CN108697044A - A kind of electromagnetic interference shielding film - Google Patents
A kind of electromagnetic interference shielding film Download PDFInfo
- Publication number
- CN108697044A CN108697044A CN201810654225.7A CN201810654225A CN108697044A CN 108697044 A CN108697044 A CN 108697044A CN 201810654225 A CN201810654225 A CN 201810654225A CN 108697044 A CN108697044 A CN 108697044A
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- China
- Prior art keywords
- electromagnetic interference
- interference shielding
- shielding film
- layer
- electromagnetic wave
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 28
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- 235000007164 Oryza sativa Nutrition 0.000 description 2
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- 229910001020 Au alloy Inorganic materials 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
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- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
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- FYHXNYLLNIKZMR-UHFFFAOYSA-N calcium;carbonic acid Chemical compound [Ca].OC(O)=O FYHXNYLLNIKZMR-UHFFFAOYSA-N 0.000 description 1
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The purpose of the present invention is to provide a kind of electromagnetic interference shielding films, conductive layer therein contains conducting particles, the resistance value of conductive layer can not only be reduced, more can substantially it lower because electromagnetic wave enters heat caused by this electromagnetic interference shielding film, and electromagnetic wave absorbing layer contains electromagnetic wave absorbent material, can promote electromagnetic interference shielding effect.
Description
Technical field
The present invention relates to a kind of devices for resisting Electromagnetic Interference, are used for electronic device, wire rod and element, such as print
The electromagnetic interference shielding film of circuit board is more particularly to used for the knot of the resistance Electromagnetic Interference of soft electronic material substrate
Structure.
Background technology
With portable electronic and communication product is frivolous and the multi-functional market demand, the IC package of circuit board need more
Gently, thin, short, small, functionally then need powerful and high speed signal transmission.Therefore, the density of I/O feet number certainly will improve, and
Also increase along with foot number.The distance of IC support plate circuits is more and more closer, in addition working frequency makes the electromagnetism of IC towards high wideband
It interferes (EMI) increasingly severe, therefore how effectively management of EMC, maintains electronic product normal signal transmission and raising
Reliability will become important issue.
Electromagnetic interference problem is solved, can be designed by routing path, such as complicated cabling is designed, may be used one
One ground plane of a signal transmitting layer collocation, can so reduce electromagnetic interference.Another way can combine signal lead
There is the masking material of electromagnetic interference protective function to ensure good ground connection effect, and then achievees the purpose that inhibit electromagnetic interference.
The electromagnetic interference masking material seen on the market is to utilize conductive label glued membrane, typically heavy with vacuum splashing and plating or chemistry
Product mode deposits single-layer or multi-layer conductive metal film such as silver, copper or nickel on conductive label adhesive film material, promotes conductive label
Screening capacity of the adhesive film material to electromagnetic interference.Conductive label adhesive film material mainly has certain solidification by electroconductive particle collocation
The high molecular material of cross-linking reaction degree.
In addition, the electronics or electric device of high power operating will inevitably face the problem of heat dissipation.Traditional solution
Method is the hot dissipation that the additional equipment of device generates electronics or electric device, such as installs additional and be made of one or more fans
Forced convertion system.However, small-sized or miniature electronic component such as CPU is used in a small space, such as install
On a printed circuit, no additional space can install forced convertion system to solve heat dissipation problem.
The prior art uses a kind of high thermal conductivity composite magnetic body, as shown in Figure 1, the electromagnetic interference suppression of composite magnetic body
Body 10 processed includes the composite magnetic body 1 of conductive support body 4 and its two sides lamination, and wherein conductive support body 4 is, for example, conduction
Property fabric;Composite magnetic body 1 be in organic bond 2, such as polyethylene-based resin or polyester based resin, addition to
The soft magnetic powder 3 of electromagnetic wave absorption, wherein soft magnetic powder 3 such as Fe-Al-Si alloys or Fe-Ni alloy/C.Composite magnetic body
1 utilizes the high-frequency absorption of the magnetic permeability of soft magnetic powder 3, can inhibit the interference of unwanted electromagnetic wave.However, this composite magnetic body
Organic bond used in 1 formation is easy the influence because heated, the shortcomings of being deformed, deteriorate.Moreover, organic knot
The heat conductivity of mixture is bad, the heat dissipation for the electronic component that calorific value can be interfered big.Above-mentioned electromagnetic interference suppressor 10 can not be same
When solve the problems, such as waste heat dissipation that EMI Electromagnetic Interferences and electronic device generate.
