CN100419430C - sensor device - Google Patents

Abstract

The invention discloses a sensor device, comprising: a sensor chip (100) having a movable part (20) on one surface, a circuit chip (200) laminated on the sensor chip opposite to the movable part of the sensor chip, Bumps (80) located between the sensor chip and the circuit chip. In the sensor chip, the sensor chip and the circuit chip are electrically connected through bumps, and the movable part of the sensor chip is separated from the circuit chip by a certain gap through the bumps. Therefore, it is possible to effectively prevent the parasitic capacitance of the electrical connection between the two chips from changing due to the impact. For example, a sensor chip can be used as an angular velocity sensor device having a vibrator as a movable part.

Description

sensor device

technical field

The present invention relates to a sensor device in which a sensor chip and a circuit chip are laminated, having a movable portion as a sensing portion on one surface of the sensor chip, and the two chips are electrically connected. In particular, the present invention relates to a sensor device for detecting dynamic quantities such as angular velocity, acceleration, etc. by means of a movable part.

Background technique

In a sensor device having a sensor chip in which a movable portion is formed on one surface side of a semiconductor substrate, the movable portion is moved by a dynamic amount such as acceleration, angular velocity or pressure.

For example, an angular velocity sensor having a vibrator composed of a comb-shaped beam structure, an acceleration sensor having a movable electrode and a fixed electrode composed of a comb-shaped beam structure (for example, Japanese Patent JP-A-2004-286615) , a pressure sensor having a semiconductor film, and the like are proposed as such a sensor device.

Here, in such a sensor device, a circuit chip constituted by an IC chip or the like separated from the sensor chip is arranged for processing a signal output from the sensor chip or the like. In this case, a stack structure for laminating the sensor chip and the circuit chip and for electrically connecting the two chips is employed to make the body of the sensor device more compact.

In a sensor device shown in FIG. 15 , a circuit chip 200 is fixed to the inside of a package 300 sealed by a cover portion 320 by an adhesive 1 . The sensor chip 100 is fixed to this circuit chip 200 by an adhesive layer 2 or the like.

The movable part 20 is formed on the upper surface of the sensor chip 100 as a sensor element (ie, a sensing part). Then, the sensor chip 100 and the circuit chip 200, and the circuit chip 200 and the package 300 are electrically connected with the wire 3 by wire bonding.

However, as shown in FIG. 15 , in this sensor chip, the sensor chip 100 and the circuit chip 200 are electrically connected through wires 3 . Therefore, the wire 3 as this electrical connection portion is easily deformed by an impact applied from outside the sensor device.

When the wire 3 is deformed in this way, the sensor output output from the sensor chip is affected by the change of the parasitic capacitance due to the deformation of the wire 3, so it is easy to change.

In addition, when a foreign substance present in the package 300 moves and adheres to the movable part 20 due to an applied impact, there is a problem of hindering the movable characteristic of the movable part 20, and the best performance cannot be obtained. Sensor characteristics.

Contents of the invention

In view of the above problems, it is an object of the present invention to provide a sensor device capable of effectively preventing changes in the parasitic capacitance of an electrical connection portion of two chips due to impact or the like, by combining a sensor chip having a movable part on one surface and a circuit Chips are stacked and two chips are electrically connected to each other.

According to an aspect of the present invention, there is provided a sensor device comprising a sensor chip having a movable part on one surface, a circuit chip laminated on the sensor chip opposite to the movable part of the sensor chip, a circuit chip located on the sensor chip and a circuit chip. Bumps between chips. In the sensor chip, the sensor chip and the circuit chip are electrically connected through the bump, and the movable part of the sensor chip is separated from the circuit chip by a certain gap by the bump.

Since the bump can be used to form a predetermined gap between the two chips, the movable portion can be easily separated from the circuit chip. Therefore, the movable portion serving as the sensing portion can be properly operated. In addition, the two chips are electrically connected through bumps, which can prevent deformation of the electrical connection between the two chips, thereby effectively preventing changes in the parasitic capacitance of the electrical connection due to impact.

For example, an adhesive member having electrical insulation properties may be arranged between the sensor chip and the circuit chip for bonding the sensor chip and the circuit chip. Even in this case, the adhesive is arranged spaced apart from the movable part of the sensor chip. Therefore, it is possible to effectively increase the mechanical strength between the two chips while making the movable part work correctly.

An adhesive may be placed around the bump to seal the bump. Alternatively, an adhesive may be arranged around the movable part between the sensor chip and the circuit chip. In this case, the movable portion located on the inner peripheral side of the adhesive is sealed by the adhesive.

Alternatively, the adhesive member may be constituted by an adhesive film, in which case the adhesive film has a first portion opposite to the movable portion and a second portion outside the first portion, and the first portion of the adhesive film is made larger than The second portion of the adhesive film is thin so as to form a recess recessed from the surface on the side of the movable portion. Alternatively, the adhesive film has a protrusion protruding in a direction spaced from the movable portion.

Furthermore, the adhesive may be arranged to form a seal for sealing the movable part around the movable part and the applicator may be provided for covering the seal. In this case the movable part can be tightly sealed.

In the present invention, the lug may have a plurality of lug parts individually arranged around the movable portion. In this case, the bump member may be located in a region where the adhesive member is arranged, or may be arranged outside the bump member so as to surround the bump member. In addition, the adhesive member may have a plurality of adhesive members arranged around the movable portion, in which case the adhesive member may be arranged around the bump member or may be arranged at a position different from the bump member.

