CN109831871B - Chip on film packaged flexible circuit board, flexible circuit board and manufacturing method thereof - Google Patents
Chip on film packaged flexible circuit board, flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN109831871B CN109831871B CN201910242293.7A CN201910242293A CN109831871B CN 109831871 B CN109831871 B CN 109831871B CN 201910242293 A CN201910242293 A CN 201910242293A CN 109831871 B CN109831871 B CN 109831871B
- Authority
- CN
- China
- Prior art keywords
- sub
- circuit board
- flexible circuit
- width
- output pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000012360 testing method Methods 0.000 claims description 22
- 238000005520 cutting process Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 11
- 230000014759 maintenance of location Effects 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 16
- 238000010586 diagram Methods 0.000 description 21
- 238000005538 encapsulation Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a chip on film packaged flexible circuit board, a flexible circuit board and a manufacturing method thereof, which are used for solving the technical problem that the flexible circuit board is short-circuited due to the fact that metal scraps are easy to remain when the flexible circuit board is cut in the prior art. The flexible circuit board therein includes: the display device comprises a flexible display substrate and a plurality of output pads which are arranged on one side of the flexible display substrate and are arranged along a first direction and are spaced from each other; wherein the output pad includes a first main portion, a first sub-portion, and a second sub-portion, a first end of the first sub-portion is connected to the first main portion, and a second end of the first sub-portion is connected to the second sub-portion; along the first direction, the width of the first main body part is larger than that of the first sub-part, and the width of the first sub-part is larger than that of the second sub-part.
Description
Technical Field
The invention relates to the technical field of circuit connectors, in particular to a Chip On Film (COF) packaging flexible circuit board, a flexible circuit board and a manufacturing method thereof.
Background
A Flexible Printed Circuit (FPC) is a Printed Circuit made of a Flexible base material, and can be freely bent and folded, thereby achieving integration of assembly and wire connection. A Chip On Film (COF) packaged flexible circuit board is used as a component in an FPC for binding components such as a chip, and specifically, a plurality of output pads are provided on a binding region of the COF packaged flexible circuit board for binding components such as a chip.
COF encapsulation flexible circuit board need cut the binding area before binding, and at present, the interval between two adjacent output pads is narrower for COF encapsulation flexible circuit board cut foreign matters such as the metal fillings that produce and remain between the output pad, lead to COF encapsulation flexible circuit board's binding area because the remaining of metal fillings takes place the short circuit.
Disclosure of Invention
The embodiment of the application provides a chip on film packaged flexible circuit board, a flexible circuit board and a manufacturing method thereof, which are used for solving the technical problem that the flexible circuit board is short-circuited due to the fact that metal scraps are easily left after the flexible circuit board is cut in the prior art.
In a first aspect, an embodiment of the present application provides a flexible circuit board, including: the display device comprises a flexible display substrate and a plurality of output pads which are arranged on one side of the flexible display substrate and are arranged along a first direction and are spaced from each other; wherein,
the output pad comprises a first main body part, a first sub-part and a second sub-part, wherein a first end part of the first sub-part is connected with the first main body part, and a second end part of the first sub-part is connected with the second sub-part;
along the first direction, the width of the first main body part is larger than that of the first sub-part, and the width of the first sub-part is larger than that of the second sub-part.
In a second aspect, an embodiment of the present application provides a flexible circuit board with a chip on film package, including the flexible circuit board, the control chip, and a plurality of leads arranged along the first direction and corresponding to the output pads one to one;
each lead connects the corresponding output pad to the control chip, and the control chip is located on a side of the first main body portion away from the first sub-portion.
In a third aspect, an embodiment of the present application provides a method for manufacturing a flexible circuit board, where the method includes:
etching the flexible substrate to form a reserved area and a pre-removing area, wherein a preset cutting line is arranged between the reserved area and the pre-removing area; the retention area comprises a plurality of output pads which are arranged along a first direction and are spaced from each other, each output pad comprises a first main body part, a first sub-part and a second sub-part, a first end part of the first sub-part is connected with the first main body part, and a second end part of the first sub-part is connected with the second sub-part; in the retention area, along the first direction, the width of the first main body portion is greater than that of the first sub-portion, and the width of the first sub-portion is greater than that of the second sub-portion; the pre-removing area comprises a plurality of test pads which are arranged along a first direction and are spaced from each other, each test pad comprises a second main body part and a third sub-part, a first end part of each third sub-part is connected with the second main body part, and a second end part of each third sub-part is connected with the second sub-part;
connecting a control chip with each output pad, wherein the control chip is positioned on one side of the reserved area, which is far away from the pre-removal area;
and cutting along the preset cutting line to obtain the flexible circuit board.
