CN108550449A - Chip conveys precompressed mechanism and its thermistor chip braid equipment - Google Patents
Chip conveys precompressed mechanism and its thermistor chip braid equipment Download PDFInfo
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- CN108550449A CN108550449A CN201810533610.6A CN201810533610A CN108550449A CN 108550449 A CN108550449 A CN 108550449A CN 201810533610 A CN201810533610 A CN 201810533610A CN 108550449 A CN108550449 A CN 108550449A
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- leveling
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- 230000007246 mechanism Effects 0.000 title claims abstract description 88
- 238000003825 pressing Methods 0.000 claims description 98
- 238000001514 detection method Methods 0.000 claims description 20
- 238000010030 laminating Methods 0.000 claims description 14
- 230000033001 locomotion Effects 0.000 claims description 14
- 230000036316 preload Effects 0.000 claims description 12
- 230000007723 transport mechanism Effects 0.000 claims description 10
- 238000009826 distribution Methods 0.000 claims description 4
- 239000004484 Briquette Substances 0.000 claims description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical group CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 claims 1
- 238000007689 inspection Methods 0.000 claims 1
- 229920001195 polyisoprene Polymers 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 25
- 238000012545 processing Methods 0.000 abstract description 11
- 230000035611 feeding Effects 0.000 description 112
- 239000000463 material Substances 0.000 description 82
- 230000005540 biological transmission Effects 0.000 description 23
- 230000006835 compression Effects 0.000 description 21
- 238000007906 compression Methods 0.000 description 21
- 238000009434 installation Methods 0.000 description 16
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 14
- 238000002372 labelling Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 230000001360 synchronised effect Effects 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 9
- 238000011112 process operation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000002745 absorbent Effects 0.000 description 5
- 239000002250 absorbent Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012840 feeding operation Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
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- Ceramic Engineering (AREA)
- Automatic Assembly (AREA)
Abstract
A kind of chip conveying precompressed mechanism and its thermistor chip braid equipment, chip conveying precompressed mechanism include：Chip conveys erecting bed, chip conveying device and chip apparatus for leveling, and chip conveying device is set in sequence in along chip conveying direction on chip conveying erecting bed with chip apparatus for leveling.The chip conveying precompressed mechanism of the present invention conveys erecting bed, chip conveying device and chip apparatus for leveling by the way that chip is arranged, to complete the conveying to chip and flattening operation, thus instead of the artificial mode of production, production efficiency can effectively be improved and so that chip keeps smooth in conveying operations so that the quality higher of production and processing.
Description
Technical field
The present invention relates to thermistor manufacturing technology fields, and precompressed mechanism and its temperature-sensitive are conveyed more particularly to a kind of chip
Resistance chip braid equipment.
Background technology
Thermistor is one kind of sensing element, is divided into posive temperature coefficient thermistor and subzero temperature according to temperature coefficient difference
Spend coefficient resistance.The typical feature of thermal resistor is to show different resistance at temperature sensitive, different temperature
Value.Posive temperature coefficient thermistor resistance value when temperature is higher is bigger, and negative tempperature coefficient thermistor gets over Gao Shi electricity in temperature
Resistance value is lower, they belong to semiconductor devices.
In thermistor, mostly important component is resistance chip, and resistance chip needs in manufacture produces
It is processed operation by multiple working procedures such as welding, pin cutting, insulating layer package and electrical property detections, and in order to make resistor core
The manufacturing of piece adapts to automated production operation, generally first can carry out braid processing to chip, i.e., be adhered to chip in turn
In braid, multiple arrangements of chips can be adhered on corresponding production jig or locating clamp plate by braid in this way so that
Subsequent chip manufacture can be convenient for operate.However, in traditional braid work in-process, chip is generally by being manually placed at
Feeding operation is carried out on corresponding jig, not only production efficiency is not high for manual operation, and is easy during chip placement
Cause chip raised so that chip cannot be smooth is placed on jig, at this point, generally requiring by manually pressing chip
It closes, the case where pressing is easy to cause wafer damage or leakage pressure manually is carried out to chip, often subsequent braid is added in this way
Work brings harmful effect, leads to the generation of defective products.
Invention content
The purpose of the present invention is overcoming shortcoming in the prior art, providing one kind can replace manually carrying out chip
Feeding operates, and can carry out stitching operation to chip while feeding transmits, and the chip for enabling the chip to smooth feeding is defeated
Send precompressed mechanism and its thermistor chip braid equipment.
The purpose of the present invention is achieved through the following technical solutions：
A kind of chip conveying precompressed mechanism, which is characterized in that including：Chip conveys erecting bed, chip conveying device and core
Piece apparatus for leveling, the chip conveying device are set in sequence in the chip apparatus for leveling along the chip conveying direction described
Chip conveys on erecting bed；
The chip conveying device includes chip conveying jig, the first conveying runner, the second conveying runner, feed drive part
And preload component, the first conveying runner convey runner with described second and are rotatably installed in the chip conveying erecting bed respectively
Both ends, chip conveying jig is mounted on described first and conveys between runner and the second conveying runner, the conveying
Actuator is connect with the first conveying runner, and the feed drive part is for driving the first conveying relatively described core of runner
Piece conveying erecting bed rotated, the preload component be used for it is described first conveying runner on the chip convey jig into
The pre- press operation of row；
The chip conveys and offers conveying card slot on the one side that jig conveys runner close to described first, and described first
It conveys and is provided with conveying fixture block on the lateral surface of runner, the conveying card slot is mutually clamped or detaches with the conveying fixture block；
The first limit annulus and the second limit annulus, first limit are provided on the lateral surface of the second conveying runner
Circle of position ring limits annulus with described second and is symmetrically set on the second conveying runner, the first limit annulus and institute
It states and is provided with limit delivery area between the second limit annulus, the chip conveying jig is located on the limit delivery area；
The preload component includes precompressed support plate, precompressed directive slide track, precompressed lifting slider and pre- pressing roller, described pre-
Support plate is pressed to be mounted on the one side of chip conveying erecting bed, the relatively described chip conveying peace of the precompressed directive slide track
Dress platform is vertically mounted in the precompressed support plate, and the precompressed lifting slider is slidably mounted on the precompressed directive slide track,
The pre- pressing roller is rotatably installed on the precompressed lifting slider, and the precompressed lifting slider is for driving the pre- pressing roller
The movement closer or far from the first conveying runner is carried out, the outer surface of the pre- pressing roller is provided with cushioning elastomeric layer；
The chip apparatus for leveling includes leveling support plate, leveling elevator, leveling lifting actuator and leveling assembly, institute
It states leveling support plate to be mounted on the one side of chip conveying erecting bed, leveling lifting is provided in the leveling support plate
Guide rail, the leveling elevator are slidably mounted on the leveling riser guide, the leveling lifting actuator and the leveling
Elevator connects, and the leveling lifting actuator is past for driving the leveling elevator to be carried out on the leveling riser guide
Composite motion, the leveling assembly are connect with one side of the leveling elevator far from the leveling lifting actuator；
The leveling assembly includes flattening mounting blocks, the first leveling briquetting, the second leveling briquetting and multiple springs, each described
Spring is connect with the leveling mounting blocks and the leveling elevator respectively, and the first leveling briquetting is pressed with second leveling
Block gap be arranged it is described leveling mounting blocks far from it is described leveling elevator one side on, it is described first leveling briquetting with it is described
Second leveling briquette structure is identical and is symmetrically set；
The first leveling briquetting is provided with leveling convex block on the one side far from the leveling mounting blocks, and described first is whole
Pressure sensor is installed, the leveling convex block is connect with the pressure sensor on concora crush block；
The chip apparatus for leveling further includes braid compact heap, and the braid compact heap is mounted on chip conveying installation
On platform, the chip conveying jig is located between the braid compact heap and chip conveying erecting bed, and the braid compresses
Braid locating slot is offered on the one side of block, and the first braid positioning clamp bar and the second braid are provided in the braid locating slot
Clamp bar is positioned, the first braid positioning clamp bar is arranged in parallel in braid positioning with second braid positioning clamp bar
In slot；
The first braid positioning clamp bar is cylindrical structure with second braid positioning clamp bar.
