CN108738246B - Device for automatically removing residual solder paste - Google Patents
Device for automatically removing residual solder paste Download PDFInfo
- Publication number
- CN108738246B CN108738246B CN201710245207.9A CN201710245207A CN108738246B CN 108738246 B CN108738246 B CN 108738246B CN 201710245207 A CN201710245207 A CN 201710245207A CN 108738246 B CN108738246 B CN 108738246B
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- China
- Prior art keywords
- solder paste
- gas
- nozzle
- moving plate
- automatically removing
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 335
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- 238000004891 communication Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 40
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 25
- 230000008569 process Effects 0.000 description 25
- 230000007246 mechanism Effects 0.000 description 20
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 14
- 230000000903 blocking effect Effects 0.000 description 11
- 230000009471 action Effects 0.000 description 7
- 238000007639 printing Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a device for automatically removing residual solder paste, which comprises: the device comprises a workbench, a solder paste nozzle opening, a solder paste through hole and a solder paste nozzle, wherein the workbench is used for bearing a solder paste tank and accommodating the solder paste nozzle; a gas channel disposed in the platen, the gas channel including a gas inlet in communication with a source of cleaning gas and a gas outlet configured to blow gas toward a solder paste nozzle opening received in the solder paste through hole to cut solder paste remaining at the solder paste nozzle opening.
Description
Technical Field
The present invention relates to an apparatus for automatically removing residual solder paste, and more particularly, to an apparatus for automatically removing residual solder paste of a solder paste printer used in a surface mounting technology of a printed circuit board.
Background
In the surface mounting process of printed circuit boards, solder paste printers (also known as stencil printers) are used to print solder paste onto electronic products such as circuit boards. Solder paste printers typically include a stencil (or stencil), a device for applying solder paste, a wiper blade, or squeegee mechanism. At the time of printing, the circuit board is automatically fed into the solder paste printer, the circuit board has a pattern of pads or some other conductive surface on which solder paste can be deposited, and the circuit board has one or more small holes or marks called fiducials thereon for aligning the circuit board with a stencil in the solder paste printer prior to printing solder paste onto the circuit board as a reference point. After the circuit board has been aligned with the stencil in the printer, solder paste is dispensed by moving a wiper blade or squeegee across the stencil to force solder paste through apertures in the stencil and onto the circuit board. After the printing operation, the circuit board is then sent to another workstation within the printed circuit board processing line.
An automatic solder paste feeding device on a solder paste printer is used for automatically feeding canned or cylindrical solder paste onto a screen of the solder paste printer, thereby replenishing the solder paste consumed in the printing process. The solder pot typically forms a solder pot assembly with a solder pot nozzle inserted into the solder pot from an opening of the solder pot, and the solder pot is dispensed (or squeezed) out of the solder pot by relative displacement of the solder pot and the solder pot nozzle. In using the automatic tin-filling apparatus, the tin-can assembly is first mounted on the automatic tin-filling apparatus such that the tin-can opening is downward, then the tin-can assembly is moved to a certain position above the screen plate (this action is simply referred to as "positioning"), and then tin paste is dispensed from the tin-can nozzle onto the screen plate by an action such as pressing or drawing (this action is simply referred to as "tin filling"). The two actions of positioning and tin adding are typically driven by two separate driving components (e.g., push rod cylinder, rotary cylinder, motor, etc.), respectively. The automatic solder paste feeding device with two driving parts makes the mechanical structure and the control system of the solder paste printer complex, occupies large space and has high cost.
In addition, after the solder paste is dispensed from the solder paste can nozzle onto the screen plate by pressing or drawing, the solder paste is generally left in the solder paste nozzle opening. For this reason, in the existing automatic solder paste applying apparatus, a tray for receiving the dropped residual solder paste is generally added near the solder paste nozzle opening, and then the tray is cleaned periodically. The need for an operator to clean the trays results in increased personnel maintenance costs.
Disclosure of Invention
The invention aims to provide a device for automatically removing residual solder paste, which can effectively and automatically remove the residual solder paste at a solder paste nozzle opening of an automatic solder paste adding device at low cost.
The device for automatically removing the residual solder paste according to the invention comprises: the device comprises a workbench, a solder paste nozzle opening, a solder paste through hole and a solder paste nozzle, wherein the workbench is used for bearing a solder paste tank and accommodating the solder paste nozzle; a gas channel disposed in the platen, the gas channel including a gas inlet in communication with a source of cleaning gas and a gas outlet configured to blow gas toward a solder paste nozzle opening received in the solder paste through hole to cut solder paste remaining at the solder paste nozzle opening.
The apparatus for automatically removing residual solder paste according to above, wherein the gas passage includes a first passage portion connected to the cleaning gas source and a second passage portion connected to the gas outlet, and the second passage portion is thinner than the first passage portion so that the flowing gas in the first passage portion is accelerated in the second passage portion.
According to the device for automatically removing the residual solder paste, the gas outlet is flat, so that the cutting gas flowing out of the gas outlet is sharper.
According to the device for automatically removing the residual solder paste, the gas is compressed gas.
The device for automatically removing the residual solder paste according to the above, wherein the workbench comprises a first thicker part and a second thinner part, and the bottom surface of the second thinner part is higher than the bottom surface of the first thicker part, so that a step surface connected with the bottom surface of the second thinner part is formed on the first thicker part; wherein the solder paste through hole extends through the second thinner portion, and the gas outlet is provided on the step surface.
