CN109188823B - A laser array light source for optical scanning - Google Patents
A laser array light source for optical scanning Download PDFInfo
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- CN109188823B CN109188823B CN201811214855.9A CN201811214855A CN109188823B CN 109188823 B CN109188823 B CN 109188823B CN 201811214855 A CN201811214855 A CN 201811214855A CN 109188823 B CN109188823 B CN 109188823B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/292—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection by controlled diffraction or phased-array beam steering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
- G01S7/481—Constructional features, e.g. arrangements of optical elements
- G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
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- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Semiconductor Lasers (AREA)
Abstract
本发明公开了一种用于光学扫描的激光阵列光源，由n行×m列个阵元阵列排布到可扩展框架上构成，所述的阵元为单独封装的个体，且阵元包括压圈、准直透镜、调整垫片、激光二极管、前置驱动电路、插座、金属外壳和有机硅胶；所述的基座包括有平行设置的上、下固定隔板，n行×m列个阵元竖直阵列排布在上、下固定隔板之间，阵元之间相互平行。本发明采用封装结构极大改善器件的散热效果，与双结构光栅器件配合，实现多光束相控阵扫描激光照射，对于阵列激光照射光源，个别单体半导体激光二极管的失效不会造成阵列功能的整体失效，极大提升了器件的可靠性和适用性，也扩展了激光检测技术的适用场合。
The invention discloses a laser array light source for optical scanning, which is composed of n rows×m columns of array elements arranged on an expandable frame, the array elements are individually packaged individuals, and the array elements include pressure ring, collimating lens, adjusting spacer, laser diode, pre-driving circuit, socket, metal casing and silicone; the base includes upper and lower fixed partitions arranged in parallel, with n rows×m columns of arrays The vertical array of elements is arranged between the upper and lower fixed partitions, and the array elements are parallel to each other. The invention adopts the package structure to greatly improve the heat dissipation effect of the device, and cooperates with the double-structure grating device to realize the multi-beam phased array scanning laser irradiation. For the array laser irradiation light source, the failure of individual single semiconductor laser diodes will not cause the array function to fail. The overall failure greatly improves the reliability and applicability of the device, and also expands the application of laser detection technology.
Description
Technical Field
The invention relates to the technical field of optical phased arrays in the field of optical detection, in particular to a laser array light source for optical scanning.
Background
At present, the application fields of rapid development of artificial intelligence technology, target detection, weapon guidance, unmanned driving, autonomous obstacle avoidance and the like urgently need a rapid, accurate and omnibearing target detection technology. The radar is the most common detection means, and compared with the radar of the traditional mechanical scanning technology, the phased array scanning technology utilizes a large number of small antenna units which are independently controlled to be arranged into an antenna array surface, each antenna unit is controlled by an independent phase-shifting switch, and different phase beams can be synthesized by controlling the phase transmitted by each antenna unit. Based on the inspiration of the phase control electronic scanning array radar, the solid-state laser radar utilizing the optical phased array scanning technology becomes a research hotspot due to the wide application prospect. Different from a mechanical scanning laser radar, the structure and the size of the radar can be greatly reduced due to no need of a rotating part, the service life is prolonged, and the cost is reduced; the scanning speed of the optical phased array depends on the electronic characteristics of the used materials and can generally reach the MHz level without being limited by the speed and the precision of mechanical rotation; the scanning precision of the optical phased array depends on the precision of the control electric signal and can reach more than one thousandth of magnitude; the light beam pointing of the optical phased array is completely controlled by an electric signal, any pointing can be achieved within an allowed angle range, and high-density scanning can be performed in a key area; one phase control array surface can be divided into a plurality of small modules, and each module can be controlled separately to lock and monitor a plurality of targets simultaneously. However, the solid-state laser radar also has the corresponding defects, grating diffraction can form other bright fringes besides the central bright fringe, and the problem can lead laser to form side lobes outside the direction of the maximum power and disperse the energy of the laser; in particular, the optical phased array requires that the size of the array unit is not more than half wavelength, and the working wavelength of the existing laser radar is about 1 micron, so the size of the array unit is not more than 500 nm. And the higher the array density is, the more concentrated the energy is, which all raises the requirement for processing precision and needs a certain technical breakthrough. Therefore, in consideration of the laser light source link, changing a single light source into an array distributed light source is a new idea for solving the above problems.
