CN109655931B - Millimeter wave/terahertz wave imaging device and method for detecting human body or article - Google Patents
Millimeter wave/terahertz wave imaging device and method for detecting human body or article Download PDFInfo
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Abstract
公开了一种毫米波/太赫兹波成像设备及对人体或物品的检测方法,包括准光学组件,包括Y形反射板,所述Y形反射板包括第一反射板、第二反射板和所述第三反射板,所述Y形反射板能够绕其转动轴线转动以使得所述第一反射板的第一反射面、第二反射板的第一反射面和所述第三反射板的第一反射面轮流用作第一工作面接收并反射第一被检对象位于第一视场不同位置的部分自发辐射或反射回来的毫米波/太赫兹波;和毫米波/太赫兹波探测器阵列,适用于接收来自所述准光学组件的波束。该毫米波/太赫兹波成像设备的控制简单,稳定性高。
Disclosed is a millimeter wave/terahertz wave imaging device and a method for detecting human body or objects, including a quasi-optical component, including a Y-shaped reflective plate, and the Y-shaped reflective plate includes a first reflective plate, a second reflective plate and all The third reflective plate, the Y-shaped reflective plate can rotate around its rotation axis so that the first reflective surface of the first reflective plate, the first reflective surface of the second reflective plate and the third reflective surface of the third reflective plate A reflective surface is used in turn as the first working surface to receive and reflect millimeter waves/terahertz waves that are spontaneously emitted or reflected back by parts of the first object under inspection located at different positions in the first field of view; and a millimeter wave/terahertz wave detector array , suitable for receiving the beam from the quasi-optical component. The millimeter wave/terahertz wave imaging equipment has simple control and high stability.
Description
技术领域Technical field
本公开涉及成像技术领域,特别是涉及一种毫米波/太赫兹波成像设备以及利用该毫米波/太赫兹波成像设备对人体或物品进行检测的方法。The present disclosure relates to the field of imaging technology, and in particular to a millimeter wave/terahertz wave imaging device and a method of detecting a human body or an object using the millimeter wave/terahertz wave imaging device.
背景技术Background technique
在当前国内外防恐形势日益严峻的形势下,恐怖分子利用隐匿方式随身携带刀具、枪支、爆炸物等危险物品对公共安全构成了严重的威胁。基于被动式毫米波/太赫兹波的人体安检技术,具有独特的优点,通过检测目标本身的毫米波/太赫兹波辐射实现成像,无需主动辐射,对人体进行安检,利用毫米波/太赫兹波的穿透能力实现藏匿危险物的检测。然而现有的毫米波/太赫兹波成像设备工作效率低。In the current increasingly severe situation of domestic and international terrorism prevention, terrorists use concealment methods to carry dangerous items such as knives, guns, and explosives with them, posing a serious threat to public security. Human body security inspection technology based on passive millimeter waves/terahertz waves has unique advantages. It achieves imaging by detecting the millimeter wave/terahertz wave radiation of the target itself, without the need for active radiation, to conduct security inspections on the human body, using millimeter waves/terahertz waves. Penetrating capability enables detection of hidden dangerous objects. However, existing millimeter wave/terahertz wave imaging equipment has low efficiency.
发明内容Contents of the invention
本公开的目的旨在解决现有技术中存在的上述问题和缺陷的至少一个方面。The present disclosure aims to solve at least one aspect of the above-mentioned problems and deficiencies existing in the prior art.
根据本公开一个方面的实施例,提供了一种毫米波/太赫兹波成像设备,包括:According to an embodiment of one aspect of the present disclosure, a millimeter wave/terahertz wave imaging device is provided, including:
准光学组件,包括Y形反射板,所述Y形反射板包括第一反射板、第二反射板和第三反射板,所述Y形反射板能够绕其转动轴线转动以使得所述第一反射板的第一反射面、第二反射板的第一反射面和所述第三反射板的第一反射面轮流用作第一工作面接收并反射第一被检对象位于第一视场不同位置的部分自发辐射或反射回来的毫米波/太赫兹波;和Quasi-optical assembly, including a Y-shaped reflective plate, the Y-shaped reflective plate including a first reflective plate, a second reflective plate and a third reflective plate, the Y-shaped reflective plate can rotate around its rotation axis so that the first reflective plate The first reflective surface of the reflective plate, the first reflective surface of the second reflective plate and the first reflective surface of the third reflective plate take turns to be used as the first working surface to receive and reflect the first inspected object located in different first fields of view. Partially spontaneously radiated or reflected millimeter/terahertz waves at the location; and
毫米波/太赫兹波探测器阵列,适用于接收来自所述准光学组件的波束。A millimeter wave/terahertz wave detector array is adapted to receive the beam from the quasi-optical component.
在一些实施例中,所述准光学组件还包括第四反射板,当所述Y形反射板转动时,所述第一反射板的与所述第一反射面相反的第二反射面、第二反射板的与所述第一反射面相反的第二工作面和所述第三反射板的与所述第一反射面相反的第二工作面轮流用作第二工作面接收并反射第二被检对象位于第二视场不同位置的部分自发辐射或反射回来的毫米波/太赫兹波至所述第四反射板;In some embodiments, the quasi-optical assembly further includes a fourth reflective plate. When the Y-shaped reflective plate rotates, the second reflective surface and the third reflective surface of the first reflective plate that are opposite to the first reflective surface The second working surface of the second reflecting plate opposite to the first reflecting surface and the second working surface of the third reflecting plate opposite to the first reflecting surface are used in turn as the second working surface to receive and reflect the second Parts of the object under examination located at different positions in the second field of view spontaneously radiate or reflect millimeter waves/terahertz waves to the fourth reflective plate;
斩波器,所述斩波器位于所述第一工作面的反射波路和所述第四反射板的反射波路上,所述斩波器被配置成在任一时刻仅来自所述第一工作面的毫米波/太赫兹波或仅来自所述第四反射板的毫米波/太赫兹波反射或透射到所述毫米波/太赫兹波探测器阵列,所述斩波器绕其中心轴线转动以使来自所述Y形反射板的所述第一工作面和所述第四反射板的毫米波/太赫兹波交替地由所述毫米波/太赫兹波探测器阵列接收。Chopper, the chopper is located on the reflection wave path of the first working surface and the reflection wave path of the fourth reflection plate, and the chopper is configured to only come from the first working surface at any time. The millimeter wave/terahertz wave or only the millimeter wave/terahertz wave from the fourth reflective plate is reflected or transmitted to the millimeter wave/terahertz wave detector array, and the chopper rotates around its central axis to The millimeter wave/terahertz wave from the first working surface of the Y-shaped reflection plate and the fourth reflection plate is alternately received by the millimeter wave/terahertz wave detector array.
在一些实施例中,所述准光学组件还包括聚焦透镜,所述聚焦透镜位于所述斩波器和所述毫米波/太赫兹波探测器阵列之间。In some embodiments, the quasi-optical assembly further includes a focusing lens located between the chopper and the millimeter wave/terahertz wave detector array.
在一些实施例中,所述准光学组件还包括第一聚焦透镜和第二聚焦透镜,所述第一聚焦透镜适用于对来自所述Y形反射板的所述第一工作面的毫米波/太赫兹波进行聚焦,所述第二聚焦透镜适用于对来自所述Y形反射板的所述第二工作面的毫米波/太赫兹波进行聚焦。In some embodiments, the quasi-optical component further includes a first focusing lens and a second focusing lens, the first focusing lens being adapted to focus on millimeter waves/mm from the first working surface of the Y-shaped reflective plate. Terahertz waves are focused, and the second focusing lens is suitable for focusing millimeter waves/terahertz waves from the second working surface of the Y-shaped reflecting plate.
在一些实施例中,该毫米波/太赫兹波成像设备还包括吸波材料,所述吸波材料适用于吸收经由所述斩波器反射的来自所述第一工作面的毫米波/太赫兹波,以及经由所述斩波器透射的来自所述第四反射板的毫米波/太赫兹波。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a wave absorbing material adapted to absorb the millimeter wave/terahertz wave reflected from the first working surface via the chopper. waves, and millimeter waves/terahertz waves from the fourth reflective plate transmitted through the chopper.
在一些实施例中,3个所述反射板与所述转动轴线之间的角度沿着所述Y形反射板的旋转方向递增或递减。In some embodiments, the angles between the three reflective plates and the rotation axis increase or decrease along the rotation direction of the Y-shaped reflective plate.
在一些实施例中,所述斩波器包括至少一个叶片。In some embodiments, the chopper includes at least one blade.
在一些实施例中,多个所述叶片等间隔地围绕所述中心轴线设置。In some embodiments, a plurality of the blades are arranged at equal intervals around the central axis.
在一些实施例中,该毫米波/太赫兹波成像设备还包括壳体,所述准光学组件和所述毫米波/太赫兹波探测器阵列位于所述壳体内,所述壳体的相对侧壁上分别设置有供来自所述第一被检对象的波束穿过的第一窗口和供来自所述第二被检对象的波束穿过的第二窗口。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a housing, the quasi-optical component and the millimeter wave/terahertz wave detector array are located in the housing, and opposite sides of the housing A first window for the beam from the first subject to be inspected to pass through and a second window for the beam from the second subject to be inspected to pass through are respectively provided on the wall.
在一些实施例中,该毫米波/太赫兹波成像设备还包括适用于驱动所述Y形反射板转动的第一驱动装置。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a first driving device adapted to drive the Y-shaped reflective plate to rotate.
在一些实施例中,该毫米波/太赫兹波成像设备还包括适用于驱动所述斩波器转动的第二驱动装置。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a second driving device adapted to drive the chopper to rotate.
在一些实施例中,该毫米波/太赫兹波成像设备还包括:In some embodiments, the millimeter wave/terahertz wave imaging device further includes:
数据处理装置,所述数据处理装置与所述毫米波/太赫兹波探测器阵列连接以分别接收来自所述毫米波/太赫兹波探测器阵列的对于所述第一被检对象的图像数据和对于所述第二被检对象的图像数据并分别生成毫米波/太赫兹波图像;和A data processing device, the data processing device is connected to the millimeter wave/terahertz wave detector array to respectively receive the image data of the first detected object from the millimeter wave/terahertz wave detector array and For the image data of the second subject to be inspected, millimeter wave/terahertz wave images are respectively generated; and
显示装置,所述显示装置与所述数据处理装置相连接,用于接收和显示来自所述数据处理装置的毫米波/太赫兹波图像。A display device connected to the data processing device and configured to receive and display millimeter wave/terahertz wave images from the data processing device.
