CN108723538A - A kind of low-temperature welding method and equipment - Google Patents
A kind of low-temperature welding method and equipment Download PDFInfo
- Publication number
- CN108723538A CN108723538A CN201810799074.4A CN201810799074A CN108723538A CN 108723538 A CN108723538 A CN 108723538A CN 201810799074 A CN201810799074 A CN 201810799074A CN 108723538 A CN108723538 A CN 108723538A
- Authority
- CN
- China
- Prior art keywords
- cable
- welding
- low
- temperature
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000006071 cream Substances 0.000 claims abstract description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000005476 soldering Methods 0.000 claims abstract description 11
- 229910052742 iron Inorganic materials 0.000 claims abstract description 7
- 230000006835 compression Effects 0.000 claims description 10
- 238000007906 compression Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of low-temperature welding methods, which is characterized in that it is to use tin cream welding manner, using low temperature tin cream, cable is first assembled into circuit board to correspond on pad, cable, welding disking area add tin cream, are then again welded together cable and board pads at 300 DEG C or less with soldering iron.The present invention is simple to operate, can solve 280 DEG C of moment resistance to temperature or less cable and be welded on circuit board problem.
Description
Technical field
The present invention relates to the cable of electronic circuit board welding process technique fields, more particularly to electronic circuit board and cable
The method and apparatus of welding.
Background technology
Existing circuit board and cable welding manner are to be welded using tin silk (fusing point of tin silk is at 280 DEG C or more) and soldering iron
Equipment carries out soldering.When actual production, this technology application necessarily requires 330 DEG C of welding temperature or more, and cable is interior
Insulating layer must use the insulating materials (400 DEG C of moment high temperature resistant) of polytetrafluoroethylene (PTFE) (PTFE/ Teflons) material, and two conditions are same
Shi Chengli could meet welding requirements.But it is FEP materials cable (280 DEG C of moment resistance to temperature or less) for inner insulating layer
Product is not applicable.The prior art can cause FEP material cables short circuit or insulating materials damaged, and such properties of product is caused to fail
Or bad order.In order to solve the problems, such as this, new low-temperature bounding method is developed.
Invention content
The purpose of the present invention is exactly to optimize product in order to which the one kind for solving the deficiency of the prior art and providing is easy to operate
Quality improves the low-temperature welding method and equipment of production efficiency.
The present invention is to realize above-mentioned purpose using following technical solution：A kind of low-temperature welding method, feature exist
In it is that cable is first assembled into circuit board and is corresponded on pad using low temperature tin cream using tin cream welding manner, cable, pad
Region adds tin cream, is then again welded together cable and board pads at 300 DEG C or less with soldering iron.
As a further illustration of the above scheme, the cable uses moment 280 DEG C of cables below of resistance to temperature.
A kind of low-temperature welding equipment, which is characterized in that including fixation clip, welder, if being provided on fixation clip
Dry welding slot, is used for fixing circuit board and cable, and welder is arranged above fixation clip, and the soldering tip of welder prolongs
Stretch to welding slot.
Further, it is provided with compression bar on the welding slot, cable presses between compression bar and circuit board.
The compression bar has angle with cable.
The present invention is using the attainable advantageous effect of above-mentioned technical solution institute：
The present invention uses low temperature tin cream, and cable is first assembled into circuit board and is corresponded on pad, cable, welding disking area add tin
Then cable and board pads are welded together with soldering iron (300 DEG C or less), compared with prior art, can be solved by cream again
280 DEG C of moment resistance to temperature or less cable is welded on circuit board problem.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Reference sign：1, cable 2, circuit board 3, fixation clip 4, welder 5, welding slot 6, compression bar.
Specific implementation mode
The technical program is explained in detail below in conjunction with specific embodiment.
As shown in Figure 1, the present invention is a kind of low-temperature welding method, it is to use tin cream welding manner, using low temperature tin cream,
Cable 1 is first assembled into circuit board 2 to correspond on pad, cable, welding disking area add tin cream, then use soldering iron at 300 DEG C or less again
Cable and board pads are welded together.Cable uses moment 280 DEG C of cables below of resistance to temperature.
