CN109579353A - A kind of semiconductor cooler - Google Patents
A kind of semiconductor cooler Download PDFInfo
- Publication number
- CN109579353A CN109579353A CN201910008218.4A CN201910008218A CN109579353A CN 109579353 A CN109579353 A CN 109579353A CN 201910008218 A CN201910008218 A CN 201910008218A CN 109579353 A CN109579353 A CN 109579353A
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- Prior art keywords
- cold
- circuit board
- hot
- type semiconductor
- semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 109
- 239000010408 film Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000010409 thin film Substances 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 238000000926 separation method Methods 0.000 claims abstract description 5
- 238000009826 distribution Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 230000001788 irregular Effects 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract 1
- 238000006073 displacement reaction Methods 0.000 description 17
- 238000004804 winding Methods 0.000 description 17
- 238000005057 refrigeration Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 210000002469 basement membrane Anatomy 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000013341 scale-up Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明公开了一种半导体制冷器，它解决了现有技术中冷热端距离太近影响制冷效果、半导体制冷器均为硬性材质，不利于其对表面形状不规则或表面形状可变化的物体冷却的问题，具有冷热端分离、冷量损失少、布置使用方便、冷端可采用柔性材质的效果；其技术方案为：包括冷端模块、热端模块，所述冷端模块和热端模块通过排线相连，实现冷热端分离；其中，冷端模块包括用于提高冷端换热热流密度的集成半导体薄膜，所述集成半导体薄膜的两侧分别与冷端电路板、冷端基板贴合；集成半导体薄膜包括若干交叉且间隔分布的N型半导体薄膜和P型半导体薄膜。
The invention discloses a semiconductor refrigerator, which solves the problem in the prior art that the distance between the cold and hot ends is too close to affect the cooling effect, and the semiconductor refrigerators are all hard materials, which is not conducive to the objects with irregular surface shapes or variable surface shapes. The problem of cooling has the effects of separation of cold and hot ends, less loss of cooling capacity, convenient layout and use, and flexible materials for the cold end; The modules are connected by cables to realize the separation of the cold and hot ends; wherein, the cold end module includes an integrated semiconductor film for improving the heat exchange heat flow density of the cold end, and the two sides of the integrated semiconductor film are respectively connected with the cold end circuit board and the cold end substrate. Lamination; the integrated semiconductor thin film includes a number of N-type semiconductor thin films and P-type semiconductor thin films that are intersected and spaced apart.
Description
Technical field
The present invention relates to domain of control temperature more particularly to a kind of semiconductor coolers.
Background technique
Semiconductor cooler is called thermoelectric cooler, is to reach a kind of refrigeration refrigerating plant of purpose using Peltier effect,
It is small with size, light-weight, simple and reliable for structure, without machine driving, noiseless, pollution-free, the anti-many merits such as mobile that jolt.
In recent years, with the continuous development of semiconductor material technology, the refrigerating efficiency of semiconductor cooler is also being continuously improved, at present
It is widely used in the fields such as Aeronautics and Astronautics, infrared acquisition, Medical Devices, electronic equipment, and is opened up to normal domestic direction
Exhibition is gradually applied in the refrigeration equipments such as domestic refrigerator, air-conditioning, wine cabinet.
However, semiconductor cooler is compared with compression-type refrigeration device, refrigerating efficiency is still lower.In the semiconductor system of restriction
In many factors of cooler refrigerating efficiency, it is important that a little precisely due to existing semiconductor chilling plate thickness very little, it is cold
Hot end distance is too close, if the heat that its hot end generates cannot export in time, will be easy to the internal structure by cooling piece
It is transmitted to cold end, to seriously affect refrigeration effect.And existing semiconductor cooler is rigid material, and it is right to be unfavorable for its
Surface shape is irregular or the transformable object of surface shape is cooling.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of semiconductor cooler, separated with hot and cold side,
Loss of refrigeration capacity is few, arrangement is easy to use, the effect of flexible material can be used in cold end.
The present invention adopts the following technical solutions:
A kind of semiconductor cooler, including cold end module, hot end module, the cold end module and hot end module pass through winding displacement
It is connected, realizes hot and cold side separation；
Wherein, cold end module includes the integrated semiconductive thin film for improving cold end heat exchange heat flow density, and described integrated half
The two sides of conductor thin film are bonded with cold end circuit board, cold end substrate respectively；Integrated semiconductive thin film includes several intersections and interval
The N-type semiconductor film and P-type semiconductor film of distribution.
