CN100405185C - Substrate assembly device - Google Patents

Abstract

A substrate mounting device in which a suction pad capable of extending and contracting up and down is provided near the center of a pressure plate (upper board) 2, and the suction pad is stretched according to the input deflection amount of the upper board, and the negative pressure is supplied to the The suction hole on the pressure plate is also supplied to the suction pad. After the substrate is adsorbed, the top end of the suction pad is positioned on the suction surface of the pressure plate by shrinking the suction pad, and the substrate can be reliably held on the pressure plate. superior. Therefore, it is possible to solve the problem that the substrate cannot be reliably held when the substrate is deflected when the upper substrate is held on the pressure plate when the substrate is loaded into the bonding device.

Description

Substrate assembly device

technical field

The present invention relates to a device for laminating substrates such as liquid crystals, and in particular to a substrate assembly that holds the bonded substrates facing each other in a decompression chamber, narrows the gap, and is suitable for assembling bonded liquid crystal display panels, etc. device.

Background technique

In the manufacture of liquid crystal display panels, there is a process of keeping the two glass substrates provided with transparent electrodes and thin film transistor arrays at a very close distance of about several μm and using an adhesive (hereinafter referred to as (referred to as a sealant) bonding (later, the bonded substrate is referred to as an element), and the liquid crystal is sealed in the space formed thereby.

In the sealing process of the liquid crystal, the method proposed in the Japanese Patent Application Laid-Open No. 2000-284295 is to apply the sealant to a substrate with a closed figure without setting the injection port, and drop the liquid crystal on the other substrate in the vacuum chamber. It is placed on this substrate, and the upper and lower substrates are brought close to each other and bonded together.

In the prior art of the aforementioned Japanese Patent Laid-Open No. 2000-284295, the holding of the substrate in a vacuum is made such that the lower substrate is placed on a flat stage, and the upper substrate is held by a negative substrate in an atmospheric state. In pressure suction adsorption, when a predetermined vacuum state is reached, the substrate is held by electrostatic adsorption generated by electrostatic force. However, recently, there are large-scale substrates with a size of 1m x 1m or more, and the thickness of the substrate also tends to be reduced from 3mm to 2mm or 1mm. When the substrate is bent at the central part, the distance between the substrate and the pressure plate in the central part of the substrate becomes large, and when the substrate is transferred from the substrate input mechanism to the pressure plate, the substrate cannot be held. Especially when holding a substrate with a large screen, it is difficult to prevent the substrate from warping because the orientation film and TFTs are formed in the center of the substrate and can only be supported by the peripheral portion of the substrate. In addition, even if holding is possible, residual stress is generated on the substrate, and holding is carried out in a state where the position of the mark on the substrate is properly shifted. In addition, when the fingers of the manipulator holding and conveying the substrate become longer and hold the substrate, the tip side is bent, and the distance between the substrate and the pressure plate on the tip side of the manipulator also increases, and the substrate cannot be sucked. For this reason, for large substrates, if the above-mentioned problems are not solved, accurate bonding cannot be performed.

Contents of the invention

Therefore, an object of the present invention is to provide a highly productive substrate mounting apparatus capable of holding substrates with high precision even when the substrates are enlarged, and bonding them at high precision and speed.

In order to achieve the above object, in the substrate mounting apparatus of the present invention, there are: a chamber for creating a reduced-pressure environment, a pressure plate that holds the upper substrate in the chamber and can move up and down, and a pressure plate held on the above-mentioned pressure plate. The upper substrate on the upper side faces the substrate holding plate that holds the lower substrate with a gap; the above substrate holding plate is driven to match the position of the upper substrate and the lower substrate, and the above-mentioned pressure plate is driven up and down to narrow the space between the substrates. The adhesive provided on any one of the above-mentioned substrates is bonded in a reduced-pressure environment, and it is characterized in that the above-mentioned pressure plate is equipped with a plurality of suction holes for maintaining the negative pressure of the upper substrate, and the above-mentioned multiple suction holes Among the holes, the suction holes near the center of the pressure plate are respectively provided on a plurality of suction pads equipped with a vertical movement mechanism. The substrate holding surface holds the upper substrate by negative pressure supplied from the plurality of suction holes and suction pads.

