CN109218589B - Imaging modules, camera components and electronic devices - Google Patents

Abstract

The present application provides an imaging module, a camera assembly and an electronic device. The imaging module includes a housing; and a reflective element, an image sensor, a lens assembly and a driving mechanism all arranged in the housing, the lens assembly being located between the reflective element and the image sensor; the driving mechanism is used to drive the lens assembly to move along the optical axis of the lens assembly so that the lens assembly can focus and image on the image sensor; the imaging module also includes a driving chip and a module circuit board, the driving chip is arranged on the outer side of the driving mechanism and is electrically connected to the driving mechanism, the module circuit board is electrically connected to the image sensor, and the module circuit board and the driving chip are respectively located on opposite sides of the housing. In the imaging module, camera assembly and electronic device of the embodiments of the present application, the driving chip is arranged on the outer side of the driving mechanism, and the module circuit board and the driving chip are respectively located on opposite sides of the housing, so that the structure of the imaging module is more compact, which is conducive to reducing the volume of the imaging module.

Description

Imaging modules, camera components and electronic devices

Technical Field

The present application relates to the field of electronic devices, and in particular to an imaging module, a camera assembly and an electronic device.

Background technique

In the related art, in order to improve the photographing effect of the mobile phone, the camera of the mobile phone adopts a periscope camera, and the periscope camera can, for example, triple the optical focal length to obtain a better quality image. The periscope camera includes a light-deflecting element, which is used to deflect the light incident into the periscope camera and transmit it to the image sensor so that the image sensor can obtain the image outside the periscope lens. The periscope camera also includes a driver chip for driving the periscope camera to work, and the driver chip causes the periscope camera to be larger in size.

Summary of the invention

In view of this, the present application provides an imaging module, a camera assembly and an electronic device.

The imaging module of the embodiment of the present application includes:

Housing; and

A reflective element, an image sensor, a lens assembly and a driving mechanism, all of which are arranged in the housing, wherein the lens assembly is located between the reflective element and the image sensor;

The housing has a light inlet, and the reflective element is used to redirect the incident light incident from the light inlet and transmit it to the image sensor after passing through the lens assembly so that the image sensor senses the incident light outside the imaging module;

The driving mechanism is used to drive the lens assembly to move along the optical axis of the lens assembly so that the lens assembly focuses and forms an image on the image sensor;

The imaging module also includes a driving chip and a module circuit board. The driving chip is arranged on the outer side of the driving mechanism and is electrically connected to the driving mechanism. The module circuit board is electrically connected to the image sensor. The module circuit board and the driving chip are respectively located on two opposite sides of the housing.

The camera assembly of the embodiment of the present application includes a first imaging module, a second imaging module and a third imaging module. The first imaging module is the imaging module described above, and the field of view of the third imaging module is greater than the field of view of the first imaging module and smaller than the field of view of the second imaging module.

The electronic device of the embodiment of the present application includes a body and a sliding module, wherein the sliding module is used to slide between a first position received in the body and a second position exposed from the body, and the camera assembly described above is disposed in the sliding module.

In the imaging module, camera assembly and electronic device of the embodiments of the present application, the driving chip is arranged on the outer side of the driving mechanism, and the module circuit board and the driving chip are respectively located on two opposite sides of the housing, which makes the structure of the imaging module more compact and helps to reduce the volume of the imaging module.

Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

FIG1 is a schematic diagram of a state of an electronic device according to an embodiment of the present application;

FIG2 is another schematic diagram of the electronic device in another state according to an embodiment of the present application;

FIG3 is a perspective schematic diagram of a camera assembly according to an embodiment of the present application;

FIG4 is a perspective schematic diagram of a first imaging module according to an embodiment of the present application;

FIG5 is another perspective schematic diagram of the first imaging module according to an embodiment of the present application;

FIG6 is an exploded schematic diagram of a first imaging module according to an embodiment of the present application;

FIG7 is a cross-sectional schematic diagram of a first imaging module according to an embodiment of the present application;

FIG8 is a partial cross-sectional schematic diagram of a first imaging module according to an embodiment of the present application;

FIG9 is a cross-sectional schematic diagram of a first imaging module according to another embodiment of the present application;

FIG. 10 is a perspective schematic diagram of a reflective element according to an embodiment of the present application.

FIG11 is a schematic diagram of light reflection imaging of an imaging module in the related art;

FIG12 is a schematic diagram of light reflection imaging of a first imaging module according to an embodiment of the present application;

FIG13 is a schematic diagram of the structure of an imaging module in the related art;

FIG14 is a schematic structural diagram of a first imaging module according to an embodiment of the present application;

FIG15 is a perspective schematic diagram of a bracket according to an embodiment of the present application;

FIG. 16 is a cross-sectional schematic diagram of the second imaging module according to an embodiment of the present application.

Description of main component symbols:

Electronic device 1000, body 110, sliding module 200, gyroscope 120;

Camera assembly 100, first imaging module 20, housing 21, light inlet 211, groove 212, top wall 213, side wall 214, avoidance hole 215, reflective element 22, light incident surface 222, backlight surface 224, light incident surface 226, light emitting surface 228, mounting seat 23, arc surface 231, first lens assembly 24, lens 241, moving element 25, clip 222, first image sensor 26, driving mechanism 27, driving device 28, arc guide rail 281, central axis 282, chip circuit board 201, mounting part 2011, connecting part 2022, driving chip 202, sensor circuit board 203, shielding cover 204, second imaging module 30, second lens assembly 31, second image sensor 32, third imaging module 40, bracket 50.

Detailed ways

The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and/or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and/or settings discussed. In addition, the various specific processes and examples of materials provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and/or the use of other materials.

Existing optical image stabilization methods usually require a separate camera gyroscope to be set in the imaging module to detect camera shake. At the same time, the imaging module includes a PCB circuit board on which a driving chip is set. As a result, the size of the imaging module with optical image stabilization is larger than that of an ordinary imaging module and cannot be reduced.

