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CN109580996A - A kind of hardware testing frame - Google Patents

A kind of hardware testing frame Download PDF

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Publication number
CN109580996A
CN109580996A CN201811454918.8A CN201811454918A CN109580996A CN 109580996 A CN109580996 A CN 109580996A CN 201811454918 A CN201811454918 A CN 201811454918A CN 109580996 A CN109580996 A CN 109580996A
Authority
CN
China
Prior art keywords
hardware
testing frame
hardware testing
frame according
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811454918.8A
Other languages
Chinese (zh)
Inventor
孙振
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inventec Pudong Technology Corp
Inventec Corp
Original Assignee
Inventec Pudong Technology Corp
Inventec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inventec Pudong Technology Corp, Inventec Corp filed Critical Inventec Pudong Technology Corp
Priority to CN201811454918.8A priority Critical patent/CN109580996A/en
Publication of CN109580996A publication Critical patent/CN109580996A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

The present invention provides a kind of hardware testing frame, comprising: at least two fixed feets intersect at a crosspoint, are removably fixed in hardware surface to be measured;Probe is fixed on the crosspoint, and one end is in contact with the test point of the hardware to be measured.Hardware testing frame of the invention can carry out the test of one or more test points without welding, greatly improve the efficiency of hardware testing, reduce the damage to hardware.

