CN100366414C - Resin sealing molding device - Google Patents

Abstract

A resin encapsulation molding device in which a loader unit (800) and a taker unit (900) are radially arranged and integrated so that they can be mutually centered around the rotation axis (702) of the carrier unit (700). An angle of 90 degrees is formed, and the support is integrally rotatable around the rotation axis (702) of the carrier unit (700). By adopting the present invention, it is easy to carry out a small amount of multi-variety production, variable production, low cost and small size.

Description

Resin sealing molding device

technical field

The present invention relates to a resin molding device for sealing and molding an electronic component, especially a chip-shaped semiconductor device (hereinafter referred to as a semiconductor chip), together with a substrate on which the semiconductor chip is mounted, using a resin material.

Background technique

In recent years, electronic devices such as personal computers, mobile phones, digital cameras, and home appliances have tended to demand more specialized electronic components in order to differentiate them more clearly from competing products. In addition, shortening the development cycle of new products, lowering the price, and increasing the number of functions increase the need for purchase and replacement, resulting in a shortened lifespan of electronic equipment. Therefore, the production of electronic components needs to be low-volume, high-variety, energy-variable production.

In addition, in response to miniaturization, diversification, and cost reduction of electronic equipment in recent years, high-density mounting, multifunctionality, and low cost are required for electronic components used in these electronic equipment. As a result, a group of so-called CSP (Chip Size Package) components (FBGA, FLGA, SON, QFN, etc.) have been developed that have progressed in miniaturization, thinning, and increased sales of resin-sealed semiconductor devices. As a manufacturing method for these module groups, a method in which a large number of semiconductor elements are arranged on one side of a substrate and electrically connected, sealed together with resin, and then cut and separated along the periphery of each module to obtain a single module MAP method (MatrixArray Packaging Method). In this manufacturing method, for example, 1,000 semiconductor chips are mounted on one substrate, and 1,000 semiconductor chips can be resin-sealed in one resin molding process.

However, in the work of electrically connecting semiconductor chips mounted on substrates with high density, the traditional wire bonding method takes too long to wire bond each substrate, and sometimes only a few pieces can be produced in an hour. . Therefore, there is a problem that the standby time of the resin sealing and molding apparatus is too long in order to resin seal several substrates.

In response to these problems, in recent years resin encapsulation molding devices, there is a structure as shown in Figure 14, in order to be able to produce a small amount of multiple varieties and variable production, the molding unit of the smallest constituent unit can be increased or decreased (for example, refer to Patent Document 1: Patent No. 2932136).

That is, it includes: a lead frame supply unit 1 before resin sealing on which electronic components are mounted; a lead frame arrangement unit 2 for arranging the lead frames before resin sealing in a predetermined direction; a resin sheet supply unit 3; The resin sheet unloading unit 4 that carries out the arrangement of materials; the molding unit 5 that resin-encapsulates and molds electronic components; the carrier unit 6 that transfers the arranged lead frames and resin sheets toward the molding unit 5; The taker unit 7 for taking out the formed resin-sealed lead frame; the cleaner unit 8 for the metal mold; the transfer unit 9 for transferring the resin-sealed lead frame; The gate removing unit 10 for removing the gate of the lead frame; the pick-up unit 11 for clamping the lead frame 1 after the gate is removed and the resin sealing is completed; the lead frame after sealing each resin after the gate is clamped A lead frame storage unit 12 individually housed in each magazine; and a controller unit 13 for continuously and automatically controlling the operations of the above-mentioned units, and the like.

In addition, there is a resin sealing molding device shown in FIG. 15 as a resin sealing molding device that can produce a small amount of multiple varieties without increasing or decreasing the molding unit (for example, refer to Patent Document 2: Japanese Patent Laid-Open No. 9-314612 Bulletin).

That is, the resin encapsulation molding apparatus includes: a material loading unit 22 for loading the unmolded lead frame 21; and a lead frame preheating unit for preheating the unmolded lead frame 21 supplied from the material loading unit 22. Section 23; the alignment section 24 of the pre-molding lead frame; the supply mechanism 26 of the resin sheet that supplies the resin sheet 25; the alignment section 27 of the resin sheet that arranges the resin sheet 25 supplied from the supply mechanism 26; The resin encapsulation molding part 28 (metal mold for resin encapsulation molding) for encapsulating and molding the electronic components mounted on the pre-molding lead frame 21 with a resin material; The material supply mechanism 29 (loader) that transfers the front lead frame 21 and the resin sheet 25 to the predetermined position of the above-mentioned resin sealing molding part 28; Lead frame 30) Molded product storage part 31 for housing; Resin molded part cutout part 33 for cutting unnecessary resin molded part 32 (unnecessary cured product) connected to the above-mentioned molded part as a product (Gate cut-off part): The molding that transfers the molded article 30 and the unnecessary resin molded body 32 to the above-mentioned unnecessary resin molded body cut-off part 33 and transfers the molded article 30 to the molded article storage part 31 for storage. A piece transfer mechanism 34 (feeder); a cleaning mechanism 35 for cleaning the mold surface of the above-mentioned metal mold; and a control mechanism 36 for automatically controlling the above-mentioned various parts and mechanisms.

