CN108857867B - Diamond grinding pad and preparation process thereof - Google Patents
Diamond grinding pad and preparation process thereof Download PDFInfo
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- CN108857867B CN108857867B CN201810568850.XA CN201810568850A CN108857867B CN 108857867 B CN108857867 B CN 108857867B CN 201810568850 A CN201810568850 A CN 201810568850A CN 108857867 B CN108857867 B CN 108857867B
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 149
- 239000010432 diamond Substances 0.000 title claims abstract description 149
- 238000000227 grinding Methods 0.000 title claims abstract description 76
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 claims abstract description 79
- 239000000853 adhesive Substances 0.000 claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 239000002245 particle Substances 0.000 claims abstract description 46
- 239000000945 filler Substances 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 23
- 230000008569 process Effects 0.000 claims abstract description 22
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 239000002002 slurry Substances 0.000 claims description 27
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 238000002156 mixing Methods 0.000 claims description 18
- 238000000016 photochemical curing Methods 0.000 claims description 16
- 239000003082 abrasive agent Substances 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 13
- 235000019738 Limestone Nutrition 0.000 claims description 12
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 12
- 239000006028 limestone Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 239000010456 wollastonite Substances 0.000 claims description 12
- 229910052882 wollastonite Inorganic materials 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 229920002799 BoPET Polymers 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000007756 gravure coating Methods 0.000 claims description 9
- 239000003607 modifier Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- 238000003980 solgel method Methods 0.000 claims description 9
- 238000001694 spray drying Methods 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 239000004840 adhesive resin Substances 0.000 claims description 8
- 229920006223 adhesive resin Polymers 0.000 claims description 8
- 239000003513 alkali Substances 0.000 claims description 8
- 239000002585 base Substances 0.000 claims description 7
- 239000007767 bonding agent Substances 0.000 claims description 4
- 238000012216 screening Methods 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 abstract description 9
- 238000005520 cutting process Methods 0.000 abstract description 6
- 230000006872 improvement Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 61
- 239000012790 adhesive layer Substances 0.000 description 10
- 238000001723 curing Methods 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 238000001029 thermal curing Methods 0.000 description 7
- 239000011449 brick Substances 0.000 description 5
- 238000004891 communication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a diamond grinding pad and a preparation process thereof, wherein the diamond grinding pad comprises a substrate and a grinding material layer arranged on the surface of the substrate, and the grinding material layer comprises the following raw materials in percentage by mass: 5-10% of diamond group abrasive, 70-75% of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group; the diamond grinding pad prepared by the formula and the process has the advantages of large removal amount, cutting force guarantee, effective improvement of grinding efficiency, better stability of grinding efficiency, greatly prolonged service life, lower surface roughness of a processed product, great improvement of the surface quality of the processed product and popularization and use worth.
Description
Technical Field
The invention relates to the technical field of grinding pads, in particular to a diamond grinding pad and a preparation process thereof.
Background
With the rapid development of semiconductor chip substrates, the high-speed signal transmission of 5G networks requires the demetalization of communication devices, signal receiving terminals and the like, and superhard materials such as ceramics, high-strength glass, sapphire and the like gradually replace the action of metals in the communication field due to the excellent performance of the superhard materials, and the use of the superhard materials also puts higher requirements on the processing of the superhard materials.
The novel diamond grinding pad is matched with cooling liquid to realize simple and convenient operation, high production efficiency and good stability, can effectively reduce energy consumption, discharge waste, save cost and really realize energy conservation and environmental protection; moreover, the mohs hardness of the superhard materials such as sapphire and ceramic is about 9, and only the diamond material with the mohs hardness of 10 can be ground, so that the demand for developing grinding materials of diamond is more and more increased.
The shape of the artificial single crystal diamond is irregular, and the artificial single crystal diamond is easy to scratch in the grinding process. In addition, in the common grinding process, when the particles are large, the cutting force is large, but the grinding easily causes scratches and scratches, and the surface quality is poor, and when the particles are small, the cutting force is small, but the smoothness is good. This is a contradiction. How to balance cutting force and finish is a goal that high performance abrasives need to achieve.
