CN109754055B - High temperature resistant label of silica gel encapsulation - Google Patents
High temperature resistant label of silica gel encapsulation Download PDFInfo
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- CN109754055B CN109754055B CN201811651333.5A CN201811651333A CN109754055B CN 109754055 B CN109754055 B CN 109754055B CN 201811651333 A CN201811651333 A CN 201811651333A CN 109754055 B CN109754055 B CN 109754055B
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- antenna
- metal sheet
- silica gel
- temperature resistant
- high temperature
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 74
- 239000000741 silica gel Substances 0.000 title claims description 70
- 229910002027 silica gel Inorganic materials 0.000 title claims description 70
- 229910052751 metal Inorganic materials 0.000 claims abstract description 63
- 239000002184 metal Substances 0.000 claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 25
- 238000004806 packaging method and process Methods 0.000 claims description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 230000002146 bilateral effect Effects 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 11
- 238000004891 communication Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013523 data management Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- Details Of Aerials (AREA)
Abstract
本发明公开了一种硅胶封装的耐高温标签，包括：天线、射频芯片封装模块和硅胶包封体构成，天线由上下两片平行设置的金属薄片构成，上下薄片之间至少有一个和薄片垂直设置的导电连接器；射频芯片封装模块设置在天线的一个金属薄片上，模块的电极和金属薄片上的连接点形成可靠的电气连接。硅胶包封体是由硅胶材料经过射出形成的包封体。本方案提供的硅胶封装的耐高温标签耐高温性能优越，能够满足实际工况的需求。
The present invention discloses a silicone-encapsulated high-temperature resistant label, comprising: an antenna, a radio frequency chip encapsulation module and a silicone encapsulation body. The antenna is composed of two upper and lower metal sheets arranged in parallel, and there is at least one conductive connector arranged perpendicular to the sheets between the upper and lower sheets; the radio frequency chip encapsulation module is arranged on a metal sheet of the antenna, and the electrodes of the module and the connection points on the metal sheet form a reliable electrical connection. The silicone encapsulation body is an encapsulation body formed by injection of silicone material. The silicone-encapsulated high-temperature resistant label provided by this solution has excellent high-temperature resistance and can meet the needs of actual working conditions.
Description
Technical Field
The invention relates to the field of electronic tags, in particular to a high-temperature-resistant tag packaged by silica gel.
Background
With the development of the internet of things technology, the RFID industry as a base thereof will meet a new opportunity and challenge. In view of the current industry situation, the relevant market for RFID will expand further, and more traditional industries will place demands on RFID products.
The communication frequencies of the intelligent labels are distinguished, and the intelligent labels mainly comprise low-frequency intelligent labels, high-frequency intelligent labels and ultrahigh-frequency intelligent labels. For example, the public transport all-purpose card is essentially a 13.56MHz electronic tag, only realizes the function of paying the traffic cost in the transportation link, is convenient and quick, is simple to use, is accepted by the vast users, and is also the most widely used application in the RFID field at present. For example, the RFID logistics label in the logistics storage field is a 915MHz single-frequency intelligent label, so that the identification and data management of medium-distance article circulation are realized, the RFID logistics label is widely used in the logistics storage field, and the working efficiency of logistics storage is greatly improved.
The intelligent tag with different frequency characteristics has very different physical characteristics, such as an ultrahigh frequency intelligent tag, has a communication distance of generally more than a few meters and more than ten meters, has a communication protocol for quick data exchange and excellent anti-collision performance, and is suitable for long-distance multi-tag application. The communication distance of the high-frequency intelligent tag is generally from a few centimeters to tens of centimeters, and the anti-collision performance is poor, so that the method is suitable for short-distance few-tag application. However, the chip of the high-frequency tag generally has better security, so that the chip is suitable for being applied to the financial field.
In some special cases, a special shaped tag or a special performance tag is required to achieve the corresponding function. If the high temperature resistant label can normally work in an environment with the temperature of more than 200 ℃ and even reach the environment temperature of more than 300 ℃, the use requirement of high temperature resistance cannot be met if the traditional electronic label packaging technology is adopted.
The existing high-temperature-resistant labels are poor in reliability and poor in high-temperature resistance in actual use process, and cannot meet the requirements of actual working conditions.
Therefore, it is a problem to be solved in the art to provide a high-temperature-resistant electronic tag with high reliability and excellent high-temperature resistance.
