CN108750390B - Semiconductor low-temperature miniature specimen collection and transportation instrument - Google Patents
Semiconductor low-temperature miniature specimen collection and transportation instrument Download PDFInfo
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- CN108750390B CN108750390B CN201810572218.2A CN201810572218A CN108750390B CN 108750390 B CN108750390 B CN 108750390B CN 201810572218 A CN201810572218 A CN 201810572218A CN 108750390 B CN108750390 B CN 108750390B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 171
- 238000009413 insulation Methods 0.000 claims abstract description 58
- 238000001179 sorption measurement Methods 0.000 claims abstract description 39
- 238000005057 refrigeration Methods 0.000 claims abstract description 33
- 239000012774 insulation material Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 15
- 238000001816 cooling Methods 0.000 abstract description 14
- 238000004321 preservation Methods 0.000 abstract description 13
- 230000005855 radiation Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 165
- 238000003780 insertion Methods 0.000 description 10
- 230000037431 insertion Effects 0.000 description 10
- 238000004891 communication Methods 0.000 description 5
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 3
- 230000002745 absorbent Effects 0.000 description 3
- 239000002250 absorbent Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- OCKGFTQIICXDQW-ZEQRLZLVSA-N 5-[(1r)-1-hydroxy-2-[4-[(2r)-2-hydroxy-2-(4-methyl-1-oxo-3h-2-benzofuran-5-yl)ethyl]piperazin-1-yl]ethyl]-4-methyl-3h-2-benzofuran-1-one Chemical compound C1=C2C(=O)OCC2=C(C)C([C@@H](O)CN2CCN(CC2)C[C@H](O)C2=CC=C3C(=O)OCC3=C2C)=C1 OCKGFTQIICXDQW-ZEQRLZLVSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 210000002966 serum Anatomy 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/18—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/20—External fittings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/38—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents with thermal insulation
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The semiconductor low-temperature miniature specimen collecting and transporting device comprises a miniature semiconductor ice box, wherein an ice box cover with a placing hole is arranged on the ice box; the semiconductor refrigeration structure is arranged at the bottom of the ice box, and a heat radiation port is arranged at the bottom; the bottom of the ice box is also provided with a direct current power supply for providing energy for the semiconductor refrigeration structure; the ice box cover is made of a heat insulation material, and a heat insulation layer is arranged in the hole plug; the whole ice box is also provided with a heat insulation layer. In addition, a marking structure is arranged on the hole plug, and an adsorption layer and an adsorbed layer are correspondingly arranged on the hole plug and the specimen cover. By the arrangement, when a specimen is placed, only a single opening is opened for placement, so that the working difficulty during placement is reduced; and continuous cooling and heat preservation in the collection and transportation processes of the specimen can be ensured through the arrangement of the direct current power supply and the refrigerating sheet, and the time limit on the collection and transportation of the specimen can be reduced.
Description
Technical Field
The invention belongs to the field of medical specimen transport apparatuses, and particularly relates to an apparatus for a specimen to be stored in a low-temperature state, in particular to a semiconductor low-temperature miniature specimen collection and transport apparatus.
Background
Most of the current clinical medical research samples are required to be collected, stored and transported in a low-temperature state, various samples in the processes are required to be collected from different sample chambers, and transported to different laboratories through transportation, the low temperature is required to be continuously maintained in the collection process and the transportation process, and the external interference is required to be reduced as much as possible.
The prior art has the defects that the low-temperature refrigerator is large in size and the instant power supply is utilized, so that the existing low-temperature refrigerator is not easy to carry, the existing heat preservation bags or heat preservation boxes which are convenient to carry and transport are mostly used for cold chains, the temperature control of the heat preservation bags or the heat preservation boxes is mostly dependent on the low-temperature material condition, the time requirement is strict, and the specimens are easily damaged once accidents occur. The existing thermal insulation bag or thermal insulation box and other instruments are provided with a plurality of covers with zippers or buckling properties, the covers are required to be opened together when the specimens are taken and placed, temperature fluctuation is easy to occur in the opening process, and when the single specimens are placed, the covers are opened integrally, so that the operation is required to be completed quickly, and the requirement on staff is high.
In addition, some storage devices are used in the existing laboratory in the refrigerator, and cannot be carried at low temperature, or must be stored by using the low-temperature box for transportation, for example, a serum specimen storage box 20161062731. X and a specimen storage box 201520437181.4 for experiment cannot be directly and effectively transported.
Aiming at the problems that in the prior art, the low-temperature time requirement is high in the process of collecting and transporting the low-temperature sample, the sample is easy to damage, and the temperature fluctuation is easy to cause in the process of taking and placing; and the existing specimen storage device can not be directly transported, etc., and provides a semiconductor low-temperature miniature specimen collection and transportation device.
Disclosure of Invention
In order to solve the problems that the low-temperature time requirement is high in the collection and transportation process of the low-temperature specimen in the prior art, the specimen is easy to damage, the temperature fluctuation is easy to cause in the taking and placing process, the conventional specimen storage instrument cannot be directly transported, and the like, the invention provides the semiconductor low-temperature miniature specimen collection and transportation instrument which can effectively solve the technical problems.
The semiconductor low-temperature miniature specimen collecting and transporting device comprises a miniature semiconductor ice box, wherein an ice box cover with a placing hole is arranged on the miniature semiconductor ice box; the semiconductor refrigeration structure is arranged at the bottom of the miniature semiconductor ice box, and the bottom is provided with a heat radiation port; the bottom of the miniature semiconductor ice box is also provided with a direct current power supply for providing energy for the semiconductor refrigeration structure; the ice box cover is made of a heat insulation material, and a heat insulation layer is arranged in the hole plug; the whole of the miniature semiconductor ice box is also provided with a heat insulation layer, and a control structure for controlling the opening and closing of the semiconductor refrigeration structure is arranged in the miniature semiconductor ice box; and a temperature sensor connected with the control structure is arranged in the miniature semiconductor ice box. By the arrangement, when a specimen is placed, only a single opening is opened for placement, so that the working difficulty during placement is reduced; the continuous cooling and heat preservation in the collection and transportation processes of the specimens can be ensured through the arrangement of the direct current power supply and the refrigerating sheet, and the time limit on the collection and transportation of the specimens can be reduced; and the temperature fluctuation is controlled through the control structure in the transportation process, and when the temperature is too high, the control structure starts the semiconductor refrigeration structure to cool down to reach the set low-temperature state.
