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CN100383541C - Measuring device and measuring method for thermal relaxation time of semiconductor laser - Google Patents

Measuring device and measuring method for thermal relaxation time of semiconductor laser Download PDF

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CN100383541C
CN100383541C CNB200510026554XA CN200510026554A CN100383541C CN 100383541 C CN100383541 C CN 100383541C CN B200510026554X A CNB200510026554X A CN B200510026554XA CN 200510026554 A CN200510026554 A CN 200510026554A CN 100383541 C CN100383541 C CN 100383541C
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semiconductor laser
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boxcar integrator
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CN1693915A (en
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陈晨
辛国锋
方祖捷
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Shanghai Institute of Optics and Fine Mechanics of CAS
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Abstract

A measuring device and its test method of the thermal relaxation time of the semiconductor laser, the constitution of the apparatus is: the output end of the pulse power supply is connected with the semiconductor laser, the collimation system and the spectrometer are sequentially arranged along the laser advancing direction of the semiconductor laser, the photomultiplier is positioned at the output slit of the spectrometer, the output end of the photomultiplier is connected with the input end of the Boxcar integrator, the synchronous output end of the pulse power supply is connected with the trigger input end of the Boxcar integrator through a delay circuit, and the data acquisition card at the input end of the computer is connected with the output end of the Boxcar integrator. The invention has the advantages that: the change relation between the threshold current of the laser and the slope efficiency along with the junction temperature does not need to be tested; the device has low manufacturing cost, easy construction, simple method and good stability.

Description

半导体激光器热弛豫时间的测试装置及其测量方法 Measuring device and measuring method for thermal relaxation time of semiconductor laser

技术领域technical field

本发明涉及半导体激光器,特别是一种半导体激光器的热弛豫时间的测试装置及其测试方法。The invention relates to a semiconductor laser, in particular to a test device and a test method for the thermal relaxation time of the semiconductor laser.

背景技术Background technique

半导体激光器的热特性是实际应用中一个重要问题。高热阻会导致激光器有源区高的温升,从而导致激光器阈值电流变大、斜率效率下降、输出功率降低,更严重的是影响器件的寿命。除了热阻,半导体激光器另一热特性参量为热弛豫时间。对于脉冲工作状态下的半导体激光器而言,热弛豫时间参量是一个很重要的参数。The thermal characteristics of semiconductor lasers are an important issue in practical applications. High thermal resistance will lead to a high temperature rise in the active region of the laser, which will lead to an increase in the threshold current of the laser, a decrease in slope efficiency, a decrease in output power, and more seriously, affect the life of the device. In addition to thermal resistance, another thermal characteristic parameter of semiconductor lasers is thermal relaxation time. For semiconductor lasers in the pulse working state, the thermal relaxation time parameter is a very important parameter.

当半导体激光器施加方波电流时,激光器结温在脉冲内逐渐上升,经过一段时间,结温达到稳态值。结温变化可以表示为:When a square wave current is applied to a semiconductor laser, the junction temperature of the laser rises gradually within the pulse, and after a period of time, the junction temperature reaches a steady-state value. The junction temperature change can be expressed as:

T=T0+RthP[1-exp(-Δt/τ)]    (1)T=T 0 +R th P[1-exp(-Δt/τ)] (1)

其中Rth为激光器热阻值,P为注入热流,τ为热弛豫时间,T0为没有电流注入时的激光器结温。Where R th is the thermal resistance of the laser, P is the injected heat flow, τ is the thermal relaxation time, and T 0 is the junction temperature of the laser when no current is injected.

热弛豫时间反映了激光器结温升高的快慢。对一些工作在短脉冲的激光器而言,若其热弛豫时间大则在脉冲内的温升很小;若热弛豫时间小则激光器结温在很短的时间内就达到稳态值。The thermal relaxation time reflects how quickly the junction temperature of a laser rises. For some lasers working in short pulses, if the thermal relaxation time is large, the temperature rise in the pulse is very small; if the thermal relaxation time is small, the laser junction temperature will reach a steady state value in a short time.

