CN109588001B - Double-loop liquid cooling system - Google Patents
Double-loop liquid cooling system Download PDFInfo
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- CN109588001B CN109588001B CN201710898383.2A CN201710898383A CN109588001B CN 109588001 B CN109588001 B CN 109588001B CN 201710898383 A CN201710898383 A CN 201710898383A CN 109588001 B CN109588001 B CN 109588001B
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- water
- cooling head
- water cooling
- head
- loop
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- 238000001816 cooling Methods 0.000 title claims abstract description 202
- 239000007788 liquid Substances 0.000 title claims abstract description 65
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 190
- 239000012530 fluid Substances 0.000 claims description 37
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 238000004891 communication Methods 0.000 claims description 16
- 230000000712 assembly Effects 0.000 description 6
- 238000000429 assembly Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 230000007774 longterm Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
Abstract
The invention provides a double-loop liquid cooling system, which is used for flowing a working liquid therein to dissipate heat and comprises a main water cooling head, a first loop assembly and a second loop assembly. The first loop assembly is connected with a first inflow port and a first outflow port of the main water cooling head, and forms a cooling loop through the main water cooling head. The second loop assembly is connected with a second inflow port and a second outflow port of the main water cooling head, and forms another cooling loop through the main water cooling head. Therefore, the invention can improve the cooling efficiency of the main water cooling head.
Description
Technical Field
The present invention relates to a liquid cooling system, and more particularly, to a liquid cooling system with dual-loop design.
Background
Along with the rapid development of computers and various electronic products, the convenience brought by the computer and various electronic products has led modern people to develop long-term use habits, but the disadvantage that the heat generated by the computers and various electronic products in the long-term operation process cannot be correspondingly and timely dissipated is also accompanied. The liquid cooling system is accordingly generated.
The conventional liquid cooling system comprises a water cooling head, a water pump and a water cooling row. However, if the cooling efficiency of the traditional liquid cooling system is good, the larger the water cooling row is, so that more heat dissipation area is obtained. However, miniaturization of electronic products is currently pursued in the market, which also indirectly results in limitation of the size and installation space of the water-cooled rows. In view of this, there is still room for improvement in conventional liquid cooling systems.
Disclosure of Invention
The present invention is directed to solve the above-mentioned drawbacks of the prior art, and provides a dual-loop liquid cooling system, in which a primary water-cooled head is used as a center, and a first loop assembly and a second loop assembly in which a working fluid flows are connected to the primary water-cooled head in a dual-loop parallel manner, so that the heat dissipation efficiency of the primary water-cooled head can be greatly improved.
The invention solves the technical problems by providing a dual-loop liquid cooling system for flowing a working liquid therein to dissipate heat, the dual-loop liquid cooling system comprises a main water cooling head, a first loop assembly and a second loop assembly, wherein the main water cooling head is provided with a common chamber, a first inflow port, a first outflow port, a second inflow port and a second outflow port, and the common chamber is in fluid communication with the first inflow port, the first outflow port, the second inflow port and the second outflow port; the first loop assembly comprises a first pipeline group, a first water pump and a first heat dissipating device, wherein the first pipeline group is provided with opposite two end parts and is respectively connected with the first inflow port and the first outflow port of the main water cooling head, and the first pipeline group is in fluid communication with the first water pump; the second loop assembly comprises a second pipeline group, a second water pump and a second heat dissipating device, wherein the second pipeline group is provided with opposite two end parts and is respectively connected with the second inflow port and the second outflow port of the main water cooling head, and the second pipeline group is in fluid communication with the second water pump; wherein, the working liquid in one part of the first loop assembly is pushed by the first water pump, flows into the shared chamber through the first inflow port of the main water cooling head, and the working liquid in the other part of the second loop assembly is pushed by the second water pump, flows into the shared chamber through the second inflow port of the main water cooling head, so that after the working liquid in the part and the working liquid in the other part are converged into the shared chamber, all the working liquid flows back into the first loop assembly and the second loop assembly through the first outflow port and the second outflow port of the main water cooling head respectively.