The feed drive part is motor in one of the embodiments,.
The conveying card slot is provided with multiple in one of the embodiments, and each conveying card slot is defeated along the chip
Direction is sent to be arranged on the chip conveying jig in "-" type.
The conveying fixture block is provided with multiple in one of the embodiments, and each conveying fixture block surrounds described first
Convey the center circular array distribution of runner.
In one of the embodiments, multiple chip placing grooves, each chip are offered on the chip conveying jig
Placing groove is arranged at intervals on the chip conveying jig.
The chip conveying jig is strip structure in one of the embodiments,.
The pre- pressing roller is individual event scroll wheel in one of the embodiments,.
The cushioning elastomeric layer is rubber elastic layer in one of the embodiments,.
The leveling lifting actuator is cylinder in one of the embodiments,.
A kind of thermistor chip braid equipment includes above-mentioned chip conveying precompressed mechanism, further includes：Board, braid pass
Send mechanism, chip coding mechanism, chip detection barcode scanning mechanism and chip braid laminating mechanism, it is the braid transport mechanism, described
Chip conveys precompressed mechanism, chip coding mechanism, chip detection barcode scanning mechanism and the chip braid laminating mechanism
It is separately mounted on the board.
Compared with prior art, the present invention has at least the following advantages：
The chip conveying precompressed mechanism of the present invention conveys erecting bed, chip conveying device and chip leveling by the way that chip is arranged
Device, conveying and flattening operation to completion to chip can effectively improve production thus instead of the artificial mode of production
Efficiency and make chip keep smooth in conveying operations so that the quality higher of production and processing.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is the structural schematic diagram of the thermistor chip braid equipment of one embodiment of the invention；
Fig. 2 is that the chip of the thermistor chip braid equipment in Fig. 1 conveys the structural schematic diagram of precompressed mechanism；
Fig. 3 is that the chip in Fig. 2 conveys the first of the precompressed mechanism structural schematic diagram for flattening briquetting；
Fig. 4 is the structural schematic diagram of the chip coding mechanism of the thermistor chip braid equipment in Fig. 1；
Fig. 5 is that the chip of the thermistor chip braid equipment in Fig. 1 detects the structural schematic diagram of barcode scanning mechanism；
Fig. 6 is the structural schematic diagram of the chip braid laminating mechanism of the thermistor chip braid equipment in Fig. 1.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the better embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not offered as being unique embodiment.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant Listed Items.
In one embodiment, a kind of chip conveying precompressed mechanism, which is characterized in that including：Chip conveys erecting bed, chip
Conveying device and chip apparatus for leveling, the chip conveying device are suitable along the chip conveying direction with the chip apparatus for leveling
Sequence setting is on chip conveying erecting bed；The chip conveying device includes chip conveying jig, the first conveying runner, the
Two conveying runners, feed drive part and preload component, the first conveying runner convey runner with described second and rotate peace respectively
The both ends of erecting bed are conveyed mounted in the chip, the chip conveying jig is mounted on described first and conveys runner and described second
Between conveying runner, the feed drive part is connect with the first conveying runner, and the feed drive part is described for driving
First conveying runner is rotated relative to chip conveying erecting bed, and the preload component is used for the first conveying runner
On chip conveying jig carry out pre- press operation；One side of the chip conveying jig close to the first conveying runner
On offer conveying card slot, be provided with conveying fixture block on the lateral surface of the first conveying runner, the conveying card slot with it is described
Conveying fixture block is mutually clamped or detaches；It is provided with the first limit annulus and the second limit on the lateral surface of the second conveying runner
Annulus, the first limit annulus limits annulus with described second and is symmetrically set on the second conveying runner, described
Limit delivery area is provided between first limit annulus and the second limit annulus, the chip conveying jig is located at the limit
On the delivery area of position；The preload component includes precompressed support plate, precompressed directive slide track, precompressed lifting slider and pre- pressing roller, institute
Precompressed support plate is stated on the one side of chip conveying erecting bed, the relatively described chip of precompressed directive slide track is defeated
Erecting bed is sent to be vertically mounted in the precompressed support plate, the precompressed lifting slider is slidably mounted on the precompressed directive slide track
On, the pre- pressing roller is rotatably installed on the precompressed lifting slider, and the precompressed lifting slider is for driving the precompressed
Idler wheel carries out the movement closer or far from the first conveying runner, and the outer surface of the pre- pressing roller is provided with snubber elastomeric
Layer；The chip apparatus for leveling includes leveling support plate, leveling elevator, flattens lifting actuator and leveling assembly, described whole
Flat support plate is mounted on the one side of chip conveying erecting bed, and leveling lifting is provided in the leveling support plate and is led
Rail, the leveling elevator are slidably mounted on the leveling riser guide, and the leveling lifting actuator rises with the leveling
Block connection is dropped, and the leveling lifting actuator is for driving the leveling elevator to be carried out on the leveling riser guide back and forth
Formula moves, and the leveling assembly is connect with one side of the leveling elevator far from the leveling lifting actuator；It is described whole
Flat component includes leveling mounting blocks, the first leveling briquetting, the second leveling briquetting and multiple springs, each spring respectively with it is described
Mounting blocks and leveling elevator connection are flattened, the first leveling briquetting flattens briquetting with described second and is arranged at intervals on institute
It states on one side of the leveling mounting blocks far from the leveling elevator, the first leveling briquetting flattens briquetting knot with described second
Structure is identical and is symmetrically set；It is convex that the first leveling briquetting is provided with leveling on the one side far from the leveling mounting blocks
Block, it is described first leveling briquetting on pressure sensor is installed, the leveling convex block is connect with the pressure sensor；The core
Piece apparatus for leveling further includes braid compact heap, and the braid compact heap is mounted on chip conveying erecting bed, the chip
Conveying jig is located between the braid compact heap and chip conveying erecting bed, is opened on the one side of the braid compact heap
Equipped with braid locating slot, the first braid positioning clamp bar and the second braid positioning clamp bar are provided in the braid locating slot, it is described
First braid positions clamp bar and second braid positioning clamp bar is arranged in parallel in the braid locating slot；Described first
It is cylindrical structure that braid, which positions clamp bar with second braid positioning clamp bar,.The chip conveying precompressed mechanism of the present invention passes through
Chip is set and conveys erecting bed, chip conveying device and chip apparatus for leveling, to complete the conveying to chip and flattening operation,
Thus instead of the artificial mode of production, production efficiency can effectively be improved and so that chip keeps smooth in conveying operations,
So that the quality higher of production and processing.
In order to preferably be illustrated to said chip conveying precompressed mechanism, chip conveying precompressed mechanism is applied in temperature-sensitive
It is illustrated in resistance chip braid equipment, to more fully understand the design of said chip conveying precompressed mechanism.Referring to Fig. 1,
A kind of thermistor chip braid equipment 10 includes：Board 100, braid transport mechanism 200, chip conveying precompressed mechanism 300, core
Piece coding mechanism 400, chip detection barcode scanning mechanism 500 and chip braid laminating mechanism 600, braid transport mechanism 200, chip are defeated
Precompressed mechanism 300, chip coding mechanism 400, chip detection barcode scanning mechanism 500 and chip braid laminating mechanism 600 is sent to pacify respectively
On board 100.