Description of drawings

The above and other objects, features and advantages of the present invention will be more apparent through the following detailed description of preferred embodiments with reference to the accompanying drawings. In the attached picture:

1 is a schematic sectional view of an angular velocity sensor device as a sensor device according to a first embodiment of the present invention;

2 is a schematic plan view of the surface structure on the bump side of the circuit chip in the angular velocity sensor device shown in FIG. 1;

Fig. 3 is a schematic plan view of an angular velocity detection element in the angular velocity sensor device shown in Fig. 1;

4 is a schematic cross-sectional view of a first method for forming a layout structure of bonding elements;

5 is a schematic cross-sectional view of a second method of forming a bond layout structure;

6 is a schematic cross-sectional view of a third method for forming a layout structure of bonding elements;

7A and 7B are schematic cross-sectional views of a fourth method of forming a bond layout structure;

Fig. 8 is a first variation example of the planar layout shape of the bonding member in the above-mentioned first embodiment;

Fig. 9 is a second modification example of the planar layout shape of the bonding member in the above-mentioned first embodiment;

Fig. 10 is a third modification example of the planar layout shape of the bonding member in the above-mentioned first embodiment;

11 is a schematic sectional view of an angular velocity sensor device as a sensor device according to a second embodiment of the present invention;

12 is a schematic sectional view of a part of an angular velocity sensor device as a sensor device according to a third embodiment of the present invention;

13 is a schematic sectional view of an angular velocity sensor device as a sensor device according to a fourth embodiment of the present invention;

14 is a schematic plan view of a part of an angular velocity sensor device as a sensor device according to a fifth embodiment of the present invention; and

15 is a schematic cross-sectional view of a conventional sensor device constituted by laminating a sensor chip and a circuit chip.

Detailed ways

(first embodiment)

FIG. 1 shows the overall structure of an angular velocity sensor device S1 as a sensor device according to a first embodiment of the present invention. FIG. 2 is a schematic plan view showing the surface structure of the circuit chip 200 having bumps 80 in the angular velocity sensor device S1 shown in FIG. 1 when the sensor chip 100 is in a transparent state. 3 is a schematic plan view of the angular velocity detecting element 100 in the angular velocity sensor device S1 shown in FIG. 1 as seen from the upper surface of the substrate 10 constituting the angular velocity detecting element 100.

As shown in FIG. 1 , the angular velocity sensor device S1 of this embodiment is generally formed by arranging an angular velocity detecting element 100 as a sensor chip, a circuit chip 200, and a package 300 for accommodating the angular velocity detecting element 100 and the circuit chip 200. form.

First, the angular velocity detection element 100 will be described mainly with reference to FIG. 3 . The angular velocity detecting element 100 has a structure 10 such as a semiconductor substrate, and is formed by performing a well-known micromachining process for this substrate 10 .

For example, an SOI (silicon on insulator) substrate may be used as the substrate 10, and the second silicon layer as the second semiconductor layer is bonded to the first semiconductor layer as the first semiconductor layer through an oxide film as the insulating layer. A silicon layer forms the SOI substrate.

As shown in FIG. 3 , trench etching and release etching (release etching) etc. are carried out on the surface layer (for example, the second silicon layer in the SOI substrate) of this substrate 10 to form the grooves separated by grooves. Beam structure 20-60.

These beam structures 20 - 60 are generally constituted by the vibrator 20 as a sensing portion (ie, a movable portion) for sensing, the respective beam portions 23 , 40 , and the respective electrodes 50 , 60 .

The vibrator 20 is formed at a central portion of the substrate 10 so as to vibrate on a surface that is horizontal with respect to the substrate 10, that is, on a paper surface in FIG. 3 . In this example, the vibrator 20 consists of an approximately rectangular first vibrating portion 21 positioned at the central portion, a rectangular frame-shaped second vibrating portion 22 positioned at the outer periphery of the first vibrating portion 21, and a second vibrating portion 22 for connecting the first vibrating portion. 21 and the driving beam part 23 of the second vibrating part 22.

The vibrator 20 is connected to the anchor portion 30 disposed in the peripheral portion of the substrate 10 through the detection beam portion 40 . Here, the solid part 30 is fixed and supported on the lower part of the surface layer in the substrate 10 where the beam structure 20 is formed (ie, the supporting substrate part). The vibrator 20 is suspended from this supporting substrate portion.

Here, as shown in FIG. 3, by forming the drive beam portion 23 in a shape extending in the Y direction, for example, the drive beam portion 23 can be elastically deformed only in the X direction. By forming the detection beam portion 40 into a shape extending in, for example, the X direction, the detection beam portion 40 can be elastically deformed only in the Y direction.

The first vibration portion in the vibrator 20 vibrates in the X direction (drive vibration direction) in a plane horizontal to the substrate 10 by the drive beam portion 23 . On the other hand, the entire vibrator 20 can vibrate in the Y direction (detection vibration direction) in the plane horizontal with respect to the substrate 10 by the detection beam portion 40 .

A driving electrode 50 for operating and vibrating the first vibrating portion 21 in the X direction is arranged between the first vibrating portion 21 and the second vibrating portion 22 .

Similar to the anchor portion 30, this driving electrode 50 is fixed to the above-mentioned support substrate portion. The driving electrode 50 is arranged to face the comb-tooth portion (comb-tooth portion for driving) 21a protruding from the first vibrating portion 21 so that the comb-teeth are engaged with each other.

A detection electrode 60 for detecting angular velocity is arranged on the outer periphery of the second vibrating portion 22 .

This detection electrode 60 detects an angular velocity around the Z axis perpendicular to the substrate 10 based on the vibration of the vibrator 20 . Similar to the anchor portion 30, the detection electrode 60 is also fixed to the above-mentioned support substrate portion. The detection electrode 60 is arranged to oppose the comb-tooth portion (comb-tooth portion for detection) 22a protruding from the second vibrating portion 22 so that the comb-teeth are engaged with each other.

In addition, in this angular velocity detecting element 100, pads 70 (see FIG. 1) are arranged at appropriate positions on the upper surface of the substrate 10 for applying voltages to the above-mentioned vibrator 20, driving electrodes 50, detecting electrodes 60, etc., and using to take out the signal. The pad 70 of the detection electrode 60 is shown in FIG. 3 .