According to the device for automatically removing the residual solder paste, the gas outlet is adjacent to the solder paste through hole.
According to the apparatus for automatically removing residual solder paste described above, the gas passage is provided in the first thicker portion.
According to the device for automatically removing the residual solder paste, the workbench is fixedly connected to one end of the workbench supporting device.
According to the apparatus for automatically removing residual solder paste described above, the solder paste tank includes a housing accommodating the solder paste nozzle, the housing being movable relative to the solder paste nozzle, the solder paste tank being carried upside down on the table by the solder paste nozzle, the housing of the solder paste tank being moved relative to the solder paste nozzle by being pressed by a pressing plate that moves up and down above the solder paste tank, so that solder paste can be extruded from the solder paste tank.
The apparatus for automatically removing residual solder paste according to the above is configured to blow gas through the gas outlet toward the solder paste nozzle opening accommodated in the solder paste through hole after the pressing plate stops pressing the solder paste can, thereby cutting the solder paste remaining at the solder paste nozzle opening.
The device for automatically removing the residual solder paste can automatically cut the solder paste remained at the solder paste nozzle opening by adopting the air knife after the automatic solder paste adding device finishes the tin adding working process, so that the residual solder paste remained at the solder paste nozzle opening of the automatic solder paste adding device can be effectively and automatically removed at lower cost, and manual operation is not needed any more to remove the residual solder paste.
Drawings
These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
FIGS. 1A and 1B show a perspective view and an exploded view, respectively, of an automatic solder paste applying apparatus of the present invention;
FIGS. 2A and 2B show inner and outer perspective views, respectively, of the moving plate of the present invention;
FIGS. 3A and 3B show inner and outer perspective views, respectively, of a platen of the present invention;
FIG. 4 shows a cross-sectional view along line A-A of FIG. 1A;
FIG. 5 shows one duty cycle of the automatic solder paste applying apparatus of the present invention;
fig. 6 shows a perspective view of the cage and the height adjustment device of the present invention;
fig. 7A and 7B show a top perspective view and a bottom perspective view, respectively, of the solder paste can of the present invention;
FIG. 8A shows a cross-sectional view of a solder paste pot assembly of the present invention;
FIG. 8B shows a perspective view of a nozzle in the solder paste pot assembly of the present invention;
FIG. 8C shows a cross-sectional view of the tin supply assembly (solder paste can holding assembly) of the present invention;
FIG. 9A shows a perspective view of a table of the present invention;
fig. 9B is a partial cross-sectional view of the table of fig. 1 showing the gas passages and solder paste vias in the table.
Detailed Description
Various embodiments of the present invention are described below with reference to the accompanying drawings, which form a part hereof. It is to be understood that, although directional terms, such as "front", "rear", "upper", "lower", "left", "right", "inner", "outer", etc., may be used in the present invention to describe various example structural portions and elements of the present invention, these terms are used herein for convenience of description only and are determined based on the example orientations shown in the drawings. Since the disclosed embodiments of the invention may be arranged in a variety of orientations, these directional terms are used by way of illustration only and are in no way limiting. Wherever possible, the same or like reference numerals are used throughout the drawings to refer to the same parts.
Fig. 1A and 1B show a perspective view and an exploded view, respectively, of an automatic solder paste applying apparatus 100 of the present invention. As shown in fig. 1A and 1B, the automatic solder paste applying apparatus 100 includes a support plate 130, a push rod 110, a pressing plate 120, a moving plate 140, and a table 150. The support plate 130 is mounted on the solder paste printer for supporting the automatic solder paste applying apparatus 100. The pressing plate 120 is disposed at an end of the pushing rod 110, and the pushing rod 110 can be driven by the driving device 160 to move up and down, so as to drive the pressing plate 120 to move up and down. The support plate 130 is relatively fixed with respect to the up-and-down movement of the push rod 110. The table 150 is fixed to the moving plate 140 at the inner side 141 of the moving plate 140, for example, at the lower end 143 of the moving plate 140. The outer side 145 of the moving plate 140 is slidably disposed on the support plate 130 up and down so that the moving plate 140 can slide up and down with respect to the support plate 130, thereby driving the table 150 up and down. When the moving plate 140 slides down to the bottom dead center, the moving plate 140 reaches its operating position. The table 150 is used to carry the solder paste pot 700 and the solder paste nozzle 500 accommodated in the solder paste pot 700, and when the moving plate 140 reaches its working position, the table 150 is lowered to a height required above the screen plate (i.e., L line shown in fig. 5) of the printer, achieving positioning of the solder paste pot 700 in the height direction. The pressing plate 120 is slidably disposed up and down on the inner side 141 of the moving plate 140.
The driving device 160 of the pushing rod 110 may be a cylinder or a motor, and the driving device 160 may be mounted on the solder paste printer as well as the supporting plate 130, or may be mounted on the supporting plate 130, so that the positions of the driving device 160 and the supporting plate 130 remain relatively fixed. The mounting of the drive 160 on the support plate 130 may be achieved by a transverse mounting plate 170, the transverse mounting plate 170 being provided with holes 172 through which the push rods 110 extend.
