CN109273515B - A pixel structure, a flexible display substrate and a manufacturing method thereof, and a display device - Google Patents

Abstract

The invention discloses a pixel structure, a flexible display substrate, a manufacturing method thereof, and a display device, and relates to the field of display technology, so as to improve the production yield of the display substrate without affecting the flexibility of the display substrate. The pixel structure includes a flexible substrate and a pixel defining layer formed on the surface of the flexible substrate, the flexible substrate is provided with a first stretching adjustment hole, the pixel defining layer includes a peeling adjustment part located in the first stretching adjustment hole, the peeling adjustment The portion includes at least two second stretch adjustment holes. The flexible display substrate includes at least one of the above-mentioned pixel structures. The pixel structure, the flexible display substrate and the manufacturing method thereof, and the display device provided by the present invention are used in the display field.

Description

A pixel structure, a flexible display substrate and a manufacturing method thereof, and a display device

technical field

The present invention relates to the field of display technology, and in particular, to a pixel structure, a flexible display substrate, a manufacturing method thereof, and a display device.

Background technique

A flexible display is a deformable and bendable display device made of soft materials, which has low power consumption and good display effect, and is generally welcomed by users.

In the prior art, as shown in FIG. 1 , the pixel structure of the flexible display substrate includes a flexible substrate 100 , and a stretching adjustment hole 101 is opened on the flexible substrate 001 to adjust the deformability of the flexible substrate 100 by using the stretching adjustment hole 101 ; A light emitting device and a thin film transistor (not shown in FIG. 1 ) are arranged in the adjustment hole 100 , and the light emitting device and the thin film transistor are encapsulated by an encapsulation film layer 400 to prevent the influence of external water vapor on the flexible display substrate. However, when manufacturing a flexible display substrate, it is necessary to form a flexible substrate 100 on the surface of the glass substrate 001 ′, then open a stretch adjustment hole 101 on the flexible substrate 100 , set the light-emitting device and the thin film transistor in the stretch adjustment hole 101 , and then The encapsulation film layer 400 is then used for encapsulation.

The inventors found that when the glass substrate 001' is peeled off from the flexible display substrate, the area indicated by the arrow in FIG. 2 is prone to large-area cracks, resulting in a decrease in the production yield of the flexible display substrate.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a pixel structure, a flexible display substrate, a manufacturing method thereof, and a display device, so as to improve the production yield of the display substrate without affecting the tensile properties of the flexible display substrate.

In order to achieve the above object, the present invention provides the following technical solutions:

A pixel structure, comprising a flexible substrate and a pixel defining layer formed on the surface of the flexible substrate; wherein,

The flexible substrate is provided with a first stretching adjustment hole, the pixel defining layer includes a peeling adjustment part located in the first stretching adjustment hole, and the peeling adjustment part includes at least two second stretching adjustment holes.

Compared with the prior art, in the pixel structure provided by the present invention, the flexible substrate is provided with a first stretching adjustment hole, the pixel defining layer includes a peeling adjustment part located in the first stretching adjustment hole, and the peeling adjustment part can increase The distance between the inorganic packaging film layer and the glass substrate is large, so that the glass substrate can be easily peeled off from the flexible display substrate, thereby ensuring the production yield of the flexible display substrate. The peeling adjustment part includes two independent second stretching adjustment holes, so that the peeling adjustment part has a good stretching function, so that when the peeling adjustment part is provided in the first stretching adjustment hole, the peeling adjustment part will not affect Tensile properties of flexible display substrates.

The present invention also provides a flexible display substrate, the flexible display substrate comprising at least one pixel structure according to the above technical solution.

Compared with the prior art, the beneficial effects of the flexible display substrate provided by the present invention are the same as those of the above-mentioned pixel structure, which will not be repeated here.

The present invention also provides a manufacturing method of a flexible display substrate, the manufacturing method of the flexible display substrate comprising:

providing a base substrate;

At least one flexible display substrate formed by the pixel structure described in the above technical solution is formed on the base substrate;

The base substrate is removed from the flexible display substrate to obtain a flexible display substrate.

Compared with the prior art, the beneficial effect of the manufacturing method of the flexible display substrate provided by the present invention is the same as the beneficial effect of the above-mentioned pixel structure, which is not repeated here.