The flexible circuit board that this application embodiment provided includes: the flexible display device comprises a flexible display substrate and a plurality of output pads which are arranged on one side of the flexible display substrate and are arranged along a first direction and are spaced from each other, wherein each output pad comprises a first main body part, a first sub-part and a second sub-part, a first end part of the first sub-part is connected with the first main body part, a second end part of the first sub-part is connected with the second sub-part, the width of the first main body part is larger than that of the first sub-part along the first direction, and the width of the first sub-part is larger than that of the second sub-part. The interval between two adjacent output pads on the flexible circuit board that this application embodiment provided is at first orientation crescent, so foreign matter such as metal fillings that probably produce when cutting the flexible circuit board just falls down from between two adjacent output pads relatively easily, reduces the remaining possibility of foreign matter such as metal fillings to avoid the problem that the flexible circuit board after cutting takes place the short circuit when using as far as possible.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a structure of an output pad of FIG. 1;
fig. 3 is a schematic structural diagram of a possible flexible circuit board according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of the structure of one of the output pads of FIG. 3;
fig. 5 is a schematic structural diagram of a possible flexible circuit board according to an embodiment of the present disclosure;
fig. 6 is a schematic structural diagram of a possible flexible circuit board according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a possible flexible circuit board according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a possible flexible circuit board according to an embodiment of the present disclosure;
fig. 9 is a schematic structural diagram of a possible flexible circuit board according to an embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of a flexible printed circuit board with a flip chip on film package according to an embodiment of the present disclosure;
fig. 11 is a schematic flow chart of a method for manufacturing a flexible circuit board according to an embodiment of the present application;
fig. 12 to fig. 15 are schematic structural diagrams corresponding to the manufacturing process of the flexible circuit board according to the embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It should be understood that the preferred embodiments described below are only for illustrating and explaining the present invention and are not to be used for limiting the present invention. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict. It should be noted that the lengths and shapes of the output pads in the drawings are not to scale, but are merely illustrative of the present invention. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
Referring to fig. 1, the present disclosure provides a flexible circuit board including a flexible display substrate 10 and a plurality of output pads 11 arranged on one side of the flexible display substrate 10 along a first direction and spaced apart from each other. Fig. 1 illustrates an example in which the flexible circuit board includes 8 output pads 11, and in fact, the number of the output pads 11 may be designed according to a chip design to be bound, or according to other circuit connection requirements, and the embodiment of the present application is not limited. The area indicated by the dashed line box in fig. 1 is the area occupied by the output pad 11 on the flexible circuit board.
Please refer to fig. 2, which is a schematic structural diagram of an output pad 11. In the second direction, each of the output pads 11 includes a first main portion 111, a first sub-portion 112, and a second sub-portion 113, a first end portion of the first sub-portion 112 is connected to the first main portion 111, and a second end portion of the first sub-portion 112 is connected to the second sub-portion 113. In addition, in the second direction, the width of the first main body portion 111 in the first direction is greater than the width of the first sub-portion 112 in the first direction, the width of the first sub-portion 112 in the first direction is greater than the width of the second sub-portion 113 in the first direction, that is, the width of the output pad 11 in the second direction and in the first direction is gradually narrowed, so that the interval between at least two adjacent output pads 11 in the second direction is gradually enlarged in the first direction, and thus, when the flexible circuit board is cut along a straight line where the end portion of the second sub-portion 113 far away from the first main body portion 111, the interval between the second sub-portions 113 of at least two adjacent output pads 11 is enlarged, the possibility of foreign matter residue such as metal chips and the like which may be generated when the flexible circuit board is cut can be reduced; meanwhile, due to the fact that the gap is large, the residual metal scraps are difficult to enable the adjacent output pads 11 to be electrically connected, and therefore the problem that the cut flexible circuit board is short-circuited in use can be further solved.
