CN109486346B - High-temperature-resistant sealing agent and preparation method and application thereof - Google Patents
High-temperature-resistant sealing agent and preparation method and application thereof Download PDFInfo
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- CN109486346B CN109486346B CN201811271765.3A CN201811271765A CN109486346B CN 109486346 B CN109486346 B CN 109486346B CN 201811271765 A CN201811271765 A CN 201811271765A CN 109486346 B CN109486346 B CN 109486346B
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- 238000007789 sealing Methods 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 52
- 239000004593 Epoxy Substances 0.000 claims abstract description 51
- 239000002966 varnish Substances 0.000 claims abstract description 22
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 229920013822 aminosilicone Polymers 0.000 claims abstract description 8
- 239000000565 sealant Substances 0.000 claims description 26
- 239000004611 light stabiliser Substances 0.000 claims description 22
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000008096 xylene Substances 0.000 claims description 12
- 229920002050 silicone resin Polymers 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 9
- 229920000137 polyphosphoric acid Polymers 0.000 claims description 8
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 6
- 239000012720 thermal barrier coating Substances 0.000 claims description 5
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 4
- 238000005303 weighing Methods 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 43
- 239000011248 coating agent Substances 0.000 abstract description 42
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract description 28
- 150000003839 salts Chemical class 0.000 abstract description 12
- 239000007921 spray Substances 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 10
- 238000005260 corrosion Methods 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 8
- 230000035939 shock Effects 0.000 abstract description 5
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 230000003064 anti-oxidating effect Effects 0.000 abstract 1
- 239000011253 protective coating Substances 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 28
- 229910052710 silicon Inorganic materials 0.000 description 28
- 239000010703 silicon Substances 0.000 description 28
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 6
- 239000004590 silicone sealant Substances 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000002679 ablation Methods 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000012856 weighed raw material Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- -1 water vapor Chemical class 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/47—Levelling agents
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/329—Phosphorus containing acids
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- Paints Or Removers (AREA)
Abstract
本发明公开了一种耐高温封闭剂及其制备方法与应用，属于热防护涂层领域。所述耐高温封闭剂，其原料包括以下质量份组份：环氧有机硅清漆100份及氨基硅油固化剂90‑110份。所述封闭剂应用于铝包氧化铝涂层表面，可明显提升其耐盐雾腐蚀性能，经历192h交变盐雾考核基材不腐蚀；另外该封闭剂应用于氧化锆涂层表面，可提高其抗氧化性能，经历室温‑1000℃热震三次后，氧化锆涂层仍不脱落。
The invention discloses a high temperature resistant sealing agent, a preparation method and application thereof, and belongs to the field of thermal protective coatings. The raw materials of the high temperature resistant sealing agent include the following components by mass: 100 parts of epoxy silicone varnish and 90-110 parts of amino silicone oil curing agent. The sealing agent is applied to the surface of the aluminum-coated alumina coating, which can significantly improve its resistance to salt spray corrosion, and the substrate does not corrode after 192 hours of alternating salt spray assessment; in addition, the sealing agent is applied to the surface of the zirconia coating, which can improve Its anti-oxidation performance, after three thermal shocks at room temperature-1000℃, the zirconia coating still does not fall off.
Description
Technical Field
The invention relates to a preparation method and application of an epoxy organosilicon high-temperature-resistant sealant, which can be applied to the surface of a ceramic-based coating to improve the oxidation resistance and the corrosion resistance of the ceramic-based coating, and belongs to the field of thermal protection coatings.
Background
The ceramic-based coating has the advantages of high temperature resistance, strong bonding force and the like, can be used as a thermal barrier coating to be applied to the surface of a metal substrate, and realizes thermal protection on the substrate. However, the ceramic-based coating often has a porous structure, and in environments such as salt spray, damp heat and the like, small molecules such as water vapor, inorganic salts and the like easily permeate through pores of the ceramic-based coating to the substrate, so that pitting corrosion occurs on the metal substrate, and the local bonding force between the ceramic-based coating and the substrate is reduced. In addition, in the high-temperature aerobic environment, oxygen molecules penetrate through the pores of the ceramic-based coating and permeate to the surface of the metal substrate, so that the substrate is oxidized.
