CN109616450B - Packaging material and application thereof - Google Patents
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- 239000005022 packaging material Substances 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 30
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 11
- 239000011231 conductive filler Substances 0.000 claims abstract description 8
- 238000009459 flexible packaging Methods 0.000 claims description 23
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 21
- 239000000945 filler Substances 0.000 claims description 18
- -1 polysiloxane Polymers 0.000 claims description 18
- 229920002379 silicone rubber Polymers 0.000 claims description 9
- 229910052582 BN Inorganic materials 0.000 claims description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 8
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 6
- 239000004800 polyvinyl chloride Substances 0.000 claims description 6
- 239000004945 silicone rubber Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 229920000747 poly(lactic acid) Polymers 0.000 claims description 4
- 239000004626 polylactic acid Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229920006346 thermoplastic polyester elastomer Polymers 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 2
- 239000002318 adhesion promoter Substances 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 150000001993 dienes Chemical class 0.000 claims description 2
- 229920001971 elastomer Polymers 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 229910021389 graphene Inorganic materials 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 229920000098 polyolefin Polymers 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 229920006345 thermoplastic polyamide Polymers 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 16
- 238000010146 3D printing Methods 0.000 abstract description 3
- 238000007639 printing Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical group [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000004964 aerogel Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000009516 primary packaging Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
本发明公开了一种封装材料及其应用，该封装材料包括依次层叠的柔性封装层、中间封装层和高强度封装层，所述柔性封装层包括热塑性聚合物和导热填料，所述中间封装层包括热塑性树脂，所述高强度封装层包括高强度材料和导热填料，所述高强度材料用以为被封装物体提供物理保护。本发明的封装材料能够适用于3D打印，具备优异的热导率和柔顺性，在芯片封装方向具备较好的应用前景。
The invention discloses an encapsulation material and an application thereof. The encapsulation material comprises a flexible encapsulation layer, an intermediate encapsulation layer and a high-strength encapsulation layer which are stacked in sequence; the flexible encapsulation layer comprises a thermoplastic polymer and a thermally conductive filler; the intermediate encapsulation layer Including a thermoplastic resin, the high-strength encapsulation layer includes a high-strength material and a thermally conductive filler, the high-strength material being used to provide physical protection to the encapsulated object. The packaging material of the invention can be suitable for 3D printing, has excellent thermal conductivity and flexibility, and has a good application prospect in the direction of chip packaging.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a packaging material and application thereof.
Background
In the electronics industry, as the overall size of electronic devices becomes smaller and smaller, more heat is generated by the operation of packaged electronic assemblies at high frequencies. Since this heat will reduce the efficiency and shorten the life of the components, it is necessary to dissipate the heat efficiently in time in order to ensure that the components will operate efficiently.
At present, heat dissipation of a chip mainly depends on the package of the chip to dissipate heat, from a primary package to a secondary package through a thermal interface material, and then from the thermal interface material to a tertiary package. The primary package is the material closest to the chip heat source, and is the key point of the whole package heat dissipation. The spherical silicon oxide filled epoxy resin molding compound used at present sacrifices heat conduction performance to ensure manufacturability and stability.
Silicon rubber has a thermal conductivity of about 0.2W/mK, and metal oxide powder such as alumina is often mixed into silicon rubber to be used as a heat dissipating material for heat generating electrical components and the like. In order to further improve the thermal conductivity of the packaging material, the use of boron nitride, which has the highest thermal conductivity among ceramic materials, as a filler has been emerging in recent years. Patent CN102717454A discloses a method for preparing a boron nitride-silicone rubber composite material, wherein an external electric field is applied to orient the high thermal conductivity crystal face of boron nitride along the direction of the electric field, so that the thermal conductivity parallel to the direction of the electric field is greatly improved, and the amplification is more than 1.5 times. However, Sebnem Kemaloglu et al indicate that 50% loading of micron-sized flake boron nitride in silicone rubber can improve the thermal conductivity of the material by ten times, while the compliance of the silicone rubber gradually decreases with increasing loading. Therefore, in order to satisfy the heat dissipation requirement of the chip-scale package and ensure the stability, it is necessary to develop a chip-scale packaging material providing sufficient thermal conductivity and flexibility.
