CN108919557A - The production method of colored optical filtering substrates - Google Patents
The production method of colored optical filtering substrates Download PDFInfo
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- CN108919557A CN108919557A CN201811014626.2A CN201811014626A CN108919557A CN 108919557 A CN108919557 A CN 108919557A CN 201811014626 A CN201811014626 A CN 201811014626A CN 108919557 A CN108919557 A CN 108919557A
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- 239000000758 substrate Substances 0.000 title claims abstract description 135
- 238000001914 filtration Methods 0.000 title claims abstract description 73
- 230000003287 optical effect Effects 0.000 title claims abstract description 73
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 230000000903 blocking effect Effects 0.000 claims abstract description 260
- 239000011159 matrix material Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 26
- 230000002093 peripheral effect Effects 0.000 claims abstract description 26
- 238000001259 photo etching Methods 0.000 claims abstract description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 113
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229910021389 graphene Inorganic materials 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 9
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 abstract description 12
- 238000004026 adhesive bonding Methods 0.000 abstract description 6
- 239000010931 gold Substances 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010408 film Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000002042 Silver nanowire Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optical Filters (AREA)
- Liquid Crystal (AREA)
Abstract
The application provides a kind of production method of colored optical filtering substrates, including step：Patterned black-matrix layer is formed on underlay substrate；Color blocking layer is formed in the corresponding black-matrix layer in display area by photoetching process, forms the color blocking boss made of color blocking layer material in peripheral region；A conductive layer is formed in color blocking layer and color blocking boss.The application passes through while forming color blocking layer, color blocking boss is formed in the peripheral region of underlay substrate, then forms conductive layer, not newly-increased technique can realize the conducting of array substrate and colored optical filtering substrates, to save the gluing process time, material, mixed glue human cost are reduced.
Description
Technical field
This application involves a kind of colored optical filtering substrates technology, in particular to a kind of production method of colored optical filtering substrates.
Background technique
With the development of Thin Film Transistor-LCD technology, the application of liquid crystal display is more and more wider, also by blueness
It looks at.
In the manufacture craft of liquid crystal display, including conducting colored optical filtering substrates and array substrate and contraposition are pressed into
Box.Wherein mainly colored optical filtering substrates and array substrate are connected by conductive gold spacer in liquid crystal display, pass through array substrate side COF
Realize the transmission of CF signal.
When conductive gold spacer is arranged, gluing process is generallyd use, the frame glue of conductive gold spacer will be mixed with, is applied to electric signal conversion
Colored optical filtering substrates and array substrate are realized in the position (periphery of display area) of graphics field, and after carrying out pressing solidification
Conducting.
But traditional conductive gold spacer is made of the method for chemical plating, it is seriously polluted, and gold is originally as noble metal, valence
Lattice are expensive.In addition time-consuming for gluing process, causes processing time longer.
Therefore, it is desirable to provide the production method of a kind of environmentally friendly, low cost and efficient colored optical filtering substrates, to solve above-mentioned skill
Art problem.
Summary of the invention
The embodiment of the present application provides the production method of a kind of environmentally friendly, low cost and efficient colored optical filtering substrates；To solve
Existing colored optical filtering substrates and array substrate are connected by conductive gold spacer, cause at high cost, pollution greatly and processing time
Long technical problem.
The embodiment of the present application provides a kind of production method of colored optical filtering substrates, the production method of the colored optical filtering substrates
Include the following steps：
Step S1：Patterned black-matrix layer is formed on underlay substrate, the underlay substrate includes a display area
With the peripheral region that the non-display area is arranged in, the black-matrix layer is arranged in the display area；
Step S2：Color blocking layer is formed in the corresponding black-matrix layer in the display area by photoetching process,
The peripheral region forms the color blocking boss made of the color blocking layer material, and the thickness of the color blocking boss is higher than the color blocking
The thickness of layer；
Step S3：A conductive layer is formed in the color blocking layer and the color blocking boss, so that the color blocking boss and right
The conductive layer combination that should be arranged on the color blocking boss is constituted for leading for the colored optical filtering substrates and array substrate to be connected
Electric boss.