在一些实施例中,该毫米波/太赫兹波成像设备还包括报警装置,所述报警装置与所述数据处理装置连接,以使得当所述数据处理装置识别出所述毫米波/太赫兹波图像中的可疑物品时发出指示该毫米波/太赫兹波图像存在可疑物品的警报。In some embodiments, the millimeter wave/terahertz wave imaging device further includes an alarm device, the alarm device is connected to the data processing device, so that when the data processing device identifies the millimeter wave/terahertz wave When there is a suspicious object in the image, an alarm is issued indicating that there is a suspicious object in the millimeter wave/terahertz wave image.
在一些实施例中,该毫米波/太赫兹波成像设备还包括校准源,所述校准源位于所述准光学组件的物面上,所述数据处理装置接收来自所述毫米波/太赫兹波探测器阵列的对于所述校准源的校准数据,并基于所述校准数据更新所述第一被检对象的图像数据和所述第二被检对象的图像数据。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a calibration source, the calibration source is located on the object surface of the quasi-optical component, and the data processing device receives data from the millimeter wave/terahertz wave. Calibration data of the detector array for the calibration source, and updating the image data of the first inspected object and the image data of the second inspected object based on the calibration data.
在一些实施例中,该毫米波/太赫兹波成像设备还包括光学摄像装置,所述光学摄像装置包括适用于采集所述第一被检对象的光学图像的第一光学摄像装置和适用于采集所述第二被检对象的光学图像的第二光学摄像装置,所述第一光学摄像装置和所述第二光学摄像装置分别与所述显示装置连接。In some embodiments, the millimeter wave/terahertz wave imaging device further includes an optical camera device, and the optical camera device includes a first optical camera device adapted to collect an optical image of the first object to be inspected and a first optical camera device adapted to collect an optical image of the first subject. The second optical camera device of the optical image of the second object to be inspected, the first optical camera device and the second optical camera device are respectively connected to the display device.
在一些实施例中,所述显示装置包括显示屏,所述显示屏包括适用于显示所述毫米波/太赫兹波图像的第一显示区以及适用于显示所述光学摄像装置所采集的光学图像的第二显示区。In some embodiments, the display device includes a display screen, the display screen includes a first display area adapted to display the millimeter wave/terahertz wave image and an optical image collected by the optical camera device. the second display area.
在一些实施例中,所述第一反射板和所述第二反射板、所述第二反射板和所述第三反射板以及所述第三反射板和所述第一反射板之间的夹角均为120°。In some embodiments, the distance between the first reflective plate and the second reflective plate, the second reflective plate and the third reflective plate, and the third reflective plate and the first reflective plate is The included angles are all 120°.
在一些实施例中,该毫米波/太赫兹波成像设备还包括第五反射板,所述第五反射板绕其中心轴往复摆动,以接收并反射第一被检对象自发辐射或反射回来的毫米波/太赫兹波到所述第一工作面上,以经由所述第一工作面的反射后由毫米波/太赫兹波探测器阵列接收,所述第五反射板的摆动周期T1为所述Y形反射板的转动周期的2m倍,其中m为大于等于1的整数。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a fifth reflective plate that swings back and forth around its central axis to receive and reflect the self-radiated or reflected light from the first subject. The millimeter wave/terahertz wave reaches the first working surface and is received by the millimeter wave/terahertz wave detector array after being reflected by the first working surface. The swing period T1 of the fifth reflecting plate is 2m times the rotation period of the Y-shaped reflecting plate, where m is an integer greater than or equal to 1.
在一些实施例中,该毫米波/太赫兹波成像设备还包括适用于驱动所述第五反射板往复摆动的第三驱动装置。In some embodiments, the millimeter wave/terahertz wave imaging device further includes a third driving device adapted to drive the fifth reflective plate to swing back and forth.
根据本公开的另一方面,还提供了一种利用根上述的毫米波/太赫兹波成像设备对人体或物品进行检测的方法,包括以下步骤:According to another aspect of the present disclosure, a method for detecting a human body or an object using the above-mentioned millimeter wave/terahertz wave imaging device is also provided, including the following steps:
S1:驱动Y形反射板转动,以使得第一反射板的第一反射面、第二反射板的第一反射面和第三反射板的第一反射面轮流用作第一工作面接收并反射第一被检对象自发辐射或反射回来的毫米波/太赫兹波;通过所述第一反射板的第二反射面、第二反射板的第二反射面和第三反射板的第二反射面轮流用作第二工作面接收并反射第二被检对象自发辐射或反射回来的毫米波/太赫兹波;在所述Y形反射板转动的同时,斩波器绕其中心轴线转动以交替地使来自所述第一工作面的毫米波/太赫兹波和第四反射板所反射的来自所述第二工作面的毫米波/太赫兹波由所述毫米波/太赫兹波探测器阵列接收;S1: Drive the Y-shaped reflecting plate to rotate so that the first reflecting surface of the first reflecting plate, the first reflecting surface of the second reflecting plate and the first reflecting surface of the third reflecting plate take turns to be used as the first working surface to receive and reflect Millimeter waves/terahertz waves that are spontaneously radiated or reflected back by the first subject; passing through the second reflective surface of the first reflective plate, the second reflective surface of the second reflective plate and the second reflective surface of the third reflective plate It is used as a second working surface in turn to receive and reflect millimeter waves/terahertz waves that are spontaneously radiated or reflected back by the second subject to be inspected; while the Y-shaped reflecting plate rotates, the chopper rotates around its central axis to alternately The millimeter wave/terahertz wave from the first working surface and the millimeter wave/terahertz wave from the second working surface reflected by the fourth reflecting plate are received by the millimeter wave/terahertz wave detector array. ;
S2:将所述毫米波/太赫兹波探测器阵列所接收的关于所述第一被检对象和关于所述第二被检对象的图像数据发送给数据处理装置;以及S2: Send the image data about the first inspected object and the second inspected object received by the millimeter wave/terahertz wave detector array to a data processing device; and
S3:利用所述数据处理装置分别对所述第一被检对象的图像数据和所述第二被检对象的图像数据进行重建以生成所述第一被检对象和所述第二被检对象的毫米波/太赫兹波图像。S3: Use the data processing device to reconstruct the image data of the first inspected object and the image data of the second inspected object respectively to generate the first inspected object and the second inspected object. Millimeter/terahertz wave images.
根据本公开上述各种实施例的毫米波/太赫兹波成像设备及对人体或物品检测的方法,通过采用Y形反射板,该Y形反射板包括第一反射板、第二反射板和第三反射板,驱动Y形反射板绕第一反射板、第二反射板和第三反射板的连接处转动以使得第一反射板的第一反射面、第二反射板的第一反射面和第三反射板的第一反射面轮流用作第一工作面接收并反射第一被检对象位于第一视场不同位置的部分自发辐射或反射回来的毫米波/太赫兹波,从而实现对被检对象进行成像,且控制简单、成本低。According to the millimeter wave/terahertz wave imaging equipment and the method for detecting human body or objects according to the above various embodiments of the present disclosure, a Y-shaped reflective plate is used. The Y-shaped reflective plate includes a first reflective plate, a second reflective plate and a third reflective plate. Three reflecting plates, driving the Y-shaped reflecting plate to rotate around the connection of the first reflecting plate, the second reflecting plate and the third reflecting plate so that the first reflecting surface of the first reflecting plate, the first reflecting surface of the second reflecting plate and The first reflective surface of the third reflective plate is used in turn as the first working surface to receive and reflect the millimeter waves/terahertz waves that are spontaneously emitted or reflected back by parts of the first subject located at different positions in the first field of view, thereby achieving detection of the subject. The inspection object is imaged, and the control is simple and the cost is low.
附图说明Description of the drawings
图1为根据本公开的一实施例的毫米波/太赫兹波成像设备的结构示意图;Figure 1 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure;
图2为根据本公开的另一实施例的毫米波/太赫兹波成像设备在移除壳体后的结构示意图;Figure 2 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device after removing the housing according to another embodiment of the present disclosure;
图3为根据本公开的一示例性实施例的毫米波/太赫兹波成像设备的Y形反射板的安装示意图;Figure 3 is a schematic diagram of the installation of a Y-shaped reflective plate of a millimeter wave/terahertz wave imaging device according to an exemplary embodiment of the present disclosure;
图4为图3所示的Y形反射板的侧视图;Figure 4 is a side view of the Y-shaped reflective plate shown in Figure 3;
图5为根据本公开的另一实施例的多面体转镜的各反射板与转动轴线之产的角度的示意图;5 is a schematic diagram of the angles between each reflecting plate and the rotation axis of a polyhedral rotating mirror according to another embodiment of the present disclosure;
图6为根据本公开的毫米波/太赫兹波成像设备的斩波器的一示例性实施例的结构示意图;Figure 6 is a schematic structural diagram of an exemplary embodiment of a chopper of a millimeter wave/terahertz wave imaging device according to the present disclosure;
图7为根据本公开的毫米波/太赫兹波成像设备的斩波器的另一示例性实施例的结构示意图;7 is a schematic structural diagram of another exemplary embodiment of a chopper of a millimeter wave/terahertz wave imaging device according to the present disclosure;
图8为根据本公开的毫米波/太赫兹波成像设备的斩波器的再一示例性实施例的结构示意图;Figure 8 is a schematic structural diagram of yet another exemplary embodiment of a chopper of a millimeter wave/terahertz wave imaging device according to the present disclosure;
图9为根据本公开的毫米波/太赫兹波成像设备的斩波器的又一示例性实施例的结构示意图;Figure 9 is a schematic structural diagram of another exemplary embodiment of a chopper of a millimeter wave/terahertz wave imaging device according to the present disclosure;
图10为透镜成像的示意图;Figure 10 is a schematic diagram of lens imaging;
图11为根据本公开的又一实施例的毫米波/太赫兹波成像设备的结构示意图;Figure 11 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to yet another embodiment of the present disclosure;
图12为根据本公开的再一实施例的毫米波/太赫兹波成像设备的结构示意图;Figure 12 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to yet another embodiment of the present disclosure;
图13为根据本公开的一个实施例的毫米波/太赫兹波成像设备的总像素、各反射板的扫描像素与稀疏排布的毫米波/太赫兹波探测器阵列的示意图;Figure 13 is a schematic diagram of the total pixels of the millimeter wave/terahertz wave imaging device, the scanning pixels of each reflector, and the sparsely arranged millimeter wave/terahertz wave detector array according to one embodiment of the present disclosure;
图14为根据本公开的一实施例的毫米波/太赫兹波成像设备对人体或物品进行检查的方法的流程图;以及Figure 14 is a flow chart of a method for inspecting a human body or an object using a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure; and
图15是根据本公开的一实施例的毫米波/太赫兹波成像设备的应用场景图。Figure 15 is an application scenario diagram of a millimeter wave/terahertz wave imaging device according to an embodiment of the present disclosure.