The present invention also provides a display device, which includes the flexible display substrate described in the above technical solution.

Compared with the prior art, the beneficial effects of the manufacturing method of the display device provided by the present invention are the same as those of the above-mentioned pixel structure, which are not repeated here.

Description of drawings

The accompanying drawings described herein are used to provide further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the attached image:

1 is a schematic structural diagram of a prior art pixel structure;

2 is a photograph of a flexible display substrate in the prior art;

FIG. 3 is a first structural schematic diagram of a pixel structure provided by an embodiment of the present invention;

FIG. 4 is a second structural schematic diagram of a pixel structure provided by an embodiment of the present invention;

FIG. 5 is a first manufacturing flow chart of the flexible display substrate provided by the embodiment of the present invention;

FIG. 6 is a second manufacturing flow chart of the flexible display substrate provided by the embodiment of the present invention;

FIG. 7 is a third manufacturing flow chart of the flexible display substrate provided by the embodiment of the present invention.

Reference number:

001-substrate substrate, 001'-glass substrate;

100-flexible substrate, 110-first stretching adjustment hole;

200-line structure, 300-pixel definition layer;

310-peeling adjustment part, 311-second stretch adjustment hole;

320-top delimiter, 400-encapsulation film layer.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the prior art, as shown in FIG. 1 , the encapsulation film layer 400 included in the pixel structure of the flexible display substrate is an inorganic encapsulation film layer. After the flexible display substrate is formed on the glass substrate, it is difficult to remove the glass flexible display substrate from the glass substrate. . The inventors found that the thicknesses of the light-emitting devices and thin film transistors located in the flexible substrate 100 are relatively thin compared to the thickness of the inorganic encapsulating film layer, so that the flexible display substrate is formed after the glass substrate 001 ′, although the inorganic encapsulating film layer and the glass substrate are relatively thin. There are also light-emitting devices and thin-film transistors between the substrates 001', but the light-emitting devices and thin-film transistors can be ignored. At this time, the area of the inorganic encapsulation film layer corresponding to the stretch adjustment hole 101 can be considered to be in contact with the glass substrate 001'; Since the glass substrate 001' and the inorganic encapsulating film layer are both made of inorganic materials, the bonding force between the part of the inorganic encapsulating film layer corresponding to the stretching adjustment hole and the glass substrate 001' is relatively strong; therefore, the glass substrate 001' is When the area of the flexible display substrate corresponding to the stretch adjustment hole 101 is peeled off, a greater peeling force is required, which also makes the position indicated by the arrow in FIG. Large-area cracks lead to a decrease in the production yield of flexible display substrates.

In response to the above problems, as shown in FIG. 3 , FIG. 4 and FIG. 7 , an embodiment of the present invention provides a pixel structure, the pixel structure includes a flexible substrate 100 and a pixel defining layer 300 formed on the surface of the flexible substrate 100 ; the flexible substrate 100 A first stretching adjustment hole 110 is opened, the pixel defining layer 300 includes a peeling adjustment part 310 located in the first stretching adjustment hole 110 , and the peeling adjustment part 310 includes at least two second stretching adjustment holes 311 .

It can be understood that the above-mentioned pixel structure further includes an encapsulation film layer 400 , the encapsulation film layer 400 is located on the surface of the pixel defining layer 300 away from the flexible substrate 100 , and the orthographic projection of the encapsulation film layer 400 on the surface of the flexible substrate 100 covers the flexible substrate 100 . and the first stretch adjustment hole 110 .

Based on the above pixel structure, it can be known that the flexible substrate 100 is provided with a first stretching adjustment hole 110 , the pixel defining layer 300 includes a peeling adjustment part 310 located in the first stretching adjustment hole 110 , and the peeling adjustment part 310 can increase the size of the inorganic The distance between the packaging film layer 400 and the glass substrate is such that the structural thickness between the inorganic packaging film layer 400 and the glass substrate cannot be ignored. Since the pixel defining layer 300 is made of organic materials (such as polyimide, but not limited to this), and the glass substrate is made of inorganic materials (such as silicon dioxide), the gap between the glass substrate and the pixel defining layer 300 is formed. Therefore, when the glass substrate is glass from the position of the flexible display substrate corresponding to the first stretch adjustment hole 110, the required peeling force is relatively small, which can reduce the two first stretches opened by the flexible substrate 100. The possibility of breaking the bridge region between the holes 110 is adjusted, so that the flexible display substrate can be easily peeled off from the glass substrate, thereby improving the production yield of the flexible display substrate. Meanwhile, the above-mentioned peeling adjusting portion 310 includes at least two second stretching adjusting holes 311 , so that the peeling adjusting portion 310 has a good stretching function. The adjusting part 310 does not have a great influence on the stretching function of the flexible substrate 100 .