In the first technical solution of the production method of the colored optical filtering substrates of the application, the color blocking layer include color not
Same the first color blocking elementary layer, the second color blocking elementary layer and third color blocking elementary layer, the step S2 include：
One layer of first photoresist, peripheral region and institute described in first photoresist overlay are coated on the underlay substrate
State black-matrix layer；
First photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to described outer
Enclose the color blocking boss in region and the first color blocking elementary layer corresponding to the display area；
One layer of second photoresist, black-matrix layer described in second photoresist overlay are coated on the underlay substrate；
Second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to described aobvious
Show the second color blocking elementary layer in region；
One layer of third photoresist, black-matrix layer described in the third photoresist overlay are coated on the underlay substrate；
The third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to described aobvious
Show the third color blocking elementary layer in region.
In the second technical solution of the production method of the colored optical filtering substrates of the application, the color blocking layer include color not
Same the first color blocking elementary layer, the second color blocking elementary layer and third color blocking elementary layer, the color blocking boss includes base and setting
The second layer in the base, the step S2 include：
One layer of first photoresist, peripheral region and institute described in first photoresist overlay are coated on the underlay substrate
State black-matrix layer；
First photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to described outer
Enclose the base in region and the first color blocking elementary layer corresponding to the display area；
One layer of second photoresist is coated on the underlay substrate, base described in second photoresist overlay and described black
Color matrix layer；
Second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to described outer
Enclose the second layer in region and the second color blocking elementary layer corresponding to the display area；
One layer of third photoresist, black-matrix layer described in the third photoresist overlay are coated on the underlay substrate；
The third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to described aobvious
Show the third color blocking elementary layer in region.
In the third technical solution of the production method of the colored optical filtering substrates of the application, the color blocking layer include color not
With the first color blocking elementary layer, the second color blocking elementary layer and third color blocking elementary layer, the color blocking boss include base, setting exist
The third layer of the second layer and setting on the second layer in the base, the step S2 include：
One layer of first photoresist, peripheral region and institute described in first photoresist overlay are coated on the underlay substrate
State black-matrix layer；
First photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to described outer
Enclose the base in region and the first color blocking elementary layer corresponding to the display area；
One layer of second photoresist is coated on the underlay substrate, base described in second photoresist overlay and described black
Color matrix layer；
Second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to described outer
Enclose the second layer in region and the second color blocking elementary layer corresponding to the display area；
One layer of third photoresist is coated on the underlay substrate, the second layer described in the third photoresist overlay and described
Black-matrix layer；
The third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to described outer
Enclose the third layer in region and the third color blocking elementary layer corresponding to the display area.
In second and third technical solution of the production method of the colored optical filtering substrates of the application, the base is by red
Color blocking material is made, and the thickness of the base is between 1 micron to 4 microns.
In the production method of the colored optical filtering substrates of the application, the conducting boss thickness is between 0.1 micron to 9 microns
Between.
In the production method of the colored optical filtering substrates of the application, the shape of the color blocking boss is cylindrical, cube
Or one of terrace with edge；
When the color blocking boss is prism-frustum-shaped, the angle of the side of the color blocking boss and bottom surface between 30 ° -50 ° it
Between.
In the production method of the colored optical filtering substrates of the application, include in the step S3：
Layer of transparent conduction liquid is coated in the color blocking layer and the color blocking boss using coating process；
The dry electrically conducting transparent liquid, forms conductive layer.
In the production method of the colored optical filtering substrates of the application, the conductive is AgNW, PEDOT:PSS,
One of CNT, Graphene.
In the production method of the colored optical filtering substrates of the application, the conducting boss is provided at least two rows of.
The application further relates to a kind of colored optical filtering substrates comprising：
Underlay substrate, including display area and the peripheral region that the display area periphery is arranged in；
Black-matrix layer is arranged on the display area；
Color blocking layer is arranged on the display area and covers the black-matrix layer；
Color blocking boss is arranged in the peripheral region；And
Conductive layer is arranged in the color blocking layer and the color blocking boss；
The color blocking boss and the conductive layer combination being arranged on the color blocking boss form conducting boss, and the color blocking is convex
The thickness of platform is higher than the thickness of the color blocking layer, for supporting at when box and being connected the colored optical filtering substrates and array substrate.
In the colored optical filtering substrates of the application, the color blocking layer includes the first different color blocking elementary layer of color, second
Color blocking elementary layer and third color blocking unit, the color blocking boss is by a kind of color blocking material or two kinds of color blocking materials stack or three kinds of colors
Resistance material stacks to be formed.
