CN109411209B

CN109411209B - Chip inductor

Info

Publication number: CN109411209B
Application number: CN201811318358.3A
Authority: CN
Inventors: 钟景高; 肖倩; 李春; 朱敏蔚; 周亚; 吴猛雄; 曾学凯
Original assignee: Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd; China Zhenhua Group Science and Technology Co Ltd
Current assignee: Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd; China Zhenhua Group Science and Technology Co Ltd
Priority date: 2018-11-07
Filing date: 2018-11-07
Publication date: 2024-06-21
Anticipated expiration: 2038-11-07
Also published as: CN109411209A

Abstract

The invention provides a chip inductor, which comprises a magnetic core, a coil, two guide pins, a packaging seat and two end pole pieces, wherein the packaging seat is molded and packaged on the magnetic core; one end of each guide pin far away from the center column is fixedly connected with the corresponding end pole piece. According to the invention, the guide pins are arranged at the two ends of the magnetic core, the two ends of the coil on the magnetic core are connected with the two guide pins, and the encapsulation seat is manufactured on the magnetic core through mould pressing encapsulation, so that the magnetic core is protected, the guide pins, the magnetic core and the coil on the magnetic core are fixed to form a fully-closed structure, good reliability can be ensured, and environmental adaptability such as high temperature, high humidity, severe cold, salt fog and the like can be improved; the end part of the guide pin stretches into the packaging seat and is further connected with the end pole piece arranged on the packaging seat, so that assembly and manufacture can be carried out in a larger space during manufacture, industrial automatic production is facilitated, reliable connection of the end pole piece and the guide pin as well as reliable connection of the guide pin and the coil can be guaranteed, and the performance of the manufactured chip inductor is guaranteed.

Description

Chip inductor

Technical Field

The invention belongs to the technical field of inductors, and particularly relates to a chip inductor.

Background

Along with the continuous progress of technology and the rapid development of information industry, large-scale and ultra-large-scale integrated circuits become the main stream and trend of development, chip inductors have the characteristics of small volume, high space utilization rate and the like, are suitable for surface mounting and SMT (surface mounting technology, surface Mount Technology abbreviations) automatic mounting, and can well meet the development requirements of intelligent manufacturing and integrated circuits. The current chip inductor is generally formed by winding a coil on a columnar magnetic core, then loading the coil into a housing, mounting patch pins in the housing, enabling one ends of the pins to extend into the housing and be welded with the lead-out ends of the coil, and then sealing a cover plate on the housing. The chip inductor with the structure needs to weld the patch pins and the coil leading-out ends in the inner cavity of the shell during manufacturing, is very inconvenient, and is easy to cause unstable welding so as to influence the performance of the chip inductor.

Disclosure of Invention

The invention aims to provide a chip inductor, which solves the problems that the chip inductor in the prior art is complex to manufacture, needs to be welded in a small space, is inconvenient to weld and is easy to cause unstable connection.

In order to achieve the above purpose, the invention adopts the following technical scheme: the chip inductor comprises a magnetic core, a coil wound on the magnetic core, two guide pins respectively arranged at two ends of the magnetic core, a packaging seat in mould pressing packaging on the magnetic core and end pole pieces respectively buckled at two ends of the packaging seat; the magnetic core comprises a center column and baffle plates arranged at two ends of the center column, and each baffle plate protrudes out of the center column along the radial direction of the center column; one end of each guide pin is fixed on the baffle plate along the axial direction of the middle column, the coil is wound on the middle column, two ends of the coil extend out to form outgoing lines which are respectively connected with the two guide pins, the magnetic core is wrapped by the packaging seat, one end of each guide pin, which is far away from the middle column, extends out of the corresponding end face of the packaging seat, and one end of each guide pin, which is far away from the middle column, is fixedly connected with the corresponding end pole piece.

Further, a lead groove for the lead wires to pass through is formed in the periphery of each baffle plate, and each lead wire is connected with the corresponding guide pin through the lead groove and passes through the baffle plate.

Further, N lead grooves are uniformly arranged at intervals on the periphery of each baffle plate, N is a positive integer, and the product of N and the diameter of the outgoing line is smaller than the perimeter of the baffle plate.

Further, each baffle plate is provided with a jack, and one end of each guide pin is inserted into the jack.

Further, each outgoing line is wound on the corresponding guide pin.