As shown in FIGS. 1 and 3, a pad 70 is arranged on the peripheral portion of the substrate 10, and this pad is formed of aluminum or the like. As shown in FIG. 1 , bumps 80 each formed of an Au (gold) bump, a solder bump, or the like are respectively connected to the pads 70 .

This bump 80 can be formed by various methods such as a conventional stud bump forming method, a solder bump forming method, a screen printing method using a conductor paste such as Au, or an inkjet method using a sodium paste such as Au. printing method.

Thus, as shown in FIG. 1 , angular velocity detecting element 100 as a sensor chip is laminated with circuit chip 200 via bumps 80 in a state where vibrator 20 as a movable portion faces circuit chip 200 . The angular velocity detection element 100 and the circuit chip 200 are electrically connected through bumps 80 .

Here, as shown in FIG. 1 , the pads 70 of the angular velocity detection element 100 and the pads 210 of the circuit chip 200 are respectively connected by bumps 80 . In this angular velocity sensor device S1 , the space between the sensor chip 100 and the circuit chip 200 (ie, the height between these two chips) can be secured by the bump 80 . Therefore, the vibrator 20 and the circuit chip 200 can be separated from each other.

In this circuit chip 200, for example, MOS transistors, bipolar transistors, etc., can be formed by known semiconductor processes for silicon substrates and the like. Therefore, this circuit chip 200 can be set to have the function of sending the voltage for operating the vibrator 20 to the angular velocity detection element 100 and providing an electrical signal sent from the angular velocity detection element 100 during conversion, amplification, etc., and transmitting the electrical signal Functions such as sending to the outside.

As shown in FIG. 1 , the circuit chip 200 can be electrically and mechanically connected to the package 300 through bumps 80 .

Here, as shown in FIG. 1 , the package of this embodiment has a wire 310 made of a conductive material inside or on the surface. The material of the package 300 is not particularly limited, and may be made of ceramics, resin, or the like.

For example, this package 300 may be constructed as a ceramic laminated wiring substrate in which a composite ceramic layer of aluminum or the like is laminated. In this laminated wiring substrate, the above-mentioned wiring 310 is formed between layers, and each wiring 310 is conducted by a via hole or the like.

As shown in FIG. 1, the pad 210 of the circuit substrate 200 and the above-mentioned wire 310 on the surface of the package 300 are electrically and mechanically connected through the bump 80, which is used for connecting the above-mentioned two chips 100 and 200. The bump 80 is similar.

In the example shown in FIG. 1 , the wire 310 is exposed in a stepped portion provided in the package 300 . The peripheral portion of the circuit chip 200 is sized larger than the angular velocity detecting element 100 as a sensor chip, and is formed in a shape supported by this stepped portion in the package. The pad 210 of the circuit chip 200 and the wire 310 of the package 300 are connected through the bump 80 with this stepped portion.

The angular velocity detection element 100 , the circuit chip 200 and the outside are electrically connected through the bump 80 and the wire 310 of the package 300 . For example, an output signal from the circuit chip 200 is transmitted to the outside through the bump 80 and the wire 310 of the package 300 .

As shown in FIG. 1 , a cover portion (cover) 320 is connected and fixed to the opening portion of the enclosure 300 . The inside of the capsule 300 is sealed by this cover portion 320 .

The material of the cover portion 320 is not limited to ceramics, resin, metal and the like. In addition, when the cover portion 320 and the package 300 are connected, various joining methods such as bonding, welding, etc. may be used. Nitrogen or the like, which is an inert gas, can be enclosed inside the enclosure 300 sealed by the cover portion 320 .

In addition, as shown in FIGS. 1 and 2 , an adhesive member 400 having electrical insulation properties and for bonding the angular velocity detecting element 100 as a sensor chip and the circuit chip 200 is arranged between the two chips 100 and 200 . The bonding member 400 is separated from the vibrator 20 as a movable part in the angular velocity detecting element 100 by a certain gap.

Here, as shown in FIGS. 1 and 2 , the bonding member 400 is arranged around the bump 80 between the angular velocity detecting element 100 and the circuit chip 200 , and the bump 80 is sealed by this bonding member 400 .

In the bonding member 400 , a recess 410 (recessed portion) recessed from one side surface of the vibrator 20 is formed in the portion opposite to the vibrator 20 by making a portion corresponding to the vibrator thinner than its peripheral portion. In this way, the bonding member 400 is separated from the vibrator 20 by the concave portion 410, and the vibrator 20 and the bonding member 400 are in a non-contact state.

In addition, in this example, as shown in FIG. 2 , the peripheral portion of the concave portion 410 in the bonding member 400 surrounds the vibrator 20 as a movable portion between the angular velocity detecting element 100 and the circuit chip 200 and is arranged in a ring shape. The vibrator 20 located at the inner periphery of the adhesive member 400 is sealed by the adhesive member 400 outside the vibrator 20 .

In the example shown in FIGS. 1 and 2 , the concave portion 410 in the bonding member 400 is formed in a shape in which a part of the bonding member 400 passes from the surface of the bonding member 400 on the angular velocity detecting element 100 side. recessed. However, in this embodiment, this recess 410 may also be formed to have a through hole extending through the bonding member 400 in the thickness direction. That is to say, the recess 410 of the bonding member 400 in this embodiment may be a cavity that does not extend through the bonding member 400 , but may also include the aforementioned through hole.

Here, when the recess 410 is formed as a through hole in this way, the bonding member 400 does not exist in the portion that is the recess 410 in FIG. 2 . That is, the bonding member 400 is partially arranged in a frame shape so as to be arranged over the entire periphery of the peripheral portion of the angular velocity detecting element 100 including the bump 80 .

A material made of resin having electrical insulating properties such as polyimide or the like can be used as this bonding member 400 .

