CN109874275B - Dry-wet separated case and network equipment using case - Google Patents
Dry-wet separated case and network equipment using case Download PDFInfo
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- CN109874275B CN109874275B CN201910180100.XA CN201910180100A CN109874275B CN 109874275 B CN109874275 B CN 109874275B CN 201910180100 A CN201910180100 A CN 201910180100A CN 109874275 B CN109874275 B CN 109874275B
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Abstract
The invention discloses a dry-wet separation type chassis and network equipment using the same, wherein the dry-wet separation type chassis comprises a chassis body, an inner space of the chassis body is divided into two chambers which are isolated from each other by a partition board and used for mounting electronic devices, one chamber is a first chamber, the electronic devices in the first chamber adopt a non-liquid cooling heat dissipation mode, the other chamber is a second chamber, and the electronic devices in the second chamber adopt a liquid cooling heat dissipation mode. The internal space of the box body is divided into two independent chambers, the electronic devices in the first chamber adopt a non-liquid cooling heat dissipation mode, and the electronic devices in the second chamber adopt a liquid cooling heat dissipation mode, so that the damage of cooling liquid to the electronic devices arranged in the first chamber is avoided, the normal operation of equipment can be ensured, meanwhile, the disassembly and assembly procedures of the electronic devices are greatly simplified, and the working efficiency is improved.
Description
Technical Field
The invention relates to a dry-wet separation type chassis and network equipment using the dry-wet separation type chassis.
Background
With the high-speed development of the computer communication industry and the electronic industry, the IDC machine room high-density server is continuously increased, the server integration level and the processing capacity are gradually improved, but the consumption power of the server is also increased, so that the heat dissipation problem of electronic devices in the server becomes a technical problem to be solved urgently in the industry.
The server heat dissipation mainly adopts air cooling heat dissipation and liquid cooling heat dissipation. The traditional air cooling mode is an indirect contact cooling mode with low heat transfer efficiency, occupies excessive precious space in a server, has high total thermal resistance, and when the traditional air cooling server solves waste heat of higher power devices or pursues lower thermal resistance, a stronger fan or lower air inlet temperature is often adopted to control the device temperature, the former causes larger noise, and the latter easily causes the problem of dew condensation of excessively low humid air. The load capacity of the working medium represented by the product of the density and specific heat of the cooling liquid is nearly 2000 times higher than that of the air cooling mode, so that the liquid cooling server utilizing the liquid cooling heat dissipation is gradually widely applied.
The liquid cooling server mainly takes away waste heat generated by the heating elements by directly contacting the cooling liquid with all the heating elements in the server. However, this heat dissipation method has the following drawbacks:
the method comprises the steps that when electronic elements in a server need to be disassembled, cabinet operation is stopped, the server is integrally disassembled from the cabinet to be cleaned and air-dried, a cover plate of a server case is opened, the electronic elements are taken out from the case, and then cooling liquid on the electronic elements is cleaned and removed, so that the whole disassembly and assembly process is very complicated.
Some electronic devices in the server cannot be in direct contact with the cooling liquid, otherwise, the cooling liquid can damage the electronic devices, and normal operation of the server is affected.
Disclosure of Invention
The first object of the present invention is to provide a dry-wet separated chassis which has a simple structure and low cost, can simplify the assembly and disassembly processes of electronic devices, can improve the working efficiency, and can prevent the electronic devices from being damaged due to contact with cooling liquid.
The first object of the invention is achieved by the following technical measures: the utility model provides a dry-wet separation formula machine case, includes box, its characterized in that: the internal space of the box body is divided into two chambers which are isolated from each other by a partition board and used for installing electronic devices, wherein one chamber is a first chamber, the electronic devices in the first chamber adopt a non-liquid cooling heat dissipation mode, the other chamber is a second chamber, and the electronic devices in the second chamber adopt a liquid cooling heat dissipation mode.
The internal space of the box body is divided into two independent chambers, the electronic devices in the first chamber adopt a non-liquid cooling heat dissipation mode, and the electronic devices in the second chamber adopt a liquid cooling heat dissipation mode, so that the damage of cooling liquid to the electronic devices arranged in the first chamber is avoided, the normal operation of equipment can be ensured, meanwhile, the disassembly and assembly procedures of the electronic devices are greatly simplified, and the working efficiency is improved.
