CN109244805A - Phase-change thermal control system and method for high-power laser diode pumping source array - Google Patents
Phase-change thermal control system and method for high-power laser diode pumping source array Download PDFInfo
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- CN109244805A CN109244805A CN201811301984.1A CN201811301984A CN109244805A CN 109244805 A CN109244805 A CN 109244805A CN 201811301984 A CN201811301984 A CN 201811301984A CN 109244805 A CN109244805 A CN 109244805A
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- 239000004317 sodium nitrate Substances 0.000 claims description 2
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Inorganic materials [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 2
- 235000010344 sodium nitrate Nutrition 0.000 claims description 2
- 239000001488 sodium phosphate Substances 0.000 claims description 2
- 229910000162 sodium phosphate Inorganic materials 0.000 claims description 2
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 2
- 238000005485 electric heating Methods 0.000 claims 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/102—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation
- H01S3/1028—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling the active medium, e.g. by controlling the processes or apparatus for excitation by controlling the temperature
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lasers (AREA)
- Semiconductor Lasers (AREA)
Abstract
本发明属于激光器技术领域，提供了一种高功率激光二极管泵浦源阵列的相变热控系统及方法，解决现有激光二极管阵列使用寿命短和可靠性差的问题。其中系统包括热沉、相变材料、相变增强材料、散热器、信息数据采集及处理模块、设在热沉上的加热元件和测温元件，热沉为空腔结构，激光二极管阵列通过热沉上表面的热界面材料设置在热沉上，相变增强材料为填充在热沉空腔内带空隙的导热增强体，并与热沉内表面整体接触充分，相变材料的熔点在激光二极管正常工作范围之内，相变材料填充于导热增强体的空隙中，散热器设置在热沉的下表面，信息数据采集及处理模块分别与加热元件、测温元件连接。
The invention belongs to the technical field of lasers, provides a phase-change thermal control system and method for a high-power laser diode pumping source array, and solves the problems of short service life and poor reliability of the existing laser diode array. The system includes a heat sink, a phase change material, a phase change enhancement material, a heat sink, an information data acquisition and processing module, a heating element and a temperature measuring element arranged on the heat sink, the heat sink is a cavity structure, and the laser diode array passes the heat The thermal interface material on the upper surface of the sink is arranged on the heat sink. The phase change reinforcing material is a thermally conductive reinforcing body filled with voids in the heat sink cavity and is in full contact with the inner surface of the heat sink. The melting point of the phase change material is the same as that of the laser diode. Within the normal working range, the phase change material is filled in the voids of the thermal conductivity enhancer, the radiator is arranged on the lower surface of the heat sink, and the information data acquisition and processing modules are respectively connected with the heating element and the temperature measuring element.
Description
Technical field
The invention belongs to field of laser device technology, and in particular to a kind of phase transformation of high-power laser diode pumping source array
Heat control system and method.
Background technique
Laser chief component is resonant cavity, pumping source and operation material.The effect of pumping source is to laser work
Substance is motivated, and activation particle is pumped into high level from ground state, to realize population inversion.Common pump mode includes
Electric pump, chemical pumping, optical pumping and four kinds of pneumatic pump, wherein optical pumping and electric pump mode are most widely used,
Electric pump mode is commonly applied in gas laser as driving source, and optical pumping mode is then widely used in solid and liquid laser
Driving source is used as in device.Optical pumping is to irradiate operation material with light beam, makes the energy of the particle absorption photon in operation material
And be excited on high level, laser diode (the Laser Diode abbreviation LD) one kind of pumping source as optical pumping, there is effect
Many advantages, such as rate is high, and noise is lower, and frequency stabilization, the service life is long, compact-sized is often used as in optical fiber laser as pump
Pu source.
The operation material of optical fiber laser is generally doped fiber, and resonant cavity is generally fiber grating, fiber end face, annular
Mirror etc. is convenient for using the optical pumping mode of LD by coupling pump light entering light fibre, and fiber core itself is superfine, makes itself more to hold
The accumulation for easily forming high level population, laser diode, which is formed array then, can excite the high-power laser of generation to export.Light
Fibre laser is mounted on satellite the effects of free optic communication in space, space early warning can be achieved.