Description

A kind of hardware testing frame
Technical field
The present invention relates to the technical fields of testing jig, more particularly to a kind of hardware testing frame.
Background technique
In the prior art, it generally requires to be tested in many test points when carrying out hardware debugging, or part is surveyed Pilot needs to be measured with oscillograph simultaneously.
Existing hardware testing mode mainly includes following two:
(1) welding lead is used, butt welding point carries out welding extraction wire, then measures to conductor wire end
However, causing the testing time to extend since solder joint is more and portion is difficult to solder to, testing cost increases;And Hardware damage is easily caused, causes test validity lower.
(2) it directlys adopt handheld probe and carries out push type test
However, which cannot test multiple test points simultaneously, cause testing efficiency low.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of hardware testing framves, without weldering The test that can carry out one or more test points is connect, the efficiency of hardware testing is greatly improved, reduces the damage to hardware Wound.
In order to achieve the above objects and other related objects, the present invention provides a kind of hardware testing frame, comprising: at least two is solid Determine foot, intersect at a crosspoint, is removably fixed in hardware surface to be measured;Probe is fixed on the crosspoint, and One end is in contact with the test point of the hardware to be measured.
In one embodiment of the invention, the number of the fixed feet is three.
In one embodiment of the invention, the bottom end of the fixed feet is provided with sucker, is fixed on by the sucker described Hardware surface to be measured.
Further include insulation sleeve in one embodiment of the invention, is coated on the probe surface.
In one embodiment of the invention, the fixed feet is retractable structure.
In one embodiment of the invention, the retractable structure is bolted.
In one embodiment of the invention, it is provided with slot in the probe, for being connected with external testing instrument.
In one embodiment of the invention, the probe include the pressing section being sequentially connected from top to bottom, telescopic segment and Contact-segment;The pressing section is for being downwardly applied to pressing force;The telescopic segment is used under the action of the pressing force to described Contact-segment applies down force;The contact-segment is used to connect under the action of the down force with test point fixation Touching.
In one embodiment of the invention, the telescopic segment uses spring.
In one embodiment of the invention, the top of the pressing section is provided with briquetting.
As described above, hardware testing frame of the invention, has the advantages that
(1) test of one or more test points can be carried out without welding, it is easy to remove;
(2) the hardware testing frame stationarity is good, and probe elastic force pressure holding degree is strong, and test signal stabilization is high;
(3) reduce the damage to hardware, reduce testing cost, increase testing efficiency.
Detailed description of the invention
Fig. 1 is shown as the structural schematic diagram of hardware testing frame of the invention in an embodiment.
Component label instructions
1 fixed feet
11 suckers
2 probes
21 briquettings
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book is understood other advantages and efficacy of the present invention easily.
It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to cooperate specification to be taken off The content shown is not intended to limit the invention enforceable qualifications so that those skilled in the art understands and reads, therefore Do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size are not influencing the present invention Under the effect of can be generated and the purpose that can reach, it should all still fall in disclosed technology contents and obtain the model that can cover In enclosing.Meanwhile cited such as "upper" in this specification, "lower", "left", "right", " centre " and " one " term, be also only Convenient for being illustrated for narration, rather than to limit the scope of the invention, relativeness is altered or modified, in no essence It changes under technology contents, when being also considered as the enforceable scope of the present invention.
Hardware testing frame of the invention can carry out the test of test point without welding, and multiple hardware testing framves can be same When work to realize the test of multiple test points, to reduce the damage to hardware, greatly improve the effect of hardware testing Rate reduces the cost of labor of test.
As shown in Figure 1, in an embodiment, hardware testing frame of the invention includes:
At least two fixed feets 1, intersect at a crosspoint, are removably fixed in hardware surface to be measured.
Probe 2 is fixed on the crosspoint, and one end is in contact with the test point of the hardware to be measured.
Specifically, the fixed feet 1 is used as supporting mechanism, is used to support the probe 2.The fixed feet 1 is removable Hardware surface to be measured is set dynamicly, so that the probe 2 can test the hardware surface to be measured any position The test point at place avoids the loss welded to hardware to be measured without welding.
In order to guarantee the stability of at least two fixed feet 1, in one embodiment of the invention, of the fixed feet Number is three, to constitute the tripod with common across point.
Preferably, the fixed feet 1, which is adopted, is made from an insulative material.
Since the size of different hardware to be measured is different, therefore the test scope of the probe 2 is also different.The fixation The height limitation of foot 1 scope of activities of the probe 2, therefore need to adjust the probe 2 according to the actual situation Scope of activities.In one embodiment of the invention, the fixed feet 1 is retractable structure, thus straight by the retractable structure The height for adjusting the fixed feet 1, and then the position without the mobile fixed feet 1 are connect, the probe 2 can be adjusted Scope of activities.Preferably, when the fixed feet 1 is adjusted to required length, the retractable structure is bolted, thus Guarantee the stability of the fixed feet 1.
When the hardware testing frame is tested, the fixed feet 1 need to be fixed on the hardware surface to be measured, to guarantee The stability of the probe 2.In one embodiment of the invention, the bottom end of the fixed feet 1 is provided with sucker 11, passes through institute It states sucker 11 and is fixed on the hardware surface to be measured.The fixation of the fixed feet 1 can be realized without external force for the sucker, Avoid the damage to the hardware surface to be measured.Meanwhile the sucker 11 is readily disassembled, and may make the fixed feet 1 in institute It is mobile to state hardware surface to be measured.
In one embodiment of the invention, hardware testing frame of the invention further includes insulation sleeve, is coated on the probe 2 Surface.Since the probe 2 is conductive material, therefore insulation sleeve is coated on 2 surface of probe, so as to tester Can the position manually to the probe 2 be adjusted flexibly, without use special insulating tool, such as insulation hand Set.
For the ease of being communicated with external testing instrument, in one embodiment of the invention, it is provided in the probe 2 Slot, for being connected with external testing instrument.Therefore, the probe 2 will can directly test signal transmission collected It is simple and convenient to external testing instrument, such as oscillograph, improve testing efficiency.
In order to further enhance the accurate testing degree of the probe 2, in one embodiment of the invention, the center is visited Needle 2 includes pressing section, telescopic segment and the contact-segment being sequentially connected from top to bottom.Wherein, the pressing section is set to top, is used for It is downwardly applied to pressing force;The telescopic segment be located at centre, under the action of the pressing force to the contact-segment apply to Lower active force;The contact-segment is located below, and is directly in contact with the test point of the hardware to be measured, in the downward work It contacts under the action of firmly with test point fixation, is tested with ten thousand.Due to the effect of elastic pressure, the center is increased The signal collected stability of probe 2, improves measuring accuracy.
Preferably, the telescopic segment uses spring.
It is further preferable that the top of the pressing section is provided with briquetting 21, for being downwardly applied to active force, greatly mention Test comfort level is risen.
In conclusion hardware testing frame of the invention can carry out the test of one or more test points without welding, just In movement;The hardware testing frame stationarity is good, and probe elastic force pressure holding degree is strong, and test signal stabilization is high;Reduce to hardware Damage, reduces testing cost, increases testing efficiency.So the present invention effectively overcomes various shortcoming in the prior art And has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as At all equivalent modifications or change, should be covered by the claims of the present invention.