Referring to FIG. 1 and FIG. 2 , the electronic device 1000 of the embodiment of the present application includes a body 110 and a sliding module 200. The sliding module 200 is used to slide between a first position received in the body 110 and a second position exposed from the body 110. The camera assembly 100 and the gyroscope 120 are arranged in the sliding module 200, and the camera assembly 100 and the gyroscope 120 are arranged separately. The electronic device 1000 can be used to control the operation of the camera assembly 100 according to the feedback data of the gyroscope 120 to achieve optical image stabilization shooting.

In the above electronic device, the camera assembly 100 and the gyroscope 120 are separately arranged, which reduces the components in the camera assembly 100, thereby reducing the volume of the camera assembly 100. In addition, the camera assembly 100 and the gyroscope 120 are both arranged in the sliding module 200, so that the gyroscope 120 is relatively close to the camera assembly 100, and the gyroscope 120 can accurately detect the shaking of the camera assembly 100, thereby improving the anti-shake effect of the camera assembly 100.

Exemplarily, the electronic device 1000 can be any of various types of computer system devices that are mobile or portable and perform wireless communication (only one form is shown exemplarily in FIG. 1 ). Specifically, the electronic device 1000 can be a mobile phone or smart phone (e.g., a phone based on iPhone TM, an Android TM), a portable game device (e.g., Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), a laptop, a PDA, a portable Internet device, a music player, and a data storage device, other handheld devices, and devices such as watches, in-ear headphones, pendants, headphones, etc. The electronic device 1000 can also be other wearable devices (e.g., head-mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).

The electronic device 1000 can also be any one of a plurality of electronic devices, including but not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical equipment, vehicle transportation instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital assistants (PDAs), portable multimedia players (PMPs), Moving Picture Experts Group (MPEG-1 or MPEG-2) Audio Layer 3 (MP3) players, portable medical devices, and digital cameras and combinations thereof.

In some cases, the electronic device 1000 can perform multiple functions (e.g., play music, display video, store pictures, and receive and send phone calls). If desired, the electronic device 1000 can be a portable device such as a cellular phone, a media player, other handheld devices, a wristwatch device, a pendant device, a handset device, or other compact portable device.

As a typical sensor, the gyroscope 120 can be used to detect the axial linear motion of the electronic device 1000 and can measure the rotation and deflection motion. For example, the gyroscope 120 can detect the vertical or horizontal state of the electronic device 1000, and then the central processor of the electronic device 1000 can control the rotation of the display screen according to the acquired detection data.

In this embodiment, during imaging, the gyroscope 120 of the electronic device 1000 is used to detect the tiny shake generated by the camera assembly 100. The gyroscope 120 sends the detected shake data, such as the tilt angle caused by the shake of the camera assembly 100 and the offset caused by the tilt, to the processing chip of the electronic device 1000. The processing chip is, for example, the driving chip described below. The processing chip controls the components in the imaging module to move relative to the components generated by the camera assembly 100 according to the feedback data received from the gyroscope 120, thereby achieving anti-shake.

It can be understood that the gyroscope 120 of the electronic device 1000 is arranged at a position other than the camera assembly 100, thereby saving the space for arranging an independent gyroscope and a driving chip in the camera assembly 100. In this way, the size of the camera assembly 100 is similar to that of an ordinary camera assembly, and the gyroscope 120 of the electronic device 1000 can be used to achieve optical image stabilization, which effectively reduces the size of the camera assembly 100 while retaining the anti-shake function.

Specifically, referring to FIG. 1 and FIG. 2 , the body 110 further includes a top surface 1002 and a bottom surface 1003 disposed opposite to the top surface 1002. Generally, the top surface 1002 and the bottom surface 1003 may extend along the width direction of the body 110. That is, the top surface 1002 and the bottom surface 1003 are short sides of the electronic device 1000. The bottom surface 1003 is used to arrange connectors, microphones, speakers, etc. of the electronic device 1000.

The top of the body 110 is provided with a receiving groove 1004, which is recessed from the top of the body 110 to the inside of the body 110. The receiving groove 1004 can penetrate the side of the body 110. The sliding module 200 is slidably connected to the body 110 in the receiving groove 1004. In other words, the sliding module 200 is slidably connected to the body 110 to extend or retract the receiving groove 1004.

The sliding module 200 includes a top surface 2003, and when the sliding module 200 is in the first position, the top surface is substantially flush with the top end surface 1002. The sliding module 200 can be connected to a screw mechanism, and the screw mechanism can drive the sliding module 200 to slide between the first position and the second position.

It can be understood that when the sliding module 200 extends out of the receiving groove 1004, the camera assembly 100 is exposed outside the body 110. At this time, the camera assembly 100 can shoot normally.

3 , the camera assembly 100 includes a first imaging module 20 , a second imaging module 30 , and a third imaging module 40 . The first imaging module 20 includes a bracket 50 .

The first imaging module 20, the second imaging module 30 and the third imaging module 40 are all disposed in the bracket 50 and fixedly connected to the bracket 50. The bracket 50 can reduce the impact on the first imaging module 20, the second imaging module 30 and the third imaging module 40, and improve the service life of the first imaging module 20, the second imaging module 30 and the third imaging module 40.

In this embodiment, the bracket 50 is frame-shaped, and the bracket 50 surrounds the first imaging module 20 , the second imaging module 30 and the third imaging module 40 .

In this embodiment, the field of view FOV3 of the third imaging module 40 is greater than the field of view FOV1 of the first imaging module 20 and less than the field of view FOV2 of the second imaging module 30, that is, FOV1＜FOV3＜FOV2. In this way, the three imaging modules with different field of view angles enable the camera assembly 100 to meet the shooting requirements in different scenes.

In one example, the field of view FOV1 of the first imaging module 20 is 10-30 degrees, the field of view FOV2 of the second imaging module 30 is 110-130 degrees, and the field of view FOV3 of the third imaging module 40 is 80-110 degrees.