Preferably, the first loop assembly further comprises a first auxiliary water cooling head, the first auxiliary water cooling head receives the working liquid from the part of the main water cooling head, and the working liquid of the part flows through the first heat dissipating device and the first water pump in sequence after passing through the first auxiliary water cooling head and flows back to the main water cooling head; and/or the second loop assembly further comprises a second auxiliary water cooling head, the second auxiliary water cooling head receives the working liquid from the other part of the main water cooling head, and the working liquid of the other part flows through the second heat dissipation device and the second water pump in sequence after passing through the second auxiliary water cooling head and flows back to the main water cooling head.
Preferably, the main water cooling head has a main water cooling head thermal contact area for absorbing heat from an external low wattage heat source, the first auxiliary water cooling head and the second auxiliary water cooling head each have an auxiliary water cooling head thermal contact area for absorbing heat from an external high wattage heat source, wherein the area of the main water cooling head thermal contact area is smaller than that of the auxiliary water cooling head thermal contact area.
Preferably, the first pipeline group is provided with four first pipe bodies, and the four first pipe bodies are respectively arranged between the main water cooling head and the first auxiliary water cooling head, between the first auxiliary water cooling head and the first heat dissipating device, between the first heat dissipating device and the first water pump, and between the first water pump and the main water cooling head; and/or the second pipeline group is provided with four second pipe bodies which are respectively arranged between the main water cooling head and the second auxiliary water cooling head, between the second auxiliary water cooling head and the second heat dissipation device, between the second heat dissipation device and the second water pump and between the second water pump and the main water cooling head.
Preferably, the first heat dissipating device and the second heat dissipating device are both a water cooling row, the water cooling row comprises a water cooling row channel, a water cooling row water inlet, a water cooling row water outlet and a plurality of heat dissipating fins, wherein the water cooling row channel, the water cooling row water inlet and the water cooling row water outlet are in fluid communication with each other, and the plurality of heat dissipating fins are in thermal contact with the water cooling row channel.
Preferably, after the part of the working liquid in the first loop assembly flows into the water-cooling exhaust channel through the water-cooling exhaust water inlet for heat exchange, the part of the working liquid flows out from the water-cooling exhaust channel to the first water pump through the water-cooling exhaust water outlet; and/or after the working liquid in the other part of the second loop assembly flows into the water-cooling exhaust channel through the water-cooling exhaust water inlet for heat exchange, the working liquid in the other part flows out from the water-cooling exhaust channel to the second water pump through the water-cooling exhaust water outlet.
The double-loop liquid cooling system is connected with one main water cooling head together through the two loop assemblies, so that the heat dissipation efficiency of the main water cooling head is improved. In addition, the heat radiator is divided into two loop assemblies, so that the volume of a single heat radiator can be reduced, and the heat radiator has more installation space margin. In addition, the single loop assembly can sequentially radiate heat of the main water cooling head and the auxiliary water cooling head, and the utilization rate of the space is improved.
Drawings
FIG. 1 is a schematic top view of a dual-loop liquid cooling system according to a first embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a heat dissipating device according to a first embodiment of the dual-loop liquid cooling system of the present invention.
FIG. 3 is a schematic top view of a second embodiment of the dual-loop liquid cooling system of the present invention.
FIG. 4 is a schematic top view of a third embodiment of a dual-loop liquid cooling system according to the present invention.
FIG. 5 is a schematic top view of a dual-loop liquid cooling system according to a fourth embodiment of the present invention.
Detailed Description
Firstly, the liquid cooling system of the invention can utilize a working liquid to flow in a plurality of devices to dissipate heat so as to take away waste heat generated by an electronic device, thereby reducing the temperature of the electronic device as much as possible. Referring to fig. 1, fig. 1 is a schematic top view of a dual-loop liquid cooling system according to a first embodiment of the present invention. In the first embodiment of the present invention, the dual-loop liquid cooling system 1 of the present invention includes a main water cooling head 11, a first loop assembly 12 and a second loop assembly 13, and the first loop assembly 12 and the second loop assembly 13 are respectively in fluid communication with the main water cooling head 11 to respectively dissipate heat of the main water cooling head 11. The first loop assembly 12 and the main water cooling head 11 together form a cooling loop, which is formed at a right side position of the dual-loop liquid cooling system, and the second loop assembly 13 and the main water cooling head 11 together form another cooling loop, which is formed at a left side position of the dual-loop liquid cooling system.