It can be known that the total area of the orthographic projection of the at least two second stretch adjustment holes 311 on the board surface where the flexible substrate 100 is located is 5% to 5% of the area of the first stretch adjustment hole 110 on the board surface where the flexible substrate 100 is located. 15%; at this time, when the flexible display substrate including the above pixel structure is produced, the glass substrate can be easily peeled off without the flexible display substrate being broken, and the tensile properties of the flexible display substrate can be guaranteed not to be affected. Excessive impact.

In some embodiments, as shown in FIG. 7 , when the axial direction of the first stretching adjustment hole 110 is different from the axial direction of the second stretching adjustment hole 311 , the flexible display substrate applied to the pixel structure will be The internal stress generated during the stretching process is relatively large. Based on this, the axial direction of the first stretch adjustment hole 110 is the same as the axial direction of each second stretch adjustment hole 311 , so that the stretch adjustment direction of the first stretch adjustment hole 110 is the same as that of the second stretch adjustment hole 110 . The stretching adjustment direction of the adjustment hole 311 is the same, so that the first stretching adjustment hole 110 and the second stretching adjustment hole 311 cooperate to reduce the internal stress generated by the flexible display substrate during the stretching process, so as to ensure the flexible display substrate. Best stretch function.

In some embodiments, as shown in FIGS. 3 and 4 , the pixel defining layer 300 further includes a top defining portion 320 formed on the surface of the flexible substrate 100 . The top defining portion 320 may be an integral structure or an independent structure with the above-mentioned peeling adjusting portion 310 .

When the top defining portion 320 and the peeling adjusting portion 310 are integral structures, the fabrication of the pixel defining layer 300 can be facilitated; when the top defining portion 320 and the peeling adjusting portion 310 are independent structures, if the above-mentioned pixel structure is applied to a flexible display substrate, During the process of stretching the flexible display substrate, the top defining portion 320 and the peeling adjusting portion 310 will not be pulled from each other, so that the peeling adjusting portion 310 has better stretchability.

For example, as shown in FIG. 3 and FIG. 7 , when the peeling adjusting part 310 has two second stretching adjusting holes 311 , the two second stretching adjusting holes 311 can make the peeling adjusting part 310 be divided into two independent two parts. Part, a part can be in contact with the hole wall, and another part is in contact with the base substrate 001 when the flexible display substrate is fabricated. When the flexible display substrate produced in this way is stretched, the part in contact with the hole wall will not be pulled against the other part, so as to ensure that the peeling adjusting part 310 will not excessively affect the stretching performance of the flexible substrate 100 .

Of course, as shown in FIG. 4 and FIG. 7 , when the peeling adjusting portion 310 has four second stretching adjusting holes 311 , the peeling adjusting portion 310 is close to the two second pulling adjusting holes 110 on the side wall of the first stretching adjusting hole 110 . The stretching adjustment holes 311 can also achieve the effect achieved by opening the two second stretching adjustment holes 311 in the peeling adjustment portion 310 described above.

In some embodiments, as shown in FIG. 3 , FIG. 4 and FIG. 7 , the above-mentioned pixel structure further includes a wiring structure 200 located on the surface of the flexible substrate 100 and a light-emitting device located in the first stretching adjustment hole 110 ; the light-emitting device The wiring structure 200 is located between the flexible substrate 100 and the pixel defining layer 300 and is disposed between the peeling adjusting portion and the packaging film layer 400 . Wherein, the light-emitting device may be an organic electroluminescent device or other electroluminescent device.