Claims (10)

1. a kind of hardware testing frame, it is characterised in that: include:
At least two fixed feets intersect at a crosspoint, are removably fixed in hardware surface to be measured;
Probe is fixed on the crosspoint, and one end is in contact with the test point of the hardware to be measured.
2. hardware testing frame according to claim 1, it is characterised in that: the number of the fixed feet is three.
3. hardware testing frame according to claim 1, it is characterised in that: the bottom end of the fixed feet is provided with sucker, leads to It crosses the sucker and is fixed on the hardware surface to be measured.
4. hardware testing frame according to claim 1, it is characterised in that: further include insulation sleeve, be coated on the center and visit Wire surface.
5. hardware testing frame according to claim 1, it is characterised in that: the fixed feet is retractable structure.
6. hardware testing frame according to claim 5, it is characterised in that: the retractable structure is bolted.
7. hardware testing frame according to claim 1, it is characterised in that: be provided with slot in the probe, be used for It is connected with external testing instrument.
8. hardware testing frame according to claim 1, it is characterised in that: the probe includes successively phase from top to bottom Pressing section, telescopic segment and contact-segment even;The pressing section is for being downwardly applied to pressing force;The telescopic segment described for pressing Apply down force to the contact-segment under the action of pressure;The contact-segment is used under the action of the down force It is contacted with test point fixation.
9. hardware testing frame according to claim 8, it is characterised in that: the telescopic segment uses spring.
10. hardware testing frame according to claim 8, it is characterised in that: the top of the pressing section is provided with briquetting.
CN201811454918.8A 2018-11-30 2018-11-30 A kind of hardware testing frame Pending CN109580996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811454918.8A CN109580996A (en) 2018-11-30 2018-11-30 A kind of hardware testing frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811454918.8A CN109580996A (en) 2018-11-30 2018-11-30 A kind of hardware testing frame

Publications (1)

Publication Number Publication Date
CN109580996A true CN109580996A (en) 2019-04-05

Family

ID=65925789

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811454918.8A Pending CN109580996A (en) 2018-11-30 2018-11-30 A kind of hardware testing frame

Country Status (1)

Country Link
CN (1) CN109580996A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2123758U (en) * 1992-02-20 1992-12-02 冶金工业部钢铁研究总院 Thin film internal stress tunneling current probe measurement device
CN101968502A (en) * 2010-09-21 2011-02-09 四川长虹电器股份有限公司 Testing needle bed and method for testing tape carrier package (TCP) driving chip by utilizing same
US20130021052A1 (en) * 2008-03-13 2013-01-24 Advanced Inquiry Systems, Inc. Wafer prober integrated with full-wafer contacter
CN103063959A (en) * 2012-12-29 2013-04-24 北京德天泉机电设备有限公司 Bed-of-nails tool for detecting circuit board
CN103792483A (en) * 2014-01-24 2014-05-14 苏州工业园区世纪福科技有限公司 Novel testing device for PCBs of mobile phones
CN207764267U (en) * 2018-01-03 2018-08-24 广东东方亮彩精密技术有限公司 Using Circuit Inspection Multi-position Continuity Inspection Tool

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2123758U (en) * 1992-02-20 1992-12-02 冶金工业部钢铁研究总院 Thin film internal stress tunneling current probe measurement device
US20130021052A1 (en) * 2008-03-13 2013-01-24 Advanced Inquiry Systems, Inc. Wafer prober integrated with full-wafer contacter
CN101968502A (en) * 2010-09-21 2011-02-09 四川长虹电器股份有限公司 Testing needle bed and method for testing tape carrier package (TCP) driving chip by utilizing same
CN103063959A (en) * 2012-12-29 2013-04-24 北京德天泉机电设备有限公司 Bed-of-nails tool for detecting circuit board
CN103792483A (en) * 2014-01-24 2014-05-14 苏州工业园区世纪福科技有限公司 Novel testing device for PCBs of mobile phones
CN207764267U (en) * 2018-01-03 2018-08-24 广东东方亮彩精密技术有限公司 Using Circuit Inspection Multi-position Continuity Inspection Tool

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Application publication date: 20190405