It is low-temperature welding equipment corresponding with the low-temperature welding method, including fixation clip 3, welder 4 below,
It is provided with several welding slots 5 on fixation clip, is used for fixing circuit board and cable, welder is arranged on fixation clip
The soldering tip of side, welder extends to welding slot.It is provided with compression bar 6 on welding slot, compression bar has angle with cable, generally
It is vertical, cable presses between compression bar and circuit board.
Compared with prior art, the present invention using low temperature tin cream, cable is first assembled into circuit board and is corresponded on pad, line
Cable, welding disking area add tin cream, are then again welded together cable and board pads with soldering iron (300 DEG C or less), and existing
Technology is compared, and can be solved 280 DEG C of moment resistance to temperature or less cable and is welded on circuit board problem.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, various modifications and improvements can be made, these belong to the present invention
Protection domain.
Claims (5)
1. a kind of low-temperature welding method, which is characterized in that it is to use tin cream welding manner, using low temperature tin cream, first by cable
It is assembled into circuit board to correspond on pad, cable, welding disking area add tin cream, then use soldering iron at 300 DEG C or less by cable and electricity again
Road plate pad solder is together.
2. a kind of low-temperature welding method according to claim 1, which is characterized in that the cable uses moment resistance to temperature
280 DEG C of cables below.
3. a kind of low-temperature welding equipment corresponding with low-temperature welding method as claimed in claim 1 or 2, which is characterized in that including
Fixation clip, welder are provided with several welding slots on fixation clip, are used for fixing circuit board and cable, welding dress
It installs above fixation clip, the soldering tip of welder extends to welding slot.
4. low-temperature welding equipment according to claim 3, which is characterized in that be provided with compression bar, line on the welding slot
Cable presses between compression bar and circuit board.
5. low-temperature welding equipment according to claim 3, which is characterized in that compression bar has angle with cable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810799074.4A CN108723538A (en) | 2018-07-19 | 2018-07-19 | A kind of low-temperature welding method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810799074.4A CN108723538A (en) | 2018-07-19 | 2018-07-19 | A kind of low-temperature welding method and equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108723538A true CN108723538A (en) | 2018-11-02 |
Family
ID=63926772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810799074.4A Pending CN108723538A (en) | 2018-07-19 | 2018-07-19 | A kind of low-temperature welding method and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108723538A (en) |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989006581A1 (en) * | 1985-12-09 | 1989-07-27 | Henry Kim | Means and method for soldering and desoldering electronic components |
| US5332144A (en) * | 1993-03-17 | 1994-07-26 | Pace, Incorporated | Concave soldering iron tip and method of soldering using same |
| JPH0716740A (en) * | 1993-06-30 | 1995-01-20 | Tokin Corp | Soldering iron and soldering method using the same |
| JPH11239866A (en) * | 1997-12-19 | 1999-09-07 | Nihon Almit Co Ltd | Low-temperature soldering method |
| US6371805B1 (en) * | 2000-12-28 | 2002-04-16 | Hon Hai Precision Ind. Co., Ltd. | Cable assembly and method for making the same |
| JP2003008229A (en) * | 2001-06-25 | 2003-01-10 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of manufacturing the same |
| JP2007221138A (en) * | 2007-02-14 | 2007-08-30 | Sanyo Electric Co Ltd | Tab lead soldering method |
| CN101198220A (en) * | 2007-12-28 | 2008-06-11 | 天津三星电机有限公司 | Method of welding varnished wire and plated circuit soft plate in electronic component |