As also shown in fig. 1A and 1B, a lower one-way locking mechanism (144,134) is provided between the moving plate 140 and the support plate 130. The lower one-way locking mechanism (144,134) defines a bottom dead center of the up-and-down movement of the moving plate 140 and locks the moving plate 140 when the moving plate 140 is in the operating position so that the moving plate 140 cannot continue to move downward. And an upper locking mechanism (142, 122) is provided between the moving plate 140 and the pressure plate 120, the upper locking mechanism (142, 122) being configured to enable the pressure plate (120) to move relative to the moving plate (140) without the moving plate (140) moving, and to move together with the moving plate (22) when the moving plate (140) moves. More specifically, the upper locking mechanism (142, 122) is configured to: such that the pressing plate 120 can move the moving plate 140 together to move the moving plate 140 to or away from the working position, and such that the pressing plate 120 can move up and down with respect to the moving plate 140 when the moving plate 140 is locked in the working position. By providing the upper (142, 122) and lower one-way locking mechanisms (144,134), the positioning action required to move the solder paste pot assembly to a height above the stencil and the dispensing of solder paste from the solder paste pot nozzle onto the stencil can be accomplished using only one drive assembly 160.
The upper (142, 122) and lower (144,134) one-way locking mechanisms are described in detail below in connection with fig. 2A, 2B, 3A and 3B.
Fig. 2A and 2B show inner and outer perspective views, respectively, of the moving plate 140 of the present invention. Referring to fig. 1A, 1B, 2A and 2B, the lower one-way locking mechanism (144,134) includes a blocking flange 134 provided at a lower end 131 of the support plate 130 and a blocking flange 144 provided at an outer side 145 of the moving plate 140, the blocking flange 134 being located below the blocking flange 144 and having a portion overlapping the blocking flange 144. Thus, as the moving plate 140 moves downward relative to the support plate 130 until the blocking flange 144 of the moving plate 140 abuts the blocking flange 134 of the support plate 130, the support plate 130 prevents the moving plate 140 from continuing to move downward, thereby locking the moving plate 140 in the operating position.
As one example, the blocking flange 134 and the blocking flange 144 are formed by protrusions extending outwardly from the support plate 130 and the moving plate 140, respectively. The blocking flange 144 may be provided at a middle or upper end of the outer side 145 of the moving plate 140, and a position of the blocking flange 144 on the outer side 145 of the moving plate 140 depends on a predetermined elevating distance of the table 150.
Fig. 3A and 3B show inner and outer perspective views, respectively, of the platen 120 of the present invention. Referring to fig. 1A, 1B, 3A and 3B, the upper locking mechanism (142, 122) includes a pulling edge 122 disposed on the pressure plate 120 and a stressing flange 142 disposed on the inner side 141 of the moving plate 140, the pulling edge 122 being located below the stressing flange 142 and having a portion overlapping the stressing flange 142. Thus, by the bearing flange 142 of the moving plate 140 abutting against the pulling edge 122 of the pressure plate 120, both downward and upward movement of the moving plate 140 relative to the support plate 130 can be controlled by movement of the pressure plate 120. And, when the moving plate 140 is locked in its operative position by the lower one-way locking mechanism (144,134), continued downward movement of the pressure plate 120 causes its pulling edge 122 to disengage from the force-receiving flange 142 of the moving plate 140, thereby releasing the moving plate 140. Thereafter, the pressing plate 120 can be moved downward with respect to the moving plate 140 to press the solder paste can 700, performing a tin adding process.
Specifically, the platen 120 is fixed in its initial position by the push rod 110 when the push rod 110 has not been driven to move downward by the driving device 160. At this time, the moving plate 140 is immobilized by the pressing plate 120 due to the bearing flange 142 of the moving plate 140 abutting against the pulling edge 122 of the pressing plate 120. Only when the driving means 160 starts to drive the push rod 110 downward, the moving plate 140 moves downward together with the pressing plate 120 until reaching its working position. The pressing plate 120 can be moved downward with respect to the moving plate 140 to perform a tin-plating work while the moving plate 140 is locked in its work position by a lower one-way locking mechanism (144,134). After the tin-plating operation is completed, when it is desired to move the moving plate 140 away from its operating position, the moving plate 140 can be moved upwardly with the pressing plate 120 by moving the pressing plate 120 upwardly to a position where its pulling edge 122 abuts against the force-bearing flange 142 of the moving plate 140.
As one example, the force-bearing flange 142 is formed by a protrusion extending outwardly from the moving plate 140, and the pulling edge 122 is the inside edge of the pressure plate 120. The force receiving flange 142 may be provided at an upper end of the inner side 141 of the moving plate 140.
As shown in fig. 1B, the support plate 130 has a first runner 136 extending between an upper end 132 and a lower end 131 thereof. As shown in fig. 2B, the moving plate 140 has a first slider 146 disposed on an outer side 145 thereof. The first slider 146 and the first chute 136 cooperate to slidably couple the moving plate 140 to the support plate 130 up and down. As an example, the first slider 146 and the first runner 136 are each trapezoidal in cross section and are sized to match such that the first slider 146 can be inserted into the first runner 136 from both upper and lower ends of the first runner 136 and can slide up and down along the first runner 136 without being released from the first runner 136 in a direction transverse to the first runner 136.
As shown in fig. 2A, the moving plate 140 has a second sliding groove 147 extending between upper and lower ends thereof on the inner side 141. As shown in FIG. 3B, the platen 120 has a second slider 127 on its trailing edge 122. The second slider 127 and the second sliding groove 147 cooperate to slidably connect the pressing plate 120 up and down to the inner side 141 of the moving plate 140. As an example, the second slider 127 and the second sliding groove 147 are each trapezoidal in cross section and are matched in size such that the second slider 127 can be inserted into the second sliding groove 147 from both upper and lower ends of the second sliding groove 147 and can slide up and down along the second sliding groove 147 without being released from the second sliding groove 147 in a direction transverse to the second sliding groove 147.