具体实施方式Detailed ways
虽然将参照含有本公开的较佳实施例的附图充分描述本公开,但在此描述之前应了解本领域的普通技术人员可修改本文中所描述的公开,同时获得本公开的技术效果。因此,须了解以上的描述对本领域的普通技术人员而言为一广泛的揭示,且其内容不在于限制本公开所描述的示例性实施例。Although the present disclosure will be fully described with reference to the accompanying drawings containing preferred embodiments of the present disclosure, it should be understood before this description that one of ordinary skill in the art can modify the disclosure described herein while obtaining the technical effects of the present disclosure. Therefore, it is to be understood that the above description is a broad disclosure to those of ordinary skill in the art, and its content is not intended to limit the exemplary embodiments described in the present disclosure.
另外,在下面的详细描述中,为便于解释,阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地,一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下,公知的结构和装置以图示的方式体现以简化附图。Additionally, in the following detailed description, for convenience of explanation, numerous specific details are set forth to provide a comprehensive understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are illustrated in order to simplify the drawings.
图1示意性地示出了根据本公开的一种示例性实施例的毫米波/太赫兹波成像设备。如图所示,该毫米波/太赫兹波成像设备100包括准光学组件、毫米波/太赫兹波探测器阵列2和斩波器8,其中,准光学组件包括Y形反射板1,Y形反射板1包括第一反射板1A、第二反射板1B和第三反射板1C,Y形反射板1能够绕第一反射板1A、第二反射板1B和第三反射板1C的连接处(即转动轴线o)转动以使得第一反射板1A的第一反射面、第二反射板1B的第一反射面和第三反射板1C的第一反射面轮流用作第一工作面接收并反射第一被检对象31A位于第一视场3A不同位置的部分自发辐射或反射回来的毫米波/太赫兹波;准光学组件还包括第四反射板7,当Y形反射板1转动时,第一反射板1A的与第一反射面相反的第二反射面、第二反射板1B的与第一反射面相反的第二工作面和第三反射板1C的与第一反射面相反的第二工作面轮流用作第二工作面接收并反射第二被检对象31B位于第二视场3B不同位置的部分自发辐射或反射回来的毫米波/太赫兹波至第四反射板7。准光学元件还包括第一聚焦透镜4A和第二聚焦透镜4B,该第一聚焦透镜4A适用于汇聚来自第一工作面的波束,该第二聚焦透镜4B适用于汇聚来自第二工作面的波束。斩波器8位于第一工作面的反射波路和第四反射板7的反射波路上,斩波器8被配置成在任一时刻仅来自第一工作面的毫米波/太赫兹波透射到毫米波/太赫兹波探测器阵列2或仅来自第四反射板7的毫米波/太赫兹波反射到毫米波/太赫兹波探测器阵列2,斩波器8绕其中心轴线转动以交替地使来自Y形反射板1的第一工作面和第四反射板7的毫米波/太赫兹波由毫米波/太赫兹波探测器阵列2接收。毫米波/太赫兹波探测器阵列2适用于接收来自准光学组件反射并汇聚后的波束;毫米波/太赫兹波探测器阵列2中的探测器的个数根据所需的视场3A、3B大小以及所需分辨率确定,其排布方向与视场法线垂直且平行于水平面,探测器的大小根据波长、加工工艺以及所需采样密度确定。FIG. 1 schematically illustrates a millimeter wave/terahertz wave imaging device according to an exemplary embodiment of the present disclosure. As shown in the figure, the millimeter wave/terahertz wave imaging device 100 includes a quasi-optical component, a millimeter wave/terahertz wave detector array 2 and a chopper 8, wherein the quasi-optical component includes a Y-shaped reflective plate 1, a Y-shaped The reflection plate 1 includes a first reflection plate 1A, a second reflection plate 1B and a third reflection plate 1C. The Y-shaped reflection plate 1 can surround the connection point ( That is, the rotation axis o) rotates so that the first reflective surface of the first reflective plate 1A, the first reflective surface of the second reflective plate 1B, and the first reflective surface of the third reflective plate 1C take turns to be used as the first working surface to receive and reflect Parts of the first inspected object 31A located at different positions in the first field of view 3A spontaneously radiate or reflect millimeter waves/terahertz waves; the quasi-optical component also includes a fourth reflective plate 7. When the Y-shaped reflective plate 1 rotates, the A second reflective surface of a reflective plate 1A opposite to the first reflective surface, a second working surface of a second reflective plate 1B opposite to the first reflective surface, and a second reflective surface of a third reflective plate 1C opposite to the first reflective surface. The working surface is in turn used as the second working surface to receive and reflect some of the millimeter/terahertz waves that are spontaneously emitted or reflected back by the second object 31B located at different positions in the second field of view 3B to the fourth reflecting plate 7 . The quasi-optical element also includes a first focusing lens 4A and a second focusing lens 4B. The first focusing lens 4A is suitable for converging the beam from the first working surface, and the second focusing lens 4B is suitable for converging the wave beam from the second working surface. . The chopper 8 is located on the reflection wave path of the first working surface and the reflection wave path of the fourth reflection plate 7. The chopper 8 is configured to transmit only the millimeter wave/terahertz wave from the first working surface to the millimeter wave at any time. /terahertz wave detector array 2 or only the millimeter wave/terahertz wave from the fourth reflection plate 7 is reflected to the millimeter wave/terahertz wave detector array 2, and the chopper 8 rotates around its central axis to alternately make the wave from The millimeter wave/terahertz waves of the first working surface of the Y-shaped reflection plate 1 and the fourth reflection plate 7 are received by the millimeter wave/terahertz wave detector array 2 . The millimeter wave/terahertz wave detector array 2 is suitable for receiving the reflected and converged wave beam from the quasi-optical component; the number of detectors in the millimeter wave/terahertz wave detector array 2 is based on the required fields of view 3A and 3B. The size and required resolution are determined. Its arrangement direction is perpendicular to the normal line of the field of view and parallel to the horizontal plane. The size of the detector is determined according to the wavelength, processing technology and required sampling density.
根据本公开的实施例的毫米波/太赫兹波成像设备100,通过驱动Y形反射板1绕第一反射板1A、第二反射板1B和第三反射板1C的连接处转动,以分别完成对第一视场3A和第二视场3B的数据采集,在Y形反射板1转动的过程中,通过斩波器8将来自第一视场3A和第二视场3B的毫米波/太赫兹波交替地切换到同一个毫米波/太赫兹波探测器阵列2,从而实现对位于两个视场3A、3B的两个被检对象31A、31B进行成像的同时,可以降低毫米波/太赫兹波探测器的数量,以降低设备成本,且稳定性高、占地空间小。According to the millimeter wave/terahertz wave imaging device 100 according to the embodiment of the present disclosure, the Y-shaped reflection plate 1 is driven to rotate around the connection of the first reflection plate 1A, the second reflection plate 1B and the third reflection plate 1C to complete respectively For data collection of the first field of view 3A and the second field of view 3B, during the rotation of the Y-shaped reflecting plate 1, the chopper 8 is used to convert the millimeter wave/terabytes from the first field of view 3A and the second field of view 3B. The Hertzian wave is alternately switched to the same millimeter wave/terahertz wave detector array 2, thereby achieving imaging of the two inspected objects 31A and 31B located in the two fields of view 3A and 3B while reducing the millimeter wave/terahertz wave detector array 2. The number of Hertzian wave detectors can reduce equipment costs, with high stability and small footprint.
在该实施例中,聚焦透镜4包括第一聚焦透镜4A和第二聚焦透镜4B,第一聚焦透镜4A位于Y形反射板1和斩波器8之间,并适用于对来自Y形反射板的所述第一工作面的毫米波/太赫兹波进行聚焦,第二聚焦透镜4B位于Y形反射板1和第四反射板7之间,并适用于对来自Y形反射板1的所述第二工作面的毫米波/太赫兹波进行聚焦。两个聚焦透镜4A、4B的焦距分别为f1、f2,其中f1与f2的大小可以是一样的,也可以是不一样的。由于斩波器8放置在经过聚焦透镜4A、4B聚焦后的波路中,因此斩波器8的叶片82的尺寸可以较小,在这种情况下,斩波器8的叶片82的具体尺寸由经过聚焦透镜4A、4B聚焦后在预放置斩波器8的地方的束斑大小决定。假设经过聚焦透镜4A、4B聚焦后在预放置斩波器8的地方的束斑半径为wcut,那么斩波器8的叶片82的尺寸(面积)选择为 In this embodiment, the focusing lens 4 includes a first focusing lens 4A and a second focusing lens 4B. The first focusing lens 4A is located between the Y-shaped reflecting plate 1 and the chopper 8 and is suitable for analyzing the signals coming from the Y-shaped reflecting plate. The second focusing lens 4B is located between the Y-shaped reflective plate 1 and the fourth reflective plate 7 and is suitable for focusing the millimeter wave/terahertz wave from the Y-shaped reflective plate 1. The millimeter wave/terahertz wave of the second working surface is focused. The focal lengths of the two focusing lenses 4A and 4B are f1 and f2 respectively, and the sizes of f1 and f2 may be the same or different. Since the chopper 8 is placed in the wave path focused by the focusing lenses 4A and 4B, the size of the blades 82 of the chopper 8 can be smaller. In this case, the specific size of the blades 82 of the chopper 8 is given by The size of the beam spot at the place where the chopper 8 is pre-placed after being focused by the focusing lenses 4A and 4B is determined. Assuming that the beam spot radius at the place where the chopper 8 is pre-placed after being focused by the focusing lenses 4A and 4B is w cut , then the size (area) of the blade 82 of the chopper 8 is selected as
需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,如图2所示,也可以采用一个聚焦透镜4,该聚焦透镜4位于斩波器8和毫米波/太赫兹波探测器阵列2之间。在这种情况下,由于斩波器8放置在未聚焦的波路中,所以其叶片82的尺寸大小应与Y形反射板1的反射面相匹配。It should be noted that those skilled in the art should understand that in other embodiments of the present disclosure, as shown in FIG. 2 , a focusing lens 4 may also be used, and the focusing lens 4 is located between the chopper 8 and the millimeter wave/ between the terahertz wave detector array 2. In this case, since the chopper 8 is placed in an unfocused wave path, the size of its blades 82 should match the reflecting surface of the Y-shaped reflecting plate 1 .
