CN109882810B - Radiator device of full-angle LED projection lamp - Google Patents
Radiator device of full-angle LED projection lamp Download PDFInfo
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- CN109882810B CN109882810B CN201711276073.3A CN201711276073A CN109882810B CN 109882810 B CN109882810 B CN 109882810B CN 201711276073 A CN201711276073 A CN 201711276073A CN 109882810 B CN109882810 B CN 109882810B
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Abstract
The present disclosure provides a radiator device of a full angle LED projector, comprising: the light source substrate is used for bearing the LED chip; the light source surface is recessed into the radiator, the side wall of the light source surface extends towards the light projection direction, and the light source substrate is arranged at the recessed position of the light source surface and is attached to the first surface of the light source surface; a heat conducting material which is jointed with the second surface of the light source surface, and the surface of the heat conducting material is provided with micro groove groups for transmitting the heat emitted by the light source substrate to the micro groove groups containing liquid below by heat conduction; the condensing wall surface is connected with the light source surface and the heat conducting material to form a sealed vacuum radiator inner cavity, and working fluid is injected into the radiator inner cavity. The solar flower radiator solves the defect that a sunflower radiator of the micro-groove group composite phase change heat exchange technology is sensitive to the use direction through the structural design, and meets the use requirement of multi-angle irradiation of a projection lamp.
Description
Technical Field
The invention relates to a radiator device which is suitable for all-angle use and adopts a micro-groove group composite phase change heat exchange technology, in particular to a high-power LED projection lamp which is suitable for the use condition that all-angle irradiation and even vertical upward hemispherical irradiation are required.
Background
As a solid semiconductor device capable of converting electric energy into visible light, an LED has obvious advantages in terms of ease of use, safety, environmental protection, service life, etc., compared with other conventional light sources such as incandescent lamps, fluorescent lamps, halogen lamps, etc., and has become a widely accepted new generation of alternative light sources. The LED is widely applied to one of the projection lamps, and the projection lamp is mainly applied to illumination of building outer walls, illumination of building inner light and outer light, illumination of indoor scenery, illumination of greening landscapes, illumination of billboards, illumination of special facilities and the like. The luminous efficiency of the LED is high, but 70% -80% of the energy is still converted into heat, and if the heat is not timely dissipated, the junction temperature of the LED will be too high, and the too high junction temperature not only can sharply attenuate the service life of the LED, but also can affect various performance parameters such as peak wavelength, light power, light flux and the like of the LED, so that a special heat dissipation design is required for the LED light source, especially for a high-power LED light source.
The micro-groove group composite phase change heat exchange technology is a novel cooling technology developed in recent years, and is used as a passive cooling mode, and the heat flux density of heat extraction can reach as high as 10 in theory 4 W/cm 2 The heat requirement of the current LED is about 10 0 ～10 2 W/cm 2 . Micro-groove group composite phase changeThe heat exchange technology is to process a micro-scale open channel group on the surface of a heat sink, so that the high-intensity evaporation of liquid in a thin liquid film area of a meniscus of the open channel group has strong heat exchange efficiency, and the heat extraction with high heat flux density of low temperature rise can be realized. The high-power LED adopting the micro-groove group composite phase-change heat exchange technology has the capability of irradiating downwards hemispheres such as bulb lamps, industrial and mining lamps, stadium lamps and the like and side surfaces such as fish-attracting lamps, track lamps and the like.
However, the micro-groove composite phase change heat exchange technology, the heat pipe technology and the like are heat dissipation technologies (the best use mode is that a heat source is arranged below and a cold source is arranged above) with requirements on the use direction, and are not easy to meet the use conditions of upward hemispherical irradiation (namely that the heat source is arranged above and the cold source is arranged below), and particularly the micro-groove composite phase change heat exchange technology, the heat pipe technology and the like are engineering application fields with high requirements on large-scale application and reliability. Aiming at the use requirements of various irradiation angles such as high-power LED projection lamps and upward hemispherical irradiation, the invention provides a radiator device which is applicable to the irradiation requirements and utilizes a micro-groove group composite phase change heat exchange technology.