Braid transport mechanism is used for braid feeding to chip conveying precompressed mechanism, chip convey precompressed mechanism for pair
Chip is delivered in chip coding mechanism, and chip coding mechanism is used to carry out stamp operation to chip, and chip detects barcode scanning mechanism
For carrying out barcode scanning operation to the chip in chip coding mechanism, chip braid laminating mechanism is used for the chip pressing after barcode scanning
On braid material block.
It should be noted that braid transport mechanism 200 is transmitted for installing braid reel, and by the braid in braid reel
To the output end of chip conveying precompressed mechanism 300, when chip is sent out from the output end of conveying precompressed mechanism 300, braid
Adherency is fitted on chip.Chip conveying precompressed mechanism 300 by chip progress feeding for being sent to chip coding mechanism 400
On, chip coding mechanism 400 is used to carry out stamp operation to the chip for pasting braid, after completing stamp number, chip detection
Barcode scanning mechanism 500 carries out barcode scanning operation, so as to track and record the postorder process operation of each chip, after completing barcode scanning,
Braid material block is pressed together on chip by chip braid laminating mechanism 600 so that and the braid on chip conforms on braid material block, by
This makes multiple chips be arranged in "-" type on braid material block, consequently facilitating the automation process operation of post-order process.
Referring to Fig. 1, braid transport mechanism 200 includes feeding supporting rack 210, feeding rotation axis 220, feeding driving
Part 230, the first feeding limit clamping plate 240, the second feeding limit clamping plate 250, limitation locking component 260 and feeding guidance set
270, feeding supporting rack 210 is mounted on board 100, and feeding rotation axis 220 is rotatably installed on feeding supporting rack 210, feeding
Actuator 230 is connect with feeding rotation axis 220, and feeding actuator 230 is for driving feeding rotation axis 220 with respect to feeding supporting rack
210 are rotated, and the first feeding limits clamping plate 240 and the second feeding limit clamping plate 250 is symmetrically mounted on feeding rotation axis
On 220, braid installing zone, braid installing zone are provided between the first feeding limit clamping plate 240 and the second feeding limit clamping plate 250
For installing braid reel, limitation locking component 260 is mounted in feeding rotation axis 220, and feeding guidance set 270 is mounted on upper
Expect supporting rack 210 on the one side of feeding rotation axis 220.
It should be noted that the braid reel equipped with braid is mounted on braid installing zone, i.e. braid reel socket installation
In feeding rotation axis 220, meanwhile, clamping plate 240 is limited by the first feeding and the second feeding limits clamping plate 250 to braid reel
Carry out position restriction, to make braid reel in the rotation will not there is a phenomenon where braid falls off or deviates, thereby, it is possible to
Enable chip proper alignment when carrying out braid attaching.After installing braid reel, feeding actuator 230 drives feeding rotation
Axis 220 is rotated, and to drive braid reel to carry out rotation operation, so that braid is orderly completed feeding operation, is led to
Crossing feeding actuator 230 drives feeding rotation axis 220 to be rotated, and the speed so as to be operated to chip braid is controlled
System, to improve the precision of chip braid processing.
Referring to Fig. 1, the first feeding limits clamping plate 240 and is set on the one side that the second feeding limits clamping plate 250
Multiple positioning convex columns 241 are equipped with, the second feeding limits clamping plate 250 and installed on the one side that the first feeding limits clamping plate 240
There are multiple snubber elastomeric parts 251, each positioning convex column 241 to be corresponded with each snubber elastomeric part 251.
It should be noted that after installation is complete for braid reel, the first feeding limits clamping plate 240 and the second feeding position limiting clamp
Plate 250 carries out limit clamping to braid reel, at this point, in each positioning convex column 241 and second on the first feeding limit clamping plate 240
Each snubber elastomeric part 251 on material limit clamping plate 250, which corresponds, to abut, to make the first feeding limit clamping plate 240 and second
Feeding limit clamping plate 250 between can generate mutually exclusive elastic force, thus, it is possible to prevent the first feeding limit clamping plate 240 with
Second feeding limit 250 mounting distance of clamping plate closely causes very much the braid on braid reel that can not smoothly carry out rotation feeding, energy
The fluency for enough improving the operation of braid feeding, reduces failure.
Referring to Fig. 1, limitation locking component 260 includes limit casing 261 and adjusting screw 262, limit casing 261
It is screwed on the one end of feeding rotation axis 220 far from feeding actuator 230, adjusting screw 262 is screwed togather with limit casing 261.
It should be noted that after the first feeding limit clamping plate 240 and the second feeding limit clamping plate 250 complete installation, pass through
Installation limit casing 261 is abutted with the second feeding limit clamping plate 250, so as to limit the position of clamping plate 250 to the second feeding
It is fixed, meanwhile, by adjusting position of the limit casing 261 in feeding rotation axis 220, so as to limit the first feeding
Position clamping plate 240 limits the distance between clamping plate 250 with the second feeding and is finely adjusted, and completes after adjusting, will by adjusting screw 262
The position of limit casing 261 is locked, to complete limitation locking operation.By the way that adjusting screw 262 and limit casing is arranged
261, it is operated so as to the convenient disassembling, assembling and replacing to braid reel, meanwhile, it is capable to adjust the first feeding limit clamping plate 240 and the
Two feedings limit the distance between clamping plate 250, enable adaptation to the installation operation of the braid reel of different in width so that equipment
The scope of application it is wider.
Referring to Fig. 1, feeding guidance set 270 includes the first feeding guide roller 271 and the second feeding orienting roll
Wheel 272, the first feeding guide roller 271 and the second feeding guide roller 272 are mutually parallel on feeding supporting rack 210,
Feeding rotation axis 220 is located at the lower section of the first feeding guide roller 271 and the second feeding guide roller 27.
It should be noted that the first feeding guide roller 271 and the second feeding guide roller 272 are when braid feeding operates
Play the role of guiding so that braid is more smooth when feeding operates, meanwhile, feeding rotation axis 220 is located at the first feeding
The lower section of guide roller 271 and the second feeding guide roller 282, i.e. braid are oriented to from braid reel feeding and by the first feeding
When idler wheel 271 and the second feeding guide roller 272, the first feeding guide roller 271 and the second feeding guide roller 272 are in one
A higher position can in advance separate a part of braid from braid reel, in such manner, it is possible to which braid feeding is made to operate
When it is more smooth, while can give braid certain tensile force, and the space of 220 top of feeding rotation axis can be utilized, make
The overall structure for obtaining equipment is more compact.
In one embodiment, feeding actuator is motor；For another example, each positioning convex column is around the center of the first feeding limit clamping plate
Circular array is distributed；For another example, positioning convex column is cylindrical structure；For another example, each snubber elastomeric part surrounds the second feeding position limiting clamp
The center circular array distribution of plate；For another example, snubber elastomeric part is spring；For another example, the first feeding guide roller and the second feeding
Guide roller is one-way rolling；For another example, the first feeding limit clamping plate is disc structure；For another example, the second feeding limit clamping plate is
Disc structure；For another example, limit casing is straight screw sleeve, so, it is possible to improve whole structural strength, and make braid feeding
What is operated is more efficient.