Disclosure of Invention
In view of the above, the present invention is directed to a diamond polishing pad and a manufacturing process thereof, which can effectively improve the surface quality of the diamond polishing pad while ensuring high polishing efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a diamond grinding pad, including the base plate with set up the abrasive material layer on the base plate surface, abrasive material layer 1, a diamond grinding pad, including the base plate with set up the abrasive material layer on the base plate surface, the abrasive material layer is including following mass percent raw materials: 5-10% of diamond group abrasive, 70-75% of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group.
Preferably, the single-particle diamond is single-crystal diamond, which is subjected to a surface modifier and an acid-base treatment.
Preferably, the adhesive is an inorganic or organic adhesive.
Preferably, the adhesive is a ceramic adhesive, a metal bonding agent, a UV adhesive or an epoxy resin.
Preferably, the filler is one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
Preferably, the diamond group abrasive has a particle size of 50 to 80 μm.
Preferably, the abrasive layer is attached and fixed on the surface of the substrate through an adhesive layer.
As a preferable scheme, a back glue layer is adhered to the bottom surface of the substrate.
Preferably, the abrasive layer comprises a base and a plurality of grinding block portions integrally extending from the surface of the base, and the plurality of grinding block portions are arranged at intervals.
A preparation process of a diamond grinding pad comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; then, solidifying and screening the spherical aggregate to obtain diamond group abrasive with proper granularity;
(2) preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1) with an adhesive and a filler, fully dispersing, and vacuumizing to eliminate bubbles to obtain required slurry; adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process to obtain a required abrasive layer;
(3) and (3) taking the substrate, and attaching and fixing the abrasive material layer on the surface of the substrate.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
the diamond grinding pad prepared by the formula and the process has the advantages of large removal amount, cutting force guarantee, effective improvement of grinding efficiency, better stability of grinding efficiency, greatly prolonged service life, lower surface roughness of a processed product, great improvement of the surface quality of the processed product and popularization and use worth.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments:
drawings
Fig. 1 is a schematic structural view of the present invention.
The attached drawings indicate the following:
10. substrate 20, abrasive layer
30. Adhesive layer 40, backing adhesive layer.
Detailed Description
Referring to fig. 1, a specific structure of a diamond polishing pad according to the present invention is shown, which includes a substrate 10 and an abrasive layer 20 disposed on a surface of the substrate 10, wherein the abrasive layer 20 includes the following raw materials by mass: 5-10% of diamond group abrasive, 70-75% of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group.
The diamond group abrasive has a particle size of 50-80 μm. The single-particle diamond is single-crystal diamond which is treated by a surface modifier and acid and alkali, the adhesive is an inorganic or organic adhesive, or the adhesive is a ceramic adhesive, a metal bonding agent, UV (ultraviolet) glue or epoxy resin, and the filler is one or more of calcium carbonate, limestone, wollastonite and silicon dioxide. And the abrasive layer 20 is attached and fixed on the surface of the substrate 10 through an adhesive layer 30, and a back glue layer 40 is attached and covered on the bottom surface of the substrate 10 so as to be fixed with an external device. Abrasive layer 20 is including basal portion 21 and in the integrative abrasive brick portion 22 that extends in basal portion 21 surface, and abrasive brick portion 22 is a plurality of, and a plurality of abrasive brick portions 22 interval are arranged, and abrasive brick portion 22 can be triangle-shaped, rectangle, square, rhombus, pentagon, hexagon, circular etc. to, in this embodiment, abrasive brick portion 22 is the square, and not for the limit.
The invention also discloses a preparation process of the diamond grinding pad, which comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; the spherical agglomerates are then solidified and sieved to obtain diamond group abrasive material of suitable particle size. The curing mode is photocuring or thermocuring; the adhesive used for preparing the diamond group abrasive is inorganic or organic adhesive, or ceramic adhesive, metal bond, UV adhesive or epoxy resin, and all the fillers are one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
(2) Preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1), an adhesive and a filler; after full dispersion, vacuumizing to eliminate bubbles to obtain the required slurry; and adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process so as to obtain the required abrasive layer.
(3) The substrate is taken out, and the abrasive layer 20 is attached and fixed to the surface of the substrate 10.
The invention is illustrated in more detail below in the following examples:
example 1:
the specific structure of a diamond grinding pad comprises a substrate 10 and a grinding material layer 20 arranged on the surface of the substrate 10, wherein the grinding material layer 20 comprises the following raw materials in percentage by mass: 8 percent of diamond group abrasive, 72 percent of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group.