A second object of the present invention is to provide a network device using the above-mentioned dry-wet separated chassis.
The second object of the invention is achieved by the following technical measures: the network equipment using the dry-wet separation type chassis is characterized in that: a first circuit board positioned in the first chamber and a second circuit board positioned in the second chamber are arranged in the box body, the electronic devices in the first chamber are mounted on the first circuit board, and the electronic devices in the second chamber are mounted on the second circuit board.
The electronic device in the first chamber is an electronic device which cannot be contacted with cooling liquid, an electronic device which is frequently replaced or an electronic device which does not need heat dissipation; the electronic device located in the second chamber is an electronic device contactable with the cooling liquid.
The electronic device in the first chamber is a communication interface, a hard disk and/or a power supply. The hard disk is not contacted with the cooling liquid, so that the damage to the hard disk caused by the cooling liquid is avoided, the normal operation of the server can be ensured, the use type of the hard disk in the server is expanded, and the hard disk with poor tightness, such as a solid state hard disk, a mechanical hard disk or a hybrid hard disk, can be used.
As an improvement of the invention, the dry-wet separation type chassis comprises a heat dissipation part, wherein one part of the heat dissipation part is a heat conduction part, the heat conduction part is positioned in the first chamber and is in contact with the electronic device in the first chamber, the other part of the heat dissipation part is a heat dissipation part, the heat dissipation part is positioned in the second chamber and is in contact with cooling liquid, the heat dissipation part passes through the partition plate and performs sealing treatment on the passing part, and the cooling liquid simultaneously takes away the waste heat of the electronic device in the first chamber and the waste heat of the electronic device in the second chamber, which are conducted by the heat dissipation part. The heat emitted by the electronic devices in the first chamber is conducted to the cooling liquid by the heat dissipation piece, and the cooling liquid takes away the waste heat of all the electronic devices, so that the heat dissipation efficiency is high.
As an embodiment of the present invention, the partition is disposed vertically, and the first chamber and the second chamber are disposed side by side.
As another embodiment of the present invention, the partition is disposed laterally, and the first chamber and the second chamber are disposed up and down, or the second chamber and the first chamber are disposed up and down.
The electronic device in the second chamber adopts immersion liquid cooling heat dissipation, the second chamber is provided with a cooling liquid inlet and a cooling liquid outlet, and the cooling liquid submerges the electronic device in the second chamber; or the electronic device in the second chamber adopts spray type liquid cooling heat dissipation, namely the top surface of the second chamber is provided with a closed spray cavity for containing cooling liquid, the closed spray cavity is provided with a cooling liquid inlet, spraying holes are distributed on the bottom surface of the closed spray cavity, and the bottom of the second chamber is provided with a cooling liquid outlet.
The size and the density of the spray holes can be specifically arranged according to the heating degree of the electronic device, and the spray holes positioned right above the electronic device with larger heating value are more densely arranged; when the flow rate of the cooling liquid is required to be high, the spray holes can be designed into conical bodies with large upper parts and small lower parts. The cross section of the spraying hole is square, round or polygonal. The cover plate comprises plate bodies positioned above the two chambers, the two plate bodies are arranged independently and respectively fixed on top surface openings of the two chambers, or the cover plate is integrally formed.
As an improvement of the invention, a gap is formed between the second circuit board and the bottom surface of the second chamber to form a cooling liquid circulation space, cooling liquid flows into the cooling liquid circulation space after contacting with the electronic device, and the heat dissipation part of the heat dissipation part is positioned in the cooling liquid circulation space.
According to the invention, the bottom surface of the cooling liquid circulation space is inclined towards the cooling liquid outlet, so that cooling liquid can quickly flow to the cooling liquid outlet to be discharged through the cooling liquid circulation space, the cooling liquid is prevented from being accumulated in the second chamber, and the pressure on the server is reduced.