Of course, the above-mentioned pixel structure further includes a thin film transistor located in the first stretching adjustment hole 110 , and the thin film transistor is electrically connected to the light emitting device and the wiring structure 200 respectively. The wiring structure 200 at least includes a scan line and a data line, the gate of the thin film transistor is connected to the scan line, the source of the thin film transistor is connected to the data line, and the drain of the thin film transistor is connected to the light emitting device.

As shown in FIG. 3 and FIG. 4 , an embodiment of the present invention further provides a display substrate including at least one of the above pixel structures.

Compared with the prior art, the beneficial effects of the display substrate provided by the embodiments of the present invention are the same as those of the above-mentioned pixel structure, which will not be repeated here.

As shown in FIG. 5 and FIG. 7 , an embodiment of the present invention further provides a manufacturing method of a display substrate, and the manufacturing method of the display substrate includes:

Step S100: Provide a base substrate 001, the base substrate 001 is generally a rigid glass substrate, and of course other rigid base substrates may also be used.

Step S200: forming at least one flexible display substrate composed of the above pixel structure on the base substrate 001;

Step 300: Remove the base substrate 001 from the flexible display substrate.

Compared with the prior art, the beneficial effects of the method for fabricating the display substrate provided by the embodiment of the present invention are the same as those of the above-mentioned pixel structure, which will not be repeated here.

In some embodiments, as shown in FIG. 6 and FIG. 7 , the flexible display substrate formed by forming at least one pixel structure on the base substrate 001 includes:

Step S210 : forming the flexible substrate 100 on the surface of the base substrate 001 . There are various methods for forming the flexible substrate 100. Considering that the material of the flexible substrate 100 is generally an organic material such as polyimide, an evaporation process can be used to evaporate polyimide on the base substrate 001 to form Flexible substrate 100 .

Step S220 : opening at least one first stretching adjustment hole 110 on the flexible substrate 100 , see A in FIG. 7 for a specific structure; specifically, a patterning process may be used to open at least one first stretching adjustment hole 110 . For example, photolithography is performed on the flexible substrate 100 by using a mask, and then development is performed, so that at least one first stretching adjustment hole 110 is formed on the flexible substrate 100 .

Step S230 : forming a wiring structure 200 on the flexible substrate 100 , the specific structure is shown in B in FIG. 7 . When the wiring structure 200 is formed, a thin film transistor located in the first stretch-adjusting hole 110 is generally formed. The connection relationship between the thin film transistor and the wiring structure 200 can be referred to the above, and will not be described in detail here.

Step S240 : forming a pixel definition layer 300 on the surface of the wiring structure 200 away from the base substrate 001 and in the at least one first stretch adjustment hole 110 ; the material used for the pixel definition layer 300 is generally a material such as polyimide, Therefore, when forming the pixel defining layer 300, an evaporation process is generally selected to form the pixel defining layer 300, and of course, other processes that can form an organic film layer can also be selected.

Step S250 : opening at least two second stretch adjustment holes 311 in the pixel definition layer 300 , so that the part of the pixel definition layer 300 located on the surface of the wiring structure 200 forms a top definition part 320 , and the pixel definition layer 300 is located in each first stretch The area in the adjustment hole 110 forms the peeling adjustment part 310, and the peeling adjustment part 310 in each first stretching adjustment hole 110 includes at least two second stretching adjustment holes 311. For the specific structure, see C in FIG. 7; When the layer 300 is provided with at least two second stretch adjustment holes 311 , the pixel defining layer 300 can be photoetched by using a mask, and then developed, so that the pixel defining layer 300 is located in the area of the first stretch adjustment hole 110 . The peeling adjusting part 310 is formed, and the peeling adjusting part 310 includes at least two second stretching adjusting holes 311 .

Step S260 : forming a light emitting device on the surface of the peeling adjusting portion 310 in each first stretching adjusting hole 110 away from the base substrate 001 .

Step S270 : forming an encapsulation film layer 400 covering the pixel defining layer 300 and the light emitting device on the surface of the pixel defining layer 300 away from the base substrate 001 , see D in FIG. 7 for a specific structure. The method of forming the encapsulation film layer 400 may be a chemical vapor deposition process or a magnetron sputtering process, of course, it is not limited thereto.