As shown in Fig. 2, being illustrated below to the concrete structure of chip conveying precompressed mechanism 300：
A kind of chip conveying precompressed mechanism 300 includes：It is whole that chip conveys erecting bed 310, chip conveying device 320 and chip
Leveling device 330, chip conveying device 320 are set in sequence in chip conveying along chip conveying direction with chip apparatus for leveling 330 and pacify
It fills on platform 310.
Referring to Fig. 2, chip conveying device 320 includes that chip conveying jig 321, first conveys runner 322, second
Runner 323, feed drive part 324 and preload component 325 are conveyed, the first conveying runner 322 turns respectively with the second conveying runner 323
The dynamic both ends that erecting bed 310 is conveyed mounted on chip, it is defeated mounted on the first conveying runner 322 and second that chip conveys jig 321
Between sending runner 323, feed drive part 324 is connect with the first conveying runner 322, and feed drive part 324 is defeated for drive first
322 opposite chip of runner conveying erecting bed 310 is sent to be rotated, preload component 325 is used for the core on the first conveying runner 322
Piece conveying jig 321 carries out pre- press operation.
Further, chip conveying jig 321 offers conveying card slot on the one side of the first conveying runner 322,
Conveying fixture block is provided on the lateral surface of first conveying runner 322, conveying card slot is mutually clamped or detaches with conveying fixture block.Conveying
Card slot be provided with it is multiple, it is each convey card slot and be arranged in chip in "-" type along chip conveying direction convey on jig.Convey fixture block
It is provided with multiple, each center circular array distribution for conveying fixture block and conveying runner around first.
It should be noted that offering multiple chip placing grooves, the setting of each chip placing groove interval on chip conveying jig
On chip conveying jig, the chip that chip feeding is placed on to chip conveying jig by artificial or corresponding feeding device is put
It sets on slot, for example, feeding device straight-line oscillation disk or conveyer belt etc..When the chip conveying jig 321 equipped with chip passes through first
When conveying runner 322, the driving of feed drive part 324 first conveying runner 322 is rotated, to make the first conveying runner 322
On conveying fixture block and chip conveying jig on the constantly engaging of conveying card slot with detach, thus make chip conveying jig towards the
The direction of two conveying runners 323 carries out linear transmission operation.Conveying card slot is equipped with conveying fixture block so that chip conveys
Jig can carry out linear transmission operation, and will not shift in transmit process.
Further, the first limit annulus and the second limit annulus are provided on the lateral surface of the second conveying runner 323, the
One limit annulus and the second limit annulus are symmetrically set on the second conveying runner, and the first limit annulus and the second limit are justified
Limit delivery area is provided between ring, chip conveys jig and is located on limit delivery area.
It should be noted that the second conveying runner 323 plays the role of guiding in chip conveys jig transmit process, make
Obtaining chip conveying jig can be passed between the second conveying runner 323 and first conveys runner 322, meanwhile, the first limit
The setting of annulus and the second limit annulus so that chip conveys the position of jig in transmit process by the first limit annulus and the
Two limit annulus limit, to make chip conveying jig beat will not occur in transmit process, can make in this way chip into
Precision higher when row braid is sticked, the interval error between each chip is small, the quality higher for making braid process.
Referring to Fig. 1, preload component 325 includes precompressed support plate 325a, precompressed directive slide track 325b, precompressed lifting
Sliding block 325c and pre- pressing roller 325d, precompressed support plate 325a are mounted on the one side of chip conveying erecting bed 310, and precompressed is led
It is vertically mounted on precompressed support plate 325a to sliding rail 325b opposite chips conveying erecting bed 310, precompressed lifting slider 325c is slided
Dynamic to be mounted on precompressed directive slide track 325b, pre- pressing roller 325d is rotatably installed on precompressed lifting slider 325c, precompressed lifting
Sliding block 325c is used to drive pre- pressing roller 325d to carry out the movement closer or far from the first conveying runner 322, pre- pressing roller 325d
Outer surface be provided with cushioning elastomeric layer.
It should be noted that when the first conveying runner 322 carries out conveying operations to chip conveying jig, chip conveys jig
By preload component 325, at this point, pre- pressing roller 325d is abutted with chip conveying jig, and as chip conveys the transmission of jig
Operation is rotated, so as to play the role of guiding；Meanwhile chip conveying jig pass through pre- pressing roller 325d when, due to
Precompressed lifting slider 325c is slidably mounted on precompressed directive slide track 325b, from can be by precompressed lifting slider 325c and pre-
The pressing roller 325d gravity of itself carries out pre- press operation to the chip on chip conveying jig, and thus chip placement is in transmission process
In bounce, ensure chip can position on the correct position that chip conveys jig.
Referring to Fig. 2, chip apparatus for leveling 330 includes leveling support plate 331, leveling elevator 332, leveling lifting
Actuator 333 and leveling assembly 334, leveling support plate 331 are mounted on the one side of chip conveying erecting bed 310, leveling branch
Leveling riser guide is provided on fagging 331, leveling elevator 332 is slidably mounted on leveling riser guide, and leveling lifting is driven
Moving part 333 is connect with leveling elevator 332, and leveling lifting actuator 333 is for driving leveling elevator 332 to be led in leveling lifting
Reciprocating is carried out on rail, leveling assembly 334 connects with one side of the leveling elevator 332 far from leveling lifting actuator 333
It connects.
Further, leveling assembly 334 includes leveling mounting blocks 334a, the first leveling briquetting 334b, the second leveling briquetting
334c and multiple spring 334d, each spring 334d are connect with leveling mounting blocks 334a and leveling elevator 332 respectively, the first leveling
The levelings of briquetting 334b and second briquetting 334c is arranged at intervals on one sides of the leveling mounting blocks 334a far from leveling elevator 332
On, the first leveling briquetting 334b is identical as the second leveling briquetting 334c structures and is symmetrically set；Flatten mounting blocks 334a with
Multiple spring 334d are set between leveling elevator 332, cushioning effect can be played, prevent pressure from causing very much the damage of chip greatly
It is bad.
As shown in figure 3, it is provided with leveling convex block 334e on the first one sides of the leveling briquetting 334b far from leveling mounting blocks,
Pressure sensor 334f is installed, leveling convex block 334e is connect with pressure sensor 334f on the first leveling briquetting 334b.
Need to illustrate when, by chip apparatus for leveling 330 after the chip on chip conveying jig completes pre- press operation
When, the leveling lifting driving leveling elevator 332 of actuator 333 declines, to make leveling assembly 334 on chip conveying jig
Chip carries out compression operation；Leveling assembly 334 is defeated to chip respectively by the first leveling briquetting 334b, the second leveling briquetting 334c
It send the both ends of the chip on jig to be pressed, beat or tilting occurs in bonding processes so as to chip placement, to
Chip can be made completely to be pressed together in chip conveying jig, the setting of leveling convex block 334e can be reduced and chip contact surface
Product, convenient for the stitching operation of the chip to small size, meanwhile, connected by the way that pressure sensor 334f and leveling convex block 334e is arranged
It connects, so as to be monitored to the pressure force for flattening convex block 334e, thus, it is possible to prevent pressure is excessive from chip is damaged by pressure.Ability
Field technique personnel can need to select the model or specification of pressure sensor 334f according to the production of realization, as long as can
The sensor that pressure to flattening convex block 334e is tested.
Referring to Fig. 2, chip apparatus for leveling 330 further includes braid compact heap 335, and braid compact heap 335 is mounted on
Chip conveys on erecting bed 310, and chip conveying jig 321 is located between braid compact heap 335 and chip conveying erecting bed 310,
Braid locating slot 335a is offered on the one side of braid compact heap 335, and it is fixed that the first braid is provided in braid locating slot 335a
Position clamp bar and the second braid position clamp bar, and the first braid positions clamp bar and the second braid positioning clamp bar is arranged in parallel in braid
In locating slot；It is cylindrical structure that first braid, which positions clamp bar and the second braid positioning clamp bar,.