The distributed laser array light source disperses laser beams, integrates a plurality of micro-channels together to form a large system, improves the rigorous requirements of a single light source on miniaturization and integration of unit sizes of an optical phased array device and a grating device, makes it possible to manufacture a laser radar system product based on an optical phased array principle by utilizing the prior art, process and device, meets the increasing application of the laser radar industry, and has very wide market prospect.
Disclosure of Invention
The invention aims to provide a laser array light source for optical scanning, which can realize modulation integration of multi-channel light beam phases and realize electric control scanning and depth focusing control of laser irradiation by matching with a grating array.
The technical scheme adopted by the invention is as follows:
a laser array light source for optical scanning is formed by arranging n rows of array elements with the length of m to an expandable frame in an array mode, wherein the array elements are independently packaged individuals and comprise pressing rings, collimating lenses, adjusting gaskets, laser diodes, a front driving circuit, a socket, a metal shell and organic silica gel, and the socket is fixed at one end of the metal shell and connected with the front driving circuit; the laser diode packaged by the heat sink is fixed at the middle position in the metal shell, and a pin of the laser diode is connected with the output end of the front-end drive circuit and is encapsulated by organic silica gel; the collimating lens is fixedly arranged at the other end in the metal shell through an adjusting gasket and a pressing ring respectively, wherein n and m are positive integers;
the expandable frame comprises an upper fixing partition plate and a lower fixing partition plate which are arranged in parallel, n rows of x m columns of array elements are vertically arrayed between the upper fixing partition plate and the lower fixing partition plate, the array elements are parallel to each other, the socket end is arranged at the lower end, the intervals between the array elements are uniform and consistent, the intervals are filled with potting materials, the potting materials are mixtures of aluminum powder and silica gel, and the whole array light source is also encapsulated while the potting materials are filled;
the drive circuit comprises a filter circuit and a drive and brightness control circuit, wherein the input end of the filter circuit is connected with the output end of the socket, the output end of the filter circuit is connected with the input end of the drive and brightness control circuit, and the output end of the drive and brightness control circuit is connected with the corresponding pin of the laser diode.
The drive circuit also comprises a power supply polarity conversion circuit which is a rectification module and is used for converting direct current or alternating current with different polarities into direct current with determined polarity to be used as a power supply of a subsequent circuit.
The filter circuit comprises a pre-filter and a post-filter which are respectively arranged at the input end and the output end of the rectifier module, and the pre-filter and the post-filter adopt capacitor filtering.
The driving and brightness control circuit comprises a reference voltage, a comparator, a bias resistor R1, a calibration resistor R2, a current limiting resistor R3 and a field effect transistor, and is used for carrying out on-off control and brightness adjustment control on the load of the laser diode according to an external control signal.
The side faces of the expandable frame are provided with semi-I-shaped through guide grooves and H-shaped fasteners all around, each side face of the expandable frame is provided with at least one semi-I-shaped through guide groove at a relative position, and two corresponding semi-I-shaped through guide grooves in adjacent splicing configuration of the plurality of expandable frames form an H-shaped groove which is used for splicing and fastening the expandable frame through the H-shaped fasteners.
The size error and the shape and position error of the upper and lower fixed partition plates for positioning the array elements are respectively less than +/-0.001 mm in size error and less than 0.001mm in parallelism error, the upper and lower fixed partition plates are processed in a matched mode, positioned in a clamping mode and formed in a formed mode, and the upper and lower fixed partition plates and the lower fixed partition plates are matched for use when being assembled and packaged in an array mode and are used for improving optical scanning accuracy and effect.
The divergence angle of the array element light beam is less than or equal to 0.3mrad, and the inconsistency of the emergent light intensity of the array element is less than 5% under the same driving condition.
Organic silica gel for high temperature resistant, thermal conductivity ≧ 1.1 organic silica gel for laser diode's heat sink and array element metal casing adopt hot pressing assembly location after, with the embedment of drive circuit board, be fixed in metal casing in, metal casing be cylinder aluminium system shell.
The array element metal shell, the upper fixing clapboard and the lower fixing clapboard are positioned by compression joint and spot welding.