Further, the integrated semiconductive thin film further includes basement membrane, and it is a evenly distributed for setting that the basement membrane opens up 2n
Set the hole location of N-type semiconductor film and P-type semiconductor film.
Further, n is the integer more than or equal to 1.
Further, cold end substrate side is provided with circuit, and cold end substrate is partly led adjacent composition by circuit
The N-type semiconductor film of body thin film PN junction links together with P-type semiconductor film.
Further, the integrated semiconductive thin film, cold end substrate and cold end circuit board are all made of flexible material and are made, and make
Cold end module overall performance is flexibility, and the object or shape that can be used for cooling down molded non-planar can changed objects.
Further, the cold end module has cold end insulating layer.
Further, the cold end circuit board is integrated circuit board, and cold end winding displacement interface, cold end circuit board is arranged in one end
Equipped with 2n fitting position, each fitting position has independent circuit connection to cold end winding displacement interface respectively.
Further, the hot end module includes hot end substrate, hot end circuit board and is set to n N-type between the two
Semiconductor chip, n P-type semiconductor piece.
Further, the hot end circuit board has 2n fitting position, n N-type semiconductor piece and n P-type semiconductor piece
Transpostion interval is set on the fitting position of hot end circuit board.
Further, the hot end circuit board is integrated circuit board, and hot end winding displacement interface, hot end circuit board is arranged in one end
Each fitting position have independent circuit connection to hot end winding displacement interface respectively.
Compared with prior art, the beneficial effects of the present invention are:
(1) present invention can be realized hot and cold side separation, is freezed and is radiated in different location respectively, effectively reduced cold
The heat in hot end exchanges, and reduces the loss of refrigerating capacity, and keep the arrangement of semiconductor cooler more flexible；
(2) hardness or flexible material can be made in cold end module of the invention, adapt to more heat exchange surface shapes,
It can changed occasion suitable for surface shape；
(3) cold end module of the invention uses integrated semiconductive thin film, and cold end arrangement can be made more compact, improved cold
Hold the heat flow density of heat exchange；Hot end module can need suitably to scale up according to heat dissipation, increase heat dissipation area, reduce heat
Hold the heat flow density of heat dissipation；
(4) each building block of the invention can mass machinery production, can be effectively reduced production cost.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present application, and the application's shows
Meaning property embodiment and its explanation are not constituted an undue limitation on the present application for explaining the application.
Fig. 1 is overall structure of the present invention；
Fig. 2 is integrated semiconductive thin film arrangement architecture schematic diagram of the invention；
Fig. 3 is cold end substrate and its electrical block diagram of the invention；
Fig. 4 is cold end board circuit structural schematic diagram of the invention；
Fig. 5 is semiconductor chip arrangement architecture schematic diagram in hot end module of the invention；
Fig. 6 is hot end substrate and its electrical block diagram of the invention；
Fig. 7 is hot end board circuit structural schematic diagram of the invention；
In figure, 1, integrated semiconductive thin film, 2, cold end substrate, 3, cold end circuit board, 4, cold end insulating layer, 5, cold end winding displacement
Interface, 6, winding displacement, 7, hot end circuit board, 8, hot end substrate, 9, P-type semiconductor piece, 10, N-type semiconductor piece, 11, hot end winding displacement
Interface, 12, electric source line interface, 13, P-type semiconductor film, 14, N-type semiconductor film, 15, basement membrane, 16, circuit.
Specific embodiment
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another
It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
As background technique is introduced, hot and cold side distance too recent photo exists in the prior art and rings refrigeration effect, semiconductor
Refrigerator is rigid material, is unfavorable for the deficiency that it is irregular to surface shape or the transformable object of surface shape is cooling,
In order to solve technical problem as above, present applicant proposes a kind of semiconductor coolers.
In a kind of typical embodiment of the application, as shown in Fig. 1-Fig. 7, a kind of semiconductor cooler is provided, is wrapped
Cold end module, hot end module and winding displacement 6 are included, the cold end module is connected with hot end module by winding displacement 6, realizes hot and cold side point
From.
The cold end module includes integrated semiconductive thin film 1, cold end substrate 2, cold end circuit board 3,1 side of semiconductive thin film
Cold end substrate 2 is attached, 1 other side of semiconductive thin film attaches cold end circuit board 3.
Integrated semiconductive thin film 1 includes basement membrane 15, and 2n evenly distributed hole locations, n piece N-type semiconductor are opened up on basement membrane 15
Film 14 and n piece P-type semiconductor film 13 intersect and are spaced apart in the hole location.
Wherein, n is the integer more than or equal to 1.