The resin encapsulation molding device of Patent Document 1 has a structure that separately drives a carrier unit that transfers the lead frame and resin sheet to the molding unit, and a reclaimer unit that takes out the molded lead frame after resin encapsulation. In addition, the transfer unit and the pick-up unit are separated from the above-mentioned carrier unit and the reclaimer unit and driven separately. Therefore, each unit requires an independent and expensive drive mechanism and drive device.

In addition, when switching the type of each unit, mutual adjustment is troublesome and time-consuming. Furthermore, in the above-mentioned resin sealing device, in order to be able to cope with mass production, the molding unit is detachable, so there is a problem that it is difficult to downsize the entire device from a structural point of view.

In addition, in the resin sealing molding device of Patent Document 2, the material supply mechanism (loader) and molded article transfer mechanism (taker) are separately driven, so expensive drive mechanisms and drive devices are required respectively.

In addition, since the pre-molding lead frame, the material supply mechanism, and the molded product transfer mechanism are arranged on the front side of the resin encapsulation molding apparatus, the entire apparatus becomes long, making it difficult to downsize.

In view of this, it is an object of the present invention to provide a low-cost, compact resin encapsulation molding device that is easy to produce a small amount of multiple varieties, variable production, and low cost.

Contents of the invention

In order to achieve the above object, the resin sealing molding device of the present invention includes: a punching unit; a molded article supply unit for supplying the molded article; a resin material supply unit for supplying the resin material; a loader unit for supplying the molded article to the punching unit ; A reclaimer unit for taking out a resin-sealed molded part from the stamping unit; and a molded part receiving unit for receiving a resin-sealed molded part, wherein the loader unit and the reclaimer The units are radially arranged and integrated to form an angle of 90 degrees with each other around a rotation axis, and the loader unit and the taker unit are supported so as to be centered on the rotation axis Rotate in one piece.

According to the present invention, since the loader unit and the unloader unit have an angle of 90 degrees, they can integrally rotate around the rotation axis. Therefore, it is not necessary to provide an expensive driving mechanism and a driving device on the loader and the unloader, respectively, and the resin sealing molding device can be manufactured at low cost.

Due to the integrated structure of the loader unit and the unloader unit, it is possible to obtain a compact resin sealing molding device with a smaller footprint than the conventional technology.

As an embodiment of the present invention, the formed product supply unit, the press unit, and the formed product storage unit may be sequentially arranged at angular intervals of 90 degrees around the rotation axis.

In this embodiment, the same applies to the loader and the unloader, and the units are sequentially arranged at angular intervals of 90 degrees. Therefore, different units can perform operations at the same time, and a resin sealing molding device with high operation efficiency can be obtained.

As another embodiment, the molded article may be conveyed from the molded article supply unit to the press unit by a loader, and the resin-sealed molded article may be conveyed from the press unit to the molded article storing unit by a reclaimer.

In this embodiment, only the loader is used to convey the molded article from the molded article supply unit to the press unit, and only the reclaimer is used to convey the resin-sealed molded article from the press unit to the molded article storage unit. Therefore, there is no need to provide a separate transfer mechanism, the type switching operation is simple, and an inexpensive and compact resin sealing molding device can be obtained.

As another embodiment, it is also possible to sequentially arrange the workpiece supply unit, the press unit, and the gate removal unit at angular intervals of 90 degrees around the rotation axis, and the gate removal unit seals the resin after molding Parts and unwanted resin are separated. In addition, the molded part supply unit, the press unit, the gate removal unit that separates the resin-sealed molded part from the unnecessary resin, and the molded part storage unit are also available at 90 degrees around the axis of rotation. The angular intervals are configured sequentially.

In this embodiment, the same applies to the loader and the unloader, and the units are sequentially arranged at angular intervals of 90 degrees. Therefore, different units can simultaneously perform operations including the operation of separating unnecessary resin, and a resin sealing molding device with higher operation efficiency can be obtained.

As a new embodiment, the molded article may be conveyed from the molded article supply unit to the press unit by the loader, and the resin-sealed molded article may be conveyed from the press unit to the gate removal unit by the picker.

In addition, it is also possible to transfer the molded article from the molded article supply unit to the press unit by using the loader, and convey the resin package from the press unit to the gate removal unit and from the gate removal unit to the molded article storage unit by using the unloader. After the forming part.

In this embodiment, the molded article is conveyed from the molded article supply unit to the press unit using only the loader, and is stored from the press unit to the gate removing unit and/or from the gate removing unit to the molded article only using the unloader. The unit transports molded parts sealed with resin. Therefore, there is no need to provide a separate transfer mechanism, the type switching operation is simple, and an inexpensive and compact resin sealing molding device can be obtained.

As a different embodiment, the molded material supply unit and the resin material supply unit may be arranged so as to form an angle of 90 degrees with each other around the rotation axis.

In this embodiment, since the molded article and the resin material can be supplied from different positions, it is possible to obtain a resin-sealed molding device with a large degree of design freedom.

As another embodiment, a mold cleaner may be provided at a position adjacent to the press unit.

In this embodiment, an inexpensive and small resin-sealed molding device equipped with a mold cleaner can be obtained.

As a supplementary embodiment, the resin material delivery position of the resin material supply unit that supplies the resin material can also be set at any one of the molded part supply unit, the stamping unit, the gate removal unit, and the molded part storage unit. Between the rotation axis of the feeder unit and the reclaimer unit.

