CN100438098C - Light emitting diode packaging structure and manufacturing method thereof - Google Patents

Abstract

The invention discloses a light emitting diode packaging structure which comprises more than one chip, a carrier, a light reflection type device and at least one external connection electrode. The chip is adhered on the carrier, the chip electrode is connected to the external connecting electrode by wire or flip chip adhesion, and the lens is formed by transparent material and the light reflection device and the carrier are fixed.

Description

Light emitting diode packaging structure and manufacturing method thereof

technical field

The invention relates to a light emitting device and a manufacturing method thereof, in particular to a light emitting diode packaging structure and a manufacturing method thereof.

Background technique

Light Emitting Diode (LED for short) is a component made of semiconductor materials and a solid-state light source that can convert electrical energy into light. It is not only small in size, but also has long life, low driving voltage, fast response rate, and shock resistance Good, able to meet the light, thin and miniaturization requirements of various application equipment, has already become a very popular product in daily life but a mature industry.

Generally, the LED chip is connected on the substrate, and its periphery is coated with a light-transmitting resin to emit light upward or downward, for example, please refer to FIG. 1A and FIG. 1B . The light distribution curves of the LED packaging structures 5 and 8 shown are shown in FIG. 1C .

But on the one hand, due to the vigorous development of liquid crystal displays, the demand for parallel light sources used as backlight modules has increased; on the other hand, due to the general parallel light in the taillight or headlight industry and the special light distribution curve shown in Figure 2, It is necessary to cover part of the luminous area with the help of a light baffle to produce or, for example, as published by Darmstadt University of Technology in PAL 2003 Symposium (as an attachment), use the assembly of lamps and LEDs to form the required light distribution curve, but its volume is relatively small It is not very economical, so there has been a series of researches on light-emitting diode devices that emit parallel light (emitted light parallel to the substrate).

For example, referring to FIG. 3A and FIG. 3B , it is known technology disclosed in US Pat. No. 6,627,922. Disclosed therein is a light emitting diode packaging structure capable of emitting light parallel to a substrate. The structure disclosed in FIG. 3A includes a light reflection component 10 , an LED chip 14 and a substrate 16 . The light reflection component 10 has an opening 12 on the side for the parallel light generated by the reflection of the light emitting diode 14 to exit. The structure disclosed in FIG. 3B includes a rectangular insulating substrate 1 , electrodes 2 and 3 , LED chips 4 , light-transmitting components 6 and light-reflecting components 7 . The light reflection component 7 only covers part of the light-transmitting element 6 , exposing the light-transmitting component 6 at the front end and both sides. Therefore, the light generated by the LED chip 4 can be emitted from the front end of the light-transmitting component 6 in parallel.

The manufacturing process for this structure includes first forming the LED chip 4 on the substrate 1 , covering the chip 4 with a light-transmitting material to form the light-transmitting component 6 , and then forming the light-reflecting component 7 on the light-transmitting component 6 . The light-emitting diode structure formed in this way requires a cumbersome manufacturing process and increases the production cost, and because the light-reflecting component 7 is additionally adhered or assembled on the surface of the substrate 1, it is easy to fall off and lose its function when it is in disrepair for a long time, and the substrate 1 and the transparent The bonding surface of the optical component 6 and the light reflection component 7 only relies on the bonding characteristics between materials without structural bite strength, and is prone to peeling and separation due to temperature changes. The structure is fragile and can only be used in extremely low-power LED packaging applications and only limited to mobile phones, etc. low power usage. Furthermore, due to the size limitation of this type of structure, when multiple light emitting diodes are included for the light mixing function, the light mixing effect is not good, and the design of the reflective surface is not easy to cause extremely poor optical properties.

Therefore, in the well-developed light emitting diode industry, there is a need for a parallel light emitting diode packaging structure, which has the advantages of simple manufacturing process, low cost, not easy to fall off and lose function, and good light mixing effect.

Contents of the invention

In view of the above problems, the main purpose of the present invention is to provide a packaging structure for light-emitting diodes, which uses a simple manufacturing process, and has the advantages of low cost, not easy to fall off and lose function, and good light mixing effect, so it can be used in general Solve the problems of the previous technology.