在图1和图2所示的示例性实施例中,该毫米波/太赫兹波成像设备还包括吸波材料9,该吸波材料9适用于吸收经由斩波器8反射的来自第一工作面的毫米波/太赫兹波,以及经由斩波器8透射的来自第四反射板7的毫米波/太赫兹波。In the exemplary embodiment shown in FIGS. 1 and 2 , the millimeter wave/terahertz wave imaging device further includes a wave absorbing material 9 , which is suitable for absorbing the wave reflected from the first working wave via the chopper 8 . millimeter waves/terahertz waves from the surface, and millimeter waves/terahertz waves from the fourth reflective plate 7 transmitted through the chopper 8 .
在图1和图2所示的示例性实施例中,第一反射板1A、第二反射板1B和第二反射板1C之产的角度θ为120°。需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,第一反射板1A、第二反射板1B和第二反射板1C中的相邻两个的角度θ也可以为其它数值。In the exemplary embodiment shown in FIGS. 1 and 2 , the angle θ between the first reflective plate 1A, the second reflective plate 1B and the second reflective plate 1C is 120°. It should be noted that those skilled in the art should understand that in other embodiments of the present disclosure, the angle θ of two adjacent ones of the first reflecting plate 1A, the second reflecting plate 1B and the second reflecting plate 1C is also Can be other values.
在图1和图2所示的示例性实施例中,第一反射板1A、第二反射板1B、第三反射板1C为长方形,其长度和宽度应与相应的聚焦透镜4相匹配,通常情况下,第一反射板1A、第二反射板1B、第三反射板1C的宽度大于或等于相应的聚焦透镜4的直径,第一反射板1A、第二反射板1B、第三反射板1C的长度应为其宽度的倍,聚焦透镜4的直径例如可以为3cm-50cm。In the exemplary embodiment shown in FIGS. 1 and 2 , the first reflective plate 1A, the second reflective plate 1B, and the third reflective plate 1C are rectangular, and their length and width should match the corresponding focusing lens 4. Generally, In this case, the widths of the first reflective plate 1A, the second reflective plate 1B, and the third reflective plate 1C are greater than or equal to the diameter of the corresponding focusing lens 4. The first reflective plate 1A, the second reflective plate 1B, and the third reflective plate 1C should have a length equal to its width times, the diameter of the focusing lens 4 may be, for example, 3cm-50cm.
在图1至图4所示的示例性实施例中,第一反射板1A、第二反射板1B、第三反射板1C与转动轴线o均是平行的。需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,第一反射板1A、第二反射板1B、第三反射板1C与转动轴线o之间的角度可以沿着Y形反射板1的旋转方向以α的增量递增或递减,以实现像素差值,这样可以将毫米波/太赫兹波探测器阵列2的探测器稀疏分布,从而降低探测器的数量。In the exemplary embodiment shown in FIGS. 1 to 4 , the first reflective plate 1A, the second reflective plate 1B, and the third reflective plate 1C are all parallel to the rotation axis o. It should be noted that those skilled in the art should understand that in other embodiments of the present disclosure, the angle between the first reflection plate 1A, the second reflection plate 1B, the third reflection plate 1C and the rotation axis o can be along the The rotation direction of the Y-shaped reflective plate 1 increases or decreases in increments of α to achieve pixel difference, so that the detectors of the millimeter wave/terahertz wave detector array 2 can be sparsely distributed, thereby reducing the number of detectors.
其中d由下列等式算出:where d is calculated from the following equation:
式中,λ为毫米波/太赫兹波的波长,In the formula, λ is the wavelength of millimeter wave/terahertz wave,
D为聚焦透镜4的直径。D is the diameter of the focusing lens 4.
需要说明的是,上式只是一个透镜理想聚集下的角分辨率估算公式。在实际的系统中应该根据实验结果,微调α的大小,使得最终的像素排列尽可能均匀且无重叠与空隙。也就是说Y形反射板1上的反射板1A、1B、1C与转动轴线o之间的角度是可微调的。It should be noted that the above formula is only an estimation formula of angular resolution under ideal focusing of a lens. In the actual system, the size of α should be fine-tuned based on the experimental results so that the final pixel arrangement is as uniform as possible without overlap and gaps. That is to say, the angle between the reflecting plates 1A, 1B, and 1C on the Y-shaped reflecting plate 1 and the rotation axis o can be finely adjusted.
如图5所示,在一种示例性实施例中,第一反射板1A、第二反射板1B、第三反射板1C与转动轴线o之间的角度大小沿着Y形反射板1的旋转方向递增。第一反射板1A与转动轴线o之间的角度θ为0°,第二反射板1B与转动轴线o之间的角度θ为+α,第三反射板1C与转动轴线o之间的角度θ为-α。需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,第一反射板1A、第二反射板1B、第三反射板1C与转动轴线o之间的角度大小沿着Y形反射板1的旋转方向递减。As shown in FIG. 5 , in an exemplary embodiment, the angle between the first reflecting plate 1A, the second reflecting plate 1B, the third reflecting plate 1C and the rotation axis o is along the rotation of the Y-shaped reflecting plate 1 The direction increases. The angle θ between the first reflection plate 1A and the rotation axis o is 0°, the angle θ between the second reflection plate 1B and the rotation axis o is +α, and the angle θ between the third reflection plate 1C and the rotation axis o is is -α. It should be noted that those skilled in the art should understand that in other embodiments of the present disclosure, the angle between the first reflection plate 1A, the second reflection plate 1B, the third reflection plate 1C and the rotation axis o is along the The rotation direction of the Y-shaped reflecting plate 1 decreases gradually.
图6至图9分别示出了几种斩波器的结构示意图,斩波器8包括至少一个叶片,例如1个、2个、3个和4个等,多个叶片82等间隔地围绕中心轴线81设置。在斩波器8绕其中心轴线81旋转的过程中,在任一时刻当来自第一工作面的毫米波/太赫兹波入射到斩波器8的叶片82上,该叶片82将来自第一工作面的毫米波/太赫兹波反射到吸波材料9,以由吸波材料9吸收,同时将来自第四反射板7的毫米波/太赫兹波反射到毫米波/太赫兹波探测器阵列2。随着斩波器8绕其中心轴线81的旋转,在下一时刻,来自第一工作面的毫米波/太赫兹波入射到斩波器8未设置有叶片82的部分(即空的部分),以透射到毫米波/太赫兹波探测器阵列2,该斩波器8未设置有叶片82的部分同时将来自第四反射板7的毫米波/太赫兹波透射到吸波材料9,以由吸波材料9吸收,依次循环下去。Figures 6 to 9 respectively show the structural schematic diagrams of several choppers. The chopper 8 includes at least one blade, such as 1, 2, 3, 4, etc., and a plurality of blades 82 are equally spaced around the center. Axis 81 is set. During the rotation of the chopper 8 around its central axis 81, at any moment when the millimeter wave/terahertz wave from the first working surface is incident on the blades 82 of the chopper 8, the blades 82 will come from the first working surface. The millimeter wave/terahertz wave on the surface is reflected to the wave absorbing material 9 to be absorbed by the wave absorbing material 9, and at the same time, the millimeter wave/terahertz wave from the fourth reflection plate 7 is reflected to the millimeter wave/terahertz wave detector array 2 . As the chopper 8 rotates around its central axis 81, at the next moment, the millimeter wave/terahertz wave from the first working surface is incident on the part of the chopper 8 that is not provided with blades 82 (i.e., the empty part), In order to transmit to the millimeter wave/terahertz wave detector array 2, the part of the chopper 8 not provided with blades 82 simultaneously transmits the millimeter wave/terahertz wave from the fourth reflection plate 7 to the wave absorbing material 9, so as to be formed by The absorbing material 9 absorbs, and the cycle continues.
需要说明的是,斩波器8也可以由能够快速切换到高反射和高透射状态的其它装置来代替。It should be noted that the chopper 8 can also be replaced by other devices that can quickly switch to high reflection and high transmission states.
在图1和图2所示的示例性实施例中,斩波器8与来自第一工作面的波路和来自第四反射板7的波路均呈45度夹角放置。需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,斩波器8与来自第一工作面的波路和来自第四反射板7的波路也可以呈其它角度放置。In the exemplary embodiment shown in FIGS. 1 and 2 , the chopper 8 is placed at an angle of 45 degrees to both the wave path from the first working surface and the wave path from the fourth reflective plate 7 . It should be noted that those skilled in the art should understand that in other embodiments of the present disclosure, the chopper 8 and the wave path from the first working surface and the wave path from the fourth reflection plate 7 can also be placed at other angles. .