In the colored optical filtering substrates of the application, when the color blocking boss is stacked or three kinds of color blocking materials by two kinds of color blocking materials
Material heap is folded when being formed, and the color blocking boss includes the base being arranged on the underlay substrate, and the base is by red color resistance material
Material is made, and the thickness of the base is between 1 micron to 4 microns.
In the colored optical filtering substrates of the application, the shape of the color blocking boss is in cylindrical, cube or terrace with edge
It is a kind of；
When the color blocking boss is prism-frustum-shaped, when the color blocking boss is prism-frustum-shaped, the side of the color blocking boss
And the angle of bottom surface is between 30 ° -50 °.
In the colored optical filtering substrates of the application, the conductive is AgNW (silver nanowires conductive film), PEDOT:
One of PSS, CNT, Graphene (graphene).
The production method of colored optical filtering substrates compared to the prior art, the production method of the colored optical filtering substrates of the application
By forming color blocking boss in the peripheral region of underlay substrate, conductive layer then being formed, without new while forming color blocking layer
The conducting of array substrate and colored optical filtering substrates can be realized by increasing technique, to save the gluing process time, reduce material,
Mixed glue human cost；
In addition, forming color blocking boss using photolithography method, the adhesive force of color blocking boss is improved, aligning accuracy is high, another
On the one hand, using AgNW (silver nanowires conductive film), PEDOT:The conductive materials conducts such as PSS, CNT, Graphene (graphene)
Conductive layer substitutes ITO, can effectively reduce ITO embrittlement risk, improves the performance of attachment color blocking boss surface；Solves existing coloured silk
Color optical filtering substrate and array substrate are connected by conductive gold spacer, lead to the technology that at high cost, pollution is big and processing time is long
Problem.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, below to required in embodiment
Attached drawing to be used is briefly described.The accompanying drawings in the following description is only the section Example of the application, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is the flow chart of the first preferred embodiments of the production method of the colored optical filtering substrates of the application；
Fig. 2 is the step flow chart of step S2 in Fig. 1 (forming color blocking boss step)；
Fig. 3 is the step structural schematic diagram of the first preferred embodiment of the production method of the colored optical filtering substrates of the application；
Fig. 4 is another structure of the step S2 of the first preferred embodiments of the production method of the colored optical filtering substrates of the application
Schematic diagram；
Fig. 5 is the step of the formation color blocking boss of the second preferred embodiment of the production method of the colored optical filtering substrates of the application
Rapid flow chart；
Fig. 6 is the step structural schematic diagram of the second preferred embodiments of the production method of the colored optical filtering substrates of the application；
Fig. 7 is the step of the formation color blocking boss of the third preferred embodiment of the production method of the colored optical filtering substrates of the application
Rapid flow chart；
Fig. 8 is the step structural schematic diagram of the third preferred embodiments of the production method of the colored optical filtering substrates of the application；
Fig. 9 is the structural schematic diagram of the preferred embodiment of the colored optical filtering substrates of the application.
Specific embodiment
The schema in attached drawing is please referred to, wherein identical component symbol represents identical component.The following description is to be based on
Illustrated by the application specific embodiment, be not construed as limitation the application other specific embodiments not detailed herein.
Fig. 1 to Fig. 3 is please referred to, Fig. 1 is the first preferred embodiments of the production method of the colored optical filtering substrates of the application
Flow chart；Fig. 2 is the step flow chart of step S2 in Fig. 1 (forming color blocking boss step)；Fig. 3 is the colorized optical filtering base of the application
The step structural schematic diagram of the first preferred embodiment of the production method of plate.
The production method of the colored optical filtering substrates of this first preferred embodiment includes the following steps：
Step S1：Patterned black-matrix layer is formed on underlay substrate, the underlay substrate includes a display area
With the peripheral region that the non-display area is arranged in, the black-matrix layer is arranged in the display area；
Step S2：Color blocking layer is formed in the corresponding black-matrix layer in the display area by photoetching process,
The peripheral region forms the color blocking boss made of the color blocking layer material, and the thickness of the color blocking boss is higher than the color blocking
The thickness of layer；
Step S3：A conductive layer is formed in the color blocking layer and the color blocking boss, so that the color blocking boss and right
The conductive layer combination that should be arranged on the color blocking boss constitutes conducting boss, for the colored optical filtering substrates and array to be connected
Substrate.