BRIEF SUMMARY OF THE PRESENT DISCLOSURE
First, the technical problem to be solved
The present disclosure provides a radiator device of an all-angle LED projector to at least partially solve the technical problems set forth above.
(II) technical scheme
According to one aspect of the present disclosure, there is provided a heat sink device of an all-angle LED projector, comprising: the light source substrate is used for bearing the LED chip; the light source surface is recessed into the radiator, the side wall of the light source surface extends towards the light projection direction, and the light source substrate is arranged at the recessed position of the light source surface and is attached to the first surface of the light source surface; a heat conducting material which is jointed with the second surface of the light source surface, and the surface of the heat conducting material is provided with micro groove groups for transmitting the heat emitted by the light source substrate to the micro groove groups containing liquid below by heat conduction; the condensing wall surface is connected with the light source surface and the heat conducting material to form a sealed vacuum radiator inner cavity, and working fluid is injected into the radiator inner cavity.
In some embodiments of the disclosure, the heat sink device further comprises: the fins are vertically arranged on the surface of the condensation wall surface and are radially distributed by taking the center of the condensation wall surface as the center.
In some embodiments of the present disclosure, the concave degree of the light source surface meets the requirement of secondary light distribution of the LED light source, and the concave shape is determined according to the heat dissipation requirement of the radiator, the light distribution design of the light source and the liquid injection amounts of different projection angles of the light source.
In some embodiments of the present disclosure, the light source face vertical cross-sectional shape includes an inverted Ω -shape, a rectangle, a trapezoid.
In some embodiments of the present disclosure, the thermally-conductive material is a metallic material or a non-metallic material with high thermal conductivity.
In some embodiments of the present disclosure, the shape of the thermally-conductive material includes a cylinder, a cube, a prism, a pyramid, or a plurality of cylinders, sheets side by side; and is arranged at the center of the inner cavity of the radiator or is deviated to one side according to different projection angles of the light source.
In some embodiments of the present disclosure, the cross-sectional dimension of the thermally-conductive material is greater than or equal to the light source substrate dimension.
In some embodiments of the present disclosure, the micro-groove group formed on the surface of the thermally-conductive material is processed by milling, wire-cut electric discharge machining, electrolytic etching, and high-energy beam lithography.
In some embodiments of the present disclosure, the micro grooves include rectangular, triangular, trapezoidal, and the micro grooves of the micro groove group have a width in the range of 0.05-2 mm, a depth in the range of 0.05-2 mm, and a pitch between adjacent micro grooves in the range of 0.05-5 mm.
In some embodiments of the present disclosure, the thermally-conductive material-to-package hole distance is greater than 1mm; the bottom of the heat conduction material is immersed in the working solution, and when the liquid injection amount is determined, the micro grooves on the surface of the heat conduction material at any angle of the radiator are ensured to be contacted with the liquid; preferably, the bottom of the heat conducting material is immersed in the working fluid for 1-5 mm.
(III) beneficial effects
According to the technical scheme, the radiator device of the full-angle LED projection lamp has at least one of the following beneficial effects:
(1) The defect that the sunflower radiator of the micro-groove group composite phase change heat exchange technology is sensitive to the use direction is overcome through the structural design, and the use requirement of the projection lamp for multi-angle irradiation is met;
(2) The radiator is inwards sunken, and heat is conducted to the liquid immersion area through the heat conducting material, so that the distance from the light source surface to the liquid level can be shortened, the heat transfer distance is reduced, the heat transfer thermal resistance is reduced, and the overall size of the whole lamp needing to be provided with secondary light distribution such as a reflecting cup is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a radiator device of an all-angle LED projector according to a first embodiment of the present disclosure.
Fig. 2 is a three-dimensional cross-sectional view of a heat sink device of the full angle LED projector of fig. 1 in a first embodiment of the disclosure.
Fig. 3 is a top view of a heat sink apparatus of the full angle LED projector of fig. 1 in a first embodiment of the disclosure.