In order to achieve the above object, the present invention proposes a light emitting diode packaging structure, comprising:

A reflective substrate, having more than one reflective cup, the reflective substrate is bent to form a reflective surface for reflecting light, and constitutes an accommodating space covering the reflective cup;

one or more light emitting diodes, housed in the reflective cup; and

A light-transmitting entity or a shell-infused entity covers the entire reflective substrate and the light-emitting diode, and forms a lens at the front end.

In the above LED packaging structure, the reflective substrate is made of a metal material or ceramics.

In the above LED package structure, the surface of the curved reflective substrate is arc-shaped.

In the above-mentioned LED packaging structure, the light-transmitting entity or the shell-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.3.

In the above-mentioned LED packaging structure, the light-transmitting entity or the shell-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.4.

In the above-mentioned LED packaging structure, the light-transmitting entity or the shell-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.5.

In the above-mentioned LED packaging structure, the light-transmitting entity or the shell-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.6.

The LED packaging structure above further includes a receiver for receiving light reflected from the curved surface of the reflective substrate.

In order to achieve the above object, the present invention also proposes a method for manufacturing a light emitting diode packaging structure, comprising:

A reflective substrate with more than one reflective cup for placing a light-emitting diode;

forming an opening on the reflective substrate by stamping;

bending the reflective substrate to form a reflective surface for reflecting light, and forming a placement space covering the reflective cup with one of the surfaces; and

A light-transmitting entity or a housing glue-infused entity covering the entire reflective substrate is formed, and a lens is formed at the front end.

In the manufacturing method of the LED packaging structure mentioned above, the reflective substrate is composed of a metal material.

In the above-mentioned manufacturing method of the LED packaging structure, the metal material is copper, iron or an alloy.

In the manufacturing method of the LED packaging structure mentioned above, a curved surface of the reflective substrate is arc-shaped.

In the manufacturing method of the above-mentioned LED packaging structure, the light-transmitting entity or the shell-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.3.

In the manufacturing method of the above LED packaging structure, the light-transmitting entity or the shell injection entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.4.

In the manufacturing method of the above-mentioned LED packaging structure, the light-transmitting body or the shell-injecting body is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.5.

In the manufacturing method of the above-mentioned LED packaging structure, the light-transmitting entity or the shell injection entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.6.

Description of drawings

FIG. 1A and FIG. 1B are respectively known packaging structures of light-emitting diodes that emit light upward or downward;

FIG. 1C is a light distribution curve of a known light-emitting diode package structure that emits light upward or downward;

Figure 2 is the special light distribution curve for producing parallel light in the general taillight or headlight industry;

FIG. 3A and FIG. 3B are known technologies disclosed in US Pat. No. 6,627,922;

4A to 4C are three-dimensional manufacturing flowcharts of the first preferred embodiment of the LED packaging structure of the present invention;

5A to 5D are the three-dimensional manufacturing flowcharts of the second preferred embodiment of the light emitting diode packaging structure of the present invention;

6A to 6C are three-dimensional manufacturing flowcharts of the third preferred embodiment of the light emitting diode packaging structure of the present invention;

FIG. 7 and FIG. 8, taking the second preferred embodiment as an example, respectively show the LED packaging structure with two electrical connections and the packaging structure with six electrical connections;

Fig. 9 is a side view of the second preferred embodiment of the light emitting diode packaging structure of the present invention;

Fig. 10 is a schematic diagram of optical simulation of the light emitting diode packaging structure of the present invention;

Fig. 11 is a side view of another preferred embodiment of the LED packaging structure of the present invention;

Fig. 12 is a side view of another preferred embodiment of the LED packaging structure of the present invention; and

Fig. 13 is a luminescence distribution diagram generated by software simulation of the LED packaging structure of the present invention.

Wherein, the reference numerals explain:

1 ......... Insulation substrate

2 ......... Electrodes

3 ......... Electrodes

4 ...........LED chip

5 ........... LED package structure

6 ..........Light-transmitting components

7 .................... Light reflection components

8 ........... LED package structure

9 ........... reflective substrate

10 ........... Light reflective components

12 .......... opening

14 .......... LED chip

15 ........... Light-transmitting entities

16 ........... Substrate

17 ........... LED chips

17a ........... Light-emitting diode chips

17b ........... Light-emitting diode chip

17c ........... LED chip

18 ........... reflector cup

18a ........... reflector cup

18b ........... Reflector cup

18c ........... Reflector Cup

19 ......... Wiring

20 .............reflective surface

21 ........... Receiver

23 .............opening

25 ............. Interface

27 .........Electrical connector

Detailed ways

In order to further understand the purpose, structure, features, and functions of the present invention, the detailed description of the accompanying examples is as follows. The above descriptions about the content of the present invention and the following descriptions of the embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the claims of the present invention.