In this first preferred embodiment, by the display area of underlay substrate formed color blocking layer while, in periphery
Region forms the color blocking boss made of color blocking material, one layer of conductive layer is arranged, on color blocking boss then to form conductive stud
Platform, thus instead of the conductive gold spacer of the prior art, therefore this first preferred embodiment is under the premise of not newly-increased technique, just
The conducting of array substrate and colored optical filtering substrates can be achieved, to save the gluing process time, reduce material, mixed glue manpower
Cost, and achieve the purpose that environmentally protective；In addition, forming color blocking boss using photoetching process, the attachment of color blocking boss is improved
Power, aligning accuracy.
Specifically, forming patterned black square on underlay substrate 11 in the step S1 of this first preferred embodiment
Battle array layer 12, underlay substrate 11 include a display area and the peripheral region that non-display area is arranged in, and black-matrix layer 12 is arranged
In display area.
Wherein, patterned black-matrix layer 12 is formed using yellow light technique (coating, exposure and imaging).
In the step S2 of this first preferred embodiment, by photoetching process in the corresponding black-matrix layer 12 in display area
Upper formation color blocking layer forms the color blocking boss 134 made of color blocking layer material in peripheral region, and the thickness of color blocking boss 134 is high
In the thickness of color blocking layer.
Specifically, color blocking layer includes the first different color blocking elementary layer 131 of color, the second color blocking elementary layer 132 and third
Color blocking elementary layer 133, step S2 include：
S201：One layer of first photoresist, the first photoresist overlay peripheral region and black square are coated on underlay substrate 11
Battle array layer 12；
S202：The first photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to external zones
The color blocking boss 134 in domain and the first color blocking elementary layer 131 corresponding to display area；
S203：One layer of second photoresist, the second photoresist overlay black-matrix layer 12 are coated on underlay substrate 11；
S204：The second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to viewing area
The second color blocking elementary layer 132 in domain；
S205：One layer of third photoresist, third photoresist overlay black-matrix layer 12 are coated on underlay substrate 11；
S206：Third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to viewing area
The third color blocking elementary layer 133 in domain.
Wherein, half-tone mask plate or gray-tone mask plate (GTM) can be used in the first photo mask board, to form the color of different-thickness
Boss 134 and the first color blocking elementary layer 131 are hindered, the thickness of color blocking boss 134 is greater than the thickness of the first color blocking elementary layer 131.The
Panchromatic tune mask plate can be used in two photo mask boards and third photo mask board, to form the second color blocking elementary layer of the same thickness
132 as thickness third color blocking elementary layer 133.
It should be noted that the first photoresist, the second photoresist are different with the color of third photoresist, i.e. the first photoetching
The color of glue, the second photoresist and third photoresist respectively can be any for red, green or blue, as long as three's color
Difference.
And step S201-S202 is used to form the first color blocking elementary layer 131 and color blocking boss 134, step S203-S204 is used
In forming the second color blocking elementary layer 132, step S205-S206 is used to form third color blocking elementary layer 133.Step S201-S202,
Without successive point in tri- groups of steps of S203-S204 and S205-S206, but this first preferred embodiment is with the step of S201-S206
Suddenly sequentially, and using the first photoresist be red photoresist, the second photoresist is green photoresist and third photoresist as blue light
It is illustrated for photoresist.
In step s 2, the shape of color blocking boss 134 is one of cylindrical, cube or terrace with edge.It is excellent originally first
It selects in embodiment, color blocking boss 134 is prism-frustum-shaped.Wherein, the angle α of the side and bottom surface of color blocking boss 134 is between 30 ° -50 °
Between, i.e. 30 °≤α≤50 °.
When the colored optical filtering substrates of the present embodiment and array substrate are pressed, need to carry out by frame glue to stablize pressure
It closes, wherein frame glue and color blocking boss 134 are the same as row and interval setting.Therefore the angle α of the side of color blocking boss 134 and bottom surface is set
It is set between 30 ° -50 °, under the premise of guaranteeing colored optical filtering substrates and array substrate with conducting contact area is stablized, favorably
In the illumination curing of frame glue.