For example, the field of view FOV1 of the first imaging module 20 is 10 degrees, 12 degrees, 15 degrees, 20 degrees, 26 degrees or 30 degrees, etc. The field of view FOV2 of the second imaging module 30 is 110 degrees, 112 degrees, 118 degrees, 120 degrees, 125 degrees or 130 degrees, etc. The field of view FOV3 of the third imaging module 40 is 80 degrees, 85 degrees, 90 degrees, 100 degrees, 105 degrees or 110 degrees, etc.

Since the field of view FOV1 of the first imaging module 20 is relatively small, it can be understood that the focal length of the first imaging module 20 is relatively large, so the first imaging module 20 can be used to shoot distant scenes, thereby obtaining a clear distant image. The field of view FOV2 of the second imaging module 30 is relatively large, and it can be understood that the focal length of the second imaging module 30 is relatively short, so the second imaging module 30 can be used to shoot close scenes, thereby obtaining a partial close-up image of an object. The third imaging module 40 can be used to shoot objects normally.

In this way, through the combination of the first imaging module 20, the second imaging module 30 and the third imaging module 40, image effects such as background blur and local sharpening of the image can be obtained.

The first imaging module 20, the second imaging module 30 and the third imaging module 40 are arranged in parallel. In this embodiment, the first imaging module 20, the second imaging module 30 and the third imaging module 40 are arranged in a straight line. Further, the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40.

Due to the field of view angle factors of the first imaging module 20 and the third imaging module 40, in order to enable the first imaging module 20 and the third imaging module 40 to obtain images of better quality, the first imaging module 20 and the third imaging module 40 can be configured with optical image stabilization devices, and optical image stabilization devices are generally configured with more magnetic elements. Therefore, the first imaging module 20 and the third imaging module 40 can generate a magnetic field.

In this embodiment, the second imaging module 30 is located between the first imaging module 20 and the third imaging module 40, so that the first imaging module 20 and the third imaging module 40 can be kept away from each other, preventing the magnetic field formed by the first imaging module 20 and the magnetic field formed by the third imaging module 40 from interfering with each other and affecting the normal use of the first imaging module 20 and the third imaging module 40.

In other embodiments, the first imaging module 20 , the second imaging module 30 , and the third imaging module 40 may be arranged in an L shape.

The first imaging module 20 , the second imaging module 30 and the third imaging module 40 may be arranged at intervals, and two adjacent imaging modules may also be placed against each other.

In the first imaging module 20 , the second imaging module 30 and the third imaging module 30 , any one imaging module may be a black and white camera, an RGB camera or an infrared camera.

The processing chip of the electronic device 1000 is used to control the operation of the first imaging module 20 according to the feedback data of the gyroscope 120 to achieve optical image stabilization shooting.

Please refer to FIGS. 4-7 . In this embodiment, the first imaging module 20 includes a housing 21 , a reflective element 22 , a mounting seat 23 , a first lens assembly 24 , a moving element 25 , a first image sensor 26 and a driving mechanism 27 .

The reflective element 22, the mounting seat 23, the first lens assembly 24, and the moving element 25 are all arranged in the housing 21. The reflective element 22 is arranged on the mounting seat 23, and the first lens assembly 24 is fixed on the moving element 25. The moving element 25 is arranged on one side of the first image sensor 26. Further, the moving element 25 is located between the reflective element 22 and the first image sensor 26.

The driving mechanism 27 connects the moving element 25 and the housing 21. After the incident light enters the housing 21, it is deflected by the reflective element 22, and then passes through the first lens assembly 24 to reach the first image sensor 26, so that the first image sensor 26 obtains an external image. The driving mechanism 27 is used to drive the moving element 25 to move along the optical axis of the first lens assembly 24.

The housing 21 is generally in a square shape and has a light inlet 211, and incident light enters the first imaging module 20 from the light inlet 211. In other words, the reflective element 22 is used to redirect the incident light incident from the light inlet 211 and transmit it to the first image sensor 26 after passing through the first lens assembly 24 so that the first image sensor 26 senses the incident light outside the first imaging module 20.

Therefore, it can be understood that the first imaging module 20 is a periscope lens module, and compared with the vertical lens module, the height of the periscope lens module is smaller, thereby reducing the overall thickness of the electronic device 1000. The vertical lens module refers to a lens module whose optical axis is a straight line, or in other words, the incident light is transmitted to the photosensitive device of the lens module along the direction of the straight optical axis.

It can be understood that the light inlet 211 is exposed through the through hole 11 so that external light passes through the through hole 11 and enters the first imaging module 20 from the light inlet 211 .

6 , the housing 21 includes a top wall 213 and two opposite side walls 214 . The two side walls 214 are respectively extended from two side edges 2131 of the top wall 213 .

Therefore, it can be understood that the top wall 213 includes two opposite side edges 2131 , the number of side walls 214 is two, each side wall 214 extends from a corresponding side edge 2131 , or in other words, the side walls 214 are respectively connected to two opposite sides of the top wall 213 . The light inlet 211 is formed on the top wall 213 .

The reflective element 22 is a prism or a plane mirror. In one example, when the reflective element 22 is a prism, the prism can be a triangular prism, and the cross-section of the prism is a right triangle, wherein light is incident from one of the right-angled sides of the right triangle, and is reflected by the hypotenuse and then emitted from the other right-angled side. It can be understood that, of course, the incident light can be refracted by the prism and then emitted without reflection. The prism can be made of a material with good light transmittance, such as glass and plastic. In one embodiment, a reflective material such as silver can be coated on one of the surfaces of the prism to reflect the incident light.

It can be understood that when the reflective element 22 is a plane mirror, the plane mirror reflects the incident light to achieve redirection of the incident light.