The diamond group abrasive has a particle size of 50-80 μm. The single-particle diamond is single-crystal diamond which is treated by a surface modifier and acid and alkali, the adhesive is an inorganic adhesive, and the filler is calcium carbonate. And the abrasive layer 20 is attached and fixed on the surface of the substrate 10 through an adhesive layer 30, and a back glue layer 40 is attached and covered on the bottom surface of the substrate 10 so as to be fixed with an external device.
The invention also discloses a preparation process of the diamond grinding pad, which comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; the spherical agglomerates are then solidified and sieved to obtain diamond group abrasive material of suitable particle size. The curing mode is photocuring or thermocuring; the adhesive used for preparing the diamond group abrasive is inorganic or organic adhesive, or ceramic adhesive, metal bond, UV adhesive or epoxy resin, and all the fillers are one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
(2) Preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1), an adhesive and a filler; after full dispersion, vacuumizing to eliminate bubbles to obtain the required slurry; and adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process so as to obtain the required abrasive layer.
(3) The substrate is taken out, and the abrasive layer 20 is attached and fixed to the surface of the substrate 10.
The diamond polishing pad obtained in this example was subjected to the polishing test, and the test results are shown in the following table:
as can be seen from the above table, the diamond grinding pad prepared by the embodiment has the advantages of large removal amount, grinding efficiency improved by 50%, good stability of grinding efficiency, greatly prolonged service life, lower surface roughness of processed products and better surface smoothness.
Example 2:
the specific structure of a diamond grinding pad comprises a substrate 10 and a grinding material layer 20 arranged on the surface of the substrate 10, wherein the grinding material layer 20 comprises the following raw materials in percentage by mass: 5% of diamond group abrasive, 70% of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group.
The diamond group abrasive has a particle size of 50-80 μm. The single-particle diamond is single-crystal diamond which is treated by a surface modifier and acid and alkali, the adhesive is an organic adhesive, and the filler is limestone. And the abrasive layer 20 is attached and fixed on the surface of the substrate 10 through an adhesive layer 30, and a back glue layer 40 is attached and covered on the bottom surface of the substrate 10 so as to be fixed with an external device.
The invention also discloses a preparation process of the diamond grinding pad, which comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; the spherical agglomerates are then solidified and sieved to obtain diamond group abrasive material of suitable particle size. The curing mode is photocuring or thermocuring; the adhesive used for preparing the diamond group abrasive is inorganic or organic adhesive, or ceramic adhesive, metal bond, UV adhesive or epoxy resin, and all the fillers are one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
(2) Preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1), an adhesive and a filler; after full dispersion, vacuumizing to eliminate bubbles to obtain the required slurry; and adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process so as to obtain the required abrasive layer.
(3) The substrate is taken out, and the abrasive layer 20 is attached and fixed to the surface of the substrate 10.
According to tests, the diamond grinding pad prepared by the embodiment has the removal amount of 30 microns, the grinding efficiency of 2.5 microns/60 seconds, the grinding efficiency stability of +/-3.5 seconds, the service life of 250 hours and the surface roughness of a processed product of 0.209 microns.
Example 3:
the specific structure of a diamond grinding pad comprises a substrate 10 and a grinding material layer 20 arranged on the surface of the substrate 10, wherein the grinding material layer 20 comprises the following raw materials in percentage by mass: 10% of diamond group abrasive, 74% of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group.
The diamond group abrasive has a particle size of 50-80 μm. The single-particle diamond is single-crystal diamond which is treated by a surface modifier and acid and alkali, the adhesive is a ceramic adhesive, and the filler is wollastonite. And the abrasive layer 20 is attached and fixed on the surface of the substrate 10 through an adhesive layer 30, and a back glue layer 40 is attached and covered on the bottom surface of the substrate 10 so as to be fixed with an external device.
The invention also discloses a preparation process of the diamond grinding pad, which comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; the spherical agglomerates are then solidified and sieved to obtain diamond group abrasive material of suitable particle size. The curing mode is photocuring or thermocuring; the adhesive used for preparing the diamond group abrasive is inorganic or organic adhesive, or ceramic adhesive, metal bond, UV adhesive or epoxy resin, and all the fillers are one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
(2) Preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1), an adhesive and a filler; after full dispersion, vacuumizing to eliminate bubbles to obtain the required slurry; and adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process so as to obtain the required abrasive layer.