In this embodiment, since the resin material delivery position can be arranged at a desired position as needed, a resin sealing molding device having a large degree of design freedom can be obtained.

Description of drawings

FIG. 1 is a plan cross-sectional view showing an embodiment of a semiconductor device resin molding apparatus according to the present invention.

FIG. 2 is a side view showing the semiconductor device resin molding apparatus shown in FIG. 1 .

Fig. 3 is a detailed top sectional view showing the loader unit.

Fig. 4 is a sectional view showing part A-A of the loader unit shown in Fig. 3 . However, the reclaimer is in a forward state.

Fig. 5 is a cross-sectional view showing part B-B of the loader unit shown in Fig. 3 . However, the reclaimer is in a forward state.

FIG. 6 is a process explanatory view showing the semiconductor device resin encapsulation molding apparatus according to the present embodiment, showing a state where each unit is at the origin position.

FIG. 7 is an explanatory view showing the steps of the semiconductor device resin encapsulation molding apparatus according to the present embodiment.

FIG. 8 is a process explanatory view showing the semiconductor device resin encapsulation molding apparatus according to the present embodiment.

FIG. 9 is an explanatory view showing the steps of the semiconductor device resin encapsulation molding apparatus according to the present embodiment.

FIG. 10 is an explanatory view showing the steps of the semiconductor device resin encapsulation molding apparatus according to the present embodiment.

FIG. 11 is an explanatory view showing the steps of the semiconductor device resin encapsulation molding apparatus according to the present embodiment.

FIG. 12 is an explanatory view showing the steps of the semiconductor device resin encapsulation molding apparatus according to the present embodiment.

Fig. 13 is an explanatory view showing the steps of the semiconductor device resin encapsulation molding apparatus according to the present embodiment.

FIG. 14 is a plan view showing a resin encapsulation molding apparatus of Patent Document 1 as a conventional example.

FIG. 15 is a plan view showing a resin sealing molding apparatus of Patent Document 2 as a conventional example.

Detailed ways

Embodiment 1 of the present invention is applied to a semiconductor device resin encapsulation molding apparatus 100 as shown in FIGS. 1 to 13 .

The semiconductor device resin encapsulation molding apparatus 100 is shown in FIG. 1 and FIG. 2, including: a substrate supply unit 101; a sheet material supply unit 200 (FIG. 2); a stamping unit 300; a metal mold cleaning unit 400; a gate removal unit 500; a forming part storage unit 600; and a carrier unit 700.

The substrate supply unit 101 , the press unit 300 , the gate removal unit 500 , and the molded article receiving unit 600 are sequentially arranged in a clockwise direction around the rotation axis 702 of the carrier unit 700 shown in FIG. 4 .

The sheet supply unit 200 is arranged below the carrier unit 700 , and the sheet shuttle 202 of the sheet supply unit 200 is arranged between the press unit 300 and the carrier unit 700 . Also, the mold cleaning unit 400 is disposed adjacent to the punching unit 300 .

The substrate supply unit 101 is composed of a cassette lifter 102 , a substrate feeding mechanism 103 , and a preheater 104 as shown in FIGS. 1 and 2 .

That is, the cassette lifter 102 is equipped with a feed cassette 106 that accommodates a plurality of substrates 105 before being molded, that is, a plurality of substrates 105 before resin sealing, and the substrate feeding mechanism 103 takes out a substrate before resin sealing from the feed cassette 106. 105 makes one substrate rise. The substrate 105 before resin sealing in the feed box 106 is clamped by the chuck 107 of the substrate feeding mechanism 103 , and the take-out position is determined on the preheater 104 . The preheater 104 is vertically movable by an air cylinder or the like, and ascends when the substrate 105 before resin sealing is delivered to the loader unit 800 described later. The substrate supply unit 101 is not limited to the method of supplying the substrate 105 before resin sealing from the cassette 106 as in the present embodiment, and may automatically supply the substrate 105 from a process before the resin sealing process, etc., using a conveyor belt or the like.

The width and length of each component of the substrate supply unit 101 can be appropriately changed according to the type of the substrate 105 . In addition, when the preheater 104 is not provided, only a guide rail or the like for guiding when taking out the substrate 105 before resin sealing from the feed cassette 106 may be provided.

The sheet supply unit 200, as shown in FIGS. 1 and 2, is used to fill the resin material for sealing, that is, a plurality of sheets 203, from the ball feeder 201 to the sheet reciprocating shuttle 202, and the sheets 203 are described later. The loader 800 is handed over. The sheet shuttle 202 can reciprocate in a direction perpendicular to the paper surface at a sheet transfer position 204 ( FIG. 1 ) to the loader 800 . Furthermore, the sheet reciprocating shuttle 202 can be appropriately replaced according to the interval between the tanks 306 of the lower mold 301 and the external dimensions of the sheet 203 described later. In addition, the supply mechanism of the sheet|seat 203 is not limited to a ball feeder, Various methods, such as a magazine method and an air pressure feeding method, can be used.

The press unit 300 is composed of an upper die 302 and a lower die 301 as shown in FIGS. 1 and 2 . In particular, as shown in FIG. 2 , the lower die 301 is mounted on the movable platen 303 , while the upper die 302 is mounted on the upper fixed platen 304 . The movable platen 303 and the upper fixed platen 304 are supported on four connecting rods 305 .