Further, an automatic marking structure is arranged on the hole plug; the setting of automatic mark structure can effectively avoid opening the repetition of placing the hole of putting into the sample, reduces the interference and the mistake of each sample.
Further, a heat insulation layer is arranged inside the hole plug.
Further, the outermost layer of the hole plug is a shell made of hard materials, and the shell encloses a shell cavity; the inside of the shell cavity is filled with a heat insulation layer; this arrangement may facilitate other configurations of arrangements.
Further, set up one deck adsorbed layer or by the adsorbed layer under the insulating layer, set up one deck corresponding adsorbed layer or adsorbed layer on the sample lid, the external diameter of sample lid is unanimous with the casing intracavity diameter, and the adsorbed layer is contacted by the adsorbed layer inter attraction, and contact state makes automatic marking structure function.
Further, the adsorption layer and the adsorbed layer which are correspondingly arranged are a magnetic adsorption layer and an adsorbed layer;
further, the adsorbed layer material is an iron layer.
Or the adsorption layer and the adsorbed layer which are arranged correspondingly are glue surface layers which are arranged correspondingly.
Further, the automatic marking structure comprises a micro indicator lamp and a micro battery which are arranged on the heat insulation layer, the micro indicator lamp is connected with a thin wire, the thin wire is led into the wall of the shell at the lower part of the heat insulation layer through the heat insulation layer, and is connected with a switch control structure which extends into the cavity of the shell or is arranged on the cavity wall; the contact state of the adsorption layer and the adsorbed layer can trigger the open control structure and the indicator lamp is on. In this way, the operator can know whether the placement hole is placed in the specimen, and repeated opening is prevented.
Further, the switch control structure is a switch knob extending into the housing cavity. The contact state of the adsorption layer and the adsorbed layer enables the side wall of the specimen cover to squeeze the trigger switch button, so that the indicator lamp is lighted.
Or, the automatic mark is a liftable indicating rod arranged beside the cavity wall of the shell, the bottom of the liftable indicating rod is horizontal to the bottom of the shell, and a cavity for the indicating rod to move is arranged on the heat insulation layer part on the cavity of the shell; the upper part of the lifting rod is horizontal with the upper part of the shell, and the two sides of the lifting rod are provided with horizontal blocking rods which are larger than the cavity channels, so that the lifting rod can be effectively prevented from sliding out.
Further, set up a buffer layer in the casing outside, the setting of buffer layer can increase the contact degree of casing and pore wall, further reduces heat loss.
Further, a thin bracket corresponding to the position of the placement hole on the ice chest cover is arranged in the box body.
Further, on the basis of guaranteeing effective connection of all holes, the thin support is provided with a large notch, and the arrangement mode can guarantee gas communication in the box body.
Further, the thin bracket is arranged on a rectangular annular protrusion in the miniature semiconductor ice box;
further, an extension pipe is arranged below the placement hole of the ice box cover, and the inner diameter of the extension pipe is consistent with the inner diameter below the placement hole. The arrangement of the extension tube can further prevent the displacement of the specimen tube direction.
Further, the side wall of the extension pipe is provided with ventilation holes, so that the gas flow is increased.
Furthermore, the periphery of the ice box cover is consistent with that of the miniature semiconductor ice box, and the ice box cover or the miniature semiconductor ice box is provided with corresponding insertion holes and insertion protrusions, so that perfect and effective buckling of the ice box cover or the miniature semiconductor ice box is realized.
Or the outer diameter of the ice box cover is larger than the inner diameter of the miniature semiconductor ice box but smaller than the outer diameter of the miniature semiconductor ice box; an outer cover with a heat insulation layer is arranged outside the ice box cover and is covered by rotation, and the outer diameter of the outer cover is consistent with the outer diameter of the miniature semiconductor ice box; the rear sides of the outer cover and the ice box cover are provided with corresponding rotating shafts and rotating ring structures, and the front sides are provided with corresponding locking structures.
Further, a handheld structure is further arranged on the upper side of the hole plug, and the handheld structure can be any structure convenient to hold.
Further, the handheld structure is a handheld ring.
Further, the ice box cover is provided with placing areas of different specimens, and placing holes with different calibers or shapes are arranged in the different placing areas.
Further, a placement hole for the tube-type specimen is arranged on the ice chest cover.
Further, the control structure comprises a control display panel arranged on the side surface of the miniature semiconductor ice chest; the control display control panel is arranged in the miniature semiconductor ice box and can control the opening and closing of a semiconductor refrigeration structure in the miniature semiconductor ice box, and the temperature in the miniature semiconductor ice box is set and displayed; and adjusting according to the required temperature.
Further, the baffle with the refrigerating structure hole with the heat insulation layer is arranged at the lower part in the miniature semiconductor ice box, the semiconductor refrigerating structure is arranged in the refrigerating structure hole, the cold side is arranged above the baffle, and the hot side is arranged below the baffle, so that the cooling efficiency can be effectively provided.
Further, a length-adjustable strap is provided on the side of the micro semiconductor ice bank, and the length-adjustable strap is used as a shoulder strap or a hand strap.
Further, the direct current power supply is arranged in a mode of convenient disassembly and assembly, and the battery is disassembled and the power-off heat preservation effect in the air transportation process of the miniature semiconductor ice box can be guaranteed. Further, a placing groove is arranged beside the groove for arranging the direct current power supply when the power supply is detached.