热弛豫时间的现有测试方案是:Existing test protocols for thermal relaxation times are:

在先技术[1](H.I.Abdelkader,H.HHausien,and J.D.Martin.Temperature rise and thermal rise-time measurement of a semiconductorlaser diode.Rev.Sci.Instrum.63(3),March 1992:2004-2007)中,H.I.Abdelkader研究了半导体激光器的阈值电流和斜率效率随结温的变化关系,通过测试脉冲工作下不同脉冲时刻的激光器光功率变化,得到不同时刻的结温升,从而计算得到热弛豫时间值。但是短的脉冲下激光器光功率值比较小,不同时刻的激光器光功率变化难以精确测定,需要比较精密的设备。在先技术[2](M.Voss,C.Lier,U.Menzel,A.Barwolff,andT.Elsaesser.Time-resolved emission studies of GaAs/AlGaAs laser diodearrays on different heat sinks.J.Appl.phys.79(2).15 January 1996:1170-1172)中,M.Voss et.al.通过对光谱仪接收装置CCD设置光开关,然后测试不同开关时间的光谱来得到激光器动态热特性。此技术对脉冲光信号采用光开关,要求精确控制开关时间,对光信号控制要求太高。In the prior art [1] (H.I.Abdelkader, H.HHausien, and J.D.Martin.Temperature rise and thermal rise-time measurement of a semiconductor laser diode.Rev.Sci.Instrum.63(3), March 1992:2004-2007) , H.I.Abdelkader studied the relationship between the threshold current and slope efficiency of semiconductor lasers as a function of junction temperature. By testing the laser light power changes at different pulse times under pulsed operation, the junction temperature rise at different times was obtained, and the thermal relaxation time was calculated. . However, the optical power value of the laser is relatively small under short pulses, and it is difficult to accurately measure the change of the optical power of the laser at different times, requiring more sophisticated equipment. Prior technology [2] (M.Voss, C.Lier, U.Menzel, A.Barwolff, and T.Elsaesser. Time-resolved emission studies of GaAs/AlGaAs laser diode arrays on different heat sinks.J.Appl.phys.79 (2).15 January 1996:1170-1172), M.Voss et.al. obtained the dynamic thermal characteristics of the laser by setting an optical switch on the CCD of the receiving device of the spectrometer, and then testing the spectra of different switching times. This technology uses optical switches for pulsed optical signals, which requires precise control of switching time, and the requirements for optical signal control are too high.

发明内容Contents of the invention

本发明克服上述现有技术的不足,提供一种半导体激光器的热弛豫时间的测量装置及其测试方法,The present invention overcomes the above-mentioned deficiencies in the prior art, and provides a measurement device and a test method thereof for the thermal relaxation time of a semiconductor laser,

本发明的技术解决方案如下:Technical solution of the present invention is as follows:

一种半导体激光器的热弛豫时间的测量装置,该装置的构成是:一脉冲电源,该脉冲电源的输出端接半导体激光器,沿该半导体激光器的激光前进方向依次是准直系统和光谱仪,光电倍增管位于所述的光谱仪的输出狭缝,光电倍增管的输出端接Boxcar积分器的输入端,所述的脉冲电源的同步输出端经过延时电路连接Boxcar积分器的触发输入端,计算机输入端数据采集卡连接Boxcar积分器输出端。A device for measuring the thermal relaxation time of a semiconductor laser, the device is composed of: a pulse power supply, the output terminal of the pulse power supply is connected to the semiconductor laser, and along the laser forward direction of the semiconductor laser is a collimation system, a spectrometer, a photoelectric The multiplier tube is located at the output slit of the spectrometer, the output end of the photomultiplier tube is connected to the input end of the Boxcar integrator, the synchronous output end of the pulse power supply is connected to the trigger input end of the Boxcar integrator through a delay circuit, and the computer input The terminal data acquisition card is connected to the output terminal of the Boxcar integrator.

