CN100441360C - Laser drilling method and drilling device thereof - Google Patents
Laser drilling method and drilling device thereof Download PDFInfo
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- 238000005553 drilling Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000003287 optical effect Effects 0.000 claims abstract description 8
- 230000001360 synchronised effect Effects 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 13
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000008439 repair process Effects 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 230000008016 vaporization Effects 0.000 claims description 2
- 238000009834 vaporization Methods 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 17
- 230000033001 locomotion Effects 0.000 description 15
- 239000007789 gas Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241001416181 Axis axis Species 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000010076 replication Effects 0.000 description 2
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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Abstract
本发明公开了一种激光打孔方法及其打孔装置,工件保持不动,先加工出小孔D1,再加工出孔径为(2/5)D3~(3/4)D3的孔D2,最后旋切得到要求的孔D3。装置包括相互联接的激光器及其光学导光部件、激光聚焦镜部件等;激光聚焦镜部件从上到下主要是X轴、Y轴45度全反镜、上导轨架、X轴移动架、中间导轨架、Y轴移动架、聚焦镜头;X轴移动架可沿上导轨架X轴向相对滑动,Y轴移动架沿中间导轨架Y轴向相对滑动。本发明适合打的孔的孔径D3为0.5mm~2mm,加工质量高。
The invention discloses a laser drilling method and a drilling device thereof. The workpiece is kept still, and a small hole D1 is processed first, and then a hole D2 with a diameter of (2/5)D3 to (3/4)D3 is processed. Finally, the required hole D3 is obtained by rotary cutting. The device includes interconnected lasers and their optical light guide parts, laser focusing mirror parts, etc.; from top to bottom, the laser focusing mirror parts are mainly X-axis, Y-axis 45-degree full reflection mirrors, upper rail frame, X-axis moving frame, middle Rail frame, Y-axis moving frame, focusing lens; X-axis moving frame can slide relatively along the X-axis of the upper rail frame, and Y-axis moving frame can relatively slide along the Y-axis of the middle rail frame. The hole diameter D3 suitable for drilling in the present invention is 0.5 mm to 2 mm, and the processing quality is high.
Description
技术领域 technical field
本发明涉及一种采用自由激光脉冲和调制激光脉冲复合进行高质量微孔加工的方法及根据此方法所设计的装置,属于激光加工技术领域。The invention relates to a method for high-quality microhole processing by combining free laser pulses and modulated laser pulses and a device designed according to the method, belonging to the technical field of laser processing.
背景技术 Background technique
激光打孔与其它打孔方法相比具有加工灵活、成本低、加工速度快、效率高、无接触、能在空气中传输、打孔深径比高、可加工任意材料、环保等优点,已广泛应用于对陶瓷和复合材料的打孔,也可以在超硬及高温合金材料打出一系列孔径和具有一定倾角的孔,例如飞机发动机涡轮叶片的打孔。Compared with other drilling methods, laser drilling has the advantages of flexible processing, low cost, fast processing speed, high efficiency, no contact, transmission in the air, high drilling depth-to-diameter ratio, processing any material, and environmental protection. It is widely used in drilling ceramics and composite materials, and can also drill holes with a series of diameters and a certain inclination angle in superhard and high-temperature alloy materials, such as the drilling of aircraft engine turbine blades.
目前激光打孔方法,主要包括复制法和回转法。复制法又包括单脉冲打孔和多脉冲打孔。单脉冲打孔适用于薄板零件打盲孔时使用,深孔加工一般采用多脉冲打孔,即采用一系列脉宽较窄的调制脉冲打孔。采用声光调制激光脉冲进行打孔,可以减少激光打孔中的再铸层和微裂纹以及热影响区大等一系列问题,但所打孔的孔径较小,打孔的速度慢,而且对较大的孔径无能为力。采用自由运转激光脉冲打孔,所打孔的孔径较大,且打孔速度快,但成孔的质量较差。现在激光加工较大孔径的孔时,多采用回转法,即工件绕以偏离激光聚焦斑点中心距离D/2的轴回转。当回转速度较慢(相对脉冲激光发射频率而言)时,相当于切割,回转一周,就在工件上切下一个孔径为D的孔。但采用回转法切孔时需要的激光能量较大,所切孔的质量较差,况且现在已有的激光切割设备价格昂贵,效率低。上述几点限制了激光加工技术的发展。At present, laser drilling methods mainly include replication method and rotary method. The replication method also includes single-pulse drilling and multi-pulse drilling. Single-pulse drilling is suitable for drilling blind holes in thin plate parts. Deep hole processing generally uses multi-pulse drilling, that is, a series of modulated pulses with narrow pulse widths are used for drilling. Drilling with acousto-optic modulated laser pulses can reduce a series of problems such as recasting layer, microcracks and large heat-affected zone in laser drilling, but the hole diameter is small and the drilling speed is slow, and it is difficult for Larger apertures can't help. Free-running laser pulse drilling is used, and the hole diameter is large, and the drilling speed is fast, but the quality of the hole is poor. Nowadays, when laser processing holes with larger apertures, the rotary method is often used, that is, the workpiece rotates around an axis that deviates from the center of the laser focus spot by a distance of D/2. When the rotation speed is slow (compared to the pulse laser emission frequency), it is equivalent to cutting, and a hole with an aperture D is cut on the workpiece after one revolution. However, the laser energy required for cutting holes by the rotary method is large, and the quality of the cut holes is relatively poor. Moreover, the existing laser cutting equipment is expensive and inefficient. The above points limit the development of laser processing technology.
