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CN108980785B - Manufacturing process of LED bracket - Google Patents

Manufacturing process of LED bracket Download PDF

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CN108980785B
CN108980785B CN201810367448.5A CN201810367448A CN108980785B CN 108980785 B CN108980785 B CN 108980785B CN 201810367448 A CN201810367448 A CN 201810367448A CN 108980785 B CN108980785 B CN 108980785B
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bracket
packaging
glass
pole
packaging pole
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CN108980785A (en
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王进
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DONGGUAN LIGHT SOURCE OPTO Tech CO Ltd
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DONGGUAN LIGHT SOURCE OPTO Tech CO Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本发明公开一种LED支架制作工艺,其包括以下步骤:一:准备支架主体,支架主体设有第一通孔;准备至少一个封装极台,封装极台下端具有导接探针;二:准备若干玻璃件及治具;先将玻璃件套设于导接探针上,再将导接探针插装于支架主体的第一通孔中,最后放入治具中,其中,至少一片玻璃件置于封装极台与支架主体上端面之间,至少一片玻璃件置于导接探针与第一通孔的孔壁之间,玻璃件将封装极台与支架主体隔开;三:将治具放入高温炉中以对玻璃件进行熔融烧结,玻璃件熔融后将封装极台和支架主体黏连在一起;四:冷却,使熔融后的玻璃件再次固化,以将封装极台和支架主体固定在一起以形成支架,且使封装极台和支架主体不接触;五:开模,取出支架。

Figure 201810367448

The invention discloses a process for manufacturing an LED bracket, which comprises the following steps: 1. preparing a bracket body, wherein the bracket body is provided with a first through hole; preparing at least one packaging pole platform, wherein the lower end of the packaging pole platform is provided with a conducting probe; 2. preparing a plurality of glass pieces and a fixture; firstly sleeve the glass piece on the conducting probe, then insert the conducting probe into the first through hole of the bracket body, and finally put it into the fixture, wherein at least one glass piece is placed between the packaging pole platform and the upper end surface of the bracket body, at least one glass piece is placed between the conducting probe and the hole wall of the first through hole, and the glass piece separates the packaging pole platform from the bracket body; 3. placing the fixture into a high-temperature furnace to melt and sinter the glass piece, and after the glass piece is melted, the packaging pole platform and the bracket body are bonded together; 4. cooling to solidify the melted glass piece again, so as to fix the packaging pole platform and the bracket body together to form a bracket, and make the packaging pole platform and the bracket body not contact each other; 5. opening the mold and taking out the bracket.

Figure 201810367448

Description

一种LED支架制作工艺A kind of LED bracket manufacturing process

技术领域:Technical field:

本发明涉及LED产品制作技术领域,特指一种LED支架制作工艺。The invention relates to the technical field of LED product manufacturing, in particular to a manufacturing process of an LED bracket.

背景技术:Background technique:

众所周知,传统的白炽灯能耗较高,能源利用率非常低,大概只有不到十分之一的能量变成了光能,其它都是热能白白的被浪费掉了。所以人们一直在想办法要用新的光源来替代白炽灯。因此,节能灯就应运而生了。由于它相比白炽灯而言,便宜又好制作,所以就得到了大量的应用,有逐步取代白炽灯的趋势。节能灯是采用电子激发原理发光的,相对于白炽灯,节能灯具有省电的优点。但节能灯存在的一个缺点就是:节能灯中含有汞,汞在节能灯管中是起中介作用的,没有汞节能灯就不会发光。这样以来就导致节能灯生产过程中和使用废弃后有汞污染,另外,节能灯仍是玻璃制品,易破碎,不好运输,不好安装。其次,其耗电量还是较大。最后,节能灯容易损坏,寿命短。As we all know, traditional incandescent lamps have high energy consumption, and the energy utilization rate is very low. Probably less than one-tenth of the energy is turned into light energy, and the rest is heat energy wasted in vain. So people have been looking for ways to replace incandescent lamps with new light sources. Therefore, energy-saving lamps came into being. Because it is cheaper and easier to make than incandescent lamps, it has been widely used and has a tendency to gradually replace incandescent lamps. Energy-saving lamps use the principle of electronic excitation to emit light. Compared with incandescent lamps, energy-saving lamps have the advantage of saving electricity. However, one disadvantage of energy-saving lamps is that energy-saving lamps contain mercury, and mercury plays an intermediary role in energy-saving lamps. Without mercury, energy-saving lamps will not emit light. This has resulted in mercury pollution in the production process of energy-saving lamps and after they are used and discarded. In addition, energy-saving lamps are still glass products, which are easily broken, difficult to transport, and difficult to install. Second, its power consumption is still relatively large. Finally, energy-saving lamps are easily damaged and have a short lifespan.