Further, the placement hole is a circular hole having a diameter of 10-20mm, wherein the preferred diameter size is: 13mm,15mm,18mm; the aperture setting range can meet the collection and placement of most tubular specimens.
When the semiconductor refrigerator is used, the semiconductor refrigeration structure in the miniature semiconductor ice box is started through the control display panel; the portable miniature semiconductor ice box reaches a designated specimen collection site to collect specimens, a single hole plug is taken out during collection, an adsorption layer which is correspondingly arranged on the hole plug and a specimen cover is combined with the adsorbed layer, and an automatic marking structure is driven to mark the adsorbed layer; and then plugging the hole plug with the specimen into the placing hole.
The invention has the advantages that: in the whole process, only a single placing hole is opened for a single specimen, so that mutual interference is reduced; the automatic marking structure can effectively mark the placing hole plugged into the specimen, so that the placing hole is prevented from being repeatedly opened, and the design is ingenious; and set up semiconductor refrigeration structure and can guarantee the continuous cooling and keep warm in the collection and the transportation of sample, can reduce the restriction of time to sample collection and transportation.
Drawings
FIG. 1 is a schematic view of the whole structure of the cover opening mode with the outer cover of the present invention;
FIG. 2 is a schematic view of the whole structure of the closing mode with the outer cover of the present invention;
FIG. 3 is a schematic view of the longitudinal cross-sectional structure of the cover opening method with the outer cover of the present invention;
FIG. 4 is a schematic view of the overall structure of the present invention without the cover;
FIG. 5 is a schematic view of a portion of an ice chest cover without the cover embodiment of the present invention;
FIG. 6 is a schematic view showing a portion of the structure of the ice bank cover according to the embodiment of the present invention with the outer cover;
FIG. 7 is a schematic view of a thin stent structure according to the present invention;
FIG. 8 is a schematic view of a thin rack and ice chest cap tube specimen structure of the present invention;
FIG. 9 is a schematic view of a portion of a micro semiconductor ice bin according to the present invention;
FIG. 10 is a schematic view of a plug and tube specimen structure with a liftable indicator rod according to the present invention;
FIG. 11 is a cross-sectional view of the top structure of a hole plug with a liftable indicator bar and a tubular specimen of the present invention;
FIG. 12 is a schematic view of a longitudinal cross-sectional structure of a hole plug with a liftable indicator bar according to the present invention with the center of the liftable indicator bar as a longitudinal reference;
FIG. 13 is a schematic view of a longitudinal cross-sectional view of a channel portion of a hole plug with a liftable indicator stem of the present invention;
FIG. 14 is a schematic view of a liftable indicator lever according to the present invention;
FIG. 15 is a schematic view of a longitudinal cross-sectional view of a plug with a liftable indicator of the present invention;
FIG. 16 is an enlarged view of a portion of the longitudinal section of the adsorbed layer and the adsorbed layer with switch knob according to the present invention;
FIG. 17 is an enlarged view of a portion of the longitudinal section of the adsorbed layer without the switch knob according to the present invention;
FIG. 18 is an enlarged view of the structure of the adsorption layer and the adsorbed layer according to the present invention;
FIG. 19 is a schematic view showing the structure of the cover and the micro semiconductor ice bank of the present invention for displaying the rotation shaft and the rotation ring;
in the figure, 1, a miniature semiconductor ice box; 11. an insertion hole; 2. an ice box cover; 21. placing the hole; 22. a tubular specimen; 23. a specimen cover; 24. an insertion protrusion; 3. a hole plug; 31. a thermal insulation layer; 321. a micro-indicator light; 322. a microbattery; 323. a thin wire; 324. a switch knob; 325. a liftable indication rod; 326. a cavity channel; 327. a horizontal blocking lever; 33. a housing; 34. a housing cavity; 351. an adsorption layer; 352. an adsorbed layer; 36. a hand-held ring; 4. a semiconductor refrigeration structure; 5. a heat radiation port; 6. a direct current power supply; 7. a thin bracket; 8. an extension tube; 9. an outer cover; 91. a rotating shaft; 92. a swivel; 93. a belt; 94. a locking structure; 10. and controlling the display panel.
Detailed Description
Example 1A semiconductor Low temperature micro specimen collection and transport apparatus
A semiconductor low-temperature miniature specimen collecting and transporting device comprises a miniature semiconductor ice box 1, wherein an ice box cover 2 with a placement hole 21 is arranged on the miniature semiconductor ice box 1, and a hole plug 3 is arranged on each hole of the ice box cover 2 with the placement hole 21; the semiconductor refrigeration structure 4 is arranged at the bottom of the miniature semiconductor ice box 1, and the bottom is provided with a heat dissipation port 5; the bottom of the miniature semiconductor ice box 1 is also provided with a direct current power supply 6 for providing energy for the semiconductor refrigeration structure 4; the ice box cover 2 is made of heat insulation materials, and a heat insulation layer 31 is arranged in the hole plug 3; the entire mini-semiconductor ice bank 1 is also provided with a heat insulating layer 31. A control structure for controlling the opening and closing of the semiconductor refrigeration structure is arranged in the miniature semiconductor ice box; and a temperature sensor connected with the control structure is arranged in the miniature semiconductor ice box. By the arrangement, when a specimen is placed, only a single opening is opened for placement, so that the working difficulty during placement is reduced; and can guarantee continuous cooling and heat preservation in the collection and transportation of sample through the setting of DC power supply 6 and refrigeration piece, can reduce the restriction of time to sample collection and transportation. The placing holes are round holes with the diameter of 10-20mm, and are specifically arranged as follows: the aperture setting range of 13mm can meet the collection and placement of most tubular specimens.
An automatic marking structure is arranged on the hole plug 3; the automatic marking structure can effectively avoid repeated opening of the placing holes 21 into which the specimens are placed, and reduce the interference and error of each specimen. Inside the plug 3 is arranged a thermal insulation layer 31.