Invention content
The purpose of the present invention is to provide a kind of electromagnetic interference shielding film, conductive layer therein contains conducting particles,
The resistance value of conductive layer can be not only reduced, more can substantially be lowered because electromagnetic wave enters produced by this electromagnetic interference shielding film
Heat, and electromagnetic wave absorbing layer contains electromagnetic wave absorbent material, can promote electromagnetic interference shielding effect.
In order to achieve the above objectives, a kind of electromagnetic interference shielding film is proposed, including:Contain electro-magnetic wave absorption particle
Electromagnetic wave absorbing layer has the first face and the second face;Conductive layer containing conducting particles is located at the first face of electromagnetic wave absorbing layer
On;Metal layer is located on the second face of electromagnetic wave absorbing layer;And insulating layer, it is located on metal layer.Electromagnetic interference shielding film
Further include the first release film of setting on the electrically conductive, and the second release film of setting on the insulating layer.
In order to reach above-mentioned purpose, a kind of electromagnetic interference shielding film is in addition proposed, including:Contain electro-magnetic wave absorption
First electromagnetic wave absorbing layer of particle has the first face and the second face;Conductive layer containing conducting particles is located at electro-magnetic wave absorption
On first face of layer;The first metal layer is located on the second face of the first electromagnetic wave absorbing layer;Containing electro-magnetic wave absorption particle
Two electromagnetic wave absorbing layers are located on the first metal layer;Second metal layer is located on the second electromagnetic wave absorbing layer;And insulating layer, position
In in second metal layer.Electromagnetic interference shielding film further includes the first release film of setting on the electrically conductive, and setting exists
The second release film on insulating layer.
Preferably, the material of the wherein conductive layer is epoxy resin or acryl resin.
Preferably, which is gold, silver, copper, aluminium, nickel, iron or Sillim's metal particles, surface copper or aluminium coated with silver
Metallic particles, surface are coated with resin particle or bead or carbon dust, carbon 60, the carbon of gold, silver, copper, aluminium, nickel, iron or tin
Black, graphite, expanded graphite, carbon nanotubes or graphene.
Preferably, the thickness of the conductive layer is 15 microns to 40 microns.
Preferably, the material of the electromagnetic wave absorbing layer is epoxy resin or acryl resin.
Preferably, which is particles.
Preferably, which is iron oxide, sendust, permalloy or iron silicochromium nickel alloy.
Preferably, which is calcium carbonate, cement, natural crystal or far infrared ore.
Preferably, the thickness of the electromagnetic wave absorbing layer is 5 microns to 20 microns.
Preferably, the material of the metal layer is gold, silver, copper, aluminium, nickel, titanium or tin.
The electromagnetic interference shielding film of the present invention can generate following effect:Conductive layer in electromagnetic interference shielding film
Containing conducting particles, the resistance value of conductive layer can be not only reduced, more can substantially be lowered because electromagnetic wave enters this Electromagnetic Interference
Electromagnetic wave absorbing layer contains electromagnetic wave absorbent material in heat caused by shielding film and electromagnetic interference shielding film,
Electromagnetic interference shielding effect can be promoted.
Description of the drawings
Fig. 1 is a kind of high thermal conductivity composite magnetic body that the prior art uses.
Fig. 2 shows the electromagnetic interference shielding films of the embodiment of the present invention.
Fig. 3 shows reflection and absorption of the electromagnetic wave incident to electromagnetic interference shielding film.
Fig. 4 shows the electromagnetic interference shielding film of another embodiment of the present invention.