Referring to FIG. 4A to FIG. 4C , it is a three-dimensional manufacturing flowchart of the first embodiment of the LED packaging structure of the present invention.

As shown in the figure, the LED packaging structure of the first embodiment is formed through the following steps, including: installing more than one LED chip (not shown) on the reflective substrate 9 with reflective cups 18a, 18b, 18c In the cups 18a, 18b, 18c; the reflective substrate 9 is made of metal such as copper, iron or alloys thereof to inject or punch into the reflective cups 18a, 18b, 18c and the reflective surface 20, and the reflective surface 20 is integrally connected with the reflective substrate 9 The point is at the back; the reflective surface 20 is bent forward to form a placement space covering the reflective cups 18a, 18b, 18c with the surface, and has an opening; finally, it is formed by mold filling or mold injection or shell filling process The light-transmitting entity or shell injection entity 15 covering the entire reflective substrate 9 and the LED is formed into a single-lens structure before the opening.

The wires 19 of the light emitting diodes are connected to four electrical connecting bars 27 to be electrically connected with the outside world, and the four electrical connecting bars 27 face opposite sides.

Referring to FIG. 5A to FIG. 5D , it is a three-dimensional manufacturing flowchart of the second preferred embodiment of the LED packaging structure of the present invention.

As shown in the figure, the LED packaging structure of the second preferred embodiment is formed through the following steps, including: installing more than one LED chip (not shown) on a reflective substrate 9 with reflective cups 18a, 18b, 18c In the reflective cups 18a, 18b, 18c; the reflective substrate 9 is made of metal such as copper, iron or alloys thereof to be injected or punched into reflective cups 18a, 18b, 18c, reflective surfaces 20 and openings 23, the reflective surfaces 20, The integral connection point between the opening 23 and the reflective substrate 9 is in the front; the reflective surface 20 is bent backward to form a space for covering the reflective cups 18a, 18b, 18c with the surface; finally, the mold is filled with glue or injected into the mold or the shell The glue pouring process forms a light-transmitting entity or shell glue injection entity 15 that covers the entire reflective substrate 9 and the LED, and forms a single lens structure before the opening.

The wires 19 of the light emitting diodes are connected to four electrical connection bars 27 to be electrically connected with the outside world, and the four electrical connection bars 27 face the same side.

Referring to FIG. 6A to FIG. 6C , it is a three-dimensional manufacturing flowchart of the third preferred embodiment of the LED packaging structure of the present invention.

As shown in the figure, the LED packaging structure of the third preferred embodiment is formed through the following steps, including: installing more than one LED chip (not shown) on a reflective substrate 9 with reflective cups 18a, 18b, 18c In the reflective cups 18a, 18b, 18c; the reflective surface 20 of the reflective cup formed by injection or punching is made of copper, iron or its alloy metal, and the reflective substrate is connected with the interface 25, and the surface is formed to cover the reflective cup 18a, 18b, 18c placement space; finally through the mold filling or mold injection or shell glue filling process to form a light-transmitting entity or shell glue injection entity 15 covering the entire reflective substrate 9 and light-emitting diodes, and form a single lens structure before the opening .

The wires 19 of the light emitting diodes are connected to four electrical connection bars 27 to be electrically connected with the outside world, and the four electrical connection bars 27 face the same side.

In addition, although the above-mentioned embodiments all take four electrical connection bars as an example, in actual application, only four electrical connection bars can be used. For example, referring to FIG. 7 and FIG. 8 , taking the second preferred embodiment as an example, it can be a light emitting diode package structure with two electrical bars and a package structure with six electrical bars.

Similarly, although the above-mentioned second preferred embodiment is used as an example of two electrical connection bars and six electrical connection bars, the two electrical connection bars 27 and the six electrical connection bars 27 can also be applied to the first preferred embodiment. Example and the third preferred embodiment.