The outermost layer of the hole plug 3 is a shell 33 made of hard materials, and the shell 33 encloses a shell cavity 34; the inside of the shell cavity 34 is filled with a heat insulation layer 31; an adsorption layer 351 or an adsorbed layer 352 is arranged below the heat insulating layer 31, a corresponding adsorbed layer 352 or adsorption layer 351 is arranged on the specimen cover 23, the outer diameter of the specimen cover 23 is consistent with the inner diameter of the shell cavity 34, the adsorption layer 351 and the adsorbed layer 352 are in attractive contact with each other, and the contact state enables the automatic marking structure to function.
The adsorption layer 351 and the adsorbed layer 352 which are correspondingly arranged are magnetic adsorption layers and adsorbed layers; the adsorbed layer 352 material is a ferrous layer.
The automatic marking structure comprises a micro indicator lamp 321 and a micro battery 322 which are arranged on the heat insulation layer 31, wherein the micro indicator lamp 321 is connected with a thin wire 323, the thin wire 323 is led into the wall of a shell 33 at the lower part of the heat insulation layer 31 through the heat insulation layer 31, and is connected with a switch control structure which extends into a shell cavity 34 or is arranged on the cavity wall; the contact state between the absorbent layer 351 and the absorbed layer 352 can trigger the open control structure, and the indicator light is turned on. In this way, the operator is informed of whether the placement hole 21 is placed with the specimen, preventing the repeated opening. The switch control structure is a switch knob 324 extending into the housing cavity 34. The contact state between the adsorption layer 351 and the adsorbed layer 352 causes the sidewall of the specimen cover 23 to press the trigger button 324, and the indicator light is turned on.
A buffer layer is arranged on the outer side of the shell 33, and the buffer layer can increase the contact degree between the shell 33 and the hole wall, so that heat loss is further reduced.
The periphery of the ice box cover 2 is consistent with that of the miniature semiconductor ice box 1, and the ice box cover 2 or the miniature semiconductor ice box 1 is provided with corresponding insertion holes 11 and insertion protrusions 24, so that perfect and effective buckling of the two is realized.
A hand-held structure, which is a hand-held ring 36, is also provided on the upper side of the plug 3. The ice box cover 2 is provided with placement areas for different specimens, and placement holes 21 with different calibers or shapes are arranged in the different placement areas. The ice box cover 2 is provided with a placement hole 21 for a tube-shaped specimen 22.
A control display panel 10 is arranged on the side surface of the miniature semiconductor ice chest 1; the control display panel 10 can control the opening and closing of the micro semiconductor ice bank 1, and set and display the temperature in the micro semiconductor ice bank 1. And adjusting according to the required temperature. The length-adjustable strap 93 is provided on the side of the mini-semiconductor ice bank 1, and is used as a shoulder strap or a hand strap by adjusting the length. The baffle with the refrigerating structure hole with the heat insulation layer 31 is arranged at the lower part in the miniature semiconductor ice box 1, the semiconductor refrigerating structure 4 is arranged in the refrigerating structure hole, the cold side is arranged above the baffle, and the hot side is arranged below the baffle, so that the cooling efficiency can be effectively provided.
Example 2A semiconductor Low temperature micro specimen collection and transport apparatus
The semiconductor low-temperature miniature specimen collecting and transporting device comprises a miniature semiconductor ice box 1, wherein an ice box cover 2 with a placing hole 21 is arranged on the miniature semiconductor ice box 1, and the device is characterized in that a hole plug 3 is arranged on each hole of the ice box cover 2 with the placing hole 21; the semiconductor refrigeration structure 4 is arranged at the bottom of the miniature semiconductor ice box 1, and the bottom is provided with a heat dissipation port 5; the bottom of the miniature semiconductor ice box 1 is also provided with a direct current power supply 6 for providing energy for the semiconductor refrigeration structure 4; the ice box cover 2 is made of heat insulation materials, and a heat insulation layer 31 is arranged in the hole plug 3; the entire mini-semiconductor ice bank 1 is also provided with a heat insulating layer 31. A control structure for controlling the opening and closing of the semiconductor refrigeration structure is arranged in the miniature semiconductor ice box; and a temperature sensor connected with the control structure is arranged in the miniature semiconductor ice box. By the arrangement, when a specimen is placed, only a single opening is opened for placement, so that the working difficulty during placement is reduced; and can guarantee continuous cooling and heat preservation in the collection and transportation of sample through the setting of DC power supply 6 and refrigeration piece, can reduce the restriction of time to sample collection and transportation. The placing holes are round holes with the diameter of 10-20mm, and are specifically arranged as follows: the aperture setting range of 15mm can meet the collection and placement of most tubular specimens.
An automatic marking structure is arranged on the hole plug 3; the automatic marking structure can effectively avoid repeated opening of the placing holes 21 into which the specimens are placed, and reduce the interference and error of each specimen. Inside the plug 3 is arranged a thermal insulation layer 31.
The outermost layer of the hole plug 3 is a shell 33 made of hard materials, and the shell 33 encloses a shell cavity 34; the inside of the shell cavity 34 is filled with a heat insulation layer 31; an adsorption layer 351 or an adsorbed layer 352 is arranged below the heat insulating layer 31, a corresponding adsorbed layer 352 or adsorption layer 351 is arranged on the specimen cover 23, the outer diameter of the specimen cover 23 is consistent with the inner diameter of the shell cavity 34, the adsorption layer 351 and the adsorbed layer 352 are in attractive contact with each other, and the contact state enables the automatic marking structure to function.
The adsorption layer 351 and the adsorbed layer 352 which are correspondingly arranged are adhesive surface layers which are correspondingly arranged.