For example, a material formed of a film-like adhesive film such as NCF (non-contact film) formed of polyimide, etc., a film formed using a polyimide paste by a printing method such as screen printing, inkjet, etc. can be used as Adhesive 400.

A method of manufacturing the angular velocity sensor device S1 of this embodiment will be described below.

First, bumps 80 are formed on the surface of the circuit chip 200 opposite to the angular velocity detection element 100 , and the bonding member 400 is arranged on the bumps 80 . Here, the bumps 80 may be formed using the above-described stud bumping method and solder bumping method, a screen printing method, or a printing method using an inkjet method or the like.

Here, FIGS. 4 , 5 , 6 , 7A and 7B respectively show various methods for the layout of this bonding member 400 . One of these methods shown in FIGS. 4-6 and FIGS. 7A and 7B can be used for the manufacturing method of this embodiment.

In a first method shown in FIG. 4, an adhesive member 400 formed of an adhesive film is attached and bonded to the circuit chip 200 having the bump 80 thereon. The above-mentioned concave portion 410 is formed by irradiating the laser beam R and removing a part of the bonding member 400 . In this way, the layout of the bonding member 400 in this method is completed.

As mentioned above, the concave portion 410 of the bonding member 400 may also be a through hole extending through the bonding member 400 in the thickness direction, that is, a through hole directly reaching the circuit chip 200 . However, when the through hole is formed in this way, there is a possibility that the circuit chip 200 may be damaged by the laser beam R irradiated onto the circuit chip 200 after the concave portion 410 is formed in this way. Therefore, in this case, it is necessary to arrange the recess 410 such that a portion (the bottom in FIG. 4 ) is left without completely extending through the recess 410 in the bonding member 400 .

In the second method shown in FIG. 5, an adhesive member 400 made of an adhesive film is adhered to a circuit chip 200 having bumps 80 thereon, and is formed by pressing a part of the adhesive member 400 with a stamper K. deformed to form the above-mentioned concave portion 410 . Thus, the layout of the bonding member 400 in this method is completed by pressing.

In the method shown in FIGS. 4 and 5 , the bonding member 400 disposed on the circuit chip 200 completely covers the bump 80 . However, thereafter, when the angular velocity detecting element 100 is laminated with the circuit chip 200 through the bonding member 400, if the bonding member 400 is softened by heating or the like, the bump 80 will break and penetrate the bonding member 400, which is different from the angular velocity. The pads 70 of the detection element 100 are in contact.

In the third method shown in FIG. 6, when the angular velocity detecting element 100 is stacked with the circuit chip 200, a hole 420 is punched out in a portion corresponding to the bump 80 in the adhesive member 400 made of an adhesive film by punching or the like. . In this case, there is no need for the bumps to break and penetrate the bond 400 .

The bonding member 400 in which the hole 420 is formed is adhered to the circuit chip 200 having the bump 80 thereon. Afterwards, the above-mentioned concave portion 410 is formed in the bonding member 400 using the above-mentioned laser and stamper. In this way, the layout of the bonding member 400 in this method is completed.

In a fourth method shown in FIGS. 7A and 7B , the bonding member 400 is formed by a printing method such as screen printing, inkjet printing, or the like.

In this case, as shown in FIG. 7A, the circuit chip 200 on which the bump 80 is formed is prepared. Next, as shown in FIG. Permanently print to form the adhesive 400.

In this embodiment, the bonding member 400 may be disposed on the bump forming surface in the circuit chip 200 using the method shown in FIGS. 4-7B and the like.

The bonding member 400 may be arranged in a chip state, that is, an independent state of the circuit chip 200, or may be arranged in a wafer state instead of a chip state, and then become chips by performing a dicing process.

In each arrangement method of the bonding member 400 , it is preferable to set the thickness of the bonding member 400 to be slightly larger than the height of the bump 80 . This is because the amount of deformation of the softer bonding member 400 should be taken into account, because the contact of each bump 80 is through the mutual contact between the two chips 100, 200 in the two chips 100, 200 being stacked in the subsequent process. Extruded to carry out.

Angular velocity detection element 100 (sensor chip) is laminated with circuit chip 200 having bumps 80 and bonding member 400 thereon such that the surface of angular velocity detection element 100 on the vibrator 20 side faces circuit chip 200 . The two chips 100, 200 are then pressed manually.

Thus, as described above, when the bump 80 is covered with the bonding member 400 , the bump 80 breaks and penetrates the bonding member 80 and comes into contact with the pad 70 of the angular velocity detecting element 100 . Or in other ways, when the bump 80 is exposed from the bonding member 400 , the exposed bump 80 contacts the pad 70 of the angular velocity detecting element 100 .

Thereafter, the angular velocity detecting element 100 and the circuit chip 200 are electrically connected by performing a bonding method by the bump 80 as in the bonding using pad pressure bonding, the bonding using, or the like.

In addition, the angular velocity detection element 100 and the circuit chip 200 are mechanically combined with the electrical connection structure through the adhesive 400 by utilizing the adhesive function of the adhesive 400 and utilizing the softening of the adhesive 400 during the heating process during bump bonding, etc. together.

In this way, after the angular velocity detection element 100 and the circuit chip 200 are bonded by the bump 80 and the bonding member 400, the two chips 100, 200 are passed through the bumps in the peripheral portion of the circuit chip 200 located outside the angular velocity detection element 100. Engaged with the enclosure 300 .

Thereafter, the cover portion 320 is attached to the enclosure 300 in a state where the above-mentioned nitrogen gas or the like is sealed inside the enclosure 300 . In this way, the angular velocity sensor device S1 shown in FIG. 1 is completed.

The basic detection operation of this angular velocity sensor device S1 will be described below with reference to FIGS. 1-3.

First, a driving signal (sine wave voltage, etc.) is applied from the circuit substrate 200 to the driving electrode 50 through the bump 80 , and an electrostatic force is generated between the comb tooth portion 21 a of the first vibrating portion 21 and the driving electrode 50 . Thus, the first vibrating portion 21 is operated and vibrated in the X direction by the elastic force of the driving beam portion 23 .

