CN109411921B - High-frequency large-current USB socket - Google Patents

Abstract

A high-frequency large-current USB socket comprises a middle plate, a first terminal group, a second terminal group and an insulating body, wherein the first terminal group and the second terminal group are respectively positioned on the upper side and the lower side of the middle plate, the insulating body integrates the middle plate with the first terminal group and the second terminal group, the first terminal group and the second terminal group respectively sequentially comprise a grounding terminal, a high-frequency signal terminal, a power terminal, a conventional signal terminal, a power terminal, a high-frequency signal terminal and a grounding terminal in the transverse direction, the thickness of the grounding terminal and the thickness of the power terminal are larger than that of the high-frequency signal terminal and the conventional signal terminal, the part of the middle plate positioned between the power terminal and the conventional signal terminal is cut off to form a left part and a right part, and each middle plate comprises a main plate part positioned between the high-frequency. The application supports high-frequency transmission and high-power transmission.

Description

High frequency high current USB socket

technical field

The present application relates to the field of electrical connectors, in particular to a high-frequency high-current USB socket.

Background technique

The existing USB 3.1 Type C socket generally includes a middle plate and first and second terminal groups located on the upper and lower sides of the middle plate. In the association's standard, the standard for power transmission is only 2A, and the current smart phone basically needs to be charged with a large current. Therefore, the standard structure can no longer meet the needs of the market. And there are several different kinds of high-current versions, that is, the middle part of the middle plate is cut off, and the outer part of the middle plate is left directly in contact with the ground terminal for grounding. However, this structure sacrifices the high-frequency transmission performance of the socket, because the shielding of the mid-plane between the high-frequency signals is missing, and high-frequency transmission cannot be achieved. In addition, the transmission of high-frequency signals requires that the ground terminal cannot be connected to the mid-plane to be grounded.

SUMMARY OF THE INVENTION

In view of this, it is necessary to provide a high-frequency and high-current USB socket that supports high-frequency transmission and can carry high-current charging.

In order to solve the above technical problems, the present application provides a high-frequency high-current USB socket, which includes a middle plate, first and second terminal groups located on the upper and lower sides of the middle plate, and a connection between the middle plate and the The first and second terminals form an integral insulating body, and the first and second terminal groups respectively include ground terminals, high-frequency signal terminals, power terminals, conventional signal terminals, power terminals, and high-frequency terminals in the lateral direction. Signal terminals and ground terminals, the thicknesses of the ground terminals and the power terminals are greater than the terminal thicknesses of the high-frequency signal terminals and the conventional signal terminals, and the part of the middle plate between the power terminals and the conventional signal terminals is cut off and formed There are two left and right plates, and each middle plate includes a main body plate portion located between the high-frequency signal terminals and a protruding portion extending from the front end of the main body plate portion to the outside in the lateral direction.

Preferably, a groove structure is formed on the ground terminal corresponding to the position of the protruding portion to avoid the protruding portion so that the middle plate does not contact the grounding terminal.

Preferably, the high-frequency signal terminal and the conventional signal terminal are integrally stamped and formed, and the thickness of the terminal is between 0.09 mm and 0.13 mm.

Preferably, the power terminal and the ground terminal are integrally stamped and formed, and the thickness of the terminal is between 0.19 mm and 0.21 mm.

Preferably, the power terminal and the ground terminal are integrally stamped and formed, and the thickness of the terminal is between 0.24 mm and 0.26 mm.

Preferably, each of the conductive terminals of the first and second terminal groups includes a contact portion, a holding portion formed by extending backward from the contact portion, and a solder leg extending out of the insulating body from the holding portion.

Preferably, the holding portion of the first or second terminal group is bent in a direction away from the middle plate to form a bending portion, and the middle plate corresponds to the bending direction of the holding portion of the first or second terminal group. The bending increases the distance between the middle plate and the holding parts on the upper and lower sides.

Preferably, the holding parts of the first and second terminal groups are respectively bent away from each other to form bent parts, so that the distance between the middle plate and the holding parts on the upper and lower sides is increased.