Fig. 4 is a schematic structural diagram of a radiator device of an all-angle LED projector according to a second embodiment of the present disclosure.
Fig. 5 is a schematic structural diagram of a radiator device of an all-angle LED projector according to a third embodiment of the disclosure.
Fig. 6 is a schematic diagram of another structure of a radiator device of an all-angle LED projector according to a third embodiment of the disclosure.
[ in the drawings, the main reference numerals of the embodiments of the present disclosure ]
1. A fin; 2. light source surface
3. A light source substrate; 4. condensation wall
5. An inner cavity of the radiator; 6. heat-diverting material
Detailed Description
The invention provides a radiator device suitable for a high-power full-angle LED projection lamp, which comprises an external fin, a light source surface recessed into the radiator, a condensation wall surface formed by an inner cylinder and a heat conduction material with high heat conductivity coefficient. The heat generated by the LED light source chip is transmitted to the light source surface which is concave inwards through the light source substrate, the heat is dredged to the liquid-containing area at the lower part of the radiator through the high heat conduction dredging material, the micro-groove group structure is arranged on the side surface of the high heat conduction dredging material, the liquid climbs by means of capillary force, high-strength evaporation and boiling are carried out after the liquid is heated, and the heat is transmitted to the external fins of the radiator after the condensation wall surface of the steam is condensed and is dissipated to the environment by means of natural convection.
For the purposes of promoting an understanding of the principles and advantages of the disclosure, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same.
Certain embodiments of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments are shown. Indeed, various embodiments of the disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements.
In a first exemplary embodiment of the present disclosure, a heat sink suitable for high power full angle LED projector is provided. Fig. 1 is a schematic structural diagram of a radiator device of an all-angle LED projector according to a first embodiment of the present disclosure. Fig. 2 is a three-dimensional cross-sectional view of a heat sink device of the full angle LED projector of fig. 1 in a first embodiment of the disclosure. Fig. 3 is a top view of a heat sink apparatus of the full angle LED projector of fig. 1 in a first embodiment of the disclosure. As shown in fig. 1-3, the heat sink device of the full angle LED projector of the present disclosure includes: the following describes each component of the radiator device of the full-angle LED projection lamp according to the present embodiment in detail:
the light source substrate 3 is used for carrying the LED chip, and is made of aluminum or ceramic, and has two main functions, one is a flat platform with certain rigidity required for packaging the LED chip, and the other is for transmitting heat emitted by the LED chip.
A light source surface 2 recessed toward the inside of the radiator, a light source substrate 3 disposed in the recess of the light source surface, a first surface bonded to the LED light source substrate 3, and a side wall extending in a direction opposite to the light projection direction; preferably, the light source surface 2 is made of aluminum alloy and copper alloy. The light source surface 2 is arranged between the light source substrate 3 and the heat conducting material 6 and is used as a part of the inner cavity 5 of the radiator, so that a vacuum inner cavity is formed conveniently, and the purpose of minimizing non-condensable gas (such as nitrogen, oxygen, CO2 and the like in the air) in the inner cavity is achieved; the light source substrate 3 is attached to the light source surface 2, and can transfer heat to the heat conducting material, and screw holes for mounting a light source gland, a lens gland, a reflecting cup and the like of the whole lamp are also formed in the light source surface. The degree of the concave of the light source surface 2 in the radiator is required to meet the requirement of secondary light distribution of the LED light source, the concave shape can be determined according to the heat dissipation requirement of the radiator, the light distribution design of the light source and the liquid injection amount of different light source projection angles, and the shape of the inward concave section comprises inverted omega, rectangle, trapezoid and the like; the concave position can be used for installing the reflecting cup, so that the length of the dredging material is reduced, the heat transmission distance and the heat resistance are reduced, the heat transmission capacity of the light source is improved, and the length and the overall dimension of the whole lamp are reduced;
in the radiator device suitable for the high-power LED projection lamp in the embodiment, the inward concave light source surface 2 is of a horn mouth shape, and the inward concave section is of a trapezoid shape. The device is suitable for upward irradiation and irradiation at a certain angle, because the inclination angle is too large, or when downward irradiation is used, a large liquid injection amount is needed to meet the full-angle use requirement.