When the angular velocity Ω is applied around the Z-axis under the vibration of the first vibrating part 21, the Coriolis force acts on the first vibrating part 21 in the Y direction, and the entire vibrator 20 acts on the elastic force of the detection beam 40. Down is detected and vibrated in the Y direction.

The capacitance between the detection electrode 60 and the comb teeth of the detection comb-tooth portion 22a is changed by this detection vibration. Therefore, the magnitude of the angular velocity Ω can be calculated by detecting the capacitance change.

Specifically, in FIG. 3, when the vibrator 20 moves in one direction along the Y-axis direction, among the left and right detection electrodes in FIG. Variations are set to be inverses of each other. Accordingly, the respective capacitance changes in the left and right detection electrodes 60 are converted into voltages, and the two voltage values are differentiated, amplified, and output, thereby calculating the angular velocity.

According to this embodiment, in the angular velocity sensor device S1, an angular velocity detecting element (sensor chip 100) having a vibrator 20 as a movable portion on one surface and a circuit chip 200 are stacked, and the two chips 100, 200 are electrically connected. In addition, the angular velocity detecting element 100 and the circuit chip 200 are stacked via the bumps 80 in a state where the vibrator 20 is opposed to the circuit chip 200 . In addition, the chips 100 , 200 are electrically connected by the bumps 80 , and the vibrator 20 and the circuit chip 200 are separated from each other by the bumps 80 .

According to this sensor device S1 , the angular velocity detection element 100 and the circuit chip 200 are stacked in a state where the vibrator 20 and the circuit chip 200 face each other. In addition, since the height between the two chips 100 , 200 is ensured by the bump 80 , the vibrator 20 is separated from the circuit chip 200 . Therefore, the vibrator 20 can work correctly. That is, the sensing section 20 can function correctly in the sensor device S1 in this embodiment.

In addition, the chips 100, 200 are electrically connected through the bumps 80, and therefore, the range of deformation due to impact or the like is narrow compared to the electrical connection using wires in conventional sensors. That is, in this embodiment, since the electrical connection portion is formed using the bump 80, deformation of this electrical connection portion is prevented.

Therefore, according to this embodiment, in the sensor S1, the sensor chip 100 having a movable part on one surface and the circuit chip 200 are stacked and the two chips 100, 200 are electrically connected, so it is possible to prevent the two chips 100 from The parasitic capacitance of the electrical connection part of , 200 changes due to impact or the like.

In addition, in the angular velocity sensor device S1 of this embodiment, an adhesive member 400 having electrical insulation properties and used for bonding the two chips 100, 200 is arranged between the angular velocity detecting element 100 (sensor chip) and the circuit chip 200, And the bonding member 400 is separated from the vibrator 20 by a certain gap.

Therefore, the angular velocity detecting element 100 and the circuit chip 200 are bonded together by the bonding member 400 . Therefore, high mechanical strength can be ensured at the bonding portion between the two chips 100, 200, and deformation of the electrical connection portion between the two chips 100, 200 can be easily suppressed. In addition, since the bonding member 400 and the vibrator 20 as a movable part are spaced apart from each other by a certain gap, the vibrator 20 can be precisely operated.

In addition, in the adhesive member 400 of the angular velocity sensor device S1 of this embodiment, by making the portion corresponding to the vibrator 20 thinner than the peripheral portion thereof, the vibrator 20 side of the adhesive member 400 is formed. The recess 410 is recessed at the surface of the .

According to this structure, the vibrator 20 and the bonding member 400 can be properly spaced from each other. In particular, when an adhesive film is used as such an adhesive member 400, such a concave portion 410 can be appropriately formed by processing using the above-mentioned laser and mold.

Furthermore, in the angular velocity sensor device S1 of this embodiment, as shown in FIGS. 80.

Accordingly, the bump 80 and its peripheral portion can be reinforced by the bonding member 400 . In this way, the strength of the electrical connection portion using the bump 80 can be improved.

Furthermore, in the angular velocity sensor device S1 of this embodiment, as shown in FIGS. The surrounding vibrator 20 is sealed by adhesive 400 .

Therefore, the vibrator 20 as a movable part can be protected from external interference by sealing the vibrator 20 with the adhesive member 400 . Therefore, it is possible to preferably prevent foreign substances from entering the vibrator 20 . In this way, it is possible to prevent the occurrence of disadvantages such as foreign substances adhering to the vibrator 20 and its movable characteristics being hindered.

In addition, in the angular velocity sensor device S1 of this embodiment, an element composed of a film-like adhesive film, an element composed of a film produced by a printing method can be used as the adhesive member 400 .

Next, various modifications of this embodiment are described with reference to FIGS. 8 , 9 , 10 and the like. 8-10 are several variations of the planar layout shape of the bonding member 400 in the circuit chip 200 .

In each of the modification examples shown in FIGS. 8 to 10 , the above-mentioned bonding member 400 is arranged between the angular velocity detecting element 100 as a sensor chip and the circuit chip 200 . Similar to the embodiment shown in FIGS. 1 and 2, the bonding member 400 is spaced apart from the vibrator 20 as a movable part.

In addition, similar to the examples shown in FIGS. 1 and 2, high mechanical strength can be ensured at the junction of the angular velocity detection element 100 and the circuit chip 200, and the use of this bonding member 400 can enable the vibrator 20 to be effectively operate.

In the first modification example shown in FIG. 8 , similar to the example shown in FIGS. 1 and 2 , the bonding member 400 is arranged to surround the vibrator 20 between the angular velocity detection element 100 and the circuit chip 200 , and is positioned at The vibrator 20 at the inner periphery of the bonding member 400 is sealed by the bonding member 400 . However, in this variant shown in FIG. 8 , the bonding member 400 is arranged at a position offset from the protrusion 80 and does not directly seal the protrusion 80 .