Further, two ends of the packaging seat are respectively provided with a containing groove, and each end pole piece is installed in the corresponding containing groove.

Further, each containing groove extends to two sides of the packaging seat from the end face of the packaging seat, and each end pole piece covers the corresponding containing groove.

Further, positioning holes are respectively formed in the two sides of the packaging seat at positions corresponding to the corners of the accommodating grooves, and positioning columns protrude inwards from the corners of the two ends of the end pole pieces.

Further, through holes for inserting the guide pins are correspondingly formed in the end pole pieces, and the guide pins are inserted into the corresponding through holes and are connected with the end pole pieces in a welding mode.

Further, each through hole is gradually expanded from the inner surface to the outer surface of the end pole piece.

The chip inductor provided by the invention has the beneficial effects that: compared with the prior art, the guide pins are arranged at the two ends of the magnetic core, the two ends of the coil on the magnetic core are connected with the two guide pins, and the packaging seat is manufactured on the magnetic core through mould pressing packaging so as to protect the magnetic core, fix the guide pins, the magnetic core and the coil on the magnetic core to form a fully-closed structure, ensure good reliability and improve environment adaptability such as high temperature, high humidity, severe cold, salt fog and the like; the end part of the guide pin stretches into the packaging seat and is further connected with the end pole piece arranged on the packaging seat, so that assembly and manufacture can be carried out in a larger space during manufacture, industrial automatic production is facilitated, reliable connection of the end pole piece and the guide pin as well as reliable connection of the guide pin and the coil can be guaranteed, and the performance of the manufactured chip inductor is guaranteed.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a chip inductor according to a first embodiment of the present invention;

FIG. 2 is a schematic diagram of the front view of the magnetic core of the chip inductor shown in FIG. 1;

FIG. 3 is a schematic side view of the magnetic core of FIG. 2;

FIG. 4 is a schematic diagram of the structure of the magnetic core of FIG. 2 after winding the coil and mounting the guide pin;

FIG. 5 is a schematic diagram of the structure of the package base fabricated by molding and packaging the core of FIG. 4;

fig. 6 is a schematic front view of the end piece of the chip inductor shown in fig. 1;

FIG. 7 is a schematic diagram of a left-hand structure of the end piece of FIG. 6;

Fig. 8 is a schematic diagram of the right-side view structure of the end pole piece in fig. 6.

Fig. 9 is a schematic front view of a chip inductor according to a second embodiment of the present invention.

Fig. 10 is a schematic side view of a chip inductor according to a third embodiment of the present invention.

Wherein, each reference numeral in the figure mainly marks:

A 100-chip inductor; 10-a magnetic core; 11-a center column; 12-baffle; 121-a wire slot; 122-jack; 21-coil; 211-outgoing lines; 22-guide pins; 23-end pole pieces; 231-through holes; 232-positioning columns; 30-packaging the base; 31-a containing groove; 32-positioning holes; 40-indicating the pattern.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.

In the description of the present invention, it should be understood that the terms "center," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Embodiment one:

Referring to fig. 1to 8 together, a chip inductor 100 according to the present invention will be described. The chip inductor 100 comprises a magnetic core 10, a coil 21, two guide pins 22, a packaging seat 30 and two end pole pieces 23; the magnetic core 10 comprises a center post 11 and two baffle plates 12, the two baffle plates 12 are respectively arranged at two ends of the center post 11, each baffle plate protrudes out of the center post 11 along the radial direction of the center post 11, a coil 21 is wound on the magnetic core 10, specifically, the coil 21 is wound on the center post 11, so that the two baffle plates 12 play a role of positioning and stopping, and the coil 21 is prevented from falling off from the center post 11; two ends of the coil 21 are respectively extended with an outgoing line 211, and the two outgoing lines 211 are respectively connected with the two guide pins 22, so as to realize the electrical connection of the two guide pins 22 with two ends of the coil 21. The two guide pins 22 are respectively arranged at two ends of the magnetic core 10 so as to support the two guide pins 22 through the magnetic core 10, and specifically, one end of each guide pin 22 is fixed on the baffle plate along the axial direction of the center column 11; the package seat 30 is molded and packaged on the magnetic core 10, namely, the magnetic core 10 is packaged in a mold pressing mode to form the package seat 30 for wrapping the magnetic core 10, so that the package seat 30 supports the magnetic core 10, simultaneously supports the coil 21 in the magnetic core 10 and the guide pins 22 at two ends of the magnetic core 10 to form a fully-closed structure, thereby ensuring good reliability and improving the environment adaptability such as high temperature, high humidity, severe cold, salt fog and the like. The two end pole pieces 23 are respectively buckled at the two ends of the packaging seat 30, and one end of each guide pin 22, which is far away from the center post 11, extends out of the corresponding end face of the packaging seat 30; and one end of each guide pin 22 far away from the center post 11 is fixedly connected with the corresponding end pole piece 23, and meanwhile, the structure can also make the volume of the chip inductor 100 smaller.