The present invention also provides a substrate assembly device comprising: a chamber for creating a reduced-pressure environment, a pressure plate holding an upper substrate in the chamber and capable of moving up and down, and an upper substrate held on the pressure plate. The substrate holding plate that holds the lower substrate facing and spaced apart, the substrate holding plate is driven to align the upper substrate and the lower substrate, and the pressure plate is driven up and down to narrow the space between the upper and lower substrates. The adhesive on any one of the upper and lower substrates is bonded in a reduced-pressure environment, and it is characterized in that a plurality of suction holes for supplying negative pressure are provided on the above-mentioned pressure plate, and the upper substrate is transported to the above-mentioned pressure. The amount of deflection on the top end side of the fingers of the manipulator on the board is set in the chamber to push the upper substrate top end correction mechanism on the side of the pressure plate. In the state where the upper substrate is pushed to the side of the pressure plate, negative pressure is supplied to the suction hole of the pressure plate, and the upper substrate is sucked and held on the pressure plate.

The present invention also provides a substrate assembly device comprising: a chamber for creating a reduced-pressure environment, a pressure plate holding an upper substrate in the chamber and capable of moving up and down, and an upper substrate held on the pressure plate. The substrate holding plate holding the lower substrate facing and spaced apart, the lower substrate holding plate is driven to align the positions of the upper substrate and the lower substrate, and the pressure plate is driven up and down to narrow the gap between the substrates. The adhesive on any one of the upper and lower substrates is bonded in a reduced-pressure environment, and it is characterized in that a plurality of adsorption holes for supplying negative pressure, sucking and holding the upper substrate are provided on the above-mentioned pressure plate, and the above-mentioned multiple Each adsorption hole is divided into groups of 3 or more, and the configuration is equipped with a negative pressure source or a pressure regulating valve, so that the adsorption force can be changed for each group.

The present invention also provides a method for assembling substrates. In a vacuum chamber, two substrates are spaced up and down and facing each other. They are respectively held on the upper and lower plates by suction and adsorption, and the positions are aligned. The adhesive on one substrate is used to bond the two substrates. It is characterized in that when the upper substrate is held on the upper plate, the input upper substrate, which is in a concave state with respect to the center of the upper plate, passes through the upper plate from the upper plate. The suction holes in the central part sequentially supply negative pressure to the suction holes in the peripheral part to suck up the upper substrate, and the upper substrate is sucked and held sequentially from the central part to the peripheral part.

Description of drawings

FIG. 1 is a diagram showing the configuration of a substrate mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram showing an outline of a robot used for board loading.

Fig. 3 is a diagram illustrating a schematic configuration of a suction pad provided on a pressure plate and a holding method when a substrate is deflected.

FIG. 4 is an explanatory diagram of a mechanism for correcting warpage of a substrate by warpage of fingers of a robot.

Fig. 5 is a diagram showing another structure for holding the flexible substrate of the present invention.

Detailed ways

An embodiment of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1 , the substrate mounting apparatus is composed of a lower chamber T1 and an upper chamber T2 . Inside the upper chamber T2, there is provided an upper side plate 2 (hereinafter sometimes referred to as a pressure plate) movable in the vertical direction by a support leg 3 and a plurality of adjustment legs 4 penetrating the upper chamber T2. The support leg 3 is isolated by an O-ring 5 and the adjustment leg 4 is isolated by a welded bellows 6, so that the inside of the upper chamber T2 is not communicated with the atmosphere. The support legs 3 and the adjustment legs 4 of the upper side plate 2 are fixed on the press base plate 7 .

In addition, the central portion of the pressure plate 7 is fixed to the intermediate substrate 8 . The intermediate base plate 8 is configured to move up and down by operating a drive mechanism composed of a drive motor 10 mounted on the top frame 9, a speed reducer 11, and a ball screw 12, using a ball spline shaft guide 13 as a guide mechanism. In addition, the top frame 9 is supported by support columns provided on the stand 1 in addition to the ball spline shaft guide. The other end side of each adjustment leg 4 whose one end is fixed to the pressure base plate 7 is connected to a ball screw 15 driven by a drive motor 14 mounted on the intermediate base plate 8 . By driving the vertical adjustment mechanism composed of the drive motor 14 and the ball screw 15 and applying a force to the pressurized base plate 7, the upper side plate 2 can be moved up and down while being kept flat.