Fig. 4 shows a cross-sectional view along line A-A in fig. 1A. Fig. 4 shows a cross section of the first slider 146, the first runner 136, the second slider 127, and the second runner 147, and shows the mating relationship between the second slider 127 of the platen 120 and the second runner 147 of the moving plate 140, and between the first slider 146 of the moving plate 140 and the first runner 136 of the support plate 130.
As shown in fig. 3B, the thickness of the platen 120 at its trailing edge 122 is greater than the thickness of the remainder of the platen 120. This is provided so that the thickness of the second slider 127 at the traction edge 122 can be set larger to make the sliding of the pressing plate 120 with respect to the moving plate 140 smoother.
Fig. 5 shows a working cycle of the automatic solder paste applying apparatus 100 of the present invention, in which a line L represents a screen of a solder paste printer, the automatic solder paste applying apparatus 100 is used to dispense solder paste in a solder paste can 700 onto the screen L, and fig. 5 (a) - (e) are exploded to show positional changes of the moving plate 140 and the pressing plate 120 (i.e., strokes of the moving plate 140 and the pressing plate 120) in an up-down direction (i.e., height direction) with respect to the screen L in the working cycle of the automatic solder paste applying apparatus 100. One working cycle of the automatic solder paste applying apparatus 100 includes a positioning process of moving the solder paste pot 700 from the initial position to the working position in the height direction, a solder paste applying working process (hereinafter referred to as "working process"), and a process of returning the solder paste pot 700 from the working position to the initial position in the height direction. It should be noted that fig. 5 (a) - (e) do not show that the automatic solder paste applying apparatus 100 moves left and right with respect to the screen L in the working cycle, and the automatic solder paste applying apparatus 100 may move with respect to the screen L or may be fixed with respect to the screen L in one working cycle. As an example, the automatic solder paste applying apparatus 100 is linearly moved in a horizontal direction with respect to the screen plate L during a solder paste applying operation to dispense solder paste on the screen plate L in a straight line or a curved line from an initial position where solder paste is required until reaching a final position where solder paste is required of the screen plate L. In the positioning process of moving the solder paste pot 700 from the initial position to the working position in the height direction and the process of returning the solder paste pot 700 from the working position to the initial position in the height direction, the automatic solder paste applying device 100 may not move in the horizontal direction with respect to the screen L but may also move in the horizontal direction with respect to the screen L. As an example, the automatic solder paste applying apparatus 100 has a parking position in the printer, and before starting the working cycle of the automatic solder paste applying apparatus 100, the automatic solder paste applying apparatus 100 needs to be moved from the parking position to the start position of the screen plate L where the solder paste is required to be applied, and after the completion of the solder paste applying process, the automatic solder paste applying apparatus 100 needs to be moved back to the parking position from the end position of the screen plate L where the solder paste is required to be applied. As one example, the positioning process of moving the solder paste pot 700 from the initial position to the working position in the height direction may occur in the process of moving the automatic solder paste applying device 100 from the parking position to the start position of the net plate L where the solder paste is required to be applied, and the process of returning the solder paste pot 700 from the working position to the initial position in the height direction may occur in the process of moving the automatic solder paste applying device 100 from the end position of the net plate L where the solder paste is required to be applied to the parking position.
In one working cycle of the automatic solder paste applying apparatus 100, the pressing plate 120 and the moving plate 140 have the following strokes: (i) a stroke of a common movement downward toward the working position of the moving plate (140), (ii) a stroke of a relative movement downward after reaching the working position of the moving plate (140), (iii) a stroke of a relative movement upward after the end of the working process, (iv) a stroke of a common movement upward. Wherein (i) the stroke of the co-movement downward toward the working position of the moving plate (140) achieves the positioning process of moving the solder paste pot 700 from the initial position to the working position in the height direction, (ii) the stroke of the downward relative movement after reaching the working position of the moving plate (140) achieves the tin adding working process, and (iii) the stroke of the upward relative movement after the working process ends and (iv) the stroke of the co-movement upward achieves the process of returning the solder paste pot 700 from the working position to the initial position in the height direction.
Fig. 5 (a) shows an initial position of the pressing plate 120 and the moving plate 140, in which the driving device 160 has not yet started driving the push rod 110 to move downward, so that the pressing plate 120 is immobilized by the push rod 110, and the moving plate 130 is locked by the pressing plate 120 from moving downward by the upper locking mechanism (142, 122). Fig. 5 (b) shows the moving plate 140 just moved down to its working position, at which point the moving plate 140 is locked against further downward movement by the lower one-way locking mechanism (144,134). The stroke from fig. 5 (a) to fig. 5 (b) is a stroke in which the pressing plate 120 and the moving plate 140 move downward toward the working position together. During this travel, the upper locking mechanism (142, 122) still locks the moving plate 140 such that the moving plate 140 is not free to move downward, but is able to move downward with the downward movement of the push rod 110 and the pressure plate 120. Accordingly, as the driving device 160 drives the push rod 110 to move downward, the moving plate 140 moves downward together with the pressing plate 120 along with the push rod 110. The end of this travel means that the positioning process of the solder paste pot 700 is ended, and the solder paste pot 700 is positioned at a desired height above the screen plate L.