Disclosure of Invention
Aiming at the problems that the existing high-temperature-resistant label has poor high-temperature resistance and cannot meet the requirements of actual working conditions, a high-temperature-resistant label scheme with high reliability and excellent high-temperature resistance is needed.
Therefore, the invention aims to provide the high-temperature-resistant label packaged by the silica gel, and simultaneously provides a corresponding assembly process for the electronic label.
In order to achieve the above object, the high temperature resistant label of the present invention for a silicone package includes:
The antenna is composed of an upper metal sheet and a lower metal sheet which are arranged in parallel, a hollowed-out pattern is formed on the metal sheet, and the upper metal sheet and the lower metal sheet are connected through at least one conductive connector;
the radio frequency chip packaging module is provided with at least two electrodes and is arranged on an upper metal sheet or a lower metal sheet in the antenna, and the electrodes on the radio frequency chip packaging module and the connection points on the metal sheets form reliable electrical connection;
The antenna comprises a silica gel medium, a conductive connector and a conductive antenna, wherein the silica gel medium is a sheet-shaped supporting body made of silica gel material and is integrally arranged in the antenna, the upper metal sheet and the lower metal sheet of the antenna are attached to two parallel planes of the silica gel medium, and the conductive connector penetrates through the silica gel medium to connect the upper metal sheet and the lower metal sheet;
The silica gel encapsulation body encapsulates the antenna, the radio frequency chip encapsulation module and the silica gel medium to form a closed shape.
Further, the metal sheet of the antenna is one of copper, aluminum, iron and alloy materials, and the thickness of the metal sheet is 1 um-1000 um.
Further, the upper metal sheet and the lower metal sheet of the antenna are independently arranged, and are connected and conducted through the conductive column
Furthermore, the upper metal sheet and the lower metal sheet of the antenna are of an integrated structure, and the upper metal sheet and the lower metal sheet are connected and conducted through a connecting belt integrally formed on the upper metal sheet and the lower metal sheet.
Furthermore, the electrode on the radio frequency chip packaging module and the connecting point on the metal sheet are reliably and electrically connected through one welding mode of laser welding, ultrasonic welding, high-temperature-resistant soldering or arc welding.
Further, the thickness of the silica gel medium is 1 mm-10 mm.
Furthermore, the antenna and the silica gel medium are bonded by adopting a high-temperature-resistant adhesive, and the main component of the adhesive is one of organic silicon or epoxy resin.
Furthermore, the silica gel encapsulation body is formed by injection molding of a silica gel material.
The high-temperature-resistant label of the silica gel package provided by the scheme is excellent in high-temperature resistance, can meet the requirements of actual working conditions, and is high in reliability.
Drawings
The invention is further described below with reference to the drawings and the detailed description.
FIG. 1 is a schematic plan view of a high temperature resistant label encapsulated by silica gel in example 1 of the present invention;
FIG. 2 is an assembled side view of the high temperature resistant label of the silicone package of example 1 of the present invention;
FIG. 3 is a schematic diagram of a radio frequency package module according to example 1 of the present invention;
fig. 4 is a schematic diagram showing the structure of an antenna with separated upper and lower sheets according to example 1 of the present invention;
FIG. 5 is an assembled side view of a high temperature resistant label encapsulated in silica gel in example 2 of the present invention;
fig. 6 is a schematic diagram of an integrated antenna structure with upper and lower sheets in example 2 of the present invention.
Detailed Description
The invention is further described with reference to the following detailed drawings in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the implementation of the invention easy to understand.
Example 1
Referring to fig. 1 and 2, the structure of the silica gel-encapsulated high temperature resistant tag given in this example is shown.
The figure shows that the silica gel packaging high temperature resistant label is composed of a main silica gel medium 1, a radio frequency module 3, an upper antenna 2, a lower antenna 4, a connecting terminal 5 and a silica gel packaging body 6.
Wherein, the upper antenna 2 and the lower antenna 4 are respectively formed by metal sheets with hollowed patterns, and the upper antenna 2 and the lower antenna 4 are arranged in parallel and are connected and conducted through a connecting terminal 5 serving as a conductive connector, thereby forming an antenna body in the whole tag. Preferably, the connection terminal 5 is vertically disposed between the upper antenna 2 and the lower antenna 4 disposed in parallel.