Preferably, the width of the middle plate at the position corresponding to the holding portion is greater than the width of the main body plate portion, the middle plate is provided with two circulation holes at the position corresponding to the holding portion, and the circulation holes correspond to the Space between conductive terminals.

Preferably, the middle plate extends laterally outward from the insulating body corresponding to the position of the holding portion to connect material tapes.

The thickness of the ground terminal and the power terminal of the present application is larger than that of the high-frequency signal terminal and the conventional signal terminal to support high-power charging. The main body plate of the middle plate is arranged between the high-frequency signal terminals of the first and second terminal groups. In order to shield the interference between high-frequency signals, and the front end of the middle plate extends to the lateral outer side to form a protrusion exposed to the outside of the mating tongue to be latched with the plug, and the ground terminal corresponds to the position of the protrusion The groove structure is formed by thinning to avoid the protrusions from contacting each other. While realizing the transmission of high current and high power power supply, it does not affect the transmission of high frequency signals.

The rear ends of the holding parts of the first and/or second terminal groups are bent in a direction away from each other, so that the distance between the holding parts is increased, so that the middle plate can extend laterally outward at this position. to connect the tape and extend the solder legs.

Description of drawings

The drawings described herein are used to provide further understanding of the present application and constitute a part of the present application. The schematic embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation of the present application. In the attached image:

1 is a perspective view of a high-frequency high-current USB socket of the application;

2 is a perspective exploded view of a high-frequency high-current USB socket of the application;

3 is a top view of the first and second conductive terminals and the middle plate of the high-frequency high-current USB socket of the application;

4 is a top view of the middle plate and the second conductive terminal of the high-frequency high-current USB socket of the present application;

5 is a side view of the first and second conductive terminals and the middle plate of the high-frequency high-current USB socket of the application;

6 is a perspective view of a mid-board of a high-frequency high-current USB socket of the present application;

7 is a cross-sectional view of the application along the dotted line A-A in FIG. 1;

FIG. 8 is a cross-sectional view of the application along the dotted line B-B shown in FIG. 1 .

Detailed ways

In order to make the objectives, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be clearly and completely described below with reference to the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

Please refer to FIG. 1 and FIG. 2 , the high-frequency high-current USB socket of the present application includes a middle plate 40 , first and second terminal groups 20 and 30 respectively located on the upper and lower sides of the middle plate 40 , and the middle plate 40 . The board 40 and the first and second terminal groups 20 and 30 are formed into an integral insulating body 10 .

The insulating body 10 includes a first insulator 11 pre-molded into one of the first terminal group 20 , a second insulator 12 pre-molded into one of the second terminal group 30 and the middle plate 40 , and the first insulator 12 . An insulator 11 and a third insulator 13 are integrally formed with the second insulator 12 . The third insulator 13 includes a base portion 131 , a butt tongue portion 132 extending forward from the base portion 131 , and a tail portion 133 located at the rear end of the base portion 131 and completely isolated from the base portion 131 .

Please refer to FIG. 3 , FIG. 4 , and FIG. 5 , the first and second terminal groups 20 , 30 sequentially include ground terminals 201 , 301 , high-frequency signal terminals 202 , 302 , Power terminals 203, 303, regular signal terminals 204, 304, power terminals 203, 303, high frequency signal terminals 202, 302 and ground terminals 201, 301.

The terminal thickness of the ground terminals 201, 301 and the power terminals 203, 303 is 0.2 mm or 0.25 mm; the terminal thickness of the conventional signal terminals 204, 304 and the high frequency signal terminals 202, 302 is 0.12 mm; carry more current.

Each of the conductive terminals of the first and second terminal groups 20 and 30 includes contact portions 21 and 31 exposed on the upper and lower surfaces of the mating tongue portion 132 , and retaining portions extending backward from the contact portions 21 and 31 are formed. parts 22 and 32 and solder legs 23 and 33 extending backward from the holding parts 22 and 32 and out of the insulating body 10 .