For more information, please refer to FIG. 7 and FIG. 10 , the reflective element 22 has a light incident surface 222, a backlight surface 224, a reflective surface 226, and a light emitting surface 228. The light incident surface 222 is close to and faces the light inlet 211. The backlight surface 224 is away from the light inlet 211 and opposite to the light incident surface 222. The reflective surface 226 connects the light incident surface 222 and the backlight surface 224. The light emitting surface 228 connects the light incident surface 222 and the backlight surface 224. The reflective surface 226 is tilted relative to the light incident surface 222. The light emitting surface 228 is opposite to the reflective surface 226.

Specifically, during the light conversion process, the light passes through the light inlet 211 and enters the reflective element 22 from the light incident surface 222, is then reflected by the reflective surface 226, and finally reflects out of the reflective element 22 from the light emitting surface 228, completing the light conversion process. The backlight surface 224 and the mounting seat 23 are fixedly arranged to keep the reflective element 22 stable.

As shown in FIG. 11 , in the related art, due to the need to reflect incident light, the reflective surface 226a of the reflective element 22a is inclined relative to the horizontal direction, and the reflective element 22a is an asymmetric structure in the reflection direction of the light. Therefore, the actual optical area below the reflective element 22a is smaller than that above the reflective element 22a. It can be understood that the reflective surface 226a that is away from the light inlet reflects less or no light.

Therefore, referring to FIG. 12 , the reflective element 22 of the embodiment of the present application cuts off the corners away from the light inlet compared to the reflective element 22a in the related art. This not only does not affect the effect of the reflective element 22 in reflecting light, but also reduces the overall thickness of the reflective element 22 .

Please refer to FIG. 7 , in some embodiments, the light reflecting surface 226 is inclined at an angle α of 45 degrees relative to the light incident surface 222 .

In this way, the incident light is better reflected and converted, and a better light conversion effect is achieved.

The reflective element 22 can be made of a material with good light transmittance, such as glass or plastic. In one embodiment, a reflective material such as silver can be coated on one surface of the reflective element 22 to reflect incident light.

In some embodiments, the light incident surface 222 and the backlight surface 224 are disposed in parallel.

In this way, when the backlight surface 224 is fixed to the mounting base 23, the reflective element 22 can be kept stable, the light incident surface 222 is also flat, and the incident light forms a regular light path during the conversion process of the reflective element 22, so that the light conversion efficiency is better. Specifically, along the light incident direction of the light inlet 211, the cross-section of the reflective element 22 is roughly trapezoidal, or in other words, the reflective element 22 is roughly trapezoidal.

In some embodiments, the light incident surface 222 and the backlight surface 224 are both perpendicular to the light emitting surface 228 .

In this way, a relatively regular reflective element 22 can be formed, so that the optical path of the incident light is relatively straight, thereby improving the light conversion efficiency.

In some embodiments, the distance between the light incident surface 222 and the backlight surface 224 is in the range of 4.8-5.0 mm.

Specifically, the distance between the light incident surface 222 and the backlight surface 224 can be 4.85mm, 4.9mm, 4.95mm, etc. In other words, the distance range between the light incident surface 222 and the backlight surface 224 can be understood as the height of the reflective element 22 is 4.8-5.0mm. The reflective element 22 formed by the light incident surface 222 and the backlight surface 224 in the above distance range has a moderate volume and can be well fitted into the first imaging module 20, forming a more compact and miniaturized first imaging module 20, camera assembly 100 and electronic device 1000, meeting more consumer needs.

In some embodiments, the light incident surface 222 , the backlight surface 224 , the light reflecting surface 226 , and the light emitting surface 228 are all hardened to form a hardened layer.

When the reflective element 22 is made of glass or other materials, the reflective element 22 itself is relatively brittle. In order to improve the strength of the reflective element 22, the light incident surface 222, the backlight surface 224, the reflective surface 226 and the light emitting surface 228 of the reflective element 22 may be hardened. Furthermore, all surfaces of the reflective element may be hardened to further improve the strength of the reflective element. The hardening treatment may include infiltrating lithium ions, applying films to the above surfaces without affecting the light conversion of the reflective element 22, etc.

In one example, the reflective element 22 redirects the incident light incident from the light inlet 211 at an angle of 90 degrees. For example, the incident angle of the incident light on the emitting surface of the reflective element 22 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the reflective element 22 can redirect the incident light at other angles, such as 80 degrees, 100 degrees, etc., as long as the incident light can be redirected to reach the first image sensor 26.

In this embodiment, the number of the reflective element 22 is one, and the incident light is redirected once before being transmitted to the first image sensor 26. In other embodiments, the number of the reflective element 22 is multiple, and the incident light is redirected at least twice before being transmitted to the first image sensor 26.

The mounting seat 23 is used to mount the reflective element 22, or in other words, the mounting seat 23 is a carrier of the reflective element 22, and the reflective element 22 is fixed on the mounting seat 23. In this way, the position of the reflective element 22 can be determined, which is conducive to the reflective element 22 reflecting or refracting the incident light. The reflective element 22 can be fixed on the mounting seat 23 by adhesive bonding to achieve fixed connection with the mounting seat 23.

Please refer to FIG. 7 again. In one example, the mounting base 23 is movably disposed in the housing 21 . The mounting base 23 can rotate relative to the housing 21 to adjust the direction in which the reflective element 22 redirects the incident light.

The mounting seat 23 can drive the reflective element 22 to rotate in the opposite direction of the shaking of the first imaging module 20, so as to compensate for the incident deviation of the incident light of the light inlet 211 and achieve the effect of optical image stabilization.

The first lens assembly 24 is accommodated in the moving element 25. Furthermore, the first lens assembly 24 is disposed between the reflective element 22 and the first image sensor 26. The first lens assembly 24 is used to image the incident light onto the first image sensor 26. In this way, the first image sensor 26 can obtain an image with better quality.

When the first lens assembly 24 moves as a whole along its optical axis, an image can be formed on the first image sensor 26, thereby realizing the focusing of the first imaging module 20. The first lens assembly 24 includes a plurality of lenses 241. When at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, thereby realizing the zoom function of the first imaging module 20. Furthermore, the driving mechanism 27 drives the moving element 25 to move in the housing 21 to achieve the zooming purpose.