It should be noted that after chip conveying jig 321 completes leveling stitching operation, braid compact heap 335 can be passed through
The Transfer pipe formed with chip conveying erecting bed 310, at this point, that braid feeding is sent to chip is whole for braid transport mechanism 200
On the braid compact heap 335 of leveling device 330, braid positions clamp bar and second by the first braid on braid locating slot 335a and compiles
Band positioning clamp bar is clamped fixation, to make braid that there is enough tensile forces, meanwhile, it is defeated that one end of braid extends to chip
It send on jig 321, when chip conveying jig 321 carries out conveying operations and passes through braid compact heap 335, due to the gap of setting
It is sufficiently small so that the first braid positions clamp bar and can be attached on corresponding chip with the braid on the second braid positioning clamp bar, and
With the chip conveying conveying of jig 321 movement so that the chip that is attached on of braid neatly conveys on each chip of jig 321, thus
Complete the adhering operation of braid.
In one embodiment, feed drive part is motor；For another example, chip conveying jig is strip structure；For another example, pre- nip drum
Wheel is individual event scroll wheel；For another example, cushioning elastomeric layer is rubber elastic layer；For another example, leveling lifting actuator is cylinder；In this way, energy
It is enough to improve whole structural strength, and whole working efficiency higher.
The chip conveying precompressed mechanism 300 of the present invention conveys erecting bed 310, chip conveying device 320 by the way that chip is arranged
And chip apparatus for leveling 330, conveying and flattening operation to completion to chip can thus instead of the artificial mode of production
It is effective to improve production efficiency and chip is made to keep smooth in conveying operations so that the quality higher of production and processing.
As shown in figure 4, being illustrated below to the concrete structure of chip coding mechanism 400：
A kind of chip coding mechanism 400 includes：Coding installation pedestal 410, coding component 420, horizontal mobile device 430,
Lifting gear 440 and coding positioning device 450, horizontal mobile device 430 are separately positioned on coding peace with coding positioning device 450
It fills on pedestal 410, lifting gear 440 is connect with horizontal mobile device 430, and coding component 420 is connect with lifting gear 440.
It should be noted that coding component 420 is moved to by the drive of horizontal mobile device 430 and lifting gear 440
On corresponding coding position, installation fixation is then carried out to the position of coding component 420 by coding positioning device 450 again, it is complete
After fixation, coding component 420 carries out coding operation.
Referring to Fig. 4, coding positioning pressuring plate 411, coding positioning pressuring plate 411 are provided in coding installation pedestal 410
In coding installation pedestal 410, it is logical that coding transmission is provided between coding positioning pressuring plate 411 and coding installation pedestal 410
Road, coding positioning pressuring plate 411 are provided with flexibly positioned layer, coding positioning pressuring plate on the one side of coding installation pedestal 410
Coding location hole 411a is offered on 411, coding location hole 411a is connected to coding Transfer pipe with coding location hole.
Further, braid coding locating piece 411b, the braid are installed on one end of the coding positioning pressuring plate 411
The cross section of coding locating piece 411b is ramp structure.
It should be noted that coding positioning pressuring plate 411 is connected with braid compact heap 335, braid coding locating piece 411b
In in braid locating slot 335a, when chip conveying jig 321, which is sent to, carries out braid operation at braid compact heap 335, braid
Coding locating piece 411b is for compressing braid so that braid can be tightly conforms on chip conveying jig 321.It is complete
It is further transmitted at the chip conveying jig 321 after braid fitting processing, to enter chip by coding Transfer pipe
Coding mechanism 400 enterprising rower code operation, at this point, the flexibly positioned layer on coding positioning pressuring plate 411 can convey chip and control
Chip on tool 321 plays the role of protection, and chip is prevented to be subject to crushing in transmit process or scratch surface.When chip conveys
When jig 321 is sent to coding location hole 411a, coding component 420 carries out coding behaviour to the chip on chip conveying jig 321
Make.
Referring to Fig. 4, horizontal mobile device 430 includes being transversely mounted support plate 431, sliding laterally block 432, is lateral
Actuator 433, the first laterally driven runner 434, the second laterally driven runner 435 and laterally driven synchronous belt 436, are transversely mounted
Support plate 431 is mounted in coding installation pedestal 410, and the first laterally driven runner 434 and the second laterally driven runner 435 are distinguished
Be rotatably installed in and be transversely mounted in support plate 431, laterally driven synchronous belt 436 respectively with the first laterally driven runner 434 and
Two laterally driven runners 435 connect, and slide laterally block 432 and are slidably installed and are transversely mounted in support plate 431, laterally driven part 433
It is connect with the first laterally driven runner 434, laterally driven part 433 is for driving 434 relatively transverse peace of the first laterally driven runner
Dress support plate 431 is rotated, and the first laterally driven runner 434 is for driving laterally driven synchronous belt 436 and the second laterally drive
Turn wheel 435 is rotated, and is slid laterally to be provided on block 432 and is slid laterally rack, slide laterally rack be mounted on it is laterally sliding
Close to being transversely mounted on the one side of support plate, sliding rack engages motion block with laterally driven synchronous belt.
It should be noted that the first laterally driven runner 434 carries out rotation operation under the driving of laterally driven part 433,
So as to make the first laterally driven runner 434 and the second laterally driven runner 435 carry out together by laterally driven synchronous belt 436
Motor performance is walked, is operated into reciprocating type mobile by the rack that slides laterally on laterally driven synchronous belt 436 at this time, to drive cross
Reciprocating type mobile is carried out on being transversely mounted support plate 431 to sliding shoe 432, thus, it is possible to the positions to sliding laterally block 432
It is adjusted.By the way that laterally driven part 433, the first laterally driven runner 434, the second laterally driven runner 435 and transverse direction is arranged
The position for sliding laterally block 432 is adjusted in the driving structure that driving synchronous belt 436 is combined into, and can improve the essence of adjusting
Degree so that position degree of regulation higher when coding.
Referring to Fig. 4, it is transversely mounted in support plate 431 and is provided with cross spacing block 431a, cross spacing block 431a
Mounted on support plate 431 is transversely mounted close to sliding laterally on the one side of block 432, opened on the one side of cross spacing block 431a
Equipped with bayonet is mounted, it is mounted in bayonet and absorption phase magnet block is installed.
Further, it slides laterally block 432 and is provided with limit magnet strip 432a, limit magnet strip 432a is mounted on laterally sliding
Motion block 432 is on the one side of cross spacing block 431a, limit magnet strip 432a and limit installation bayonet corresponding matching.
It should be noted that after sliding laterally the movement of block 432 in place, by being arranged on being transversely mounted support plate 431
Cross spacing block 431a, to be coordinated by cross spacing block 431a and limit magnet strip 432a so that limit magnet strip 432a
Be mounted bayonet corresponding matching, and by be mounted bayonet in absorption phase magnet block complete positioning, so as to
It prevents from sliding laterally block 432 and moving that position offset occurs afterwards in place, thus improves the precision of coding processing.
