CN109714685A - Wafer speaker - Google Patents
Wafer speaker Download PDFInfo
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- CN109714685A CN109714685A CN201711020150.9A CN201711020150A CN109714685A CN 109714685 A CN109714685 A CN 109714685A CN 201711020150 A CN201711020150 A CN 201711020150A CN 109714685 A CN109714685 A CN 109714685A
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- film substrate
- film
- thin
- conductive
- speaker
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The present invention relates to a kind of wafer speakers, and including a film substrate, two conductive layers, two ring-shaped conductors, two conductive components, which has a working region；Two conductive layers at least cover upper side and downside in the film substrate working region；Two ring-shaped conductors are respectively arranged at the opposite two sides of the film substrate, and fit in the edge that two conductive layers are located at working region periphery；Two conductive components are respectively provided with annular solid corresponding with two ring-shaped conductors, and covering is contacted with one side of two ring-shaped conductors relative to the film substrate；Two conductive components are connected with the two poles of the earth of sound source signal output respectively, and the sound source signal that the sound source signal is exported is transmitted to two conductive layers by two conductive components and two ring-shaped conductors.
Description
Technical field
The present invention relates to a kind of wafer speakers more particularly to one kind to be used in audio device or electronic product to defeated
The wafer speaker of voice signal out.
Background technique
With the epoch progress and consumer for portability demand, make consumer electrical product increasingly towards light, thin and
Miniaturization, therefore be used in every spare part on electronic product and also develop both facing to micromation, thin type direction.
For the electronic product of the types such as mobile phone, body-worn device, digital assistants, loudspeaker be responsible for so that
Electronic signal can be converted to the function of voice signal by electronic product, therefore be one of spare part important in electronic product.One
As loudspeaker according to operation principles can be divided mainly into moving-coil type (Dynamic), electrostatic (Electrostatic) and piezoelectric type
(Piezoelectric), wherein coil-moving speaker is the type that is most widely used, but this kind of coil-moving speaker at present
Structure needs be made of permanent magnet, coil and speaker, therefore keep its bulky, and be not easy thin type, therefore apply light
It will cause the volume and the increased situation of thickness of electronic device on thin short and small portable electronic or wearing electronic device, and in face of electricity
The designer trends of the micro- shape of sub- product and thin type make coil-moving speaker be easy to be kept within bounds by volume and can not have further hair
Exhibition.
The action principle of conventional electrostatic formula loudspeaker is that the fixed plate electrode clamping conductive diaphragm of two panels aperture is formed one
Kind capacitor, by supplying vibrating diaphragm Dc bias and giving the alternating voltage of two fixed electrode audios, according to Coulomb's law
(Coulomb rule) is moved forward and backward conductive diaphragm under electrostatic force acts synergistically, and vibrates hair with audio signal source
Sound, but electrostatic loudspeaker is needed with high voltage drive, it is therefore desirable to and the enlarger of external high unit price and bulkiness causes it
It can not popularize.
Piezo-electric loudspeaker is the piezoelectric effect using piezoelectric material, when additional electric field material caused by piezoelectric material
The characteristic of deformation is expected, for pushing vibration film sounding.Its structure of piezo-electric loudspeaker is simple and is not required to external voice box, therefore can be solid
Due in limited space, for the first choice for developing miniature electronics applications.However, existing piezo-electric loudspeaker majority knot
Structure vibrating diaphragm and piezoelectric element are two different components, and piezoelectric element is relatively slight relative to the area of vibrating diaphragm, therefore can not
Biggish amplitude of vibration is formed, therefore it is bad to result in phonation efficiency, and be only capable of obtaining superior performance in high audio range, for low
The performance efficiency of audio is bad and distortion rate is high.
Meanwhile although existing piezo-electric loudspeaker uses film for pronunciation component, it is since it is desired that additional setting
Conductive structure to connect driving circuit and piezoelectric element and the fixed frame to support vibrating diaphragm, therefore cause its construction
Still considerably complicated, and the shortcomings that cause manufacturing cost to rise.
Due to above, various inconvenience in existing piezoelectric type wafer speaker use are caused, therefore how to pass through knot
Structure improvement, to solve the problems, such as aforementioned items, it has also become those skilled in the art's one of important topic to be solved.
Summary of the invention
The purpose of the present invention is to provide a kind of wafer speakers, to solve the above problems.