Therefore, the movable platen 303 slides vertically along the connecting rod 305 by a known mold opening and closing mechanism. Furthermore, a plurality of tanks 306 into which the sheet 203 is injected are provided on the lower die 301 . A plunger (not shown) for pressurizing the sheet is accommodated in the tank 306 so as to be movable up and down by a known transport mechanism.

The lower mold 301, the upper mold 302, and the plunger can be appropriately replaced according to the types of the substrate 105 and the sheet 203.

The mold cleaning unit 400 is shown in Figure 1. After the resin-sealed substrate 901 and unnecessary resin 902 (Figure 10) are removed from the lower mold 301 by using the picker unit 900 described later, it enters the mold opening process. between the upper mold 302 and the lower mold 301. Use the brush 401 to clean and vacuum the mating surfaces of the upper mold 302 and the lower mold 301 to clean the mating surfaces. It is also possible to carry out the above-mentioned cleaning operation while blowing air on the mating surface.

The gate removing unit 500 is, as shown in FIG. 1 , a unit for separating the resin-sealed substrate 901 obtained from the picker unit 900 described later from the unnecessary resin 902 . A waste box 501 is provided below the gate removal unit 500, and unnecessary resin 902 can be disposed of. The gate unit 500 can cope with resin-sealed substrates 901 and unnecessary resin 902 having various shapes by replacing each component. In addition, the gate removal unit 500 may not be provided, and the resin-sealed substrate may be automatically separated from unnecessary resin in the mold. In this case, the gate removing unit 500 is unnecessary, and instead of the gate removing unit 500 , a substrate correcting unit for correcting warpage of the substrate 901 may be provided by sandwiching the resin-sealed substrate 901 .

As shown in FIG. 1, the molded part storage unit 600 is a unit that receives resin-sealed substrates 901 from the reclaimer unit 900 and performs storage. A discharge unit for stacking and storing resin-sealed substrates 901 can be provided. Box 601. However, the output box 601 is not limited to the form in which the resin-sealed substrates 901 are stacked and stored as in the present embodiment, and a method of sliding and storing the resin-sealed substrates from the side of the material box can also be used. form. In addition, the method of storing molded parts is not limited to the method of storing them in the discharge box, and a molded part storage unit equipped with a conveying mechanism such as a conveyor belt to automatically transport to the outside of the resin sealing device can also be used.

The loader unit 700 is composed of a rotating part 701 , a loader unit 800 , and a reclaimer unit 900 as shown in FIGS. 1 to 6 . In particular, the above-mentioned rotating part 701 , which is integrally suspended by joining the loader unit 800 and the unloader unit 900 in a substantially L-shape, can be rotatably supported around the rotation axis 702 .

As shown in FIG. 4 , the rotating unit 701 is composed of a base plate 703 , an upper plate 704 , a rotating shaft 705 , and a unit base plate 718 .

The base plate 703 is attached to the frame 108 of the semiconductor device resin encapsulation molding apparatus 100 , and the upper plate 704 is attached to the lower portion of the base plate 703 via a support post 707 . A bearing seat 708 is fixed on the lower part of the upper plate 704 , and the rotating shaft 705 is rotatably installed inside the bearing seat through a bearing 709 . A synchronous pulley 710 is installed on the top of the rotating shaft 705, and a rotating plate 711 is installed on its lower part, which is connected with the synchronous pulley 713 by a synchronous belt 712 at the same time. The timing pulley 713 is mounted on a rotating shaft 716 of a servo motor 715 fixed to a bracket 714 of the upper plate 704 .

Therefore, the rotational force of the servo motor 715 rotates the rotating plate 711 through the timing pulley 713, the timing belt 712, the timing pulley 710, and the rotation shaft 705, thereby rotating the carrier unit 700 around the rotation shaft 702.

A unit base plate 718 is attached to the lower part of the rotating plate 711 via a support column 717 . The loader 800 and the unloader 900 are respectively installed on the upper and lower surfaces of the unit base plate 718, forming an angle of 90 degrees to each other.

As shown in FIGS. 3 and 5 , the loader 900 is a unit that transports the substrate 105 and sheet 203 before resin sealing to the lower mold 301 , and is composed of a carrying unit 801 and a slide unit 850 . The sliding unit 850 can reciprocate in a direction perpendicular to the rotation axis 702 .

In the carrying-in unit 801 , a connecting block 803 is attached to one side of a sheet seat 802 for storing sheets 203 , and a slide shaft 804 is fixed to the other side. The protruding pin 866 is guided by an unillustrated guide mechanism, and is attached to the upper portion of the sheet holder 802 so as to be movable up and down while the tip is inserted from the upper portion of the sheet insertion hole 813 . In addition, a pin hole 868 communicating with the sheet insertion hole 813 is provided below the connecting block 803 installed on the side surface of the sheet seat 802. The stopper pin 862 is guided by a guide mechanism not shown, and is installed so that the front end is inserted into the pin hole 868. In the state of being inside, the sheet insertion hole 813 can be inserted and withdrawn. On the side opposite to the side fixed to the sheet seat 802 of the slide shaft 804 , a connection block 805 is attached. A pair of rods 807 are attached to the slide shaft 804 through bushes 806 . Chuck claws 808 for clamping the substrate 105 before resin sealing are attached to the side surfaces of the rod 807 , and pins 809 are attached to the top. Protrusions 810 that can be slidably fitted to a connection block 859 and a connection block 860 described later are formed on the connection block 803 and the connection block 805 .