As shown in Fig. 2, adjacent per a piece of 13 four sides of P-type semiconductor film is N-type semiconductor film 14, similarly,
Adjacent per a piece of 14 four sides of N-type semiconductor film is P-type semiconductor film 13；Every (the N-type half of P-type semiconductor film 13
Conductor thin film 14) it is spaced between film adjacent thereto, it does not contact with each other.
Wherein, the 1st N-type semiconductor film 14 and the 1st P-type semiconductor film 13 form the 1st couple of semiconductive thin film PN
Knot, successively arranges backward, forms n altogether to semiconductive thin film PN junction.
The integrated semiconductive thin film 1 is flexible material.
When having one or more in cold end substrate 2 and cold end circuit board 3 using hard material, for example, by using printed circuit board
PCB etc., then the overall performance of cold end module is rigid material, is used for cooling and plane object.
When cold end substrate 2 and cold end circuit board 3 use flexible material simultaneously, for example, by using flexible circuit board FPC etc., due to
Integrated semiconductive thin film 1 is also flexibility, and cold end module overall performance at this time is flexible material, for cooling down the object of molded non-planar
Body or shape can changed objects.
Cold end substrate 2 is the plate that side is machined with circuit 16, as shown in Figure 3.
Cold end substrate 2 is connected m piece N-type semiconductor film 14 and m piece P-type semiconductor film 13 by circuit 16
Come, m is the integer for being less than or equal to n more than or equal to 1；I.e. by the N-type semiconductor film 14 and p-type of each pair of semiconductive thin film PN junction
Semiconductive thin film 13 connects.
2 outside of cold end substrate (far from integrated 1 side of semiconductive thin film) outwardly provides cold and hot amount, cold and hot amount is passed through straight
It connects or indirectly acts on passing to and need object that is cooling or heating.
The cold end substrate 2 uses the biggish material of relatively thin and thermal coefficient, such as: pellosil, carbon-fiber film.
Cold end circuit board 3 is integrated circuit board, as shown in figure 4,3 one end of cold end circuit board is provided with cold end winding displacement interface 5,
The cold end winding displacement interface 5 is connect with one end of winding displacement 6.
Circuit 16 on the cold end circuit board 3 is equipped with 2n fitting position, is bonded with 2n chip semiconductor film one-to-one correspondence,
And each fitting position has independent circuit 16 to be connected to cold end winding displacement interface 5 respectively, and passes through independent conducting wire point in winding displacement 6
It is not connected with hot end module.
The cold end module further includes cold end insulating layer 4, and cold end insulating layer 4 is set to cold end module surrounding and close to cold end
The outside of circuit board 3, for reducing loss of refrigeration capacity.
When cold end module overall performance is rigid material, hardness or flexible heat-insulating material is can be used in the cold end insulating layer 4
Material；When cold end module overall performance is flexible material, the cold end insulating layer 4 also uses flexibly thermal insulation material.
The hot end module includes the contour semiconductor chip of hot end circuit board 7, hot end substrate 8,2n piece, and semiconductor chip includes
N piece N-type semiconductor piece 10 and n piece P-type semiconductor piece 9.
The hot end circuit board 7 is integrated circuit board, as shown in fig. 7, hot end circuit board 7 has 2n fitting position.
N piece N-type semiconductor piece 10 and 9 transpostion interval of n piece P-type semiconductor piece are set to 2n fitting of hot end circuit board 7
On position；N-type half is provided that on the fitting position connecting by winding displacement 6 and circuit with N-type semiconductor film 14 on cold end circuit board 3
Conductor piece 10 is provided that P-type semiconductor piece 9 on the fitting position connecting with P-type semiconductor film 13 on cold end circuit board 3.
Therefore, the 2n chip semiconductor piece of hot end module and the 2n chip semiconductor film of cold end module pass through circuit and winding displacement 6
It connects one to one.
Wherein, the 1st N-type semiconductor piece 10 and the 1st p-type being correspondingly connected with the 1st pair of semiconductive thin film PN junction are partly led
Body piece 9 forms the 1st pair of semiconductor chip PN junction, successively arranges backward, forms n altogether to semiconductor chip PN junction.
The hot end substrate 8 is that inside (close to the side of hot end circuit board 7) is machined with the plate of circuit, as shown in Figure 6；
Hot end substrate 8 by circuit 16 by a in semiconductor chip PN junction P-type semiconductor piece 13 and a+1 to semiconductor chip PN junction
In N-type semiconductor piece 10 link together, wherein a be more than or equal to 1 be less than or equal to n-1 integer.