Certainly, it in order to enable the pressing conducting of the colored optical filtering substrates of the present embodiment and array substrate is more stable, is serving as a contrast
At least two rows of conducting boss can be set in the peripheral region of substrate 11.Such as Fig. 4.
In the step S3 of this first preferred embodiment, a conductive layer 14 is formed in color blocking layer and color blocking boss 134.Tool
Body, step S3 includes：
S31：Layer of transparent conduction liquid is coated in color blocking layer and color blocking boss 134 using coating process；
S32：Dry electrically conducting transparent liquid, forms conductive layer 14.
It in step s3, can be with flat first color blocking unit when being coated since electrically conducting transparent liquid has levelability
Existing difference in height between the 131, second color blocking elementary layer 132 of layer and third color blocking elementary layer 133, plays flat effect.
In addition, conduction liquid is coated on the outermost surface of color blocking boss 134, and pattern is formed, is formed and colorized optical filtering base
The conducting boss of the public electrode conducting of plate.And conducting boss thickness according at box when, the difference in box gap and it is different, so
Color blocking boss 134 and the conductive layer 14 being arranged on color blocking boss 134 combination constitute conducting boss, conducting boss thickness between
Between 0.1 micron to 9 microns.Preferably, conducting boss is 5.8 microns.
In addition, conductive is AgNW (silver nanowires conductive film), PEDOT:PSS, CNT, Graphene (graphene)
One of.In step s3, the ito film that the prior art is replaced using transparent conduction liquid, can effectively reduce ito film embrittlement
Risk, and using coating process make conductive layer 14 have good adhesive force.
The step process of the present embodiment is just completed in this way.
Referring to figure 5. and Fig. 6, in the second preferred embodiments, the difference of the present embodiment and first preferred embodiment
It is, in step s 2, color blocking layer is formed in the corresponding black-matrix layer 22 in display area by photoetching process, in external zones
Domain forms the color blocking boss made of color blocking layer material, and the thickness of color blocking boss is higher than the thickness of color blocking layer.
Specifically, color blocking layer includes the first different color blocking elementary layer 231 of color, the second color blocking elementary layer 232 and third
Color blocking elementary layer 233, color blocking boss include base 234 and the second layer 235 that is arranged in base 234, and step S2 includes：
S211：One layer of first photoresist, the first photoresist overlay peripheral region and black square are coated on underlay substrate 21
Battle array layer 22；
S212：The first photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to external zones
The base 234 in domain and the first color blocking elementary layer 231 corresponding to display area；
S213：One layer of second photoresist, the second photoresist overlay base 234 and black matrix" are coated on underlay substrate 21
Layer 22；
S214：The second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to external zones
The second layer 235 in domain and the second color blocking elementary layer 232 corresponding to display area；
S215：One layer of third photoresist, third photoresist overlay black-matrix layer 22 are coated on underlay substrate 11；
S216：Third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to viewing area
The third color blocking elementary layer 233 in domain.
Wherein, half-tone mask plate or gray-tone mask plate (GTM) can be used in the first photo mask board and the second photo mask board, with
Base 234 and the first color blocking elementary layer 231 of the color blocking boss of different-thickness are obtained, and obtains the color blocking boss of different-thickness
The second layer 235 and the second color blocking elementary layer 232.The thickness of color blocking boss is greater than the thickness of color blocking layer.Third photo mask board
Panchromatic tune mask plate can be used, to form the third color blocking elementary layer 233 of the same thickness.
Certainly, the first photo mask board and the second photo mask board be also possible to it is one of using half-tone mask plate or
Gray-tone mask plate (GTM), as long as the thickness of color blocking boss is made to meet the requirement in box gap.
It should be noted that the first photoresist, the second photoresist are different with the color of third photoresist, i.e. the first photoetching
The color of glue, the second photoresist and third photoresist respectively can be any for red, green or blue, as long as three's color
Difference.
And step S211-S212 is used to form the base 234 of the first color blocking elementary layer 231 and color blocking boss, step S213-
S214 is used to form the second layer 235 of the second color blocking elementary layer 232 and color blocking boss, and step S215-S216 is used to form third
Color blocking elementary layer 233.Step S213-S214 closely follows the step S211-S212 and S215-S216 two after step S211-S212
Without successive point in group step, but this second preferred embodiment is with sequence the step of S211-S216, and is with the first photoresist
Red photoresist, the second photoresist are green photoresist and third photoresist is to be illustrated for blue photoresist.