Further, in manufacturing the chip inductor 100, the magnetic core 10 may be manufactured first, then the pins 22 may be mounted at both ends of the magnetic core 10, then the coil 21 may be wound around the magnetic core 10, and then the two lead wires 211 at both ends of the coil 21 may be connected to the two pins 22. The assembled magnetic core 10 and the coil 21 are integrally arranged in a die, die pressing and packaging are carried out to form a packaging seat 30 outside the magnetic core 10, and two end pole pieces 23 are pressed and fixed at two ends of the packaging seat 30 so that two guide pins 22 are respectively connected with the two end pole pieces 23; the manufacturing process is simple, the assembly space is not limited, the assembly is convenient, the industrial automatic production is convenient, the reliable connection between the end pole piece 23 and the guide pin 22 and between the guide pin 22 and the coil 21 can be ensured, and the performance of the manufactured chip inductor 100 is ensured.

Compared with the prior art, the chip inductor 100 provided by the invention has the advantages that the guide pins 22 are arranged at the two ends of the magnetic core 10, the two ends of the coil 21 on the magnetic core 10 are connected with the two guide pins 22, and the encapsulation seat 30 is manufactured on the magnetic core 10 through mould pressing encapsulation to protect the magnetic core 10, fix the guide pins 22, the magnetic core 10 and the coil 21 on the magnetic core 10 to form a fully-closed structure, ensure good reliability and improve the environment adaptability such as high temperature, high humidity, severe cold, salt fog and the like; the end of the guide pin 22 extends into the packaging seat 30 and is further connected with the end pole piece 23 mounted on the packaging seat 30, so that assembly and manufacture can be performed in a larger space during manufacture, industrial automatic production is facilitated, reliable connection of the end pole piece 23 and the guide pin 22 and reliable connection of the guide pin 22 and the coil 21 can be ensured, and performance of the manufactured chip inductor 100 can be ensured.

Further, referring to fig. 2 to 4 together, as a specific embodiment of the chip inductor 100 provided by the present invention, a lead groove 121 is formed on the periphery of each baffle 12 for the lead wires 211 to pass through, and each lead wire 211 is connected to a corresponding lead pin 22 through the lead groove 121 and across the baffle 12. When the coil 21 extends out of the outgoing line 211, the outgoing line 211 can be connected with the corresponding guide pin 22 beyond the guide line groove 121, connection is convenient, and when the package seat 30 is manufactured by die-pressing and packaging, the risk that the outgoing line 211 of the coil 21 breaks due to the action of external force in the die-pressing process can be effectively reduced. Of course, in other embodiments, openings may be formed in each baffle 12 to connect the lead wires 211 to the lead pins 22 after passing through the openings.

Further, referring to fig. 2 to 4 together, as a specific embodiment of the chip inductor 100 provided by the present invention, N lead grooves 121 are provided around each baffle 12, N is a positive integer, and the product of N and the diameter of the lead wire 211 is smaller than the perimeter of the baffle 12; the N lead grooves 121 are uniformly spaced around the baffle plate 12 so that after the coil 21 of a specific circle is wound in the center post 11, both ends of the coil 21 can be connected with the opposite guide pins 22 through the adjacent lead grooves 121; thereby achieving accurate control of the number of turns up to 1/N of the turns during the winding of the coil 21.

In this embodiment, four lead grooves 121 are provided on each baffle plate 12. In other embodiments, the number of lead slots 121 may be one, two, three, five, etc.

Further, the baffle 12 has a disc shape to facilitate the processing and manufacturing, and to facilitate the determination of the number of turns of the wound coil 21.

Further, the magnetic core 10 is integrally formed, so as to facilitate processing and manufacturing, and ensure good strength of the magnetic core 10.