In addition, the upper chamber T2 is equipped with a connecting mechanism for connecting the pressurized substrate 7, and when the upper chamber T2 is separated from the lower chamber T1, the connecting mechanism is operated to integrate the pressurized substrate and the upper chamber T2, so that Drive motor 10 action rises upwards.

In addition, a gate valve 16 for carrying in and out substrates in the chamber is provided on the side outer wall side of the upper chamber T2. Furthermore, an ionizer 17 is provided at the side wall of the upper chamber opposite to the gate valve 16, and the substrate can be destaticized by blowing ionized ultrasonic gas to the surface of the substrate. In addition, the ionizer 17a is also provided near the gate valve 16 on the outdoor side, whereby the deionizing effect on the substrate can be enhanced by blowing ionized gas while the valve is open.

On the upper outer wall of the upper chamber T2, a plurality of sub-rails 18 having a sleeve structure are provided so as to project a central axis 19 into the chamber. This central axis 19 cooperates with the hole that is arranged on the protruding part of the outer periphery of upper side plate 2, can carry out the adjustment of the horizontal direction of upper side plate 2, namely, as the auxiliary guide rail 18 of the level adjustment mechanism of upper side plate 2 and The central shaft 19 moves.

A plurality of observation windows for substrate mark observation are provided in the upper chamber T2. The lens barrel 21 of the camera is inserted into this observation window, and the mark provided on the board|substrate is recognized by a camera. The lens barrel 21 of the camera is installed on a movable stage provided with a horizontal direction (X, Y direction) moving axis and a vertical direction (Z direction) moving axis, and the moving stage is fixed on the upper chamber T2. In addition, a hole for identifying a board mark is provided at a position corresponding to the above-mentioned observation window on the upper side plate 2 .

In this embodiment, the camera is arranged outdoors. If the camera is directly installed on the upper side plate 2, the camera can be arranged close to the substrate, which can improve the recognition accuracy of the camera to the mark, and can improve the position accuracy of the substrate.

In addition, in order to measure the pressing force on the substrate, a load cell 22 is provided between the intermediate substrate 8 of the support leg 3 and the ball screw. In addition, a load cell 23 is provided on each adjustment leg on the pressurized substrate 7 for monitoring, so that the motor 14 driving each adjustment leg 4 is not overloaded when adjusting the flatness of the upper side plate.

The lower side plate 24 is fixed in the lower chamber T1. If the entire surface of the lower side plate 24 is bonded and fixed to the lower chamber T1, when the lower chamber T1 is deformed during decompression, there is a risk that the flatness may deviate due to the deformation. Therefore, only the peripheral part is fixed, In order not to be affected by the lower chamber T1, a seal ring 25 described later is arranged on the entire circumference of the lower chamber T1 to be in contact with the upper chamber T2, and constitutes an internally sealed decompression chamber with the gate valve 16 closed.

The lower chamber T1 is provided on a θ base plate 28 that is rotationally driven by a motor 26 , a ball screw (not shown), and a slewing bearing 27 . In order to connect the θ substrate 28 and the lower chamber T1, a predetermined space can be secured by the box-shaped member. This space is used to install the UV irradiation mechanism 40 , the substrate holding claw elevating mechanism 41 , and the substrate elevating mechanism 42 on the lower side of the lower chamber T1 . The θ base plate 28 is mounted on the Y plate 32 via the slewing bearing 27 . In addition, the Y-plate 32 is provided so as to be movable by the motor 29 on a linear guide provided on the X-plate 33 . Furthermore, the X board 33 is configured to be movable on a linear guide provided on one side of the stage 1 by the drive motor 30 .

In addition, when the upper chamber T2 and the lower chamber T1 are brought into contact to form a decompression chamber, a plurality of ball bearings 34 and belts for the upper chamber are provided on the outer peripheral portion of the θ base plate 28 in order to make the compression margin of the seal ring 25 constant. The bearing seat 35 of the adjustment mechanism. The lowering position of the upper chamber T2 is adjusted by these ball bearings 34 and the receiving base 35 .

Furthermore, a plurality of ball bearings 37 for the θ substrate 28 and a receiving seat 38 with an adjustment mechanism are set on the member fixed on the device base (stand) 1 to support the outer peripheral portion of the θ substrate 28, so that the θ substrate 28 is not deformed. These are used to bear the load of the θ substrate 28 . In this way, since the load around the upper and lower chambers is received by both the ball bearing 34 for the chamber and the ball bearing 37 for the θ substrate, deformation of the chamber can be reduced.