Specifically, the structure of the output pad 11 includes, but is not limited to, one of the following structures:
first, please refer to fig. 1 continuously, which is a schematic structural diagram of a possible flexible circuit board in the embodiment of the present application. The first body part 111 includes a first edge L1 and a second edge L2 oppositely disposed in the first direction; the first sub-portion 112 includes a first edge L3 and a second edge L4 oppositely disposed in the first direction; the second sub-portion 113 includes a first edge L5 and a second edge L6 oppositely disposed in the first direction. The widths of the first main portion 111 and the second sub-portion 113 in the first direction are uniform, and the width of the first sub-portion 112 in the first direction is gradually decreased along the second direction. In a specific implementation, the first direction and the second direction may intersect, and the embodiment of the present application does not limit a manner in which the first direction and the second direction intersect.
Specifically, please refer to fig. 2, which is a schematic diagram of a possible structure of an output pad 11 in fig. 1. The first edge L3 and the second edge L4 of the first sub-portion 112 are both straight edges, the first edge L3 intersects the first edge L1 of the first body portion 111, and the second edge L4 intersects the second edge L2 of the first body portion 111. The width of the first sub-portion 112 along the second direction and in the first direction gradually decreases, so that the trace impedance of the output pad 11 can be reduced from suddenly changing, and the output pad 11 has a better impedance characteristic. Specifically, the acute angle formed by the intersection of the second edge L4 and the second edge L2 of the first main body portion 111 is [0 °,45 °, and preferably, the acute angle formed by the intersection of the extension line of the second edge L4 and the second edge L2 of the first main body portion 111 is [30 °,45 °, so as to ensure that the first sub-portion 112 occupies the effective area of the flexible circuit board as much as possible.
As can be seen from fig. 1 or fig. 2, the width of the first main body portion 111 in the first direction is greater than the width of the first sub-portion 112 in the first direction, the width of the first sub-portion 112 in the first direction is greater than the width of the second sub-portion 113 in the first direction, and the distance between two adjacent output pads 11 at the position of the second sub-portion 113 is the largest, so that when the flexible circuit board is cut, the area where the second sub-portion 113 is cut can be selected. The structure shown in fig. 1 can ensure the area occupied by the first sub-portion 112 on the flexible circuit board as much as possible, so as to increase the stress that the output pad 11 can bear when being bent, and to avoid the possible fracture condition when the output pad 11 is bent as much as possible.
Generally, when the flexible circuit board is used, for example, when the flexible circuit board is tested, the flexible circuit board may be bent, and at this time, if the effective area occupied by the output pad 11 on the flexible circuit board is small, the stress that the output pad 11 can bear is small, and a situation of fracture is easy to occur. Therefore, in the embodiment of the present application, the width of the second sub-portion 113 needs to ensure the stress requirement of the output pad 11. In one possible implementation manner, the width of the first main portion 111 along the first direction is less than or equal to 12 μm, and the width of the second sub-portion 113 is not less than 6 μm.
Second, please refer to fig. 3, which is a schematic structural diagram of a possible flexible circuit board in the embodiment of the present application. The first main portion 111 of each output pad 11 shown in fig. 3 has the same structure as the first main portion 111 of each output pad 11 shown in fig. 2, and the second sub-portion 113 of each output pad 11 shown in fig. 3 has the same structure as the second sub-portion 113 of each output pad 11 shown in fig. 2, and thus, the description thereof is omitted. The first sub-section 112 of each output pad 11 shown in fig. 3 is different from the first sub-section 112 of each output pad 11 shown in fig. 2 in that the first edge L3 and the second edge L4 of the first sub-section 112, which are oppositely disposed along the first direction, are both arc-shaped edges, as shown in fig. 4. The first edge L3 and the second edge L4 of the first sub-portion 112 are both arc edges, which can reduce the abrupt change of the trace impedance of the output pad 11, so that the output pad 11 has better impedance characteristics.
In the embodiment of the present application, the axes of each output pad 11 on the flexible circuit board along the second direction may be symmetrically distributed, as shown in fig. 1 to 4. In this case, if the flexible circuit board includes at least three output pads 11, the first main body portions 111 of any two adjacent output pads 11 of the at least three output pads 11 have a first distance therebetween along the first direction, and the two adjacent first distances may be equal, as shown in fig. 1 to 4, for example, the two adjacent first distances are equal. If two adjacent first intervals are equal, the first interval can be set to be smaller, so that more output pads 11 can be arranged in the effective area of the flexible circuit board, and the application requirement that more output pads 11 need to be arranged can be met.