The working method of diode laser matrix is interval, and in the operating condition, each laser diode carries out electric light
When conversion, a part of energy is converted into thermal energy, conducts to the shell of laser diode, if laser diode heat dissipation is too late
When, it will cause junction temperature raising, so that the threshold current density of laser diode be made to increase, electro-optical efficiency is reduced, laser wave
It is long that serious temperature drift occurs, therefore for diode laser matrix, heat dissipation problem is a problem to be solved, and seriously affects laser
The service life and reliability of diode.
Summary of the invention
In order to solve the problems, such as that existing diode laser matrix service life is short and poor reliability, the present invention provides one kind
The phase transformation thermal control system and method for high-power laser diode pumping source array.
To achieve the above object, present invention provide the technical scheme that
A kind of phase transformation heat control system of high-power laser diode pumping source array, be characterized in that including it is heat sink,
Phase-change material, phase transformation reinforcing material, radiator and active heating unit；
Described heat sink for cavity structure, the thermal interfacial material that diode laser matrix passes through heat sink upper surface is arranged heat sink
On；The phase transformation reinforcing material is to be filled in the enhanced thermal conduction body with gap in heat sink cavity, and integrally connect with heat sink inner surface
Touching is abundant；The phase-change material is filled in and leads within laser diode normal range of operation by the fusing point of the phase-change material
In the gap of hot reinforcement；Heat sink lower surface is arranged in the radiator；The active heating unit includes heating element, surveys
Warm element, information data acquisition and processing module；The heating element, temperature element are arranged on heat sink, and heating element is used
It is heated in heat sink, temperature element is for measuring heat sink temperature；Information data acquisition and processing module respectively with
Heating element, temperature element connection, temperature element transmit a signal to information data acquisition and processing module, information data acquisition
And the work of processing module control heating element.
Further, enhanced thermal conduction body is the foam copper with gap, and porosity is not less than 85%.
Further, the porosity of foam copper is 95%, and all gaps interconnect, and connect with heat sink inner surface
It touches, in the gap that phase-change material is filled in foam copper by the way of perfusion.
Further, above-mentioned heating element is the heating sheet, electrical bar or heater strip that heat sink side is arranged in；The thermometric
Element is the thermistor that heat sink side is arranged in, thermocouple or other types of temperature sensor.
Further, above-mentioned thermal interfacial material is graphene-copper foil composite heat conduction film, with a thickness of 9 μm.
Further, above-mentioned heat sink using red copper is heat sink or Aluminum Heat Sink, heat sink is body structure, with a thickness of 3mm, in case
Several ribs are set on the inside of body lower surface, rib and cabinet edge are concordant in the height direction, and several ribs shift to install,
And there are communication paths.
Further, above-mentioned phase-change material be acetic acid, hexadecane, sodium citrate, sodium phosphate, nitrate or paraffin, according to
It is required according to the melting temperature of product to select.
Further, the radiator is radiation cooling plate or water cooling unit.
Meanwhile the present invention provides a kind of phase transformation heat control systems such as above-mentioned high-power laser diode pumping source array
Construction method, be characterized in that and include the following steps:
(1) several ribs are set on the inside of heat sink cabinet lower surface, rib is integrated with cabinet lower surface, using milling
Technique is completed, and rib and cabinet edge are concordant in the height direction；
(2) foam copper that porosity is 95% is placed in heat sink, foam copper should integrally be contacted with heat sink each inner surface
Sufficiently, then cabinet edge and rib tops are welded together with cabinet upper surface with vacuum welding；
(3) a filling import and a filling outlet are processed in heat sink side, by liquid phase more than phase point temperature
Become material out of, filling access is fed into heat sink middle foam copper gap, realizes the complete filling of foam copper gap；
(4) the heat sink sealing after will be filling, and pass through air pressure test and performing leak test；
(5) thermal interfacial material is sprayed in the upper surface of heat sink cabinet；
(6) radiator is set in heat sink lower surface, if the use of space, setting radiation cooling plate is made in heat sink lower surface
For radiating surface, or on ground in use, radiating in heat sink lower surface installation cooling-water machine；
(7) it in heat sink upper setting heating element, temperature element, connect, surveys with information data acquisition and processing module respectively
Warm element transmits a signal to information data acquisition and processing module, and information data acquisition and processing module control heating element
Work.