A plurality of through lights 39 for marking identification are provided in the lower chamber T1 , and holes are opened at corresponding positions of the lower side plate 24 . Furthermore, a plurality of pressurization and UV irradiation mechanisms 40 are provided in the lower chamber T1 for compressing and curing the UV adhesive so that the bonded substrates do not deviate. In addition, when carrying out the input and output of the substrate, the holding claw lifting mechanism 41 for preventing the substrate from bending in the width direction, the rotating lifting pin and the lifting pin for preventing the bending of the manipulator and the bending of the substrate in the front and rear directions are respectively provided. A substrate lifting mechanism 43 for lifting and lowering the bonded substrates.

Holes are provided in the lower plate 24 so that the pressurization/UV irradiation mechanism 40 can move up and down in the lower plate 24 . In addition, the pressurization and UV irradiation mechanism can also be used as a rotary lift pin. In addition, grooves (cutouts) are respectively provided on the substrate support side so that the substrate elevating mechanism 43 can move up and down. This substrate elevating mechanism 43 can be operated and a robot arm can be inserted on the lower surface side of the substrate during substrate loading and unloading. These holes or slots may only be provided with a minimum margin in order to fix the lower side plate 24 in the lower chamber T1.

In addition, the pressurization/UV irradiation mechanism 40, the holding elevating mechanism 41, and the substrate elevating mechanism 42 each have a vertical movement mechanism passing through the lower chamber T1, but an O-ring is provided between the lower chamber T1 and these vertical movement mechanism parts. Therefore, it is made into an airtight structure.

The holding mechanism of the upper substrate formed by the upper plate 2 in the depressurized state may be either an electrical holding mechanism formed by an electrostatic chuck or a physical holding mechanism formed by an adhesive material. When the electrostatic chuck is used for electrical holding, the holding by the upper side plate 2 can be interrupted by cutting off the external power supply and raising the upper side plate 2 after a certain period of static electricity removal. In addition, when holding by an adhesive material, by providing a plurality of pins that mechanically press the upper substrate to the lower substrate, only the upper plate 2 is raised while the pins are pressed on the lower side, The holding of the substrate on the upper side can be interrupted.

On the other hand, the lower substrate holding mechanism formed by the lower plate 24 in a decompressed state may also be equipped with an electrostatic adsorption mechanism for electrically holding by an electrostatic chuck or physically holding by an adhesive material. Any one of the methods of bonding the retention mechanism. The assembly of the adsorption method of the upper side plate 2 and the lower side plate 24 is preferably to make the upper side plate 2 and the lower side plate 24 into electrostatic chucks, or to make one of the upper side plate 2 or the lower side plate 24 By making an electrostatic chuck and making the other an adhesive material, it becomes easy to assemble between boards having a flat part as a reference, so that the upper and lower substrates can be bonded evenly. In addition, in the present embodiment, a suction suction mechanism for suction by negative pressure and an electrostatic suction mechanism for electrostatic suction by static electricity may be used in combination.

The decompression in the decompression chamber is performed by connecting a vacuum valve and a vacuum pump of a dry pump or a turbomolecular pump through an unillustrated exhaust port provided in any of the upper and lower chambers. In addition, the inflation of the chamber is performed by introducing an inert gas such as nitrogen or the atmosphere through valves provided in either of the upper and lower chambers (not shown). In order to reduce the adhesion of indoor moisture and shorten the time of indoor decompression, the gas charged is preferably an inert gas such as nitrogen with less water molecule content.

As an example of the substrate mounting apparatus using the above-mentioned present invention, the structure in which the decompression chamber can be divided into two parts has been described. This device can also be used if the substrates are attached to each other by holding one substrate on the upper plate and moving the upper plate to the side of the lower plate holding the other substrate in this state (reducing the distance between the substrates). invention.

FIG. 2 is a diagram showing the structure of a hand of a robot for carrying in a substrate mounter, and FIG. 3 is a schematic diagram showing substrate suction in a suction pad portion of a pressure plate.