发明内容 Contents of the invention
本发明的目的是提出一种采用自由激光脉冲和调制激光脉冲相复合的激光打孔方法及为实现该方法而设计的打孔装置;解决了现有的复制法不能打大孔,而回转法所打的大孔质量差的技术问题,解决了激光打孔中出现的再铸层和微裂纹以及热影响区域大的技术问题。The purpose of the present invention is to propose a laser drilling method using free laser pulses and modulated laser pulses and a drilling device designed to realize the method; The technical problem of poor quality of the large holes drilled solves the technical problems of recasting layer and micro-cracks and large heat-affected area in laser drilling.
本发明解决上述目的所采用的技术方案如下。The technical solution adopted by the present invention to solve the above object is as follows.
一种激光打孔方法,其特征在于:激光打孔的步骤为:A laser drilling method is characterized in that: the step of laser drilling is:
1.对工件上需要打孔的位置进行定位,调整好激光聚焦镜的位置;1. Position the position on the workpiece that needs to be drilled, and adjust the position of the laser focusing mirror;
2.根据工件上需要打孔的孔径及深度与能量的关系式,调整激光器的各个输出参数,输出能量为E1的的激光脉冲,2. Adjust the output parameters of the laser according to the relationship between the diameter and depth of the workpiece to be drilled and the energy, and output the laser pulse with energy E 1 ,
式中E为激光能量(J),LB为加工工件材料的汽化比能(J/cm2),LM为加工材料的熔化热比能(J/cm2),θ为激光进入材料时的发散半角(rad),H为激光打孔的深度,即所加工材料的厚度,D为激光所打孔的孔径,输出的是高峰值功率的调制激光脉冲,功率范围为106W/CM2~109W/CM2;In the formula, E is the laser energy (J), L B is the vaporization specific energy of the workpiece material (J/cm 2 ), L M is the melting heat specific energy of the processed material (J/cm 2 ), θ is the time when the laser enters the material The divergence half angle (rad), H is the depth of the laser drilling, that is, the thickness of the processed material, D is the aperture of the laser drilling, the output is a modulated laser pulse with high peak power, and the power range is 10 6 W/CM 2 ~ 10 9 W/CM 2 ;
3.根据工件材料性质采用合适的辅助气体,并在辅助气体保护下输出调制激光脉冲,将工件穿透,得到小孔D1;3. Adopt suitable auxiliary gas according to the material properties of the workpiece, and output modulated laser pulses under the protection of the auxiliary gas to penetrate the workpiece to obtain a small hole D1 ;
4.重新调整激光器的各个输出参数,要发射的为自由运转激光脉冲,能量范围为5E1~10E1;4. Readjust the output parameters of the laser, and the laser pulse to be emitted is a free-running laser pulse with an energy range of 5E 1 to 10E 1 ;
5.工件的位置保持不变,在辅助气体的保护下,输出自由运转激光脉冲,在步骤[3]中得到的所述小孔D1的基础上继续进行打孔,得到孔径尺寸范围为
6.再次调整激光器的各个输出参数,输出能量为E1的调制激光脉冲;6. Adjust the output parameters of the laser again, and output the modulated laser pulse with energy E 1 ;
7.工件的位置保持不变,在辅助气体的保护下,输出了调制激光脉冲,调整激光聚焦镜的位置,对孔D2旋切,修复孔壁的再铸层和微裂纹,并获得所要求的孔径D3。7. The position of the workpiece remains unchanged. Under the protection of the auxiliary gas, the modulated laser pulse is output, the position of the laser focusing mirror is adjusted, the hole D2 is rotary cut, the recast layer and microcracks on the hole wall are repaired, and the obtained The required aperture D 3 .
本发明小孔D1的孔径尺寸范围为50~300μm。The pore size of the pores D1 of the present invention ranges from 50 to 300 μm.