如图1所示,在一种示例性实施例中,该毫米波/太赫兹波成像设备还包括壳体6,准光学组件和毫米波/太赫兹波探测器阵列2位于壳体6内,壳体6的相对侧壁上分别设置有供第一被检对象31A自发辐射或反射的毫米波/太赫兹波穿过的第一窗口61A和供第二被检对象31B自发辐射或反射的毫米波/太赫兹波穿过的第二窗口61B。As shown in Figure 1, in an exemplary embodiment, the millimeter wave/terahertz wave imaging device further includes a housing 6, in which the quasi-optical component and the millimeter wave/terahertz wave detector array 2 are located, Opposite side walls of the housing 6 are respectively provided with a first window 61A for the millimeter wave/terahertz wave to be spontaneously radiated or reflected by the first subject 31A to pass through, and a millimeter wave for the second subject 31B to be spontaneously radiated or reflected. The second window 61B through which the wave/terahertz wave passes.
如图3和图4所示,在一种示例性实施例中,第一反射板1A、第二反射板1B和第二反射板1C的连接处设置有转轴11,转轴11的两端经由轴承10A、10B与壳体6可转动地连接,以使得Y形反射板能够转动,从而使得第一反射板1A的第一反射面、第二反射板1B的第一反射面和第二反射板1C的第一反射面分别对来自被检对象31A位于视场3A不同竖直位置的部分的波束进行反射,同时第一反射板1A的第二反射面、第二反射板1B的第二反射面和第二反射板1C的第二反射面分别对来自被检对象31B位于视场3B不同竖直位置的部分的波束进行反射。As shown in Figures 3 and 4, in an exemplary embodiment, a rotating shaft 11 is provided at the connection between the first reflecting plate 1A, the second reflecting plate 1B and the second reflecting plate 1C, and both ends of the rotating shaft 11 are connected through bearings. 10A, 10B are rotatably connected to the housing 6, so that the Y-shaped reflective plate can rotate, thereby making the first reflective surface of the first reflective plate 1A, the first reflective surface of the second reflective plate 1B and the second reflective plate 1C The first reflective surfaces respectively reflect the beams from parts of the inspected object 31A located at different vertical positions in the field of view 3A. At the same time, the second reflective surfaces of the first reflective plate 1A, the second reflective surface of the second reflective plate 1B and The second reflective surface of the second reflective plate 1C reflects the beams from the portions of the inspected object 31B located at different vertical positions in the field of view 3B respectively.
如图3和图4所示,在一种示例性实施例中,该毫米波/太赫兹波成像设备还包括适用于驱动Y形反射板1转动的第一驱动装置13,例如伺服电机。As shown in FIGS. 3 and 4 , in an exemplary embodiment, the millimeter wave/terahertz wave imaging device further includes a first driving device 13 suitable for driving the Y-shaped reflective plate 1 to rotate, such as a servo motor.
如图3和图4所示,在一种示例性实施例中,该毫米波/太赫兹波成像设备还包括实时检测Y形反射板的角位移的角位移测量机构12,例如光电码盘,以便准确地计算出Y形反射板的姿态,这可以在相当程度上减小控制算法和成像算法的研制难度。As shown in Figures 3 and 4, in an exemplary embodiment, the millimeter wave/terahertz wave imaging device also includes an angular displacement measurement mechanism 12 that detects the angular displacement of the Y-shaped reflective plate in real time, such as a photoelectric code disk, In order to accurately calculate the attitude of the Y-shaped reflector, this can reduce the difficulty of developing control algorithms and imaging algorithms to a considerable extent.
如未示出的一种示例性实施例中,该毫米波/太赫兹波成像设备还包括适用于驱动斩波器8转动的第二驱动装置,例如伺服电机,以驱动斩波器8绕其中心轴线81高速旋转,斩波器8的旋转周期应与Y形反射板1的扫描周期相匹配,以使得对该毫米波/太赫兹波成像设备能够同时对两个视场3A、3B的两个被检对象31A、31B分别进行成像,优选斩波器8的旋转周期为Y形反射板的扫描周期的1/1000-1/2。As in an exemplary embodiment not shown, the millimeter wave/terahertz wave imaging device further includes a second driving device suitable for driving the chopper 8 to rotate, such as a servo motor, to drive the chopper 8 around it. The central axis 81 rotates at high speed, and the rotation period of the chopper 8 should match the scanning period of the Y-shaped reflective plate 1, so that the millimeter wave/terahertz wave imaging device can simultaneously image both fields of view 3A and 3B. The objects 31A and 31B to be inspected are imaged respectively. It is preferable that the rotation period of the chopper 8 is 1/1000-1/2 of the scanning period of the Y-shaped reflecting plate.
在该实施例中,探测器的静态视场为水平视场,假定探测器的个数为N,两个相邻的探测器的中心间距d时,则探测器的最大偏馈距离ym,则In this embodiment, the static field of view of the detector is a horizontal field of view. Assume that the number of detectors is N and the center distance between two adjacent detectors is d, then the maximum offset distance y m of the detector is, but
由此可以计算出毫米波/太赫兹波探测器阵列2的静态视场为H0。如图10所示,毫米波/太赫兹波探测器阵列2的静态视场H0与物距L1、像距L2需要满足如下关系式From this, it can be calculated that the static field of view of the millimeter wave/terahertz wave detector array 2 is H 0 . As shown in Figure 10, the static field of view H 0 of the millimeter wave/terahertz wave detector array 2, the object distance L 1 and the image distance L 2 need to satisfy the following relationships:
Y形反射板1绕着其转动轴线o转动,数据采集的角度大小根据需要扫描的被检对象31A、31B的高度方向的视场范围决定,假设高度方向所需的成像视场对应的角度方位为θm,那么对应的扫描视场角度为θrot=θm/2。The Y-shaped reflective plate 1 rotates around its rotation axis o. The angle of data collection is determined by the field of view in the height direction of the objects 31A and 31B that need to be scanned. Assume that the angle of view corresponding to the required imaging field of view in the height direction is is θ m , then the corresponding scanning field of view angle is θ rot =θ m /2.
其中,Y形反射板1完成对相应的被检对象31A(31B)所在的视场竖直范围的反射所需要摆动的次数Nv通过下式计算:Among them, the number of swings N v required for the Y-shaped reflecting plate 1 to complete the reflection of the vertical range of the field of view where the corresponding subject 31A (31B) is located is calculated by the following formula:
式中,[]表示向上取整;In the formula, [] means rounding up;
L为视场3A(3B)的中心到第一工作面(第二工作面1B)的中心的距离;L is the distance from the center of the field of view 3A (3B) to the center of the first working surface (second working surface 1B);
δ表示物方分辨率;δ represents the object-space resolution;
θm为竖直视场范围H所对应的视场角度。θ m is the field of view angle corresponding to the vertical field of view range H.
Y形反射板1转动一个周期对每个视场完成都3幅图像的采集。The Y-shaped reflecting plate 1 rotates in one cycle to complete the collection of three images for each field of view.
高度方向采样密度决定于波束驻留时产,Y形反射板1转动一个周期,每个视场各输出3副图像。假设探测器的角分辨率为θres,Y形反射板1转动一个周期包含的3dB波束数为The sampling density in the height direction is determined by the beam dwell time. The Y-shaped reflector 1 rotates for one cycle, and each field of view outputs three images. Assuming that the angular resolution of the detector is θ res , the number of 3dB beams contained in one rotation of the Y-shaped reflector 1 is
n=360°/θres (5)n=360°/θ res (5)
假设成像速率要求为mHz,则每个采样波束的在高度方向的平均驻留时间τd为Assuming that the imaging rate requirement is mHz, the average residence time τ d of each sampling beam in the height direction is
以成像距离系统3000mm处,角分辨率θres=0.57°,则物方分辨率为δ=30mm,成像速率10Hz为例,可以求得高度方向采集的步数为约67个,平均每个波束驻留时间为τd=100ms/67=1.47ms。第一驱动装置13控制Y形反射板1转动,其周期为0.05s。Taking the imaging distance of the system as 3000mm, the angular resolution θ res = 0.57°, the object-space resolution as δ = 30mm, and the imaging rate of 10Hz as an example, the number of steps collected in the height direction can be calculated to be approximately 67, with an average of each beam The dwell time is τ d =100ms/67=1.47ms. The first driving device 13 controls the Y-shaped reflecting plate 1 to rotate with a period of 0.05s.
在一种示例性实施例中,工作在中心频率为94GHz的毫米波/太赫兹波成像设备,探测器个数N=30个,排成一列,探测器的中心间距d=7mm,探测器阵列长2ym=21cm。物距L1=3.5m,像距L2=0.7m,根据公式(3)可以计算出静态视场H0=105cm。假设成像区域高度方向大小为1.8m,那么用于重建图像的高度方向的扫描角度为θm=34°。In an exemplary embodiment, a millimeter wave/terahertz wave imaging device operating at a center frequency of 94 GHz, the number of detectors N = 30, arranged in a row, the center distance of the detectors d = 7 mm, the detector array Length 2y m = 21cm. The object distance L 1 =3.5m, the image distance L 2 =0.7m, the static field of view H 0 =105cm can be calculated according to formula (3). Assuming that the size of the imaging area in the height direction is 1.8m, the scanning angle in the height direction used to reconstruct the image is θ m =34°.
在另一示例性实施例中,工作在中心频率为220GHz的毫米波/太赫兹波成像设备,探测器个数N=48个,排成一列,探测器的中心间d=3mm,探测器阵列长度为2ym=14.4cm。物距L1=5m,像距L2=0.7m,根据公式(3)可以计算出静态视场H0=103cm。假设成像区域高度方向大小为1.8m,那么用于重建图像的高度方向的扫描角度为θm=20°。In another exemplary embodiment, a millimeter wave/terahertz wave imaging device operating at a center frequency of 220 GHz, the number of detectors is N=48, arranged in a row, the center distance between detectors is d=3mm, and the detector array The length is 2y m =14.4cm. The object distance L 1 =5m, the image distance L 2 =0.7m, the static field of view H 0 =103cm can be calculated according to formula (3). Assuming that the size of the imaging area in the height direction is 1.8m, the scanning angle in the height direction used to reconstruct the image is θ m =20°.
在一种示例性实施例中,该毫米波/太赫兹波成像设备还包括数据处理装置(未示出)。该数据处理装置与毫米波/太赫兹波探测器阵列2无线连接或有线连接以分别接收毫米波/太赫兹波探测器阵列2所接收的关于第一被检对象31A和关于第二被检对象31B的图像数据。In an exemplary embodiment, the millimeter wave/terahertz wave imaging device further includes a data processing device (not shown). The data processing device is connected wirelessly or wiredly to the millimeter wave/terahertz wave detector array 2 to respectively receive the first detected object 31A and the second detected object received by the millimeter wave/terahertz wave detector array 2 31B of image data.