A heat conducting material 6, which is jointed with the second surface of the light source surface 2, and the surface of which is provided with micro-groove groups, has stronger heat conducting capability and is used for transmitting the heat emitted by the light source to the micro-groove groups of the liquid below through heat conduction; the heat conducting material is a metal material with high heat conductivity coefficient, such as copper, copper alloy and the like, and the non-metal material is a high heat conductivity graphite and the like. The shape of the heat conducting material 6 can be a cylinder, a cube, a prism, a pyramid, etc., or a mode of arranging a plurality of cylinders and sheets side by side; preferably, the cross-sectional dimension of the thermally-conductive material is generally greater than or equal to the light source substrate dimension.
The micro-groove group formed on the surface of the heat-dredging material can be processed by milling, wire-cut electric discharge machining, electrolytic etching, high-energy beam photo-etching and the like. The width of the micro-channels of the micro-channel group is in the range of 0.05-2 mm, the depth is in the range of 0.05-2 mm, and the distance between adjacent micro-channels is in the range of 0.05-5 mm. The micro grooves are rectangular, triangular, trapezoidal, etc.
The condensation wall surface 4 is cylindrical and is connected with the light source surface 2 and the heat conducting material 6 to form a sealed radiator inner cavity 5, the radiator inner cavity 5 is provided with a packaging hole, and the inside of the radiator inner cavity is filled with working fluid; vacuumizing the inner part of the inner cavity 5 of the radiator to remove non-condensable gas; the bottom of the heat conducting material 6 is immersed in the working solution to a height of 1-5 mm, and the length of the heat conducting material 6 is designed so as not to influence the encapsulation of the encapsulation holes, and the distance from the heat conducting material to the encapsulation holes is larger than 1mm. As the surface of the heat dredging material 6 is provided with micro-channels, the working fluid climbs by capillary force of the micro-channels, high-strength heat taking is carried out by means of a micro-channel group composite phase change heat exchange technology, and heat is transferred into steam in the form of vaporization latent heat; preferably, the liquid injection amount is determined so as to ensure that the radiator is at any angle, and each micro groove on the surface of the heat conducting material is contacted with liquid or most micro grooves can be contacted with liquid; the fins 1 are vertically arranged on the surface of the condensation wall surface 4 and are radially arranged with the center of the condensation wall surface 4 as the center.
When the projection lamp irradiates upwards, heat generated by the light source substrate 3 is dredged to the bottom end of the heat dredging material 6 through the heat dredging material 6, the bottom end part of the heat dredging material 6 is immersed in liquid, the liquid climbs a certain height along a micro groove group on the surface of the heat dredging material 6 through capillary force, the heat is taken away through high-strength evaporation of a meniscus thin liquid film region of a micro groove group composite phase change heat exchange technology, the steam is condensed on the condensation wall surface 4, and the heat is guided out to the fins 1 and is dissipated into the air through natural convection.
So far, the description of the radiator device of the full-angle LED projection lamp in the first embodiment of the disclosure is completed.
In a second exemplary embodiment of the present disclosure, a heat sink apparatus for an all-angle LED projector is provided. Fig. 4 is a schematic structural diagram of a radiator device of an omnidirectional LED projector according to a second embodiment of the present disclosure. As shown in fig. 4, the difference from the first embodiment is that the cross-section of the light source surface 2 recessed inwards is rectangular, and compared with the first embodiment, the radiator of the present embodiment has a smaller upper space inside, preferably, the gap between the upper part of the radiator cavity and the cross-section of the light source surface is greater than 5mm, and when the projection lamp irradiates downwards, the design scheme of the present embodiment satisfies the requirement of irradiating downwards with a relatively small liquid injection amount.
For the sake of brevity, any description of the technical features of embodiment 1 that can be applied identically is incorporated herein, and the same description is not repeated.