In this second preferred embodiment, base 234 is made of red color resistance material, and the thickness of base 234 is between 1 micron
To between 4 microns.Wherein preferred preparation red color resistance, so that base of the red color resistance as color blocking boss, to improve processing procedure
Characteristic, and improve the stability of color blocking boss.Preferably, base 234 with a thickness of 3 microns.
Wherein conductive layer 24 is arranged on color blocking boss and color blocking layer.
Fig. 7 and Fig. 8 are please referred to, in this third preferred embodiment, the difference of the present embodiment and first preferred embodiment
It is in in step s 2, color blocking layer being formed in the corresponding black-matrix layer 32 in display area by photoetching process, in periphery
Region forms the color blocking boss made of color blocking layer material, and the thickness of color blocking boss is higher than the thickness of color blocking layer.
Specifically, color blocking layer includes the first different color blocking elementary layer 331 of color, the second color blocking elementary layer 332 and third
Color blocking elementary layer 333, color blocking boss include the base 334 being arranged on underlay substrate 31, the second layer being arranged in base 334
335 and the third layer 336 that is arranged on the second layer 335, step S2 include：
S231：One layer of first photoresist, the first photoresist overlay peripheral region and described black are coated on underlay substrate 31
Color matrix layer 32；
S232：The first photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to external zones
The base 334 in domain and the first color blocking elementary layer 331 corresponding to display area；
S233：One layer of second photoresist, the second photoresist overlay base 334 and black matrix" are coated on underlay substrate 31
Layer 32；
S234：The second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to external zones
The second layer 335 in domain and the second color blocking elementary layer 332 corresponding to display area；
S235：One layer of third photoresist, the third photoresist overlay second layer 335 and black square are coated on underlay substrate 31
Battle array layer 32；
S236：Third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to external zones
The third layer 336 in domain and third color blocking elementary layer 333 corresponding to display area.
Wherein, half-tone mask plate can be used in the first photo mask board, the second photo mask board and third photo mask board
Or gray-tone mask plate (GTM), to obtain base 334 and the first color blocking elementary layer 331 of the color blocking boss of different-thickness, and obtain not
The second layer 335 of the color blocking boss of stack pile and the second color blocking elementary layer 332, obtain the third layer of the color blocking boss of different-thickness
336 and third color blocking elementary layer 333.The thickness of color blocking boss is greater than the thickness of color blocking layer.
Certainly, the first photo mask board, the second photo mask board and third photo mask board are also possible to any one
A photo mask board or wantonly one or two of photo mask board are using half-tone mask plate or gray-tone mask plate (GTM) or three photo mask boards
It is all made of panchromatic tune mask plate.As long as the thickness of color blocking boss is made to meet the requirement in box gap.
It should be noted that the first photoresist, the second photoresist are different with the color of third photoresist, i.e. the first photoetching
The color of glue, the second photoresist and third photoresist respectively can be any for red, green or blue, as long as three's color
Difference.
And step S221-S222 is used to form the base 334 of the first color blocking elementary layer 331 and color blocking boss, step S223-
S224 is used to form the second layer 335 of the second color blocking elementary layer 332 and color blocking boss, and step S225-S226 is used to form third
Color blocking elementary layer 333.This second preferred embodiment is red photoetching with the first photoresist with sequence the step of S221-S226
Glue, the second photoresist are green photoresist and third photoresist is to be illustrated for blue photoresist.
In this third preferred embodiment, base 334 is made of red color resistance material, and the thickness of base 334 is between 1 micron
To between 4 microns.Wherein preferred preparation red color resistance, so that base of the red color resistance as color blocking boss, to improve processing procedure
Characteristic, and improve the stability of color blocking boss.Preferably, base 334 with a thickness of 3 microns.
Wherein conductive layer 34 is arranged on color blocking boss and color blocking layer.
Please refer to Fig. 9, a kind of colored optical filtering substrates of the present embodiment comprising：
Underlay substrate 41, including display area and the peripheral region that the display area periphery is arranged in；
Black-matrix layer 42 is arranged on the display area；
Color blocking layer is arranged on the display area and covers the black-matrix layer 42；
Color blocking boss is arranged in the peripheral region；And
Conductive layer 44 is arranged in the color blocking layer and the color blocking boss；
The color blocking boss and the conductive layer 44 being arranged on color blocking boss combination form conducting boss, the color blocking
The thickness of boss is higher than the thickness of the color blocking layer, for supporting at when box and being connected the colored optical filtering substrates and array base
Plate.