(3) The substrate is taken out, and the abrasive layer 20 is attached and fixed to the surface of the substrate 10.
According to tests, the diamond grinding pad prepared by the embodiment has the removal amount of 30 microns, the grinding efficiency of 2.6 microns/60 seconds, the grinding efficiency stability of +/-3.2 seconds, the service life of 252 hours and the surface roughness of a processed product of 0.213 microns.
Example 4:
the specific structure of a diamond grinding pad comprises a substrate 10 and a grinding material layer 20 arranged on the surface of the substrate 10, wherein the grinding material layer 20 comprises the following raw materials in percentage by mass: 6% of diamond group abrasive, 75% of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group.
The diamond group abrasive has a particle size of 50-80 μm. The single-particle diamond is single-crystal diamond which is treated by a surface modifier and acid and alkali, the adhesive is a metal bonding agent, and the filler is silicon dioxide. And the abrasive layer 20 is attached and fixed on the surface of the substrate 10 through an adhesive layer 30, and a back glue layer 40 is attached and covered on the bottom surface of the substrate 10 so as to be fixed with an external device.
The invention also discloses a preparation process of the diamond grinding pad, which comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; the spherical agglomerates are then solidified and sieved to obtain diamond group abrasive material of suitable particle size. The curing mode is photocuring or thermocuring; the adhesive used for preparing the diamond group abrasive is inorganic or organic adhesive, or ceramic adhesive, metal bond, UV adhesive or epoxy resin, and all the fillers are one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
(2) Preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1), an adhesive and a filler; after full dispersion, vacuumizing to eliminate bubbles to obtain the required slurry; and adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process so as to obtain the required abrasive layer.
(3) The substrate is taken out, and the abrasive layer 20 is attached and fixed to the surface of the substrate 10.
According to tests, the diamond grinding pad prepared by the embodiment has the removal amount of 30 microns, the grinding efficiency of 2.8 microns/60 seconds, the grinding efficiency stability of +/-3.6 seconds, the service life of 248 hours and the surface roughness of a processed product of 0.223 microns.
Example 5:
the specific structure of a diamond grinding pad comprises a substrate 10 and a grinding material layer 20 arranged on the surface of the substrate 10, wherein the grinding material layer 20 comprises the following raw materials in percentage by mass: 7% of diamond group abrasive, 71% of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group.
The diamond group abrasive has a particle size of 50-80 μm. The single-particle diamond is single-crystal diamond which is treated by a surface modifier and acid and alkali, the adhesive is UV glue, and the filler is calcium carbonate and limestone. And the abrasive layer 20 is attached and fixed on the surface of the substrate 10 through an adhesive layer 30, and a back glue layer 40 is attached and covered on the bottom surface of the substrate 10 so as to be fixed with an external device.
The invention also discloses a preparation process of the diamond grinding pad, which comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; the spherical agglomerates are then solidified and sieved to obtain diamond group abrasive material of suitable particle size. The curing mode is photocuring or thermocuring; the adhesive used for preparing the diamond group abrasive is inorganic or organic adhesive, or ceramic adhesive, metal bond, UV adhesive or epoxy resin, and all the fillers are one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
(2) Preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1), an adhesive and a filler; after full dispersion, vacuumizing to eliminate bubbles to obtain the required slurry; and adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process so as to obtain the required abrasive layer.
(3) The substrate is taken out, and the abrasive layer 20 is attached and fixed to the surface of the substrate 10.
According to tests, the diamond grinding pad prepared by the embodiment has the removal amount of 30 microns, the grinding efficiency of 2.6 microns/60 seconds, the grinding efficiency stability of +/-3.3 seconds, the service life of 254 hours and the surface roughness of a processed product of 0.211 microns.
Example 6:
the specific structure of a diamond grinding pad comprises a substrate 10 and a grinding material layer 20 arranged on the surface of the substrate 10, wherein the grinding material layer 20 comprises the following raw materials in percentage by mass: 9 percent of diamond group abrasive, 73 percent of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group.
The diamond group abrasive has a particle size of 50-80 μm. The single-particle diamond is single-crystal diamond which is treated by a surface modifier and acid and alkali, the adhesive is epoxy resin, and the filler is wollastonite and silicon dioxide. And the abrasive layer 20 is attached and fixed on the surface of the substrate 10 through an adhesive layer 30, and a back glue layer 40 is attached and covered on the bottom surface of the substrate 10 so as to be fixed with an external device.