The embodiment of the present invention provides a kind of wafer speaker, including a film substrate, two conductive layers, two ring-types
Conductor, two conductive components.Film substrate has opposite upper side and downside, and the upper side of the film substrate and downside
Face is able to define a working region；Two conductive layers are respectively arranged on the upper side and downside of the film substrate,
And at least cover the upper side and the downside that the film substrate is located in the working region；Two ring-shaped conductors are respectively set
In the opposite two sides of the film substrate；Two ring-shaped conductors opposite to each other and respectively around the edge of the working region,
And the edge that two conductive layers are located at working region periphery is fitted in respectively；Two conductive components are respectively arranged at two should
One side of the ring-shaped conductor relative to the film substrate, two conductive components are in annular corresponding with two ring-shaped conductors
Body, and covering is contacted with one side of two ring-shaped conductors relative to the film substrate；Two conductive components are respectively with one
Sound source signal output the two poles of the earth connection, and enable the sound source signal export sound source signal by two conductive components with
And two ring-shaped conductors are transmitted to two conductive layers.
One embodiment of the present invention, wherein the film substrate is polyvinylidene fluoride (PVDF) film.
One embodiment of the present invention, the two of them conductive layer are metallic film or metal-oxide film.
One embodiment of the present invention, the two of them ring-shaped conductor are conducting resinl or are to be set to two with plating mode
The metal conductor layer of the conductive layer surface.
One embodiment of the present invention, wherein further comprising a frame structure, which is set to the film base
Material is located at the position at the working region edge, so that the film substrate forms flat state in the range of the working region.
One embodiment of the present invention, wherein the frame structure includes: a lower frame body and a upper frame body, and the upper frame body is under
Framework is oppositely disposed upper side and downside in the film substrate working region marginal position, and relatively clamping is thin in this
The upper side of film base material and downside, so as to fixing the film substrate.
One embodiment of the present invention, wherein the lower frame body has a top surface, the top surface towards the side of the film substrate
Center has a card slot, which has a bottom surface towards the side of the film substrate, which has one and the card slot pair
The snap flange answered, when opposite with the lower frame body clamping of the upper frame body, which can be sticked in the card slot, and should
Film substrate corresponds to the extruding of the material at the snap flange and the groove position and snaps into the card slot, and makes the film substrate
Concaveconvex shape corresponding with the snap flange and card slot is formed corresponding to the material at snap flange and the groove position.
One embodiment of the present invention, wherein the film substrate can be attached at a plate body surface, be made by the plate body
The film substrate forms flat state.
One embodiment of the present invention, wherein the film substrate in be arranged within the scope of the working region at least one perforation.
One embodiment of the present invention, wherein the shape of the working region is selected from: circle, rectangle, triangle, ellipse,
One of polygon or combinations thereof.
The beneficial effects of the invention are that the structure of wafer speaker can be simplified, and promote its phonation efficiency, and simplifies group
Program is filled, cost is reduced.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however appended attached drawing is only for reference and description, and is not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of wafer speaker first embodiment of the present invention.
Fig. 2 is the D structure schematic diagram of wafer speaker first embodiment of the present invention.
Fig. 3 to Fig. 6 is the flat of a variety of alternate embodiments of film substrate that wafer speaker first embodiment of the present invention uses
Surface construction schematic diagram.
Fig. 7 is the combination profile construction schematic diagram of wafer speaker second embodiment of the present invention.
Fig. 8 is the vertical view organigram of wafer speaker second embodiment of the present invention.
Fig. 9 is the stereo decomposing organigram of wafer speaker second embodiment of the present invention.
Figure 10 is the profile construction schematic diagram of wafer speaker 3rd embodiment of the present invention.
Figure 11 is the D structure schematic diagram for the film substrate that wafer speaker fourth embodiment of the present invention uses.
Figure 12 is the three-dimensional structure for another alternate embodiment of film substrate that wafer speaker fourth embodiment of the present invention uses
Make schematic diagram.
Specific embodiment
(first embodiment)
As shown in Figures 1 and 2, the present invention provides a kind of wafer speaker 1, the structure packet of wafer speaker 1 of the invention
Include: a film substrate 10, the film substrate 10 by macromolecule polymeric material at film or plate, the film substrate 10 it is upper
Lower two sides are respectively provided with an opposite upper side and downside；Two conductive layers 20, two conductive layers 20 are made of an electrically conducting material,
And it is respectively arranged on the upper side and downside of the film substrate 10.