The radio frequency module 3 in the present tag has at least two electrodes, while the module is arranged on one foil of the antenna, i.e. on the upper antenna 2 or the lower antenna 4. The connection points on the electrodes and the foil of the module form a reliable electrical connection.
The silica gel medium 1 is used for supporting an upper antenna 2 and a lower antenna 4 which are arranged in parallel, the silica gel medium 1 is a sheet-shaped supporting body formed by silica gel materials, an upper metal sheet and a lower metal sheet of the antenna are attached to two parallel planes of the silica gel medium, and a connecting terminal 5 penetrates through the medium to connect the upper metal sheet and the lower metal sheet.
And the silica gel encapsulation body 6 is formed by injecting silica gel material, encapsulates the antenna, the radio frequency chip encapsulation module and the silica gel medium to form a closed shape, and protects the whole tag.
Referring to fig. 3, in a specific implementation, the radio frequency module 3 in the electronic tag is a molded chip package body, and is formed by processing a radio frequency chip by high-reliability molded package, two electrodes 32 and 33 suitable for electrical connection are led out from two sides of the molded package body 31, and the radio frequency chip adopted in this embodiment is H3 of ALIEN company.
As shown in fig. 2, the rf module 3 having such a structure is disposed on the surface of the upper antenna 2 near the medium 1, and the welding positions are referred to as two ends of the welding terminal 21 of the upper antenna 2 in fig. 1, and a reliable electrical connection is formed between the module pins and the connection points on the antenna by using one welding process of laser welding, ultrasonic welding, high temperature resistant soldering or arc welding.
Referring to fig. 4, the antenna in the present electronic tag is composed of two mutually independent upper and lower antennas 2 and 4. The upper antenna 2 and the lower antenna 4 are both formed by metal sheets with hollowed-out patterns. The metal sheet is one of copper, aluminum, iron and alloy materials, and the thickness of the metal sheet is preferably 1 um-1000 um.
The upper antenna 2 is an electrode of a polarized antenna, and the lower antenna is a reflecting plate, so that the metal resistance function is realized. A ring-shaped resonant ring 22 and a welding terminal 21 are provided at a proper position of the upper antenna 2, wherein the welding terminal 21 is in a left-right symmetrical pattern, and the middle is open.
On this basis, in this example, a rectangular member 23 is formed on the upper antenna 2 body on the side opposite to the resonant ring 22, and this member 23 will serve as an impedance matcher for the entire antenna, so that the impedance of the antenna and the impedance of the chip are effectively matched, and a good communication effect is obtained.
Connection holes 24 and 41 are provided at left ends of the upper and lower antennas for connection conduction welding of the upper and lower antennas. In particular, the diameter of the connecting hole is set to 1.05mm, which is slightly larger than the diameter of the connecting terminal 5. The preferred connecting terminal 5 of this example selects copper connecting pipe, and it is the hollow cylinder structure specifically, and the cylinder external diameter is between 1.0mm, and pipe wall thickness is 0.15mm, and the length of cylinder is 5mm.
The connection terminal 5 thus structured is reliably connected to and conducted with the connection hole 24 of the upper antenna and the connection hole 41 of the lower antenna by one of welding processes of laser welding, ultrasonic welding, high temperature resistant soldering or arc welding.
Referring to fig. 2, the silica gel medium 1 in the electronic tag is processed by adopting a silica gel material, and is a sheet-shaped carrier with the thickness of 1 mm-10 mm, preferably a sheet-shaped structure with the thickness of 4.0 mm.
The silica gel medium 1 with such a structure has upper and lower surfaces uniformly coated with a high temperature resistant adhesive, and in this example, an organic silica gel or an epoxy resin gel is used.
When the silica gel medium 1 is used for supporting the antenna, the upper antenna 2 and the lower antenna 4 in the processed antenna assembly are distributed and attached to the upper surface and the lower surface of the silica gel medium 1, the light pressure antenna is enabled to be kept flat, the upper antenna 2, the lower antenna 4 and the silica gel medium are respectively subjected to preliminary adhesion by high-temperature-resistant adhesives, then the materials are cured in a high-temperature storage box at 150 ℃ for 30 minutes, and the curing process is completed.
The silica gel encapsulation body in the electronic tag is formed by injection molding of a silica gel material, and can effectively encapsulate the antenna, the radio frequency chip encapsulation module and the silica gel medium to form a closed shape.