Referring to Fig. 4, lifting gear 440 includes lifting moving plate 441, the lifting lifting rotation of actuator 442, first
The 443, second lifting rotating wheel 444 of wheel and lifting synchronous belt 445, lifting moving plate 441, which is slidably mounted on, slides laterally block 432
On, the first lifting lifting rotating wheel 444 of rotating wheel 443 and second is rotatably installed in respectively to be slid laterally on block 432, and lifting synchronizes
Band 445 lifts rotating wheel 444 with the first lifting rotating wheel 443 and second respectively and connect, and the lifting lifting of actuator 442 and first turns
Driving wheel 443 connects, and lifting actuator 442 is rotated for driving first to lift 443 relatively transverse sliding shoe 432 of rotating wheel,
First lifting rotating wheel 443 is rotated for driving lifting synchronous belt 445 and second to lift rotating wheel 444, lifting moving plate
Be provided with lifting tooth stick 441a on 441, lifting synchronous belt 445 be arranged in lifting tooth stick 441a and with lifting tooth stick 441a
Engagement.
It should be noted that after sliding laterally the movement of block 432 in place, driving the first lifting rotation of lifting actuator 442
Wheel 443 is rotated, and is carried out rotation operation to drive lifting synchronous belt 445 and second to lift rotating wheel 444, is thus made lifting
Movable plate 441 carries out elevating movement operation on sliding laterally block 432, so as to the coding position of coding component 420 into
Row is adjusted.
Referring to Fig. 4, coding component 420 includes coding mounting blocks 421, coding control panel 422 and labelling head 423,
Coding mounting blocks 421 are mounted on lifting moving plate 441, and coding control panel 422 is mounted on coding mounting blocks 421, labelling head
423 connect with coding control panel 421, and labelling head 423 is corresponded with coding location hole 411a, and labelling head 423 is used for coding
Chip in location hole 411a carries out coding operation.
It should be noted that after lifting moving plate 441 completes lift adjustment so that labelling head 423 is located at the mark of setting
On code position, then labelling head 423 is controlled by coding control panel 422, to be positioned to coding by labelling head 423
Chip in the 411a of hole carries out coding operation.
Referring to Fig. 4, coding positioning device 450 include coding positioning base 451, the first coding positioning fixture block 452,
Second coding positions fixture block 453 and coding fixture block actuator 454, and coding positioning base 451 is mounted on coding installation pedestal 410
On, coding fixture block actuator 454 is mounted on coding positioning base 451, and the first coding positions fixture block 452 and the positioning of the second coding
Fixture block 453 is connect with coding fixture block actuator 454 respectively, and coding fixture block actuator 454 is for driving the first coding to position fixture block
452 and second coding positioning fixture block 453 carry out movement close to each other or separate, the first coding positions the mark of fixture block 452 and second
Code positioning 453 structure of fixture block is identical and is symmetrically set.First coding positions one that fixture block positions fixture block close to the second coding
Clamping card slot is offered on side, the surface for clamping card slot is provided with elastic clamping layer.
It should be noted that when labelling head 423 carries out mark process operation, labelling head 423 is in mark in order to prevent
Position offset occurs in journey, causes the precision that mark operates not high, to be used when labelling head 423 carries out mark process operation
First coding positions fixture block 452 and the second coding positioning fixture block 453 is clamped fixation to labelling head 423, so as to beat
Header 423 will not influence that position offset occurs due to extraneous factor when carrying out mark process operation.
In one embodiment, flexibly positioned layer is rubber elastic layer；For another example, laterally driven part is motor；For another example, coding controls
Plate is touch screen control panel；For another example, labelling head is laser marking head；For another example, coding fixture block actuator is clamping cylinder；Again
Such as, elastic clamping layer is rubber layer；For another example, coding mounting blocks are cuboid structure；For another example, coding positioning base is cuboid knot
Structure so, it is possible to improve whole structural strength, and can improve the processing efficiency of coding operation.
The chip coding mechanism 400 of the present invention is filled by the way that coding installation pedestal 410, coding component 420, transverse shifting is arranged
430, lifting gear 440 and coding positioning device 450 are set, to complete the coding operation to chip, thus instead of artificial mark
Code mode of operation, can prevent spill tag code or repeat coding the case where occur, effectively improve production efficiency and coding processing
Precision.
As shown in figure 5, being illustrated below to the concrete structure of chip detection barcode scanning mechanism 500：
Chip detect barcode scanning mechanism 500 include detection supporting rack 510, CCD imagings code reader 520, detection mounting plate 530,
It is imaged reflector 540 and light source assembly 550, the detection supporting rack 510 is mounted on board 100, the detection mounting plate 530
It is mutually perpendicular on the one end for being mounted on the detection supporting rack 510 with the imaging reflector 540, the CCD is imaged code reader
520 are mounted on the detection mounting plate 530, and the light source assembly 550 is mounted on the detection supporting rack 510, and is located at
The lower section of the CCD imagings code reader 520.
The light source assembly 550 includes moving block 551, light source holder 552 and multiple LED lamps bubble, the moving block 551
It is rotatably installed on the detection supporting rack 510, the light source holder 552 is mounted on the moving block 551, each described
LED lamp bubble is installed in the light source holder 552.
It should be noted that after chip completes coding operation in chip coding mechanism 400, chip detects barcode scanning mechanism
500 by CCD be imaged code reader 520 to complete coding after chip carries out imaging and barcode scanning operate, to by image-forming information with
Barcode scanning information corresponds, meanwhile, appearance detection can be carried out to chip by imaging, to detect on corresponding coding number
Chip whether meet production and processing require, be achieved in the policer operation to each chip, when a problem occurs, can quickly look for
To the scheme in the place and solution that go wrong.
The setting of imaging reflector 540 can make the imaging effect of CCD imaging code readers 520 more preferable, be rotated by adjusting
The angle of block 551 can be conveniently operated adjusting, further so as to adjust the direction of illumination that LED lamp steeps in light source holder
The imaging effect for improving CCD imaging code readers 520 is more preferable.
As shown in fig. 6, being illustrated below to the concrete structure of chip braid laminating mechanism 600：
A kind of chip braid laminating mechanism 600 includes：Press workbench 610, braid pressing transmission device 620, pressing material
Block feeding device 630 and material block pressing device 640, braid press transmission device 620 and are mounted on pressing workbench 610, pressing
The direction of transfer that material block feeding device 630 and material block pressing device 640 press transmission device 620 along braid is set in sequence in pressing
On workbench 610.
Referring to Fig. 6, it includes that pressing conveyer belt 621, first presses delivery roller that braid, which presses transmission device 620,
622, the second pressing delivery roller 623 and pressing transmission actuator 624, the first pressing pressing transmission of delivery roller 622 and second
Idler wheel 623 be rotatably installed in respectively pressing workbench 610 on, pressing conveyer belt 621 respectively with first pressing delivery roller 622 and
Second pressing delivery roller 623 connects, and pressing transmission actuator 624 is connect with the first pressing delivery roller 622, and pressing transmission is driven
Moving part 624 is for driving the first pressing delivery roller 622 to be rotated relative to pressing workbench 610, the first pressing delivery roller
622 are rotated for driving pressing conveyer belt 624 and second to press delivery roller 623.
Further, the first pressing delivery roller 622 and second is provided with pressing support cross between pressing delivery roller 623
Item, pressing support horizontal stripe are mounted on pressing workbench 610 on the one side of pressing conveyer belt 621, pressing support horizontal stripe position
In the lower section of pressing conveyer belt 621.