而目前节能照明用具的发展方向就是LED灯具。相对于上述照明灯具,LED灯具有如下优点:At present, the development direction of energy-saving lighting appliances is LED lamps. Compared with the above lighting fixtures, LED lamps have the following advantages:

1、节能。白光LED灯的能耗仅为白炽灯的1/10,节能灯的1/4。1. Energy saving. The energy consumption of white LED lamps is only 1/10 of incandescent lamps and 1/4 of energy-saving lamps.

2、使用寿命长。LED灯的寿命可达10万小时以上,远远高于白炽灯和节能灯。2. Long service life. The life of LED lamps can reach more than 100,000 hours, which is much higher than that of incandescent lamps and energy-saving lamps.

3、可以频繁启动。传统的节能灯、白炽灯如果频繁的启动或关断,灯丝就会发黑,很快的坏掉,而LED灯不会。3. It can be started frequently. If the traditional energy-saving lamps and incandescent lamps are frequently turned on or off, the filaments will turn black and fail quickly, while LED lamps will not.

4、固态封装,属于冷光源类型,所以它很方便运输和安装,可以被装置在任何微型和封闭的设备中,不怕振动,基本上用不着考虑散热。4. The solid-state package belongs to the type of cold light source, so it is very convenient to transport and install, and can be installed in any miniature and closed equipment. It is not afraid of vibration and basically does not need to consider heat dissipation.

5、环保,没有汞的有害物质。LED灯的组装部件可以非常容易的拆装,回收方便。5. Environmental protection, no mercury harmful substances. The assembly parts of the LED light can be easily disassembled and assembled, and the recycling is convenient.

基于上述特点,LED灯将会逐步取代其他照明灯具。Based on the above characteristics, LED lights will gradually replace other lighting fixtures.

但是,现有技术中的LED灯一般包括有支架、若干安装于支架上的LED芯片以及固定于该支架上并罩盖于该LED芯片外围的灯帽,其中,所述支架包括作为第一导电极的支架主体以及至少一个安装于支架主体上端并作为第二导电极的封装极台,该封装极台下端的导接探针穿过该支架主体并伸出于该支架主体下端面外,且该封装极台与支架主体之间通过注塑方式成型有绝缘套,该绝缘套将封装极台与支架主体固定在一起,并使该封装极台与支架主体之间不导通。However, an LED lamp in the prior art generally includes a bracket, a plurality of LED chips mounted on the bracket, and a lamp cap fixed on the bracket and covering the periphery of the LED chip, wherein the bracket includes a first conductive A pole bracket body and at least one packaging pole table mounted on the upper end of the bracket main body and used as a second conductive electrode, the conductive probes at the lower end of the packaging pole table pass through the bracket main body and protrude out of the lower end surface of the bracket main body, and An insulating sleeve is formed between the packaging pole stage and the bracket main body by injection molding, and the insulating sleeve fixes the packaging pole stage and the bracket main body together, and makes the packaging pole stage and the bracket main body non-conductive.

但是,上述支架在制作过程中,在需要对封装极台与支架主体之间注塑绝缘套时,需要采用模具对该支架主体定位,同时需求对封装极台形成支撑,且要求该封装极台及导接探针与该支架主体之间形成有间隔,以致不能接触,即封装极台相对支架主体处于悬空状态,另外,由于上述支架的体积较小,导致该模具的精度要求极高,且还需要考虑模具注塑流道等问题,这样导致大大增加了开模成本,同时增加了工艺的难度,也难以保证产品的质量。However, in the manufacturing process of the above-mentioned support, when it is necessary to inject an insulating sleeve between the packaging pole table and the main body of the bracket, it is necessary to use a mold to position the main body of the bracket, and at the same time, it is required to form a support for the packaging pole table, and the packaging pole table and the main body of the bracket are required to be supported. There is a gap between the lead probe and the main body of the bracket so that they cannot be in contact, that is, the packaging pole table is in a suspended state relative to the main body of the bracket. In addition, due to the small size of the bracket, the precision of the mold is extremely high, and the It is necessary to consider problems such as mold injection runners, which greatly increases the cost of mold opening, increases the difficulty of the process, and makes it difficult to ensure the quality of the product.