Further, referring to fig. 2 to 4 together, as an embodiment of the chip inductor 100 provided by the present invention, the magnetic core 10 is a soft magnetic core, that is, the magnetic core 10 is made of a soft magnetic material. Specifically, the soft magnetic core is a ferrite core, a permalloy core, an iron powder core, a soft magnetic material doped polymer material core, or the like, that is, the core 10 may be made of ferrite, permalloy, iron powder, a soft magnetic material doped polymer material, or the like.

Further, referring to fig. 2 to 4 together, as an embodiment of the chip inductor 100 provided by the present invention, the magnetic core 10 is a non-magnetic core, that is, the magnetic core 10 may be made of a non-magnetic material. Specifically, the nonmagnetic core is an alumina ceramic core, a dielectric ceramic core, a polymer nonmagnetic material core, or the like, that is, the core 10 may be made of alumina ceramic, dielectric ceramic, polymer nonmagnetic material, or the like.

Further, referring to fig. 2 to 4 together, as an embodiment of the chip inductor 100 provided by the present invention, each baffle 12 is provided with a jack 122, and one end of each guide pin 22 is inserted into the jack 122. A receptacle 122 is provided in the baffle 12 to facilitate the installation of the fixed lead 22.

Further, each of the insertion holes 122 is coaxial with the center post 11. This construction also allows the guide pin 22 to be coaxial with the center post 11 for ease of manufacture when the guide pin 22 is inserted into the receptacle 122. Further, each of the insertion holes 122 is located at the center of the baffle plate 12, so that the guide pin 22 does not need to be positioned during molding and packaging, thereby facilitating processing and manufacturing.

Further, referring to fig. 2 to 4 together, as a specific embodiment of the chip inductor 100 provided by the present invention, each lead wire 211 of the coil 21 is wound on the corresponding lead pin 22, so that the lead wires 211 and the lead pins 22 are well and fixedly connected.

Further, each outgoing line 211 of the coil 21 is welded to the corresponding lead 22, so that each outgoing line 211 can be better fixedly connected to the corresponding lead 22, and the lead 22 is electrically connected to the outgoing line 211.

Further, the coil 21 is wound by wires such as enameled wires or electronic wires, so that the cost is reduced, and the reliability of the inductor is ensured. Specifically, the enameled wire can be enameled copper wire, enameled manganese copper wire, enameled aluminum wire, enameled silver wire, enameled stranded wire and the like. The electronic wire can be an aluminum core electronic wire, a copper core electronic wire, a silver-coated copper electronic wire, a silver core electronic wire and the like.

Further, each of the leads 22 may be made of a conductive material having a certain mechanical strength and a low dc resistance, such as phosphor bronze tin plating, phosphor bronze gold plating, copper-clad steel tin plating, copper-clad steel plating, and the like, and has good soldering performance. So as to be connected to the outgoing line 211 of the coil 21 while reducing loss and improving the reliability of the inductor.

Further, referring to fig. 1 and fig. 4 to fig. 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the package base 30 is manufactured by molding and packaging, and encapsulates the magnetic core 10, so as to protect the coil 21 and the functional modules such as the magnetic core 10, and realize the integrated design of the core component structure of the chip inductor 100, so as to form a closed structure, thereby improving the environment adaptability.

Further, the package base 30 may be made of a nonmagnetic epoxy-based packaging material, a dielectric material, a soft magnetic material doped polymer composite material, or other materials suitable for mold pressing packaging. The chip inductor 100 can be adjusted and effectively controlled in terms of electrical performance and reliability by selecting different packaging materials.

Further, referring to fig. 1 and fig. 4 to fig. 6, as a specific embodiment of the chip inductor 100 provided by the present invention, two ends of the package base 30 are respectively provided with a receiving groove 31, and each end pole piece 23 is mounted in the corresponding receiving groove 31. Receiving grooves 31 are provided at both ends of the package base 30 to position and mount the fixed end pole piece 23.

Further, an epoxy adhesive layer is provided in the receiving groove 31 to weld the fixed end pole piece 23.