Specific implementation mode
Fig. 2 shows the electromagnetic interference shielding films of the embodiment of the present invention.As shown in Fig. 2, electromagnetic interference shielding is thin
Film 20, including:Electromagnetic wave absorbing layer 21 containing electro-magnetic wave absorption particle 212 has the first face 213 and the second face 214;Contain
The conductive layer 23 of conducting particles 232 is located on the first face 213 of electromagnetic wave absorbing layer 21;Metal layer 24 is located at electro-magnetic wave absorption
On second face 214 of layer 21;And insulating layer 27, it is located on metal layer 24.Electromagnetic interference shielding film 20 further includes setting and exists
The first release film 28 on conductive layer 23, and the second release film 29 for being arranged on insulating layer 27.
The material of electromagnetic wave absorbing layer 21 is epoxy resin or acryl resin.The electricity being dispersed in electromagnetic wave absorbing layer 21
Electro-magnetic wave absorption particle 212 can be particles, such as iron oxide, sendust, permalloy or iron silicochromium nickel alloy.It utilizes
The high-frequency absorption of the magnetic permeability of particles can inhibit the interference of electromagnetic wave.In addition, electro-magnetic wave absorption particle 212 can be carbon
Sour calcium, cement, natural crystal, far infrared ore materials.The content of electro-magnetic wave absorption particle 212 can be 5wt%-30wt%.
The thickness of electromagnetic wave absorbing layer 21 is 5 microns to 20 microns.Inorganic filler can be added in electromagnetic wave absorbing layer 21, such as is carbonized
Silicon, boron nitride and aluminium oxide.
The material of conductive layer 23 is epoxy resin or acryl resin.The conducting particles 232 being dispersed in conductive layer 23 is
Gold, silver, copper, aluminium, nickel, iron or Sillim's metal particles, surface be coated with silver copper or aluminium gold metal particles, surface be coated with gold, silver,
Copper, aluminium, nickel, the resin particle or bead or carbon dust of iron or tin, carbon 60, carbon black, graphite, expanded graphite, carbon nanotubes or
Graphene.The content of conducting particles 232 can be 15wt%-40wt%.The thickness of conductive layer 23 is 15 microns to 40 microns.It is conductive
Layer 23 contains conducting particles 232, can not only reduce the resistance value of conductive layer 23, more can substantially lower because electromagnetic wave enters this electricity
Heat caused by magnetic wave interference shielding film 20.Inorganic filler, such as silicon carbide, boron nitride and oxygen can be added in conductive layer 23
Change aluminium.
Metal layer 24 mainly provides the function of electromagnetic wave shielding.The material of metal layer 24 can be gold, silver, copper, aluminium, nickel, titanium
Or tin, preferably silver-colored or aluminium.24 thickness of metal layer can be 0.05 micron to 5 microns.Metal layer 24 can utilize vacuum evaporation, splash
The filming equipments such as plating, plating, vacuum deposition, chemical vapor deposition (CVD) complete continuous coating using roll-to-roll mode.This
Outside, metal layer 24 is not limited carries out plated film using aforesaid way, and another selection of the metal foil as metal layer 24 also can be selected.
Insulating layer 27 is located on metal layer 24.The mode for forming insulating layer 27, it is special can to paste soft board on metal layer 24
Cover film, wherein composition include:Hard formation is PI, and soft formation is epoxy resin.The other mode for forming insulating layer 27 is to make merely
With insulating cement, e.g. epoxy resin, acryl resin or can be through UV/ electron beam curing resins.The thickness of insulating layer 27 can be 5
Micron is to 50 microns.
First release film 28 is made by engineering plastic, such as polypropylene (PP), crosslinked polyethylene (PE), makrolon
(PC), polyester (PET), polyimides (PI), polyimide amide (PAI), polyetherimide (PEI), epoxy resin
(Epoxy), the macromolecules such as polyurethane resin and acryl resin (Acrylic) are formed by engineered plastics material.In addition, first
Release paper or the engineering plastic film containing mould release can be selected in release film 28.The function of first release film 28 is that protection is conductive
Layer 23 prevents from being polluted (such as hydrolysis, dust ...) by external environment, and the electromagnetic interference shielding film 20 is in use, meeting
First release film 28 is torn off.The thickness of first release film 28 can be 7.5 microns to 50 microns.