The socket comprises two power supply electrodes and a control signal electrode, the automatic identification circuit combined with the power supply polarity change circuit can be connected with an external power supply in a self-adaptive mode, the automatic identification circuit is not divided into a positive electrode and a negative electrode, and is universal in alternating current and direct current power supply, a grounding wire can be communicated in the array, and the array elements can be connected with the external circuit by adopting a three-wire system or a two-wire system.
The special packaging method greatly improves the heat dissipation effect of the device, can realize multi-beam phased array scanning laser irradiation by matching with the double-structure grating device, is applied to an optical phased array laser radar system, greatly reduces the rigorous requirement of the beam laser irradiation in the common optical phased array laser radar system on the structural miniaturization of the phase modulation device, and meanwhile, for an array laser irradiation light source, the failure of individual single semiconductor laser diodes cannot cause the integral failure of the array function, so that the reliability and the applicability of the device are greatly improved, and the application occasion of a laser detection technology is also expanded. The distributed laser source which can be applied to the optical phased array laser radar is further manufactured by utilizing the conventional common semiconductor laser diode device, array elements are independently packaged and controlled, a semi-I-shaped guide groove is formed in an array packaging metal frame, a plurality of arrays can rapidly form array components with different forms and sizes through I-shaped lock catches, and the array components are suitable for different application requirements.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural diagram of an array element according to the present invention;
FIG. 3 is a top view of the present invention;
FIG. 4 is a bottom view of the present invention;
FIG. 5 is a schematic diagram of a pre-driver circuit according to the present invention;
fig. 6 is a schematic view of the splicing structure of the present invention.
Detailed Description
As shown in fig. 1, 2 and 3, the present invention is formed by arranging an array of n rows × m columns of array elements 6 on an expandable frame 5, wherein the array elements 6 are individually packaged, and each array element 6 includes a clamping ring 14, a collimating lens 13, an adjusting gasket 12, a laser diode 11, a front-end driving circuit 9, a socket 7, a metal housing 8 and an organic silicon gel 10, and the socket 7 is fixed at one end of the metal housing 8 and connected with the front-end driving circuit 9; wherein, the light source, namely the laser diode 11, the adjusting shim 12 and the collimating lens 13 form a collimating correction link, and the adjustment within a certain range is carried out through the different thicknesses of the adjusting shim 12; the specially designed pre-drive circuit 9 has a power polarity identification function, can be connected with an external power source in a self-adaptive manner, and is universal for alternating current and direct current, wherein n and m are positive integers.
The array element 6 independently encapsulates the laser diode 11, the front driving circuit 9 and the collimating lens 13 into a single body, the array is not limited by the array form and the number of the array elements, so that the corresponding control methods of the working mode, the scanning, the correction and the like are relatively independent, the implementation of different technical routes is easy to realize, and the influence of the characteristics of individual array elements on the overall performance of the array is reduced to the minimum.
The laser diode 11 is a heat sink packaged laser diode, the heat sink packaged laser diode is fixed at the middle position in the metal shell 8, and a pin of the heat sink packaged laser diode is connected with the output end of the front driving circuit 9 and is encapsulated by organic silica gel 10; the collimating lens is fixedly arranged at the other end in the metal shell through an adjusting gasket and a pressing ring respectively;
the expandable frame comprises an upper fixed partition board 1 and a lower fixed partition board 2 which are arranged in parallel, n rows of x m columns of array elements 6 are vertically arrayed between the upper fixed partition board and the lower fixed partition board, the array elements 6 are parallel to each other, a socket end is arranged at the lower end, the intervals between the array elements are uniform and consistent, filling materials 3 are filled in the intervals, the filling materials 3 are mixtures of aluminum powder and silica gel, and the whole array light source is also packaged while filling; as shown in fig. 4, the array element 6 is connected with an external circuit by using a socket 7, the socket 7 comprises two electrodes of a power supply and one electrode of a control signal, the specially designed power supply polarity automatic identification circuit can be adaptively connected with an external power supply, no worry about wrong connection polarity (no positive pole or negative pole) exists, alternating current and direct current power supply are commonly used, and a grounding wire can be communicated in the array, so that the array element can be connected with the external circuit by using a three-wire system or a two-wire system. When the three wires are connected, the input power supply is a direct current constant voltage source and is used as a driving power supply of the semiconductor laser diode; the brightness of the semiconductor laser diode is independently controlled by a brightness adjusting signal, and the on/off of the field effect switching tube is controlled by changing the duty ratio or the frequency of the brightness adjusting signal to adjust the laser brightness.