有鉴于此,本发明人提出以下技术方案。In view of this, the inventors propose the following technical solutions.

发明内容:Invention content:

本发明的目的在于克服现有技术的不足,提供一种LED支架制作工艺。The purpose of the present invention is to overcome the deficiencies of the prior art and provide a manufacturing process for an LED bracket.

为了解决上述技术问题,本发明采用了下述技术方案:该LED支架制作工艺包括以下步骤:第一步:准备支架主体,该支架主体沿其上端面向下开设有贯穿其下端面的第一通孔;再准备至少一个封装极台,该封装极台下端具有导接探针;第二步:准备若干玻璃件以及治具;先将玻璃件套设于导接探针上,再将导接探针插装于该支架主体的第一通孔中,其中,至少一片玻璃件置于该封装极台与支架主体上端面之间,至少一片玻璃件置于该导接探针与该第一通孔的孔壁之间,该玻璃件将封装极台与支架主体隔开,最后将由玻璃件、封装极台、支架主体构成的半成品放入该治具中;第三步:将治具放入高温炉中以对玻璃件进行熔融烧结,使玻璃件熔融后将封装极台和支架主体黏连在一起;第四步:冷却,使熔融后的玻璃件再次固化,以将封装极台和支架主体固定在一起以形成支架,且使该封装极台和支架主体不接触;第五步:开模,取出支架。In order to solve the above-mentioned technical problems, the present invention adopts the following technical solutions: the manufacturing process of the LED bracket includes the following steps: the first step: preparing a bracket main body, the bracket main body is provided with a first pass through its lower end surface downward along its upper end surface Then prepare at least one packaging pole table, the lower end of the packaging pole table has a conductive probe; the second step: prepare a number of glass parts and fixtures; first set the glass parts on the conductive probe, and then The probe is inserted into the first through hole of the bracket body, wherein at least one glass piece is placed between the packaging pole table and the upper end surface of the bracket body, and at least one glass piece is placed between the conducting probe and the first Between the hole walls of the through holes, the glass piece separates the packaging pole table and the bracket body, and finally the semi-finished product consisting of the glass piece, the packaging pole table and the bracket main body is put into the fixture; the third step: put the fixture into the fixture. Put it into a high-temperature furnace to melt and sinter the glass parts, and after the glass parts are melted, the packaging pole table and the main body of the bracket are adhered together; the fourth step: cooling, so that the molten glass parts are solidified again, so as to fuse the packaging pole table and the bracket body together; The bracket bodies are fixed together to form a bracket, and the packaging pole table and the bracket body are not in contact; the fifth step: open the mold and take out the bracket.

进一步而言,上述技术方案中,所述封装极台的数量为一个,该封装极台作为第一导电极,所述支架主体作为第二导电极,所述支架为二极支架。Further, in the above technical solution, the number of the packaging pole stage is one, the packaging pole stage is used as the first conductive electrode, the support body is used as the second conductive electrode, and the support is a diode support.