Second release film 29 is made by engineering plastic, such as polypropylene (PP), crosslinked polyethylene (PE), makrolon
(PC), polyester (PET), polyimides (PI), polyimide amide (PAI), polyetherimide (PEI), epoxy resin
(Epoxy), the macromolecules such as polyurethane resin and acryl resin (Acrylic) are formed by engineered plastics material.In addition, second
Release paper or the engineering plastic film containing mould release can be selected in release film 29.The function of second release film 29 is protection insulation
Layer 27 prevents from being polluted (such as hydrolysis, dust ...) by external environment, and the electromagnetic interference shielding film 20 is in use, meeting
Second release film 29 is torn off.The thickness of second release film 29 can be 7.5 microns to 50 microns.
Then, with reference to figure 3, Fig. 3 shows reflection and absorption of the electromagnetic wave incident to electromagnetic interference shielding film.Such as figure
Shown in 3, when incident electromagnetic wave I encounters the electromagnetic interference shielding film 20 of the present invention, a part of 23 surface of self-conductance electric layer
It is reflected as back wave R1, another part, which penetrates the conductive layer 23 of the present invention and electromagnetic wave absorbing layer 21, becomes penetrated wave T, penetrates
Wave T, which encounters 24 surface reflection of metal layer back, becomes primary reflection R21 and to encounter 21 inner surface of electromagnetic wave absorbing layer anti-again
It is emitted back towards the secondary counter ejected wave R22 come, secondary counter ejected wave R22, which encounters 24 surface reflection of metal layer back, to be become back wave R31 and touch
To the reflected back wave R32 of 21 inner surface of electromagnetic wave absorbing layer, back wave R32 encounter 24 surface reflection of metal layer back at
For back wave R41 and encounters 21 inner surface of electromagnetic wave absorbing layer reflected back wave R42, back wave R42 and encounter metal layer
24 surface reflections become back wave R51 and meet the reflected back wave R52 of 21 inner surface of electromagnetic wave absorbing layer back, continue
There are multipath reflection and multi-absorption in electromagnetic wave absorbing layer 21 into electromagnetic wave is exercised.Control electromagnetic wave in electromagnetic wave absorbing layer 21
The electromagnetic property of absorbing particle 212 allows electromagnetic wave to have amplitude appropriate and phase multipath reflection in electromagnetic wave absorbing layer 21, makes
Electromagnetic wave has multi-absorption in electromagnetic wave absorbing layer 21, and the total reflection amount of electromagnetic wave is reduced, and reaches electro-magnetic wave absorption efficiency
Promotion.
Fig. 4 shows the electromagnetic interference shielding film of another embodiment of the present invention.Exist with the difference of Fig. 3 embodiments
In the electromagnetic interference shielding film of the present embodiment has two metal layers and two layers of absorbed layer, different types of metal layer that can hide
Cover the electromagnetic wave of different frequency.As shown in figure 4, electromagnetic interference shielding film 30, including:Contain electro-magnetic wave absorption particle 312
The first electromagnetic wave absorbing layer 31, have the first face 313 and the second face 314;Conductive layer 33 containing conducting particles 332, is located at
On first face 313 of the first electromagnetic wave absorbing layer 31;The first metal layer 34 is located at the second face of the first electromagnetic wave absorbing layer 31
On 314;The second electromagnetic wave absorbing layer 35 containing electro-magnetic wave absorption particle 352 is located on the first metal layer 34;Second metal layer
36, it is located on the second electromagnetic wave absorbing layer 35;And insulating layer 37, it is located in second metal layer 36.Electromagnetic interference shielding film
30 further include the first release film 38 being arranged on conductive layer 33, and the second release film 39 being arranged on insulating layer 37.
