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CN100377333C - 带有一个或更多通孔的半导体结构 - Google Patents

带有一个或更多通孔的半导体结构 Download PDF

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Publication number
CN100377333C
CN100377333C CNB028252926A CN02825292A CN100377333C CN 100377333 C CN100377333 C CN 100377333C CN B028252926 A CNB028252926 A CN B028252926A CN 02825292 A CN02825292 A CN 02825292A CN 100377333 C CN100377333 C CN 100377333C
Authority
CN
China
Prior art keywords
layer
semiconductor structure
vias
semiconductor
feedthrough
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028252926A
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English (en)
Chinese (zh)
Other versions
CN1605126A (zh
Inventor
M·赫舍尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yuanxin Optoelectronics Co ltd
Epistar Corp
Original Assignee
Hymite AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hymite AS filed Critical Hymite AS
Publication of CN1605126A publication Critical patent/CN1605126A/zh
Application granted granted Critical
Publication of CN100377333C publication Critical patent/CN100377333C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Optical Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
CNB028252926A 2001-10-17 2002-10-15 带有一个或更多通孔的半导体结构 Expired - Lifetime CN100377333C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US32969901P 2001-10-17 2001-10-17
US60/329,699 2001-10-17
US10/264,440 US6818464B2 (en) 2001-10-17 2002-10-04 Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
US10/264,440 2002-10-04

Publications (2)

Publication Number Publication Date
CN1605126A CN1605126A (zh) 2005-04-06
CN100377333C true CN100377333C (zh) 2008-03-26

Family

ID=26950546

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028252926A Expired - Lifetime CN100377333C (zh) 2001-10-17 2002-10-15 带有一个或更多通孔的半导体结构

Country Status (8)

Country Link
US (3) US6818464B2 (fr)
EP (1) EP1436837B1 (fr)
JP (1) JP4546087B2 (fr)
CN (1) CN100377333C (fr)
AT (1) ATE464656T1 (fr)
AU (1) AU2002351771A1 (fr)
DE (1) DE60236007D1 (fr)
WO (1) WO2003034490A2 (fr)

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EP1436837A2 (fr) 2004-07-14
US20030071283A1 (en) 2003-04-17
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US6818464B2 (en) 2004-11-16
DE60236007D1 (de) 2010-05-27
US7081412B2 (en) 2006-07-25
EP1436837B1 (fr) 2010-04-14
US20050059204A1 (en) 2005-03-17
JP2005506701A (ja) 2005-03-03
ATE464656T1 (de) 2010-04-15
WO2003034490A3 (fr) 2004-04-01
WO2003034490A2 (fr) 2003-04-24
JP4546087B2 (ja) 2010-09-15
AU2002351771A1 (en) 2003-04-28
CN1605126A (zh) 2005-04-06
US20040266038A1 (en) 2004-12-30

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