本发明半导体激光器的热弛豫时间的测试方法,其特征在于该方法包括下列步骤:The test method of the thermal relaxation time of semiconductor laser of the present invention is characterized in that the method comprises the following steps:

①首先设定Boxcar积分器的参数:取样脉冲信号Tg为0.5us,扫描时间Ts为150s;其次设定延时电路的延时时间不超过5ms;光谱仪的狭缝宽度为10μm-40μm;① First set the parameters of the Boxcar integrator: the sampling pulse signal T g is 0.5us, and the scanning time T s is 150s; secondly, set the delay time of the delay circuit to no more than 5ms; the slit width of the spectrometer is 10μm-40μm;

②开启激光器脉冲电源,固定光谱仪扫描波长λs1,Boxcar积分器产生的取样脉冲信号扫描光电倍增管由光功率信号转化的电信号,计算机对Boxcar积分器输出进行采集,得到电信号数据I1……1i……,从一系列电信号数据Ii以及相应的时间t得到电信号峰值出现的时间t=um1② Turn on the laser pulse power supply, fix the scanning wavelength λ s1 of the spectrometer, the sampling pulse signal generated by the Boxcar integrator scans the electrical signal converted from the optical power signal by the photomultiplier tube, and the computer collects the output of the Boxcar integrator to obtain the electrical signal data I 1 ... ...1 i ..., from a series of electrical signal data I i and the corresponding time t to obtain the time t= um1 of the electrical signal peak value;

③改变光谱仪的扫描波长λsi(i=2,3....15),重复第二步过程,得到一系列电信号峰值出现时间um1(i=2,3....15)。③ Change the scanning wavelength λ si (i=2, 3....15) of the spectrometer, and repeat the second step to obtain a series of electrical signal peak appearance times u m1 (i=2, 3....15).

④将扫描波长λsi和峰值出现时间um1利用下式求出τ1,再平均得到该激光器的热弛豫时间参量值τ:④ Use the following formula to calculate τ 1 from the scanning wavelength λ si and the peak time u m1 , and then obtain the thermal relaxation time parameter value τ of the laser on average:

ττ == -- uu mm lnln [[ 11 -- λλ sthe s -- λλ PP (( TT 00 )) λλ TT ′′ RR ththe th PP ]]

式中:λs为光谱仪固定的扫描波长值,um为对应光功率峰值出现时间,λp(T0)为初始峰值波长,λT′为光谱温度系数。In the formula: λ s is the fixed scanning wavelength value of the spectrometer, u m is the appearance time of the corresponding optical power peak, λ p (T 0 ) is the initial peak wavelength, and λ T ′ is the spectral temperature coefficient.

所述的延时电路的延时时间应为0.2ms。The delay time of the delay circuit should be 0.2ms.

所述的狭缝宽度为30μm。The slit width is 30 μm.

与其它测试方法相比,本发明的优点是:不需测试激光器阈值电流和斜率效率随结温的变化关系;使用电开关,较光开关容易控制,整个实验装置造价低,容易搭建,方法简单、稳定性好。Compared with other test methods, the present invention has the advantages of: no need to test the relationship between laser threshold current and slope efficiency with junction temperature; the use of electric switches is easier to control than optical switches, the cost of the entire experimental device is low, easy to build, and the method is simple , Good stability.

附图说明Description of drawings

图1为本发明装置的结构示意图。Fig. 1 is a structural schematic diagram of the device of the present invention.

图2为由测试结果得到的扫描波长与光功率峰值时间的关系图。Fig. 2 is a graph showing the relationship between the scanning wavelength and the peak time of optical power obtained from the test results.

图1中:1-半导体激光器,2-脉冲电源,3-延时电路,4-准直系统,5-光谱仪,6-光电倍增管,7-Boxcar积分器,8-计算机In Figure 1: 1-semiconductor laser, 2-pulse power supply, 3-delay circuit, 4-collimation system, 5-spectrometer, 6-photomultiplier tube, 7-Boxcar integrator, 8-computer

具体实施方式Detailed ways

下面结合实施例对本发明作进一步说明。The present invention will be further described below in conjunction with embodiment.