In detail, the main head 11 is formed by a housing, and the main head 11 has a common chamber 11a, a first inlet 111, a first outlet 112, a second inlet 113, and a second outlet 114. Wherein the common chamber 11a is located in the housing, the first inlet 111, the first outlet 112, the second inlet 113 and the second outlet 114 are located at the edge of the housing, that is, the common chamber 11a is in fluid communication with the first inlet 111, the first outlet 112, the second inlet 113 and the second outlet 114.
Further, the first circuit assembly 12 includes a first pipe set 125, a first water pump 126 and a first heat dissipating device 127, the first pipe set 125 is in fluid communication with the first water pump 126, the first pipe set 125 is composed of a plurality of first pipes (as will be described later), and the first pipe set 125 has opposite end-to-end ends respectively connected to the first inlet 111 and the first outlet 112 of the main water-cooling head 11, so that the first circuit assembly 12 and the main water-cooling head 11 together form the cooling circuit, and the working fluid can circulate therein to dissipate heat of the main water-cooling head 11. Similarly, the second circuit assembly 13 includes a second pipe set 135, a second water pump 136 and a second heat dissipating device 137, the second pipe set 135 is in fluid communication with the second water pump 136, the second pipe set 135 is composed of a plurality of second pipes (as will be described later), and the second pipe set 135 has opposite end portions connected to the second inlet 113 and the second outlet 114 of the main water cooling head 11, respectively, so that the second circuit assembly 13 and the main water cooling head 11 together form another cooling circuit, and the working fluid can circulate therein to dissipate heat of the main water cooling head 11.
According to the above-described construction, a part of the working fluid in the first circuit assembly 12 of the present invention is pushed by the first water pump 126 to flow into the common chamber 11a through the first inflow port 111 of the main water-cooling head 11, and another part of the working fluid in the second circuit assembly 13 is pushed by the second water pump 136 to flow into the common chamber 11a through the second inflow port 113 of the main water-cooling head 11. The working fluid in the first circuit assembly 12 and the working fluid in the other part of the second circuit assembly 13 are collected into the common chamber 11a to be mixed, and then all the working fluid flows back into the first circuit assembly 12 and the second circuit assembly 13 through the first outlet 112 and the second outlet 114 of the main water cooling head 11, respectively. In this way, the heat dissipation efficiency of the main water cooling head 11 can be improved by the arrangement of the two loop assemblies 12 and 13. In addition, since the space for installing the liquid cooling system is not enough in the general electronic device, the installation is more convenient than the installation of one loop assembly (or heat sink) with larger volume by using a plurality of loop assemblies (or heat sinks) with smaller volumes.
Referring to fig. 1 and fig. 2 in combination, fig. 2 is a schematic cross-sectional view of a heat dissipating device according to a first embodiment of the dual-loop liquid cooling system of the present invention. The first heat sink 127 and the second heat sink 137 of the present invention are all water-cooled rows, and for convenience of illustration, the reference symbol in fig. 2 refers to the first heat sink 127 of the first circuit assembly 12. The second heat dissipation device 137 of the second circuit assembly 13 is the same as the first heat dissipation device 127 of the first circuit assembly 12, and thus will not be described again. The water cooling row comprises a water cooling row channel 127a, a water cooling row water inlet 127b, a water cooling row water outlet 127c and a plurality of heat dissipation fins 127d, wherein the water cooling row channel 127a, the water cooling row water inlet 127b and the water cooling row water outlet 127c are in fluid communication with each other, and the plurality of heat dissipation fins 127d are in thermal contact with the water cooling row channel 127a to absorb heat of the working liquid and dissipate the heat to the outside. Specifically, part of the working fluid in the first circuit assembly 12 flows into the water-cooling drain passage 127a through the water-cooling drain port 127b for heat exchange, and then the cooled working fluid flows out from the water-cooling drain passage 127a to the first water pump 126 through the water-cooling drain port 127 c. Thereafter, the first water pump 126 may push the cooled working fluid to the main head 11, in preparation for absorbing heat from the main head 11 again.