The thickness preferably for the film substrate 10 that wafer speaker 1 of the invention is selected is less than 0.3mm or less.Film base
The region of part of the material 10 to make a sound is defined as a working region 11, and two conductive layers 20 are at least covered in the film base
Material 10 is located at upper side and downside in 11 range of working region.The film substrate 10 preferably selects polyvinylidene fluoride
Material or other can generate film or plate made of the polymeric material of piezoelectric effect.
Two conductive layers 20 be at least covered in upper surface 101 that the film substrate 10 is located in 11 range of working region with
Lower surface 102.Two conductive layers 20 of the invention can be selected from metal material, such as: copper (Cu), silver (Ag), chromium (Cr), nickel
(Ni), the metal materials such as titanium (Ti) or conductive metal oxide (Metal Oxide) film, such as: nitridation
Titanium (TiN), tin indium oxide (ITO) film etc..Two conductive layers 20 can by vapor deposition, sputter, be electroplated or be the side such as coating
Formula is set to the surface of the film substrate 10.
The film substrate 10 is located at the upper side at 11 edge of working region and downside is also further arranged two ring-types and leads
Body 30, two ring-shaped conductors 30 opposite to each other and respectively around the edge of the working region 11, and respectively with two conductive layers
20 are located at the edge connection of 11 periphery of working region.Two ring-shaped conductors 30 of the invention can be selected as conducting resinl, either
It uses made by the metallic conductor being set on 20 surface of conductive layer in a manner of being electroplated or being coated with etc..
Two conductive components 40 are further arranged in the lateral surface of two ring-shaped conductors 30, and the ontology of two conductive components 40 is
It is greater than or equal to two rings with the width of two corresponding annular solids of ring-shaped conductor 30, two 40 ontology ring parts of conductive component
The width of shape conductor 30, therefore the one side for being contacted with two ring-shaped conductors 30 relative to the film substrate 10 can be covered.And
Two conductive components 40 are connected with two output electrodes of sound source signal output 50 respectively, and the sound source signal is made to export 50
Sound source signal can be transmitted to two ring-shaped conductors 30 by two conductive components 40, and further pass through two ring-shaped conductors
It is transmitted to two conductive layers 20.
As shown in Fig. 2, can there is two conductive components 40 for flexible circuit board or electroplating surface in the embodiment
Electric conductor made by the high molecular polymer of conductor, such as: electroplating surface has the polyethylene terephthalate of metal layer
(PET).And at least a side of the ring body of two conductive components 40 further extends an interconnecting piece 41, and in interconnecting piece 41
End has a contact portion 42, to connect with the output electrode of sound source signal output device.
The present invention is since the film substrate 10 selects the polymeric material that can generate piezoelectric effect to be made, and two conductions
Layer 20 is covered each by the both side surface of the working region of the film substrate 10 11, therefore when the potential conduction of sound source signal to two
After a conductive layer 20, two conductive layers 20 is enabled to generate electric field, so that film substrate 10 generates inverse piezoelectric effect, because
This makes the working region of film substrate 10 generate vibration, so as to sound source signal to be converted to the output of sound.
It as shown in Figures 3 to 6, is more than a kind of change mode of wafer speaker of first embodiment of the invention.Using this
Wafer speaker 1 made of inventive technique, the working region 11 on film substrate 10 can be planned to various different geometries,
And conductive layer 20 and ring-shaped conductor 30 also can according to working region 11 change in shape and change.As shown in Figures 3 and 4, divide
Not in the working region 11 for cooking up round and rectangle on film substrate 10, and conductive layer 20 and ring-shaped conductor 30 are also according to work
The shape in region 11 and rounded and rectangle.Embodiment as also shown in fig. 5, cook up on film substrate 10 two it is of different shapes
Working region 11a and working region 11b, and the surface and periphery of working region 11a and working region 11b are respectively arranged with and lead
Electric layer 20 and ring-shaped conductor 30.The working region 11 of embodiment as also shown in fig. 6,10 surface of film substrate setting is presented by more
The region for the compound shape that a rectangle is composed, and conductive layer 20 and ring-shaped conductor 30 are also designed to and the working region 11 is matched
The shape of conjunction.