The material of first electromagnetic wave absorbing layer 31 and the second electromagnetic wave absorbing layer 35 is epoxy resin or acryl resin.Point
The electro-magnetic wave absorption particle 312 being dispersed in the first electromagnetic wave absorbing layer 31 can be particles, such as the conjunction of iron oxide, iron sial
Gold, permalloy or iron silicochromium nickel alloy.The electro-magnetic wave absorption particle 352 being dispersed in the second electromagnetic wave absorbing layer 35 can be soft
Magnetic particle, such as iron oxide, sendust, permalloy or iron silicochromium nickel alloy.Utilize the height of the magnetic permeability of particles
Frequency absorbs, and can inhibit the interference of electromagnetic wave.In addition, electro-magnetic wave absorption particle 312 and electro-magnetic wave absorption particle 352 can be carbonic acid
Calcium, cement, natural crystal, far infrared ore materials.The content of electro-magnetic wave absorption particle 312 can be 5wt%-30wt%.Electricity
The content of electro-magnetic wave absorption particle 352 can be 5wt%-30wt%.The thickness of first electromagnetic wave absorbing layer 31 is 2 microns to 10 micro-
Rice.The thickness of second electromagnetic wave absorbing layer 35 is 2 microns to 10 microns.First electromagnetic wave absorbing layer 31 and the second electro-magnetic wave absorption
Inorganic filler, such as silicon carbide, boron nitride and aluminium oxide can be added respectively in layer 35.The material of conductive layer 33 be epoxy resin or
Acryl resin.The conducting particles 332 being dispersed in conductive layer 33 is gold, silver, copper, aluminium, nickel, iron or Sillim's metal particles, surface
Copper or aluminium gold metal particles, surface coated with silver are coated with the resin particle or bead of gold, silver, copper, aluminium, nickel, iron or tin, or
It is carbon dust, carbon 60, carbon black, graphite, expanded graphite, carbon nanotubes or graphene.The content of conducting particles 232 can be 15wt%-
40wt%.The thickness of conductive layer 33 is 15 microns to 40 microns.Conductive layer 33 contains conducting particles 332, can not only reduce conduction
The resistance value of layer 33 more can substantially lower because electromagnetic wave enters heat caused by this electromagnetic interference shielding film 30.It leads
Inorganic filler, such as silicon carbide, boron nitride and aluminium oxide can be added in electric layer 33 respectively.
The first metal layer 34 and second metal layer 36 are mainly to provide the function of electromagnetic wave shielding.The material of the first metal layer 34
Matter can be the alloy of gold, silver, copper, aluminium, nickel, titanium, tin or above-mentioned metal, preferably silver, aluminium or silver-aluminium alloy.Second metal layer
36 material is optional different from the material of the first metal layer 34, and different types of metal layer can cover the electromagnetism of different frequency
Wave.34 thickness of the first metal layer can be 0.05 micron to 2.5 microns.36 thickness of second metal layer can be 0.05 micron to 2.5 micro-
Rice.The first metal layer 34 and second metal layer 36 can utilize vacuum evaporation, sputter, plating, vacuum deposition, chemical vapor deposition
(CVD) etc. filming equipments complete continuous coating using roll-to-roll mode.In addition, the first metal layer 34 and second metal layer 36 are simultaneously
It does not limit and carries out plated film using aforesaid way, metal foil or Alloy Foil also can be selected as the first metal layer 34 and second metal layer
36 another selection.
Insulating layer 37 is located in second metal layer 36.The mode for forming insulating layer 37, can paste in second metal layer 36
The dedicated cover film of soft board, wherein composition includes:Hard formation is PI, and soft formation is epoxy resin.Form the other mode of insulating layer 37
It is to use insulating cement merely, e.g. epoxy resin, acryl resin or can be through UV/ electron beam curing resins.Insulating layer 37
Thickness can be 5 microns to 50 microns.
First release film 38 is made by engineering plastic, such as polypropylene (PP), crosslinked polyethylene (PE), makrolon
(PC), polyester (PET), polyimides (PI), polyimide amide (PAI), polyetherimide (PEI), epoxy resin
(Epoxy), the macromolecules such as polyurethane resin and acryl resin (Acrylic) are formed by engineered plastics material.In addition, first
Release paper or the engineering plastic film containing mould release can be selected in release film 38.The function of first release film 38 is that protection is conductive
Layer 33 prevents from being polluted (such as hydrolysis, dust ...) by external environment, and the electromagnetic interference shielding film 30 is in use, meeting
First release film 38 is torn off.The thickness of first release film 38 can be 7.5 microns to 50 microns.