The invention also discloses a preparation process of the diamond grinding pad, which comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; the spherical agglomerates are then solidified and sieved to obtain diamond group abrasive material of suitable particle size. The curing mode is photocuring or thermocuring; the adhesive used for preparing the diamond group abrasive is inorganic or organic adhesive, or ceramic adhesive, metal bond, UV adhesive or epoxy resin, and all the fillers are one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
(2) Preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1), an adhesive and a filler; after full dispersion, vacuumizing to eliminate bubbles to obtain the required slurry; and adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process so as to obtain the required abrasive layer.
(3) The substrate is taken out, and the abrasive layer 20 is attached and fixed to the surface of the substrate 10.
According to tests, the diamond grinding pad prepared by the embodiment has the removal amount of 30 microns, the grinding efficiency of 2.8 microns/60 seconds, the grinding efficiency stability of +/-3.3 seconds, the service life of 254 hours and the surface roughness of a processed product of 0.224 microns.
The design of the invention is characterized in that: the diamond grinding pad prepared by the formula and the process has the advantages of large removal amount, guaranteed cutting force, effectively improved grinding efficiency, better stability of grinding efficiency, greatly prolonged service life, lower surface roughness of processed products, greatly improved surface quality of the processed products, and worth popularization and use
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (9)
1. A preparation process of a diamond grinding pad is characterized by comprising the following steps: the diamond grinding pad comprises a substrate and a grinding material layer arranged on the surface of the substrate, wherein the grinding material layer comprises the following raw materials in percentage by mass: 5-10% of diamond group abrasive, 70-75% of adhesive and the balance of filler; wherein the diamond group abrasive is formed from a single particle diamond group;
the method comprises the following steps:
(1) preparing the diamond group abrasive: firstly, mixing and uniformly dispersing single-particle diamond, an adhesive and a filler; then obtaining spherical aggregate by spray drying, fluidized bed or sol-gel method; then, solidifying and screening the spherical aggregate to obtain diamond group abrasive with proper granularity;
(2) preparation of abrasive layer: uniformly mixing and dispersing the diamond group abrasive prepared in the step (1) with an adhesive and a filler, fully dispersing, and vacuumizing to eliminate bubbles to obtain required slurry; adding the obtained slurry into a charging basket of automatic coating equipment, and attaching the slurry in the concave die cavity onto a PET film substrate in a thermosetting or photocuring demolding molding manner by a gravure coating process to obtain a required abrasive layer;
(3) and (3) taking the substrate, and attaching and fixing the abrasive material layer on the surface of the substrate.
2. The process for producing a diamond polishing pad according to claim 1, wherein: the single-particle diamond is single-crystal diamond which is treated by a surface modifier and acid and alkali.
3. The process for producing a diamond polishing pad according to claim 1, wherein: the adhesive is an inorganic or organic adhesive.
4. The process for producing a diamond polishing pad according to claim 1, wherein: the adhesive is ceramic adhesive, metal bonding agent, UV adhesive or epoxy resin.
5. The process for producing a diamond polishing pad according to claim 1, wherein: the filler is one or more of calcium carbonate, limestone, wollastonite and silicon dioxide.
6. The process for producing a diamond polishing pad according to claim 1, wherein: the diamond group abrasive has a particle size of 50-80 μm.
7. The process for producing a diamond polishing pad according to claim 1, wherein: the abrasive layer is attached and fixed on the surface of the substrate through the bonding layer.
8. The process for producing a diamond polishing pad according to claim 1, wherein: and a back glue layer is adhered to the bottom surface of the substrate.
9. The process for producing a diamond polishing pad according to claim 1, wherein: the abrasive layer comprises a base and a plurality of grinding block parts integrally extending out of the surface of the base, and the grinding block parts are arranged at intervals.
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| CN112980391A (en) * | 2021-03-02 | 2021-06-18 | 河北思瑞恩新材料科技有限公司 | Coarse grinding fluid for processing silicon carbide wafer and preparation method thereof |
| CN114161230B (en) * | 2021-11-29 | 2024-04-12 | 凯吉斯金刚石(广州)有限公司 | Renovating process of marble table top |
| CN119772797A (en) * | 2024-12-31 | 2025-04-08 | 东莞金太阳研磨股份有限公司 | Diamond abrasive belt and preparation process thereof |
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