Certainly, the shape for the working region 11 being arranged on film substrate 10 of the invention is not limited to the above embodiments disclosed
Range, the shape of the working region 11 can be selected from one of circle, rectangle, triangle, ellipse, polygon, or
Person is the compound shape being combined by various different geometries.
The embodiment as disclosed in Fig. 3 to Fig. 6, it can be appreciated that wafer speaker 1 of the invention can pass through patterning techniques
The working region 11 of planning setting any shape on film substrate 10, and the quantity of working region 11 is also not necessarily limited to one,
So that there are many present invention a possibility that different application mode, such as: multiple receiving are set on same film substrate 10
The working region 11 of different sources of sound input, or cook up on film substrate 10 for different acoustic characteristics can be generated
Working region (such as: the working region 11 of high audio and bass is respectively set on same film substrate 10), therefore make
Increasing with elasticity for wafer speaker 1 of the invention is obtained, is also easier to adjust out more outstanding sound quality.
(second embodiment)
As shown in Figure 7 to 9, second embodiment of the invention further comprises a frame structure 60, to support film base
Material 10 is so that form flat state to less than the film substrate 10 in 11 range of working region.In the embodiment, the framework knot
Structure 60 is set to the marginal position of the working region 11 of the film substrate 10, which includes: a lower frame body 62 and one
Upper frame body 61, the upper frame body 61 and lower frame body 62 are oppositely disposed in the upside of 10 working region of the film substrate, 11 marginal position
Face and downside, and relatively clamping is in the two sides of film substrate 10.The upper frame body 61 is also held on respectively with lower frame body 62
The lateral surface of the ring-shaped conductor 30 and two conductive components 40, to by ring-shaped conductor 30 and two 40 compressive contacts of conductive component
In the lateral surface of two conductive layers 20, to improve the stability of signal transduction.
In the embodiment, the lower frame body of frame structure 60 has a top surface towards the side of the film substrate, in the top surface
Centre has a cricoid card slot 621, while the upper frame body 61 has a bottom surface, bottom surface tool towards the side of the film substrate 10
There are the mutual corresponding snap flange 611 of card slot 621 of one He the lower frame body, the upper frame body 61 and the lower frame body 62 with respect to clamping
When, which can be sticked in the card slot 621, and the film substrate 10 is corresponded to the snap flange 611 and the card
Material extruding at 621 position of slot snaps into the card slot 621.
As shown in Fig. 7 and Fig. 9, since card slot 621 and snap flange 611 are respectively perpendicular to the surface of the film substrate 10,
Therefore when the material of 10 marginal position of film substrate is driven by snap flange 611 and snaps onto card slot 621, it will so that
The material that the film substrate 10 corresponds at snap flange 611 and 621 position of card slot is formed and the snap flange 611 and card slot
621 corresponding concaveconvex shapes, and film substrate 10 is driven to be located at the material of 11 marginal position of working region by Vertical Square
To pulling force and make so that film substrate 10 is located at the strain that the material in 11 range of working region generates horizontal direction
The material of film substrate 10 generates tensile stress.
Second embodiment of the invention enables to film substrate 10 to form the structural body of a plane by above structure, with
So that film substrate 10 is readily able to be mounted on other electronic products.Simultaneously, additionally it is possible to pass through the snap flange 611
And the card slot 621 makes film substrate 10 be located at the material deformation of 11 marginal position of working region, while to working region
Film substrate 10 in 11 ranges generates one and upholds pulling force, and the film substrate 10 in working region 11 is made to generate tensile stress,
And form tight state.
Second embodiment of the invention can also further pass through the snap flange 611 and card slot 621 of change frame structure 60
Shape so that film substrate 10 generates different degrees of strain, and reach adjustment or change film substrate 10 and be located at workspace
Material in 11 range of domain bears the size of tensile stress, to achieve the purpose that adjust sound quality.
(3rd embodiment)
As shown in Figure 10, third embodiment of the invention is that the film substrate 10 is further attached on a plate body 70, is led to
Crossing the plate body 70 makes the film substrate 10 form formation state.The embodiment can make film of the invention by plate body 70
Loudspeaker 1 forms flat structural body, therefore allows to be easily installed and be fixed on other electronic products.