In addition, the first pipe group 125 has a more specific structure that the first pipe group 125 has three first pipes 125a, 125c, 125d, and the three first pipes 125a, 125c, 125d are respectively disposed as follows: the first pipe 125a is disposed between the main water cooling head 11 and the first heat dissipating device 127, the first pipe 125c is disposed between the first heat dissipating device 127 and the first water pump 126, and the first pipe 125d is disposed between the first water pump 126 and the main water cooling head 11. Similarly, the second pipe group 135 has three second pipes 135a, 135c, 135d, and the three second pipes 135a, 135c, 135d are respectively provided with: the second pipe 135a is disposed between the main water cooling head 11 and the second heat dissipating device 137, the second pipe 135c is disposed between the second heat dissipating device 137 and the second water pump 136, and the second pipe 135d is disposed between the second water pump 136 and the main water cooling head 11.
Referring to fig. 3, fig. 3 is a schematic top view of a second embodiment of the dual-loop liquid cooling system according to the present invention. The second embodiment is the same as the first embodiment in that the dual-circuit liquid cooling system 1' also includes a main water cooling head 11, a first circuit assembly 12', and a second circuit assembly 13, and the first circuit assembly 12' and the second circuit assembly 13 are respectively in fluid communication with the main water cooling head 11 to respectively dissipate heat of the main water cooling head 11, and details thereof are not repeated herein as described in detail. The second embodiment differs from the first embodiment in that the first circuit assembly 12' of the second embodiment further includes a first auxiliary water cooling head 128 that receives a portion of the working fluid from the main water cooling head 11, and thereafter, the portion of the working fluid flows back to the main water cooling head 11 after sequentially flowing through the first heat dissipating device 127 and the first water pump 126. Thus, the heat dissipation device has the advantage of utilizing a single loop assembly to dissipate heat of the two water cooling heads. Therefore, in the present embodiment, the first pipe set 125 'has four first pipes 125a', 125b, 125c, 125d. The four first tubes 125a', 125b, 125c, 125d are respectively provided with: the first pipe 125a' is disposed between the main water cooling head 11 and the first auxiliary water cooling head 128, the first pipe 125b is disposed between the first auxiliary water cooling head 128 and the first heat dissipating device 127, the first pipe 125c is disposed between the first heat dissipating device 127 and the first water pump 126, and the first pipe 125d is disposed between the first water pump 126 and the main water cooling head 11. Of course, the present embodiment may also be modified in that a secondary water cooling head is added to the second loop assembly 13, that is, the second loop assembly 13 further includes a second secondary water cooling head, receives another portion of the working fluid from the primary water cooling head 11, and then the other portion of the working fluid flows back to the primary water cooling head 11 after sequentially flowing through the second heat dissipating device 137 and the second water pump 136, which is also a feasible arrangement, and details thereof are not repeated herein because they are the same as those of the first loop assembly 12'.
Referring to fig. 4, fig. 4 is a schematic top view of a third embodiment of the dual-loop liquid cooling system according to the present invention. The third embodiment is the same as the first embodiment in that the dual-circuit liquid cooling system 1″ also includes a main water cooling head 11, a first circuit assembly 12 'and a second circuit assembly 13', and the first circuit assembly 12 'and the second circuit assembly 13' are respectively in fluid communication with the main water cooling head 11 to respectively dissipate heat of the main water cooling head 11, and details thereof are detailed as above, and will not be repeated herein. In the third embodiment, the first circuit assembly 12' further includes a first sub-cooling head 128, and the second circuit assembly 13' further includes a second sub-cooling head 138, so that part of the working fluid in the first circuit assembly 12' and the other part of the working fluid in the second circuit assembly 13' are mixed in the common chamber 11a of the main cooling head 11, and then flow back to the first sub-cooling head 128 of the first circuit assembly 12' and the second sub-cooling head 138 through the first outlet 112 and the second outlet 114 of the main cooling head 11, respectively, and then cooling of other parts is continued. Thus, the first tube set 125 'has four first tubes 125a', 125b, 125c, 125d and the second tube set 135 'has four first tubes 135a', 135b, 135c, 135d.