It should be noted that pressing conveyer belt 621 is used to carry out reception transmission to chip conveying jig 321, when chip is defeated
After sending jig 321 to complete coding and barcode scanning detection operation at chip coding mechanism 400 and chip detection barcode scanning mechanism 500, into
Enter the stitching operation that material block and braid is carried out at chip braid laminating mechanism 600.Specifically, chip conveying jig 321 enters pressure
After closing conveyer belt 621, the driving of actuator 624 first pressing delivery roller 622 is transmitted by pressing and is rotated, to dynamic pressure
It closes conveyer belt 621 and operation is transmitted to chip conveying jig 321 so that chip conveying jig 321 can be transferred into pressing
Expect on block feeding device 630 and material block pressing device 640.Pressing support horizontal stripe setting can chip convey jig 321 into
Pressing conveyer belt 621 is supported when row material block stitching operation, to prevent pressing conveyer belt 621 from deforming so that stitching operation
There is error, thereby guarantees that the precision of braid stitching operation.
Referring to Fig. 6, pressing material block feeding device 630 include material block conveyer belt 631, material block transmission actuator 632,
Expect block pushing plate 633, material block push actuator 634, material block feeding pressing plate 635 and material block absorbent module 636, expects block conveyer belt
631 are mounted on pressing workbench 610, and material block conveyer belt 631 is located at the side of pressing conveyer belt 621, and material block transmits actuator
632 connect with material block conveyer belt 631, and material block transmission actuator 632 is for driving material block conveyer belt 631 in pressing workbench 610
Upper carry out translatory movement, material block pushing plate 633 are slidably mounted on pressing workbench 610, material block push actuator 634 and material block
Pushing plate 633 connects, and material block push actuator 634 is close for driving material block pushing plate 633 to be carried out on pressing workbench 610
Or the reciprocating far from material block conveyer belt 631 so that on 20 feeding of material block to pressing conveyer belt on material block conveyer belt 631
621, material block feeding pressing plate 635 is arranged on pressing workbench 610, and material block feeding pressing plate 635 is located at the upper of pressing conveyer belt 621
Side, material block absorbent module 636 are mounted on material block feeding pressing plate 635.Expect that block absorbent module 636 includes that multiple material blocks adsorb gas nozzle
636a, it is each to expect that block absorption gas nozzle 636a is arranged at intervals on material block feeding pressing plate 635.
Further, transmission limited block 631a is provided on material block conveyer belt 631, transmission limited block 631a is located at material block and passes
On the output end for sending band 631, after expecting that block conveyer belt 631 will expect the transmission of block 20 in place, transmission limited block 631a can be to expecting block
20 position is defined, and being thus material block 20 can accurately feeding extremely press on conveyer belt 621.
Further, push horizontal stripe 633a is provided on material block pushing plate 633, push horizontal stripe 633a is located at material block pushing plate
633 on the one side of material block conveyer belt 631, and push horizontal stripe 633a is offered on the one side of material block conveyer belt 631
Limiting groove is pushed, push limiting groove can carry out position limit when expecting that block pushing plate 633 carries out push operation to material block 20
It is fixed, prevent material block 20 from position offset occurring during push.Push horizontal stripe 633a setting can more accurately with material block
20 are abutted, to enable material block to be smoothly pushed to pressing conveyer belt 621.
It should be noted that material block 20 is expected by expecting that block conveyer belt 631 is sent on 633 corresponding position of block pushing plate,
Material block pushing plate 633 is moved under the driving that material block pushes actuator 634, to expect the material block on block conveyer belt 631
20 push on pressing conveyer belt 621, and material block feeding pressing plate 635 is arranged in the top of pressing conveyer belt 621, when material block 20 is pushed away
When sending to pressing conveyer belt 621, material block absorbent module 636 is adsorbed gas nozzle 636a by multiple material blocks and is adsorbed to material block 20
Operation so that material block 20 is attracted on material block feeding pressing plate 635.It is passed when chip conveys jig 321 by pressing conveyer belt 621
After being sent to position, material block adsorbs gas nozzle 636a and is adjusted to outlet operation from suction operation, thus will expect the material on block feeding pressing plate 635
Block 20 is placed and is pressed in advance on chip conveying jig 321, completes the feeding precompressed manipulator of material block 20, chip conveys jig 321
Material block is carried out into pan feeding block pressing device 640 compress operation under the transmission of pressing conveyer belt 621.Expect block feeding pressing plate 635 with
The setting of material block absorbent module 636 is not only able to make on 20 accurate feeding of material block to chip conveying jig 321, while can complete
The pre- press operation for expecting block prevents chip conveying jig 321 from expecting that position offset occurs for block in transmit process.
Referring to Fig. 6, material block pressing device 640 includes that material block compresses pedestal 641, material block compresses holder 642, compresses
Elevator 643 and compression lifting actuator 644, material block compress the setting of pedestal 641 on pressing workbench 610, and material block compresses branch
The setting of frame 642 is compressed in material block on pedestal 641, and compression lifting actuator 644 is mounted on material block and compresses on holder 642, and compression rises
Drop actuator 644 is connect with compression elevator 643, and it is close for driving compression elevator 643 to carry out to compress lifting actuator 644
Or the reciprocating far from pressing conveyer belt 621.
Further, it compresses and is provided with multiple compression bullets on one side of the elevator 643 far from compression lifting actuator 644
Property column 643a, it is each compress elastic 643a and be arranged at intervals on compress on elevator 643.
Referring to Fig. 6, material block pressing device 640 further includes that the first compression positioning component 645 and second compresses positioning
Component 646, the first compression positioning component 645 and second compress two that positioning component 646 is separately positioned on material block compression pedestal 641
End, the first compression positioning component 645 is identical as the second compression 646 structure of positioning component and is symmetrically set.First compression is fixed
Hyte part 645 includes compressing positioning plate 645a and compressing Locating driver part 645b, compresses positioning plate and connects with Locating driver part is compressed
It connects, compresses Locating driver part and be used to drive compression positioning plate to be carried out closer or far from pressing conveyer belt on material block compression pedestal
Reciprocating.
It should be noted that after chip conveying jig 321 transmits in place, compresses positioning plate 645a and compressing Locating driver
It is moved under the driving of part 645b, is defined to convey the position of one end of jig 321 to chip, similarly, the second pressure
The position for the other end that tight positioning component 646 conveys chip jig 321 is defined, to keep chip conveying jig 321 solid
It is scheduled between the first compression positioning component 645 and second compression positioning component 646, chip conveys jig 321 and completes after fixing, pressure
Tight lifting actuator 644 driving compresses elevator 643 and carries out downward motion, to by compressing each compression on elevator 643
Elastic 643a into operation is compressed, thus makes material block 20 be attached in braid, to make the material block on chip conveying jig 321
Neat being arranged in of chip in braid is expected on block, in this way, completing chip braid stitching operation.
The chip braid laminating mechanism 600 of the present invention presses workbench 610 by setting, braid presses transmission device 620,
Pressing material block feeding device 630 and material block pressing device 640, to complete on the chip pressing after braid to material block, thus
Instead of artificial mode of operation, working efficiency can be effectively provided and enable the chip to proper alignment on material block.
In one embodiment, pressing transmission actuator is motor；For another example, pressing support horizontal stripe is cuboid structure；For another example, expect
It is motor gear driving structure that block, which transmits actuator,；For another example, material block push actuator is cylinder；For another example, lifting actuator is compressed
Cylinder is driven for lifting；For another example, elastic is respectively compressed in "-" type to be arranged in compression elevator；For another example, it is rubber to compress elastic
Glue elasticity column；For another example, it is compression cylinder to compress Locating driver part, so, it is possible to improve whole structural strength so that chip is compiled
Band pressing process operation precision higher.