In the example of FIG7 , in some embodiments, the moving element 25 is cylindrical, and the plurality of lenses 241 in the first lens assembly 24 are fixed in the moving element 25 at intervals along the axial direction of the moving element 25. As in the example of FIG9 , the moving element 25 includes two clips 252, and the two clips 252 clamp the lenses 241 between the two clips 252.

It can be understood that since the moving element 25 is used to fix multiple lenses 241, the required length of the moving element 25 is relatively large, and the moving element 25 can be cylindrical, square cylindrical, or other shapes with a certain cavity. In this way, the moving element 25 is in a cylindrical shape, which can better arrange multiple lenses 241 and better protect the lenses 241 in the cavity, so that the lenses 241 are not easy to shake.

In addition, in the example of Figure 9, the moving element 25 clamps multiple lenses 241 between two clips 252, which not only has a certain stability, but also can reduce the weight of the moving element 25, and can reduce the power required for the driving mechanism 27 to drive the moving element 25. The design difficulty of the moving element 25 is also relatively low, and the lenses 241 are also easier to set on the moving element 25.

Of course, the moving element 25 is not limited to the above-mentioned cylindrical shape and two clips 252. In other embodiments, the moving element 25 may include three, four or more clips 252 to form a more stable structure, or a simpler structure such as one clip 252; or various regular or irregular shapes such as a rectangular body, a circular body, etc. with a cavity to accommodate the lens 241. The specific selection can be made under the premise of ensuring the normal imaging and operation of the imaging module 10.

The first image sensor 26 may be a complementary metal oxide semiconductor (CMOS) photosensitive element or a charge-coupled device (CCD) photosensitive element.

In some embodiments, the driving mechanism 27 is an electromagnetic driving mechanism, a piezoelectric driving mechanism, or a memory alloy driving mechanism.

Specifically, the electromagnetic drive mechanism includes a magnetic field and a conductor. If the magnetic field moves relative to the conductor, an induced current will be generated in the conductor. The induced current causes the conductor to be affected by the Ampere force, and the Ampere force causes the conductor to move. The conductor here is the part of the electromagnetic drive mechanism that drives the moving element 25 to move; the piezoelectric drive mechanism is based on the inverse piezoelectric effect of piezoelectric ceramic materials: if voltage is applied to the piezoelectric material, mechanical stress is generated, that is, conversion occurs between electrical energy and mechanical energy, and rotation or linear motion is generated by controlling its mechanical deformation, which has the advantages of simple structure and low speed.

The driving of the memory alloy driving mechanism is based on the characteristics of shape memory alloy: shape memory alloy is a special alloy. Once it is made to remember any shape, even if it is deformed, when heated to a certain appropriate temperature, it can return to its shape before deformation, thereby achieving the purpose of driving. It has the characteristics of rapid displacement and free direction.

Please refer to FIG. 7 again. Further, the first imaging module 20 further includes a driving device 28, which is used to drive the mounting seat 23 with the reflective element 22 to rotate around the rotation axis 29. The driving device 28 is used to drive the mounting seat 23 to move axially along the rotation axis 29. The rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the light sensing direction of the first image sensor 26, so that the first imaging module 20 realizes optical image stabilization in the axial direction of the optical axis of the light inlet 211 and the rotation axis 29.

In this way, since the volume of the reflective element 22 is smaller than that of the lens barrel, the driving device 28 drives the mounting seat 23 to move in two directions, which can not only achieve the optical image stabilization effect of the first imaging module 20 in two directions, but also make the volume of the first imaging module 20 smaller.

6-7 , for the convenience of description, the width direction of the first imaging module 20 is defined as the X direction, the height direction is defined as the Y direction, and the length direction is defined as the Z direction. Therefore, the optical axis of the light inlet 211 is the Y direction, the photosensing direction of the first image sensor 26 is the Z direction, and the axial direction of the rotation axis 29 is the X direction.

The driving device 28 drives the mounting seat 23 to rotate, so that the reflective element 22 rotates around the X direction, so that the first imaging module 20 achieves the effect of optical image stabilization in the Y direction. In addition, the driving device 28 drives the mounting seat 23 to move axially along the rotation axis 29, so that the first imaging module 20 achieves the effect of optical image stabilization in the X direction. In addition, the first lens assembly 24 can be moved along the Z direction to achieve the focus of the first lens assembly 24 on the first image sensor 26.

Specifically, when the reflective element 22 rotates about the X direction, the light reflected by the reflective element 22 moves in the Y direction, so that the first image sensor 26 forms different images in the Y direction to achieve the anti-shake effect in the Y direction. When the reflective element 22 moves along the X direction, the light reflected by the reflective element 22 moves in the X direction, so that the first image sensor 26 forms different images in the X direction to achieve the anti-shake effect in the X direction.

In some embodiments, the driving device 28 is formed with an arc guide rail 281, and the driving device 28 is used to drive the mounting seat 23 to rotate around the central axis 282 of the arc guide rail 281 and move axially along the central axis 282, and the central axis 2282 coincides with the rotation axis 29.

It can be understood that the driving device 28 is used to drive the mounting seat 23 to rotate along the arc-shaped guide rail 281 around the central axis 282 of the arc-shaped guide rail 281 and to move axially along the central axis 282 .

In this way, since the driving device 28 uses the arc guide rail 281 to drive the mounting base 23 with the reflective element 22 to rotate together, the friction between the driving device 28 and the mounting base 23 is small, which is conducive to the smooth rotation of the mounting base 23 and improves the optical image stabilization effect of the first imaging module 20.

Specifically, please refer to Figure 13. In the related art, the mounting base (not shown) is rotatably connected to the rotating shaft 23a, and the mounting base rotates around the rotating shaft 23a to drive the reflective element 22a to rotate together. Assume that the friction force is f1, the radius of the rotating shaft 23a is R1, the thrust is F1, and the rotation radius is R1. Then the ratio of friction torque to thrust torque K1 is K1=f1R1/F1A1. Since the reflective element 22a only needs to rotate slightly, F1 cannot be too large; and the imaging module itself needs to be thin and short, which leads to the size of the reflective element 22a cannot be too large, and the space for A to be enlarged is also limited, which makes it impossible to further eliminate the influence of friction.

Please refer to Figure 14, and in this application, the mounting seat 23 rotates along the arc guide rail 281, and the radius of the arc guide rail 281 is R2. At this time, the ratio K2 of the friction torque and the rotation torque is K2 = f2R2/F2A. When f2, R2, and F2 do not change significantly, due to the use of an orbital swinging method for rotation, the corresponding thrust torque becomes R2, and R2 may not be limited by the size of the reflective element 22, and may even be several times greater than R1. Therefore, in this case, the influence of friction on the rotation of the reflective element 22 can be greatly reduced (the size of K2 is reduced), thereby improving the rotation accuracy of the reflective element 22, so that the optical image stabilization effect of the first imaging module 20 is better.

Referring to Fig. 7, in some embodiments, the mounting seat 23 includes an arcuate surface 231, which is concentrically arranged with the arcuate guide rail 281 and cooperates with the arcuate guide rail 281. In other words, the center of the arcuate surface 231 coincides with the center of the arcuate guide rail 281. This makes the mounting seat 23 and the driving device 28 cooperate more compactly.

In some embodiments, the central axis 282 is located outside the first imaging module 20. In this way, the radius R2 of the arc-shaped guide rail 281 is relatively large, which can reduce the adverse effect of friction on the rotation of the mounting seat 23.

In some embodiments, the driving device 28 is located at the bottom of the housing 21. In other words, the driving device 28 and the housing 21 are an integral structure. In this way, the structure of the first imaging module 20 is more compact.

In some embodiments, the driving device 28 drives the mounting base 23 to rotate by electromagnetic means. In one example, the driving device 28 is provided with a coil, and an electromagnetic sheet is fixed on the mounting base 23. When the coil is energized, the coil can generate a magnetic field to drive the electromagnetic sheet to move, thereby driving the mounting base 23 and the reflective element to rotate together.

Of course, in other embodiments, the driving device 28 can drive the mounting seat 23 to move by piezoelectric driving or memory alloy driving. The piezoelectric driving and memory alloy driving methods are described above and will not be described in detail here.

Please refer to Figures 4 to 6 and 8 again. The first imaging module 20 also includes a driving chip 202 and a module circuit board 210. The driving chip 202 is arranged on the outer side of the driving mechanism 27 and is electrically connected to the driving mechanism 27. The module circuit board 210 is electrically connected to the first image sensor 26. The module circuit board 210 and the driving chip 202 are respectively located on two opposite sides of the housing 21.

In this way, the driving chip 202 is arranged on the side of the driving mechanism 27, and the module circuit board 210 and the driving chip 202 are respectively located on the opposite sides of the shell 21, which makes the structure of the first imaging module 20 more compact and helps to reduce the volume of the first imaging module 20.

Specifically, the driving chip 202 is used to control the driving mechanism 27 to drive the moving element 25 to move along the optical axis of the first lens assembly 24, so that the first lens assembly 24 is focused on the first image sensor 26. The driving chip 202 is used to control the driving device 28 to drive the mounting seat 23 with the reflective element 22 to rotate around the rotation axis 29 according to the feedback data of the gyroscope 120. The driving chip 202 is also used to control the driving device 28 to drive the mounting seat 23 to move axially along the rotation axis 29 according to the feedback data of the gyroscope 120.

The driving chip 202 is also used to control the driving device 28 to drive the mounting seat 23 to rotate around the central axis 282 of the arc guide rail 281 and move axially along the central axis 282 according to the feedback data of the gyroscope 120 .

The module circuit board 210 is used to connect with external components. For example, the module circuit board 210 is connected to the main board of the electronic device 1000, and the battery of the electronic device 1000 provides power to the first imaging module 20 through the main board. The first image sensor 26 can transmit the sensing data to the processor of the electronic device 1000 through the module circuit board 210, so that the processor can obtain external image data after analyzing the sensing data.

4 and 5, the driver chip 202 is located at the front side of the housing 21, and the module circuit board 210 is located at the rear side of the housing 21. In the embodiment of FIG6, the module circuit board 210 is located at the front side of the housing 21, and the driver chip 202 is located at the rear side of the housing 21.

Referring to FIG. 4 and FIG. 7 , in some embodiments, the housing 21 is formed with an avoidance hole 215, and the driver chip 202 is at least partially located in the avoidance hole 215, so as to be exposed from the housing 21. In this way, there is an overlapping portion between the driver chip 202 and the housing 21, which makes the structure between the driver chip 202 and the housing 21 more compact, and can further reduce the volume of the first imaging module 20.

It can be understood that when there is a gap between the outer side of the driving mechanism 27 and the housing 21, or the thickness of the driving chip 202 is greater than the thickness of the housing 21, the driving chip 202 is partially located in the avoidance hole 215 in the thickness direction of the driving chip 202. When the outer side of the driving mechanism 27 is in contact with the housing 21 and the thickness of the driving chip 202 is less than the thickness of the housing 21, the driving chip 202 is completely located in the avoidance hole 215.

Preferably, the shape and size of the avoidance hole 215 match the shape and size of the driver chip 202. For example, the size of the avoidance hole 215 is slightly larger than the size of the driver chip 202, and the shape of the avoidance hole 215 is the same as that of the driver chip 202.

In this embodiment, the avoidance hole 215 is formed on one of the side walls 214 of the housing 21, and the module circuit board 210 is partially attached to the other side wall 214 of the housing 21. It can be understood that the avoidance hole 215 passes through the inside and outside of the side wall 214.

In one example, the module circuit board 210 can be fixed to the side wall 214 by gluing, welding, etc. It should be noted that a portion of the module circuit board 210 is fixedly connected to the side wall 214, and an end of the module circuit board 210 away from the side wall 214 is used to connect to external components.