Fig. 5 (c) shows the platen 120 being pressed against the solder paste pot 700. The stroke from fig. 5 (b) to fig. 5 (c) is a downward relative movement stroke after reaching the working position of the moving plate 140. During this stroke, the moving plate 140 is locked against further downward movement by the lower one-way locking mechanism (144,134), while the upper locking mechanism (142, 122) releases the moving plate 140 so that the platen 120 can move downward relative to the moving plate 140. When the pressing plate 120 moves relative to the moving plate 140 to contact the solder paste can 700, the continued downward movement of the pressing plate 120 presses the solder paste can 700, so that the solder paste can 700 moves relative to the nozzle 500 mounted on the table 150 and accommodated in the solder paste can 700, thereby dispensing solder paste accommodated in the solder paste can 700 from the nozzle 500 onto the lower screen plate L. The end of this stroke means that the platen 120 has completed the tin adding operation and the working process is ended.
Fig. 5 (d) shows the platen 120 raised to the upper locking mechanism (142, 122) after the end of the operation to re-lock the moving plate 140, the locking being to move the moving plate 130 back up to its original position by the platen 120 (as shown in fig. 5 (e)). The stroke from fig. 5 (c) to fig. 5 (d) is a stroke in which the pressing plate 120 and the moving plate 140 relatively move upward after the end of the working process. During this travel, the upper locking mechanism (142, 122) still releases the moving plate 142, and the platen 120 moves upward relative to the moving plate 140 until the pulling edge 122 of the platen 120 abuts the stressing flange 142 of the moving plate 140.
Fig. 5 (e) shows the moving plate 130 moving upward back to its original position. The stroke from fig. 5 (d) to fig. 5 (e) is the upward common movement stroke of the pressing plate 120 and the moving plate 140. During this stroke, the upper locking mechanism (142, 122) locks the moving plate 140 such that the moving plate 140 moves upward with the upward movement of the push rod 110. The end of this travel means that the platen 120 and the moving plate 140 return to their initial positions and one cycle of the automatic solder paste applying apparatus 100 ends.
By using the support plate 130, the moving plate 140 and the pressing plate 120, which are matched with each other as described above, the automatic solder paste applying apparatus 100 of the present invention can achieve the positioning action required for moving the solder paste pot to the height above the screen plate and the solder paste applying action for dispensing the solder paste from the solder paste pot nozzle onto the screen plate by using only one driving device 160. Therefore, the automatic solder paste feeding device 100 has simple mechanical structure and control system, small occupied space and low cost.
Returning now to fig. 1A and 1B. As shown in fig. 1A and 1B, the present invention also provides a device for preventing solder paste from dripping for use in the automatic solder paste applying device 100, and a solder paste can 700 for use with the device for preventing solder paste dripping.
The solder paste is a relatively viscous fluid such that the solder paste contained in the solder paste can sticks to the housing 710 (shown in fig. 7A) of the solder paste can 700 and the solder paste has a certain dead weight. When the solder paste can 700 is mounted on the table 150 with the opening facing down through the solder paste nozzle 500, the weight of the solder paste tends to flow out of the solder paste nozzle 500 even if the platen 120 does not press the solder paste can 700. And because the solder paste sticks to the housing 710 of the solder paste can 700, the weight of the solder paste drives the solder paste can 700 downward relative to the nozzle 500 housed in the solder paste can 700, and the downward movement of the solder paste can 700 relative to the nozzle 500 tends to squeeze solder paste out of the solder paste can 700, which exacerbates the tendency of solder paste to flow out of the nozzle 500. To this end, the present invention provides the means for preventing solder paste from dripping and the solder paste pot 700 used in combination with the means for preventing solder paste from dripping to prevent solder paste from the solder paste nozzle 500 due to its own weight.
Fig. 6 shows a holder 180 and a height adjustment device 190 in the device for preventing solder paste from dripping. As shown in fig. 6, the means for preventing solder paste from dripping includes a holder 180 and a height adjusting means 190, one end of the height adjusting means 190 being connected to the holder 180. As an example, the holder 180 is provided with a through hole 181, the size of the through hole 181 matching the outer diameter of the housing 710 of the solder paste can 700.
As shown in fig. 1A and 1B, in use, the holder 180 is positioned above the table 150 for carrying the solder paste can 700 and is connected to the housing 710 of the solder paste can 700 by its through-holes 181. One end of the holder 180 is slidably coupled to a table supporting means (i.e., the moving plate 140) for supporting the table 150 so that the holder 180 can move downward with the solder paste pot 700 as the solder paste in the solder paste pot 700 decreases to accommodate a change in the relative positions of the solder paste nozzle 500 and the solder paste pot housing 710. It should be noted that, although in the embodiment shown in fig. 1A and 1B, the table supporting device to which the holder 180 is connected is the moving plate 140, the device for preventing solder paste from dripping provided by the present invention may be used for the automatic solder paste feeding device that does not use the moving plate 140, and the table supporting device may be a non-moving part as long as the part is used for supporting the table 150. That is, any automatic solder paste applying device may be used as long as it applies solder paste using an upside-down solder paste can, the above-described device for preventing solder paste from dripping provided by the present invention, and in use, the holder 180 is attached to a stage supporting device for supporting a stage of the solder paste can.