Alternatively, the two adjacent first pitches may not be equal, for example, please refer to fig. 5, which is a schematic structural diagram of a possible flexible circuit board in the embodiment of the present application. In fig. 5, for example, two adjacent first spacings are d1 and d2, respectively, and d1 is not equal to d 2. In this case, when the width of the first space between the first body portions 111 of the adjacent two output pads 11 is less than 200 μm, the edges adjacent to the two first sub-portions 112 corresponding to the adjacent two output pads 11 may be arc edges or straight edges. When the width of the first space between the first main portions 111 of two adjacent output pads 11 is greater than or equal to 200 μm, the adjacent edges of the two first sub-portions 112 corresponding to the two adjacent output pads 11 are parallel to each other. Generally, the maximum diameter of the metal filings is generally less than 200 μm, so when the first spacing is greater than 200 μm, the metal filings residue possibly generated by cutting the flexible circuit board can be reduced, and the possibility of short circuit of the flexible circuit board caused by the metal filings residue can be avoided. In this case, the first edge L3 and the second edge L4 of the first sub-portion 112, which are oppositely disposed along the first direction, may be parallel to each other, so that the effective area occupied by the first sub-portion 112 in the flexible circuit board is larger to avoid the possible breakage of the output pad 11 when it is bent.
For example, in fig. 5, two adjacent output pads 11 are a first output pad 11a and a second output pad 11b, respectively, and a first distance d1 is between the first output pad 11a and the second output pad 11 b; the two adjacent output pads 11 may again be a second output pad 11b and a third output pad 11c, the first distance between the second output pad 11b and the third output pad 11c being d 2. When d1 is less than 200 μm, the second edge L4 of the first sub-section 112 of the first output pad 11a may be a curved edge or a direct edge, and the first edge L3 of the first sub-section 112 of the second output pad 11b may be a curved edge or a direct edge. Fig. 5 illustrates the second edge as a straight edge. And when d2 is greater than or equal to 200 μm, the second edge L4 of the first sub-section 112 of the second output pad 11b and the first edge L3 of the first sub-section 112 of the third output pad 11c are parallel to each other. For example, the second edge L4 of the first sub-section 112 of the second output pad 11b is aligned in the second direction with the second edge L2 of the first body portion 111 or the second edge L6 of the second sub-section 113, and the first edge L3 of the first sub-section 112 of the third output pad 11c is aligned in the second direction with the first edge L1 of the first body portion 111 or the first edge L5 of the second sub-section 113.
Fig. 1 to 5 describe possible configurations of the output pads 11 on the flexible circuit board in the first direction as described above. The possible configuration of the output pads 11 on the flexible circuit board in the second direction is described below.
In the embodiment of the present application, the lengths of the first sub-portions 112 of the at least two output pads 11 included in the flexible circuit board in the second direction may be equal, as in the structure shown in fig. 1. As another embodiment, please refer to fig. 6, which is a schematic structural diagram of a possible flexible circuit board in an embodiment of the present application. The flexible circuit board shown in fig. 6 includes a plurality of output pads whose virtual extension lines (illustrated by dotted lines in fig. 6) intersect a straight line in the first direction.
In the embodiment of the present application, the lengths of the first sub-portions 112 of the at least two output pads 11 included in the flexible circuit board along the second direction may not be equal. Fig. 7 is a schematic structural diagram of a possible flexible circuit board in the embodiment of the present application. Fig. 7 illustrates that the flexible circuit board includes 8 output pads 11, and the lengths of the first sub-portions 112 of 3 output pads 11, which are not adjacent to each other, in the 8 output pads 11 along the second direction are not equal, and the lengths of the first sub-portions 112 of the remaining 5 output pads 11 along the second direction are equal. Wherein, the 3 output pads 11 which are not adjacent to each other are the output pad 11d, the output pad 11e and the output pad 11f, respectively. In fact, the at least two output pads 11 may also be at least two adjacent output pads 11, which is not limited by the embodiment of the present application. In this case, the effective areas of the flexible circuit boards occupied by the first sub-portions 112 of the at least two output pads 11 included in the flexible circuit board are different, and when the length of the first sub-portions 112 along the second direction is longer, the larger the effective area of the flexible circuit board occupied by the first sub-portions 112 is, the larger the effective area of the corresponding output pads 11 occupied by the flexible circuit board may be increased, for example, in fig. 7, the effective area of the flexible circuit board occupied by the output pads 11d is increased, so as to increase the stress that the output pads 11 can bear when being bent as much as possible, and avoid the fracture condition that may occur when the output pads 11 are bent.