As a preferred implementation mode of the invention, the first chamber and the second chamber are arranged side by side, the case mainly comprises a case body with an opening on the top surface and a cover plate arranged on the opening of the case body, a sealed spraying cavity for containing cooling liquid is arranged on the inner surface of the cover plate and above the second chamber, a cooling liquid inlet is arranged on the sealed spraying cavity, spraying holes are distributed on the bottom surface of the sealed spraying cavity, or a sealed spraying cavity for containing cooling liquid is arranged on the inner surface of the cover plate, a cooling liquid inlet is arranged on the sealed spraying cavity, spraying holes are distributed on the bottom surface of the sealed spraying cavity and above the second chamber, a cooling liquid outlet is arranged at the bottom of the case body, cooling liquid enters the sealed spraying cavity from the cooling liquid inlet, is sprayed onto an electronic device which generates heat or an expansion surface contacted with the electronic device through the cooling liquid inlet, and the cooling liquid after heat absorption is taken away from the cooling liquid outlet.
The heat dissipation part comprises a plurality of independent heat dissipation units, wherein the heat conduction parts of the heat dissipation units are in one-to-one corresponding contact with the electronic devices in the first cavity, and the heat dissipation parts of the heat dissipation units are respectively in contact with cooling liquid; or the heat dissipation part is an integral part, the heat conduction part of the heat dissipation part is contacted with the electronic device in the first chamber, and the heat dissipation part is contacted with the cooling liquid.
As a further improvement of the invention, the heat dissipation part is mainly composed of a plurality of heat pipes which are arranged in parallel, the heat pipes are filled with heat exchange working media, each heat pipe is a circulation loop, the part of the heat pipe, which is contacted with an electronic device in the first cavity, is a heat conduction part, the part, which is contacted with cooling liquid, is a heat dissipation part, the surface of the heat conduction part of the heat pipe absorbs heat emitted by the electronic device in the first cavity, the heat exchange working media absorbs heat and then undergoes phase change, the heat exchange working media after phase change are conveyed to the heat dissipation part of the heat pipe through the heat pipe, the heat exchange working media are subjected to phase change by cooling of cooling liquid and flow back to the heat conduction part of the heat pipe, and a circulation process is completed. The heat exchange working medium can be water or glycol, and the heat pipe is used as a heat dissipation piece, so that the heat dissipation efficiency can be further improved.
The heat dissipation part is a cold plate made of heat conduction materials and provided with a hollow cavity, the cold plate is provided with a liquid inlet and a liquid outlet, the liquid inlet is connected with the spraying cavity or externally connected with cooling liquid, and the liquid outlet of the cold plate is communicated with the second cavity. The heat dissipation piece adopts the cold plate, so that the heat dissipation efficiency is further improved.
The heat dissipation part is a cold plate made of heat conduction materials and provided with a hollow cavity, serpentine channels are formed in the hollow cavity at intervals, two ends of each serpentine channel are respectively used as a liquid inlet and a liquid outlet, the liquid inlet is connected with the spraying cavity or externally connected with cooling liquid, and the liquid outlet is communicated with the second cavity. The cooling liquid flows uniformly, and heat on the cold plate is absorbed more quickly and effectively.
The invention can also be improved in that the side wall of the first cavity is respectively provided with a plug hole which is matched with the hard disk and/or the power supply, and the hard disk and/or the power supply can be detached from the first cavity through the plug holes to be separated from the first circuit board or installed in the first cavity to be plugged on the first circuit board. The power supply and/or the hard disk are directly inserted into or pulled out of the insertion hole, so that hot insertion and pulling are realized. Therefore, the invention can assemble and disassemble any type of power supply and/or hard disk through the plug hole, and further simplifies the assembly and disassembly procedures of the power supply and/or the hard disk.
The electronic device in the first chamber is a power supply or a hard disk and a power supply, the power supply comprises a power supply shell which is integrally manufactured and an electronic device positioned in the power supply shell, insulating heat-conducting glue is poured into the power supply shell, and heat emitted by the electronic device is conducted to the power supply shell through the insulating heat-conducting glue; when the electronic device in the first chamber is a hard disk and a power supply, the hard disk and the power supply are adjacently arranged, and the heat conducting part of the heat dissipation member is positioned between the hard disk and the power supply. The heat dissipation piece adopts the cold plate, and the power adopts fanless design, and power shell is the integral type, and the heat that its inside electronic device given off is conducted to power shell through insulating heat conduction glue, and rethread cold plate makes heat conduction to the cold plate with power shell contact.
The network device of the present invention is a server, a network switch or a transmitter.
Compared with the prior art, the invention has the following remarkable effects:
the electronic device in the first chamber adopts a non-liquid cooling heat dissipation mode, and the electronic device in the second chamber adopts a liquid cooling heat dissipation mode, so that damage of cooling liquid to the electronic devices installed in the first chamber is avoided, normal operation of equipment can be ensured, meanwhile, the disassembly and assembly procedures of the electronic devices are greatly simplified, and the working efficiency is improved.