Based on the above description, it can be found that the present invention only uses two main steps: the reflective surface of the LED chip can be directly formed by bending the substrate; Entity and forming a single lens structure before the opening can complete the entire light emitting diode packaging structure, so the whole manufacturing process is simpler, more convenient and lower in cost.

The above-mentioned manufacturing steps are achieved by structural design, in other words, the structural improvement of the present invention makes the manufacturing process simpler and lower in cost. The structural features of the present invention will be described in detail below with reference to the accompanying drawings.

Referring to FIG. 9 , it is a side view of a second preferred embodiment of the LED packaging structure of the present invention.

In the figure, the light emitting diode package structure of the present invention includes: a reflective substrate 9 with a reflective cup 18 , a light emitting diode chip 17 , and a light-transmitting entity or shell injection entity 15 .

The reflective substrate 9 can be made of conductive and non-conductive metals and non-metallic materials with good ductility and thermal conductivity and high reflectivity, such as ceramics, such as copper-iron alloy, etc., and then coated with a layer of high reflectivity material, including an opening 23. The reflective cup 18 is extended to form a reflective surface 20 that can be bent for reflection. The reflective substrate 9 can be directly bent backward by using the metal with good ductility to form a space between the surface of the substrate 9 and the opening 23 and the reflective cup 18 for accommodating the LED chips. Since the opening 23 is used to emit the light reflected by the LED chip 17 , the design of the opening 23 needs to match the angle of the reflected light. The opening 23 and the reflection cup 18 are formed by stamping or injection molding, for example.

In addition, the reflective substrate 9 can be electrically connected with the wire bonding 19 of the LED chip 17 to the electrical connection bar 27 or a related circuit pattern connected with the LED can be formed thereon.

The light emitting diode chip 17 is arranged in the placement space with the reflective cup 18 formed by the reflective substrate 9, and the following known structures can be utilized:

One is a basic light-emitting diode structure, and the p-n interface is formed on a semiconductor substrate mainly composed of AlGaAs, AlGaInP, GaP or GaN.

The aforementioned semiconductor material can be selected according to the desired emission wavelength.

In this specification, only the above examples are mentioned, but for those who have ordinary knowledge in this field, any suitable LED chip can be used. In other words, the present invention is not limited to the above-mentioned LED structure.

The light-transmitting entity or shell injection entity 15 can cover the entire reflective substrate 9 including the reflective cup containing the LED chip 17 , including the upper and lower surfaces of the reflective substrate 9 , by potting or injection molding. The light-transmitting entity or the housing glue-injecting entity 15 can be made of transparent epoxy resin or silicone or their equivalents. Because the light-transmitting entity or shell injection entity 15 is used to transmit light and form a lens at the front end of the opening, its material and curvature can be adjusted according to the overall light source requirements of the light-emitting diode packaging structure. The optical simulation is shown in Figure 10 shown.

In the present invention, the curved arc of the reflective substrate is designed according to the position of the LED chip and the parallel light to be produced, that is, the parameters related to the curved arc of the reflective substrate and the position of the LED chip are designed according to the output of parallel light and Adjust the design.

Referring to FIG. 11 , it is a side view of another preferred embodiment of the LED packaging structure of the present invention.

In the figure, the light emitting diode packaging structure includes three groups (one or more) of light emitting diode chips 17a, 17b, 17c, that is, there are three Groups (one or more) of LED chips 17a, 17b, 17c are located in reflective cups 18a, 18b, 18c. The three groups of LED chips 17 a , 17 b , 17 c are, for example, red, blue and green LED chips respectively, which can mix white light with good chromaticity after being reflected by the curved surface 11 of the reflective substrate.

In the above-mentioned embodiments, although three groups (one or more) of LEDs are taken as an example, in practice, not only three groups (one or more) of LEDs can be used, but can be increased or decreased as required.

Referring to FIG. 12 , it is a side view of another preferred embodiment of the LED packaging structure of the present invention.

In the figure, the light emitting diode packaging structure is used in related applications such as a DVD read head. This structure comprises one group (one or more than one) light-emitting diode chip 17 and a receiver 21, namely there is a group (one or more than one) ) LED chips 17 and a receiver 21 are located in the reflective cups 18a, 18b. The light emitting diode chip 17 can be reflected by the curved surface 11 of the reflective substrate to form parallel light, and when the parallel light is incident, it can be reflected by the curved surface 11 of the reflective substrate to be received by the receiver 21 .