Compared with prior art, the invention has the advantages that
1, the phase transformation heat control system of high-power laser diode pumping source array of the invention, diode laser matrix installation
Spraying thermal interfacial material it is heat sink on, diode laser matrix generates heat when working, and is transmitted by heat sink fast and stable and quilt
Phase-change material is absorbed and is stored, and maintains laser diode temperature within the scope of working normally allows；In laser diode battle array
Using the interval unused time when column do not work, realize that the heat for absorbing phase-change material carries out dissipation by radiator；Work as simultaneously
It when diode operation environment temperature is too low, does not work in diode, Phase Transition Systems can ceaselessly radiate, and lead to diode pumping source
Simultaneously to uncontrollable state (" freezing to death " state), it is single that heat control system of the invention increases actively heating for the temperature decline of array
Member, temperature element measure heat sink temperature, and are compared and differentiate with preset temperature threshold, according to the knot of judgement
Fruit generates corresponding heating element switch control signal, so that laser diode pumping source array " will not be freezed to death ", guarantee entire phase
Become the temperature levels of heat control system, diode laser matrix can normally start in lower task, improve laser diode battle array
The service life and reliability of column.
2, thermal interfacial material is sprayed in heat sink upper surface, laser diode and heat sink contact shape or processing can be made
Fitting completely is realized on surface, is avoided between contact interface that there are gaps, is led to thermal contact resistance；Thermal interfacial material can also enhance sharp
Optical diode and it is heat sink between heat transfer, thus by heat quickly, uniformly, diffuse to heat sink surface in large area, reduce " heat
To make that uniform phase transformation occurs inside phase-change material the state of solid-liquid mixing will not occur for a possibility that point " occurs.
3, it in the gap that phase-change material is packed into foam copper by the way of perfusion, is encapsulated in heat sink, it can be with
Phase-change material heat dissipation channel is greatly reduced along the thermal contact resistance of journey, improves heating conduction.
4, phase transformation heat control system of the invention is applied widely, is required (to work normally model according to the thermal control of laser diode
Enclose), select different phase-change materials that different temperature control requirements may be implemented, the fusing point of phase-change material should be normal in laser diode
Within working range.
5, the phase transformation heat control system of high-power laser diode pumping source array of the present invention can apply different environment, on ground
Phase transformation heat control system can be used as heat dissipation front end in face ring border, and water cooling unit use is mixed in rear end；It can be in space environment rear end
Cooperation radiation cooling plate reaches cooling requirements.
6, it is applicable in load multiplicity, phase transformation heat control system of the invention can apply the load for having high-power heat-dissipation requirement at other
On lotus.
7, heat sink to use body structure, rib, which is arranged, on cabinet can be improved heat sink intensity and filling phase-change material rear cabinet
Body needs the pressure born.
Detailed description of the invention
Fig. 1 is the main view that diode laser matrix is mounted on phase transformation heat control system of the present invention；
Fig. 2 is the structural schematic diagram that diode laser matrix is mounted on phase transformation heat control system of the present invention；
Fig. 3 is the flow diagram of active heating unit in heat control system of the present invention；
Fig. 4 is the heat transfer schematic diagram of heat control system of the present invention；
Wherein, appended drawing reference is as follows:
1- laser diode, 2- is heat sink, 5- thermal interfacial material, 6- rib, 7- heating element, 8- temperature element.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.
The phase transformation heat control system of the present embodiment, diode laser matrix are mounted on heat control system, when laser diode battle array
When column work (diode laser matrix working method is interval), each laser diode 1 is when carrying out electro-optic conversion, and one
The energy divided is converted into thermal energy, conducts to the encapsulating housing of laser diode 1, the purpose of heat control system is by multi-quantity, height
Heat dissipation on power, densely covered laser diode shell is fallen, to guarantee that highly reliable, the high electric light of laser diode 1 turns
Change efficiency work.