进一步而言,上述技术方案中,所述封装极台的数量为两个,其分别为第一封装极台和第二封装极台,该第一封装极台具有第一导接探针,且该第一封装极台上端面向下开设有贯穿该第一导接探针下端面的第二通孔;该第二封装极台具有第二导接探针,于第二步中:先将若干玻璃件套设于第一导接探针上,再将第一导接探针插装于该支架主体的第一通孔中,其中,至少一片玻璃件置于该第一封装极台与支架主体上端面之间,至少一片玻璃件置于该第一导接探针与该第一通孔的孔壁之间,该玻璃件将第一封装极台与支架主体隔开;再将若干玻璃件套设于第二导接探针上,再将第二导接探针插装于该第一封装极台的第二通孔中,其中,至少一片玻璃件置于该第二封装极台与第一封装极台上端面之间,至少一片玻璃件置于该第二导接探针与该第二通孔的孔壁之间,该玻璃件将第二封装极台与第一封装极台隔开,最后将由玻璃件、第一封装极台、第二封装极台、支架主体构成的半成品放入该治具中,最后制成三极支架。Further, in the above technical solution, the number of the packaging pole stage is two, which are a first packaging pole stage and a second packaging pole stage, the first packaging pole stage has a first conductive probe, and The upper end of the first packaging pole table is provided with a second through hole penetrating the lower end surface of the first conductive probe; the second packaging pole table has a second conductive probe. The glass piece is sleeved on the first conductive probe, and then the first conductive probe is inserted into the first through hole of the bracket body, wherein at least one glass piece is placed on the first packaging pole table and the bracket Between the upper end faces of the main body, at least one glass piece is placed between the first conducting probe and the hole wall of the first through hole, and the glass piece separates the first packaging pole table from the main body of the bracket; The second conductive probe is inserted into the second through hole of the first packaging pole stage, wherein at least one glass piece is placed on the second packaging pole stage At least one glass piece is placed between the second conductive probe and the hole wall of the second through hole between the upper end face of the first packaging pole stage and the second packaging pole stage, and the glass piece connects the second packaging pole stage and the first packaging pole The stage is separated, and finally the semi-finished product consisting of the glass piece, the first packaging pole stage, the second packaging pole stage and the bracket body is put into the fixture, and finally a three-pole bracket is made.

进一步而言,上述技术方案中,所述玻璃件呈环状或筒状。Further, in the above technical solution, the glass piece is annular or cylindrical.

进一步而言,上述技术方案中,所述支架主体及封装极台均由导电金属制成,且其熔点高于玻璃件的熔点。Furthermore, in the above technical solution, the support body and the packaging pole stage are both made of conductive metal, and their melting point is higher than that of the glass piece.

采用上述技术方案后,本发明与现有技术相比较具有如下有益效果:由于本发明LED支架制作工艺采用若干玻璃件放入封装极台与支架主体上端面之间及导接探针与该支架主体中第一通孔的孔壁之间,再通过玻璃烧结工艺将玻璃件一体固定于该封装极台与支架主体上端面之间及导接探针与该支架主体中第一通孔的孔壁之间,使封装极台与支架主体固定在一起形成一个LED支架,且该玻璃件将封装极台与支架主体公开,防止玻璃件将封装极台与支架主体之间接触而出现导接的问题,另外,由于支架主体通过玻璃件能够对封装极台形成支撑,以致无需采用特殊的模具将封装极台悬空置于支架主体中,令本发明LED支架制作工艺仅采用简单的治具即可定位封装极台与支架主体,以此简化了整个产品制作工艺的复杂性,操作更加简便,同样降低了制作成本,即无需通过注塑的方式在封装极台与支架主体之间注塑成型绝缘套,即无需采用采用模具,解决了模具精度要求高而导致成本高的问题,令本发明具有极强的市场竞争力。After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: because the LED bracket manufacturing process of the present invention adopts several glass parts to be placed between the packaging pole table and the upper end face of the bracket main body, and the guide probe and the bracket are connected Between the hole walls of the first through hole in the main body, and then through the glass sintering process, the glass piece is integrally fixed between the packaging pole table and the upper end face of the bracket main body, and between the probe and the hole of the first through hole in the bracket main body. Between the walls, the packaging pole table and the bracket main body are fixed together to form an LED bracket, and the glass piece exposes the packaging pole stage and the bracket main body to prevent the glass piece from contacting the packaging pole table and the bracket main body to cause conduction. In addition, because the bracket body can support the packaging pole table through the glass piece, so that no special mold is required to suspend the packaging pole table in the bracket main body, so that the LED bracket manufacturing process of the present invention only uses a simple fixture. Positioning the packaging pole table and the bracket main body simplifies the complexity of the entire product manufacturing process, makes the operation easier, and also reduces the production cost, that is, there is no need to inject an insulating sleeve between the packaging pole table and the bracket main body by injection molding. That is, it is not necessary to use a mold, which solves the problem of high cost caused by high mold precision requirements, so that the present invention has strong market competitiveness.