In the colored optical filtering substrates of the present embodiment, the color blocking layer include the first different color blocking elementary layer 431 of color,
Second color blocking elementary layer 432 and third color blocking unit 433, the color blocking boss is by a kind of color blocking material or two kinds of color blocking material piles
Folded or three kinds of color blocking materials stack to be formed.
In the present embodiment, color blocking boss is stacked by three kinds of color blocking materials and is formed, and color blocking boss includes being arranged in substrate base
Base 434, the second layer 435 being arranged in base 434 on plate 41 and the third layer 436 being arranged on the second layer 435.
In the colored optical filtering substrates of the present embodiment, when the color blocking boss is stacked or three kinds of color blockings by two kinds of color blocking materials
When material stacks to be formed, the base is made of red color resistance material, and the thickness of the base is between 1 micron to 4 microns.
In the colored optical filtering substrates of the present embodiment, the shape of the color blocking boss is in cylindrical, cube or terrace with edge
One kind；
When the color blocking boss is prism-frustum-shaped, when the color blocking boss is prism-frustum-shaped, the side of the color blocking boss
And the angle of bottom surface is between 30 ° -50 °.
In the colored optical filtering substrates of the present embodiment, the conductive be AgNW (silver nanowires conductive film),
PEDOT:One of PSS, CNT, Graphene (graphene).
The production method of colored optical filtering substrates compared to the prior art, the production method of the colored optical filtering substrates of the application
By forming color blocking boss in the peripheral region of underlay substrate, conductive layer then being formed, without new while forming color blocking layer
The conducting of array substrate and colored optical filtering substrates can be realized by increasing technique, to save the gluing process time, reduce material,
Mixed glue human cost；
In addition, forming color blocking boss using photolithography method, the adhesive force of color blocking boss is improved, aligning accuracy is high, another
On the one hand, using AgNW (silver nanowires conductive film), PEDOT:The conductive materials conducts such as PSS, CNT, Graphene (graphene)
Conductive layer substitutes ITO, can effectively reduce ITO embrittlement risk, improves the performance of attachment color blocking boss surface；Solves existing coloured silk
Color optical filtering substrate and array substrate are connected by conductive gold spacer, lead to the technology that at high cost, pollution is big and processing time is long
Problem.
The application is although have shown and described the disclosure, this field skill relative to one or more implementations
Art personnel will be appreciated that equivalent variations and modification based on the reading and understanding to the specification and drawings.The disclosure include it is all this
The modifications and variations of sample, and be limited only by the scope of the following claims.In addition, although the special characteristic of the disclosure phase
Only one in several implementations is disclosed, but this feature can with such as can be for a given or particular application
It is expectation and one or more other features combinations of other advantageous implementations.Moreover, with regard to term " includes ", " having ",
" containing " or its deformation be used in specific embodiments or claims for, such term be intended to with term "comprising"
Similar mode includes.
In conclusion although the application is disclosed above with embodiment, the serial number before embodiment, such as " first ", " second "
Deng only using for convenience of description, the sequence of each embodiment of the application is not caused to limit.Also, above-described embodiment not to
Limit the application, those skilled in the art are not departing from spirit and scope, can make various changes with
Retouching, therefore the protection scope of the application subjects to the scope of the claims.
Claims (10)
1. a kind of production method of colored optical filtering substrates, which is characterized in that the production method of the colored optical filtering substrates include with
Lower step：
Step S1：Patterned black-matrix layer is formed on underlay substrate, the underlay substrate includes a display area and sets
The peripheral region in the non-display area is set, the black-matrix layer is arranged in the display area；
Step S2：Color blocking layer is formed in the corresponding black-matrix layer in the display area by photoetching process, described
Peripheral region forms the color blocking boss made of the color blocking layer material, and the thickness of the color blocking boss is higher than the color blocking layer
Thickness；
Step S3：A conductive layer is formed in the color blocking layer and the color blocking boss, so that the color blocking boss and correspondence are set
The conductive layer combination on the color blocking boss is set to constitute for leading for the colored optical filtering substrates and array substrate to be connected
Electric boss.