In the embodiment of the present application, in the case that the lengths of the first sub-portions 112 of the at least two output pads 11 included in the flexible circuit board along the second direction are not equal, the second direction and the first direction may also intersect. The embodiment in which the second direction crosses the first direction is the same as the embodiment of fig. 6, and will not be described again here.
Alternatively, in the embodiment of the present application, the lengths of the second sub-portions 113 of the plurality of output pads 11 included in the flexible circuit board in the second direction are all equal, as shown in fig. 7. The stress that the second sub-portion 113 on the flexible circuit board can bear is thus more uniform.
As another possible embodiment, the lengths of the second sub-portions 113 of at least two output pads 11 included in the flexible circuit board along the second direction are not equal, as shown in fig. 8, so as to make the interval between the first sub-portions 112 or the second sub-portions 113 of two adjacent output pads 11 along the first direction as wide as possible. Fig. 8 exemplifies that the flexible circuit board includes the output pads 11d, 11e, and the first sub-portions 112 of the output pads 11f having unequal lengths in the second direction. Of course, in this case, the lengths of the first sub-portions 112 of the at least two output pads 11 included in the flexible circuit board along the second direction may not be equal, as shown in fig. 9. Fig. 9 illustrates that lengths of the output pads 11d, 11e, and 11f included in the flexible circuit board in the second direction are different from each other, so that the first sub-portion 112 or the second sub-portion 113 of two adjacent output pads 11 is ensured to have a wider interval in the first direction, and the output pads 11 of the flexible circuit board can bear a larger stress, thereby avoiding a possible fracture condition caused by bending the output pads 11 of the flexible circuit board.
Based on the same inventive concept, the embodiment of the application provides a flexible circuit board with a flip chip film package. Fig. 10 is a schematic structural diagram of a flexible printed circuit board with a chip on film package. The flexible printed circuit board with a chip on film package includes the flexible printed circuit board, the control chip 13, and a plurality of leads 12 arranged along a first direction and corresponding to the output pads 11, wherein each of the leads 12 connects the corresponding output pad 11 to the control chip 13, and the control chip 13 is located on a side of the first main body 111 away from the first sub-portion 112.
The first sub-portion 112 or the second sub-portion 113 of at least two adjacent output pads 11 on the flexible printed circuit board with the chip on film package provided by the embodiment of the application has a wider interval in the first direction, so that foreign matters such as metal chips and the like which may be generated during manufacturing the flexible printed circuit board with the chip on film package can easily fall down from between the two adjacent output pads, and the possibility of remaining foreign matters such as metal chips and the like is reduced, so that the problem of short circuit of the cut flexible printed circuit board with the chip on film package can be avoided as much as possible during use.
It should be noted that, a power transmission pad and a lead wire are further disposed on the side of the chip on film package flexible circuit board away from the output pad 11 of the control chip 13 for binding the FPC.
Referring to fig. 11, based on the same inventive concept, an embodiment of the present application provides a method for manufacturing a flexible circuit board, including:
and S111, etching the flexible substrate to form a reserved area and a pre-removing area, wherein a preset cutting line is arranged between the reserved area and the pre-removing area.
Fig. 12 is a schematic structural diagram of a flexible circuit board manufacturing process. The remaining area a on the flexible substrate 50 may include a plurality of output pads 11 as described above, i.e., a plurality of output pads 11 arranged along the first direction and spaced apart from each other, each output pad 11 including a first main portion 111, a first sub-portion 112 and a second sub-portion 113, a first end portion of the first sub-portion 112 being connected to the first main portion 111, and a second end portion of the first sub-portion 112 being connected to the second sub-portion 113. In the reserved area a, along the first direction, the width of the first main body portion 111 is greater than the width of the first sub-portion 112, and the width of the first sub-portion 112 is greater than the width of the second sub-portion 113. The pre-removal area B of the flexible substrate 50 includes a plurality of test pads 21 arranged in a first direction and spaced apart from each other, the test pads 21 include a second main portion 211 and a third sub-portion 212, a first end of the third sub-portion 212 is connected to the second main portion 211, and a second end of the third sub-portion 212 is connected to the second sub-portion 113. The boundary line between the reserved area a and the pre-removal area B may be a predetermined cutting line L (illustrated by a dotted line in fig. 12), which is exemplified in fig. 12.