附图说明:Description of drawings:

图1是本发明实施例一制成的LED支架的立体分解图;FIG. 1 is an exploded perspective view of an LED bracket made in Embodiment 1 of the present invention;

图2是本发明实施例一制成的LED支架的立体图;FIG. 2 is a perspective view of the LED bracket made in Embodiment 1 of the present invention;

图3是本发明实施例一制成的LED支架的剖视图;3 is a cross-sectional view of an LED bracket made in Embodiment 1 of the present invention;

图4是本发明实施例二制成的LED支架的立体分解图;4 is an exploded perspective view of the LED bracket made in the second embodiment of the present invention;

图5是本发明实施例二制成的LED支架的立体图;FIG. 5 is a perspective view of the LED bracket made in the second embodiment of the present invention;

图6是本发明实施例二制成的LED支架的剖视图。FIG. 6 is a cross-sectional view of the LED bracket manufactured in the second embodiment of the present invention.

具体实施方式:Detailed ways:

下面结合具体实施例和附图对本发明进一步说明。The present invention will be further described below with reference to specific embodiments and accompanying drawings.

实施例一:Example 1:

见图1-3所示,为一种LED支架制作工艺,其包括以下步骤:As shown in Figure 1-3, it is an LED bracket manufacturing process, which includes the following steps:

第一步:准备支架主体1,该支架主体1沿其上端面向下开设有贯穿其下端面的第一通孔11;再准备一个封装极台3,该封装极台3下端具有导接探针31;The first step: prepare a bracket body 1, the bracket body 1 is provided with a first through hole 11 running through its lower end surface downward along its upper end surface; and then prepare a package pole table 3, the lower end of the package pole table 3 has a conducting probe 31;

第二步:准备若干玻璃件2以及治具;先将玻璃件2套设于导接探针31上,再将导接探针31插装于该支架主体1的第一通孔11中,其中,至少一片玻璃件2置于该封装极台3与支架主体1上端面之间,至少一片玻璃件2置于该导接探针31与该第一通孔11的孔壁之间,该玻璃件2将封装极台3与支架主体1隔开,最后将由玻璃件2、封装极台3、支架主体1构成的半成品放入该治具中;The second step: prepare a number of glass pieces 2 and fixtures; first set the glass pieces 2 on the lead probe 31 , and then insert the lead probe 31 into the first through hole 11 of the bracket body 1 , Wherein, at least one piece of glass piece 2 is placed between the packaging pole table 3 and the upper end surface of the bracket body 1, at least one piece of glass piece 2 is placed between the conducting probe 31 and the hole wall of the first through hole 11, the The glass piece 2 separates the packaging pole stage 3 from the bracket main body 1, and finally the semi-finished product consisting of the glass piece 2, the packaging pole stage 3 and the bracket main body 1 is put into the fixture;

第三步:将治具放入高温炉中以对玻璃件2进行熔融烧结,使玻璃件2熔融后将封装极台3和支架主体1黏连在一起;The third step: put the fixture into a high-temperature furnace to melt and sinter the glass piece 2, and after the glass piece 2 is melted, the packaging pole table 3 and the bracket body 1 are adhered together;

第四步:冷却,使熔融后的玻璃件2再次固化,以将封装极台3和支架主体1固定在一起以形成支架,且使该封装极台3和支架主体1不接触;The fourth step: cooling, so that the molten glass piece 2 is solidified again, so as to fix the packaging pole stage 3 and the bracket main body 1 together to form a bracket, and make the packaging pole stage 3 and the bracket main body 1 not contact;

第五步:开模,取出支架。Step 5: Open the mold and take out the bracket.

所述玻璃件2呈环状或筒状,其中,置于该封装极台3与支架主体1上端面之间的玻璃件2呈环状,置于该导接探针31与该第一通孔11的孔壁之间的玻璃件2呈筒状,当然,置于该导接探针31与该第一通孔11的孔壁之间的玻璃件2也可以是呈环状结构,只需要在导接探针31与该第一通孔11的孔壁之间套设多片环状的玻璃件2即可,其同样可达到相同的功效。The glass piece 2 is annular or cylindrical, wherein the glass piece 2 placed between the packaging pole table 3 and the upper end face of the bracket main body 1 is annular, and is placed between the conducting probe 31 and the first connection. The glass piece 2 between the hole walls of the hole 11 is cylindrical. Of course, the glass piece 2 placed between the conducting probe 31 and the hole wall of the first through hole 11 can also be a ring-shaped structure. It is only necessary to set a plurality of annular glass pieces 2 between the conducting probes 31 and the hole wall of the first through hole 11 , which can also achieve the same effect.