In FIG. 2 , the hand of the manipulator is provided with a plurality of finger portions 51 supporting a substrate 60 starting from an arm portion 52 , and a plurality of suction pads 53 are provided on the finger portions 51 . The suction pad 53 is provided with suction holes at the tip, and can suction the substrate 60 by negative pressure. The suction pads 53 of the fingers 51 can move up and down, and the suction pads 53 of the portion in contact with the surface of the liquid crystal display part are retracted to a position not in contact with the substrate surface in advance according to the number of chamfers of the substrate 60 to be held. For this reason, as shown in FIG. 2( b ), in the case of a chamfered substrate 60, among the suction pads 53 provided on the fingers of the central portion, the suction pad 53b of the central portion retreats so as not to be in contact with The substrate 60 is supported by the suction pads 53a at the peripheral portion at the position where the substrate surfaces are in contact with each other.

For this reason, as shown in FIG. 2( b ), the substrate is supported such that the central portion thereof is recessed. In this state, when the suction hole provided on the pressure plate (upper plate) 2 is sucked by negative pressure, the negative pressure does not act on the central portion of the substrate 60, and the substrate 60 may not be held on the upper plate 2. Situation happens. In addition, even if it can be held, the adsorption of the substrate becomes uneven, and a locally large suction force acts on the substrate, which also becomes a cause of a decrease in accuracy during bonding. Therefore, in this embodiment, as shown in FIG. 3( a), a plurality of adsorption pads capable of moving up and down are arranged near the central portion of the pressure plate 2, so that the central portion of the substrate can be reliably adsorbed on the upper plate (plus platen) 2.

The suction pad is composed of air 55 which moves up and down, a rod portion 57 stretched and contracted by air 55 , and a pad portion 56 at the tip. In addition, although not shown in figure, the rod part 57 is hollow, and the air of negative pressure is supplied from it. A hole communicating with the hollow portion of the rod portion 57 is provided in the pad portion 56 at the tip.

Although not shown in FIG. 3( a ), a plurality of negative pressure suction holes are provided on the substrate suction surface of the pressure plate 2 . When carrying out the excessive operation of the substrate 60 from the manipulator 50 with the above-mentioned structure, as shown in FIG. Only protrude to the substrate side by a necessary amount, and after the substrate 60 is held by the pad portion 56, the rod portion 57 is retracted to the substrate holding surface of the upper plate 2, so that it can be reliably adsorbed to the vicinity of the central portion. on the hole. In addition, when the substrate 60 is bonded by applying a pressing force, the pad portion 56 supplies a negative pressure as a suction hole. In addition, the pad portion 56 is made of an elastic body such as rubber so that the substrate 60 will not be damaged when it comes into contact with the substrate 60 .

In this embodiment, the up and down movement of the rod portion 57 is performed by an air cylinder, and this drive portion is installed outside the decompression chamber T2 in this embodiment, but it may also be installed on the side opposite to the pressure surface of the pressure plate. . In addition, the protrusion amount of the rod portion 57 of the suction pad can be adjusted to a predetermined amount by measuring the deflection amount of the substrate in advance, and changing the position of the stopper for restraining the elongation according to the measured amount. A motor or the like may be used as the driving device, and a sensor for measuring deflection may be provided on each input substrate, and the protrusion amount of the rod portion 57 may be controlled based on the measurement result.

In the above, the actuating mechanism when the central part of the substrate 60 is deflected has been described, but when the substrate 60 is input by the plurality of fingers 51 of the manipulator 50, if the rigidity of the fingers 51 is increased, the fingers 51 will become larger. The movement of the manipulator 50 will be hindered. For this reason, the rigidity of the fingers 51 cannot be increased. For this reason, when carrying a large substrate, as shown in FIG. 4 , the tips of the fingers 51 are bent, and the pressure plate 2 may not be able to suck the substrate 60 by the negative pressure. For this purpose, a substrate tip correction mechanism 70 having correction claws for lifting the tip portion of the substrate 60 before suction and suction of the upper substrate 60 is provided in the chamber. This substrate tip correcting mechanism 70 provides a substrate end holding portion 71 holding the end portion of the substrate and a finger holding portion 72 for lifting the finger 51 of the manipulator. The substrate end holding portion 71 is provided between adjacent fingers of the manipulator, as shown in FIG. For this purpose, not only the distal end side of the fingers but also the arm side is provided with the substrate end holding portion 71 .