The applicant is in practice, it has been found that laser diode arrays for high power, thinned array simultaneously, due to heat
Amount can form " hot spot " in the position of laser diode size, and (the position temperature of installation laser diode is excessively high, does not install
The position temperature of laser diode is low), cause heat sink interior temperature transmitting uneven, so as to cause the insufficient formation of phase-change material phase transformation
Solid-liquid mixture influences to radiate.When the working environment locating for the diode laser matrix is too low simultaneously, in laser diode not work
When making, the temperature of the system can drop to uncontrollable state, the above service life for seriously affecting laser diode and can
By property, therefore the present invention devises a kind of phase transformation heat control system of powered laser diodes pumping source array, and laser two can be improved
The service life and reliability of pole pipe array.
As shown in Figures 1 to 4, the phase transformation heat control system of the present embodiment include heat sink 2, phase-change material, phase transformation reinforcing material,
Radiator and active heating unit, heat sink 2 be cavity structure, and upper surface sprays thermal interfacial material 5, and phase transformation reinforcing material is to fill out
The enhanced thermal conduction body in heat sink 2 cavity with gap is filled, and is integrally contacted sufficiently with heat sink 2 inner surface, phase-change material is filled
In the gap of enhanced thermal conduction body, radiator is arranged in heat sink 2 lower surface, and diode laser matrix is attached on thermal interfacial material 5,
Or be mounted on thermal interfacial material 5 by screw, according to the interval work of diode laser matrix, biggish heating power,
The characteristics of array radiates simultaneously is transmitted by heat sink 2 fast and stable and is absorbed by phase-change material in laser diode work
And store, maintain laser diode temperature within the scope of working normally allows, it is sharp when diode laser matrix does not work
With the interval unused time, realize that the heat for absorbing phase-change material carries out dissipation by radiator；Work as diode operation ring simultaneously
Border temperature is too low, in radiation processes, when active heating unit detects heat sink temperature lower than preset temperature threshold, actively
Heating unit is heated to heat sink, maintains the temperature of entire phase transformation heat control system in suitable range, guarantees laser two
Pole pipe pumping source array " will not freeze to death ", to guarantee that diode laser matrix can normally start in lower task.
1, heat sink
Heat sink 2 can be used that red copper is heat sink or Aluminum Heat Sink, and preferably red copper is heat sink, and heat sink 2 platform plays the role of two: being 1. sharp
Optical diode 1 and optical fiber provide a structure mounting platform；2. the fever heat of high-power heat generating components-pumping and optical fiber is fast
Speed steadily reaches in phase-change material to guarantee in the laser diode-pumped operating temperature range for remaining at requirement.
It selects the red copper that thermal conductivity is 386.4W/m*K heat sink in order to guarantee the quick conduction of heat, heat sink 2, case can be used
Body structure, with a thickness of 3mm or so, in order to guarantee the intensity and the filling phase-change material rear box pressure that needs to bear of welding,
Several ribs are set in heat sink 2 cabinet, rib and cabinet edge are concordant in the height direction, and several ribs shift to install, and
It is conduit, i.e. foam copper filling region between rib, rib 6 is integrated with cabinet lower surface, using milling there are communication path
Technique complete, cabinet edge and rib tops are welded by the way of vacuum welding with cabinet upper surface.
2, phase-change material
Carrier of the phase-change material as storage heat needs to select suitable phase transformation material according to use environment and task objective
Material, the fusing point of phase-change material should be within 1 normal range of operation of laser diode.Phase-change material temperature in phase transformation maintains phase
Height is, it can be achieved that the accurate temperature controlling of thermally sensitive electronic component can according to the thermal control of high-power laser diode requirement
To select different phase-change materials, common phase-change material has acetic acid (CH3COOH), and phase transition temperature is 17 DEG C, and latent heat of phase change is
187KJ/Kg；Hexadecane (C16H34), phase transition temperature is 18.1 DEG C, latent heat of phase change 236KJ/Kg, in other specific heats, close
Under conditions of degree, compatible and nontoxic etc. conditions all meet, main consideration phase transition temperature and latent heat of phase change, to select suitable phase
Become material.