In the embodiment of the present application, the width of the third sub-portion 212 in the first direction is smaller than the width of the second main body portion 211 in the first direction. The width of the third sub-portion 212 in the first direction may be equal to the width of the second sub-portion 113 in the first direction. Alternatively, the width of the second main body portion 211 in the first direction, the width of the third sub-portion 212 in the first direction, and the width of the second sub-portion 113 in the first direction may all be equal.
The effective area of the second main body portion 211 occupied by the flexible substrate 60 can be as large as possible, because the flexible circuit board needs to be tested when the flexible circuit board is manufactured, and the flexible circuit board may be bent for many times in the testing process, so that the larger the effective area of the second main body portion 211 occupied by the flexible substrate 60 is, the larger the stress that the flexible circuit board can bear is, and the fracture condition that the test pad 21 may appear is avoided.
Of course, as another possible embodiment, the third sub-portion 212 of the test pad 21 may also include two portions, for example, a first portion and a second portion, wherein the first portion is symmetrical to the first sub-portion 112 of the output pad 11 along the predetermined cutting line L, and the second portion is symmetrical to the second sub-portion 113 of the output pad 11 along the predetermined cutting line L, as shown in fig. 13.
In addition, the flexible substrate 50 is etched to form a plurality of leads 12 located on a side of the first main body 111 away from the first sub-portion 112 and arranged along the first direction, and the plurality of leads 12 are in one-to-one correspondence with the output pads 11 for connecting the corresponding output pads 11 with an electrical component, such as a control chip.
And S112, connecting the control chip with each output pad, wherein the control chip is positioned on one side of the reserved area far away from the pre-removal area.
Fig. 14 is a schematic structural diagram of a flexible circuit board manufacturing process. One end of each of the leads 12 is connected to a side of the first main body portion 111 of the output pad 11 away from the pre-removal region B, and the other end of each of the leads 12 is connected to the control chip 13.
After connecting the control chip 13 to the output pad 11, the control chip 13 may be tested to obtain a test result. For example, various functions to be implemented by the control chip 13 are tested one by one, and if the test result reaches a preset condition, for example, the function to be implemented by the control chip 13 can be implemented, or the test result is in an error allowing to be received, it is proved that the control chip 13 is not damaged after being connected to the output pad 11. If some of the functions to be performed by the test control chip 13 are not performed or the test results are not in error allowing reception, it turns out that the control chip 13 is damaged after the connection to the output pad 11, and additional processing of the control chip 13 is required.
And S113, cutting along a preset cutting line to obtain the flexible circuit board.
When the test result of the test control chip 13 reaches the preset condition, the structure shown in fig. 14 is cut along the preset cutting line L, and the flexible circuit board shown in fig. 15 is obtained.
It should be noted that the pre-removal area B of the flexible circuit board may be provided with leads for connecting with testing equipment or other electrical components involved in the testing process.
In the manufacturing method of the flexible circuit board provided by the embodiment of the application, when the output pads 11 are manufactured, the interval between the first sub-portion 112 or the second sub-portion 113 of at least two adjacent output pads 11 located in the reserved area in the first direction is wider, so that metal chips possibly generated in the cutting process can be leaked from the interval between the two adjacent output pads 11 when the flexible circuit board is cut subsequently, and the possibility that the metal chips are remained in the flexible circuit board is reduced as much as possible. In addition, the effective area of the output pad 11 in the pre-removing area on the flexible circuit board is as large as possible, so that the stress on the output pad 11 in the pre-removing area of the flexible circuit board is increased, and the possible breakage condition caused by bending the output pad 11 of the flexible circuit board in the test process is avoided.