The sliding unit 850 is arranged on the upper surface of the unit base plate 718, and can reciprocate in a direction perpendicular to the rotation axis 702, and the above-mentioned loading unit 801 is detachably installed on the front end. The sliding unit 850 is composed of a base plate 851 and a sliding guide rail 852 . A block 853 is erected on the upper portion of the unit base plate 718, and a linear guide 854 (FIG. 3) is mounted on the block 853. The slide rail 852 is fixed on a rod 855 mounted on the upper surface of the base plate 851 and guided by a linear guide 854 .

In addition, an actuator 856 for opening and closing chuck jaws, an index plunger 858 , a connection block 859 , and a connection block 860 are fixed to the lower surface of the base plate 851 . A sheet ejection cylinder 861 is fixed on the upper surface of the base plate 851 . Furthermore, stopper pins 811 are respectively attached to the connection block 859 and the connection block 860 . Furthermore, a sheet stop cylinder 864 is fixed to the side of the connection block 860 via a bracket 863 . Guide grooves 865 are formed on opposing surfaces of the connection block 859 and the connection block 860 . The protrusions 810 of the connecting block 803 and the connecting block 805 of the carrying-in unit 801 can be slidably fitted into the groove 865 .

When the carrier unit 700 is in the state shown in FIG. 1 , the carry-in unit 801 is slid and fitted in the X direction by the slide unit 850 , positioned by the stopper pin 811 , and fixed by the index plunger 858 . The carrying-in unit 801 can be easily and appropriately replaced according to the types of the substrate 105 and the sheet 203 .

When the carry-in unit 801 is connected to the slide unit 850 , the pin 809 attached to the upper portion of the rod 807 of the carry-in unit 801 is engaged with the chuck claw opening and closing actuator 856 . Also, the protruding pin 866 is connected to the sheet ejection cylinder 861 , and the stopper pin 862 is connected to the sheet stopper cylinder 864 . When the chuck claw opening and closing actuator 856 operates, the chuck claw 808 is opened and closed, and the substrate 105 before resin sealing can be held. When the sheet 203 is inserted from the lower side of the sheet seat 802, the sheet stop cylinder 864 is activated to push out the stop pin 862 so that the sheet 203 will not fall. The sheet ejection cylinder 861 ejects the sheet 203 from above, so that the sheet 203 can be reliably dropped into the tank 306 of the lower mold 301 .

Also, a lead screw 870 is mounted parallel to the slide rail 852 on a block 869 mounted on the rod 855 . One end of the threaded rod 870 is connected with a block 872 installed on the unit base plate 718 through a nut 871 . The nut 871 is installed in the nut seat 873 . The above-mentioned nut seat 873 is rotatably installed in the seat block 872 through a bearing 874 . A timing pulley 875 is installed on the nut seat 873, and is connected with a timing pulley 877 by a timing belt 876. The timing pulley 877 is attached to the rotation shaft 721 of the motor 720 of the bracket 719 erected on the upper surface of the unit base plate 718 .

Therefore, the rotational force of the motor 720 rotates the nut 871 through the timing pulley 877, the timing belt 876, the timing pulley 875, and the nut seat 873, and the rotation is converted into a linear reciprocating motion, so that the sliding unit 850 reciprocates.

When the carrier unit 700 rotates, the slide unit 850 moves in the direction of the rotation axis 702 (retreats).

The picker unit 900 is a unit for transporting the resin-sealed substrate 901 and unnecessary resin 902 ( FIG. 10 ) from the lower mold 301 to the gate removal unit 500 as shown in FIGS. 3 to 5 . The resin-sealed substrate 901 separated by the gate removal unit 500 is transported to the discharge box 601 of the molding storage unit 600 , and unnecessary resin 902 is discarded in the waste box 501 .

The unloader 900 has substantially the same structure as the loader 800 , and is composed of a carry-out unit 903 and a slide unit 950 . The sliding unit 950 can reciprocate in a direction perpendicular to the rotation axis 702 .

In the carry-out unit 903, a slide block 906 having a T-shaped cross section is fixed to a manifold block 905 on which a suction pad for vacuum-suctioning unnecessary resin 902 is attached. Moreover, the sliding shaft 907 is fixed on the side of the integrated block 905 . The plate 908 is installed on the opposite side of the integrated block 905 to which the slide shaft 907 is fixed. Additionally, a pair of rods 910 are mounted on slide shaft 907 via bushings 909 (FIG. 3). Chuck claws 911 for gripping the resin-sealed substrate 901 are attached to the side of the lever 910, and pins 912 are attached thereto.

The slide unit 950 is installed under the unit base plate 718, and can reciprocate in a direction perpendicular to the rotation axis 702, and the unloading unit 903 is detachably mounted on the front end. The slide unit 950 is composed of a base plate 951 , slide rails 952 , and a movable plate 953 . A block 954 is erected below the unit base plate 718, and a linear guide 955 (FIG. 3) is attached to the block 954 (FIG. 3). The slide rail 952 is fixed on a block 956 installed on the upper surface of the base plate 951 and guided by a linear guide 955 . A block 957 is erected on the upper surface of the base plate 951 , and a linear guide 958 is attached to the block 957 . On the top of the base plate 951, a movable plate upper and lower air cylinder 959 is installed.