The automatic marking structure comprises a micro indicator lamp 321 and a micro battery 322 which are arranged on the heat insulation layer 31, wherein the micro indicator lamp 321 is connected with a thin wire 323, the thin wire 323 is led into the wall of a shell 33 at the lower part of the heat insulation layer 31 through the heat insulation layer 31, and is connected with a switch control structure which extends into a shell cavity 34 or is arranged on the cavity wall; the contact state between the absorbent layer 351 and the absorbed layer 352 can trigger the open control structure, and the indicator light is turned on. In this way, the operator is informed of whether the placement hole 21 is placed with the specimen, preventing the repeated opening. The switch control structure is a switch knob 324 extending into the housing cavity 34. The contact state between the adsorption layer 351 and the adsorbed layer 352 causes the sidewall of the specimen cover 23 to press the trigger button 324, and the indicator light is turned on.
A buffer layer is arranged on the outer side of the shell 33, and the buffer layer can increase the contact degree between the shell 33 and the hole wall, so that heat loss is further reduced.
A thin bracket 7 corresponding to the position of the placement hole 21 on the ice box cover 2 is arranged in the box body. On the basis of guaranteeing effective connection of all holes, the thin support 7 is provided with a large notch, and the arrangement mode can ensure gas communication in the box body. The thin bracket 7 is arranged on a rectangular annular protrusion in the miniature semiconductor ice bin 1
The periphery of the ice box cover 2 is consistent with that of the miniature semiconductor ice box 1, and the ice box cover 2 or the miniature semiconductor ice box 1 is provided with corresponding insertion holes 11 and insertion protrusions 24, so that perfect and effective buckling of the two is realized.
A hand-held structure, which is a hand-held ring 36, is also provided on the upper side of the plug 3.
The ice box cover 2 is provided with placement areas for different specimens, and placement holes 21 with different calibers or shapes are arranged in the different placement areas. The ice box cover 2 is provided with a placement hole 21 for a tube-shaped specimen 22.
A control display panel 10 is arranged on the side surface of the miniature semiconductor ice chest 1; the control display panel 10 can control the opening and closing of the micro semiconductor ice bank 1, and set and display the temperature in the micro semiconductor ice bank 1. And adjusting according to the required temperature. The length-adjustable strap 93 is provided on the side of the mini-semiconductor ice bank 1, and is used as a shoulder strap or a hand strap by adjusting the length. The baffle with the refrigerating structure hole with the heat insulation layer 31 is arranged at the lower part in the miniature semiconductor ice box 1, the semiconductor refrigerating structure 4 is arranged in the refrigerating structure hole, the cold side is arranged above the baffle, and the hot side is arranged below the baffle, so that the cooling efficiency can be effectively provided.
Example 3A semiconductor Low temperature micro specimen collection and transport apparatus
The semiconductor low-temperature miniature specimen collecting and transporting device comprises a miniature semiconductor ice box 1, wherein an ice box cover 2 with a placing hole 21 is arranged on the miniature semiconductor ice box 1, and the device is characterized in that a hole plug 3 is arranged on each hole of the ice box cover 2 with the placing hole 21; the semiconductor refrigeration structure 4 is arranged at the bottom of the miniature semiconductor ice box 1, and the bottom is provided with a heat dissipation port 5; the bottom of the miniature semiconductor ice box 1 is also provided with a direct current power supply 6 for providing energy for the semiconductor refrigeration structure 4; the ice box cover 2 is made of heat insulation materials, and a heat insulation layer 31 is arranged in the hole plug 3; the entire mini-semiconductor ice bank 1 is also provided with a heat insulating layer 31. A control structure for controlling the opening and closing of the semiconductor refrigeration structure is arranged in the miniature semiconductor ice box; and a temperature sensor connected with the control structure is arranged in the miniature semiconductor ice box. By the arrangement, when a specimen is placed, only a single opening is opened for placement, so that the working difficulty during placement is reduced; and can guarantee continuous cooling and heat preservation in the collection and transportation of sample through the setting of DC power supply 6 and refrigeration piece, can reduce the restriction of time to sample collection and transportation. The placing holes are round holes with the diameter of 10-20mm, and are specifically arranged as follows: the aperture setting range of 18mm can meet the collection and placement of most tubular specimens.
An automatic marking structure is arranged on the hole plug 3; the automatic marking structure can effectively avoid repeated opening of the placing holes 21 into which the specimens are placed, and reduce the interference and error of each specimen. Inside the plug 3 is arranged a thermal insulation layer 31.
The outermost layer of the hole plug 3 is a shell 33 made of hard materials, and the shell 33 encloses a shell cavity 34; the inside of the shell cavity 34 is filled with a heat insulation layer 31; an adsorption layer 351 or an adsorbed layer 352 is arranged below the heat insulating layer 31, a corresponding adsorbed layer 352 or adsorption layer 351 is arranged on the specimen cover 23, the outer diameter of the specimen cover 23 is consistent with the inner diameter of the shell cavity 34, the adsorption layer 351 and the adsorbed layer 352 are in attractive contact with each other, and the contact state enables the automatic marking structure to function.
The adsorption layer 351 and the adsorbed layer 352 which are correspondingly arranged are magnetic adsorption layers and adsorbed layers; the adsorbed layer 352 material is a ferrous layer. The automatic indication is a lifting indication rod 325 arranged beside the wall of the shell cavity 34, the bottom of the lifting indication rod is horizontal to the bottom of the shell 33, and a cavity 326 for the indication rod to move is arranged on the heat insulation layer 31 part on the shell cavity 34; the upper part of the lifting rod is horizontal with the upper part of the shell 33, and the two sides of the lifting rod are provided with horizontal blocking rods 327 which are larger than the cavity 326, so that the lifting rod can be effectively prevented from sliding out.
A buffer layer is arranged on the outer side of the shell 33, and the buffer layer can increase the contact degree between the shell 33 and the hole wall, so that heat loss is further reduced.