Specifically, the silica gel encapsulation body encapsulates the cured semi-finished product with silica gel to form the silica gel encapsulation high temperature resistant label.
Aiming at the scheme of the silica gel packaging high-temperature-resistant label, the embodiment also provides a quick and convenient implementation method, and the process for assembling the silica gel packaging high-temperature-resistant label based on the method comprises the following steps:
step 1, radio frequency chip packaging is carried out, and high-reliability molding packaging is adopted to package the radio frequency chip, so that a special molding packaging body is formed, and the size of the special molding packaging body is preferably 1.55 x 2.65 x 1.05mm.
And 2, connecting an antenna, and welding the packaged radio frequency chip module to the position of an antenna electrode.
And 3, uniformly coating high-temperature-resistant adhesive on the upper surface and the lower surface of the silica gel medium, aligning and attaching an upper antenna on the upper surface of the silica gel medium so that a radio frequency module on the upper antenna is positioned on the inner side of the antenna, aligning and attaching a lower antenna on the lower surface of the silica gel medium, and enabling a connecting terminal to penetrate through the silica gel medium to connect the upper antenna and the lower antenna.
And 4, lightly pressing the assembly finished in the step 3, and placing the assembly into a high-temperature storage box to cure the adhesive.
And 5, encapsulating the cured semi-finished product by using a silica gel encapsulation body to form the silica gel encapsulated high-temperature-resistant label.
The assembly of the silica gel packaging high-temperature-resistant label can be completed rapidly and conveniently through the working procedures, the efficiency is high, the yield is high, and the mass production of products is guaranteed.
Example 2
Referring to fig. 5 and 6, the structure of the silica gel-encapsulated high temperature resistant tag given in this example is shown. The overall structure of the silica gel packaging high temperature resistant tag provided in this example is the same as that of the silica gel packaging high temperature resistant tag in example 1, and is different from the antenna in the electronic tag in this example, which is composed of an upper antenna 2 and a lower antenna 4 of two integrated structures.
As can be seen from the figure, in this example, the upper antenna 2 and the lower antenna 4 are integrally formed, and the upper antenna 2 and the lower antenna 4 are made of metal sheets with hollowed patterns. The metal sheet is one of copper, aluminum, iron and alloy materials, and the thickness of the metal sheet is preferably 1 um-1000 um.
The upper antenna 2 is an electrode of a polarized antenna, and the lower antenna is a reflecting plate, so that the metal resistance function is realized. A ring-shaped resonant ring 22 and a welding terminal 21 are provided at a proper position of the upper antenna 2, wherein the welding terminal 21 is in a left-right symmetrical pattern, and the middle is open.
On this basis, in this example, a rectangular member 23 is formed on the upper antenna 2 body on the side opposite to the resonant ring 22, and this member 23 will serve as an impedance matcher for the entire antenna, so that the impedance of the antenna and the impedance of the chip are effectively matched, and a good communication effect is obtained.
The upper antenna 2 and the lower antenna 4 are connected and conducted through a connecting belt 24 integrally formed with the upper antenna 2 and the lower antenna 4, and the connecting belt 24 can be bent by 90 degrees in the processing process so as to be matched with a silica gel medium when the electronic tag is assembled.
When the antenna with the structure and the silica gel medium are arranged, firstly, the upper antenna 2 is attached to the upper surface of the silica gel medium in an aligned manner, so that the radio frequency module 3 is positioned at the inner side of the antenna, and then the connecting belt 24 is bent, so that the lower antenna 4 is wound on the other surface of the silica gel medium and is attached.