The electronic device positioned in the first cavity can be a hard disk and/or a power supply, and the hard disk and/or the power supply are/is not contacted with the cooling liquid, so that the damage to the cooling liquid caused by the cooling liquid is avoided, the normal operation of the server can be ensured, and meanwhile, the use type of the hard disk in the server is expanded. When the hard disk and/or the power supply are/is required to be disassembled, the operation of the cabinet is not required to be stopped, the whole server is not required to be disassembled, the subsequent cleaning treatment of the hard disk and/or the power supply is not required, the disassembly and assembly procedures of the hard disk and/or the power supply are greatly simplified, and the working efficiency is improved.
According to the invention, the heat emitted by the electronic devices in the first chamber is conducted to the cooling liquid by the heat dissipation part, and the cooling liquid takes away the waste heat of all the electronic devices, so that the heat dissipation efficiency is high.
The electronic device positioned in the first chamber is a hard disk and a power supply, and the heat dissipation part arranged between the hard disk and the power supply is a cold plate, so that the heat conduction capacity can be improved, and the heat dissipation efficiency can be further improved.
Drawings
The invention will now be described in further detail with reference to the drawings and to specific examples.
FIG. 1 is a schematic view showing the overall structure of embodiment 1 of the present invention;
FIG. 2 is a schematic view of the structure of embodiment 1 of the present invention with the cover plate removed;
FIG. 3 is a schematic view of the structure of the cover plate above the second chamber (inner surface is shown) according to embodiment 1 of the present invention;
FIG. 4 is a schematic view of the structure of embodiment 1 of the present invention with the cover plate and side plate removed;
FIG. 5 is a schematic overall structure of embodiment 2 of the present invention;
fig. 6 is a schematic view showing the structure of embodiment 2 of the present invention when the cover plate is opened;
fig. 7 is a schematic view of the structure of embodiment 2 of the present invention in which the cover plate is opened and the power supply and the hard disk are pulled out;
FIG. 8 is a schematic view of the structure of embodiment 2 with the side plates removed;
fig. 9 is a second schematic view of the structure of embodiment 2 with the side plate removed.
Detailed Description
Example 1
As shown in fig. 1 to 4, the dry-wet separation type chassis of the present invention includes a chassis body 4, wherein an internal space of the chassis body is divided into two chambers isolated from each other by a partition board for mounting electronic devices, one of the chambers is a first chamber, the electronic devices in the first chamber adopt a non-liquid cooling heat dissipation mode, the other chamber is a second chamber, and the electronic devices in the second chamber adopt a liquid cooling heat dissipation mode.
In this embodiment, the network device is a liquid cooling server 1, and includes a dry-wet separation type chassis, a board card 3 disposed in the chassis, and an electronic device disposed on the board card 3, where the chassis mainly includes a case body 4 with an opening on a top surface, a cover plate 5 disposed on the opening of the case body 4, and a top plate 18, and the top plate 18 is connected with the case body 4 in a sealing manner. The electronic device comprises a hard disk 6, a processor, a memory, a power supply and the like, the internal space of the case is divided into a first chamber and a second chamber which are isolated from each other by a partition 7, in this embodiment, the partition 7 is vertically arranged, and the first chamber and the second chamber are arranged side by side. The board card 3 comprises a first circuit board provided with a hard disk 6 and a second circuit board provided with other electronic devices (heating elements such as a processor 15, a memory 14 and a power supply 25), the hard disk 6 and the first circuit board are positioned in a first cavity, the other electronic devices and the second circuit board are positioned in a second cavity and adopt liquid cooling for heat dissipation, a heat dissipation piece 8 (preferably copper) made of a heat conduction material is arranged in a chassis, one part of the heat dissipation piece 8 is a heat conduction part 81, the heat conduction part 81 is positioned in the first cavity and is in contact with a heating surface of the hard disk 6 in the first cavity, the other part is a heat dissipation part 82, the heat dissipation part 82 is positioned in the second cavity and is in contact with cooling liquid, and the part of the heat dissipation piece penetrating through the partition 7 is subjected to sealing treatment, in particular, the sealing glue can be adopted for sealing, so that the cooling liquid in the second cavity can not enter the first cavity, and the cooling liquid can simultaneously take away waste heat of the hard disk 6 and waste heat of the other electronic devices conducted by the heat dissipation piece 8. In this embodiment, the hard disk 6 is a plurality of heat dissipation elements 8 each comprising a plurality of independent heat dissipation units, each heat dissipation unit is a plate-shaped body, and the plurality of heat dissipation units are arranged in parallel, the heat dissipation units are in one-to-one correspondence with the hard disk, and the heat dissipation parts of the heat dissipation units are respectively in contact with the cooling liquid. In other embodiments, the plurality of hard disks may be provided, and the heat dissipation member may be an integral component, where the heat conducting portion contacts each hard disk, and the heat dissipation portion contacts the cooling liquid. The cooling liquid can be mineral oil, silicone oil or fluoridized liquid, and in practical application, the cooling liquid has heat conduction and insulation properties.