A thin bracket 7 corresponding to the position of the placement hole 21 on the ice box cover 2 is arranged in the box body. On the basis of guaranteeing effective connection of all holes, the thin support 7 is provided with a large notch, and the arrangement mode can ensure gas communication in the box body. The thin bracket 7 is arranged on a rectangular annular protrusion in the miniature semiconductor ice bin 1
The periphery of the ice box cover 2 is consistent with that of the miniature semiconductor ice box 1, and the ice box cover 2 or the miniature semiconductor ice box 1 is provided with corresponding insertion holes 11 and insertion protrusions 24, so that perfect and effective buckling of the two is realized.
A hand-held structure, which is a hand-held ring 36, is also provided on the upper side of the plug 3.
The ice box cover 2 is provided with placement areas for different specimens, and placement holes 21 with different calibers or shapes are arranged in the different placement areas. The ice box cover 2 is provided with a placement hole 21 for a tube-shaped specimen 22. A control display panel 10 is arranged on the side surface of the miniature semiconductor ice chest 1; the control display panel 10 can control the opening and closing of the micro semiconductor ice bank 1, and set and display the temperature in the micro semiconductor ice bank 1. And adjusting according to the required temperature. The length-adjustable strap 93 is provided on the side of the mini-semiconductor ice bank 1, and is used as a shoulder strap or a hand strap by adjusting the length. The baffle with the refrigerating structure hole with the heat insulation layer 31 is arranged at the lower part in the miniature semiconductor ice box 1, the semiconductor refrigerating structure 4 is arranged in the refrigerating structure hole, the cold side is arranged above the baffle, and the hot side is arranged below the baffle, so that the cooling efficiency can be effectively provided.
Example 4A semiconductor Low temperature micro specimen collection and transport apparatus
The semiconductor low-temperature miniature specimen collecting and transporting device comprises a miniature semiconductor ice box 1, wherein an ice box cover 2 with a placing hole 21 is arranged on the miniature semiconductor ice box 1, and the device is characterized in that a hole plug 3 is arranged on each hole of the ice box cover 2 with the placing hole 21; the semiconductor refrigeration structure 4 is arranged at the bottom of the miniature semiconductor ice box 1, and the bottom is provided with a heat dissipation port 5; the bottom of the miniature semiconductor ice box 1 is also provided with a direct current power supply 6 for providing energy for the semiconductor refrigeration structure 4; the ice box cover 2 is made of heat insulation materials, and a heat insulation layer 31 is arranged in the hole plug 3; the entire mini-semiconductor ice bank 1 is also provided with a heat insulating layer 31. A control structure for controlling the opening and closing of the semiconductor refrigeration structure is arranged in the miniature semiconductor ice box; and a temperature sensor connected with the control structure is arranged in the miniature semiconductor ice box. By the arrangement, when a specimen is placed, only a single opening is opened for placement, so that the working difficulty during placement is reduced; and can guarantee continuous cooling and heat preservation in the collection and transportation of sample through the setting of DC power supply 6 and refrigeration piece, can reduce the restriction of time to sample collection and transportation. The placing holes are round holes with the diameter of 10-20mm, and are specifically arranged as follows: the aperture setting range of 13mm can meet the collection and placement of most tubular specimens.
An automatic marking structure is arranged on the hole plug 3; the automatic marking structure can effectively avoid repeated opening of the placing holes 21 into which the specimens are placed, and reduce the interference and error of each specimen. Inside the plug 3 is arranged a thermal insulation layer 31.
The outermost layer of the hole plug 3 is a shell 33 made of hard materials, and the shell 33 encloses a shell cavity 34; the inside of the shell cavity 34 is filled with a heat insulation layer 31; an adsorption layer 351 or an adsorbed layer 352 is arranged below the heat insulating layer 31, a corresponding adsorbed layer 352 or adsorption layer 351 is arranged on the specimen cover 23, the outer diameter of the specimen cover 23 is consistent with the inner diameter of the shell cavity 34, the adsorption layer 351 and the adsorbed layer 352 are in attractive contact with each other, and the contact state enables the automatic marking structure to function.
The adsorption layer 351 and the adsorbed layer 352 which are correspondingly arranged are adhesive surface layers which are correspondingly arranged.
The automatic indication is a lifting indication rod 325 arranged beside the wall of the shell cavity 34, the bottom of the lifting indication rod is horizontal to the bottom of the shell 33, and a cavity 326 for the indication rod to move is arranged on the heat insulation layer 31 part on the shell cavity 34; the upper part of the lifting rod is horizontal with the upper part of the shell 33, and the two sides of the lifting rod are provided with horizontal blocking rods 327 which are larger than the cavity 326, so that the lifting rod can be effectively prevented from sliding out.
A buffer layer is arranged on the outer side of the shell 33, and the buffer layer can increase the contact degree between the shell 33 and the hole wall, so that heat loss is further reduced.
A thin bracket 7 corresponding to the position of the placement hole 21 on the ice box cover 2 is arranged in the box body. On the basis of guaranteeing effective connection of all holes, the thin support 7 is provided with a large notch, and the arrangement mode can ensure gas communication in the box body. The thin bracket 7 is arranged on a rectangular annular protrusion in the miniature semiconductor ice bin 1
An extension pipe 8 is arranged below the placement hole 21 of the ice box cover 2, and the inner diameter of the extension pipe 8 is consistent with the inner diameter below the placement hole 21. The extension tube 8 is provided to further prevent the displacement of the specimen tube in the direction. The side wall of the extension pipe 8 is provided with ventilation holes to increase the gas flow.
The outer diameter of the ice box cover 2 is larger than the inner diameter of the miniature semiconductor ice box 1 but smaller than the outer diameter of the miniature semiconductor ice box 1; an outer cover 9 with a heat insulation layer 31 is arranged outside the ice box cover 2, and the outer diameter of the outer cover 9 is consistent with the outer diameter of the miniature semiconductor ice box 1; the rear sides of the outer cover 9 and the ice box cover 2 are provided with corresponding rotating shaft 91 and rotating ring 92 structures, and the front sides are provided with corresponding locking structures 94.