In this figure, a substrate front end correction mechanism 70 for moving up and down by an air cylinder is provided in the lower chamber T1. Therefore, when the fingers 51 of the manipulator 50 are deflected, the substrate tip correction mechanism 70 is operated to correct the deflection of the substrate, and the substrate 60 can be reliably attracted to the pressure plate 2 .

In addition, instead of providing the substrate tip correcting mechanism 70, it may also be provided at a position corresponding to the substrate holding portion on the tip side of the finger portion 51 of the manipulator 50 (the opposite side of the substrate input port side of the chamber, that is, as in the previous embodiment). The pressure plate 2 at the innermost position) is provided with an adsorption pad equipped with an up and down drive mechanism.

Fig. 5 shows another embodiment of the present invention. In the present embodiment, the suction and adsorption holes arranged on the pressure plate 2 are divided into a plurality of groups (R1, R2, R3), and the negative pressure sources are set respectively so that the negative pressure supplied to each group can be changed, or a negative pressure The source is branched, and the pressure can be adjusted by installing a pressure regulating valve on the piping in the middle.

In Fig. 5, the suction and adsorption holes are divided into three groups R1, R2, R3, and two kinds of negative pressures A1 and A2 are applied respectively by negative pressure source. Since the orientation mold of the liquid crystal panel and the like are formed on the central portion of the substrate 60, the substrate is supported by the suction pads 53 on both sides of the manipulator and transported into the assembly device. For this reason, as shown in FIG. 5( a ), the central portion of the substrate is bent and there is a distance from the pressure plate 2 . For this purpose, first, a large negative pressure A1 is applied to the central suction and adsorption hole R2 to adsorb the central portion of the substrate ( FIG. 5( b )). Next, by applying a negative pressure A2 smaller than the negative pressure A1 applied to the central portion to the suction and adsorption holes R1 and R3 on both sides, the substrate 60 can be adsorbed to the pressure plate 2 without the substrate 60 being skewed. on (Fig. 5(c)). In the present embodiment, the state in which the adsorption holes are divided into three groups is described as an example, but by dividing into finer groups and gradually absorbing from the center of the substrate to the ends of the substrate, more accurate adsorption can be achieved. In addition, this action is to arrange a plurality of suction pads 56 capable of moving up and down as described in FIG. This is realized by suction through a plurality of suction suction holes provided in the pressure plate 2 . In addition, although not shown, in order to prevent the substrate from falling when the chamber of the substrate mounting apparatus is depressurized, on the pressure plate, in addition to the above-mentioned suction and adsorption mechanism, an adhesive holding mechanism and an electrostatic adsorption mechanism are also provided together.

Next, the operation of bonding liquid crystal panels will be described using the substrate mounting apparatus 1 of the present invention.

First, the upper substrate, which is coated in a black matrix shape or close to a black matrix shape and surrounded by an adhesive agent around the outer periphery of the liquid crystal panel in a frame shape, is turned over so that the surface coated with the adhesive agent is on the lower side. , placed on one finger located on the underside of the manipulator. In addition, the lower substrate, on which the liquid crystal was previously applied, was mounted on the other finger of the upper manipulator in a state where the liquid crystal dripping surface was placed on the upper side. In this way, with the two substrates placed on the upper and lower fingers, the robot moves to the front of the bonding device. The substrate mounting apparatus 1 opens the gate valve 16 of the upper chamber T2, and the manipulator inserts the inverted upper substrate on the lower finger into the apparatus.

The substrate assembly device 1 lowers the upper side plate 2, and absorbs and holds the reversed upper side substrate on the lower side of the upper side plate 2 by sucking and sucking by negative pressure. At this time, when there is a warp on the substrate, the substrate tip correction mechanism 70 is operated together with the suction pad to keep it flat. That is, when there is a deflection on the substrate, by protruding the adsorption pad from the board surface to a position where the substrate can be adsorbed, when the adsorption pad adsorbs the substrate, the surface of the adsorption pad is retracted to the position of the upper board surface, which can Hold the substrate flat on the board.

Furthermore, when the suction holes of the upper plate are divided into a plurality of groups, negative pressure is applied sequentially from the suction holes in the center to the suction holes on the end side, so that the substrate can be held flat without distortion.