In other embodiments, the hard disk located in the first chamber may also use an existing heat dissipation mode such as air cooling, but the heat dissipation efficiency is relatively low.
In this embodiment, the electronic device in the second chamber uses spray liquid cooling, and in other embodiments, other liquid cooling methods, such as immersion liquid cooling, may be used, where the second chamber has a coolant inlet and a coolant outlet, and the coolant immerses the electronic device in the second chamber. The roof 18 is located the top of apron 5, apron 5 is including the plate body that is located two cavitys top, two plate bodies set up alone, fix respectively on the top surface opening of two cavitys, the apron 5 that is located the second cavity top is a airtight spraying cavity 9 that is used for splendid attire coolant liquid, be equipped with coolant liquid entry 11 on this airtight spraying cavity 9, it sprays the hole 10 to distribute on the bottom surface of airtight spraying cavity 9, the bottom of box 4 is equipped with coolant liquid export 12, coolant liquid gets into airtight spraying cavity 9 from coolant liquid entry 11, spray to the electronic component that generates heat or on the extension surface that contacts with it through spraying the hole 10, take away the waste heat that electronic component produced, coolant liquid after the heat absorption flows from coolant liquid export 12. The size and the density of the spray holes can be specifically arranged according to the heating degree of the electronic device, and the spray holes positioned right above the electronic device with larger heating value are more densely arranged; when the flow rate of the cooling liquid is required to be high, the spray holes can be designed into conical bodies with large upper parts and small lower parts. The cross section of the spray hole is square, round or polygonal.
In other embodiments, the cover plate is integrally formed, a closed spraying cavity for containing cooling liquid is arranged on the inner face of the cover plate, a cooling liquid inlet is arranged on the closed spraying cavity, and spraying holes are distributed on the bottom face of the closed spraying cavity and above the second cavity.
A gap is formed between the second circuit board and the bottom surface of the second chamber to form a cooling liquid circulation space 13, cooling liquid flows into the cooling liquid circulation space 13 after contacting with the electronic device, the heat dissipation part 82 of the heat dissipation part 8 is positioned in the cooling liquid circulation space 13, and the heat dissipation part 8 can be fully contacted with the cooling liquid, so that the heat dissipation effect is improved. The bottom surface of the coolant circulation space 13 is inclined toward the coolant outlet 12 so that the coolant is rapidly circulated to the coolant outlet 12 through the coolant circulation space 13 to be discharged, thereby avoiding the accumulation of the coolant inside the second chamber to relieve the pressure on the server.
The side wall of the first cavity is provided with a plug hole 15 which is matched with the hard disk 6, the plug hole 15 is provided with a protection side bar 17 with an opening 16 in the middle, the interface of the hard disk 6 is exposed in the opening 16 of the protection side bar 17, and after the protection side bar 17 is removed, the hard disk 6 can be detached from the first cavity through the plug hole 15 to separate from the first circuit board or be installed in the first circuit board to be plugged on the first circuit board. The protection side bar 17 is fixed on the plug hole 15 through a clamping connection or a threaded connection mode, when the hard disk needs to be plugged, the protection side bar is removed, and the hard disk is directly plugged or pulled out through the plug hole, so that hot plug is realized.