In some embodiments, the base substrate 001 can be removed in various manners, for example, laser lift-off technology can be used to remove the glass substrate. When the material used for the flexible substrate 100 is polyimide and the base substrate 001 is a glass substrate, the oxygen atoms contained in the amide groups of the polyimide molecules contained in the flexible substrate 100 and the Si-OH contained in the glass substrate The hydrogen bonds are generated, and the glass substrate is removed from the flexible display substrate by using the laser lift-off technology. In essence, the laser is used to break the hydrogen bonds to remove the glass substrate from the flexible display substrate.

As shown in FIG. 3 and FIG. 4 , an embodiment of the present invention further provides a display device including the above-mentioned display substrate.

Compared with the prior art, the beneficial effects of the display substrate provided by the embodiment of the present invention are the same as those of the above-mentioned display substrate, which will not be repeated here.

Wherein, the display device provided in the above embodiment may be any product or component with display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, or a navigator.

In the foregoing description of the embodiments, the particular features, structures, materials or characteristics may be combined in any suitable manner in any one or more of the embodiments or examples.

The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention. should be included within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (9)

1. A pixel structure, characterized in that it comprises a flexible substrate and a pixel defining layer formed on the surface of the flexible substrate; wherein, The flexible substrate is provided with a first stretching adjustment hole, the pixel defining layer includes a peeling adjustment part located in the first stretching adjustment hole, and the peeling adjustment part includes at least two second stretching adjustment holes; The total area of the orthographic projection of the at least two second stretch adjustment holes on the board surface where the flexible substrate is located is 5% to 15% of the area of the first stretch adjustment hole on the board surface where the flexible substrate is located. 2 . The pixel structure according to claim 1 , wherein the axial direction of the first stretch adjustment hole is the same as the axial direction of each of the second stretch adjustment holes. 3 . 3 . The pixel structure according to claim 1 , wherein the pixel defining layer further comprises a top layer defining portion formed on the surface of the flexible substrate, and the top layer defining portion and the peeling regulating portion are an independent structure or an integrated structure. 4 . . 4 . The pixel structure according to claim 1 , wherein the pixel structure further comprises an encapsulation film layer, the encapsulation film layer is located on the surface of the pixel defining layer away from the flexible substrate, and the encapsulation film layer is located on the surface of the pixel definition layer away from the flexible substrate. 5 . The orthographic projection of the board surface where the flexible substrate is located covers the flexible substrate and the first stretching adjustment hole. 5 . The pixel structure according to claim 4 , wherein the pixel structure further comprises a wiring structure located on the surface of the flexible substrate and a light-emitting device located in the first stretching adjustment hole, and the light-emitting device is located in the between the peeling regulating part and the packaging film layer, and the wiring structure is located between the flexible substrate and the pixel defining layer. 6. A flexible display substrate, comprising at least one pixel structure according to any one of claims 1 to 5. 7. A method for manufacturing a flexible display substrate, comprising: providing a base substrate; At least one flexible display substrate composed of the pixel structure according to any one of claims 1 to 5 is formed on the base substrate; The base substrate is removed from the flexible display substrate. 8 . The method for manufacturing a flexible display substrate according to claim 7 , wherein the flexible display substrate formed by forming at least one pixel structure on the base substrate comprises: forming a flexible substrate on the surface of the base substrate; opening at least one first stretch adjustment hole on the flexible substrate; forming a wiring structure on the flexible substrate; forming a pixel definition layer in the surface of the trace structure away from the base substrate and in the at least one first stretch adjustment hole; At least two second stretch-adjustment holes are opened in the pixel-defining layer, so that the part of the pixel-defining layer located on the surface of the wiring structure forms a top-defining portion, and the pixel-defining layer is located in each first stretch-adjustment hole A peeling adjustment part is formed in the area of the first stretching adjustment hole, and the peeling adjustment part in each first stretching adjustment hole includes at least two second stretching adjustment holes; forming a light-emitting device located in the first stretch-adjustment hole on a surface of each of the peeling-adjusting parts away from the base substrate; An encapsulation film layer covering the pixel definition layer and the light emitting device is formed on the surface of the pixel definition layer away from the base substrate to obtain a flexible display substrate composed of at least one pixel structure. 9 . A display device, comprising the flexible display substrate of claim 6 . 10 .

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