When the two-wire system is connected, the brightness adjusting signal is invalid (grounded), the input power supply is an amplitude-variable direct-current voltage source, and the on-off of the voltage controls the on-off of the semiconductor laser diode; the magnitude of the power supply voltage amplitude regulates and controls the brightness of the semiconductor laser diode.
The drive circuit comprises a filter circuit and a drive and brightness control circuit, wherein the input end of the filter circuit is connected with the output end of the socket, the output end of the filter circuit is connected with the input end of the drive and brightness control circuit, and the output end of the drive and brightness control circuit is connected with the corresponding pin of the laser diode. The drive circuit also comprises a power supply polarity conversion circuit which is a rectification module and is used for converting direct current or alternating current with different polarities into direct current with determined polarity to be used as a power supply of a subsequent circuit. The filter circuit comprises a pre-filter and a post-filter which are respectively arranged at the input end and the output end of the rectifier module, and the pre-filter and the post-filter adopt capacitor filtering. The driving and brightness control circuit comprises a reference voltage, a comparator, a bias resistor R1, a calibration resistor R2, a current limiting resistor R3 and a field effect transistor, and is used for carrying out on-off control and brightness adjustment control on the load of the laser diode according to an external control signal.
As shown in fig. 5, the pre-driver circuit is composed of a socket 7, a jumper cap 4, a front filter, a polarity inversion circuit, a back filter, a reference voltage, a comparator, an offset, a feedback, a calibration, a field effect high-speed switch tube and a load (laser diode), wherein the input end of the rectifier circuit is connected in parallel with the front filter and then connected with a power input pin of the socket, and the output end of the polarity inversion circuit is connected in parallel with the back filter and then supplies power to a subsequent circuit; the input end of the reference voltage chip is connected with a socket brightness adjusting pin, the output end of the reference voltage chip is connected with the reference voltage input end of the comparator, the output end of the comparator is connected with the on/off of the field effect high-speed switching tube control pole control switch, the on/off and brightness adjustment of the semiconductor laser diode is achieved, and the reference voltage chip further comprises a bias circuit, a feedback circuit, a calibration circuit and a current limiting circuit. The front end is connected with an external circuit through a socket, and the rear end outputs to directly drive the semiconductor laser diode. The power input by the socket is filtered by C1 and then input into the input end of the rectifier module (equivalent to the polarity inversion), and the output end of the rectifier module is filtered by C2 and then supplies power to the comparator and the semiconductor laser diode. The external brightness adjusting signal is connected with the input end of the reference voltage module through the socket, the output end of the reference voltage module is connected with the voltage reference end of the comparator and used as the reference of brightness control, the output end of the comparator is connected with the grid of the field effect switch tube to control the on/off of the field effect switch tube, and the on/off control and the brightness adjustment of the semiconductor laser diode are realized. The rectification link has a power polarity self-regulation (also called self-adaption) function, so that an external power supply does not need to judge the positive pole and the negative pole, can be directly connected (no matter whether the polarity of the power supply applied to the input end of the rectification module is positive up and negative down, or positive up and negative down, the polarity of the voltage loaded on the C2 at the output end of the rectification module is still positive up and negative down, and a subsequent circuit works normally), and is simultaneously suitable for alternating current power supply.
As shown in fig. 6, the periphery of the side surface of the expandable frame 5 is further provided with a half-i-shaped through-type guide slot and an H-shaped fastener 15, each side surface of the expandable frame is provided with at least one half-i-shaped through-type guide slot at a relative position, and two corresponding half-i-shaped through-type guide slots form an H-shaped slot when the plurality of expandable frames are adjacently spliced and configured, so that the expandable frames are spliced and fastened by placing the H-shaped fastener. The annular built-in semi-I-shaped through guide groove is formed along the lower edge of the outer surface of the expandable frame, two array modules which are oppositely butted are connected and fixed by using the I-shaped lock catch when splicing and expanding are needed, the limitation of a splicing and expanding form is avoided, auxiliary elements and difficulty are not increased, and the array expansion is really equal to the parallel application of simple devices.
The array element 6 is connected with an external circuit through a socket 7, n rows of the array elements are positioned by an upper fixed clapboard and a lower fixed clapboard, the array elements are fixed and packaged in an expandable frame after adjustment, a laser array light source integrating driving, light emitting and collimation is formed, the array elements are packaged by organic silicon, the array elements are packaged by aluminum powder added with the organic silicon, and the array is particularly suitable for application occasions of optical phased array laser radars and the like
The size error and the shape and position error of the upper and lower fixed partition plates for positioning the array elements are respectively, the size error is less than +/-0.001 mm, the parallelism error is less than 0.001mm, the upper and lower fixed partition plates are required to be processed in a matched manner, clamped and positioned once and formed once, and the upper and lower fixed partition plates and the lower fixed partition plates are required to be used in a matched manner during array assembly and packaging so as to improve the optical scanning precision and effect. Because the relative position size and the axial parallelism index among the laser array light source array elements directly influence the optical scanning precision and effect, the precision requirement is strict. The parallelism error between the light beam axes of the array elements is less than or equal to 0.04mrad, and the perpendicularity error between the light beam axes and the bottom plane of the expandable frame is less than or equal to 0.01 mm.
When the array element 6 is packaged, the position of a collimating lens is adjusted through screening of a semiconductor laser diode, the light beam divergence angle of the array element is required to be less than or equal to 0.3mrad, the inconsistency of the emergent light intensity of the array element under the same driving condition is less than 5%, organic silica gel with high temperature resistance and thermal conductivity greater than or equal to 1.1 is adopted, after a heat sink for the laser diode and an array element metal shell are positioned by hot-press assembly, a driving circuit board is encapsulated and fixed in the metal shell 8, and the metal shell 8 is a cylindrical aluminum shell; when the array is packaged, the basic position of the array element is preset by an upper fixing clapboard and a lower fixing clapboard, then the parallelism between the optical axes of the light beams of each array element is accurately adjusted by a reflector, the parallelism error between the optical axes of the light beams of each array element is less than or equal to 0.04mrad, and the perpendicularity error between the optical axes of the light beams of each array element and the bottom plane of an expandable frame is less than or equal to 0.01mm, the array element is packaged in a rectangular expandable aluminum outer frame by adding a small amount of organic silica gel 3 with the thermal conductivity of more than or equal to 1.1 with aluminum powder, and when the laser array light source is used, pulse lasers with different pulse widths are selectively emitted.
The heat sink semiconductor laser diode and the array element metal shell 8 are positioned by hot-pressing assembly, and the array element metal shell and the upper and lower fixed clapboards are positioned by compression joint and spot welding, so that good electrical connection (small contact resistance) is ensured. After parallelism adjustment is completed, aluminum powder corresponding to different granularities is added with an organic silicon mixed material in a corresponding proportion to serve as an array encapsulating material, and the adjusted and fixed array elements, the upper fixed partition plate and the lower fixed partition plate are encapsulated in the expandable frame, so that the heat conduction performance among the heat sink, the array element shell, the upper fixed partition plate, the lower fixed partition plate and the expandable frame is greatly improved, the components are made to be good heat dissipation bodies of array devices, the process requirements of respectively adjusting and positioning each array element in the array assembly process are met, and the requirement of efficient heat dissipation of the whole array is met.
The method combines the monomer semiconductor laser diodes with small power and small size into a high-power laser array, adopts a special packaging method to greatly improve the heat dissipation effect of the device, is matched with a double-structure grating device, can realize multi-beam phased array scanning laser irradiation, is applied to an optical phased array laser radar system, greatly reduces the rigorous requirement of single-beam laser irradiation on the structural miniaturization of a phase modulation device in a common optical phased array laser radar system, and meanwhile, for an array laser irradiation light source, the integral failure of the array function cannot be caused by the failure of individual monomer semiconductor laser diodes, greatly improves the reliability and the applicability of the device, and also expands the application occasions of laser detection technology.
The preferred embodiments of the present invention will be described in detail below; it should be understood that the preferred embodiments are for purposes of illustration only and are not intended to limit the scope of the present invention.
The design of application column adopts, when adopting 8 x 8 array elements, go up fixed division board 1, lower fixed division board 2, but expanded frame 5 constitutes, wholly adopt encapsulating material 3 to pour into the encapsulation, array element 6 adopts the aluminum alloy shell structure, the size is about phi 3.7mm x 30mm, array element 6 encapsulates the shell with last, lower fixed division board passes through spot welding and is connected, the location, go up, the location of lower fixed division board as array element, the holding member, adopt aluminum alloy material, pair numerical control machine-shaping, the structure size is confirmed according to array element and array size. Inputting a control link, and selecting a 3-wire socket (ZH 1.0-3P) with small space; a voltage polarity conversion link, namely selecting a rapid rectification integrated chip (MP 6908GJ PD), and selecting C1= C2=0.22 μ F; a driving and brightness control link, wherein the reference voltage circuit selects LM1403, the comparator selects LM358, the high-speed switch circuit selects 2SJ461 field-effect transistor P channel-50V-100 mA, R1=1k, R2= R3=51 omega; and in the load driving link, a laser diode (GH series) with the wavelength of 980nm is selected, the outer diameter is 3.3mm, the length is 8.27mm, the driving voltage is less than or equal to 3.0V, and the output power is 120 mW. The collimating lens 13 is a molded glass aspheric lens with a diameter of 3.0mm and a focal length of 2.0 mm. The array element 6 packaging material 3 adopts high-heat-conductivity and high-temperature-resistant organic silica gel BS-333, the heat conductivity coefficient reaches 1.1, and the high temperature resistance is 250 ℃. The array packaging material is a mixed material of organic silica gel and aluminum powder, and the weight ratio of the aluminum powder to the organic silica gel BS-333 is 9: 1.
The invention applies a modular design method, the array elements are small modules which are independently packaged, and can be mutually replaced, produced in batches and debugged; the array element arrangement is suggested to adopt an n multiplied by n matrix form (or an n multiplied by m form), the array elements are fixed by upper and lower metal clapboards and then encapsulated in an expandable metal frame, and mixed materials are filled for sealing; when the two array modules are spliced for use, the corresponding half I-shaped guide grooves are oppositely butted to form a complete I-shaped guide groove, and the splicing and locking of the modules can be conveniently and rapidly completed by inserting the I-shaped lock catch without the limitation of the splicing number and shape.
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| CN110039048B (en) * | 2019-03-29 | 2021-05-04 | 西北大学 | Linear array high-speed laser 3D metal printer and its printing control method |
| EP3808663B1 (en) * | 2019-10-14 | 2024-03-27 | General Electric Company | Lighting system for an optical navigation beacon |
| CN113670347B (en) * | 2020-05-15 | 2022-06-21 | 大连理工大学 | A high-resolution quasi-distributed physical quantity measurement method, device and system |
| CN111844738B (en) * | 2020-06-30 | 2022-08-19 | 上海制驰智能科技有限公司 | Synchronous variable lens for SLM (Selective laser melting) surface exposure equipment and application |
| CN112034616B (en) * | 2020-08-31 | 2022-06-03 | 同济大学 | Variable lens for scalable low-energy laser ultra-high speed scanning and application |
| CN112034615B (en) * | 2020-08-31 | 2022-06-24 | 同济大学 | Control coding method, device and medium for variable lens for high-speed scanning |
| CN114193844B (en) * | 2021-11-23 | 2024-09-27 | 深圳市塬煌电子科技有限公司 | Chip detection film, manufacturing method thereof and detection method |
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| CN111193179A (en) * | 2020-03-06 | 2020-05-22 | 西安域视光电科技有限公司 | Laser unit and laser stack |
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| US6636538B1 (en) * | 1999-03-29 | 2003-10-21 | Cutting Edge Optronics, Inc. | Laser diode packaging |
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| CN203135207U (en) * | 2012-11-23 | 2013-08-14 | 南京长青激光科技有限责任公司 | Multi-beam array laser |
| CN107069434A (en) * | 2017-03-13 | 2017-08-18 | 西安炬光科技股份有限公司 | A kind of semiconductor laser stacks of mechanical connection |
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