In summary, the flip chip film packaged flexible circuit board, the flexible circuit board and the manufacturing method provided by the embodiment of the application can avoid the problem that the flexible circuit board is short-circuited due to metal scrap residue possibly generated by cutting the flexible circuit board when the flexible circuit board is cut.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (14)
1. A flexible circuit board, comprising: the display device comprises a flexible display substrate and a plurality of output pads which are arranged on one side of the flexible display substrate and are arranged along a first direction and are spaced from each other; wherein,
the output pad comprises a first main body part, a first sub-part and a second sub-part, wherein a first end part of the first sub-part is connected with the first main body part, and a second end part of the first sub-part is connected with the second sub-part;
in the first direction, the width of the first main body part is greater than that of the first sub-part, and the width of the first sub-part is greater than that of the second sub-part;
along the first direction, a first distance is formed between the first main body parts of two adjacent output pads, and the first distances are not equal;
when the width of the first interval is less than 200 μm, the adjacent edges of the two first sub-portions corresponding to the two adjacent output pads are both arc edges or both straight edges;
when the width of the first interval is greater than or equal to 200 μm, the edges adjacent to the two first sub-portions corresponding to the two adjacent output pads are parallel to each other.
2. The flexible circuit board of claim 1, wherein the lengths of the first sub-portions of at least two of the output pads are not equal along a second direction, wherein the second direction crosses the first direction.
3. The flexible circuit board of claim 2, wherein the second sub-portions of the plurality of output pads are all equal in length along the second direction.
4. The flexible circuit board of claim 2, wherein the lengths of the second sub-portions of at least two of the output pads are not equal along the second direction.
5. The flexible circuit board according to claim 3 or 4, wherein the first sub-portion has a width in the first direction gradually decreasing along the second direction.
6. The flexible circuit board of claim 5, wherein the plurality of output pads is at least three output pads;
along the first direction, a first distance is reserved between the first main body parts of any two adjacent output pads in the at least three output pads, and the two adjacent first distances are equal.
7. The flexible circuit board of claim 6, wherein the first sub-portion includes a first edge and a second edge disposed opposite in the first direction, the first edge and the second edge each being a straight edge.
8. The flexible circuit board of claim 6, wherein the first sub-portion includes first and second edges oppositely disposed along the first direction, the first and second edges each being a curved edge.
9. The flexible circuit board of claim 2, wherein each output pad is symmetrically distributed along an axis of the second direction, wherein the second direction intersects the first direction.
10. A flexible circuit board with a chip on film package, comprising the flexible circuit board according to any one of claims 1 to 9, a control chip, and a plurality of leads arranged along the first direction and corresponding to the output pads one by one;
each lead connects the corresponding output pad to the control chip, and the control chip is located on a side of the first main body portion away from the first sub-portion.
11. A method for manufacturing a flexible circuit board is characterized by comprising the following steps:
etching the flexible substrate to form a reserved area and a pre-removing area, wherein a preset cutting line is arranged between the reserved area and the pre-removing area; the retention area comprises a plurality of output pads which are arranged along a first direction and are spaced from each other, each output pad comprises a first main body part, a first sub-part and a second sub-part, a first end part of the first sub-part is connected with the first main body part, and a second end part of the first sub-part is connected with the second sub-part; in the retention area, along the first direction, the width of the first main body portion is greater than that of the first sub-portion, and the width of the first sub-portion is greater than that of the second sub-portion; the pre-removing area comprises a plurality of test pads which are arranged along a first direction and are spaced from each other, each test pad comprises a second main body part and a third sub-part, a first end part of each third sub-part is connected with the second main body part, and a second end part of each third sub-part is connected with the second sub-part;
connecting a control chip with each output pad, wherein the control chip is positioned on one side of the reserved area, which is far away from the pre-removal area;
and cutting along the preset cutting line to obtain the flexible circuit board.
12. The method of claim 11, further comprising, after connecting a control chip to the output pads:
testing the control chip to obtain a test result;
follow preset cuts the line and cuts, obtains flexible circuit board, includes:
and when the test result reaches a preset condition, cutting along the preset cutting line to obtain the flexible circuit board.
13. The method of claim 11, wherein the width of the second body portion is greater than the width of the third sub-portion in the first direction, the width of the third sub-portion being equal to the width of the second sub-portion.