Please refer to Figures 6 and 7. In some embodiments, the first imaging module 20 also includes a chip circuit board 201, which is fixed to the outer side of the driving mechanism 27. The driving chip 202 is fixed to the side of the chip circuit board 201 away from the outer side of the driving mechanism 27. The driving chip 202 is electrically connected to the driving mechanism 27 through the chip circuit board 201. The chip circuit board 201 is located on the inner side of the side wall 214.

Thus, the chip circuit board 201 makes it easy for the driving chip 202 to be electrically connected to the driving mechanism. The chip circuit board 201 is located inside the side wall 214 . It can be understood that the chip circuit board 201 is located inside the housing 21 .

In one embodiment, the first imaging module 20 further includes a shielding cover 204, which is fixed to the chip circuit board 201 and covers the driver chip 202. In this way, the shielding cover 204 can protect the driver chip 202 and prevent the driver chip 202 from being subjected to physical impact. In addition, the shielding cover 204 can also reduce the electromagnetic influence on the driver chip 202.

The shielding cover 204 can be made of metal material, for example, stainless steel.

In this embodiment, the first imaging module 20 includes a sensor circuit board 203, the first image sensor 26 is fixed to the sensor circuit board 203, the chip circuit board 201 includes a mounting portion 2011 and a connecting portion 2022, the mounting portion 2011 is fixed to the side of the driving mechanism 27, the driving chip 202 is fixed to the mounting portion 2011, and the connecting portion 2022 connects the mounting portion 2011 and the sensor circuit board 203. The chip circuit board 201 is fixed to the mounting portion 2011. The module circuit board 210 is connected to the sensor circuit board 203.

In this way, the driving chip 202 can be electrically connected to the first image sensor 26 through the sensor circuit board 203. Specifically, the connecting portion 2022 can be fixedly connected to the sensor circuit board 203 by welding.

In one example, when assembling the first imaging module 20, the driving chip 202 can be first fixed on the chip circuit board 201, and then the chip circuit board 201 with the driving chip 202 can be connected to the sensor circuit board 203 by welding, and finally the chip circuit board 201 with the driving chip 202 can be fixed on the outer side of the driving mechanism 27.

The chip circuit board 201 can be fixedly connected to the driving mechanism 27 by welding, bonding, etc.

It should be pointed out that the chip circuit board 201 being fixed to the outer side of the driving mechanism 27 may mean that the chip circuit board 201 is in contact and fixed with the outer side of the driving mechanism 27, or may mean that the chip circuit board 201 is fixedly connected to the outer side of the driving mechanism 27 via other components.

In one embodiment, the module circuit board 210 and the sensor circuit board 203 are an integrated structure. For example, the sensor circuit board 203 is a rigid circuit board, the module circuit board 210 is a flexible circuit board, and the module circuit board 210 and the sensor circuit board 203 are connected to form an integrated rigid-flexible board.

In this embodiment, the mounting portion 2011 is a rigid circuit board, the connecting portion 2022 is a flexible circuit board, and the mounting portion 2011 is attached to the outer side surface of the driving mechanism 27 .

Thus, the mounting portion 2011 is a rigid circuit board, so that the mounting portion 2011 has good rigidity and is not easily deformed, which is conducive to the fixed connection between the mounting portion 2011 and the outer side of the driving mechanism 27. The mounting portion 2011 can be attached to the outer side of the driving mechanism 27 by bonding. In addition, the connecting portion 2022 is a flexible circuit board, so that the chip circuit board 201 is easy to deform, so that the chip circuit board 201 is easy to be installed on the side of the driving mechanism 27.

Of course, in other embodiments, the mounting portion 2011 may also be a flexible circuit board. In this embodiment, preferably, the mounting portion 2011 is preferably a rigid circuit board or a plate material combining a flexible circuit board and a reinforcing plate. In this way, the mounting portion 2011 is convenient for mounting the driver chip 202 and the shielding cover 204.

3 and 15 , in some embodiments, the shielding cover 204 protrudes from the housing 21 , and the bracket 50 surrounds the housing 21 . The bracket 50 is formed with a receiving groove 51 for avoiding the shielding cover 204 , and the shielding cover 204 is located in the receiving groove 51 .

In this way, the receiving groove 51 allows the shielding cover 204 to extend into the bracket 50 , which can make the structure of the first imaging module 20 more compact and help to further reduce the volume of the first imaging module 20 .

Specifically, the receiving groove 51 may be in a square, circular, etc. Preferably, the receiving groove 51 penetrates the side of the bracket 50 facing the housing 21 and the side of the bracket 50 facing away from the housing 21 .

Please refer to FIG. 16 . In the present embodiment, the second imaging module 30 is a vertical lens module. Of course, in other embodiments, the second imaging module 30 may also be a periscope lens module.

The second imaging module 30 includes a second lens assembly 31 and a second image sensor 32 . The second lens assembly 31 is used to image the light on the second image sensor 32 . The incident optical axis of the second imaging module 30 coincides with the optical axis of the second lens assembly 31 .

In this embodiment, the second imaging module 30 may be a fixed-focus lens module. Therefore, the second lens assembly 31 has fewer lenses 241 , so that the height of the second imaging module 30 is relatively low, which is beneficial for reducing the thickness of the electronic device 1000 .

The type of the second image sensor 32 may be the same as that of the first image sensor 26 , and will not be described in detail herein.

The structure of the third imaging module 40 is similar to that of the second imaging module 30. For example, the third imaging module 40 is also a vertical lens module. Therefore, the features of the third imaging module 40 refer to the features of the second imaging module 40, which will not be repeated here.

In summary, the first imaging module 20 includes a housing 21, a reflective element 22, a first lens assembly 24, a first image sensor 26, and a driving mechanism 27. The reflective element 22, the first lens assembly 24, the motion element 25, the first image sensor 26, and the driving mechanism 27 are all disposed in the housing 21. The first lens assembly 24 is located between the reflective element 22 and the first image sensor 26.