The following of the movable plate 953 is equipped with a guide block 960, a guide block 961, an actuator 962 and a stop pin 963 for opening and closing the chuck jaws. In addition, the plate 964 is installed on the upper surface of the movable plate 953, and passes through the plate 964 and the piston 965 of the upper and lower cylinders 959 of the movable plate. Furthermore, an index plunger 966 is fixed to the upper portion 953 of the movable plate.

The guide rail 967 is fixed on the side of the guide block 960, guided by the linear guide 958, and the movable plate 953 can move up and down.

The sliding block 906 of the carrying-out unit 903 is slidably fitted into a groove 969 having a substantially T-shaped cross section formed by the guide block 960 , the guide block 961 , and the movable plate 953 , and is fixed by an indexing plunger 966 .

When the carrier unit 700 rotates 90 degrees clockwise from the state shown in FIG. Furthermore, the above-mentioned carry-out unit 903 can be easily and appropriately replaced according to the types of substrates and sheets.

When the carry-out unit 903 is connected to the movable plate 953, the pin 912 attached to the upper surface of the rod 910 of the carry-out unit 903 is engaged with the chuck claw opening and closing actuator 962. When the chuck claw opening and closing actuator 962 operates, the chuck claw 911 is opened and closed, and the resin-sealed substrate 901 can be held. In addition, the movable plate 953 can be moved up and down by the operation of the above-mentioned movable plate vertical cylinder 959 . Therefore, after resin sealing molding, the resin-sealed substrate 901 ejected from the lower mold 301 by ejector pins (not shown) can be grasped to absorb unnecessary resin 902 and take it out from the lower mold 301 .

Moreover, the screw rod 971 is installed on the base plate 951 in parallel with the slide guide rail 952 through the bracket 970, and one end of the screw rod 971 is the same as the loader unit 800, and is installed on the bottom of the unit base plate 718 through a nut. Blocks 973 (FIG. 5) connect. The nut is installed on the nut seat. The above-mentioned nut seat is rotatably installed in the block 973 through a bearing. Moreover, the timing pulley 976 is installed on the above-mentioned nut seat, and is connected with the timing pulley 978 through the timing belt 977 . The above-mentioned synchronous pulley 978 is installed on the rotating shaft of the motor 723 , and the motor 723 is fixed on the bracket 722 erected on the lower side of the unit base plate 718 .

Therefore, the rotational force of the motor 723 rotates the nut through the timing pulley 978, the timing belt 977, the timing pulley 976, and the nut seat, and the rotation is converted into a linear reciprocating motion to make the sliding unit 950 reciprocate. When the carrier unit 700 rotates, the slide unit 950 moves toward the rotation axis 702 (retreats).

Next, the operation of the semiconductor device resin encapsulation molding apparatus 100 configured as described above will be described.

The rotation position of the carrier unit 700 shown in FIG. 6 is taken as the origin position (absolute coordinate 0 degrees), and the clockwise direction is taken as the positive direction.

First, as shown in FIG. 7 , from the feed cassette 106 placed on the cassette lifter 102 of the substrate supply unit 101 , the chuck 107 of the substrate feed mechanism 103 grasps the substrate 105 before resin sealing one by one. Live, pull out and locate on the preheater 104. When the substrate 105 before resin sealing is drawn out from the above-mentioned feeding box 106, the magazine lifter 102 just lifts up the size of one substrate, and then the next substrate 105 before resin sealing is in the state of being pulled out. At this time, the sheet holder 802 of the load-in unit 801 of the loader 800 is at the sheet delivery position 204 , and the sheet shaft 202 on which the sheet 203 is loaded of the sheet supply unit 200 is raised to directly below the sheet holder 802 . The sheet 203 mounted on the sheet seat 802 is pushed out with an ejector (not shown), and inserted from the lower opening of the sheet seat 802 . When the sheet 203 is inserted into the sheet seat 802, the sheet stop cylinder 864 is activated to eject the stop pin 862 so that the sheet 203 does not fall from the sheet seat 802 (FIG. 5).

Next, as shown in FIG. 8, the carrier unit 700 is rotated 90 degrees in the counterclockwise direction (absolute coordinates -90 degrees). Then, the slide unit 850 of the loader unit 800 is moved forward so that the carrying-in unit 801 is positioned above the preheater 104 . After the preheater 104 loaded with the substrate 105 before resin sealing is raised, the chuck claw opening and closing actuator 856 is operated, and the substrate 105 before resin sealing is grasped and held by the chuck claw 808 of the loading unit 801 (Figure 5).

Then, the preheater 104 is lowered, the slide unit 850 is moved backward, and the carrier unit 700 is rotated clockwise by 90 degrees (absolute coordinates 0 degrees) as shown in FIG. 9 . The slide unit 850 of the loader unit 800 is moved forward, the carry-in unit 801 is inserted between the opened upper die 302 and the lower die 301 , and it stands by at a predetermined position on the lower die 301 . Then, after raising the lower mold 301 slightly, the chuck claws 808 of the loading unit 801 are opened, and the substrate 105 before resin sealing is placed on the lower mold 301 . Then, the stopper pin 862 is pulled back from the sheet seat 802, the sheet ejection pin 866 is pushed out, and the sheet 203 is thrown into the pot 306 of the lower mold 301.