In the example shown in FIG. 8 , the bonding member 400 is arranged outside the bump 80 , but if the bonding member 400 is arranged to surround the vibrator 20 , it may also be arranged inside the bump at a position misaligned from the bump 80 .

That is, the example shown in FIG. 8 corresponds to the case where the recess 410 is formed by the through hole in the bonding member 400 shown in FIG.

In a second variant shown in FIG. 9 , similar to the example shown in FIGS. 1 and 2 , an adhesive 400 is arranged around and seals the bump 80 . However, in this modification, the bonding member 400 is arranged around the bump 80 only, and is not arranged so as to surround the vibrator 20 entirely. That is, the bonding member 400 is only partially disposed around the bump 80 on the peripheral portion of the sensor chip 100 .

In a third modification example shown in FIG. 10 , the bonding member 400 is arranged on the peripheral portion of the sensor chip 100 between the bumps 80 and is arranged at a position misaligned from the bumps 80 . Therefore, the bonding member 400 in this example does not seal the bump 80 and is not arranged to completely surround the vibrator 20 .

In the variant shown in FIGS. 9 and 10 , the vibrator 20 is not sealed by the adhesive 400 . However, by using the sealing structure of the package 300 and the cover portion 320, and the gap between the two chips 100, 200 is small enough that foreign substances are not easy to enter the gap, when the foreign substances are not afraid of intrusion, the Fig. 9 and Fig. 9 can also be used. 10 of these examples are shown.

However, in the modified examples shown in FIGS. 9 and 10, when there is foreign matter entering from the gap of the bonding member 400 relative to the vibrator 20, it is necessary to take measures.

In this case, for example, a protective film (not shown in the drawing) which is generally disposed on the surface of the circuit chip 200 and made of polyimide or the like may be formed to be partially thickened by photolithography or the like, and A blocking dam is formed so that the vibrator 20 is surrounded by the thick-walled portion to prevent the intrusion of foreign substances. Specifically, the shape of the blocking dam is similar to the bonding member 400 shown in FIG. form.

(second embodiment)

Fig. 11 shows an angular velocity sensor device S2 used as a sensor device according to a second embodiment of the present invention.

In this embodiment, as shown in FIG. 11, similarly to the first embodiment described above, in the angular velocity sensor device S2, an angular velocity detecting element (sensor chip) 100 having a vibrator 20 on one surface and a circuit chip 200 are laminated , and the two chips 100, 200 are electrically connected. In addition, the angular velocity detection element 100 and the circuit chip 200 are laminated via the bumps 80 so that the vibrator 20 thereof faces the circuit chip 200 . In addition, the two chips 100 and 200 are electrically connected through the bumps 80 , while the vibrator 20 and the circuit chip 200 are separated by a certain gap through the bumps 80 .

Here, as shown in FIG. 11 , in the angular velocity sensor device S2 of this embodiment, the above-described bonding member is not disposed between the angular velocity detecting element 100 and the circuit chip 200 .

That is, if the mechanical connection strength can be ensured by using the bump 80 bonded between the angular velocity detecting element 100 and the circuit chip 200, the above-mentioned bonding member may also be omitted.

Even if the adhesive is omitted in the sensor device S2, the sensor device S2 can effectively operate the movable portion 20 and prevent the parasitic capacitance of the electrical connection portion of the two chips 100, 200 from changing due to impact or the like to the greatest possible extent.

As described in the modification of the first embodiment above, even in the angular velocity sensor device S2 of this embodiment, it is possible to partially thicken the protective film on the surface of the circuit chip 200 and form a barrier by this thick wall portion. Dam, to prevent the invasion of foreign substances.

(third embodiment)

FIG. 12 is a diagram of a part of an angular velocity sensor device S3 as a sensor device according to a third embodiment of the present invention.

In the third embodiment, as shown in FIG. 12, similarly to the first embodiment described above, in the angular velocity sensor device S3, an angular velocity detecting element (sensor chip) 100 having a vibrator 20 on one surface and a circuit chip 200 are stacked, and the two chips 100, 200 are electrically connected. In addition, in the state where the vibrator 20 is opposite to the circuit chip 200, the angular velocity detection element 100 is stacked on the circuit chip 200 through the bump 80, and the two chips 100, 200 are electrically connected through the bump 80, and the vibrator 20 and the circuit chip 200 separated by bumps 80 .

In addition, an adhesive member 400 having electrical insulating properties and used for bonding the two chips 100 , 200 is disposed between the angular velocity detection element 100 and the circuit chip 200 , and the adhesive member 400 is spaced apart from the vibrator 20 .

In the third embodiment, an element composed of a film-like adhesive film is used as the adhesive member 400, and this adhesive film constitutes a convex portion 430 protruding in a direction in which, as a movable part, A part corresponding to the vibrator 20 is separated from the vibrator 20, as shown in FIG. 12 .

Thus, in the angular velocity sensor device S3 of this embodiment, the vibrator 20 and the adhesive film as the adhesive member 400 can be effectively separated by the protrusion 430 . In addition, since the vibrator 20 is covered with the protrusion 430 of the bonding member 400 , foreign substances can be prevented from entering the vibrator 20 .

Here, as shown in FIG. 12, this convex portion 430 may be formed by bending an adhesive film or the like. In the embodiment shown in FIG. 12 , one protrusion 220 is formed on the circuit chip 200 , and the adhesive film is bent by using this protrusion 220 , thereby forming the protrusion 430 .

For example, as described above, the protective film on the surface of the circuit chip 200 is formed to be partially thickened, and this protruding portion 220 may be formed as this thick-walled portion or may also be formed by a separate adhesive film.

(fourth embodiment)

In the angular velocity sensor device of the above-described embodiment, the laminate of the circuit chips 200 in which the angular velocity detecting element 100 is laminated is mounted on the package 300 through the bumps 80 . However, it is also possible to use a structure without the package 300 as the sensor device.