Hot end substrate 8 is additionally provided with electric source line interface 12, and the circuit 16 of hot end substrate 8 is also by the 1st N-type semiconductor piece 10
It is connect respectively with electric source line interface 12 with n-th P-type semiconductor piece 9, for being that semiconductor cooler is powered after powering on.
The outside of hot end substrate 8 is outwardly radiated, and suitably increases the face of hot end substrate 8 in the case where installation space allows
Product, can reduce heat dissipation heat flow density.
On the outside of the hot end substrate 8 also settable radiating fin, fin add fan, heat-pipe radiator, water-cooled radiator or
The radiator of the diversified forms such as phase-change heat-exchanger, for enhancing heat dissipation effect.
The application semiconductor cooler has two kinds of works of refrigeration mode and heating mode when connecting external dc power work
Operation mode.
When semiconductor cooler works in cooling mode, cold end module is provided out cooling capacity, and hot end module radiates outward,
Electric current flows through sequence successively are as follows: positive pole, the 1st N-type semiconductor piece, the 1st N-type semiconductor film, the 1st p-type half
Conductor thin film, the 1st P-type semiconductor piece, the 2nd N-type semiconductor piece ..., n-th N-type semiconductor piece, n-th N-type are partly led
Body thin film, n-th P-type semiconductor film, n-th P-type semiconductor piece, power cathode.
When semiconductor cooler works under heating work mode, external dc power positive and negative anodes should be reversely connected, it is cold at this time
End module is provided out heat, and hot end module absorbs heat from the external world, and flowing through for electric current is sequentially opposite under refrigeration work mode.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field
For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair
Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910008218.4A CN109579353B (en) | 2019-01-04 | 2019-01-04 | A semiconductor refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910008218.4A CN109579353B (en) | 2019-01-04 | 2019-01-04 | A semiconductor refrigerator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109579353A true CN109579353A (en) | 2019-04-05 |
| CN109579353B CN109579353B (en) | 2024-05-28 |
Family
ID=65915533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910008218.4A Active CN109579353B (en) | 2019-01-04 | 2019-01-04 | A semiconductor refrigerator |
Country Status (1)
| Country | Link |
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| CN (1) | CN109579353B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110535373A (en) * | 2019-09-25 | 2019-12-03 | 山东省科学院能源研究所 | A kind of thermoelectric generator |
| CN110906585A (en) * | 2019-11-07 | 2020-03-24 | 青岛杰生电气有限公司 | Heat dissipation device of semiconductor refrigeration device, preparation method and sterilization module |
| CN114413928A (en) * | 2021-11-12 | 2022-04-29 | 株洲菲斯罗克光电科技股份有限公司 | Zero-offset tester for sensitive ring |
| CN116007224A (en) * | 2023-02-01 | 2023-04-25 | 山东大学 | A kind of portable cooling and heating all-in-one machine and method based on thermoelectric refrigeration |
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| CN2504569Y (en) * | 2001-11-07 | 2002-08-07 | 王彬 | Splitting thermoelectric cooling module |
| KR20110080963A (en) * | 2010-01-07 | 2011-07-13 | 충북대학교 산학협력단 | Thermoelectric Cooling Device of Printed Circuit Board with Flip Chip |
| CN103811652A (en) * | 2014-01-22 | 2014-05-21 | 杜效中 | Novel thermoelectric semiconductor device manufacturing method capable of separating cold end and hot end |
| CN105070820A (en) * | 2015-08-02 | 2015-11-18 | 杜效中 | Fabrication method for novel thin film thermoelectric semiconductor device with separated cold end and hot end |
| CN209326136U (en) * | 2019-01-04 | 2019-08-30 | 山东省科学院能源研究所 | A semiconductor refrigerator |
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| CN1352467A (en) * | 2001-10-24 | 2002-06-05 | 王彬 | Split thermocouple refrigeration and power generation technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110535373A (en) * | 2019-09-25 | 2019-12-03 | 山东省科学院能源研究所 | A kind of thermoelectric generator |
| CN110906585A (en) * | 2019-11-07 | 2020-03-24 | 青岛杰生电气有限公司 | Heat dissipation device of semiconductor refrigeration device, preparation method and sterilization module |
| CN114413928A (en) * | 2021-11-12 | 2022-04-29 | 株洲菲斯罗克光电科技股份有限公司 | Zero-offset tester for sensitive ring |
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| CN116007224B (en) * | 2023-02-01 | 2024-06-11 | 山东大学 | Portable cooling and heating integrated machine and method based on thermoelectric refrigeration |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109579353B (en) | 2024-05-28 |
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