In the third embodiment, it is specifically described that the main water-cooling head 11 has a main water-cooling head thermal contact area A0 for absorbing heat from a low-wattage heat source of the outside, for example, a computing unit of a motherboard. The first sub-head 128 and the second sub-head 138 each have a sub-head thermal contact area A1, A2 for absorbing heat from two external high wattage heat sources, such as two operation units of a display card. Wherein the secondary water cooling head thermal contact areas A1, A2 are larger than the primary water cooling head thermal contact area A0, thereby facilitating the first secondary water cooling head 128 and the second secondary water cooling head 138 to more rapidly extract heat from the high wattage heat source.
Referring to fig. 5, fig. 5 is a schematic top view of a dual-loop liquid cooling system according to a fourth embodiment of the invention. The fourth embodiment is the same as the first embodiment in that the dual-circuit liquid cooling system 1' "also includes a main water cooling head 11, a first circuit assembly 12" and a second circuit assembly 13", and the first circuit assembly 12" and the second circuit assembly 13 "are respectively in fluid communication with the main water cooling head 11 to respectively dissipate heat of the main water cooling head 11, and detailed details thereof are not repeated herein. In the fourth embodiment, the first and second heat dissipation devices 127', 137' are heat dissipation fins and are directly arranged on the first and second pipe sets 125, 135, so as to dissipate heat of the working fluid in the first and second pipe sets 125, 135.
In summary, the dual-loop liquid cooling system of the present invention is provided with two loop assemblies and is commonly connected to a main water cooling head, so as to improve the heat dissipation efficiency of the main water cooling head. In addition, the heat radiator is divided into two loop assemblies, so that the volume of a single heat radiator can be reduced, and the space for installation is more abundant. In addition, the single loop assembly can radiate heat of the main water cooling head and the auxiliary water cooling head in sequence, and the utilization rate of the space is improved.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and illustrate the technical features of the present invention, but are not intended to limit the scope of the invention. Any person skilled in the art can easily accomplish the change or arrangement of equality without departing from the technical principle and spirit of the present invention. Accordingly, the scope of the invention is to be indicated by the appended claims.
Claims (4)
1. A dual-loop liquid cooling system for flowing a working fluid therein to dissipate heat, the dual-loop liquid cooling system comprising:
the main water cooling head is provided with a shared chamber, a first inflow port, a first outflow port, a second inflow port and a second outflow port, wherein the shared chamber is in fluid communication with the first inflow port, the first outflow port, the second inflow port and the second outflow port;
The first loop assembly comprises a first pipeline group, a first water pump and a first heat dissipating device, wherein the first pipeline group is provided with opposite two end parts and is respectively connected with the first inflow port and the first outflow port of the main water cooling head, and the first pipeline group is in fluid communication with the first water pump; and
The second loop assembly comprises a second pipeline group, a second water pump and a second heat radiating device, wherein the second pipeline group is provided with opposite two end parts and is respectively connected with the second inflow port and the second outflow port of the main water cooling head, and the second pipeline group is in fluid communication with the second water pump;
Wherein, the working liquid in one part of the first loop assembly is pushed by the first water pump, and the working liquid in the other part of the second loop assembly is pushed by the second water pump, so that after the working liquid in the part and the working liquid in the other part are converged in the shared cavity, all the working liquid flows back into the first loop assembly and the second loop assembly through the first outflow port and the second outflow port of the main water cooling head respectively, wherein the first loop assembly further comprises a first auxiliary water cooling head which receives the working liquid in the part of the main water cooling head, and the working liquid in the part flows through the first heat dissipating device and the first water pump in sequence after flowing through the first auxiliary water cooling head, and flows into the shared cavity through the first inflow port of the main water cooling head; the second loop assembly also comprises a second auxiliary water cooling head, the second auxiliary water cooling head receives the working liquid from the other part of the main water cooling head, the working liquid of the other part flows through the second heat dissipation device and the second water pump in sequence after passing through the second auxiliary water cooling head, and flows into the shared cavity through the second inflow port of the main water cooling head, the main water cooling head is provided with a main water cooling head thermal contact area for absorbing heat of a low-wattage heat source from the outside, and the first auxiliary water cooling head and the second auxiliary water cooling head are respectively provided with an auxiliary water cooling head thermal contact area for absorbing heat of a high-wattage heat source from the outside.