The organic sealant has good leveling property and permeability, and can seal micropores on the surface of the ceramic-based coating to improve the corrosion resistance of the ceramic-based coating. The traditional sealant adopts epoxy resin or acrylic resin, although good sealing effect can be achieved, the epoxy resin has poor environmental resistance, and can be seriously yellowed and pulverized when being applied to a marine environment for a long time, so that the sealing effect is seriously influenced. Although the acrylic resin has good weather resistance, the temperature resistance of the acrylic resin is poor, and the acrylic resin cannot be applied to a high-temperature environment with the temperature higher than 500 ℃. At present, epoxy organic silicon is difficult to cure due to construction below 15 ℃, and is difficult to apply to the field of sealing agents.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a high-temperature-resistant sealing agent and a preparation method and application thereof, wherein the sealing agent is applied to the surface of an aluminum-clad aluminum oxide coating, can obviously improve the salt spray corrosion resistance of the aluminum-clad aluminum oxide coating, and is not corroded after passing 192h alternating salt spray examination; in addition, the sealing agent is applied to the surface of the zirconia coating, the oxidation resistance of the zirconia coating can be improved, and the zirconia coating still cannot fall off after the zirconia coating is subjected to thermal shock for three times at room temperature of 1000 ℃ below zero.
In order to achieve the above purpose, the invention provides the following technical scheme:
a high-temperature resistant sealing agent comprises the following raw materials in parts by mass:
100 parts of epoxy organic silicon varnish and 90-110 parts of amino silicone oil curing agent.
In an optional embodiment, the epoxy silicone varnish comprises the following components in parts by mass:
100 parts of epoxy organic silicon resin, 1.5-2.5 parts of polyphosphoric acid leveling agent, 1.5-2.5 parts of modified organic silicon leveling agent, 1.5-2.5 parts of ultraviolet light stabilizer, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.
In an alternative embodiment, a method of making the epoxy silicone resin includes:
mixing 100 parts by mass of epoxy resin and 90-110 parts by mass of xylene, dissolving at 80-100 ℃ for 2-3h, adding 35-45 parts by mass of organosilicon intermediate and 1-3 parts by mass of isopropyl titanate, heating to 130-140 ℃, and reacting for 4-5h until the solution is clear and transparent.
In an alternative embodiment, the molecular structure of the silicone intermediate is represented by the following formula:
wherein n is 10-15.
In an alternative embodiment, the polyphosphoric acid leveling agent is BYK358, BYK, germany.
In an alternative embodiment, the modified silicone leveling agent is BYK320, BYK, germany.
In an alternative embodiment, the ultraviolet light stabilizer is 220 from BYK, Germany.
In an alternative embodiment, the visible light stabilizer is 9061 from BYK, germany.
In an alternative embodiment, the solvent is at least one of xylene, butyl acetate, toluene, acetone, or ethyl acetate.
In an alternative embodiment, the molecular structure of the curing agent is as follows:
wherein n is 9-14.
A preparation method of a high-temperature resistant sealant comprises the following steps:
(1) weighing the following raw materials in proportion:
100 parts of epoxy organic silicon varnish and 90-110 parts of amino silicone oil curing agent;
(2) and mixing the weighed raw materials to obtain the high-temperature-resistant sealing agent.
In an optional embodiment, the epoxy silicone varnish comprises the following raw materials in parts by mass:
100 parts of epoxy organic silicon resin, 1.5-2.5 parts of polyphosphoric acid leveling agent, 1.5-2.5 parts of modified organic silicon leveling agent, 1.5-2.5 parts of ultraviolet light stabilizer, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.
In an optional embodiment, the varnish raw material is stirred for more than 30 minutes at a rotating speed of more than 400 revolutions per minute to obtain the epoxy silicone varnish.
In an alternative embodiment, a method of making the epoxy silicone resin includes:
mixing 100 parts by mass of epoxy resin and 90-110 parts by mass of xylene, dissolving at 80-100 ℃ for 2-3h, adding 35-45 parts by mass of organosilicon intermediate and 1-3 parts by mass of isopropyl titanate, heating to 130 ℃ and 140 ℃, and reacting for 4-5h until the solution is clear and transparent.
In an alternative embodiment, the molecular structure of the silicone intermediate is represented by the following formula:
wherein n is 10-15.
In an alternative embodiment, the solvent is at least one of xylene, butyl acetate, toluene, acetone, or ethyl acetate.
In an alternative embodiment, the molecular structure of the curing agent is as follows:
wherein n is 9-14.
The high-temperature-resistant sealant is applied to a ceramic-based thermal barrier coating.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the high-temperature-resistant sealant provided by the embodiment of the invention, epoxy organic silicon resin is used as a film forming agent, and an amino silicone oil curing agent is used for realizing rapid curing at the temperature below 15 ℃;
(1) compared with the traditional epoxy organic silicon resin, the epoxy organic silicon resin prepared by the method provided by the embodiment of the invention has the advantages that on the premise that other basic properties are not changed, the thermal weight loss at 600 ℃ is reduced to 60%, the toughness is improved to 52%, and the problem that the commercially available epoxy organic silicon resin does not have corrosion resistance after flame ablation at more than 600 ℃ is avoided; (2) the novel high-temperature-resistant sealing agent is applied to an aluminum-clad aluminum oxide coating, still has good salt spray corrosion resistance after being ablated for 5s at 1800 ℃, and is not corroded after passing 192h alternating salt spray examination.