In other embodiments, the heat dissipation member is mainly composed of a plurality of heat pipes arranged in parallel, the heat pipes are filled with heat exchange working media, the heat exchange working media can be water or glycol, each heat pipe is a circulation loop, a part of the heat pipe, which is contacted with the hard disk, is a heat conduction part, a part of the heat pipe, which is contacted with the cooling liquid, is a heat dissipation part, the heat dissipation part surface of the heat pipe absorbs heat emitted by the hard disk, the heat exchange working media absorb the heat and then undergo phase change, the phase-changed heat exchange working media are conveyed to the heat dissipation part of the heat pipe through the heat pipe, the cooling liquid cools down to cause the heat exchange working media to undergo phase change and flow back to the heat conduction part of the heat pipe, and a circulation process is completed. The heat pipe is used as a heat dissipation piece, so that the heat dissipation efficiency can be further improved.
The power supply 25 comprises a power supply shell and a heating device positioned in the power supply shell, wherein a liquid inlet hole is formed in the top surface of the power supply shell, a liquid outlet hole is formed in the bottom surface of the power supply shell, and cooling liquid flows into the power supply shell from the liquid inlet hole to cool the heating device and flows out of the liquid outlet hole into the box body. In other embodiments, the power supply may be located outside the chassis, and the heat generating device in the power supply housing is cooled by cooling liquid sprayed outside the chassis flowing in from the liquid inlet and then flowing out from the liquid outlet.
In order to accurately control the temperature of each electronic device of the server, a liquid temperature sensing system is arranged in a case, the liquid temperature sensing system comprises a controller, a control valve arranged on a cooling liquid inlet, and temperature sensors arranged on a heating electronic device and a cooling liquid outlet, the temperature sensors and the control valve are respectively connected with the controller, each temperature sensor respectively collects temperature signals of the heating electronic device and the cooling liquid outlet and transmits the temperature signals to the controller, the controller controls the temperature of cooling liquid entering the cooling liquid inlet, and simultaneously controls the opening of the control valve to adjust the flow of the cooling liquid entering a spraying cavity on a second cavity, so that the automatic adjustment of spraying cooling of the electronic devices is realized.
Example 2
As shown in fig. 5 to 9, this embodiment is different from embodiment 1 in that: the electronic devices in the first chamber are a power supply 19 and a hard disk 6, wherein the power supply 19 comprises a power supply shell and electronic devices in the power supply shell, the power supply shell is internally filled with insulating heat-conducting glue, and heat emitted by the electronic devices is conducted to the power supply shell through the insulating heat-conducting glue; the hard disk 6 and the power supply 19 are disposed adjacently, and the heat conductive portion of the heat sink is located between the hard disk 6 and the power supply 19. In this embodiment, the heat dissipation member is a cold plate 20 made of a heat conductive material and having a hollow chamber, the cold plate 20 has a liquid inlet 21 and a liquid outlet 22, the liquid inlet 21 is connected to the spraying hole 10 of the spraying cavity 9 through a pipe (in other embodiments, the liquid inlet may also be externally connected with a cooling liquid), and the liquid outlet 22 of the cold plate 20 is communicated with the second chamber. The serpentine channels are formed in the hollow cavity of the cold plate 20 at intervals, so that the cooling liquid flows uniformly, heat on the cold plate is absorbed more quickly and effectively, and two ends of the serpentine channels are respectively used as a liquid inlet 21 and a liquid outlet 22. When the server works, cooling liquid enters the serpentine channel of the cold plate from the spraying holes of the spraying cavity through the pipeline, heat emitted by the server and the power supply is absorbed by the heat conducting material of the cold plate, the heat is conducted to the cooling liquid by the heat conducting material, and the cooling liquid flows into the second cavity through the liquid outlet, so that the heat of the server and the power supply is taken away. The power supply is high in power, and the cold plate is arranged between the power supply and the hard disk, so that the heat conduction capacity can be improved.
The side wall of the first cavity is respectively provided with a plug hole 23 which is suitable for the hard disk 6 and a plug hole 24 which is suitable for the power supply 19, and the hard disk 6 and the power supply 19 can be detached from the first circuit board or installed in the first cavity through the plug holes 23 and 24 to be plugged on the first circuit board.