2. the production method of colored optical filtering substrates according to claim 1, which is characterized in that the color blocking layer includes color
Different the first color blocking elementary layer, the second color blocking elementary layer and third color blocking elementary layers, the step S2 include：
One layer of first photoresist is coated on the underlay substrate, peripheral region described in first photoresist overlay and described black
Color matrix layer；
First photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to the external zones
The color blocking boss in domain and the first color blocking elementary layer corresponding to the display area；
One layer of second photoresist, black-matrix layer described in second photoresist overlay are coated on the underlay substrate；
Second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to the viewing area
The second color blocking elementary layer in domain；
One layer of third photoresist, black-matrix layer described in the third photoresist overlay are coated on the underlay substrate；
The third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to the viewing area
The third color blocking elementary layer in domain.
3. the production method of colored optical filtering substrates according to claim 1, which is characterized in that the color blocking layer includes color
Different the first color blocking elementary layer, the second color blocking elementary layer and third color blocking elementary layers, the color blocking boss include base and set
The second layer in the base is set, the step S2 includes：
One layer of first photoresist is coated on the underlay substrate, peripheral region described in first photoresist overlay and described black
Color matrix layer；
First photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to the external zones
The base in domain and the first color blocking elementary layer corresponding to the display area；
One layer of second photoresist, base and the black square described in second photoresist overlay are coated on the underlay substrate
Battle array layer；
Second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to the external zones
The second layer in domain and the second color blocking elementary layer corresponding to the display area；
One layer of third photoresist, black-matrix layer described in the third photoresist overlay are coated on the underlay substrate；
The third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to the viewing area
The third color blocking elementary layer in domain.
4. the production method of colored optical filtering substrates according to claim 1, which is characterized in that the color blocking layer includes color
Different the first color blocking elementary layer, the second color blocking elementary layer and third color blocking elementary layers, the color blocking boss include base, setting
The third layer of the second layer and setting on the second layer in the base, the step S2 include：
One layer of first photoresist is coated on the underlay substrate, peripheral region described in first photoresist overlay and described black
Color matrix layer；
First photoresist is exposed by the first photo mask board, development treatment, obtains corresponding to the external zones
The base in domain and the first color blocking elementary layer corresponding to the display area；
One layer of second photoresist, base and the black square described in second photoresist overlay are coated on the underlay substrate
Battle array layer；
Second photoresist is exposed by the second photo mask board, development treatment, obtains corresponding to the external zones
The second layer in domain and the second color blocking elementary layer corresponding to the display area；
One layer of third photoresist, the second layer and the black described in the third photoresist overlay are coated on the underlay substrate
Matrix layer；
The third photoresist is exposed by third photo mask board, development treatment, obtains corresponding to the external zones
The third layer in domain and third color blocking elementary layer corresponding to the display area.
5. according to the production method of the described in any item colored optical filtering substrates of claim 3-4, which is characterized in that the base by
Red color resistance material is made, and the thickness of the base is between 1 micron to 4 microns.
6. the production method of colored optical filtering substrates according to claim 1, which is characterized in that the conducting boss thickness is situated between
Between 0.1 micron to 9 microns.
7. the production method of colored optical filtering substrates according to claim 1, which is characterized in that the shape of the color blocking boss
For one of cylindrical, cube or terrace with edge；
When the color blocking boss is prism-frustum-shaped, the side of the color blocking boss and the angle of bottom surface are between 30 ° -50 °.
8. the production method of colored optical filtering substrates according to claim 1, which is characterized in that include in the step S3：
Layer of transparent conduction liquid is coated in the color blocking layer and the color blocking boss using coating process；
The dry electrically conducting transparent liquid, forms conductive layer.
9. the production method of colored optical filtering substrates according to claim 8, which is characterized in that the conductive is
AgNW,PEDOT:One of PSS, CNT, Graphene.
10. the production method of colored optical filtering substrates according to claim 1, which is characterized in that the conducting boss setting
Have at least two rows of.
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Address after: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant after: TCL China Star Optoelectronics Technology Co.,Ltd. Address before: 9-2 Tangming Avenue, Guangming New District, Shenzhen City, Guangdong Province Applicant before: Shenzhen China Star Optoelectronics Technology Co.,Ltd. |
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Application publication date: 20181130 |