(3) The novel high-temperature-resistant sealing agent is applied to the surface of the zirconia coating, can improve the oxidation resistance of the zirconia coating, and the zirconia coating still does not fall off after three thermal shocks at room temperature of 1100 ℃ below zero.
Drawings
FIG. 1 is a graph of the thermal weight loss of epoxy silicone resin sealant and epoxy resin sealant provided in example 1;
FIG. 2 is a graph of corrosion after subjecting an alumina-epoxy silicone sealer coating system (left) and an alumina-conventional sealer coating system (right) in example 1 to ablation at 1800 ℃ for 5s for 192h alternating salt spray examination;
FIG. 3 is a graph of the surface state of the zirconia-epoxy silicone sealant system of example 1 (left) after three thermal shock tests at room temperature-1100 ℃ with a single zirconia coating (right).
Detailed Description
The following detailed description of embodiments of the invention will be made with reference to the accompanying drawings and specific examples.
The embodiment of the invention provides a high-temperature-resistant sealing agent which comprises the following raw materials in parts by mass:
100 parts of epoxy organic silicon varnish and 90-110 parts of amino silicone oil curing agent.
Specifically, in the embodiment of the invention, the epoxy silicone varnish is a transparent coating with epoxy silicone resin as a matrix;
the high-temperature-resistant sealant provided by the embodiment of the invention adopts epoxy organic silicon resin as a film forming agent and adopts amino silicone oil curing agent to realize rapid curing at the temperature below 15 ℃.
Wherein, the molecular structure of the curing agent is preferably as shown in formula (1):
wherein n is 9-14.
In an optional embodiment, the epoxy silicone varnish comprises the following components in parts by mass:
100 parts of epoxy organic silicon resin, 1.5-2.5 parts of polyphosphoric acid leveling agent, 1.5-2.5 parts of modified organic silicon leveling agent, 1.5-2.5 parts of ultraviolet light stabilizer, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent.
The preparation method of the epoxy silicone resin comprises the following steps:
mixing 100 parts by mass of epoxy resin and 90-110 parts by mass of xylene, dissolving at 80-100 ℃ for 2-3h, adding 35-45 parts by mass of organosilicon intermediate and 1-3 parts by mass of isopropyl titanate, heating to 130 ℃ and 140 ℃, and reacting for 4-5h until the solution is clear and transparent. The molecular structure of the organosilicon intermediate is shown as a formula (2):
wherein n is 10-15.
The epoxy organic silicon resin prepared by the method provided by the embodiment of the invention has heat resistance up to more than 600 ℃ and ultraviolet irradiation resistance up to more than 500 h.
The polyphosphoric acid leveling agent is preferably BYK358 of BYK company of Germany; the modified organic silicon flatting agent is preferably BYK320 of Germany BYK company; the ultraviolet light stabilizer is preferably 220 of Germany BYK company; the visible light stabilizer is preferably 9061 of German BYK company; the solvent is preferably at least one of xylene, butyl acetate, toluene, acetone or ethyl acetate.
The embodiment of the invention also provides a preparation method of the high-temperature-resistant sealing agent, which comprises the following steps:
(1) weighing the following raw materials in proportion:
100 parts of epoxy organic silicon varnish and 90-110 parts of amino silicone oil curing agent;
(2) and mixing the weighed raw materials to obtain the high-temperature-resistant sealing agent.
Specifically, the epoxy organic silicon varnish comprises the following raw materials in parts by mass:
100 parts of epoxy organic silicon resin, 1.5-2.5 parts of polyphosphoric acid leveling agent, 1.5-2.5 parts of modified organic silicon leveling agent, 1.5-2.5 parts of ultraviolet light stabilizer, 1.5-2.5 parts of visible light stabilizer and 90-110 parts of solvent. Stirring the varnish raw material at a rotating speed of more than 400 rpm for more than 30 minutes to obtain the epoxy organic silicon varnish.
The raw materials used in the embodiments of the present invention are provided in the raw material embodiments, and specific descriptions and effects are provided in the above embodiments, which are not repeated herein.
The embodiment of the invention also provides application of the high-temperature-resistant sealant in a ceramic-based thermal barrier coating.
A sealant layer is formed on the surface of the coating by the process methods of spraying, brushing, roll coating and the like, so that the thermal barrier coating still has the salt spray corrosion resistance after being subjected to high temperature of over 1800 ℃ and can resist alternating salt spray for 192 h.
The following are specific examples of the present invention, and the raw materials used in each example are commercially available products.