As also shown in fig. 1A and 1B, the other end of the height adjusting device 190 is also connected to the moving plate 140 as is the holder 180 for adjusting the height of the holder 180 relative to the moving plate 140. As an example, the height adjusting device 190 is a mainspring, a free end of which is connected to the holder 180, a spiral wound portion of which is mounted on the moving plate 140, and a corresponding receiving space 149 (see fig. 2A) is provided on the moving plate 140 to receive the spiral wound portion of the mainspring. The spring force of the clockwork spring should match the weight of the solder paste contained in the solder paste can 700. Specifically, the spring force of the clockwork spring cannot be set too large to prevent the solder paste can 700 from being pulled out of the solder paste nozzle 500, nor too small to apply a sufficient pulling force to the solder paste can 700 to counteract the dead weight of the solder paste. In performing the tin adding operation shown in fig. 5, the clockwork spring enables the holder 180 to move as the solder paste can 700 is pressed down. The height adjusting means 190 may include two mainsprings respectively connected to both ends of the holder 180. Providing two clockwork springs allows for a smoother adjustment of the height of the retainer 180 relative to the moving plate 140. It should be noted that, like the holder 180, the height adjusting device 190 is connected to a table supporting device that supports a table when the automatic solder paste applying device does not use a moving plate.
As shown in fig. 6, the holder 180 includes a slider 182 at one side thereof. The slider 182 is capable of cooperating with a slide groove (e.g., the second slide groove 147 of the moving plate 140) provided on the table support (e.g., the moving plate 140) to slidably couple the holder 180 to the table support (e.g., the moving plate 140). As an example, the slider 182 and the second sliding groove 147 on the moving plate 140 have a trapezoidal cross section and their dimensions are matched so that the slider 182 can be inserted into the second sliding groove 147 from both upper and lower ends of the second sliding groove 147 and can slide up and down along the second sliding groove 147 without being released from the second sliding groove 147 in a direction transverse to the second sliding groove 147.
Fig. 7A and 7B show a top perspective view and a bottom perspective view, respectively, of the solder paste can of the present invention. As shown in fig. 7A and 7B, the solder paste can 700 includes a housing 710 and a cover 720, the housing 710 having an outlet 712, the cover 720 covering the outlet 712. After the solder paste is loaded into the housing 710, the lid 720 seals the outlet 712 to enclose the solder paste in the housing 710.
The outer wall of the housing 710 is provided with a clamping device 750, and when the solder paste can 700 is inserted downward into the through hole 181 of the holder 180 by the outlet 712 (as shown in fig. 1A), the clamping device 750 can be matched with the through hole 181 of the holder 180 to clamp the solder paste can 700 in the holder 180. As one example, the snap-fit device 750 is a stop flange that extends along the circumference of the outer wall of the housing 710. As one example, the snap fit device 750 is positioned near the outlet 712 such that the snap fit device 750 can cooperate with the cap 720 to seal solder paste in the solder paste pot 700, fig. 8A shows a cross-sectional view of the solder paste pot assembly 800 of the present invention, and fig. 8B shows a perspective view of a solder paste nozzle in the solder paste pot assembly of the present invention. As shown in fig. 8A, the solder paste can assembly 800 of the present invention includes a solder paste can 700 as shown in fig. 7, solder paste contained in the solder paste can 700, and a solder paste nozzle 500 (as shown in fig. 8B) contained in the solder paste can 700. The solder paste pot assembly 800 is mounted to the table 150 (shown in fig. 1A) through the solder paste nozzle 500.
As shown in fig. 8B, the solder paste nozzle 500 has a nozzle body 510, a nozzle hole 520 extending through the nozzle body 510, an enlarged head 530 at one end of the nozzle body 510, and a nozzle opening 550 at the other end of the nozzle body 510. As shown in fig. 8A, the enlarged head 530 has a diameter that matches the inner diameter of the solder paste can 700. The outer diameter of the nozzle body 510 near the nozzle opening 550 may be set smaller to mount the solder paste nozzle 500 in the solder paste through hole 155 of the stage 150 (as shown in fig. 9B).
In forming the solder paste pot assembly 800 using the solder paste pot 700 containing solder paste, the cap 720 of the solder paste pot 700 is first removed from the outlet 712 and then the enlarged head 530 of the solder paste nozzle 500 is inserted into the housing 710 from the outlet 712 of the solder paste pot 700. The vicinity of the outlet 712 in the solder paste can 700 is not filled with solder paste, but a space is left for the solder paste nozzle 500.
When the solder paste can assembly 800 is mounted upside down on the table 150 such that the opening 712 of the solder paste can 700 is downward, pressing the bottom of the solder paste can 700 by the pressing plate 120 can move the housing 710 of the solder paste can 700 downward with respect to the solder paste nozzle 500 with the solder paste nozzle 500 being immobilized by the table 150, thereby dispensing solder paste from the nozzle opening 550 of the solder paste nozzle 500.
The above-described means for preventing solder paste from dripping is combined with the solder paste can 700, so that the amount of solder paste dripping from the solder paste nozzle opening 550 or remaining at the nozzle opening 550 due to the weight of solder paste can be reduced.
Fig. 8C shows a cross-sectional view of the tin supply assembly (solder paste can holding assembly) of the present invention. As shown in fig. 8C, the tin supplying assembly of the present invention includes a holder 180, a height adjusting device 190, a tin paste can 700, etc. for supplying tin paste to an automatic tin paste applying device. The tin supplying assembly can prevent solder paste from dripping due to self weight when the solder paste is supplied by utilizing the mutual matching of the limit flange 750 on the solder paste tank shell and the retainer 180, thereby improving the utilization rate of the solder paste, saving the cost, preventing the solder paste from dripping at an unnecessary position and improving the production efficiency of products.