Further, referring to fig. 1 and fig. 5 to fig. 8 together, as a specific embodiment of the chip inductor 100 provided by the present invention, each receiving groove 31 on the package base 30 extends from the end surface of the package base 30 to two sides of the package base 30, and each end pole piece 23 covers the corresponding receiving groove 31, so that the structure designs the end pole piece 23 into a U-shape to be better fastened on the package base 30, not only can the end pole piece 23 be more stably mounted on the package base 30, but also pins can be formed on two sides of the package base 30, so as to facilitate welding from two sides of the package base 30.

Further, positioning holes 32 are respectively formed on two sides of the package base 30 at positions corresponding to corners of the accommodating grooves 31, and positioning posts 232 protrude inward from corners of two ends of the end pole pieces 23. When the structure is used for installing the end pole piece 23, each positioning column 232 on the end pole piece 23 can be inserted into each positioning hole 32 in the accommodating groove 31, so that the end pole piece 23 is fixed on the packaging seat 30 through a mechanical matching scheme, and the installation firmness of the end pole piece 23 is ensured.

Further, through holes 231 for inserting the guide pins 22 are correspondingly formed in each end pole piece 23, and each guide pin 22 is inserted into the corresponding through hole 231 and is welded with the end pole piece 23. Through holes 231 are formed in the end pole pieces 23, and when the guide pins 22 are installed, the guide pins 22 can extend into the corresponding through holes 231, so that the guide pins 22 can be connected with the end pole pieces 23 in a welding mode, and firm connection between the guide pins 22 and the end pole pieces 23 is guaranteed.

Further, each through hole 231 is formed in a gradually expanding shape from the inner surface to the outer surface of the end piece 23. The through holes 231 are gradually expanded, so that the contact area among the guide pin 22, the end pole piece 23 and the solder can be increased during welding, and the welding reliability between the guide pin 22 and the end pole piece 23 is effectively improved. Furthermore, each through hole 231 is tapered to facilitate processing and positioning during welding, and improve the welding reliability of the guide pin 22 and the end pole piece 23. Further, the lead 22 and the through hole 231 may be embedded with a build-up welding to ensure the welding firmness.

Further, referring to fig. 1 and fig. 6 to fig. 8, as an embodiment of the chip inductor 100 provided by the present invention, the end plate 23 may be made of a conductive metal material or a non-metal material with a surface metalized treatment.

Specifically, the end pole piece 23 may be a metal end pole piece, that is, the end pole piece 23 may be made of a metal material. More specifically, the metal end pole piece may be a phosphor bronze tin-plated end pole piece, a phosphor bronze gold-plated end pole piece, a copper-clad steel tin-plated end pole piece, a copper-clad steel gold-plated end pole piece, or the like, that is, the end pole piece 23 may be made of phosphor bronze tin plating, phosphor bronze gold plating, copper-clad steel tin plating, copper-clad steel gold plating, or the like.

Specifically, the end pole piece 23 may be a plastic-metal composite end pole piece, that is, the end pole piece 23 may be made of a plastic-metal composite material. More specifically, the plastic-metal composite end pole piece may be an bakelite-based metal-fit end pole piece, a PPS (polyphenylene sulfide) -based metal-fit end pole piece, a surface-metallized end pole piece, or the like. The end plate 23 can be made of materials such as bakelite-based metal fitting, PPS (polyphenylene sulfide) -based metal fitting, and surface-metallized non-conductive materials.

Further, referring to fig. 1 and fig. 6 to fig. 8, as a specific embodiment of the chip inductor 100 provided by the present invention, the end piece 23 has a symmetrical structure at two ends, so that the outer surfaces of the two ends of the end piece 23 respectively form pads of the inductor at two sides of the package base 30, and can be used for mounting. And the two end pole pieces 23 are identical in structure, so that the design and processing cost can be effectively reduced.

Further, referring to fig. 1 to 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the chip inductor 100 is made of a soft magnetic core, an enamel wire, a metal end piece, and an epoxy resin molding material.

Further, referring to fig. 1 to 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the chip inductor 100 is made of a soft magnetic core, an enamel wire, a metal end piece, and a dielectric material molding material.

Further, referring to fig. 1 to 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the chip inductor 100 is made of a non-magnetic core, an enamel wire, a plastic-metal composite end plate, and a polymer composite molding material doped with a soft magnetic material.

Further, referring to fig. 1 to 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the chip inductor 100 is made of a non-magnetic core, an electronic wire, a metal end plate, and a soft magnetic material doped polymer composite molding material.