Example 1
The embodiment of the invention provides a high-temperature-resistant sealant, and a preparation method of the high-temperature-resistant sealant comprises the following steps:
(1) adding 100g of the ba ling petrochemical CYD011 epoxy resin and 100g of xylene into a reaction kettle, dissolving for 3 hours at 90 ℃, adding 40g of an organic silicon intermediate (n is 9-14, purchased from Dow Corning DC6030) shown as a formula (2) and 2g of isopropyl titanate, heating to 130 ℃, and reacting for 4 hours until the solution is clear and transparent to obtain the epoxy organic silicon resin.
(2) 100g of epoxy silicone resin, 2g of BYK358, 2g of BYK320, 2g of light stabilizer 9061, 2g of light stabilizer 220 and 100g of xylene are added into a stirring kettle and stirred for 30min at the rotating speed of 400 revolutions per minute to obtain the epoxy silicone varnish.
(3) 100g of epoxy silicone varnish and 100g of curing agent (n is 9-14, purchased from Dow Corning 6040) with the structural formula shown as the formula (1) are uniformly mixed to obtain the sealant.
The coating is applied to the surfaces of the aluminum-clad aluminum oxide coating and the zirconium oxide coating by brushing and is cured for more than 24 hours at room temperature.
Fig. 1 is a thermal weight loss curve of the epoxy silicone sealant provided in this embodiment after curing and a conventional epoxy resin sealant, after 600 ℃, the conventional epoxy resin is completely decomposed, and the epoxy silicone sealant still has a mass retention rate of 40%.
FIG. 2 shows that the epoxy silicone sealant provided by the present embodiment and the conventional sealant undergo ablation at 1800 ℃ for 5s and then undergo 192h alternating salt spray examination, and the sealant provided by the present embodiment still has corrosion resistance, while the surface of the conventional sealant is corroded. FIG. 3 shows that the zirconia-epoxy silicone sealant coating system and the single zirconia coating undergo three thermal shock tests at room temperature to 1100 ℃, the zirconia on the surface of the single zirconia coating is removed, and the zirconia coating of the zirconia-epoxy silicone sealant coating system is still intact.
Example 2
The embodiment of the invention provides a high-temperature-resistant sealant, and a preparation method of the high-temperature-resistant sealant comprises the following steps:
adding 100gg ba ling petrochemical CYD011 epoxy resin and 90g of xylene into a reaction kettle, dissolving for 3 hours at 90 ℃, adding 35g of an organic silicon intermediate (n is 9-14, purchased from Dow Corning DC6030) shown as a formula (2) and 1g of isopropyl titanate, heating to 130 ℃, and reacting for 4 hours until the solution is clear and transparent to obtain the epoxy organic silicon resin.
100g of epoxy silicone resin, 1.5g of BYK358, 1.5g of BYK320, 1.5g of light stabilizer 9061, 1.5g of light stabilizer 220 and 90g of toluene are added into a stirring kettle and stirred for 30min at the rotating speed of 400 r/min to prepare the epoxy silicone varnish.
100g of epoxy organic silicon varnish and 90g of curing agent (purchased from Dow Corning 6040) with the structural formula shown as the formula (1) are uniformly mixed to obtain the sealant.
The coating is applied to the surfaces of the aluminum-clad aluminum oxide coating and the zirconium oxide coating by brushing and is cured for more than 24 hours at room temperature.
After 600 ℃, the conventional epoxy resin is completely decomposed, and the sealant prepared in example 2 still has a mass retention rate of 38%.
Example 3
The embodiment of the invention provides a high-temperature-resistant sealant, and a preparation method of the high-temperature-resistant sealant comprises the following steps:
adding 100gg ba ling petrochemical CYD011 epoxy resin and 110g xylene into a reaction kettle, dissolving for 3h at 90 ℃, adding 45g organosilicon intermediate (purchased from Dow Corning DC6030) and 3g isopropyl titanate, heating to 130 ℃, and reacting for 4h until the solution is clear and transparent.
100g of epoxy silicone resin, 2.5g of BYK358, 2.5g of BYK320, 2.5g of light stabilizer 9061, 2.5g of light stabilizer 220 and 110g of ethyl acetate are added into a stirring kettle and stirred for 30min at the rotating speed of 400 revolutions per minute to prepare the epoxy silicone varnish.
100g of epoxy organic silicon varnish and 110g of curing agent (purchased from Dow Corning 6040) with the structural formula shown as the formula (1) are uniformly mixed, the mixture is applied to the surfaces of an aluminum-coated aluminum oxide coating and a zirconium oxide coating by a brush coating mode, and the mixture is cured for more than 24 hours at room temperature.
After 600 ℃, the traditional epoxy resin is completely decomposed, and the sealant prepared in example 3 still has a mass retention rate of 42%. The above description is only one embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention.
The invention has not been described in detail in part of the common general knowledge of those skilled in the art.
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