The substrate 105 before resin sealing is placed on the lower mold 301 , and when the sheet 203 is put into the tank 306 , the lower mold 301 is slightly lowered, and the slide unit 850 of the loader unit 800 moves backward. At this time, the sheet holder 802 of the carry-in unit 801 is at the sheet delivery position 204, and the above-mentioned sheet delivery is performed.

Then, the lower mold 301 is raised to close the mold, the substrate 105 before resin sealing is clamped by the upper mold 302 and the lower mold 301 to form a cavity, and the plunger (not shown) is pushed upward to heat the sheet 203 Melt and fill the cavity with resin.

After the resin filled in the cavity hardens, the lower mold 301 is lowered to open the upper mold 302 and the lower mold 301 . At this time, ejector pins (not shown) of the upper mold 302 are pushed out, and the resin-sealed substrate 901 and unnecessary resin 902 are pushed out toward the lower mold 301 . Then, while the lower mold 301 and the upper mold 302 are opened, as shown in FIG. 10 , the carrier unit 700 is rotated 90 degrees counterclockwise (absolute coordinates −90 degrees). The slide unit 950 of the reclaimer 900 is advanced to enter between the opened upper mold 302 and the lower mold 301 , and the unloading unit 903 is positioned at a predetermined position on the lower mold 301 . Then, ejector pins (not shown) of the lower mold 301 are pushed out to eject the resin-sealed substrate 901 and unnecessary resin 902 from the lower mold 301 , and at the same time, the carry-out unit 903 is lowered. The resin-sealed substrate 901 is gripped by chuck claws 911 , and unnecessary resin 902 is adsorbed by adsorption pads 904 . Then, the carry-out unit 903 is raised, and the slide unit 950 is retracted while holding the resin-sealed substrate 901 and unnecessary resin 902 .

While the slide unit 950 of the reclaimer unit 900 is retreating, the mold cleaning unit 400 cleans the mating surfaces of the upper mold 302 and the lower mold 301, and starts cleaning by vacuum suction.

In addition, while the picker unit 900 is performing the above-mentioned operation, the slide unit 850 of the loader unit 800 is moved forward, and the above-mentioned receiving operation of the substrate 105 before resin sealing is performed.

After the taker unit 900 unloads the resin-sealed substrate 901 and unnecessary resin 902 from the lower mold 301, and the loader 800 receives the resin-sealed substrate 105, as shown in FIG. Rotate 90 degrees clockwise (absolute coordinates 0 degrees). The slide unit 950 of the picker unit 900 is moved forward, and the resin-sealed substrate 901 and unnecessary resin 902 are conveyed to the gate removal unit 500 .

Then, the carry-out unit 903 holding the resin-sealed substrate 901 and unnecessary resin 902 is lowered, and while the chuck claws 911 are opened, the suction of the suction pad 904 is released, and the resin-sealed substrate 901 and unnecessary resin are released. The required resin 902 is placed on the gate removal unit 500 . Then, the carry-out unit 903 is raised, and the slide unit 950 is moved backward.

In addition, immediately after the mold cleaning is completed, the slide unit 850 of the loader 800 is advanced, and the substrate 105 and the sheet 203 before resin sealing are supplied to the lower mold 301 as described above. Perform the same resin sealing work as above.

When the resin-encapsulated substrate 901 is transported from the gate removal unit 500 to the molded part storage unit 600 without using the picker unit 900, the slide unit 950 is retracted to the state shown in FIG. 7, and the above steps are repeated. Actions.

When the slide unit 950 of the picker unit 900 retreats, the gate removing unit 500 separates the resin-sealed substrate 901 from the unnecessary resin 902 , and discards the unnecessary resin 902 in the waste box 501 . After the gate removal unit 500 completes the separation operation, as shown in FIG. 12 , the slide unit 950 of the picker unit 900 is advanced again, and the carry-out unit 903 is lowered. Then, the chuck jaws 911 are closed, and the resin-sealed substrate 901 is grasped and held. Then, the carry-out unit 903 is raised, and the slide unit 950 is retracted.

After the picker unit 900 takes out the resin-sealed substrate 901 from the gate removing unit 500 , as shown in FIG. 13 , the carrier unit 700 is rotated clockwise by 90 degrees (90 degrees in absolute coordinates). Then, the slide unit 950 of the picker unit 900 is advanced, and the carry-out unit 903 is positioned on the upper part of the discharge box 601 provided on the molding storage unit 600 . Then, the chuck jaws 911 are opened, the resin-sealed substrate 901 is stored in the discharge box 601 , and the sliding unit 950 is moved backward.

Next, as shown in FIG. 7 , the carrier unit 700 is rotated 90 degrees counterclockwise (absolute coordinates 0 degrees). Thereafter, the same operation as above is repeated.

In Embodiment 1 described above, the sheet shaft 202 of the sheet supply unit 200 is arranged between the press unit 300 and the carrier unit 700, and the sheet delivery position 204 is provided. Therefore, in the first embodiment, the loader 800 rotates -90 degrees (absolute coordinates -90 degrees) after storing the sheet 203 in the sheet holder 802 .