Further, referring to fig. 1 to 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the chip inductor 100 is made of a non-magnetic core, an electronic wire, a plastic-metal composite end plate, and a dielectric material molding compound.

Further, referring to fig. 1 to 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the chip inductor 100 is prepared from a dielectric ceramic core, an enamel wire, a metal end plate, and a polymer composite material doped with a soft magnetic material.

Further, referring to fig. 1 to 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the chip inductor 100 is made of a non-magnetic material magnetic core, an enamel wire, a plastic-metal composite end pole piece, and an epoxy resin molding material.

Further, referring to fig. 1 to 6, as a specific embodiment of the chip inductor 100 provided by the present invention, the chip inductor 100 is made of a polymer non-magnetic material core, an electron beam, a metal end plate, and a soft magnetic material doped polymer composite molding material.

Embodiment two:

Referring to fig. 9, the chip inductor 100 of the present embodiment is different from the chip inductor of the first embodiment in that:

The surface of the package base 30 is provided with a marking pattern 40 for facilitating the selection of the shape in use. The logo pattern 40 may be made in an additive or in situ decoration manner. Specifically, the additive manufacturing mode can be a mode of printing ink, spraying paint, high-energy beam co-material or different-material melting and coating and the like. The in-situ decoration manufacturing mode can be a laser engraving mode, a mechanical engraving mode and the like.

Other structures of the chip inductor 100 in this embodiment are the same as those of the chip inductor in the first embodiment, and will not be described here again.

Embodiment III:

referring to fig. 10, the chip inductor 100 of the present embodiment is different from the chip inductor of the first embodiment in that:

the surface of the end piece 23 is provided with a marking pattern 40 to facilitate the selection of the shape in use. The logo pattern 40 may be made in an additive or in situ decoration manner. Specifically, the additive manufacturing mode can be a mode of printing ink, spraying paint, high-energy beam co-material or different-material melting and coating and the like. The in-situ decoration manufacturing mode can be a laser engraving mode, a mechanical engraving mode and the like.

The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.

Claims

1. Chip inductor, its characterized in that: the magnetic core comprises a magnetic core, a coil wound on the magnetic core, two guide pins respectively arranged at two ends of the magnetic core, a packaging seat which is packaged on the magnetic core in a mould pressing manner, and end pole pieces respectively buckled at two ends of the packaging seat; the magnetic core comprises a center column and baffle plates arranged at two ends of the center column, and each baffle plate protrudes out of the center column along the radial direction of the center column; one end of each guide pin is fixed on the baffle plate along the axial direction of the middle column, the coil is wound on the middle column, two ends of the coil extend out to form outgoing lines which are respectively connected with the two guide pins, the packaging seat wraps the magnetic core, one end of each guide pin, which is far away from the middle column, extends out of the corresponding end face of the packaging seat, and one end of each guide pin, which is far away from the middle column, is fixedly connected with the corresponding end pole piece; after the packaging seat is molded by compression, each end pole piece is buckled at the corresponding end of the packaging seat, a through hole for the guide pin to be inserted is correspondingly formed in each end pole piece, each guide pin is inserted into the corresponding through hole and is connected with the end pole piece by welding, each through hole is gradually expanded from the inner surface to the outer surface of the end pole piece, and each through hole is conical;

The two ends of the packaging seat are respectively provided with a containing groove, each end pole piece is arranged in the corresponding containing groove, each containing groove extends from the end face of the packaging seat to the two sides of the packaging seat, each end pole piece covers the corresponding containing groove, the two sides of the packaging seat are respectively provided with a positioning hole at each corner corresponding position of each containing groove, and each corner of the two ends of each end pole piece is internally protruded with a positioning column.

2. The chip inductor of claim 1, wherein: and the periphery of each baffle plate is provided with a lead groove for the lead wires to pass through, and each lead wire passes through the lead groove and passes over the baffle plate to be connected with the corresponding guide pin.

3. The chip inductor of claim 2, wherein: n lead grooves are uniformly arranged on the periphery of each baffle at intervals, N is a positive integer, and the product of N and the diameter of the outgoing line is smaller than the perimeter of the baffle.

4. A chip inductor as claimed in any one of claims 1 to 3, wherein: the baffle plates are provided with jacks, and one end of each guide pin is inserted into each jack.

5. A chip inductor as claimed in any one of claims 1 to 3, wherein: each outgoing line is wound on the corresponding guide pin.