In addition, other structures and embodiments of the electronic tag in this example are the same as those in example 1, and a detailed description thereof is omitted herein.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. High temperature resistant label of silica gel encapsulation, its characterized in that includes:
The antenna comprises an upper metal sheet and a lower metal sheet which are arranged in parallel, wherein a hollowed pattern is formed on the metal sheet, the upper metal sheet and the lower metal sheet are connected through at least one conductive connector, the upper metal sheet forms an upper antenna and is used as an electrode of a polarized antenna, the lower metal sheet forms a lower antenna and is used as a reflecting plate to play a role of resisting metal, a ring-shaped resonant ring and a welding terminal are arranged at a proper position of the upper antenna, wherein the welding terminal is in a pattern of bilateral symmetry and is open in the middle, a rectangular part parallel to the upper antenna body is formed on one side of the upper antenna body opposite to the resonant ring, and the rectangular part is used as an impedance matcher of the whole antenna to effectively match the impedance of the antenna with the impedance of a chip;
the radio frequency chip packaging module is provided with at least two electrodes and is arranged on an upper metal sheet or a lower metal sheet in the antenna, and the electrodes on the radio frequency chip packaging module and the connection points on the metal sheets form reliable electrical connection;
The antenna comprises a silica gel medium, a conductive connector and a conductive antenna, wherein the silica gel medium is a sheet-shaped supporting body made of silica gel material and is integrally arranged in the antenna, the upper metal sheet and the lower metal sheet of the antenna are attached to two parallel planes of the silica gel medium, and the conductive connector penetrates through the silica gel medium to connect the upper metal sheet and the lower metal sheet;
The silica gel encapsulation body encapsulates the antenna, the radio frequency chip encapsulation module and the silica gel medium to form a closed shape.
2. The silica gel packaged high temperature resistant tag of claim 1, wherein the metal sheet of the antenna is one of copper, aluminum, iron and alloy material, and the thickness of the metal sheet is 1 um-1000 um.
3. The silica gel packaged high temperature resistant tag of claim 1, wherein the upper metal sheet and the lower metal sheet of the antenna are independently arranged, and are connected and conducted through a conductive column.
4. The high temperature resistant tag of claim 1, wherein the upper metal sheet and the lower metal sheet are integrally formed, and are connected and conducted through a connecting band integrally formed on the upper metal sheet and the lower metal sheet.
5. The high temperature resistant tag of claim 1 wherein the reliable electrical connection is made between the electrode on the rf chip package module and the connection point on the metal sheet by one of laser welding, ultrasonic welding, high temperature resistant soldering or arc welding.
6. The silica gel packaged high temperature resistant tag of claim 1, wherein the thickness of the silica gel medium is between 1mm and 10 mm.
7. The high temperature resistant tag of claim 1, wherein the antenna and the silicone medium are bonded by a high temperature resistant adhesive, and the adhesive comprises one of silicone or epoxy resin as a main component.
8. The high temperature resistant label of claim 1, wherein the silica gel envelope is formed by injection molding of a silica gel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811651333.5A CN109754055B (en) | 2018-12-31 | 2018-12-31 | High temperature resistant label of silica gel encapsulation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811651333.5A CN109754055B (en) | 2018-12-31 | 2018-12-31 | High temperature resistant label of silica gel encapsulation |
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| Publication Number | Publication Date |
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| CN109754055A CN109754055A (en) | 2019-05-14 |
| CN109754055B true CN109754055B (en) | 2024-12-17 |
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| CN201811651333.5A Active CN109754055B (en) | 2018-12-31 | 2018-12-31 | High temperature resistant label of silica gel encapsulation |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209433425U (en) * | 2018-12-31 | 2019-09-24 | 上海仪电特镭宝信息科技有限公司 | A kind of high temperature resistant labels of silica gel packaging |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100686598B1 (en) * | 2005-09-30 | 2007-02-26 | 주식회사 손텍 | Radio Frequency Identification Label with Printed Antenna |
| KR100686599B1 (en) * | 2005-09-30 | 2007-02-26 | 주식회사 손텍 | Radio Frequency Identification Label with Fabric Antenna |
| KR100567842B1 (en) * | 2005-12-16 | 2006-04-05 | 주식회사 알에프링크 | Radio frequency identification tag for metal with heat resistance |
| KR20080048105A (en) * | 2006-11-28 | 2008-06-02 | 삼성테크윈 주식회사 | RFID tag having a double package structure and its manufacturing method |
| AT509633A1 (en) * | 2010-03-29 | 2011-10-15 | Ctr Carinthian Tech Res Ag | HIGH TEMPERATURE RESISTANT, ELECTRICALLY CONDUCTIVE THIN FILMS |
| CN104025126B (en) * | 2011-09-30 | 2017-08-18 | 日立化成株式会社 | Rfid tag |
| CN106599970A (en) * | 2016-11-03 | 2017-04-26 | 王力安防科技股份有限公司 | Metal product with RFID tag |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209433425U (en) * | 2018-12-31 | 2019-09-24 | 上海仪电特镭宝信息科技有限公司 | A kind of high temperature resistant labels of silica gel packaging |
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