在一个示例性实施例中,该成像设备还可以包括显示装置,该显示装置与数据处理装置相连接,用于接收和显示来自数据处理装置的毫米波/太赫兹波图像。In an exemplary embodiment, the imaging device may further include a display device connected to the data processing device for receiving and displaying millimeter wave/terahertz wave images from the data processing device.
如图1所示,在一种示例性实施例中,该毫米波/太赫兹波成像设备还包括校准源5,该校准源5位于壳体6内并在准光学组件的物面上,以使得当第一工作面转动到校准区域时,通过毫米波/太赫兹波探测器阵列2接收关于校准源5的校准数据,数据处理装置接收毫米波/太赫兹波探测器阵列2所接收的关于校准源5的校准数据,并基于校准数据实时地更新第一被检对象31A和第二被检对象31B的图像数据。由于校准源5封装在壳体1内部,因此使得该毫米波/太赫兹波成像设备比采用远处的空气进行校准更加稳定可靠。As shown in Figure 1, in an exemplary embodiment, the millimeter wave/terahertz wave imaging device further includes a calibration source 5, which is located in the housing 6 and on the object surface of the quasi-optical component, to So that when the first working surface rotates to the calibration area, the calibration data about the calibration source 5 is received through the millimeter wave/terahertz wave detector array 2, and the data processing device receives the calibration data about the calibration source 5 received by the millimeter wave/terahertz wave detector array 2. The calibration data of the source 5 is calibrated, and the image data of the first inspected object 31A and the second inspected object 31B are updated in real time based on the calibration data. Since the calibration source 5 is packaged inside the housing 1, the millimeter wave/terahertz wave imaging device is more stable and reliable than using remote air for calibration.
在该实施例中,校准源5位于Y形反射板1的斜上方,需要说明的是,校准源5的位置只要使得毫米波/太赫兹波探测器阵列2接收关于校准源5的校准数据和被检对象31A、31B的图像数据不相互干涉即可,校准源5辐射的波束经由第一工作面和/或第二工作面反射到毫米波/太赫兹波探测器阵列2,这样可以实现对包含聚焦透镜4和探测器的完整接收通道的校准,进一步保证了通道的一致性。In this embodiment, the calibration source 5 is located obliquely above the Y-shaped reflecting plate 1. It should be noted that the position of the calibration source 5 only needs to enable the millimeter wave/terahertz wave detector array 2 to receive the calibration data about the calibration source 5 and As long as the image data of the objects 31A and 31B do not interfere with each other, the beam radiated by the calibration source 5 is reflected to the millimeter wave/terahertz wave detector array 2 through the first working surface and/or the second working surface, so that alignment can be achieved. The calibration of the complete receiving channel including focusing lens 4 and detector further ensures the consistency of the channel.
在图1和图2所示的示例性实施例中,Y形反射板1的转轴11水平设置,以使得第一工作面、第二工作面对来自相应的被检对象31A、31B位于视场不同竖直位置的部分的波束进行反射。需要说明的是,本领域的技术人员应当理解,在本公开的其它一些实施例中,Y形反射板1的转轴11也可以竖直设置,以使得第一工作面、第二工作面对来自相应的被检对象31A、31B位于视场不同水平位置的部分的波束进行反射。此外,校准源5可以是塑料、泡沫等发射率接近于1的吸波材料,也可以采用黑体或半导体致冷器等。In the exemplary embodiment shown in FIGS. 1 and 2 , the rotation axis 11 of the Y-shaped reflective plate 1 is set horizontally, so that the first working surface and the second working surface are located in the field of view from the corresponding inspected objects 31A, 31B. Parts of the beam at different vertical positions are reflected. It should be noted that those skilled in the art should understand that in other embodiments of the present disclosure, the rotation axis 11 of the Y-shaped reflection plate 1 can also be arranged vertically, so that the first working surface and the second working surface come from The beams corresponding to the portions of the inspected objects 31A and 31B located at different horizontal positions in the field of view are reflected. In addition, the calibration source 5 can be an absorbing material with an emissivity close to 1, such as plastic or foam, or a blackbody or semiconductor refrigerator.
由奈奎斯特采样定律,在一个半功率波束宽度内至少有两个采样点才能完全恢复图像。该实施例中的毫米波/太赫兹波探测器阵列2的排布方向与视场法线垂直且平行于水平面,以对高度方向的视场进行采样,毫米波/太赫兹波探测器阵列2的排列密度决定采样密度。毫米波成像系统所成图像实际为灰度图像,其空间采样率在达不到奈奎斯特采样要求(欠采样)时,仍然可以对目标场景成像,只是成像效果相对较差。为了弥补欠采样所带来的像素缺失,可以在后期信号处理时采用插值算法增加数据密度。According to the Nyquist sampling law, at least two sampling points are required within a half-power beam width to fully restore the image. The arrangement direction of the millimeter wave/terahertz wave detector array 2 in this embodiment is perpendicular to the normal line of the field of view and parallel to the horizontal plane to sample the field of view in the height direction. The millimeter wave/terahertz wave detector array 2 The arrangement density determines the sampling density. The images produced by the millimeter-wave imaging system are actually grayscale images. When the spatial sampling rate cannot meet the Nyquist sampling requirements (undersampling), the target scene can still be imaged, but the imaging effect is relatively poor. In order to compensate for the missing pixels caused by undersampling, an interpolation algorithm can be used to increase data density during post-signal processing.
如图1所示,在一种示例性实施例中,校准源5的长度方向平行于Y形反射板的转轴11,校准源5的长度大于等于毫米波/太赫兹波探测器阵列2在平行于转轴11方向上的视场大小,校准源5的宽度为毫米波/太赫兹波探测器2的天线波束宽度的10倍。然而,需要说明的是,本领域的技术人员应当理解,校准源5的宽度也可以为毫米波/太赫兹波探测器的天线波束宽度的1倍或2倍或其它倍数。As shown in Figure 1, in an exemplary embodiment, the length direction of the calibration source 5 is parallel to the rotation axis 11 of the Y-shaped reflection plate, and the length of the calibration source 5 is greater than or equal to the millimeter wave/terahertz wave detector array 2 in parallel. The size of the field of view in the direction of the rotation axis 11, the width of the calibration source 5 is 10 times the antenna beam width of the millimeter wave/terahertz wave detector 2. However, it should be noted that those skilled in the art will understand that the width of the calibration source 5 may also be 1 time, 2 times or other multiples of the antenna beam width of the millimeter wave/terahertz wave detector.
在一种实施例中,该毫米波/太赫兹波成像设备还包括光学摄像装置,该光学摄像装置包括适用于采集第一被检对象31A的光学图像的第一光学摄像装置和适用于采集第二被检对象31B的光学图像的第二光学摄像装置,该光学摄像装置与显示装置连接,该光学摄像装置可以实现可见光实时成像,给出第一被检对象31A和第二被检对象31B的图像信息,以与毫米波/太赫兹波图像进行对照,以供使用者参考。In one embodiment, the millimeter wave/terahertz wave imaging device further includes an optical camera device. The optical camera device includes a first optical camera device adapted to collect an optical image of the first subject 31A and a first optical camera device adapted to collect the second optical image. A second optical camera device for optical images of the two inspected objects 31B. The optical camera device is connected to the display device. The optical camera device can realize visible light real-time imaging and provide images of the first inspected object 31A and the second inspected object 31B. Image information to compare with millimeter wave/terahertz wave images for user reference.
在未示出的一种示例性实施例中,显示装置包括显示屏,显示屏包括适用于显示第一被检对象31A和第二被检对象31B的毫米波/太赫兹波图像的第一显示区以及适用于显示光学摄像装置所采集的第一被检对象31A和第二被检对象31B的光学图像的第二显示区,以便于使用者将光学摄像装置所采集的光学图像和毫米波/太赫兹波图像进行对比。In an exemplary embodiment not shown, the display device includes a display screen, and the display screen includes a first display adapted to display millimeter wave/terahertz wave images of the first subject 31A and the second subject 31B. area and a second display area suitable for displaying the optical images of the first object 31A and the second object 31B collected by the optical camera, so that the user can combine the optical images collected by the optical camera with millimeter-wave/ Terahertz wave images for comparison.
在未示出的一种示例性实施例中,该毫米波/太赫兹波成像设备还包括报警装置,该报警装置与数据处理装置连接,以使得当识别出第一被检对象31A和/或第二被检对象31B的毫米波/太赫兹波图像中的可疑物品时,例如在相应的被检对象所对应的毫米波/太赫兹波图像的下方发出警报,例如报警灯亮起,需要说明的是,也可以采用声音提示的报警方式。In an exemplary embodiment not shown, the millimeter wave/terahertz wave imaging device further includes an alarm device connected to the data processing device so that when the first inspected object 31A and/or When there is a suspicious object in the millimeter wave/terahertz wave image of the second inspected object 31B, for example, an alarm is issued below the millimeter wave/terahertz wave image corresponding to the corresponding inspected object, for example, the alarm light lights up. It should be explained. Yes, the alarm method with sound prompt can also be used.
在一个示例性实施例中,数据处理装置可以用于生成控制信号并将控制信号发送给第一驱动装置13和第二驱动装置,以分别驱动Y形反射板1和斩波器8转动。在另一示例性实施例中,成像设备也可以包括与数据处理装置相独立的控制装置。In an exemplary embodiment, the data processing device may be used to generate a control signal and send the control signal to the first driving device 13 and the second driving device to drive the Y-shaped reflective plate 1 and the chopper 8 to rotate respectively. In another exemplary embodiment, the imaging apparatus may also include a control device independent of the data processing device.