That is, it is not necessary to mount a laminate constituted by laminating the angular velocity detecting element 100 and the circuit substrate 200 into the package. For example, the laminate may be a printed wiring board, a ceramic wiring board, or the like, and electrical connection using bumps may be performed.

FIG. 13 is an angular velocity sensor device S4 without a package according to a fourth embodiment of the present invention.

Here, a stack of two chips 100 , 200 is mounted on a printed wiring board 500 and constructed such that the circuit chip 200 and the printed wiring board 500 are electrically connected through bumps 80 .

Specifically, as shown in FIG. 13 , a through hole 510 into which the angular velocity detecting element 100 can be inserted is provided in the printed wiring board 500 , and the angular velocity detecting element 100 is inserted into this through hole 510 .

Pads 210 of the circuit chip 200 and unillustrated pads of the printed wiring board 500 are electrically connected by bumps 80 in the peripheral portion of the circuit chip 200 protruding outward from the angular velocity detection element 100 .

In addition, in the angular velocity sensor device S4 in this embodiment, the vibrator 20 as a movable part is also surrounded and sealed by the adhesive member 400 . Here, the outer periphery of the bonding member 400 is also covered and sealed by the sealing part 600 .

For example, as shown in FIG. 13 , the gap between the circuit chip 200 and the printed wiring board 500 including the bump 80 located outside the bonding member 400 and the gap between the angular velocity detecting element 100 and the printed wiring board 500 are filled. There is sealing material 440 .

The sealing material 440 is filled between the sensor chip 100 and the printed wiring board 500, and is made of a resin bonding material such as epoxy resin, polyimide resin, etc., which can be hardened after being injected into the arrangement space.

In addition, similarly to the first embodiment described above, a film formed by an adhesive film, a printing method, or the like can be used as the adhesive member 400 of this embodiment. In this embodiment, the sealing portion 600 for sealing the movable portion 20 is composed of these bonding members 400 and the sealing material 440 .

In addition, in the fourth embodiment, the surface of the sealing portion 600 including the bonding member 400 is covered with a coating material 700 for ensuring the sealing performance of the sealing portion 600 .

For example, an inorganic material or the like can be used as this coating material 700 . Specifically, Al ₂ O ₃ using the ALD (atomic layer deposition) film formation method and silicon oxide (Si ₃ N ₄ etc.) using the low-temperature catalytic CVD (low-temperature catalytic chemical vapor deposition: CAT-CVD for short) method can be used As coating material 700.

According to the angular velocity sensor device S4 of this embodiment using the coating material 700, the sealing performance of the sealing portion 600 for sealing the movable portion 20 can be improved, and the angular velocity sensor device S4 can be formed to be free from moisture in terms of preventing the intrusion of foreign substances. The blocking performance and other aspects are very good. Specifically, when the sealing performance of the sealing portion 600 is insufficient, the coating material 700 can be effectively used in the bonding member 400 and the sealing portion 600 .

In this embodiment, similar to the first embodiment described above, the two chips 100, 200 are electrically connected through the bumps 80, and the vibrator 20 and the circuit chip 200 are separated. In addition, the bonding member 400 is disposed between the two chips 100 , 200 , and the bonding member 400 is spaced apart from the vibrator 20 and the like.

In addition, the coating material 700 can also be used for the sensor device having the capsule 300 as in the above-described embodiment. For example, in the angular velocity sensor device S1 shown in FIG. 1 , the adhesive 400 for sealing the vibrator 20 is used as the sealing portion, however, a coating material may be formed on the surface of this adhesive 400 . In this case, the sealing effect can be further improved.

(fifth embodiment)

Fig. 14 is a schematic plan view of a part of an angular velocity sensor device according to a fifth embodiment of the present invention.

In the fifth embodiment, as shown in FIG. 14 , a plurality of bumps 80 are arranged to form point symmetry with respect to the center C1 of the sensor chip 100 . In this way, the stress applied to the sensor chip 100 can be effectively reduced, and the sensor performance and the like can be prevented from being affected.

In this example shown in FIG. 14, a plurality of bumps 80 for connecting the circuit chip 200 and the package 300, that is, a plurality of bumps 80 located on the outer periphery of the sensor chip 100 in FIG. The center C1 of the chip 100 is point-symmetric.

In addition, the layout of the bumps 80 and the structure of each part for relieving stress applied to the sensor chip 100 may also be used.

First, the center of the sensor chip 100 coincides with the center of the vibrator 20 (that is, the center of the above-mentioned concave portion 410 ) as a sensor element. That is, the sensor chip 100 and the sensor element 20 are symmetrical about the lines of the X-axis and the Y-axis of FIG. 14 .

In addition, for the sensor chip 100, the bumps 80 bonded to the circuit chip 200 may be arranged symmetrically only about the X-axis, only about the Y-axis, or symmetrically about the X-axis and the Y-axis. In addition, for the sensor chip 100, the bumps 80 bonded to the circuit chip 200 may also be arranged in 90-degree rotational symmetry.

In addition, for the circuit chip 200, the bumps 80 bonded to the package 300 may be arranged symmetrically only about the X-axis, only about the Y-axis, or symmetrically about the X-axis and the Y-axis. In addition, for the circuit chip 200, the bumps 80 bonded to the package 300 may be arranged in 90 rotational symmetry.

In addition, the planar shape of the sensor chip 100 can ideally be square instead of rectangular, and the planar shape of the circuit chip 200 and the package 300 can also be ideally square instead of rectangular.

(other embodiments)

Although the invention has been described in terms of several preferred embodiments with reference to the accompanying drawings, it is to be noted that various changes and modifications will be apparent to those skilled in the art.

For example, the structure of the angular velocity detection element 100 shown in FIG. 3 is only an example applicable to the angular velocity detection element as the sensor chip of the present invention, and the present invention is not limited to this example.