A hand-held structure, which is a hand-held ring 36, is also provided on the upper side of the plug 3.
The ice box cover 2 is provided with placement areas for different specimens, and placement holes 21 with different calibers or shapes are arranged in the different placement areas. The ice box cover 2 is provided with a placement hole 21 for a tube-shaped specimen 22.
A control display panel 10 is arranged on the side surface of the miniature semiconductor ice chest 1; the control display panel 10 can control the opening and closing of the micro semiconductor ice bank 1, and set and display the temperature in the micro semiconductor ice bank 1. And adjusting according to the required temperature. The length-adjustable strap 93 is provided on the side of the mini-semiconductor ice bank 1, and is used as a shoulder strap or a hand strap by adjusting the length. The baffle with the refrigerating structure hole with the heat insulation layer 31 is arranged at the lower part in the miniature semiconductor ice box 1, the semiconductor refrigerating structure 4 is arranged in the refrigerating structure hole, the cold side is arranged above the baffle, and the hot side is arranged below the baffle, so that the cooling efficiency can be effectively provided.
Example 5A semiconductor Low temperature micro specimen collection and transport apparatus
The semiconductor low-temperature miniature specimen collecting and transporting device comprises a miniature semiconductor ice box 1, wherein an ice box cover 2 with a placing hole 21 is arranged on the miniature semiconductor ice box 1, and the device is characterized in that a hole plug 3 is arranged on each hole of the ice box cover 2 with the placing hole 21; the semiconductor refrigeration structure 4 is arranged at the bottom of the miniature semiconductor ice box 1, and the bottom is provided with a heat dissipation port 5; the bottom of the miniature semiconductor ice box 1 is also provided with a direct current power supply 6 for providing energy for the semiconductor refrigeration structure 4; the ice box cover 2 is made of heat insulation materials, and a heat insulation layer 31 is arranged in the hole plug 3; the entire mini-semiconductor ice bank 1 is also provided with a heat insulating layer 31. A control structure for controlling the opening and closing of the semiconductor refrigeration structure is arranged in the miniature semiconductor ice box; and a temperature sensor connected with the control structure is arranged in the miniature semiconductor ice box. By the arrangement, when a specimen is placed, only a single opening is opened for placement, so that the working difficulty during placement is reduced; and can guarantee continuous cooling and heat preservation in the collection and transportation of sample through the setting of DC power supply 6 and refrigeration piece, can reduce the restriction of time to sample collection and transportation. The placing holes are round holes with the diameter of 10-20mm, and are specifically arranged as follows: the aperture setting range of 15mm can meet the collection and placement of most tubular specimens.
An automatic marking structure is arranged on the hole plug 3; the automatic marking structure can effectively avoid repeated opening of the placing holes 21 into which the specimens are placed, and reduce the interference and error of each specimen. Inside the plug 3 is arranged a thermal insulation layer 31.
The outermost layer of the hole plug 3 is a shell 33 made of hard materials, and the shell 33 encloses a shell cavity 34; the inside of the shell cavity 34 is filled with a heat insulation layer 31; an adsorption layer 351 or an adsorbed layer 352 is arranged below the heat insulating layer 31, a corresponding adsorbed layer 352 or adsorption layer 351 is arranged on the specimen cover 23, the outer diameter of the specimen cover 23 is consistent with the inner diameter of the shell cavity 34, the adsorption layer 351 and the adsorbed layer 352 are in attractive contact with each other, and the contact state enables the automatic marking structure to function.
The adsorption layer 351 and the adsorbed layer 352 which are correspondingly arranged are magnetic adsorption layers and adsorbed layers; the adsorbed layer 352 material is a ferrous layer.
The automatic marking structure comprises a micro indicator lamp 321 and a micro battery 322 which are arranged on the heat insulation layer 31, wherein the micro indicator lamp 321 is connected with a thin wire 323, the thin wire 323 is led into the wall of a shell 33 at the lower part of the heat insulation layer 31 through the heat insulation layer 31, and is connected with a switch control structure which extends into a shell cavity 34 or is arranged on the cavity wall; the contact state between the absorbent layer 351 and the absorbed layer 352 can trigger the open control structure, and the indicator light is turned on. In this way, the operator is informed of whether the placement hole 21 is placed with the specimen, preventing the repeated opening. The switch control structure is a switch knob 324 extending into the housing cavity 34. The contact state between the adsorption layer 351 and the adsorbed layer 352 causes the sidewall of the specimen cover 23 to press the trigger button 324, and the indicator light is turned on.
A buffer layer is arranged on the outer side of the shell 33, and the buffer layer can increase the contact degree between the shell 33 and the hole wall, so that heat loss is further reduced.
A thin bracket 7 corresponding to the position of the placement hole 21 on the ice box cover 2 is arranged in the box body. On the basis of guaranteeing effective connection of all holes, the thin support 7 is provided with a large notch, and the arrangement mode can ensure gas communication in the box body. The thin bracket 7 is arranged on a rectangular annular protrusion in the miniature semiconductor ice bin 1
An extension pipe 8 is arranged below the placement hole 21 of the ice box cover 2, and the inner diameter of the extension pipe 8 is consistent with the inner diameter below the placement hole 21. The extension tube 8 is provided to further prevent the displacement of the specimen tube in the direction. The side wall of the extension pipe 8 is provided with ventilation holes to increase the gas flow.
The outer diameter of the ice box cover 2 is larger than the inner diameter of the miniature semiconductor ice box 1 but smaller than the outer diameter of the miniature semiconductor ice box 1; an outer cover 9 with a heat insulation layer 31 is arranged outside the ice box cover 2, and the outer diameter of the outer cover 9 is consistent with the outer diameter of the miniature semiconductor ice box 1; the rear sides of the outer cover 9 and the ice box cover 2 are provided with corresponding rotating shaft 91 and rotating ring 92 structures, and the front sides are provided with corresponding locking structures 94.