Second release film 39 is made by engineering plastic, such as polypropylene (PP), crosslinked polyethylene (PE), makrolon
(PC), polyester (PET), polyimides (PI), polyimide amide (PAI), polyetherimide (PEI), epoxy resin
(Epoxy), the macromolecules such as polyurethane resin and acryl resin (Acrylic) are formed by engineered plastics material.In addition, second
Release paper or the engineering plastic film containing mould release can be selected in release film 39.The function of second release film 39 is protection insulation
Layer 37 prevents from being polluted (such as hydrolysis, dust ...) by external environment, and the electromagnetic interference shielding film 30 is in use, meeting
Second release film 39 is torn off.The thickness of second release film 39 can be 7.5 microns to 50 microns.
(embodiment)
(first embodiment-electromagnetic interference shielding film)
The electromagnetic interference shielding film of the present invention can be used following making step and complete, and making step is as follows:
The first release film that one thickness is 10 microns is provided first;It is 20 microns that a thickness is formed on the first release film
Conductive layer;The second release film that one thickness is 10 microns is provided;Electromagnetic wave absorbing layer is formed on the second release film;By second from
Electromagnetic wave absorbing layer on type film is stacked and placed on conductive layer;On electromagnetic wave absorbing layer one is formed using sputter (or vapor deposition) mode
The silver metal layer that thickness is 1.0 microns;Insulating layer is formed on third release film;And insulating layer and third release film are stacked
In on silver metal layer, that is, form electromagnetic interference shielding film.
(second embodiment-has the electromagnetic interference shielding film of double-metal layer)
The electromagnetic interference shielding film with double-metal layer of the present invention, can complete by following making step,
Making step is as follows:
The first release film that one thickness is 10 microns is provided first;It is 20 microns that a thickness is formed on the first release film
Conductive layer;The second release film that one thickness is 10 microns is provided;The first electromagnetic wave absorbing layer is formed on the second release film;By
The first electromagnetic wave absorbing layer on two release films is stacked and placed on conductive layer;On the first electromagnetic wave absorbing layer using sputter (or steam
Plating) to form a thickness be 1.0 microns of silver metal layer to mode;The second electromagnetic wave absorbing layer is formed on third release film;By
The second electromagnetic wave absorbing layer on three release films is stacked and placed on silver metal layer;On the second electromagnetic wave absorbing layer using sputter (or
Vapor deposition) to form a thickness be 1.0 microns of silver-aluminum metal layer to mode;Insulating layer is formed on the 4th release film;And it will insulation
Layer and the 4th release film are stacked and placed on silver-aluminum metal layer, that is, form the electromagnetic interference shielding film with double-metal layer.
Illustrate that conducting particles content, electro-magnetic wave absorption particle contain below with the electromagnetic interference shielding film of first embodiment
The influence of amount and metal layer thickness for electromagnetic interference shielding film characteristics.In the conductive layer of table 1 other than conducting particles, add
Increase thermal diffusivity added with inorganic filler aluminium oxide.As seen from Table 1, as graphene content increases in conductive layer, resistance value drop
It is low.In the electromagnetic wave absorbing layer of table 2 other than electro-magnetic wave absorption particle, increase thermal diffusivity added with inorganic filler aluminium oxide.By
Table 2 can be seen that resistance value has no the trend obviously increased, resistance value about 10 as electro-magnetic wave absorption particle content increases14.By
Table 3 can be seen that, increase with the thickness of metal layer, increased trend is presented in electromagnetic shielding value.In addition to leading in the conductive layer of table 4
Outside charged particle, increase thermal diffusivity added with inorganic filler aluminium oxide.As seen from Table 4, conducting particles content increases in conductive layer,
The K values that radiate increase.