所述封装极台3作为第一导电极,所述支架主体1作为第二导电极,所述支架为二极支架,即本实施例一所述的LED支架制作工艺最后制成一个二极LED支架。The packaging pole table 3 is used as the first conductive electrode, the bracket body 1 is used as the second conductive electrode, and the bracket is a diode bracket, that is, the LED bracket manufacturing process described in the first embodiment finally produces a diode LED bracket.

所述支架主体1及封装极台3均由导电金属制成,且其熔点高于玻璃件2的熔点,以致使,该玻璃件2开始熔融时,该支架主体1及封装极台3不会熔融,保证整个支架制作的质量。The bracket body 1 and the packaging pole stage 3 are both made of conductive metal, and their melting point is higher than the melting point of the glass piece 2, so that when the glass piece 2 begins to melt, the bracket main body 1 and the packaging pole stage 3 will not. Melting to ensure the quality of the entire stent fabrication.

由于本发明LED支架制作工艺采用若干玻璃件放入封装极台3与支架主体1上端面之间及导接探针31与该支架主体中第一通孔11的孔壁之间,再通过玻璃烧结工艺将玻璃件一体固定于该封装极台3与支架主体1上端面之间及导接探针31与该支架主体中第一通孔11的孔壁之间,使封装极台3与支架主体1固定在一起形成一个LED支架,且该玻璃件将封装极台3与支架主体1公开,防止玻璃件将封装极台3与支架主体1之间接触而出现导接的问题,另外,由于支架主体1通过玻璃件能够对封装极台3形成支撑,以致无需采用特殊的模具将封装极台3悬空置于支架主体1中,令本发明LED支架制作工艺仅采用简单的治具即可定位封装极台3与支架主体1,以此简化了整个产品制作工艺的复杂性,操作更加简便,同样降低了制作成本,即无需通过注塑的方式在封装极台与支架主体之间注塑成型绝缘套,即无需采用采用模具,解决了模具精度要求高而导致成本高的问题,令本发明具有极强的市场竞争力。Because the LED bracket manufacturing process of the present invention adopts several glass pieces to be placed between the packaging pole table 3 and the upper end face of the bracket main body 1 and between the conducting probe 31 and the hole wall of the first through hole 11 in the bracket main body, and then pass through the glass The sintering process fixes the glass piece integrally between the packaging pole table 3 and the upper end face of the bracket main body 1 and between the conducting probe 31 and the hole wall of the first through hole 11 in the bracket main body, so that the packaging pole table 3 and the bracket The main body 1 is fixed together to form an LED bracket, and the glass piece exposes the packaging pole stage 3 and the bracket main body 1 to prevent the glass piece from contacting the packaging pole stage 3 and the bracket main body 1 to cause conduction problems. The bracket main body 1 can form support for the packaging pole table 3 through the glass piece, so that the packaging pole table 3 does not need to be suspended in the bracket main body 1 without using a special mold, so that the LED bracket manufacturing process of the present invention can be positioned only by using a simple jig The pole table 3 and the bracket body 1 are encapsulated, which simplifies the complexity of the entire product manufacturing process, makes the operation easier, and also reduces the production cost, that is, there is no need to inject an insulating sleeve between the encapsulation pole table and the bracket main body by means of injection molding. , that is, it is not necessary to use a mold, which solves the problem of high cost caused by high mold precision requirements, and makes the present invention have strong market competitiveness.

实施例二:Embodiment 2:

结合图4-6所示,本实施例二与上述实施例一的不同之处在于:所述封装极台3的数量为两个,其分别为第一封装极台4和第二封装极台5,该第一封装极台4具有第一导接探针41,且该第一封装极台4上端面向下开设有贯穿该第一导接探针41下端面的第二通孔42;该第二封装极台5具有第二导接探针51,于第二步中:先将若干玻璃件2套设于第一导接探针41上,再将第一导接探针41插装于该支架主体1的第一通孔11中,其中,至少一片玻璃件2置于该第一封装极台4与支架主体1上端面之间,该玻璃件2呈环状;至少一片玻璃件2置于该第一导接探针41与该第一通孔11的孔壁之间,该玻璃件2呈筒状;该玻璃件2将第一封装极台4与支架主体1隔开;再将若干玻璃件2套设于第二导接探针51上,再将第二导接探针51插装于该第一封装极台4的第二通孔42中,其中,至少一片玻璃件2置于该第二封装极台5与第一封装极台4上端面之间,该玻璃件2呈环状;至少一片玻璃件2置于该第二导接探针51与该第二通孔42的孔壁之间,该玻璃件2呈筒状;该玻璃件2将第二封装极台5与第一封装极台4隔开,最后将由玻璃件2、第一封装极台4、第二封装极台5支架主体1构成的半成品放入该治具中,最后制成三极LED支架。Referring to FIGS. 4-6 , the difference between the second embodiment and the above-mentioned first embodiment is that the number of the packaging pole stages 3 is two, which are the first packaging pole stage 4 and the second packaging pole stage respectively. 5. The first packaging pole stage 4 has a first conductive probe 41, and the upper end of the first packaging pole stage 4 is provided with a second through hole 42 penetrating the lower end surface of the first conductive probe 41; the The second encapsulation stage 5 has second conductive probes 51 . In the second step: first, a plurality of glass pieces 2 are sleeved on the first conductive probes 41 , and then the first conductive probes 41 are inserted. In the first through hole 11 of the bracket main body 1, at least one glass piece 2 is placed between the first packaging pole table 4 and the upper end surface of the bracket main body 1, and the glass piece 2 is annular; at least one glass piece 2 is placed between the first conducting probe 41 and the hole wall of the first through hole 11, the glass piece 2 is cylindrical; the glass piece 2 separates the first packaging pole stage 4 from the bracket body 1; Then a plurality of glass pieces 2 are sleeved on the second conductive probes 51, and the second conductive probes 51 are inserted into the second through holes 42 of the first packaging pole table 4, wherein at least one piece of glass The glass piece 2 is placed between the second packaging pole stage 5 and the upper end surface of the first packaging pole stage 4, and the glass piece 2 is annular; at least one piece of glass piece 2 is placed between the second conductive probe 51 and the second Between the hole walls of the through holes 42, the glass piece 2 is cylindrical; the glass piece 2 separates the second packaging pole stage 5 from the first packaging pole stage 4, and finally the glass piece 2, the first packaging pole stage 4 . The semi-finished product formed by the bracket body 1 of the second package pole table 5 is put into the fixture, and finally a three-pole LED bracket is made.

除以上所述之外,本实施例二的内容与实施例一的相同,且该本实施例二中所述LED支架制作工艺同样具备实施例一中LED支架制作工艺的优点。Except for the above, the content of the second embodiment is the same as that of the first embodiment, and the LED bracket manufacturing process described in the second embodiment also has the advantages of the LED bracket manufacturing process in the first embodiment.

当然,以上所述仅为本发明的具体实施例而已,并非来限制本发明实施范围,凡依本发明申请专利范围所述构造、特征及原理所做的等效变化或修饰,均应包括于本发明申请专利范围内。Of course, the above descriptions are only specific embodiments of the present invention, and are not intended to limit the scope of implementation of the present invention. Any equivalent changes or modifications made in accordance with the structures, features and principles described in the scope of the patent application of the present invention shall be included in the within the scope of the patent application of the present invention.

Claims (5)