| CN202498277U (en) * | 2012-02-29 | 2012-10-24 | 博罗县精汇电子科技有限公司 | Rotary type manual soldering device |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
| CN103495784A (en) * | 2013-10-12 | 2014-01-08 | 四川钟顺太阳能开发有限公司 | Welding jig for grating solar battery pieces and welding process thereof |
| CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
| CN203875447U (en) * | 2014-05-27 | 2014-10-15 | 张曹 | Ultrasonic wave low-temperature brazing device |
| CN104682016A (en) * | 2013-11-26 | 2015-06-03 | 广东盛路通信科技股份有限公司 | Multi-frequency miniaturized handset antenna |
| CN204686241U (en) * | 2015-05-07 | 2015-10-07 | 天地融科技股份有限公司 | Press welding device |
| CN105472879A (en) * | 2016-01-12 | 2016-04-06 | 深圳市立洋光电子股份有限公司 | Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure |
| US20160285221A1 (en) * | 2013-07-22 | 2016-09-29 | Frisimos, Ltd. | Method and system of an automatic-robotic-cable-connector-assembly system |
| CN206361663U (en) * | 2017-01-04 | 2017-07-28 | 浙江阳光美加照明有限公司 | A kind of bonding wire structure of high heat conduction light source board |
| CN207606379U (en) * | 2017-12-12 | 2018-07-13 | 深圳市优特利电源有限公司 | A kind of welding structure and welding fixture |
| CN207625857U (en) * | 2017-10-20 | 2018-07-17 | 广州广电运通金融电子股份有限公司 | A kind of circuit board |
| CN208743872U (en) * | 2018-07-19 | 2019-04-16 | 广东盛路通信科技股份有限公司 | A kind of low-temperature welding equipment |
-
2018
- 2018-07-19 CN CN201810799074.4A patent/CN108723538A/en active Pending
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1989006581A1 (en) * | 1985-12-09 | 1989-07-27 | Henry Kim | Means and method for soldering and desoldering electronic components |
| US5332144A (en) * | 1993-03-17 | 1994-07-26 | Pace, Incorporated | Concave soldering iron tip and method of soldering using same |
| JPH0716740A (en) * | 1993-06-30 | 1995-01-20 | Tokin Corp | Soldering iron and soldering method using the same |
| JPH11239866A (en) * | 1997-12-19 | 1999-09-07 | Nihon Almit Co Ltd | Low-temperature soldering method |
| US6371805B1 (en) * | 2000-12-28 | 2002-04-16 | Hon Hai Precision Ind. Co., Ltd. | Cable assembly and method for making the same |
| JP2003008229A (en) * | 2001-06-25 | 2003-01-10 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of manufacturing the same |
| JP2007221138A (en) * | 2007-02-14 | 2007-08-30 | Sanyo Electric Co Ltd | Tab lead soldering method |
| CN101198220A (en) * | 2007-12-28 | 2008-06-11 | 天津三星电机有限公司 | Method of welding varnished wire and plated circuit soft plate in electronic component |
| CN202498277U (en) * | 2012-02-29 | 2012-10-24 | 博罗县精汇电子科技有限公司 | Rotary type manual soldering device |
| CN103917056A (en) * | 2012-12-31 | 2014-07-09 | 联想(北京)有限公司 | Welding process and circuit board |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
| US20160285221A1 (en) * | 2013-07-22 | 2016-09-29 | Frisimos, Ltd. | Method and system of an automatic-robotic-cable-connector-assembly system |
| CN103495784A (en) * | 2013-10-12 | 2014-01-08 | 四川钟顺太阳能开发有限公司 | Welding jig for grating solar battery pieces and welding process thereof |
| CN104682016A (en) * | 2013-11-26 | 2015-06-03 | 广东盛路通信科技股份有限公司 | Multi-frequency miniaturized handset antenna |
| CN203875447U (en) * | 2014-05-27 | 2014-10-15 | 张曹 | Ultrasonic wave low-temperature brazing device |
| CN204686241U (en) * | 2015-05-07 | 2015-10-07 | 天地融科技股份有限公司 | Press welding device |
| CN105472879A (en) * | 2016-01-12 | 2016-04-06 | 深圳市立洋光电子股份有限公司 | Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure |
| CN206361663U (en) * | 2017-01-04 | 2017-07-28 | 浙江阳光美加照明有限公司 | A kind of bonding wire structure of high heat conduction light source board |
| CN207625857U (en) * | 2017-10-20 | 2018-07-17 | 广州广电运通金融电子股份有限公司 | A kind of circuit board |
| CN207606379U (en) * | 2017-12-12 | 2018-07-13 | 深圳市优特利电源有限公司 | A kind of welding structure and welding fixture |
| CN208743872U (en) * | 2018-07-19 | 2019-04-16 | 广东盛路通信科技股份有限公司 | A kind of low-temperature welding equipment |
Non-Patent Citations (1)
| Title |
|---|
| 梅开乡等: "电子电路设计与制作 电子技术课程设计教学指导", vol. 2, 北京理工大学出版社, pages: 175 - 176 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181102 |
|
| RJ01 | Rejection of invention patent application after publication |