Disclosure of Invention
Aiming at the defects of the prior art, the technical problem to be solved by the invention is to provide the packaging material and the application thereof, wherein the packaging material has excellent heat-conducting property and flexibility and can be used for packaging chips.
The technical scheme adopted by the invention is as follows:
the invention provides a packaging material which comprises a flexible packaging layer, an intermediate packaging layer and a high-strength packaging layer which are sequentially stacked, wherein the flexible packaging layer comprises a thermoplastic polymer and a heat-conducting filler, the intermediate packaging layer comprises a thermoplastic resin, the high-strength packaging layer comprises a high-strength material and a heat-conducting filler, and the high-strength material is used for providing physical protection for a packaged object.
Preferably, the heat conductive filler is at least one of boron nitride, aluminum nitride, silicon carbide, carbon and graphene.
Preferably, the thermoplastic resin is at least one of polyethylene, polyvinyl chloride, polystyrene, polyamide, polyoxymethylene, polycarbonate, polyphenylene oxide, polysulfone, and rubber.
Preferably, the thermoplastic polymer is at least one of a thermoplastic elastomer and a polysiloxane.
Further, the thermoplastic elastomer is at least one of silicone rubber thermoplastic elastomer, styrene thermoplastic elastomer (TPS), polyolefin thermoplastic elastomer (TPO), polyvinyl chloride thermoplastic elastomer (TPVC), polyurethane thermoplastic elastomer (TPU), thermoplastic polyester elastomer (TPEE), polyamide thermoplastic elastomer (TPAE), organic fluorine thermoplastic elastomer (TPF) and diene thermoplastic elastomer (TPB, TPI).
Further, the polysiloxane is at least one of polydimethylsiloxane, polymethylphenylsiloxane and polymethylsiloxane.
Preferably, the high-strength material is at least one of epoxy resin, polylactic acid, and acrylonitrile-butadiene-styrene copolymer.
Preferably, the mass fraction of the heat-conducting filler in the flexible packaging layer is 10% -90%, and the mass fraction of the heat-conducting filler in the high-strength packaging layer is 10% -90%.
Preferably, the flexible packaging layer further comprises an adhesion promoter. Such tackifiers include, but are not limited to, silica, diatomaceous earth, aerogels, and the like.
The packaging material can be applied to chip primary packaging.
The invention has the beneficial effects that:
the invention provides a packaging material with a three-layer structure, wherein a flexible packaging layer is attached to a part closest to a bare chip (bare chip) when a chip is packaged, the flexible packaging layer on the inner layer has the performance of absorbing thermal expansion stress, the mismatch of the thermal expansion coefficients of the bare chip and a first-stage package can be reduced, in addition, the flexible packaging layer added with a heat conduction filler has high heat conduction capability, the part closest to a heat source can conduct heat to the next-stage packaging layer to the maximum extent, the flexible packaging layer provides flexibility for the thermal stress caused by the difference of the thermal expansion coefficients between a PCB and the chip, and under the heated condition, the deformable flexible packaging layer allows the PCB and the chip to displace, so that the stress for interconnecting welding balls is reduced to the minimum. The middle packaging layer belongs to the transition layer, the thermal expansion coefficient of the middle packaging layer is between the flexible packaging layer and the high-strength packaging layer, the thermal stress between the upper layer and the lower layer is reduced, the high-strength packaging layer on the outermost layer serves as a supporting structure and provides physical protection for the chip, and the packaging material has excellent thermal conductivity and flexibility by arranging the three-layer packaging structure.
Drawings
Fig. 1 is a schematic cross-sectional view of the packaging material of the present invention.
Detailed Description
The concept and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments to fully understand the objects, features and effects of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and those skilled in the art can obtain other embodiments without inventive effort based on the embodiments of the present invention, and all embodiments are within the protection scope of the present invention.