The holding parts 22 , 32 of the first or second terminal groups 20 , 30 are bent upward at the position of the base 131 of the insulating body 10 to form a bending part 321 , so that the first and second terminal groups 20 , 30 The distance between the portions of the holding portions 22 and 32 located behind the bent portion 321 increases. In a specific embodiment, the holding portions 22 , 32 of the first and second terminal groups 20 , 30 may be respectively bent and extended in opposite directions to increase the distance between the holding portions 22 , 32 .

6 , the part of the middle board 40 located between the power terminals 203 , 303 and the conventional signal terminals 204 , 304 is completely cut away, thereby forming two independent middle board structures on the left and right. Each independent middle plate 40 includes a main body plate portion 41 extending in the insertion and extraction direction, a protruding portion 42 extending from the front end of the main body plate portion 41 to the lateral outer side, and a raised portion formed at the rear end of the main body plate portion 41 part 44 and a welding part 47 extending from the raised part 44 . The raised portion 44 is formed by bending upward from the main body plate portion 41 to extend and form the inclined portion 43 thereby. The lateral width of the raised portion 44 is larger than the lateral width of the main body plate portion 41 , the raised portion 44 is provided with two circulation holes 45 , and the raised portion 44 extends laterally outward to form an extension portion 46 , the lateral outer side of the extension portion 46 is used to connect the material tape to facilitate production automation. The welding portion 47 is formed by extending from the rear end of the extending portion 46 . An outer edge of the protruding portion 42 is provided with a slot 421 for engaging with a plug (not shown), and a through hole 422 is also formed on the protruding portion 42 to facilitate the flow of plastic to hold the middle plate 40 .

4, the main body plate 41 and the raised portion 44 are interposed between the high-frequency signal terminals 202, 302 of the first and second terminal groups 20, 30 to shield the upper and lower rows of high-frequency signals For the interference between the high frequency signals between the terminals 202 and 302 , the flow holes 45 on the raised portion 44 correspond to the gaps between the terminals in the vertical direction to facilitate the flow of plastic.

The holding parts 22 , 32 of the first or second terminal group 20 , 30 are bent and extended to the side away from each other so that there is a sufficient distance between the holding parts 22 , 32 to make the raised part 44 ideal. The laterally outer side extends and connects the tape.

In one embodiment, the middle plate 40 is not provided with the raised portion 44 , and the raised portion 44 is only a part of the main body plate portion 41 , that is, where the main body plate portion 41 and the raised portion 44 are located. Parts are at the same level. On the other hand, the holding portions 22 and 32 of the first and second terminal groups 20 and 30 are both bent and extended in a direction away from each other. In this way, the holding portions of the first and second terminal groups 20 and 30 can be guaranteed. The distance between 22, 32 leaves room for the middle plate 40 to extend laterally.

4 and 5 , the front ends of the grounding terminals 201 and 301 are thinned toward the position of the protruding portion 42 to form groove structures 2011 and 3011 so that the protruding portion 42 extends laterally out of the grounding terminal. 201 and 301 are not in contact with the ground terminal. At the position of the raised portion 44, there is already a sufficient distance for the raised portion 44 to extend laterally.

Please refer to FIG. 7 and FIG. 8 , the first and second terminal groups of the middle plate 40 except the protrusions 42 extending outwardly through the groove structures 2011 , 3011 of the ground terminals 201 , 301 The middle plate 40 does not exist between the grounding terminals 201 and 301 of 20 and 30. In this way, the grounding terminals 201 and 301 can be thickened to 0.19mm-0.21mm or 0.24mm-0.26mm to carry a larger current . There is no middle plate 40 between the power terminals 203 and 303 of the first and second terminal groups 20 and 30. Similarly, the power terminals 203 and 303 can be thickened to 0.19mm~0.21mm or 0.24mm~ 0.26mm to carry larger current.

While the conventional signal terminals 204 and 304 transmit conventional signals, there is no need to shield the conventional signals between the first and second terminal groups 20 and 30 , that is, there is no midplane between the conventional signal terminals 204 and 304 . 40.

The ground terminals 201, 301 and the power terminals 203, 303 have the same terminal thickness and are integrally stamped; the high-frequency signal terminals 202, 302 and the conventional signal terminals 204, 304 have the same terminal thickness (0.09mm~0.13mm) And one-piece stamping molding.