Compared with prior art, the present invention has at least the following advantages：
The thermistor chip braid equipment 10 of the present invention is defeated by the way that board 100, braid transport mechanism 200, chip is arranged
Precompressed mechanism 300, chip coding mechanism 400, chip detection barcode scanning mechanism 500 and chip braid laminating mechanism 600 are sent, to complete
The braid process operation of pairs of thermistor chip, thus instead of the artificial mode of production, can effectively improve production efficiency and
The quality of production.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of chip conveying precompressed mechanism, which is characterized in that including：Chip conveys erecting bed, chip conveying device and chip
Apparatus for leveling, the chip conveying device are set in sequence in the core with the chip apparatus for leveling along the chip conveying direction
Piece conveys on erecting bed；
The chip conveying device includes chip conveying jig, the first conveying runner, the second conveying runner, feed drive part and pre-
Component, the first conveying runner is pressed to be rotatably installed in the two of the chip conveying erecting bed respectively with the second conveying runner
End, the chip conveying jig are mounted on described first and convey between runner and the second conveying runner, the feed drive
Part is connect with the first conveying runner, and the feed drive part is defeated for driving the first conveying relatively described chip of runner
Erecting bed is sent to be rotated, the preload component is used to carry out the chip conveying jig on the first conveying runner pre-
Press operation；
The chip conveying jig offers conveying card slot, first conveying on the one side of the first conveying runner
Conveying fixture block is provided on the lateral surface of runner, the conveying card slot is mutually clamped or detaches with the conveying fixture block；
The first limit annulus and the second limit annulus, the first limit circle are provided on the lateral surface of the second conveying runner
Ring limits annulus with described second and is symmetrically set on the second conveying runner, the first limit annulus and described the
Limit delivery area is provided between two limit annulus, the chip conveying jig is located on the limit delivery area；
The preload component includes precompressed support plate, precompressed directive slide track, precompressed lifting slider and pre- pressing roller, the precompressed branch
Fagging is mounted on the one side of chip conveying erecting bed, and the relatively described chip of the precompressed directive slide track conveys erecting bed
It is vertically mounted in the precompressed support plate, the precompressed lifting slider is slidably mounted on the precompressed directive slide track, described
Pre- pressing roller is rotatably installed on the precompressed lifting slider, and the precompressed lifting slider is for driving the pre- pressing roller to carry out
Closer or far from the movement of the first conveying runner, the outer surface of the pre- pressing roller is provided with cushioning elastomeric layer；
The chip apparatus for leveling includes leveling support plate, leveling elevator, flattens lifting actuator and leveling assembly, described whole
Flat support plate is mounted on the one side of chip conveying erecting bed, and leveling lifting is provided in the leveling support plate and is led
Rail, the leveling elevator are slidably mounted on the leveling riser guide, and the leveling lifting actuator rises with the leveling
Block connection is dropped, and the leveling lifting actuator is for driving the leveling elevator to be carried out on the leveling riser guide back and forth
Formula moves, and the leveling assembly is connect with one side of the leveling elevator far from the leveling lifting actuator；
The leveling assembly includes leveling mounting blocks, the first leveling briquetting, the second leveling briquetting and multiple springs, each spring
It is connect respectively with the leveling mounting blocks and the leveling elevator, between the first leveling briquetting and the second leveling briquetting
Every being arranged on one side of the leveling mounting blocks far from the leveling elevator, described first flattens briquetting and described second
Leveling briquette structure is identical and is symmetrically set；
The first leveling briquetting is provided with leveling convex block, the first leveling pressure on the one side far from the leveling mounting blocks
Pressure sensor is installed, the leveling convex block is connect with the pressure sensor on block；
The chip apparatus for leveling further includes braid compact heap, and the braid compact heap is mounted on the chip and conveys erecting bed
On, the chip conveying jig is located between the braid compact heap and chip conveying erecting bed, the braid compact heap
One side on offer braid locating slot, the first braid positioning clamp bar and the second braid are provided in the braid locating slot and is determined
Position clamp bar, the first braid positioning clamp bar and second braid positioning clamp bar are arranged in parallel in the braid locating slot
It is interior；
The first braid positioning clamp bar is cylindrical structure with second braid positioning clamp bar.
2. chip conveying precompressed according to claim 1 mechanism, which is characterized in that the feed drive part is motor.
3. chip according to claim 1 conveying precompressed mechanism, which is characterized in that the conveying card slot be provided with it is multiple,
Each conveying card slot is arranged in along the chip conveying direction in "-" type on the chip conveying jig.
4. chip according to claim 1 conveying precompressed mechanism, which is characterized in that the conveying fixture block be provided with it is multiple,
The center circular array distribution that each conveying fixture block conveys runner around described first.
5. chip conveying precompressed according to claim 1 mechanism, which is characterized in that offered on the chip conveying jig
Multiple chip placing grooves, each chip placing groove are arranged at intervals on the chip conveying jig.
6. chip conveying precompressed according to claim 5 mechanism, which is characterized in that the chip conveying jig is strip
Structure.
7. chip conveying precompressed according to claim 1 mechanism, which is characterized in that the pre- pressing roller rolls for individual event
Wheel.
8. chip conveying precompressed according to claim 1 mechanism, which is characterized in that the cushioning elastomeric layer is caoutchouc elasticity
Layer.
9. chip conveying precompressed according to claim 1 mechanism, which is characterized in that the leveling lifting actuator is gas
Cylinder.
10. a kind of thermistor chip braid equipment, which is characterized in that including the core described in any one of claim 1-9
Piece conveys precompressed mechanism, further includes：Board, braid transport mechanism, chip coding mechanism, chip detection barcode scanning mechanism and chip are compiled
Band laminating mechanism, the braid transport mechanism, chip conveying precompressed mechanism, chip coding mechanism, chip inspection
It surveys barcode scanning mechanism and the chip braid laminating mechanism is separately mounted on the board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810533610.6A CN108550449A (en) | 2018-05-29 | 2018-05-29 | Chip conveys precompressed mechanism and its thermistor chip braid equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810533610.6A CN108550449A (en) | 2018-05-29 | 2018-05-29 | Chip conveys precompressed mechanism and its thermistor chip braid equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108550449A true CN108550449A (en) | 2018-09-18 |
Family
ID=63511269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810533610.6A Withdrawn CN108550449A (en) | 2018-05-29 | 2018-05-29 | Chip conveys precompressed mechanism and its thermistor chip braid equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108550449A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110068294A (en) * | 2019-04-15 | 2019-07-30 | 苏州电器科学研究院股份有限公司 | Wound-rotor type noninductive resistor detection device and detection method |
| CN117497266A (en) * | 2023-11-30 | 2024-02-02 | 东莞市台易电子科技有限公司 | NTC integrated processing equipment |
| CN117637267A (en) * | 2023-12-13 | 2024-03-01 | 玮晶科技(泰州)有限公司 | NTC chip assembly device |
-
2018
- 2018-05-29 CN CN201810533610.6A patent/CN108550449A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110068294A (en) * | 2019-04-15 | 2019-07-30 | 苏州电器科学研究院股份有限公司 | Wound-rotor type noninductive resistor detection device and detection method |
| CN117497266A (en) * | 2023-11-30 | 2024-02-02 | 东莞市台易电子科技有限公司 | NTC integrated processing equipment |
| CN117497266B (en) * | 2023-11-30 | 2024-05-31 | 东莞市台易电子科技有限公司 | NTC integrated processing equipment |
| CN117637267A (en) * | 2023-12-13 | 2024-03-01 | 玮晶科技(泰州)有限公司 | NTC chip assembly device |
| CN117637267B (en) * | 2023-12-13 | 2024-05-03 | 玮晶科技(泰州)有限公司 | NTC chip assembly device |
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Application publication date: 20180918 |
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