1.一种LED支架制作工艺,其特征在于:其包括以下步骤:1. a manufacturing process of LED bracket, is characterized in that: it comprises the following steps: 第一步:准备支架主体,该支架主体沿其上端面向下开设有贯穿其下端面的第一通孔;再准备至少一个封装极台,该封装极台下端具有导接探针;The first step: prepare the main body of the bracket, and the main body of the bracket is provided with a first through hole running through the lower end surface of the main body along its upper end surface; and then prepare at least one packaging pole table, and the lower end of the packaging pole table has a conducting probe; 第二步:准备若干玻璃件以及治具;先将玻璃件套设于导接探针上,再将导接探针插装于该支架主体的第一通孔中,其中,至少一片玻璃件置于该封装极台与支架主体上端面之间,至少一片玻璃件置于该导接探针与该第一通孔的孔壁之间,该玻璃件将封装极台与支架主体隔开,最后将由玻璃件、封装极台、支架主体构成的半成品放入该治具中;The second step: prepare a number of glass pieces and fixtures; first set the glass pieces on the guide probes, and then insert the guide probes into the first through holes of the bracket body, wherein at least one glass piece It is placed between the packaging pole table and the upper end face of the support main body, and at least one piece of glass is placed between the conducting probe and the hole wall of the first through hole, and the glass piece separates the packaging pole table from the bracket main body. Finally, put the semi-finished product consisting of the glass piece, the encapsulation pole table and the bracket body into the fixture; 第三步:将治具放入高温炉中以对玻璃件进行熔融烧结,使玻璃件熔融后将封装极台和支架主体黏连在一起;The third step: put the fixture into a high-temperature furnace to melt and sinter the glass parts, so that the glass parts are melted and the packaging pole table and the main body of the bracket are adhered together; 第四步:冷却,使熔融后的玻璃件再次固化,以将封装极台和支架主体固定在一起以形成支架,且使该封装极台和支架主体不接触;The fourth step: cooling to solidify the molten glass piece again, so as to fix the packaging pole table and the bracket body together to form a bracket, and make the packaging pole table and the bracket main body not in contact; 第五步:开模,取出支架。Step 5: Open the mold and take out the bracket. 2.根据权利要求1所述的一种LED支架制作工艺,其特征在于:所述封装极台的数量为一个,该封装极台作为第一导电极,所述支架主体作为第二导电极,所述支架为二极支架。2 . The manufacturing process of an LED bracket according to claim 1 , wherein the number of the packaging pole stage is one, the packaging pole stage is used as the first conductive electrode, and the bracket main body is used as the second conductive electrode, 2 . The support is a diode support. 3.根据权利要求1所述的一种LED支架制作工艺,其特征在于:所述封装极台的数量为两个,其分别为第一封装极台和第二封装极台,该第一封装极台具有第一导接探针,且该第一封装极台上端面向下开设有贯穿该第一导接探针下端面的第二通孔;该第二封装极台具有第二导接探针,于第二步中:先将若干玻璃件套设于第一导接探针上,再将第一导接探针插装于该支架主体的第一通孔中,其中,至少一片玻璃件置于该第一封装极台与支架主体上端面之间,至少一片玻璃件置于该第一导接探针与该第一通孔的孔壁之间,该玻璃件将第一封装极台与支架主体隔开;再将若干玻璃件套设于第二导接探针上,再将第二导接探针插装于该第一封装极台的第二通孔中,其中,至少一片玻璃件置于该第二封装极台与第一封装极台上端面之间,至少一片玻璃件置于该第二导接探针与该第二通孔的孔壁之间,该玻璃件将第二封装极台与第一封装极台隔开,最后将由玻璃件、第一封装极台、第二封装极台、支架主体构成的半成品放入该治具中,最后制成三极支架。3 . The manufacturing process of an LED bracket according to claim 1 , wherein the number of the packaging poles is two, which are respectively a first packaging pole and a second packaging pole, and the first packaging pole The pole stage has a first conductive probe, and the upper end of the first packaging pole stage is provided with a second through hole penetrating the lower end surface of the first conductive probe; the second packaging pole stage has a second conductive probe Needle, in the second step: first set a number of glass pieces on the first lead probe, and then insert the first lead probe into the first through hole of the bracket body, wherein at least one piece of glass At least one glass piece is placed between the first conductive probe and the hole wall of the first through hole, and the glass piece seals the first package pole The stage is separated from the main body of the bracket; and then a plurality of glass pieces are sleeved on the second conductive probes, and then the second conductive probes are inserted into the second through holes of the first packaging pole stage, wherein at least A piece of glass is placed between the second packaging pole stage and the upper end face of the first packaging pole stage, and at least one glass piece is placed between the second conductive probe and the hole wall of the second through hole, the glass piece The second packaging pole stage is separated from the first packaging pole stage, and finally the semi-finished product consisting of the glass piece, the first packaging pole stage, the second packaging pole stage and the bracket body is put into the fixture, and finally a three-pole bracket is made . 4.根据权利要求1-3任意一项所述的一种LED支架制作工艺,其特征在于:所述玻璃件呈环状或筒状。4 . The manufacturing process of an LED bracket according to claim 1 , wherein the glass piece is annular or cylindrical. 5 . 5.根据权利要求1所述的一种LED支架制作工艺,其特征在于:所述支架主体及封装极台均由导电金属制成,且其熔点高于玻璃件的熔点。5 . The manufacturing process of an LED bracket according to claim 1 , wherein the bracket main body and the packaging pole table are both made of conductive metal, and the melting point thereof is higher than that of the glass piece. 6 .
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