The thickness of the ground terminal and the power terminal of the present application is larger than that of the high-frequency signal terminal and the conventional signal terminal to support high-power charging. The main body plate of the middle plate is arranged between the high-frequency signal terminals of the first and second terminal groups. In order to shield the interference between high-frequency signals, and the front end of the middle plate extends to the lateral outer side to form a protrusion exposed to the outside of the mating tongue to be latched with the plug, and the ground terminal corresponds to the position of the protrusion The groove structure is formed by thinning to avoid the protrusions from contacting each other. While realizing the transmission of high current and high power power supply, it does not affect the transmission of high frequency signals.

The rear ends of the holding parts of the first and/or second terminal groups are bent in a direction away from each other, so that the distance between the holding parts is increased, so that the middle plate can extend laterally outward at this position. to connect the tape and extend the solder legs.

It should also be noted that the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a series of elements includes not only those elements, but also Other elements not expressly listed, or which are inherent to such a process, method, article of manufacture, or apparatus are also included. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article of manufacture, or device that includes the element.

The above descriptions are merely examples of the present application, and are not intended to limit the present application. Various modifications and variations of this application are possible for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the scope of the claims of this application.

Claims (9)

1. A high-frequency high-current USB socket, comprising a middle plate, first and second terminal groups located on the upper and lower sides of the middle plate respectively, and the middle plate and the first and second terminals are formed into a type. An integrated insulating body, the first and second terminal groups respectively include ground terminals, high-frequency signal terminals, power terminals, conventional signal terminals, power terminals, high-frequency signal terminals and ground terminals in sequence in the lateral direction, and it is characterized in that , the thickness of the ground terminal and the power terminal is greater than the thickness of the high-frequency signal terminal and the conventional signal terminal, the part of the middle plate between the power terminal and the conventional signal terminal is cut off and formed into two left and right pieces, each The board in the block includes a main body plate portion located between the high-frequency signal terminals and a protruding portion extending from the front end of the main body plate portion to the outside in the lateral direction, and the grounding terminal is pressed to form a groove corresponding to the position of the protruding portion The structure is designed to avoid the protruding portion so that the middle plate does not contact the ground terminal. 2 . The high-frequency high-current USB socket according to claim 1 , wherein the high-frequency signal terminal and the conventional signal terminal are integrally stamped and formed, and the terminal thickness is between 0.09 mm and 0.13 mm. 3 . 3 . The high-frequency high-current USB socket of claim 1 , wherein the power terminal and the ground terminal are integrally stamped and formed, and the thickness of the terminal is between 0.19 mm and 0.21 mm. 4 . 4 . The high-frequency high-current USB socket according to claim 1 , wherein the power terminal and the ground terminal are integrally stamped and formed, and the thickness of the terminal is between 0.24 mm and 0.26 mm. 5 . 5 . The high-frequency and high-current USB socket according to claim 1 , wherein each conductive terminal of the first and second terminal groups comprises a contact portion, and a retaining portion extending backward from the contact portion is formed. 6 . part and a welding leg extending out of the insulating body from the holding part. 6 . The high-frequency high-current USB socket according to claim 5 , wherein the holding portion of the first or second terminal group is bent in a direction away from the middle plate to form a bent portion, and the middle plate is folded. 7 . Bending according to the bending direction of the holding portion of the first or second terminal group increases the distance between the middle plate and the holding portions on the upper and lower sides. 7 . The high-frequency high-current USB socket according to claim 5 , wherein the holding parts of the first and second terminal groups are respectively bent away from each other to form bent parts, so that the middle plate is connected to the upper and lower parts. 8 . The distance between the holding portions on both sides increases. 8 . The high-frequency and high-current USB socket according to claim 6 , wherein the width of the middle plate corresponding to the position of the holding portion is greater than the width of the main body plate portion, and the middle plate corresponding to the Two flow holes are provided at the position of the holding portion, and the flow holes correspond to the gaps between the conductive terminals. 9 . The high-frequency high-current USB socket according to claim 6 or 7 , wherein the middle plate extends laterally outward from the insulating body corresponding to the position of the holding portion to connect material tapes. 10 .

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