In other embodiments, the electronics located in the first chamber are electronics that cannot be contacted by the cooling fluid (such as a hard disk and a communication interface), frequently replaced electronics (such as a hard disk and a power supply), or electronics that do not require heat dissipation (such as a communication interface); the electronics located in the second chamber are electronics (e.g., heating elements such as processors, memory, etc.) that are contactable with the cooling fluid; the partition plate is transversely arranged, and the first chamber and the second chamber are arranged up and down, or the second chamber and the first chamber are arranged up and down. The electronic device positioned in the second chamber adopts spray type liquid cooling heat dissipation, namely, the top surface of the second chamber is provided with a closed spray cavity for containing cooling liquid, the closed spray cavity is provided with a cooling liquid inlet, spraying holes are distributed on the bottom surface of the closed spray cavity, and the bottom of the second chamber is provided with a cooling liquid outlet. Specifically, in the embodiment in which the first chamber and the second chamber are disposed up and down, the closed shower cavity is disposed on the partition plate, and in the embodiment in which the second chamber and the first chamber are disposed up and down, the closed shower cavity is disposed on the cover plate. The specific structure of the heat dissipation part is adaptively changed according to the setting positions of the first cavity and the second cavity.
In other embodiments, the network device may also be a network switch or transmitter.
The network exchanger comprises a switching module, a control module, an interface module, a power supply, a fan and the like which are arranged in the box body. The fan, the interface module and the like can be placed in the first chamber, the exchange module and the control module are placed in the second chamber by using the dry-wet separation type machine box, and the heat dissipation treatment is carried out by using the heat conduction modes. And a fan is not required, so that noise is reduced, and the heat dissipation effect is improved.
Typically the transmitter comprises three parts built into a housing: a high frequency part, a low frequency part and a power supply part. The high frequency part generally comprises a master oscillator, a buffer amplifier, a frequency multiplier, an intermediate amplifier, a power amplifier boost stage and a final power amplifier. The low frequency part comprises a microphone, a low frequency voltage amplifying stage, a low frequency power amplifying stage and a final low frequency power amplifying stage. The power supply part can be placed in the first chamber, the high-frequency part and the low-frequency part can be placed in the second chamber by using the dry-wet separation type case, and the heat dissipation treatment is performed by using the above heat conduction modes.
The embodiments of the present invention are not limited thereto, and according to the above-described aspects of the present invention, the present invention may be modified, replaced or altered in various other ways without departing from the basic technical spirit of the present invention, all of which fall within the scope of the claims of the present invention, according to the general technical knowledge and conventional means of the present art.
Claims (13)
1. The utility model provides a network equipment of use dry wet disconnect-type quick-witted case, dry wet disconnect-type quick-witted case includes the box, the inner space of box is separated into two by the baffle and is used for installing the cavity of electron device each other to be isolated, and one of them cavity is first cavity, and the electron device in the first cavity adopts non-liquid cooling heat dissipation mode, and another cavity is the second cavity, and the electron device in the second cavity adopts liquid cooling heat dissipation mode, its characterized in that: a first circuit board positioned in a first cavity and a second circuit board positioned in a second cavity are arranged in the box body, the electronic devices in the first cavity are mounted on the first circuit board, and the electronic devices in the second cavity are mounted on the second circuit board; the network equipment comprises a heat dissipation part, wherein one part of the heat dissipation part is a heat conduction part, the heat conduction part is positioned in a first chamber and is in contact with an electronic device in the first chamber, the other part of the heat dissipation part is a heat dissipation part, the heat dissipation part is positioned in a second chamber and is in contact with cooling liquid, the heat dissipation part penetrates through a partition plate and performs sealing treatment on the penetrating part, and the cooling liquid simultaneously takes away waste heat of the electronic device in the first chamber and waste heat of the electronic device in the second chamber, which are conducted by the heat dissipation part; a gap is formed between the second circuit board and the bottom surface of the second cavity to form a cooling liquid circulation space, cooling liquid flows into the cooling liquid circulation space after contacting with the electronic device, and a heat dissipation part of the heat dissipation part is positioned in the cooling liquid circulation space; the bottom surface of the cooling liquid circulation space is inclined towards the cooling liquid outlet, so that the cooling liquid rapidly flows to the cooling liquid outlet to be discharged through the cooling liquid circulation space.
2. The network device of claim 1, wherein: the electronic device in the first chamber is an electronic device which cannot be contacted with the cooling liquid, an electronic device which is frequently replaced or an electronic device which does not need heat dissipation; the electronic device located in the second chamber is an electronic device contactable with the cooling liquid.