14. The method of claim 11, wherein a width of the second body portion, a width of the third sub-portion, and a width of the second sub-portion are all equal along the first direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910242293.7A CN109831871B (en) | 2019-03-28 | 2019-03-28 | Chip on film packaged flexible circuit board, flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910242293.7A CN109831871B (en) | 2019-03-28 | 2019-03-28 | Chip on film packaged flexible circuit board, flexible circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109831871A CN109831871A (en) | 2019-05-31 |
| CN109831871B true CN109831871B (en) | 2020-02-21 |
Family
ID=66872992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910242293.7A Active CN109831871B (en) | 2019-03-28 | 2019-03-28 | Chip on film packaged flexible circuit board, flexible circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109831871B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12236028B2 (en) | 2020-09-02 | 2025-02-25 | Boe Technology Group Co., Ltd. | Flexible circuit board and manufacturing method thereof, touch panel and manufacturing method thereof |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110634833A (en) * | 2019-09-24 | 2019-12-31 | 武汉华星光电半导体显示技术有限公司 | Chip on film |
| CN110610977A (en) * | 2019-09-27 | 2019-12-24 | 武汉华星光电半导体显示技术有限公司 | Chip on film and display panel |
| CN111613597A (en) * | 2020-05-18 | 2020-09-01 | 武汉华星光电半导体显示技术有限公司 | Bonding area circuit |
| CN111682029A (en) * | 2020-06-15 | 2020-09-18 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
| CN113163595A (en) * | 2021-03-30 | 2021-07-23 | 荣耀终端有限公司 | Chip on film, roll and display device |
| CN113556867B (en) * | 2021-06-21 | 2023-06-27 | 昆山工研院新型平板显示技术中心有限公司 | Flexible circuit board, display panel and preparation method of display panel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM314988U (en) * | 2006-12-29 | 2007-07-01 | Innolux Display Corp | Flexible printed circuit board |
| EP3229564B1 (en) * | 2016-04-04 | 2018-02-28 | Sick Ag | Printed circuit board assembly and sensor |
| CN107809843A (en) * | 2017-11-30 | 2018-03-16 | 武汉天马微电子有限公司 | Binding component, display substrate and display panel |
| CN107864555A (en) * | 2017-12-09 | 2018-03-30 | 中国电子科技集团公司第四十三研究所 | A kind of flexible PCB |
-
2019
- 2019-03-28 CN CN201910242293.7A patent/CN109831871B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM314988U (en) * | 2006-12-29 | 2007-07-01 | Innolux Display Corp | Flexible printed circuit board |
| EP3229564B1 (en) * | 2016-04-04 | 2018-02-28 | Sick Ag | Printed circuit board assembly and sensor |
| CN107809843A (en) * | 2017-11-30 | 2018-03-16 | 武汉天马微电子有限公司 | Binding component, display substrate and display panel |
| CN107864555A (en) * | 2017-12-09 | 2018-03-30 | 中国电子科技集团公司第四十三研究所 | A kind of flexible PCB |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12236028B2 (en) | 2020-09-02 | 2025-02-25 | Boe Technology Group Co., Ltd. | Flexible circuit board and manufacturing method thereof, touch panel and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109831871A (en) | 2019-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109831871B (en) | Chip on film packaged flexible circuit board, flexible circuit board and manufacturing method thereof | |
| US12080910B2 (en) | Wiring material and battery module | |
| CN113163595A (en) | Chip on film, roll and display device | |
| US4335272A (en) | Breakaway circuit board with flexible coupling | |
| US10879636B2 (en) | Connector and communications device | |
| US20190260165A1 (en) | Cable termination for connectors | |
| US20120061129A1 (en) | Circuit board structure with low capacitance | |
| JP4532462B2 (en) | Press-fit terminal | |
| US6224395B1 (en) | Flex cables with increased three-dimensional conformity and design flexibility | |
| CN111315124B (en) | Circuit Board Assemblies and Electronics | |
| KR970004516B1 (en) | In-circuit emulator | |
| CN1179608C (en) | Printed circuit board and electronic equipment with the printed circuit board | |
| US12068554B2 (en) | Dual-path high-speed interconnect PCB layout solution | |
| JP2004281068A (en) | Mold pin for cable terminal | |
| CN210042351U (en) | PCB single board and PCB makeup | |
| CN210274697U (en) | Packaging structure of PCB board | |
| CN108134224B (en) | Coaxial to plane strain relief | |
| US7079399B2 (en) | Printed circuit boards having improved solder pads | |
| JP6475502B2 (en) | Circuit board held and fixed by mechanical structure, and electronic device using the same | |
| US10999929B2 (en) | Expansion card interfaces for high-frequency signals and methods of making the same | |
| CN111465214B (en) | Printed circuit board | |
| CN111142624B (en) | Expansion Card | |
| JP6743802B2 (en) | Semiconductor device | |
| JP2005136182A (en) | Flexible wiring board | |
| CN119521525A (en) | Flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |