CN108693930B - Radiator pop-up structure and connector module - Google Patents
Radiator pop-up structure and connector module Download PDFInfo
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- CN108693930B CN108693930B CN201710232200.3A CN201710232200A CN108693930B CN 108693930 B CN108693930 B CN 108693930B CN 201710232200 A CN201710232200 A CN 201710232200A CN 108693930 B CN108693930 B CN 108693930B
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- expansion card
- heat sink
- cantilever
- radiator
- pop
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Electric Stoves And Ranges (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明公开一种散热器弹起结构，其适于固定至一主机板上的一连接器，并供一扩展卡散热器设置于其上。散热器弹起结构包括一本体、一悬臂及一固定部。本体适于固定至连接器。悬臂延伸自本体，并可相对于本体在一第一位置与一第二位置之间挠动。固定部位于本体或悬臂上。扩展卡散热器适于固定至散热器弹起结构的固定部，并承靠于悬臂上，以连动于悬臂。扩展卡散热器适于受压而连同悬臂从第一位置一起移动至第二位置，且当解除扩展卡散热器的受压状态时，悬臂带动扩展卡散热器回到第一位置。本发明还提供一种连接器模块。
The invention discloses a radiator pop-up structure, which is suitable for being fixed to a connector on a mainboard, and for an expansion card radiator to be arranged on it. The radiator pop-up structure includes a body, a cantilever and a fixing part. The body is adapted to be secured to the connector. The cantilever extends from the body and can be deflected relative to the body between a first position and a second position. The fixed part is located on the body or the cantilever. The expansion card radiator is suitable for being fixed to the fixing part of the radiator pop-up structure, and is supported on the cantilever so as to be linked with the cantilever. The expansion card radiator is adapted to be pressed and moved together with the cantilever from the first position to the second position, and when the compressed state of the expansion card radiator is released, the cantilever drives the expansion card radiator back to the first position. The present invention also provides a connector module.
Description
Technical Field
The present invention relates to a pop-up structure and a module having the same, and more particularly, to a heat sink pop-up structure and a connector module having the same.
Background
As users demand more and more, the motherboard is configured with a plurality of connectors to provide more functions. For example, there may be a Next Generation Form Factor (NGFF) slot, i.e., an m.2 slot, on the motherboard for an expansion card with an m.2 interface (e.g., a solid state disk with an m.2 interface) to be inserted. Such a high-performance expansion card may generate a large amount of heat during operation due to data transfer at a high speed, thereby causing a temperature rise. In order to avoid the performance of the expansion card from being affected by overheating, an expansion card heat sink may be disposed on the expansion card to rapidly dissipate heat.
Generally, the expansion card heat sink is fixed to the expansion card or the motherboard by screws, for example. If the expansion card heat radiator needs to be disassembled or replaced later, the expansion card heat radiator can be taken only by detaching the screws of the expansion card heat radiator. However, due to the narrow space on the motherboard, there are other electronic components or slots close to the expansion card heat sink, so it is not easy for the user to take out the expansion card heat sink.
Disclosure of Invention
The invention provides a heat radiator bouncing structure which can automatically bounce an expansion card heat radiator so as to facilitate a user to take out the expansion card heat radiator or replace an expansion card below the expansion card heat radiator.
The invention provides a connector module, which comprises the heat radiator bouncing structure.
The invention relates to a heat radiator spring structure which is suitable for being fixed to a connector on a mainboard and is used for arranging an expansion card heat radiator on the connector. The body is adapted to be secured to a connector. The cantilever extends from the body and can be flexible between a first position and a second position relative to the body. The fixing part is located on the body or the cantilever, wherein the expansion card radiator is suitable for being fixed to the fixing part of the radiator bouncing structure and is supported on the cantilever so as to be linked with the cantilever, the expansion card radiator is suitable for being pressed to move to the second position together with the cantilever from the first position, and when the pressed state of the expansion card radiator is relieved, the cantilever drives the expansion card radiator to return to the first position.
In an embodiment of the invention, the cantilever presents an inclined surface inclined upward at a position away from the body.
In an embodiment of the invention, the fixing portion is a through groove located on the cantilever or the body for the expansion card heat sink to penetrate through.
In an embodiment of the invention, the body includes a solder tail adapted to be fixed to the motherboard.
The invention relates to a connector module which is suitable for being fixed on a mainboard and used for connecting an expansion card. The heat sink bouncing structure comprises a body, a cantilever and a fixing part. The body is fixed to the connector. The cantilever extends from the body and can flex relative to the body. The fixing part is positioned on the body or the cantilever. The expansion card radiator is detachably fixed on the fixing part of the radiator bouncing structure and leans against the cantilever to drive the cantilever to move between a first position and a second position together. When the expansion card is inserted into the connector and the expansion card heat radiator is positioned at the first position, an acute angle is formed between the expansion card heat radiator and the expansion card. When the expansion card radiator is pressed and moves to the second position together with the cantilever, the expansion card radiator is abutted against the expansion card. When the pressure state of the expansion card radiator is relieved, the cantilever drives the expansion card radiator to return to the first position.
In an embodiment of the invention, the portion of the cantilever away from the main board gradually moves away from the main board, and the cantilever presents an inclined surface inclined upward.
In an embodiment of the invention, the fixing portion is a through groove located on the cantilever or the body for the expansion card heat sink to penetrate through.
In an embodiment of the invention, the body includes a solder tail adapted to be fixed to the motherboard.
In an embodiment of the invention, the expansion card heat sink includes a base and a fin set disposed on the base, wherein the base includes two clamping portions located at two opposite sides, and the two clamping portions respectively extend from the base to a direction away from the fin set for clamping the expansion card.
In an embodiment of the invention, the base further includes a base fixing portion for fixing to the motherboard.
Based on the above, the heat sink pop-up structure of the present invention can be fixed to the connector. When the expansion card radiator is to be installed, the expansion card radiator can be fixed to the fixing part of the radiator bouncing structure, and at the moment, the expansion card radiator is supported on the cantilever. Then, as long as the pressure is applied to the end of the expansion card radiator far away from the radiator bouncing structure, the expansion card radiator and the cantilever can move together from the first position to the second position to be close to the expansion card, and then the end of the expansion card radiator far away from the radiator bouncing structure can be fixed on the mainboard through locking and the like. When the expansion card heat radiator is removed or replaced, the cantilever of the heat radiator spring structure drives the expansion card heat radiator to turn upwards to return to the first position as long as the fixing state of the expansion card heat radiator and the mainboard is released. Therefore, the user can conveniently take out the expansion card radiator or replace the expansion card positioned below the expansion card radiator.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
Fig. 1 is a schematic diagram of a connector and heat sink pop-up structure of a connector module according to an embodiment of the invention.
Fig. 2 is a schematic view of the heat sink pop-up structure of fig. 1 from another perspective.
FIG. 3 is a schematic view of the expansion card heat sink of the connector module disposed in a first position on the heat sink pop-up structure.
Fig. 4 is a partially enlarged schematic view of the other viewing angles of fig. 3.
FIG. 5 is a schematic view of the card expansion heat sink of the connector module in a second position and secured to the motherboard.
Fig. 6 is a schematic sectional view taken along line a-a of fig. 3.
Fig. 7 is a schematic sectional view taken along line B-B of fig. 5.
Fig. 8 is a schematic cross-sectional view taken along line C-C of fig. 5.
Fig. 9 is a schematic diagram of a heat sink pop-up structure according to an embodiment of the invention.