So far, the description of the radiator device of the full-angle LED projection lamp in the second embodiment of the disclosure is completed.
In a third exemplary embodiment of the present disclosure, a heat sink apparatus for an all-angle LED projector is provided. Fig. 5 and 6 are schematic structural diagrams of a radiator device of an all-angle LED projector according to a second embodiment of the disclosure. As shown in fig. 5 and 6, the difference between the first and second embodiments is that the heat conducting material 6 is biased to one side, and in particular, the joint surface of the heat conducting material 6 and the light source surface 2 may be arranged offset from the joint surface of the light source substrate 3 and the light source surface 2, and a part of the upper surface of the heat conducting material 6 may be used to join the light source surface 2. The radiator has the advantages that when the radiator is used obliquely (the side which is required to be biased towards the heat conducting material 6 is inclined), liquid can easily contact the heat conducting material 6, compared with the central design of the heat conducting material 6 in the first embodiment and the second embodiment, the design can reduce the liquid injection amount, or the liquid can more easily contact the heat conducting material 6 under the condition of the same liquid injection amount, and the heat taking capacity is high.
So far, the description of the radiator device of the full-angle LED projection lamp in the third embodiment of the present disclosure is completed.
Because the radiator of this disclosure includes external fin, to the light source face of the recess in the radiator, the condensation wall face of constituteing by the inner tube and possess the heat of high coefficient of heat conductivity and dredge the material, the heat that the LED produced can be transmitted to the light source face of inwards recess through the light source base plate, dredge the material through high heat conductivity and dredge the heat and dredge the material and lead the lower part liquid-containing area of radiator, the micro groove crowd structure is offered to the side of high heat conductivity and dredge the material, liquid relies on capillary force to climb, carry out high strength evaporation and boiling after being heated, steam carries out heat conduction to the external fin of radiator and relies on natural convection to scatter and disappear in the environment after condensation of condensation wall face. Therefore, the radiator device solves the problem that the sunflower radiator adopting the micro-groove group composite phase change heat exchange technology is sensitive to the use direction and even the radiator fails when the LED lamp irradiates upwards.
Thus, embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It should be noted that, in the drawings or the text of the specification, implementations not shown or described are all forms known to those of ordinary skill in the art, and not described in detail. Furthermore, the above definitions of the elements and methods are not limited to the specific structures, shapes or modes mentioned in the embodiments, and may be simply modified or replaced by those of ordinary skill in the art.
It should be further noted that, the directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the drawings, and are not intended to limit the scope of the present disclosure. Like elements are denoted by like or similar reference numerals throughout the drawings. Conventional structures or constructions will be omitted when they may cause confusion in understanding the present disclosure.
And the shapes and dimensions of the various elements in the drawings do not reflect actual sizes and proportions, but merely illustrate the contents of the embodiments of the present disclosure. In addition, in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.
Unless otherwise known, numerical parameters in this specification and the appended claims are approximations that may vary depending upon the desired properties sought to be obtained by the present disclosure. In particular, all numbers expressing quantities of ingredients, reaction conditions, and so forth used in the specification and claims are to be understood as being modified in all instances by the term "about". In general, the meaning of expression is meant to include a variation of + -10% in some embodiments, a variation of + -5% in some embodiments, a variation of + -1% in some embodiments, and a variation of + -0.5% in some embodiments by a particular amount.
Furthermore, the word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.
Those skilled in the art will appreciate that the modules in the apparatus of the embodiments may be adaptively changed and disposed in one or more apparatuses different from the embodiments. The modules or units or components of the embodiments may be combined into one module or unit or component and, furthermore, they may be divided into a plurality of sub-modules or sub-units or sub-components. Any combination of all features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or units of any method or apparatus so disclosed, may be used in combination, except insofar as at least some of such features and/or processes or units are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Also, in the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware.
Similarly, it should be appreciated that in the above description of exemplary embodiments of the disclosure, various features of the disclosure are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various disclosed aspects. However, the disclosed method should not be construed as reflecting the intention that: i.e., the claimed disclosure requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single foregoing disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this disclosure.