The housing 21 has a light inlet 211 . The reflective element 22 is used to redirect the incident light incident from the light inlet 211 and transmit it to the first image sensor 26 after passing through the first lens assembly 24 so that the first image sensor 26 senses the incident light outside the first imaging module 20 .

The driving mechanism 27 is used to drive the lens assembly 24 to move along the optical axis of the lens assembly 24 so that the lens assembly 24 is focused and imaged on the first image sensor 26;

The first imaging module 20 also includes a driving chip 202 and a module circuit board 210. The driving chip 202 is arranged on the outer side of the driving mechanism 27 and is electrically connected to the driving mechanism 27. The module circuit board 210 is electrically connected to the first image sensor 26. The module circuit board 210 and the driving chip 202 are respectively located on two opposite sides of the housing 21.

In the first imaging module 20 of the present application, the driving chip 202 is arranged on the side of the driving mechanism 27, and the module circuit board 210 and the driving chip 202 are respectively located on two opposite sides of the shell 21, so that the structure of the first imaging module 20 is more compact, which is conducive to reducing the volume of the first imaging module 20.

In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims (14)

1. An imaging module, comprising: Housing; and A reflective element, an image sensor, a lens assembly and a driving mechanism, all of which are arranged in the housing, wherein the lens assembly is located between the reflective element and the image sensor; The housing has a light inlet, and the reflective element is used to redirect the incident light incident from the light inlet and transmit it to the image sensor after passing through the lens assembly so that the image sensor senses the incident light outside the imaging module; The driving mechanism is used to drive the lens assembly to move along the optical axis of the lens assembly so that the lens assembly focuses and forms an image on the image sensor; The imaging module further includes a driving chip and a module circuit board, wherein the driving chip is arranged on the outer side of the driving mechanism and is electrically connected to the driving mechanism, and the module circuit board is electrically connected to the image sensor, and the module circuit board and the driving chip are respectively located on two opposite sides of the housing; the housing is formed with an avoidance hole, and the driving chip is at least partially located in the avoidance hole; The imaging module further comprises a moving element, the moving element is cylindrical, and a plurality of lenses in the lens assembly are fixed in the moving element at intervals along the axial direction of the moving element; or The moving element comprises two clips, and the lens assembly is clamped between the two clips. 2. The imaging module as described in claim 1 is characterized in that the outer shell includes a top wall and two opposite side walls, the two side walls are respectively extended from the side edges of the top wall, the avoidance hole is formed in one of the side walls, and the module circuit board is partially attached to the other side wall of the outer shell. 3. The imaging module as described in claim 2 is characterized in that the imaging module also includes a chip circuit board, the chip circuit board is fixed on the outer side of the driving mechanism, the driving chip is fixed on the side of the chip circuit board away from the outer side of the driving mechanism, the driving chip is electrically connected to the driving mechanism through the chip circuit board, and the chip circuit board is located on the inner side of the side wall. 4 . The imaging module according to claim 3 , further comprising a shielding cover fixed to the chip circuit board and covering the driving chip. 5. The imaging module as described in claim 4 is characterized in that the shielding cover protrudes from the outer shell, the imaging module includes a bracket surrounding the outer shell, the bracket is formed with a receiving groove for avoiding the shielding cover, and the shielding cover is located in the receiving groove. 6. The imaging module as described in claim 4 is characterized in that the imaging module includes a sensor circuit board, the image sensor is fixed on the sensor circuit board, the chip circuit board includes a mounting part and a connecting part, the mounting part is fixed to the outer side of the driving mechanism, the driving chip is fixed to the mounting part, the connecting part connects the mounting part and the sensor circuit board, the shielding cover is fixed to the mounting part, and the module circuit board is connected to the sensor circuit board. 7. The imaging module according to claim 6, characterized in that the mounting portion is a rigid circuit board, the connecting portion is a flexible circuit board, and the mounting portion is attached to the outer side surface of the driving mechanism. 8. A camera assembly, characterized in that it includes a first imaging module, a second imaging module and a third imaging module, wherein the first imaging module is the imaging module described in any one of claims 1 to 7, and the field of view angle of the third imaging module is greater than the field of view angle of the first imaging module and smaller than the field of view angle of the second imaging module. 9. The camera assembly as described in claim 8, characterized in that the first imaging module, the second imaging module and the third imaging module are arranged in a straight line, and the second imaging module is located between the first imaging module and the third imaging module. 10. An electronic device, comprising: ontology; A sliding module, the sliding module is used to slide between a first position housed in the main body and a second position exposed from the main body, and the camera assembly according to claim 8 or 9 is arranged in the sliding module. 11. The electronic device according to claim 10, wherein a gyroscope is disposed in the sliding module, and the camera assembly is disposed separately from the gyroscope; The driving chip is used to control the camera assembly to operate according to the feedback data of the gyroscope to achieve optical image stabilization shooting, and the driving chip is used to control the first imaging module to operate according to the feedback data of the gyroscope to achieve optical image stabilization shooting. 12. The electronic device as described in claim 11 is characterized in that the first imaging module also includes a mounting base, the reflective element is fixed on the mounting base, and the driving chip is used to control the driving device to drive the mounting base with the reflective element to rotate around a rotation axis according to feedback data of the gyroscope, so as to achieve optical image stabilization in the direction of the optical axis of the light inlet, and the rotation axis is perpendicular to the optical axis of the light inlet. 13. The electronic device as described in claim 12 is characterized in that the driving device forms an arc-shaped guide rail, and the driving chip is used to control the driving device according to the feedback data of the gyroscope to drive the mounting seat to rotate along the arc-shaped guide rail around the central axis of the arc-shaped guide rail, and the central axis coincides with the rotation axis. 14 . The electronic device as claimed in claim 13 , wherein the mounting seat comprises an arcuate surface which is arranged concentrically with the arcuate guide rail and matches with the arcuate guide rail.