3. The network device of claim 2, wherein: the electronic device located in the first chamber is a communication interface.
4. The network device of claim 2, wherein: the electronic device located in the first chamber is a hard disk and/or a power supply.
5. The network device of claim 4, wherein: the partition plate is vertically arranged, and the first chamber and the second chamber are arranged side by side; or the partition board is transversely arranged, and the first chamber and the second chamber are arranged up and down, or the second chamber and the first chamber are arranged up and down.
6. The network device of claim 5, wherein: the electronic device in the second chamber adopts immersion liquid cooling heat dissipation, the second chamber is provided with a cooling liquid inlet and a cooling liquid outlet, and the cooling liquid submerges the electronic device in the second chamber; or the electronic device in the second chamber adopts spray type liquid cooling heat dissipation, namely the top surface of the second chamber is provided with a closed spray cavity for containing cooling liquid, the closed spray cavity is provided with a cooling liquid inlet, spraying holes are distributed on the bottom surface of the closed spray cavity, and the bottom of the second chamber is provided with a cooling liquid outlet.
7. The network device of claim 6, wherein: the first chamber and the second chamber are arranged side by side, the case is mainly composed of a case body with an opening at the top surface and a cover plate arranged on the opening of the case body, a closed spraying cavity for containing cooling liquid is arranged on the inner surface of the cover plate and above the second chamber, a cooling liquid inlet is arranged on the closed spraying cavity, spraying holes are distributed on the bottom surface of the closed spraying cavity, or a closed spraying cavity for containing cooling liquid is arranged on the inner surface of the cover plate, a cooling liquid inlet is arranged on the closed spraying cavity, spraying holes are distributed on the bottom surface of the closed spraying cavity and above the second chamber, a cooling liquid outlet is arranged at the bottom of the case body, cooling liquid enters the closed spraying cavity from the cooling liquid inlet, is sprayed onto a heating electronic device or an expansion surface contacted with the heating electronic device through the spraying holes, waste heat generated by the electronic device is taken away, and cooling liquid after heat absorption flows out from the cooling liquid outlet.
8. The network device of claim 7, wherein: the heat dissipation part consists of a plurality of independent heat dissipation units, the heat conduction parts of the heat dissipation units are in one-to-one corresponding contact with the electronic devices in the first cavity, and the heat dissipation parts of the heat dissipation units are respectively in contact with the cooling liquid; or the heat dissipation part is an integral part, the heat conduction part of the heat dissipation part is contacted with the electronic device positioned in the first chamber, and the heat dissipation part is contacted with the cooling liquid; or the heat dissipation part is mainly composed of a plurality of heat pipes which are arranged in parallel, the heat pipes are filled with heat exchange working media, and each heat pipe is a circulation loop.
9. The network device of claim 7, wherein: the heat dissipation piece is a cold plate made of heat conduction materials and provided with a hollow cavity, the cold plate is provided with a liquid inlet and a liquid outlet, the liquid inlet is connected with the spraying cavity or externally connected with cooling liquid, and the liquid outlet of the cold plate is communicated with the second cavity.
10. The network device of claim 9, wherein: the space forms the snakelike passageway in the cavity of cold plate, the both ends of snakelike passageway are as inlet and liquid outlet respectively.
11. The network device according to any one of claims 8 to 10, characterized in that: and the side wall of the first cavity is respectively provided with a plug hole which is matched with the hard disk and/or the power supply, and the hard disk and/or the power supply can be detached from the first cavity through the plug holes to be separated from the first circuit board or installed in the first cavity to be plugged on the first circuit board.
12. The network device of claim 11, wherein: the electronic device in the first chamber is a power supply or a hard disk and a power supply, the power supply comprises a power supply shell which is integrally manufactured and an electronic device positioned in the power supply shell, insulating heat-conducting glue is poured into the power supply shell, and heat emitted by the electronic device is conducted to the power supply shell through the insulating heat-conducting glue; when the electronic device in the first chamber is a hard disk and a power supply, the hard disk and the power supply are adjacently arranged, and the heat conducting part of the heat dissipation member is positioned between the hard disk and the power supply.
13. The network device of claim 12, wherein: the network device is a server, a network switch, or a transmitter.
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| CN2019100831046 | 2019-01-18 | ||
| CN201910083104 | 2019-01-18 |
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