Wherein the reference numerals are as follows:
p1: first position
P2: second position
10: main machine board
12: screw with a thread
20: expansion card
100: connector module
110: connector with a locking member
112: a first engaging part
120. 120 a: heat radiator spring structure
122: body
123: solder leg
124: second engaging part
125. 125 a: cantilever arm
127. 127 a: fixing part
130: expansion card radiator
132: base seat
133: tongue piece
134: clamping part
136: base fixing part
140: fin group
Detailed Description
Fig. 1 is a schematic diagram of a connector and heat sink pop-up structure of a connector module according to an embodiment of the invention. Fig. 2 is a schematic view of the heat sink pop-up structure of fig. 1 from another perspective. Referring to fig. 1 and fig. 2, the connector module 100 (shown in fig. 4) of the present embodiment is fixed to a motherboard 10 and is used for connecting an expansion card 20. In the present embodiment, the connector module 100 includes a connector 110, a heat sink bouncing structure 120 and an expansion card heat sink 130 (shown in fig. 3). The connector 110 is exemplified by a connector 110 having an m.2 interface, and the expansion card 20 is exemplified by an expansion card 20 having an m.2 interface, such as a solid state disk having an m.2 interface. Of course, the types of the connectors 110 and the expansion cards 20 are not limited thereto, and other connectors 110 and corresponding expansion cards 20 with the socket direction parallel to the motherboard 10 may also be suitable.
As shown in fig. 1, the heat sink pop-up structure 120 includes a main body 122, a suspension 125 and a fixing portion 127. The body 122 is fixed to the connector 110. In the present embodiment, the connector 110 includes two first engaging portions 112 located at two opposite sides (only one first engaging portion 112 is shown in fig. 1 due to the view angle, and the other first engaging portion 112 is located at the opposite side), and the body 122 of the heat sink pop-up structure 120 includes two second engaging portions 124 located at two opposite sides and corresponding to the two first engaging portions 112. More specifically, the first engaging portion 112 is, for example, a hook, the second engaging portion 124 is, for example, a slot, and the body 122 of the heat sink pop-up structure 120 is fixed to the connector 110 by the engagement of the first engaging portion 112 and the second engaging portion 124. Of course, in other embodiments, the number, the installation position, and the type of the first engaging portion 112 and the second engaging portion 124 are not limited thereto, as long as the main body 122 of the heat sink pop-up structure 120 can be fixed to the connector 110.
In addition, in the present embodiment, the body 122 of the heat sink pop-up structure 120 includes at least one solder leg 123, which can be fixed to the motherboard 10 by reflow or the like. That is, in the present embodiment, the body 122 of the heat sink pop-up structure 120 is fixed to the main board 10 in addition to the connector 110, and provides a good stability by the double fixing configuration. Of course, in other embodiments, the body 122 of the heat sink pop-up structure 120 may be fixed to the connector 110 or the motherboard 10 without the solder leg 123 or the first engaging portion 112 and the second engaging portion 124. In addition, in the present embodiment, the solder leg 123 may also be connected to a ground line of the motherboard 10. However, in other embodiments, the solder leg 123 may not be connected to the ground line of the motherboard 10, but only serves as a fixing function.
In addition, in the embodiment, the material of the body 122 of the heat sink pop-up structure 120 may be metal, and since the cover is disposed outside the connector 110, the body 122 may provide an electromagnetic shielding effect for the connector 110 and contribute to increasing the structural strength of the connector 110.
With continued reference to fig. 1, the cantilever 125 of the heat sink pop-up structure 120 extends from the top surface of the body 122. In the present embodiment, the heat sink pop-up structure 120 is made of metal, so the protruding cantilever 125 can be flexible relative to the body 122. In the embodiment, the side of the cantilever 125 is slightly V-shaped, and the cantilever 125 is inclined downward in a direction gradually toward the motherboard 10 near the half of the extended body 122; the cantilever 125 is inclined upward in a direction away from the half of the body 122 and gradually away from the main board 10 (as shown in fig. 2).
The fixing portion 127 of the heat sink pop-up structure 120 is located on the body 122 or the cantilever 125. In the present embodiment, the fixing portion 127 of the heat sink pop-up structure 120 is a through slot located on the cantilever 125, and more specifically, the fixing portion 127 is located on the cantilever 125 near the half of the extended body 122 for the extended card heat sink 130 (shown in fig. 3) to pass through.
Fig. 3 is a schematic diagram of the expansion card heat sink 130 of the connector module 100 disposed on the heat sink pop-up structure 120 and located at the first position P1. Fig. 4 is a partially enlarged schematic view of the other viewing angles of fig. 3. Referring to fig. 3 and 4, in the present embodiment, the expansion card heat sink 130 includes a base 132, a tongue 133 extending from the base 132, and a fin set 140 disposed on the base 132, and the expansion card heat sink 130 is used for dissipating heat of the expansion card 20 connected to the connector 110. As shown in fig. 4, the card expansion heat sink 130 is detachably fixed to the fixing portion 127 of the heat sink pop-up structure 120, and more specifically, the tongue piece 133 at the front end of the base 132 of the card expansion heat sink 130 can extend into the fixing portion 127 (through slot) of the heat sink pop-up structure 120. After the front end of the base 132 of the card expansion heat sink 130 extends into the fixing portion 127 of the heat sink pop-up structure 120, the base 132 of the card expansion heat sink 130 will lean against the cantilever 125 of the heat sink pop-up structure 120 to link the cantilever 125. Thus, the card expansion heat sink 130 can move together with the cantilever 125 between a first position P1 (the upward-opening position shown in fig. 3, 4, and 6) and a second position P2 (the horizontal position shown in fig. 5 and 7). As can be seen in fig. 3, when the expansion card 20 is inserted into the connector 110 and the expansion card heat sink 130 is located at the first position P1, an acute angle is formed between the expansion card heat sink 130 and the expansion card 20. That is, the extended card heat sink 130 is tilted at an end away from the heat sink pop-up structure 120.
Fig. 5 is a schematic view of the expansion card heat sink 130 of the connector module 100 being located at the second position P2 and being fixed to the motherboard 10. Fig. 6 is a schematic sectional view taken along line a-a of fig. 3. Fig. 7 is a schematic sectional view taken along line B-B of fig. 5. Referring to fig. 6 and 7, referring to fig. 5 to 7, in the present embodiment, after the front end of the base 132 of the card expansion heat sink 130 extends into the fixing portion 127 of the heat sink pop-up structure 120, as long as the end of the card expansion heat sink 130 away from the heat sink pop-up structure 120 (e.g., the end located at the left side of fig. 3) is pressed, the card expansion heat sink 130 and the cantilever 125 can move together from the first position P1 shown in fig. 6 to the second position P2 shown in fig. 7 to abut against the card expansion 20 (shown in fig. 3).
Then, the expansion card heat sink 130 can be fixed on the expansion card 20 or the motherboard 10 as shown in fig. 5. In the embodiment, the base 132 includes a base fixing portion 136 at the rear end, and the base fixing portion 136 may be a through hole for passing the screw 12 to fix the base 132 to the motherboard 10. Of course, the base fixing portion 136 may also be a structure such as a buckle, a latch, etc., and is not limited by the drawings.
Fig. 8 is a schematic cross-sectional view taken along line C-C of fig. 5. Referring to fig. 8, in the present embodiment, the base 132 further includes two clamping portions 134 located at two opposite sides, and the two clamping portions 134 respectively extend from the base 132 to a direction away from the fin group 140 for clamping the expansion card 20. That is, in the present embodiment, when the card heat spreader 130 moves to the second position P2, the base 132 of the card heat spreader 130 is fixed to the card 20 by the two clamping portions 134 and fixed to the motherboard 10 by the base fixing portion 136. Of course, in other embodiments, the base 132 may be fixed to the expansion card 20 only by the two clamping portions 134, or fixed to the main board 10 only by the base fixing portion 136.