A hand-held structure, which is a hand-held ring 36, is also provided on the upper side of the plug 3. The ice box cover 2 is provided with placement areas for different specimens, and placement holes 21 with different calibers or shapes are arranged in the different placement areas. The ice box cover 2 is provided with a placement hole 21 for a tube-shaped specimen 22.
A control display panel 10 is arranged on the side surface of the miniature semiconductor ice chest 1; the control display panel 10 can control the opening and closing of the micro semiconductor ice bank 1, and set and display the temperature in the micro semiconductor ice bank 1. And adjusting according to the required temperature. The length-adjustable strap 93 is provided on the side of the mini-semiconductor ice bank 1, and is used as a shoulder strap or a hand strap by adjusting the length. The baffle with the refrigerating structure hole with the heat insulation layer 31 is arranged at the lower part in the miniature semiconductor ice box 1, the semiconductor refrigerating structure 4 is arranged in the refrigerating structure hole, the cold side is arranged above the baffle, and the hot side is arranged below the baffle, so that the cooling efficiency can be effectively provided.
The direct current power supply is arranged in a mode of convenient disassembly and assembly, and the battery is disassembled and powered down for heat preservation in the air transportation process of the miniature semiconductor ice box. Further, a placing groove is arranged beside the groove for arranging the direct current power supply when the power supply is detached.
The above description of embodiments is only for the understanding of the present invention. It should be noted that it will be apparent to those skilled in the art that modifications can be made to the present invention without departing from the principles of the invention, and such modifications will fall within the scope of the claims.
Claims (5)
1. The semiconductor low-temperature miniature specimen collecting and transporting device comprises a miniature semiconductor ice box (1), wherein an ice box cover (2) with a placement hole (21) is arranged on the miniature semiconductor ice box (1), and the device is characterized in that a hole plug (3) is arranged on each hole of the ice box cover (2) with the placement hole (21); the semiconductor refrigeration structure (4) is arranged at the bottom of the miniature semiconductor ice box (1), and a heat dissipation opening (5) is arranged at the bottom; the bottom of the miniature semiconductor ice box (1) is also provided with a direct current power supply (6) for providing energy for the semiconductor refrigeration structure (4); the ice box cover (2) is made of heat insulation materials, and a heat insulation layer (31) is arranged in the hole plug (3); a heat insulation layer (31) is also arranged in the whole of the miniature semiconductor ice box (1); a control structure for controlling the opening and closing of the semiconductor refrigeration structure (4) is arranged in the miniature semiconductor ice box (1); a temperature sensor connected with the control structure is arranged in the miniature semiconductor ice box;
an automatic marking structure is arranged on the hole plug (3);
the inside of the hole plug (3) is provided with a heat insulation layer (31);
the outermost layer of the hole plug (3) is a shell (33) made of hard materials, and the shell (33) encloses a shell cavity (34); the inside of the shell cavity (34) is filled with a heat insulation layer (31);
an adsorption layer (351) or an adsorbed layer (352) is arranged below the heat insulation layer (31), a layer of corresponding adsorbed layer (352) or an adsorption layer (351) is arranged on the specimen cover (23), the outer diameter of the specimen cover (23) is consistent with the inner diameter of the shell cavity (34), the adsorption layer (351) and the adsorbed layer (352) are mutually attracted and contacted, and the contact state enables the automatic marking structure to work;
the outer diameter of the ice box cover (2) is larger than the inner diameter of the miniature semiconductor ice box (1) but smaller than the outer diameter of the miniature semiconductor ice box (1); an outer cover (9) with a heat insulation layer (31) is arranged outside the ice box cover (2), and the outer diameter of the outer cover (9) is consistent with the outer diameter of the miniature semiconductor ice box (1); the rear sides of the outer cover (9) and the ice box cover (2) are provided with corresponding rotating shaft (91) and rotating ring (92) structures, and the front sides are provided with corresponding locking structures (94).
2. The semiconductor low-temperature micro specimen collection and transportation device according to claim 1, wherein the automatic marking structure comprises a micro indicator lamp (321) and a micro battery (322) which are arranged on the heat insulation layer (31), the micro indicator lamp (321) is connected with a thin wire (323), the thin wire (323) is led into a shell (33) wall at the lower part of the heat insulation layer (31) through the heat insulation layer (31), and is connected with a switch control structure which extends into a shell cavity (34) or is arranged on the cavity wall; the contact state of the adsorption layer (351) and the adsorbed layer (352) can trigger the open control structure, and the indicator light is on.
3. The semiconductor low-temperature micro specimen collection and transportation device according to claim 1, wherein the device is automatically marked as a lifting indication rod (325) arranged beside the wall of the housing cavity (34), the bottom of the lifting indication rod is horizontal to the bottom of the housing (33), and a cavity (326) for moving the indication rod is arranged on the heat insulation layer (31) part on the housing cavity (34); the upper part of the lifting rod is horizontal with the upper part of the shell (33), and horizontal blocking rods (327) which are larger than the cavity (326) are arranged on two sides of the lifting rod.
4. The semiconductor low-temperature micro specimen collection and transportation device according to claim 1, wherein a thin bracket (7) corresponding to the position of the placement hole (21) on the ice chest cover (2) is provided in the case body.
5. The semiconductor low-temperature micro specimen collection and transportation device according to any one of claims 1 to 4, wherein an extension tube (8) is provided below the placement hole (21) of the ice chest cover (2), and the inner diameter of the extension tube (8) is identical to the inner diameter below the placement hole (21).
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| CN201810572218.2A CN108750390B (en) | 2018-06-06 | 2018-06-06 | Semiconductor low-temperature miniature specimen collection and transportation instrument |
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