图11为根据本公开的又一实施例的毫米波/太赫兹波成像设备的结构示意图。如图11所示,该毫米波/太赫兹波成像设备包括Y形反射板1和一个聚焦透镜4,通过驱动Y形反射板1转动,以使得第一反射板1A的第一反射面、第二反射板1B的第一反射面和第二反射板1C的第一反射面分别对来自被检对象31A位于视场3A不同位置的部分的波束进行反射,从而实现对单视场的成像,Y形反射板1转动一圈能够完成3幅图像的采集。Figure 11 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to yet another embodiment of the present disclosure. As shown in Figure 11, the millimeter wave/terahertz wave imaging device includes a Y-shaped reflective plate 1 and a focusing lens 4. By driving the Y-shaped reflective plate 1 to rotate, the first reflective surface of the first reflective plate 1A, The first reflective surface of the two reflective plates 1B and the first reflective surface of the second reflective plate 1C respectively reflect the beams from the parts of the object 31A located at different positions in the field of view 3A, thereby achieving imaging of a single field of view, Y The reflection plate 1 rotates once to complete the collection of three images.
图12为根据本公开的再一实施例的毫米波/太赫兹波成像设备的结构示意图。如图12所示,该还包括Y形反射板1、聚焦透镜4和第五反射板14,所述第五反射板14绕其中心轴往复摆动,以接收并反射第一被检对象31A自发辐射或反射回来的毫米波/太赫兹波到所述第一工作面上,以经由所述第一工作面的反射后由毫米波/太赫兹波探测器阵列2接收,第五反射板14的摆动周期T1为Y形反射板1的转动周期的2m倍,其中m为大于等于1的整数。在该实施例中,通过驱动第五反射板14绕其中心轴往复摆动,以此来增加对被测对象31水平方向的扫描列数,由于第五反射板14的摆动范围刚好可使被测对象在像平面上所成的像的移动范围为两个相邻探测单元之间的距离,因此当该第五反射板14绕其中心轴往复摆动时,可以将与毫米波/太赫兹波探测器阵列2中的探测单元相邻的像素点先后送入每个探测单元中。Figure 12 is a schematic structural diagram of a millimeter wave/terahertz wave imaging device according to yet another embodiment of the present disclosure. As shown in Figure 12, it also includes a Y-shaped reflection plate 1, a focusing lens 4 and a fifth reflection plate 14. The fifth reflection plate 14 swings back and forth around its central axis to receive and reflect the spontaneous movement of the first subject 31A. The millimeter wave/terahertz wave radiated or reflected back to the first working surface is received by the millimeter wave/terahertz wave detector array 2 after being reflected by the first working surface. The fifth reflection plate 14 The swing period T1 is 2m times the rotation period of the Y-shaped reflecting plate 1, where m is an integer greater than or equal to 1. In this embodiment, the fifth reflective plate 14 is driven to swing back and forth around its central axis to increase the number of scanning columns in the horizontal direction of the object 31 to be measured. Since the swing range of the fifth reflective plate 14 is just enough to allow the object to be measured to be The moving range of the image formed by the object on the image plane is the distance between two adjacent detection units. Therefore, when the fifth reflection plate 14 swings back and forth around its central axis, it can detect millimeter waves/terahertz waves. The pixels adjacent to the detection units in the detector array 2 are sent to each detection unit successively.
在第五反射板14不摆动的情况下,被检对象31A发射或反射的毫米波/太赫兹波经由第五反射板14反射到Y形反射板1上,Y形反射板1绕其转动轴线o进行高速稳定旋转,Y形反射板1中的第一反射板1A、第二反射板1B和第三反射板1C转到第五反射板14后方的波路中时,都会对被检对象31A的竖直列方向完成一维多列快速扫描,然后再经聚焦透镜4的汇聚,形成被检对象31A的像,最终由排列在像平面的毫米波/太赫兹波探测器阵列2接收,被检对象31A上被探测到的列数与毫米波/太赫兹波探测器阵列2中探测单元的数量一致。When the fifth reflective plate 14 does not swing, the millimeter wave/terahertz wave emitted or reflected by the object 31A is reflected to the Y-shaped reflective plate 1 through the fifth reflective plate 14, and the Y-shaped reflective plate 1 rotates around its axis. o Perform high-speed and stable rotation. When the first reflecting plate 1A, the second reflecting plate 1B and the third reflecting plate 1C in the Y-shaped reflecting plate 1 turn into the wave path behind the fifth reflecting plate 14, they will all affect the object 31A being inspected. One-dimensional multi-column rapid scanning is completed in the vertical column direction, and then is converged by the focusing lens 4 to form an image of the object to be inspected 31A, which is finally received by the millimeter wave/terahertz wave detector array 2 arranged in the image plane. The number of detected columns on the object 31A is consistent with the number of detection units in the millimeter wave/terahertz wave detector array 2 .
当第五反射板14绕其中心轴偏转一个角度,则被测对象31A在聚焦透镜4后方的像平面也相应地移动一定角度,毫米波/太赫兹波探测器阵列2中的每一个探测单元就会探测到原来成在它所在位置左方或右方的某列像素点,如果第五反射板14转动的角度合适,则每一个探测单元就可以接收到在第五反射板14转动前任何探测单元所没有接收到的像素点,即原两个相邻探测单元之间的像素点,如图13所示。由此,第五反射板14偏转一定角度就可以在没有增加毫米波/太赫兹波探测器阵列2中探测单元的基础上提高被测对象的扫描列数,即增加了被测对象31A在水平行方向上的像素数,从而可以提高扫描速度,此外由于第五反射板14的摆动角度较小,因而使得系统稳定性比较高。When the fifth reflective plate 14 deflects by an angle around its central axis, the image plane of the object 31A behind the focusing lens 4 also moves by a certain angle accordingly. Each detection unit in the millimeter wave/terahertz wave detector array 2 A certain column of pixels that was originally located to the left or right of its position will be detected. If the fifth reflective plate 14 rotates at an appropriate angle, each detection unit can receive any pixels before the fifth reflective plate 14 rotates. The pixel points not received by the detection unit are the pixel points between the original two adjacent detection units, as shown in Figure 13. Therefore, by deflecting the fifth reflecting plate 14 at a certain angle, the number of scanning columns of the measured object 31A can be increased without adding additional detection units in the millimeter wave/terahertz wave detector array 2, that is, the horizontal scanning column number of the measured object 31A can be increased. The number of pixels in the row direction can be increased, thereby increasing the scanning speed. In addition, since the swing angle of the fifth reflective plate 14 is small, the system stability is relatively high.
在该成像设备启动前,按照要求布置系统中的各器件,使第五反射板14置于其中心轴左侧或右侧最大角度上,Y形反射板1中的第一反射板1A、第二反射板1B和第三反射板1C与第五反射板14的中心轴平行。成像设备启动后,第五反射板14和Y形反射板1同步运动,毫米波/太赫兹波探测器阵列2开始对聚焦透镜4透射的毫米波/太赫兹波进行接收,毫米波/太赫兹波探测器阵列2将毫米波/太赫兹波信号转换为直流电压信号。Before starting the imaging equipment, arrange each device in the system as required so that the fifth reflective plate 14 is placed at the maximum angle to the left or right side of its central axis. The first reflective plate 1A and the third reflective plate 1A in the Y-shaped reflective plate 1 The second reflecting plate 1B and the third reflecting plate 1C are parallel to the central axis of the fifth reflecting plate 14 . After the imaging equipment is started, the fifth reflective plate 14 and the Y-shaped reflective plate 1 move synchronously, and the millimeter wave/terahertz wave detector array 2 begins to receive the millimeter wave/terahertz wave transmitted by the focusing lens 4. The millimeter wave/terahertz wave The wave detector array 2 converts millimeter wave/terahertz wave signals into DC voltage signals.
如图14所示,本公开还提供了一种利用毫米波/太赫兹波成像设备对人体或物品进行检测的方法,包括以下步骤:As shown in Figure 14, the present disclosure also provides a method for detecting human bodies or objects using millimeter wave/terahertz wave imaging equipment, including the following steps:
S1:驱动Y形反射板1转动,以使得第一反射板1A的第一反射面、第二反射板1B的第一反射面和第三反射板1C的第一反射面轮流接收并反射第一被检对象31A自发辐射或反射回来的毫米波/太赫兹波;通过所述第一反射板1A的第二反射面、第二反射板1B的第二反射面和第三反射板1C的第二反射面轮流接收并反射第二被检对象31B自发辐射或反射回来的毫米波/太赫兹波;在Y形反射板1转动的同时,斩波器8绕其中心轴线转动以交替地使来自第一工作面的毫米波/太赫兹波和第四反射板7所反射的来自第二工作面的毫米波/太赫兹波由毫米波/太赫兹波探测器阵列2接收;S1: Drive the Y-shaped reflecting plate 1 to rotate, so that the first reflecting surface of the first reflecting plate 1A, the first reflecting surface of the second reflecting plate 1B and the first reflecting surface of the third reflecting plate 1C take turns to receive and reflect the first The millimeter wave/terahertz wave that the subject 31A radiates spontaneously or reflects back; passes through the second reflective surface of the first reflective plate 1A, the second reflective surface of the second reflective plate 1B and the second reflective surface of the third reflective plate 1C. The reflective surface takes turns to receive and reflect the millimeter/terahertz waves that are spontaneously radiated or reflected back by the second subject 31B; while the Y-shaped reflective plate 1 rotates, the chopper 8 rotates around its central axis to alternately make the waves from the second subject 31B The millimeter wave/terahertz wave from one working surface and the millimeter wave/terahertz wave from the second working surface reflected by the fourth reflecting plate 7 are received by the millimeter wave/terahertz wave detector array 2;
S2:将毫米波/太赫兹波探测器阵列2所获得的对于第一被检对象31A的图像数据和关于第二被检对象31B的图像数据发送给数据处理装置;以及S2: Send the image data about the first subject 31A and the image data about the second subject 31B obtained by the millimeter wave/terahertz wave detector array 2 to the data processing device; and
S3:利用数据处理装置分别对第一被检对象31A的图像数据和第二被检对象31B的图像数据进行重建以生成第一被检对象31A和第二被检对象31B的毫米波/太赫兹波图像。S3: Use the data processing device to reconstruct the image data of the first subject 31A and the image data of the second subject 31B respectively to generate millimeter waves/terahertz of the first subject 31A and the second subject 31B. wave image.