Referring to FIG. 13 , it is a luminescence distribution diagram generated by software simulation of the LED packaging structure of the present invention.

It can be seen from the simulation figure that the light generated by the present invention is distributed below zero, so it is not necessary to add additional light baffles to limit the light to a certain area as in the known technology. Therefore, the same or better effect can be produced more efficiently without additional baffle costs.

To sum up the above, with the help of the reflective surface formed by the bending of the substrate, an LED packaging structure can be completed by simplifying the existing glue filling process, so it has the advantages of simple manufacturing method and low cost. In addition, because the reflective surface makes light It emits in parallel, which can indeed limit the light at a certain angle without additional baffles. Moreover, because the substrate is directly bent to form a reflective surface, there will be no problem of the reflective surface falling off the substrate and losing its function. When the diode intends to mix light, the reflective surface can indeed increase the light mixing effect.

Therefore, the present invention can be applied to industries such as headlights, taillights, measurement and projection backlight panels, and DVD reading heads. Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (16)

1. A light-emitting diode packaging structure, characterized in that, comprising: A reflective substrate, having more than one reflective cup, the reflective substrate is bent to form a reflective surface for reflecting light, and constitutes a placement space covering the reflective cup; one or more light emitting diodes disposed in the reflective cup; and A light-transmitting entity or a shell-infused entity covers the entire reflective substrate and the light-emitting diode, and forms a lens at the front end. 2. The LED package structure according to claim 1, wherein the reflective substrate is made of a metal material or ceramics. 3 . The LED package structure according to claim 1 , wherein the curved surface of the reflective substrate is arc-shaped. 4 . 4 . The light emitting diode package structure according to claim 1 , wherein the light-transmitting entity or the housing glue-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.3. 5 . The light emitting diode packaging structure according to claim 1 , wherein the light-transmitting entity or the housing glue-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.4. 6 . The light emitting diode package structure according to claim 1 , wherein the light-transmitting entity or the housing glue-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.5. 7 . The light emitting diode package structure according to claim 1 , wherein the light-transmitting entity or the housing glue-injecting entity is composed of a transparent epoxy resin or a silica gel or other transparent materials with a refractive index above 1.6. 8. The LED packaging structure according to claim 1, further comprising a receiver for receiving light reflected from the curved surface of the reflective substrate. 9. A method for manufacturing a light emitting diode packaging structure, characterized in that it comprises: A reflective substrate with more than one reflective cup for placing a light-emitting diode; forming an opening on the reflective substrate by stamping; bending the reflective substrate to form a reflective surface for reflecting light, and forming a placement space covering the reflective cup with one of the surfaces; and A light-transmitting entity or a housing glue-infused entity covering the entire reflective substrate is formed, and a lens is formed at the front end. 10. The manufacturing method of the LED packaging structure according to claim 9, wherein the reflective substrate is made of a metal material. 11. The manufacturing method of the LED packaging structure according to claim 10, wherein the metal material is copper, iron or an alloy. 12 . The manufacturing method of the LED packaging structure according to claim 9 , wherein a curved surface of the reflective substrate is in an arc shape. 13 . 13. The manufacturing method of the light emitting diode packaging structure according to claim 9, characterized in that, the light-transmitting entity or the shell injection entity is composed of a transparent epoxy resin or a silica gel or other materials with a refractive index above 1.3. Composition of transparent material. 14. The manufacturing method of the light-emitting diode packaging structure according to claim 9, characterized in that, the light-transmitting entity or the shell injection entity is composed of a transparent epoxy resin or a silica gel or other materials with a refractive index above 1.4. Composition of transparent material. 15. The method for manufacturing a light-emitting diode packaging structure according to claim 9, characterized in that, the light-transmitting entity or the shell injection entity is composed of a transparent epoxy resin or a silica gel or other materials with a refractive index above 1.5. Composition of transparent material. 16. The manufacturing method of the light emitting diode packaging structure according to claim 9, characterized in that, the light-transmitting entity or the shell injection entity is composed of a transparent epoxy resin or a silica gel or other materials with a refractive index above 1.6. Composition of transparent material.

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