3, phase transformation reinforcing material
Thermal process inside phase-change material is a Transient Heat Transfer process, and there is the temperature difference for each moment material internal.
It needs to reduce thermal resistance in phase transformation heat control system, improve heating conduction, improve the temperature uniformity inside phase-change material, improve storage
Thermal energy power, therefore increase material in the heat sink middle thermally conductive phase transformation of setting, it is the enhanced thermal conduction body with gap that phase transformation, which increases material, and hole can be selected
Gap rate is not less than 85% foam copper, in the gap that phase-change material is packed into foam copper by the way of perfusion.
Preferred embodiment be 95% using porosity foam copper as skeleton, corresponding phase-change material is filled in foam copper can
Composite phase-change material is made, the density of this composite phase-change material and the latent heat of phase change of unit volume change less, by its envelope
Mounted in red copper it is heat sink in, and integrally contacted sufficiently with heat sink 2 inner surface, phase-change material heat dissipation channel can be greatly reduced along journey
Thermal contact resistance, improve heating conduction.
4, thermal interfacial material
Laser diode 1 is mounted on heat sink 2, heat sink 2 is conducted heat to by heat transfer, due to laser diode 1
Contact shape or finished surface with heat sink 2 may be not exclusively bonded, and can have gap between contact interface, thus be generated
Thermal contact resistance；Simultaneously for high power, the laser diode arrays of thinned array, since heat can be in laser diode size
The position of size forms " hot spot ", causes heat sink interior temperature transmitting uneven, is formed admittedly so as to cause phase-change material phase transformation is insufficient
Liquid mixture influences to radiate.
Ideal thermal interfacial material 5 should have characteristics that (1) compressibility and flexibility, guarantee two contact tables
Face can come into full contact with；(2) high thermal conductivity；(3) low-heat damps；(4) sensibility of make-up resultant pressure is high；(5) simple installation
And has dismoutability；(6) reusable；(7) stability of cold cycling is good；(8) applicability is wide, can fill small gap,
Big gap can be filled.
Preferably graphene-copper foil composite heat conduction film, plane thermal conductivity reach 800W/m*K, and vertical thermal conductivity is 25W/m*
K, copper thickness 0.009mm can be set between diode laser matrix and red copper are heat sink；Graphene-copper foil is compound simultaneously
Heat conducting film can be enhanced laser diode 1 and red copper it is heat sink between heat transfer, thus by heat quickly, uniformly, in large area
Diffuse to red copper heat sink surface.
5, radiator (not marked in figure)
In use, High power laser diode array work absorbs system in the black cold environment in space in space
The heat of storage can be radiated in the space environment of 4K by heat radiation plate, and the placement of heat radiation plate pays attention to avoiding sun photograph
The radiation with other on-board equipments is penetrated, heat radiation plate surface sprays KS-Z as radiating surface, also may be selected directly in heat sink following table
Face sprays KS-Z as radiating surface, and the heat that phase-change material absorbs is radiated in space by radiation mode；In ground system
In in use, heat sink lower surface installation cooling-water machine carry out rear end heat dissipation.
6, active heating unit
In laser diode pumping source array phase transformation heat control system, when laser diode 1 does not work, radiator is not also
Disconnected carry out heat dissipation, the temperature of system can constantly decline, working environment is too low or space in can even drop to it is subzero
It is spent 100 more, will lead to heat control system temperature and be in runaway condition, active heating unit is needed to control the system at this time,
By system control within the scope of suitable temperature, general control is 10 degree or so below phase point temperature, to guarantee two pole of laser
Pipe pumping source array " will not freeze to death ", and can normally can start in lower task phase change heat control system, to guarantee whole
The temperature levels of a phase transformation heat control system.