Thereafter, when the expansion card heat sink 130 is removed or the expansion card 20 is replaced, as long as the fixing state between the expansion card heat sink 130 and the motherboard 10 and between the expansion card heat sink 130 and the expansion card 20 is released, for example, the locking between the base 132 and the motherboard 10 is released, and the base 132 is slightly lifted by applying a force to separate the two clamping portions 134 from the expansion card 20, the cantilever 125 of the heat sink pop-up structure 120 will drive the expansion card heat sink 130 to be flipped up and return to the first position P1.
Since the half portion of the cantilever 125 away from the main body 122 is an inclined surface inclined upward when the cantilever is in the uncompressed state, the end of the extended card heat sink 130 away from the heat sink bouncing structure 120 also tilts upward when the extended card heat sink 130 is in the first position P1. The raised portion of the expansion card heat sink 130 can be higher than the peripheral electronic components or slots, so that the user can conveniently hold the expansion card heat sink 130. Moreover, since the expansion card heat sink 130 is fixed to the body 122 of the heat sink pop-up structure 120 by a through-hole, the user can easily take out the expansion card heat sink 130 by directly pulling it out. Of course, in other embodiments, the expansion card heat sink 130 may be fixed to the body 122 of the heat sink pop-up structure 120 by other quick-release methods, which is not limited thereto. Furthermore, even without removing the expansion card heat sink 130, the tilted expansion card heat sink 130 may provide enough space to replace the expansion card 20 located below the expansion card heat sink 130.
Fig. 9 is a schematic diagram of a heat sink pop-up structure 120 according to an embodiment of the invention. In the embodiment of fig. 9, the same or similar elements as those of the previous embodiment are denoted by the same or similar symbols, and only the main differences will be described below, referring to fig. 9, the heat sink pop-up structure 120a of fig. 9 is mainly different from the heat sink pop-up structure 120 of fig. 1 in that in the present embodiment, the fixing portion 127a is a through slot on the body 122, and the heat sink pop-up structure 120a includes two cantilevers 125a for popping up the expansion card heat sink 130 (shown in fig. 3) and located at two sides of the fixing portion 127 a. Of course, in other embodiments, the number, shape, arrangement position and fixing manner of the cantilever 125a and the fixing portion 127a are not limited to the above, as long as the heat sink pop-up structure 120a can fix the expansion card heat sink 130 by the fixing portion 127a, and the expansion card heat sink 130 can be popped up by the cantilever 125a when the expansion card heat sink is not pressed.
In summary, the heat sink pop-up structure of the present invention can be fixed to the connector. When the expansion card radiator is to be installed, the expansion card radiator can be fixed to the fixing part of the radiator bouncing structure, and at the moment, the expansion card radiator is supported on the cantilever. Then, as long as the pressure is applied to the end of the expansion card radiator far away from the radiator bouncing structure, the expansion card radiator and the cantilever can move together from the first position to the second position to be close to the expansion card, and then the end of the expansion card radiator far away from the radiator bouncing structure can be fixed on the mainboard through locking and the like. When the expansion card heat radiator is removed or replaced, the cantilever of the heat radiator spring structure drives the expansion card heat radiator to turn upwards to return to the first position as long as the fixing state of the expansion card heat radiator and the mainboard is released. Therefore, the user can conveniently take out the expansion card radiator or replace the expansion card positioned below the expansion card radiator.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (11)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710232200.3A CN108693930B (en) | 2017-04-11 | 2017-04-11 | Radiator pop-up structure and connector module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710232200.3A CN108693930B (en) | 2017-04-11 | 2017-04-11 | Radiator pop-up structure and connector module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108693930A CN108693930A (en) | 2018-10-23 |
| CN108693930B true CN108693930B (en) | 2021-10-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710232200.3A Active CN108693930B (en) | 2017-04-11 | 2017-04-11 | Radiator pop-up structure and connector module |
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| US5796581A (en) * | 1997-07-30 | 1998-08-18 | International Business Machines Corporation | Rotational joint for hinged heat pipe cooling of a computer |
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|---|---|
| CN108693930A (en) | 2018-10-23 |
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