Next, once the lower manipulator retreats from the substrate assembly device 1, the substrate assembly device 1 waiting for the retreat uses the substrate lifting mechanism 43 and the holding claw lifting mechanism 41 to move the liquid crystal panel that has been bonded on the lower side plate 24 upwards. promote. In this state, the lower manipulator is reinserted into the lower side of the liquid crystal panel in the substrate mounter 1, and after the manipulator is lifted upward, the liquid crystal panel is taken out from the board mounter 1 by moving the manipulator backward. The substrate mounter 1 lowers the substrate elevating mechanism 43 and the holding claw elevating mechanism 41 .

Next, insert the lower substrate pre-coated with liquid crystal on the upper manipulator into the substrate assembly device 1, and the substrate assembly device 1 raises the holding claw lifting mechanism 41, and the lower substrate is lifted. After the manipulator retreats, put the The lower substrate is placed on the lower plate 24, and the lower substrate is sucked and sucked.

Next, lower the moving axis of the lens barrel 21 of the vertical camera to measure the position of the substrate mark on the upper substrate, and move to a position where the center of the mark on the upper substrate coincides with the center of the lens barrel 21 of the camera with the horizontal moving axis. Next, the upper plate 2 is lowered, and the deviation of the mark positions between the upper board and the lower board is measured by the lens barrel 21 of the camera. By raising the ball bearing 34 with an elevating mechanism not shown, the upper chamber part T2 is raised through the receiving seat 35 with an adjustment mechanism, so that the sealing ring 25 and the upper chamber part T2 are slightly in contact with or not in contact (the load of the upper chamber does not act on the sealing ring 25), drive the motor 26, the motor 29, and the motor 30 to drive the lower chamber part T1. As a result, the lower plate 24 moves horizontally in the XYθ direction together with the lower chamber T1, and rough positioning of the alignment marks on the lower substrate and the upper substrate is performed. After the rough positioning is finished, the ball bearing 34 is lowered. Next, when the upper and lower plates are adsorbed by the electrostatic chuck, a voltage is applied to the electrostatic chuck to adsorb the substrate. In this state, the gate valve 16 is closed, and the decompression chamber is decompressed and exhausted with a vacuum pump. During the decompression and exhaust process, the upper side plate 2 is raised to easily exhaust the gas between the upper and lower substrates.

When the decompression chamber reaches the specified decompression state, lower the upper side plate 2 again, measure the positional deviation between the upper and lower substrates, drive the lower chamber T1 by driving the motor 26, motor 29, and motor 30, and move horizontally in the XYθ direction , perform micropositioning of the calibration marks on the lower and upper substrates. After the micro-positioning is completed, the upper plate 2 is lowered while measuring the value of the load cell 22, and the substrate is bonded under pressure. After the pressing force reaches the specified value for compressing the adhesive, the pressurization is terminated, and the temporary fixing position of the substrate is pressed by the pressurization/UV irradiation mechanism 40, and UV light is irradiated while pressing the UV adhesive for temporary fixing applied in advance. , for temporary fixation so that the position of the substrate does not shift.

After the temporary fixation is completed, the pressurization/UV irradiation mechanism 40 is raised. When the upper side plate 2 is adsorbed in vacuum by the electrostatic chuck, the voltage is cut off, and the upper side plate 2 is raised after a few minutes of power failure and standby. When the upper side plate 2 uses adhesion, the upper side board is mechanically pressed against the lower side board by a plurality of pins, and in the state where the pins are pressed down, the upper side board is interrupted by only raising the upper side board. side of the substrate is held.

Then, an inert gas such as nitrogen or air is introduced into the decompression chamber through a valve provided in the decompression chamber, and the chamber is opened to the atmosphere. Next, the gate valve 16 is opened to carry out the input and output of the substrate. When performing maintenance such as cleaning in the vacuum chamber of the substrate assembly device 1, the connecting mechanism installed on the upper chamber part T2 is activated to connect the pressurized substrate 7 and the upper chamber part T2 into one body, and the drive motor 10 is connected to the upper side plate. 2 rise together in the direction of the Z axis. Thereby, maintenance of the upper and lower plates can be performed with the chamber opened. As described above, in this embodiment, when holding a large substrate on the upper side plate, the problem that the substrate cannot be reliably held on the upper side plate due to the substrate deflection when the substrate is input can be solved, and the substrate can be improved. Fitting precision.