(fourth embodiment)
As shown in FIG. 11 and 12, the wafer speaker 1 of fourth embodiment of the invention is in the workspace of film substrate 10
One perforation 12 is further set in domain 11.In the embodiment, 12 size and shape of perforating can change according to actual demand
Become, such as shown in Figure 11, the perforation 12 is rounded, and embodiment illustrated in fig. 12, perforation 12 is then in rectangle.
Fourth embodiment, can be for change wafer speaker generation in the purpose of setting perforation 12 on film substrate 10
Audio or sound quality, perforation 12 can also be designed to accommodate to the space of other electronic building bricks.
(invention beneficial effect)
The beneficial effect of wafer speaker of the present invention is mainly as follows:
1, the sandwich-like knot that 1 main body of wafer speaker of the present invention is combined by film substrate 10 and two conductive layers 20
Structure, therefore its simple structure, and the film substrate 10 being located in 11 range of working region is the vibrating diaphragm that can generate vibration, because
This improves the efficiency of its sound output.
2, wafer speaker 1 of the present invention is used as using ring-shaped conductor 30 and the conductive component 40 of annular and transmits sound source signal
To the conductor structure of two conductive layers 20, so that the voltage of sound source signal can be stably transmitted to entire conductive layer 20,
And it only needs that ring-shaped conductor 30 and the conductive component 40 of annular is just enabled to be incorporated in a manner of being bonded or crimp when assembling
On the surface of conductive layer 20, therefore its manufacture assembly program is made to become comparatively simple.
The foregoing is merely preferable possible embodiments of the invention, non-therefore limitation the scope of the patents of the invention, therefore all fortune
The equivalence techniques variation made of description of the invention and accompanying drawing content, is both contained in protection scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711020150.9A CN109714685A (en) | 2017-10-26 | 2017-10-26 | Wafer speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711020150.9A CN109714685A (en) | 2017-10-26 | 2017-10-26 | Wafer speaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109714685A true CN109714685A (en) | 2019-05-03 |
Family
ID=66252883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711020150.9A Pending CN109714685A (en) | 2017-10-26 | 2017-10-26 | Wafer speaker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109714685A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399294A (en) * | 2019-08-16 | 2021-02-23 | 华一声学股份有限公司 | Headphone sound module |
| CN112748815A (en) * | 2019-10-30 | 2021-05-04 | 华一声学股份有限公司 | Flexible electronic assembly with film sounding assembly and electronic device thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2653352B2 (en) * | 1995-06-06 | 1997-09-17 | 松下電器産業株式会社 | Ultrasound diagnostic equipment |
| CN2930176Y (en) * | 2005-08-24 | 2007-08-01 | 梦想音速技术有限公司 | Contact structure of film speaker |
| CN101617544A (en) * | 2007-03-15 | 2009-12-30 | 拓普纳诺斯株式会社 | Film speaker |
| CN101754074A (en) * | 2008-12-03 | 2010-06-23 | 朱斯忠 | Bass solution without sound box |
| CN101931850A (en) * | 2008-12-31 | 2010-12-29 | 财团法人工业技术研究院 | Microspeaker and its manufacturing method |
| CN105246010A (en) * | 2015-11-02 | 2016-01-13 | 李崇 | Film speaker having low sound improving effect |
-
2017
- 2017-10-26 CN CN201711020150.9A patent/CN109714685A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2653352B2 (en) * | 1995-06-06 | 1997-09-17 | 松下電器産業株式会社 | Ultrasound diagnostic equipment |
| CN2930176Y (en) * | 2005-08-24 | 2007-08-01 | 梦想音速技术有限公司 | Contact structure of film speaker |
| CN101617544A (en) * | 2007-03-15 | 2009-12-30 | 拓普纳诺斯株式会社 | Film speaker |
| CN101754074A (en) * | 2008-12-03 | 2010-06-23 | 朱斯忠 | Bass solution without sound box |
| CN101931850A (en) * | 2008-12-31 | 2010-12-29 | 财团法人工业技术研究院 | Microspeaker and its manufacturing method |
| CN105246010A (en) * | 2015-11-02 | 2016-01-13 | 李崇 | Film speaker having low sound improving effect |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399294A (en) * | 2019-08-16 | 2021-02-23 | 华一声学股份有限公司 | Headphone sound module |
| CN112748815A (en) * | 2019-10-30 | 2021-05-04 | 华一声学股份有限公司 | Flexible electronic assembly with film sounding assembly and electronic device thereof |
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Application publication date: 20190503 |