Active heating unit includes heating element 7, temperature element 8, information data acquisition and processing module；Heating element 7
The heating sheet for being R for the resistance value by design, is arranged on heat sink 2 side, for heating to heat sink 2；Temperature element 8
For the thermistor by calibration, it is arranged on heat sink 2, for measuring heat sink 2 temperature；Information data acquisition and processing module
Including acquisition module, control module and industrial personal computer, temperature signal is converted to temperature digital by A/D converter by acquisition module
Temperature digital amount is transferred to industrial personal computer storage, display by amount；Industrial personal computer is according to temperature digital amount simultaneously, with preset temperature threshold
Value is compared and differentiates, according to differentiation as a result, generating corresponding heating sheet switch machine control signal to control module, control
Module controls the cut-off and conducting of the Darlington transistor of heating sheet output channel, when temperature digital amount is lower than preset temperature threshold
When, industrial personal computer transmits a signal to control module control heating sheet work, when temperature digital signal is higher than preset temperature threshold,
Heating sheet does not work, and the preset threshold temperature general control in information data acquisition and processing module is below phase point temperature
10 degree or so.
Temperature element 8 and heating element 7 can be it is multiple, be uniformly arranged on heat sink 2 side, temperature element 8 can be selected
The occasionally other types of temperature sensor of thermistor, thermoelectricity, heating element 7 can be heating sheet, electrical bar or heater strip.
The temperature control process of the present embodiment heat control system:
(1) diode laser matrix is mounted on heat sink 2 upper surface, and laser diode 1 generates heat when working, and heat passes through hot boundary
It transmits and is absorbed and stored by phase-change material to plane materiel material 5 and heat sink 2 fast and stable, phase-change material solid state is transformed into liquid, inhales
It stores up and deposits heat, within the scope of so that the temperature of laser diode is maintained normal work permission, the raising of phase transformation reinforcing material is led
Hot property improves the temperature uniformity inside phase-change material, improves heat storage capacity；
(2) using the interval unused time when diode laser matrix does not work, phase-change material, at solid-state, is incited somebody to action by settable liquid
The heat of storage is lost in working environment by being mounted on the radiator of heat sink 2 lower surface, realizes the dissipation of heat；
(3) in radiation processes, temperature element 8 measures heat sink 2 temperature, and transmit a signal to information data acquisition and
Processing module, when the temperature that temperature element 8 measures heat sink 2 is lower than preset temperature threshold, information data acquisition and processing
Module controls heating element 7 and starts to work, and heats to heat sink 2, guarantees that laser diode pumping source array " will not freeze to death ",
And can normally start in lower task phase change heat control system, to guarantee the temperature levels of entire phase transformation heat control system.
The construction method of the present embodiment heat control system, includes the following steps:
(1) several ribs are set on the inside of heat sink cabinet lower surface, rib is integrated with cabinet lower surface, using milling
Technique is completed, and rib and cabinet edge are concordant in the height direction；
(2) foam copper that porosity is 95% is placed in heat sink, foam copper should integrally be contacted with heat sink each inner surface
Sufficiently, then cabinet edge and rib tops are welded together with cabinet upper surface with vacuum welding；
(3) a filling import and a filling outlet are processed in heat sink 2 side, by liquid phase more than phase point temperature
Become material out of, filling access is fed into heat sink middle foam copper gap, the gap of foam copper is realized completely filling；
(4) the filling import of heat sink 2 side after will be filling and filling outlet are sealed, and by air pressure test and
Performing leak test；
(5) thermal interfacial material 5, preferably graphene-copper foil composite heat conduction film are sprayed on heat sink 2 surface, with a thickness of 9 μ
m；
(6) radiator is set in heat sink 2 lower surface, the interval unused time is utilized when diode laser matrix does not work,
The heat that phase-change material is absorbed carries out dissipation；
(7) heating element 7, temperature element 8 are set on heat sink 2, connected respectively with information data acquisition and processing module
It connects, temperature element 8 transmits a signal to information data acquisition and processing module, information data acquisition and processing module control heating
The work of element 7.
Claims (10)
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| CN112038877A (en) * | 2020-11-04 | 2020-12-04 | 中国工程物理研究院激光聚变研究中心 | Heat dissipation piece and fiber laser |
| CN114845175A (en) * | 2022-07-01 | 2022-08-02 | 江苏泽宇智能电力股份有限公司 | Power grid wireless base station handheld operation and maintenance system with data comparison function |
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