Fig. 9A shows a perspective view of a table 150 of the present invention. Fig. 9B is a partial cross-sectional and enlarged view at the stage 150 of fig. 1, showing the positional relationship of the gas passage 900 and the solder paste through hole 155 in the stage 150. The present invention also provides an apparatus for automatically removing residual solder paste that includes a gas channel 900 (shown in fig. 9A and 9B) disposed in the platen 150.
As shown in fig. 9A and 9B, a solder paste through hole 155 and a gas passage 900 are provided in the stage 150, the solder paste through hole 155 being for accommodating the solder paste nozzle opening 550, the gas passage 900 being for guiding a gas in a cleaning gas source (not shown) toward the solder paste nozzle opening 550 accommodated in the solder paste through hole 155 to cut (or remove) the solder paste remaining at the solder paste nozzle opening 550 by the gas.
Specifically, the table 150 includes a first thicker portion 157 and a second thinner portion 156, and a bottom surface 156a of the second thinner portion 156 is higher than the bottom surface 157a of the first thicker portion 157, thereby forming a stepped surface 158 on the first thicker portion 157 that connects with the bottom surface 156a of the second thinner portion 156. The solder paste through hole 155 extends through the second thinner portion 156, and the gas channel 900 is provided in the first thicker portion 157. The gas channel 900 includes a gas inlet 910 and a gas outlet 920, the gas inlet 910 being in communication with a source of cleaning gas, the gas outlet 920 being disposed on the step face 158 to blow gas toward the solder paste nozzle opening 550 received in the solder paste through hole 155. As one example, the gas outlet 920 is disposed adjacent to the solder paste through hole 155 to improve the cleaning efficiency of the cleaning gas.
The gas outlet 920 is flat so that the cutting gas flowing out from the gas outlet 920 is formed into an air knife. The gas channel 900 comprises a first channel portion 930 and a second channel portion 940, the first channel portion 930 being connected to a source of cleaning gas via a gas inlet 910, the second channel portion 940 being connected to the gas outlet 920. The second channel portion 940 is thinner than the first channel portion 930 such that the gas flowing from the first channel portion 930 into the second channel portion 940 is accelerated, forming a sharper gas knife at the gas outlet 920. In addition, the cleaning gas may be a compressed gas to increase the flow rate of the gas, thereby facilitating sharper air knives.
The above-mentioned device for automatically removing the residual solder paste cuts off the solder paste remaining at the solder paste nozzle 550 immediately after the end of the soldering work, i.e., after the pressing plate 120 stops pressing the solder paste can 700, and the cut-off residual solder paste falls on the position of the solder paste on the screen plate, thereby preventing the solder paste remaining at the solder paste nozzle 550 from being randomly dropped on the screen plate at a position where the dispensing of solder paste is not required during the process of raising the table 150 up to the initial position or the process of moving the automatic solder paste applying device 100 as a whole.
The present specification uses examples to disclose the invention, one or more of which are illustrated in the accompanying drawings. Each example is provided by way of explanation, not limitation, of the invention. Indeed, it will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the scope or spirit of the invention. For instance, features illustrated or described as part of one embodiment, can be used with another embodiment to yield a still further embodiment. It is therefore intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Claims (9)
1. An apparatus for automatically removing residual solder paste, comprising:
a table (150), the table (150) being adapted to carry a solder paste can (700), the solder paste can (700) accommodating a solder paste nozzle (500), the solder paste nozzle (500) having a solder paste nozzle opening (550), the table (150) having a solder paste through hole (155), the solder paste through hole (155) being adapted to accommodate the solder paste nozzle opening (550); and
a gas channel (900) disposed in the platen (150), the gas channel (900) comprising a gas inlet (910) and a gas outlet (920), the gas inlet (910) being configured to communicate with a source of cleaning gas, the gas outlet (920) being configured to blow gas towards the solder paste nozzle opening (550) received in the solder paste through hole (155) to cut solder paste remaining at the solder paste nozzle opening (550),
wherein the solder paste can (700) comprises a housing (710), the housing (710) accommodates the solder paste nozzle (500), the housing (710) is movable relative to the solder paste nozzle (500), the solder paste can (700) is carried upside down on the work table (150) by the solder paste nozzle (500), and the housing (710) of the solder paste can (700) is movable relative to the solder paste nozzle (500) by being pressed by a pressing plate (120) moving up and down above the solder paste can (700), so that solder paste can be extruded from the solder paste can (700).
2. The apparatus for automatically removing residual solder paste according to claim 1, wherein:
the gas channel (900) comprises a first channel portion (930) and a second channel portion (940) in communication with each other, the first channel portion (930) being connected to the cleaning gas source, the second channel portion (940) being connected to the gas outlet (920), the second channel portion (940) being thinner than the first channel portion (930) such that the flowing gas in the first channel portion (930) is accelerated in the second channel portion (940).
3. The apparatus for automatically removing residual solder paste according to claim 1, wherein:
the gas outlet (920) is flat so that the gas flowing out of the gas outlet (920) for cutting residual solder paste is sharper.
4. The apparatus for automatically removing residual solder paste according to claim 1, wherein:
the gas is a compressed gas.
5. The apparatus for automatically removing residual solder paste according to claim 1, wherein:
the workbench (150) comprises a first thicker part (157) and a second thinner part (156), wherein the bottom surface (156 a) of the second thinner part (156) is higher than the bottom surface (157 a) of the first thicker part (157), so that a step surface (158) connected with the bottom surface (156 a) of the second thinner part (156) is formed on the first thicker part (157); and
the solder paste through hole (155) extends through the second thinner portion (156), and the gas outlet (920) is disposed on the step surface (158).