Then, the loader unit 800 receives the substrate 105 before resin sealing from the preheater 104, and rotates +90 degrees so that the absolute coordinate becomes 0 degrees. The sheet 203 and the substrate 105 before resin sealing are supplied to the lower die 301 of the press unit 300 .

Furthermore, as another usage example of the first embodiment, for example, the loader unit 800 may be considered to rotate +90 degrees after receiving the substrate 105 before resin sealing from the preheater 104 . Furthermore, there is a method of receiving the sheet 203 from the sheet shaft 202 at an absolute coordinate of 0 degrees, and supplying the sheet 203 and the substrate 105 before resin sealing into the lower die 301 of the press unit 300 .

According to this usage example, since the sheet 203 is received just before the molding material is supplied to the press unit 300, it is preferable that the dust adhering to the sheet 203 does not scatter in the moving path. In addition, the above-mentioned other usage examples only need to change the operation program, so it is easy to change.

In Embodiment 2, the sheet transfer position 204 is arranged between the substrate supply unit 101 and the carrier unit 700 by changing the position of the sheet shaft 202 .

According to the present embodiment, the sheet delivery position 204 is arranged between the substrate supply unit 101 and the carrier unit 700 . Therefore, during the period when the picker unit 900 enters between the upper mold 302 and the lower mold 301 to take out the resin-sealed substrate 901, the loader unit 800 can simultaneously perform the receiving operation of the substrate 105 before resin sealing and carry out the above-mentioned process. The sheet shaft 202 receives motion of the sheet 203 . As a result, there are advantages in that the working efficiency of the device can be improved and the cycle time of the whole device can be shortened.

The sheet shaft 202 is not necessarily provided at the same position as the sheet supply unit 200, and may be provided at a separate position. More specifically, the resin material delivery position 204 may also be provided in any one of the substrate supply unit 101, the punching unit 300, the gate removal unit 500, and the molded part storage unit 600, as well as the loader unit 800 and the unloading unit. between the rotation axis 702 of the device unit 900.

Possibility of industrial use

Of course, the above-mentioned resin sealing molding device of the present invention can also be applied to the occasion of resin sealing other electronic components.

Claims (11)

1. A resin sealing forming device, comprising: a punching unit; a formed part supply unit for supplying a formed part; a resin material supply unit for supplying a resin material; a loader unit for supplying a formed part to the stamping unit; A reclaimer unit for taking out resin-sealed molded parts from the unit; and a molded part receiving unit for receiving resin-sealed molded parts, characterized in that, The loader unit and the reclaimer unit are radially arranged and integrated, and form an angle of 90 degrees to each other with the rotation axis as the center, and the loader unit and the reclaimer The unit is supported so as to be integrally rotatable around the rotation axis. 2. The resin encapsulation molding apparatus according to claim 1, wherein the molded article supply unit, the press unit, and the molded article storage unit are sequentially arranged at angular intervals of 90 degrees around the rotation axis. 3. The resin sealing molding apparatus according to claim 1, wherein the molded article is conveyed from the molded article supply unit to the press unit by a loader, and the molded article is transported from the press unit to the molded article receiving unit by a reclaimer. Handling molded parts sealed with resin. 4. The resin encapsulation molding apparatus according to claim 1, wherein the molded article supply unit, the press unit, and the gate removal unit are sequentially arranged at angular intervals of 90 degrees around the rotation axis, wherein the The above-mentioned gate removal unit separates the resin-sealed molded part from unnecessary resin. 5. The resin sealing molding device according to claim 4, wherein the molded part supply unit, the punching unit, the gate removal unit, and the molded part storage unit are arranged at an angle of 90 degrees around the rotation axis. Spaces are sequentially arranged, and the gate removal unit separates the resin-sealed molded article from unnecessary resin. 6. The resin sealing molding apparatus according to claim 4, wherein the molded article is conveyed from the molded article supply unit to the press unit by a loader, and is conveyed from the press unit to the gate removal unit by a reclaimer. Molded parts sealed with resin. 7. The resin sealing molding apparatus according to claim 5, wherein the molded article is conveyed from the molded article supply unit to the press unit by a loader, and the molded article is conveyed from the press unit to the gate removal unit by a picker, And the resin-sealed molded article is conveyed from the gate removal unit to the molded article storage unit. 8. The resin sealing molding device according to claim 2, wherein the molded article is conveyed from the molded article supply unit to the press unit by a loader, and the molded article is transported from the press unit to the molded article receiving unit by a reclaimer. Handling molded parts sealed with resin. 9. The resin encapsulation molding device according to any one of claims 1 to 8, wherein the molded article supply unit and the resin material supply unit are arranged so as to form an angle of 90 degrees to each other centering on the rotation axis. angle. 10. The resin sealing molding apparatus according to any one of claims 1 to 8, wherein a mold cleaning unit is provided adjacent to the press unit. 11. The resin encapsulation molding device according to any one of claims 4 to 7, wherein the resin material delivery position of the resin material supply unit for supplying the resin material is arranged at the molded part supply unit, the stamping unit, Between any one of the gate removal unit and the forming part storage unit and the rotation axis of the loader unit and the reclaimer unit.

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