该方法可以同时对两个被检对象31A、31B进行全方位的成像和检测,其中被检对象31可以是人体,也可以是物品。当被检对象31A、31B是人体时,该毫米波/太赫兹波成像设备100可以配合物品成像设备200使用,如图15所示,两个被检对象31A和31B分别在左侧待检位置和右侧待检位置进行检测,或者,也可以当一个被检对象31A在左侧待检位置完成正面检测之后,可以沿着箭头所示的路径行走至到右侧待检位置,并完成背面检测,从而无需被检对象31A转身即可完成全方位的检测。This method can perform all-round imaging and detection of two inspected objects 31A and 31B at the same time, where the inspected object 31 can be a human body or an object. When the objects to be inspected 31A and 31B are human bodies, the millimeter wave/terahertz wave imaging device 100 can be used in conjunction with the object imaging device 200. As shown in Figure 15, the two objects to be inspected 31A and 31B are respectively at the left side to be inspected. and the right side to be inspected, or, after an inspected object 31A completes the front inspection at the left side to be inspected, it can walk along the path shown by the arrow to the right side to be inspected, and complete the back side detection, so that all-round detection can be completed without the need for the subject 31A to turn around.
在一种示例性实施例中,该方法在步骤S3之前还包括以下步骤:当Y形反射板1转动到校准区域时,通过毫米波/太赫兹波探测器阵列2接收关于校准源5的校准数据;并且基于校准源5的校准数据实时更新所接收的第一被检对象31A和第二被检对象31B的图像数据。In an exemplary embodiment, the method further includes the following steps before step S3: when the Y-shaped reflection plate 1 rotates to the calibration area, receive calibration about the calibration source 5 through the millimeter wave/terahertz wave detector array 2 data; and the received image data of the first inspected object 31A and the second inspected object 31B are updated in real time based on the calibration data of the calibration source 5 .
检波的输出电压Vout对应的天线温度为TA,其应满足如下关系,The antenna temperature corresponding to the detected output voltage V out is T A , which should satisfy the following relationship,
TA=(Vout-b)/a (7)T A =(V out -b)/a (7)
式中,a为增益定标系数,In the formula, a is the gain scaling coefficient,
b为偏置定标系数。b is the bias scaling coefficient.
因此,基于校准源5的校准数据更新所接收的被检对象31的图像数据包括对偏置定标系数b的校正和对增益定标系数a的校正。Therefore, updating the received image data of the subject 31 based on the calibration data of the calibration source 5 includes correction of the offset scaling coefficient b and correction of the gain scaling coefficient a.
在校准区域内,校准源5及其周围环境的辐射亮温都可以视作是均匀的,即所有通道的天线温度TA是一致的。当通道完全一致时,焦面阵接收通道的输出Vout应该完全一致,如果输出不一致,则需要调整各通道的增益定标系数a和偏置定标系数b,使所有通道输出一致,从而实现通道的一致性调节。增益定标参数a反映的是通道的总增益和等效带宽,在通道调试时这部分已经经过仔细调节,可以认为各通道的增益定标系数a近似相等,因此在正常使用过程中校正通过调节偏置定标系数b来完成。Within the calibration area, the radiation brightness temperature of the calibration source 5 and its surrounding environment can be regarded as uniform, that is, the antenna temperature TA of all channels is consistent. When the channels are completely consistent, the output V out of the focal plane array receiving channel should be completely consistent. If the outputs are inconsistent, the gain scaling coefficient a and offset scaling coefficient b of each channel need to be adjusted to make the output of all channels consistent, thereby achieving Channel consistency adjustment. The gain scaling parameter a reflects the total gain and equivalent bandwidth of the channel. This part has been carefully adjusted during channel debugging. It can be considered that the gain scaling coefficient a of each channel is approximately equal, so the correction is adjusted during normal use. This is done by offsetting the scaling coefficient b.
在一种示例性实施例中,基于校准源5的校准数据更新所接收的被检对象31的图像数据主要包括对偏置定标系数b的校正,包括以下步骤:In an exemplary embodiment, updating the received image data of the subject 31 based on the calibration data of the calibration source 5 mainly includes the correction of the offset scaling coefficient b, including the following steps:
A1:计算所述毫米波/太赫兹波探测器阵列的所有通道在所述校准区域的多次测量输出电压的平均值 A1: Calculate the average of the multiple measured output voltages of all channels of the millimeter wave/terahertz wave detector array in the calibration area
A2:每个通道的检测区域校准后的数据为每个通道的检测区域采集的数据Vi减去所述平均值然后再除以每个通道的增益定标系数ai。A2: The calibrated data of the detection area of each channel is the data V i collected in the detection area of each channel minus the average value Then divide by the gain scaling coefficient a i of each channel.
该方法可以对焦平面阵系统接收通道阵列进行整体校准,校准算法只需简单的运算,耗时极少,可以实现实时校准;对每幅图像都进行通道一致性校准。This method can perform overall calibration on the receiving channel array of the focal plane array system. The calibration algorithm only requires simple calculations, takes very little time, and can achieve real-time calibration; channel consistency calibration is performed on each image.
当设备在长期运行或者更换使用场所等情况下,由于系统温度漂移而带来的系统性能恶化,各通道的增益定标系数a通常也会发生变化。这时需要对通道的增益定标系数a和偏置定标系数b进行调整,具体包括以下步骤When the equipment is operated for a long time or the place of use is changed, the system performance deteriorates due to system temperature drift, and the gain scaling coefficient a of each channel usually changes. At this time, it is necessary to adjust the gain scaling coefficient a and offset scaling coefficient b of the channel, including the following steps:
B1:使用所述毫米波/太赫兹波探测器阵列测量空气的电压值Vair(i),i∈[1,通道数],并计算所有通道的空气的平均电压值 B1: Use the millimeter wave/terahertz wave detector array to measure the voltage value V air (i) of the air, i∈[1, number of channels], and calculate the average voltage value of the air in all channels
B2:设置所述校准源的温度与空气的温度具有差值,使用所述毫米波/太赫兹波探测器阵列测量所述校准源的电压值Vcal(i),i∈[1,通道数],并计算所有通道的校准源的平均电压值并通过下列等式计算出每个通道的增益定标系数ai和偏置定标系数bi:B2: Set the temperature of the calibration source to have a difference with the temperature of the air, and use the millimeter wave/terahertz wave detector array to measure the voltage value V cal (i) of the calibration source, i∈[1, number of channels ], and calculate the average voltage value of the calibration source for all channels And calculate the gain scaling coefficient a i and offset scaling coefficient b i of each channel through the following equations:
B3:每个通道的检测区域校准后的数据为的绝对值,其中Vi为每个通道的检测区域采集的数据。B3: The calibrated data of the detection area of each channel is The absolute value of , where Vi is the data collected in the detection area of each channel.
数据处理装置每个3dB波束方位内采集两次,这样在图1所示的实施例中,每个通道在校准区域获得至少10个采集数据。在校准区域的输出电压数据与检测区域的输出电压数据均存储在数据处理装置的同一个数据表格中。The data processing device collects twice in each 3dB beam direction, so that in the embodiment shown in Figure 1, each channel obtains at least 10 collected data in the calibration area. The output voltage data in the calibration area and the output voltage data in the detection area are stored in the same data table of the data processing device.
作为一个示例性实施例,该方法还可以包括S4:在生成第一被检对象31A和第二被检对象31B的毫米波/太赫兹波图像之后,对第一被检对象31A和第二被检对象31B是否带有可疑物以及可疑物的位置进行识别并将结果输出。As an exemplary embodiment, the method may further include S4: after generating millimeter wave/terahertz wave images of the first subject 31A and the second subject 31B, It identifies whether the inspection object 31B contains suspicious objects and the location of the suspicious objects, and outputs the results.
在上述步骤中,对于可疑物及其位置的识别可以通过计算机自动识别或是人工识别或是两者相结合的方法来进行。结果输出可以通过例如在显示装置上显示标有直接显示是否带有可疑物的结论等方式来实现,电可以将检测结果直接打印或发送。In the above steps, the identification of suspicious objects and their locations can be carried out through automatic computer identification or manual identification or a combination of both. The result output can be realized by, for example, displaying a mark on the display device to directly indicate whether there is a conclusion containing suspicious objects. The detection result can be directly printed or sent.
执行检测的安检人员可以根据上述步骤S4给出的检测结果来对人体或物品是否带有可疑物以及可疑物的位置进行确认,也可以通过人工检测来进行复核。The security personnel who perform the detection can confirm whether the human body or object contains suspicious objects and the location of the suspicious objects based on the detection results given in step S4 above, or they can conduct a review through manual inspection.
本领域的技术人员可以理解,上面所描述的实施例都是示例性的,并且本领域的技术人员可以对其进行改进,各种实施例中所描述的结构在不发生结构或者原理方面的冲突的情况下可以进行自由组合。Those skilled in the art can understand that the above-described embodiments are exemplary and can be improved by those skilled in the art. The structures described in the various embodiments do not conflict in structure or principle. can be freely combined.
在详细说明本公开的较佳实施例之后,熟悉本领域的技术人员可清楚的了解,在不脱离随附权利要求的保护范围与精神下可进行各种变化与改变,且本公开亦不受限于说明书中所举示例性实施例的实施方式。After describing the preferred embodiments of the present disclosure in detail, those skilled in the art can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the appended claims, and the present disclosure is not limited to Implementations limited to the exemplary embodiments set forth in the specification.
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| PCT/CN2019/110406 WO2020134336A1 (en) | 2018-12-29 | 2019-10-10 | Millimeter-wave/terahertz-wave imaging apparatus, and inspection method for body or object |
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| JP7508208B2 (en) * | 2019-09-20 | 2024-07-01 | キヤノン株式会社 | Image capture device, image capture device control method, and program |
| CN113008907B (en) | 2019-12-19 | 2024-04-12 | 华为技术有限公司 | Terahertz sensing system and terahertz sensing array |
| CN113131224B (en) * | 2020-01-16 | 2022-08-19 | 华为技术有限公司 | Antenna beam propagation direction adjustment system |
| CN113009588B (en) * | 2021-03-01 | 2023-05-02 | 杭州睿影科技有限公司 | Human body security inspection equipment based on millimeter wave imaging |
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