6. The apparatus for automatically removing residual solder paste according to claim 5, wherein:
the gas outlet (920) is adjacent to the solder paste through hole (155).
7. The apparatus for automatically removing residual solder paste according to claim 5, wherein:
the gas channel (900) is arranged in the first thicker portion (157).
8. The apparatus for automatically removing residual solder paste according to claim 5, wherein:
the table (150) is fixedly connected to one end of the table support means.
9. The apparatus for automatically removing residual solder paste according to claim 1, wherein:
the means for automatically removing residual solder paste is configured to blow gas through the gas outlet (920) toward the solder paste nozzle opening (550) accommodated in the solder paste through hole (155) after the pressing plate (120) stops pressing the solder paste can (700), thereby cutting solder paste remaining at the solder paste nozzle opening (550).
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710245207.9A CN108738246B (en) | 2017-04-14 | 2017-04-14 | Device for automatically removing residual solder paste |
| KR1020197033356A KR102456216B1 (en) | 2017-04-14 | 2018-04-13 | Automatic cleaning device for residual solder paste with gas channels in the work platform that supports the solder paste pail |
| PCT/IB2018/000496 WO2018189592A1 (en) | 2017-04-14 | 2018-04-13 | An apparatus for automatically clearing residual solder paste with a gas channel in the working platform bearing a solder paste tub |
| TW107112759A TWI760479B (en) | 2017-04-14 | 2018-04-13 | A device for automatically clearing residual solder paste |
| US16/604,463 US11072033B2 (en) | 2017-04-14 | 2018-04-13 | Apparatus for automatically clearing residual solder paste with a gas channel in the working platform bearing a solder paste tub |
| JP2019555891A JP7152416B2 (en) | 2017-04-14 | 2018-04-13 | A device that automatically removes residual solder paste |
| EP18734284.5A EP3610974B1 (en) | 2017-04-14 | 2018-04-13 | An apparatus for automatically clearing residual solder paste with a gas channel in the working platform bearing a solder paste tub |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710245207.9A CN108738246B (en) | 2017-04-14 | 2017-04-14 | Device for automatically removing residual solder paste |
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| Publication Number | Publication Date |
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| CN108738246A CN108738246A (en) | 2018-11-02 |
| CN108738246B true CN108738246B (en) | 2023-08-04 |
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| CN201710245207.9A Active CN108738246B (en) | 2017-04-14 | 2017-04-14 | Device for automatically removing residual solder paste |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111232343B (en) * | 2020-01-19 | 2022-05-03 | 广州适普电子有限公司 | Device for removing residual solder paste |
| CN111702282A (en) * | 2020-07-13 | 2020-09-25 | 迈普通信技术股份有限公司 | Through hole element unsoldering device, system and method |
| CN118824664B (en) * | 2024-09-20 | 2024-11-15 | 肃菲(江苏)电子科技有限公司 | Solder paste spot coating device for piezoresistor production line |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995020456A1 (en) * | 1994-01-31 | 1995-08-03 | Pillarhouse International Limited | Soldering apparatus |
| GB9604490D0 (en) * | 1995-03-01 | 1996-05-01 | Tani Denki Kogyo Kk | Screen printing method and apparatus |
| US6073817A (en) * | 1998-09-04 | 2000-06-13 | Ford Motor Company | Pneumatically-actuated throttle valve for molten solder dispenser |
| JP2010172928A (en) * | 2009-01-29 | 2010-08-12 | Yamaha Motor Co Ltd | Solder feeder and printer |
| CN105008132A (en) * | 2013-02-07 | 2015-10-28 | 松下知识产权经营株式会社 | Paste supply apparatus, screen printer, paste supply method, and screen printing method |
| CN207266403U (en) * | 2017-04-14 | 2018-04-20 | 伊利诺斯工具制品有限公司 | For removing the device of residual tin cream automatically |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE0101503D0 (en) * | 2001-04-27 | 2001-04-27 | Mydata Automation Ab | Method device and use of the device |
| US8453595B2 (en) * | 2005-11-14 | 2013-06-04 | Mydata Automation Ab | Jetting apparatus and method of improving the performance of a jetting apparatus |
| DE102013017159B3 (en) * | 2013-10-16 | 2014-12-24 | Pac Tech - Packaging Technologies Gmbh | Device for isolated application of solder material depots |
-
2017
- 2017-04-14 CN CN201710245207.9A patent/CN108738246B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1995020456A1 (en) * | 1994-01-31 | 1995-08-03 | Pillarhouse International Limited | Soldering apparatus |
| GB9604490D0 (en) * | 1995-03-01 | 1996-05-01 | Tani Denki Kogyo Kk | Screen printing method and apparatus |
| US6073817A (en) * | 1998-09-04 | 2000-06-13 | Ford Motor Company | Pneumatically-actuated throttle valve for molten solder dispenser |
| JP2010172928A (en) * | 2009-01-29 | 2010-08-12 | Yamaha Motor Co Ltd | Solder feeder and printer |
| CN105008132A (en) * | 2013-02-07 | 2015-10-28 | 松下知识产权经营株式会社 | Paste supply apparatus, screen printer, paste supply method, and screen printing method |
| CN207266403U (en) * | 2017-04-14 | 2018-04-20 | 伊利诺斯工具制品有限公司 | For removing the device of residual tin cream automatically |
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