While the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be understood that the foregoing embodiments are merely illustrative of the invention and are not intended to limit the invention, and that any modifications, equivalents, improvements, etc. that fall within the spirit and principles of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (10)
1. A heat sink apparatus for an upwardly directed LED projector, comprising:
a light source substrate (3) for carrying the LED chips;
the light source surface (2) is recessed into the condensation wall surface of the radiator device, the recessed shape of the light source surface (2) meets the requirement of secondary light distribution of the LED chip, and the light source substrate (3) is arranged at the recessed position of the light source surface (2) and is attached to the first surface of the recessed position of the light source surface (2);
a heat-conducting material (6) which is jointed with the second surface of the concave part of the light source surface (2), the surface of the heat-conducting material is provided with micro-groove groups, the bottom of the heat-conducting material (6) is immersed in the working liquid, and when the liquid injection amount is determined, the micro-grooves on the surface of the heat-conducting material at any angle of the radiator device can be ensured to be contacted with the liquid;
the cylindrical condensation wall surface (4) is connected with the light source surface (2), the heat conducting material (6) and the bottom surface of the radiator device to form a radiator inner cavity (5) with sealed vacuum, and working fluid is injected into the radiator inner cavity (5).
2. The heat sink device of claim 1, further comprising:
the fins (1) are vertically arranged on the surface of the condensation wall surface (4) and are radially distributed by taking the center of the condensation wall surface (4) as the center.
3. The radiator device according to claim 1, wherein the shape of the recess of the light source surface (2) is determined according to the heat radiation requirement of the radiator and the light distribution design of the light source.
4. The heat sink device according to claim 1, the light source face (2) vertical cross-sectional shape comprising an inverted Ω -shape, a rectangle or a trapezoid.
5. Radiator arrangement according to claim 1, wherein the heat-diverting material (6) is a metallic or non-metallic material with a high heat conductivity.
6. The radiator device according to claim 1, the shape of the heat-diverting material (6) comprising a cylinder, a cube, a prism, a pyramid, or in a plurality of cylinders, sheets side by side; and is arranged at the center of the inner cavity (5) of the radiator or is deviated to one side according to different projection angles of the light source.
7. The heat sink device according to claim 1, the cross-sectional dimension of the thermally-conductive material (6) being greater than or equal to the light source substrate dimension.
8. The heat sink device according to claim 1, wherein the group of micro grooves formed in the surface of the thermally conductive material (6) is processed by milling, wire-cut electric discharge machining, electrolytic etching or high-energy beam lithography.
9. The heat sink device of claim 1, the micro grooves comprising a rectangular shape, a triangular shape, a trapezoidal shape, the micro grooves of the micro groove group having a width in the range of 0.05 to 2mm, a depth in the range of 0.05 to 2mm, and a pitch of adjacent micro grooves in the range of 0.05 to 5mm.
10. The heat sink device according to claim 1, wherein the heat sink inner cavity (5) is provided with an encapsulation hole, the heat-conducting material (6) being at a distance of more than 1mm from the encapsulation hole; the bottom of the heat dredging material (6) is immersed in the working solution for 1-5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711276073.3A CN109882810B (en) | 2017-12-06 | 2017-12-06 | Radiator device of full-angle LED projection lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN101561128A (en) * | 2009-05-27 | 2009-10-21 | 王治效 | Super-power direct-cooling radiator for semiconductor lighting source substrate |
| CN101666433A (en) * | 2009-08-27 | 2010-03-10 | 符建 | High power LED source for heat conduction by using room temperature liquid metal |
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| CN207610175U (en) * | 2017-12-06 | 2018-07-13 | 中国科学院工程热物理研究所 | Radiator device for full-angle LED projection lights |
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| CN101561128A (en) * | 2009-05-27 | 2009-10-21 | 王治效 | Super-power direct-cooling radiator for semiconductor lighting source substrate |
| CN101666433A (en) * | 2009-08-27 | 2010-03-10 | 符建 | High power LED source for heat conduction by using room temperature liquid metal |
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