先请参阅图1所示。图1为本发明装置实施例的结构示意图。由图可见,本发明半导体激光器的热弛豫时间的测试装置,其特征在于该装置的构成是:一脉冲电源2,该脉冲电源2的输出端接半导体激光器1,沿该半导体激光器1的激光前进方向依次是准直系统4和光谱仪5,光电倍增管6位于所述的光谱仪5的输出狭缝,光电倍增管6的输出端接Boxcar积分器7的输入端,所述的脉冲电源2的同步输出端经过延时电路3连接Boxcar积分器7的触发输入端,计算机8输入端数据采集卡连接Boxcar积分器7输出端。Please refer to Figure 1 first. Fig. 1 is a schematic structural diagram of an embodiment of the device of the present invention. As can be seen from the figure, the test device of the thermal relaxation time of the semiconductor laser of the present invention is characterized in that the composition of the device is: a pulse power supply 2, the output terminal of the pulse power supply 2 is connected to the semiconductor laser 1, along the laser beam of the semiconductor laser 1 The forward direction is the collimation system 4 and the spectrometer 5 successively, the photomultiplier tube 6 is positioned at the output slit of the spectrometer 5, the output terminal of the photomultiplier tube 6 is connected to the input end of the Boxcar integrator 7, and the pulse power supply 2 of the The synchronization output end is connected to the trigger input end of the Boxcar integrator 7 through the delay circuit 3, and the data acquisition card at the input end of the computer 8 is connected to the output end of the Boxcar integrator 7.

利用图1所述的装置进行半导体激光器的热弛豫时间的测试方法,包括下列步骤:Utilize the device described in Fig. 1 to carry out the test method of the thermal relaxation time of semiconductor laser, comprise the following steps:

①首先设定Boxcar积分器7的参数:取样脉冲信号Tg为0.5us,扫描时间Ts为150s;其次设定延时电路3的延时时间为0.2ms。光谱仪5的狭缝宽度为1所述的狭缝宽度为30μm;① First set the parameters of the Boxcar integrator 7: the sampling pulse signal T g is 0.5us, and the scanning time T s is 150s; secondly, set the delay time of the delay circuit 3 to 0.2ms. The slit width of the spectrometer 5 is 1 and the slit width is 30 μm;

②开启激光器脉冲电源2,固定光谱仪5扫描波长λs1,Boxcar积分器7产生的取样脉冲信号扫描光电倍增管6由光功率信号转化的电信号,计算机8对Boxcar积分器7输出进行采集,得到电信号数据I1……1i……,从一系列电信号数据Ii以及相应的时间t得到电信号峰值出现的时间t=um1② Turn on the pulse power supply 2 of the laser, fix the spectrometer 5 to scan the wavelength λ s1 , the sampling pulse signal generated by the Boxcar integrator 7 scans the electrical signal converted by the photomultiplier tube 6 from the optical power signal, and the computer 8 collects the output of the Boxcar integrator 7 to obtain Electrical signal data I 1 ... 1 i ..., from a series of electrical signal data I i and the corresponding time t to obtain the time t= um1 of the electrical signal peak value;

③改变光谱仪5的扫描波长λsi(i=2,3....15),重复第二步过程,得到一系列电信号峰值出现时间umi(i=2,3....15)。③ Change the scanning wavelength λ si (i=2, 3....15) of the spectrometer 5, repeat the second step process, and obtain a series of electrical signal peak time u mi (i=2, 3....15) .

④将扫描波长λsi和峰值出现时间umi利用下式求出τ1,再平均得到该激光器的热弛豫时间参量值τ:④ Use the following formula to obtain τ 1 from the scanning wavelength λ si and the peak time u mi , and then obtain the thermal relaxation time parameter value τ of the laser on average:

ττ == -- uu mm lnln [[ 11 -- λλ sthe s -- λλ PP (( TT 00 )) λλ TT ′′ RR ththe th PP ]]

式中:λs为光谱仪固定的扫描波长值,um为对应光功率峰值出现时间,λp(T0)为初始峰值波长,λT′为光谱温度系数。In the formula: λ s is the fixed scanning wavelength value of the spectrometer, u m is the appearance time of the corresponding optical power peak, λ p (T 0 ) is the initial peak wavelength, and λ T ′ is the spectral temperature coefficient.