As described above, according to the substrate laminating device of the present invention, when the substrate is loaded into the device, especially when a large upper substrate is held on the upper side plate, since the substrate can be freed from deflection, The substrate is reliably held at the specified position due to the influence of the influence, so the accuracy of the position matching can be improved, and the time required for the position matching can be shortened at the same time.

Claims (7)

1. substrate assembling device has: be used to make reduced pressure atmosphere the chamber, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps infrabasal plate at interval with upper substrate on remaining on above-mentioned increased pressure board; The position that drives the aforesaid substrate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the substrate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of aforesaid substrate, it is characterized in that

On above-mentioned increased pressure board, have a plurality of adsorption holes of the negative pressure that is used to keep upper substrate, near the adsorption hole the increased pressure board central portion in above-mentioned a plurality of adsorption hole is separately positioned on a plurality of adsorbent pad that have reciprocating mechanism, after above-mentioned adsorbent pad descended, keeping substrate, make its substrate that retreats into above-mentioned increased pressure board keep face, keep upper substrate by the negative pressure of supplying with by above-mentioned a plurality of adsorption holes and adsorbent pad.

2. substrate assembling device as claimed in claim 1 is characterized in that, above-mentioned a plurality of adsorbent pad only are arranged near the increased pressure board central portion.

3. substrate assembling device as claimed in claim 1 is characterized in that, with end one side of the opposite side in substrate input port of above-mentioned increased pressure board a plurality of adsorbent pad with reciprocating mechanism is being set also.

4. substrate assembling device, have: the chamber that is used to make reduced pressure atmosphere, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps at interval infrabasal plate with the upper substrate on remaining on above-mentioned increased pressure board, the position that drives the aforesaid substrate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the upper and lower base plate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of above-mentioned upper and lower base plate, it is characterized in that

On above-mentioned increased pressure board, be provided for supplying with a plurality of adsorption holes of negative pressure,

Deflection according to the finger tip side that upper substrate is transported to the mechanical arm on the above-mentioned increased pressure board, at the indoor upper substrate top correction mechanism of shifting increased pressure board one side on being provided for above-mentioned upper substrate onto, on by the top ends of upper substrate top correction mechanism, shift onto under the state of increased pressure board one side upper substrate, adsorption hole to above-mentioned increased pressure board is supplied with negative pressure, attracts absorption to remain on the increased pressure board upper substrate.

5. substrate assembling device, have: the chamber that is used to make reduced pressure atmosphere, upper substrate is remained on the above-mentioned indoor and increased pressure board that can move up and down, relative and vacate the substrate holding plate that keeps at interval infrabasal plate with the upper substrate on remaining on above-mentioned increased pressure board, the position that drives the aforesaid substrate holding plate and carry out above-mentioned upper substrate and infrabasal plate meets, driving above-mentioned increased pressure board up and down makes the interval stenosis between the substrate narrow, fit in reduced pressure atmosphere by the bonding agent that is arranged on any one of above-mentioned upper and lower base plate, it is characterized in that

On above-mentioned increased pressure board, be provided for supplying with negative pressure, attract absorption to keep a plurality of adsorption holes of upper substrate, above-mentioned a plurality of adsorption holes are divided into group more than 3, make the formation that has negative pressure source or pressure regulator valve, make each group can change absorption affinity.

6. the described substrate assembling device of each of claim 1 to 5, it is characterized in that, the adsorption hole on being arranged at above-mentioned increased pressure board, when above-mentioned indoor decompression, be used to keep the absorption affinity also effect that diminishes that attracts of aforesaid substrate to keep the Electrostatic Absorption mechanism or the bonding maintaining body of the confining force of substrate even also have.

7. substrate assembly method, the empty standard width of a room in an old-style house is every also relative make 2 substrates in vacuum chamber about, by attracting absorption to remain on the upper and lower plates respectively, carrying out the position meets, interval by making two substrates is narrow, carry out the applying of two substrates by the bonding agent that is arranged on any one substrate, it is characterized in that

When remaining on upper substrate on the upper plate, the upper substrate that is transfused to that is etat lacunaire with respect to the upper plate central portion, supply with negative pressure to the adsorption hole of periphery successively by adsorption hole from above-mentioned upper plate central portion, thereby pick up upper substrate, attract absorption to keep to periphery to it successively from the upper substrate central portion.

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