Influence of the conducting particles content for resistance value in 1 conductive layer of table
| Graphene content (wt%) | Epoxy resin content (wt%) | Resistance value (Ω/) |
| 0 | 40 | 7.31×1015 |
| 15 | 40 | 1.8×106 |
| 25 | 40 | 1.2×104 |
| 40 | 40 | 9.43×102 |
| 50 | 40 | <10 |
| 60 | 40 | <1 |
Influence of the 2 electro-magnetic wave absorption particle content of table for resistance value
Influence of 3 metal layer thickness of table to electromagnetic shielding value
| The type of metal layer | Thickness (micron) | Electromagnetic shielding value (db) |
| Silver | 0.5 | 56 |
| Silver | 1 | 65 |
| Silver | 4 | 73 |
| Silver | 7 | 78 |
| Silver | 10 | >80 |
Influence of the conducting particles content for the K values that radiate in 4 conductive layer of table
Note:Other materials in table 4, including non-thermally conductive material and Heat Conduction Material.Wherein, non-thermally conductive material is, for example, to harden
Agent, catalyst and fire retardant etc.;Heat Conduction Material is, for example, silica, molten state silica, aluminium oxide, magnesia, hydrogen-oxygen
Change magnesium, calcium carbonate, aluminium nitride, boron nitride, aluminium hydroxide, aluminum silicon carbide, silicon carbide, sodium carbonate, titanium dioxide, zinc oxide, oxygen
Change zirconium, quartz, metal oxide, nonmetal oxide, nitride, silicon compound, silicate object, glass, ceramic material, calcining
Kaolin and glaze etc..
Claims (10)
1. a kind of electromagnetic interference shielding film, including:
Electromagnetic wave absorbing layer containing electro-magnetic wave absorption particle has the first face and one second face;
Conductive layer containing conducting particles is located on first face of the electromagnetic wave absorbing layer;
Metal layer is located on second face of the electromagnetic wave absorbing layer;And
Insulating layer is located on the metal layer.
2. the material of electromagnetic interference shielding film as described in claim 1, the wherein conductive layer is epoxy resin or pressure gram
Power resin.
3. electromagnetic interference shielding film as described in claim 1, the wherein conducting particles be gold, silver, copper, aluminium, nickel, iron or
Sillim's metal particles, surface are coated with the resin of copper or aluminium gold metal particles, surface coated with gold, silver, copper, aluminium, nickel, iron or tin of silver
Particle or bead or carbon dust, carbon 60, carbon black, graphite, expanded graphite, carbon nanotubes or graphene.
4. electromagnetic interference shielding film as described in claim 1, the wherein thickness of the conductive layer are 15 microns to 40 microns.
5. the material of electromagnetic interference shielding film as described in claim 1, the wherein electromagnetic wave absorbing layer is epoxy resin
Or acryl resin.
6. electromagnetic interference shielding film as described in claim 1, wherein the electro-magnetic wave absorption particle is particles.
7. electromagnetic interference shielding film as described in claim 1, the wherein particles be iron oxide, sendust,
Permalloy or iron silicochromium nickel alloy.
8. electromagnetic interference shielding film as described in claim 1, wherein the electro-magnetic wave absorption particle be calcium carbonate, cement,
Natural crystal or far infrared ore.
9. electromagnetic interference shielding film as described in claim 1, the wherein thickness of the electromagnetic wave absorbing layer are 5 microns to 20
Micron.
10. electromagnetic interference shielding film as described in claim 1, the wherein material of the metal layer be gold, silver, copper, aluminium,
Nickel, titanium or tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810654225.7A CN108697044A (en) | 2018-06-22 | 2018-06-22 | A kind of electromagnetic interference shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810654225.7A CN108697044A (en) | 2018-06-22 | 2018-06-22 | A kind of electromagnetic interference shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108697044A true CN108697044A (en) | 2018-10-23 |
Family
ID=63849081
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| Application Number | Title | Priority Date | Filing Date |
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| Country | Link |
|---|---|
| CN (1) | CN108697044A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115484808A (en) * | 2022-10-17 | 2022-12-16 | 宁波中科毕普拉斯新材料科技有限公司 | Electromagnetic shielding composite material and preparation method thereof |
-
2018
- 2018-06-22 CN CN201810654225.7A patent/CN108697044A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115484808A (en) * | 2022-10-17 | 2022-12-16 | 宁波中科毕普拉斯新材料科技有限公司 | Electromagnetic shielding composite material and preparation method thereof |
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Application publication date: 20181023 |