光功率信号峰值时间为从电流脉冲开始注入到激光器光功率峰值出现所需要的时间。在对Boxcar积分器7输出数据进行采集时,同时需要采集取样脉冲信号。实验中设定当采集到取样脉冲信号时,开始采集Boxcar积分器7输出信号。从而,每次Boxcar积分器7输出信号采集都是在同一时刻开始。实验过程中,因为取样脉冲宽度为0.5μs,数据采集卡采集速率最高为40k/s,不易采样。因此将取样脉冲信号展宽为宽度250μs的同步信号,送入计算机8采样。当采集到该信号上升沿时,数据采集卡开始采集Boxcar积分器7输出信号。The peak time of the optical power signal is the time required from the injection of the current pulse to the appearance of the peak optical power of the laser. When collecting the output data of the Boxcar integrator 7, the sampling pulse signal needs to be collected at the same time. It is set in the experiment that when the sampling pulse signal is collected, the output signal of the Boxcar integrator 7 is started to be collected. Therefore, each acquisition of the output signal of the Boxcar integrator 7 starts at the same moment. During the experiment, because the sampling pulse width is 0.5μs, and the acquisition rate of the data acquisition card is up to 40k/s, it is not easy to sample. Therefore, the sampling pulse signal is expanded into a synchronous signal with a width of 250 μs, which is sent to the computer 8 for sampling. When the rising edge of the signal is collected, the data acquisition card starts to collect the output signal of the Boxcar integrator 7 .

图2为固定波长λs与平均峰值时间um的关系图。由(3)式,当 &lambda; s - &lambda; P ( T 0 ) &lambda; T &prime; R th P < < 1 时,um与λs线性变化,(3)式写为: &tau; = - u m &lambda; s - &lambda; P ( T 0 ) &lambda; T &prime; R th P . 所以由图(2)中拟合曲线的斜率可以计算得到该激光器热弛豫时间值为390μs。Fig. 2 is a relation diagram of fixed wavelength λ s and average peak time u m . By (3), when &lambda; the s - &lambda; P ( T 0 ) &lambda; T &prime; R the th P < < 1 When , u m and λ s change linearly, formula (3) is written as: &tau; = - u m &lambda; the s - &lambda; P ( T 0 ) &lambda; T &prime; R the th P . Therefore, the thermal relaxation time value of the laser can be calculated to be 390 μs from the slope of the fitting curve in Figure (2).

Claims (2)

1. the proving installation of the thermal relaxation time of a semiconductor laser, the formation that it is characterized in that this device is: a pulse power (2), the output termination semiconductor laser (1) of this pulse power (2), laser working direction along this semiconductor laser (1) is colimated light system (4) and spectrometer (5) successively, photomultiplier (6) is positioned at the output slit of described spectrometer (5), the input end of the output termination Boxcar integrator (7) of photomultiplier (6), the synchronous output end of the described pulse power (2) is through the triggering input end of delay circuit (3) connection Boxcar integrator (7), and computing machine (8) input end data collecting card connects Boxcar integrator (7) output terminal.
2. utilize the described device of claim 1 to carry out the method for testing of the thermal relaxation time of semiconductor laser, it is characterized in that this method comprises the following steps:
1. at first set the parameter of Boxcar integrator (7): sample-pulse signal T gBe 0.5us, sweep time T sBe 150s; Next delay time of setting delay circuit (3) is no more than 0.2ms; The slit width of spectrometer (5) is 30 μ m;
2. open laser pulse power supply (2), fixed light spectrometer (5) scanning wavelength λ S1, the sample-pulse signal scanning photomultiplier (6) that Boxcar integrator (7) produces is by the optical power signals signals converted, and computing machine (8) is exported Boxcar integrator (7) and is gathered, and obtains electrical signal data I 1L i, from the series of electrical signals data I iAnd corresponding time t obtains the time t=u that electrical signal peak occurs M1
3. change the scanning wavelength λ s of spectrometer (5) 1(i=2 3....15), repeats the second step process, obtains series of electrical signals peak value time of occurrence u M1(i=2,3....15);
4. with scanning wavelength λ S1With peak value time of occurrence u M1Utilize following formula to obtain τ i, on average obtain the thermal relaxation time value of consult volume τ of this laser instrument again:
&tau; = - u m ln [ 1 - &lambda; s - &lambda; P ( T 0 ) &lambda; T &prime; R th P ]
In the formula: λ sBe the fixing scanning wavelength value of spectrometer, u mBe corresponding luminous power peak value time of occurrence, λ p(T 0) be the initial spike wavelength, λ T' be the spectroscopic temperature coefficient.
CNB200510026554XA 2005-06-08 2005-06-08 Measuring device and measuring method for thermal relaxation time of semiconductor laser Expired - Fee Related CN100383541C (en)

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