Example 1
Referring to fig. 1, the present embodiment provides an encapsulation material, which includes a flexible encapsulation layer 1, an intermediate encapsulation layer 2, and a high-strength encapsulation layer 3, which are sequentially stacked, where the flexible encapsulation layer includes a thermoplastic polymer and 10 wt% of a heat conductive filler, the intermediate encapsulation layer includes a thermoplastic resin, the high-strength encapsulation layer includes a high-strength material and 10 wt% of a heat conductive filler, the high-strength material is used to provide physical protection for an encapsulated object, the thermoplastic polymer used in the present embodiment is butyl rubber, the heat conductive filler is hexagonal boron nitride fiber, the thermoplastic resin is polyethylene, and the high-strength material is epoxy resin.
The embodiment also provides a preparation method for preparing the packaging material by using 3D printing, which comprises the following steps:
(1) the 3D max is used to model a package structure, the cross-sectional view of which is shown in fig. 1, which includes three regions: the flexible packaging structure comprises an inner-layer flexible packaging area, a middle-layer transition area and an outer-layer high-strength supporting area;
(2) uniformly mixing an active raw material of a thermoplastic polymer, tackifier silicon dioxide particles, a curing agent and hexagonal boron nitride fibers to prepare an inner-layer printing material;
uniformly mixing epoxy resin and hexagonal boron nitride fibers to prepare an outer-layer printing material;
(3) the printing sequence and the printing speed of different printing nozzles are designed according to the model size, the flexible packaging layer on the inner layer is printed firstly, the middle packaging layer is printed after the flexible packaging layer is cured, the high-strength packaging layer on the outermost layer is printed after the middle packaging layer is cured, and the packaging material is obtained by printing layer by layer.
When the packaging material is prepared by 3D printing, the curing mode of the inner layer printing material can be selected from thermal curing, ultraviolet curing or both thermal curing and ultraviolet curing according to different selected materials, so that a proper curing agent is added, and the transition from flexibility to rigidity of the flexible packaging layer of the inner layer can be realized by controlling the curing degree.
Example 2
The embodiment provides a packaging material, including the flexible packaging layer, middle packaging layer and the high strength packaging layer that stack gradually, the flexible packaging layer includes thermoplastic polymer and 90 wt% heat conduction filler, thermoplastic polymer is silicon rubber class thermoplastic polymer phenyl vinyl silicone rubber, and heat conduction filler is the carbon fiber, middle packaging layer includes thermoplastic resin, thermoplastic resin is polyvinyl chloride, the high strength packaging layer includes high strength material and 10 wt% heat conduction filler, high strength material is polylactic acid, heat conduction filler is the graphite alkene fibre, high strength material is used for providing physical protection for being encapsulated the object.
Example 3
The embodiment provides a packaging material, including flexible packaging layer, middle packaging layer and the high strength packaging layer that stack gradually, flexible packaging layer includes thermoplastic polymer and 20 wt% heat conduction filler, thermoplastic polymer is polydimethylsiloxane PDMS, and the heat conduction filler is aluminium nitride, middle packaging layer includes thermoplastic resin, the thermoplastic resin is polyvinyl chloride, the high strength packaging layer includes high strength material and 90 wt% heat conduction filler, the high strength material is polylactic acid, the heat conduction filler is silicon carbide, the high strength material is used for providing physical protection for the object that is encapsulated.
Example 4
The thermal diffusivity of the encapsulant was measured by a flash method in accordance with ASTM E1461, the specific heat capacity was measured by a differential scanning calorimeter, the density was measured by a density balance, the thermal conductivity of the encapsulant was calculated from the thermal conductivity of thermal diffusivity x specific heat capacity x density, and the performance parameters of the encapsulant prepared in examples 1 to 3 were measured as shown in table 1:
TABLE 1 Performance parameters of the encapsulation materials prepared in examples 1-3
The data in the table show that the thermal conductivity of the packaging material prepared by adopting the thermal conductive filler and the polymer in different proportions in the embodiment is improved compared with the thermal conductivity of the polymer matrix which is usually less than 1W/m.K, the surface of the prepared packaging material is soft, the prepared packaging material can be tightly attached to the surface of a bare crystal, and the packaging material is not delaminated and cracked after long-term use.