In addition, in each of the above-described embodiments, the circuit chip 200 and the package 300 are electrically connected through the bumps 80 . However, the circuit chip 200 and the package 300 may also be electrically connected by bonding wires.

In addition, in the above-described embodiment, after the bumps 80 and the bonding member 400 are formed on the surface of the circuit chip 200 , the angular velocity detecting element 100 as a sensor chip is laminated with the circuit chip 200 through the bumps 80 . However, conversely, the circuit chip 200 may be bonded to the angular velocity detection element after the bumps 80 and the bonding member 400 are formed on the surface of the angular velocity detection element 400 .

In this case, for example, the bonding member 400 can be arranged at the angular velocity detection by first bonding the adhesive film having the above-mentioned concave portion 410, or selectively printing the bonding member 400 other than the vibrator 20 part. Element 100.

In addition, the present invention is not limited to the above-mentioned angular velocity sensor device, but can be applied to a sensor device in which a sensor chip and a circuit chip having a movable portion on one surface are laminated, and the two chips are electrically connected .

For example, the present invention can also be applied to an acceleration sensor having a movable part such as a movable electrode, a movable weight, etc. on one surface of a sensor chip, and a pressure sensor having a movable part such as a membrane wait.

That is, in the above-described embodiments, in the sensor device, the sensor chip and the circuit chip having the movable portion, that is, the sensing portion, on one surface are laminated, and the two chips are electrically connected. In this sensor device, the sensor chip and the circuit chip are electrically connected through bumps, so that the movable part of the sensor chip is opposed to the circuit chip, and the two chips are electrically connected through the bumps while the movable part, that is, the sensing part, and the circuit chip pass through. Use bumps to separate them. Other parts can be changed appropriately in the structure. For example, the number of bumps can be appropriately changed, and a single bump can also be used.

In the sensing part for detection in the sensor device, the sensing part and the circuit chip are separated so that correct operation of the sensor can be ensured without hindering the performance of the sensor. In addition, it is possible to prevent a change in parasitic capacitance of an electrical connection portion between two chips due to an impact or the like by bump bonding between the two chips.

While the invention has been described with reference to its preferred embodiments, it should be understood that the invention is not limited to these preferred embodiments and constructions, and is intended to cover various modifications and equivalent arrangements. Additionally, while the present invention shows the various elements of the preferred embodiment of this invention in various combinations and configurations, which are preferred, other combinations and configurations, including more, less or only a single element, fall within the scope of this disclosure. within the spirit and scope of the invention.

Claims (14)

1. A sensor device comprising: a sensor chip (100) with a movable portion (20) on one surface, a circuit chip (200) laminated on the sensor chip opposite to the movable part of the sensor chip; An adhesive member (400) with electrical insulation properties, the adhesive member is arranged between the sensor chip and the circuit chip, and is used for bonding the sensor chip and the circuit chip, the movable part of the adhesive member and the sensor chip Partially separated and the adhesive member is composed of an adhesive film, the adhesive film has a first portion opposite to the movable portion and a second portion outside the first portion, and the first portion of the adhesive film is covered by being made thinner than the second part of the adhesive film to form a recess (410) depressed from the surface on the side of the movable part; bumps (80) located between the sensor chip and the circuit chip, The sensor chip and the circuit chip are electrically connected by bumps, and the movable part of the sensor chip and the circuit chip are separated by a certain gap by the bumps. 2. A sensor device comprising: a sensor chip (100) with a movable portion (20) on one surface, a circuit chip (200) laminated on the sensor chip opposite to the movable part of the sensor chip; An adhesive member (400) with electrical insulation properties, the adhesive member is arranged between the sensor chip and the circuit chip, and is used for bonding the sensor chip and the circuit chip, the movable part of the adhesive member and the sensor chip partly spaced apart and the adhesive member is composed of an adhesive film having a protrusion (430) protruding in a direction spaced from the movable part; and bumps (80) located between the sensor chip and the circuit chip, The sensor chip and the circuit chip are electrically connected by bumps, and the movable part of the sensor chip and the circuit chip are separated by a certain gap by the bumps. 3. The sensor device according to claim 1 or 2, characterized in that the adhesive is arranged around and seals the bump. 4. The sensor device according to claim 1 or 2, wherein the adhesive is arranged to surround the movable part between the sensor chip and the circuit chip; and The movable portion on the inner peripheral side of the adhesive is sealed by the adhesive. 5. The sensor device according to claim 1 or 2, wherein the adhesive film is formed by printing. 6. The sensor device according to claim 1 or 2, wherein the adhesive is used to form a seal (600) for sealing the movable part around the movable part, the sensor device further comprising A coating (700) covering the seal. 7. The sensor device according to claim 1 or 2, wherein the bumps comprise a plurality of bump parts (80), which are arranged point-symmetrically about the center of the sensor chip. 8. The sensor device according to claim 1 or 2, characterized in that the protrusion comprises a plurality of protrusion parts (80), which are individually arranged around the movable part. 9. The sensor device of claim 8, wherein the adhesive is arranged around the movable part of the sensor chip. 10. The sensor device according to claim 9, wherein the bump member is located in the region where the adhesive is arranged. 11. The sensor device according to claim 9, wherein the bonding member is arranged on an outer side of the bump member to surround the bump member. 12. The sensor device according to claim 9, characterized in that, The adhesive includes a plurality of adhesive members (400) arranged around the movable portion; and The adhesive members are arranged to surround the bump members, respectively. 13. The sensor device of claim 9, wherein: The adhesive includes a plurality of adhesive members (400) arranged around the movable portion; and The bonding parts are arranged at positions different from the bump parts, respectively. 14. The sensor device according to claim 1 or 2, further comprising: a package having a space in which the circuit chip and the sensor chip are arranged; and Additional bumps through which the circuit chip is electrically connected to the conductive portion of the enclosure.

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