2. The dual-loop liquid cooling system of claim 1, wherein the first pipe set has four first pipes disposed between the primary water-cooled head and the first secondary water-cooled head, between the first secondary water-cooled head and the first heat sink, between the first heat sink and the first water pump, and between the first water pump and the primary water-cooled head, respectively; and/or the second pipeline group is provided with four second pipe bodies which are respectively arranged between the main water cooling head and the second auxiliary water cooling head, between the second auxiliary water cooling head and the second heat dissipation device, between the second heat dissipation device and the second water pump and between the second water pump and the main water cooling head.
3. The dual-loop liquid cooling system of claim 1, wherein the first heat sink and the second heat sink are both a water-cooled row comprising a water-cooled row channel, a water-cooled row water inlet, a water-cooled row water outlet, and a plurality of heat sink fins, wherein the water-cooled row channel, the water-cooled row water inlet, and the water-cooled row water outlet are in fluid communication with each other, and the plurality of heat sink fins are in thermal contact with the water-cooled row channel.
4. The dual-loop liquid cooling system of claim 3, wherein after the portion of the working fluid in the first loop assembly flows into the water-cooled drain passage through the water-cooled drain inlet for heat exchange, the portion of the working fluid flows out of the water-cooled drain passage through the water-cooled drain outlet to the first water pump; and/or after the working liquid in the other part of the second loop assembly flows into the water-cooling exhaust channel through the water-cooling exhaust water inlet for heat exchange, the working liquid in the other part flows out from the water-cooling exhaust channel to the second water pump through the water-cooling exhaust water outlet.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710898383.2A CN109588001B (en) | 2017-09-28 | 2017-09-28 | Double-loop liquid cooling system |
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| CN201710898383.2A CN109588001B (en) | 2017-09-28 | 2017-09-28 | Double-loop liquid cooling system |
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| CN109588001A CN109588001A (en) | 2019-04-05 |
| CN109588001B true CN109588001B (en) | 2024-05-24 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111853730A (en) * | 2019-09-12 | 2020-10-30 | 义乌市宏博机械科技有限公司 | Heat radiation structure and mobile heat radiation device |
| CN111194155B (en) | 2019-12-18 | 2021-10-12 | 深圳市迅凌科技有限公司 | Water cooling head, water cooling radiator and electronic equipment |
| TWI729960B (en) * | 2019-12-19 | 2021-06-01 | 雙鴻科技股份有限公司 | Liquid-cooling heat dissipation device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4930570A (en) * | 1987-12-22 | 1990-06-05 | Kenji Okayasu | Electronic equipment cooling device |
| CN103458666A (en) * | 2013-09-22 | 2013-12-18 | 武汉洛芙科技有限公司 | Double-circulation-waterway semiconductor laser refrigerating system |
| CN204206711U (en) * | 2014-11-07 | 2015-03-11 | 山东欧瑞安电气有限公司 | Explosion-proof frequency converter double-circulation water-cooling heat abstractor |
| TWM535934U (en) * | 2016-08-26 | 2017-01-21 | 雙鴻科技股份有限公司 | Liquid cooler module |
| CN207321756U (en) * | 2017-09-28 | 2018-05-04 | 泽鸿(广州)电子科技有限公司 | Double loop liquid cooling system |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6331771B2 (en) * | 2014-06-28 | 2018-05-30 | 日本電産株式会社 | Heat module |
| TWM503078U (en) * | 2015-01-09 | 2015-06-11 | Micro Star Int Co Ltd | Liquid cooled heat sink |
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2017
- 2017-09-28 CN CN201710898383.2A patent/CN109588001B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4930570A (en) * | 1987-12-22 | 1990-06-05 | Kenji Okayasu | Electronic equipment cooling device |
| CN103458666A (en) * | 2013-09-22 | 2013-12-18 | 武汉洛芙科技有限公司 | Double-circulation-waterway semiconductor laser refrigerating system |
| CN204206711U (en) * | 2014-11-07 | 2015-03-11 | 山东欧瑞安电气有限公司 | Explosion-proof frequency converter double-circulation water-cooling heat abstractor |
| TWM535934U (en) * | 2016-08-26 | 2017-01-21 | 雙鴻科技股份有限公司 | Liquid cooler module |
| CN207321756U (en) * | 2017-09-28 | 2018-05-04 | 泽鸿(广州)电子科技有限公司 | Double loop liquid cooling system |
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