Claims (8)
1. The chip packaging material is characterized by comprising a flexible packaging layer, an intermediate packaging layer and a high-strength packaging layer which are sequentially stacked, wherein the flexible packaging layer comprises a thermoplastic polymer and a heat-conducting filler, the thermoplastic polymer is at least one of a thermoplastic elastomer and polysiloxane, the mass fraction of the heat-conducting filler in the flexible packaging layer is 10% -90%, the intermediate packaging layer comprises thermoplastic resin, the high-strength packaging layer comprises a high-strength material and a heat-conducting filler, the high-strength material is used for providing physical protection for a packaged object, and the mass fraction of the heat-conducting filler in the high-strength packaging layer is 10% -90%.
2. The chip packaging material according to claim 1, wherein the thermally conductive filler is at least one of boron nitride, aluminum nitride, silicon carbide, carbon, and graphene.
3. The chip packaging material of claim 1, wherein the thermoplastic resin is at least one of polyethylene, polyvinyl chloride, polystyrene, polyamide, polyoxymethylene, polycarbonate, polyphenylene oxide, polysulfone, and rubber.
4. The chip packaging material according to claim 1, wherein the thermoplastic elastomer is at least one of a silicone rubber thermoplastic elastomer, a styrene thermoplastic elastomer, a polyolefin thermoplastic elastomer, a polyvinyl chloride thermoplastic elastomer, a polyurethane thermoplastic elastomer, a thermoplastic polyester elastomer, a polyamide thermoplastic elastomer, an organic fluorine thermoplastic elastomer, and a diene thermoplastic elastomer.
5. The chip packaging material of claim 1, wherein the polysiloxane is at least one of polydimethylsiloxane, polymethylphenylsiloxane, and polymethylsiloxane.
6. The chip packaging material according to any one of claims 1 to 5, wherein the high-strength material is at least one of epoxy resin, polylactic acid, and acrylonitrile-butadiene-styrene copolymer.
7. The chip packaging material according to any one of claims 1-5, wherein the flexible packaging layer further comprises an adhesion promoter.
8. Use of the chip packaging material of any one of claims 1-7 in chip packaging.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811326083.8A CN109616450B (en) | 2018-11-08 | 2018-11-08 | Packaging material and application thereof |
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|---|---|---|---|
| CN201811326083.8A CN109616450B (en) | 2018-11-08 | 2018-11-08 | Packaging material and application thereof |
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| CN109616450A CN109616450A (en) | 2019-04-12 |
| CN109616450B true CN109616450B (en) | 2021-05-18 |
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| US20230317535A1 (en) * | 2022-03-31 | 2023-10-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and method for fabricating the same |
| CN115267986B (en) * | 2022-08-15 | 2024-01-26 | 武汉锐科光纤激光技术股份有限公司 | Packaging structure and optical fiber coupler |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1389801A2 (en) * | 2002-08-15 | 2004-02-18 | The Bergquist Company | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
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| US7390551B2 (en) * | 2004-07-02 | 2008-06-24 | Caterpillar Inc. | System and method for encapsulation and protection of components |
| KR20150023075A (en) * | 2010-09-24 | 2015-03-04 | 생-고뱅 퍼포먼스 플라스틱스 코포레이션 | Laminate structure and method for making |
| CN106280050B (en) * | 2016-08-15 | 2019-02-22 | 佛山市南海飞步橡塑制品有限公司 | A kind of high thermal conductive silicon rubber laminar composite |
| CN108656676A (en) * | 2018-03-05 | 2018-10-16 | 南方科技大学 | Multilayer heat-conducting composite material and preparation method thereof |
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2018
- 2018-11-08 CN CN201811326083.8A patent/CN109616450B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1389801A2 (en) * | 2002-08-15 | 2004-02-18 | The Bergquist Company | Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads |
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