一种激光打孔装置,包括相互联接的激光器1及其光学导光部件2、CCD摄像机3、光电探测器5、计算机6、数字示波器7和激光聚焦镜部件4,激光聚焦镜部件的正上方是CCD摄像机3,激光聚焦镜部件和光学导光部件相连接,光电探测器5在激光聚焦镜部件上部外的一侧,其特征还包括:所述激光聚焦镜部件4从上到下主要是X轴45度全反镜12和Y轴45度全反镜13、上导轨架14、X轴移动架25、中间导轨架16、Y轴移动架22、聚焦镜头24;上导轨架14、X轴移动架25、中间导轨架16、Y轴移动架22均是中空结构,X轴45度全反镜下部的固定座穿过上导轨架14固定在X轴移动架25上,Y轴45度全反镜13下部的Y轴激光导光管穿过上导轨架14、X轴移动架25、中间导轨架16,和Y轴移动架22固定,Y轴激光导光管正下方固定聚焦镜头24;上导轨架固定在所述的激光聚焦镜部件的机架上,X轴移动架与中间导轨架固定在一起;X轴移动架25与上导轨架14联接,两者之间通过计算机6控制的驱动机构沿X轴向作相对滑动,Y轴移动架22与中间导轨架16联接,两者之间通过计算机控制的驱动机构沿Y轴向作相对滑动,X轴轴向和Y轴轴向相互垂直;X轴45度全反镜的镜头和Y轴45度全反镜的镜头正对,激光束经X轴45度全反镜和Y轴45度全反镜后,由平行于工作台的方向变为垂直于工作台的方向A laser perforating device, comprising a
穿过两者之间的激光束平行于Y轴轴向。The laser beam passing between the two is parallel to the Y-axis axis.
本发明X轴导轨31安装在上导轨架14的底部两侧,Y轴导轨17安装在中间导轨架16底部两侧;Y轴移动架22通过其上面的Y轴滑块21和Y轴导轨17接触,X轴移动架31通过其上面的X轴滑块30和X轴导轨31接触。The X-axis
本发明的X轴驱动机构包括在上导轨架14的侧边上固定的X轴电机、X轴电机同步轮20,X轴丝杠同步轮15,本发明的Y轴驱动机构包括在Y轴移动架22的侧边上固定的Y轴电机、Y轴电机同步轮28,Y轴丝杠同步轮19;X轴丝杠同步轮15与X轴电机同步轮20经同步带连接;Y轴丝杠同步轮19与Y轴电机同步轮28通过同步带连接。The X-axis driving mechanism of the present invention includes an X-axis motor fixed on the side of the upper
本发明设一X轴丝杠26,一端固定于X轴丝杠同步轮15的轴心里,另一端旋入X轴丝杠螺母32里,X轴丝杠螺母固定在X轴移动架25的一侧;设一Y轴丝杠23,一端固定于Y轴丝杠同步轮19的轴心里,另一端旋入Y轴丝杠螺母33里,Y轴丝杠螺母固定在Y轴移动架22的一侧。The present invention establishes an
本发明在聚焦镜头24周围有相对位置不变的辅助气体喷嘴11。The present invention has
本发明X轴移动架25、Y轴移动架22的相对移动距离范围均为0~40mm。The ranges of the relative moving distances of the
若只有X轴电机工作或只有Y轴电机工作可以实现一维切割,两个电机同时工作可以实现二维运动。保持X轴方向丝杠和Y轴方向丝杠不动,既保持聚焦镜不动,静止打孔;两轴电机同时工作,带动聚焦镜作二维运动,运动路径就是所需要修复的孔径。If only the X-axis motor is working or only the Y-axis motor is working, one-dimensional cutting can be realized, and two motors working at the same time can realize two-dimensional movement. Keep the X-axis direction screw and the Y-axis direction screw fixed, not only keep the focusing mirror still, and drill holes at rest; the two-axis motors work at the same time, driving the focusing mirror to move in two dimensions, and the movement path is the aperture that needs to be repaired.
聚焦镜部件实现了复制打孔和旋切打孔的结合。The focusing mirror part realizes the combination of copy punching and rotary cutting punching.
本发明的有益效果为:聚焦镜旋转切割法相比回转法,实现了小能量的激光脉冲切割;提高了激光打孔的精度,而且能提高激光打孔的效率,并能获得较大的孔径;而且对小尺寸的熔融点材料的移出更方便;减小了激光热作用影响区域,减小了再铸层的厚度,圆整度高,孔壁平直并且表面干净。The beneficial effects of the present invention are: compared with the rotary method, the focusing mirror rotary cutting method realizes laser pulse cutting with small energy; improves the precision of laser drilling, and can improve the efficiency of laser drilling, and can obtain a larger aperture; Moreover, it is more convenient to remove the material at the melting point of small size; the area affected by laser heat is reduced, the thickness of the recast layer is reduced, the roundness is high, the hole wall is straight and the surface is clean.
附图说明 Description of drawings
图1是本发明方法的示意图;Fig. 1 is the schematic diagram of the inventive method;
图2是本发明装置整体结构框架示意图;Fig. 2 is a schematic diagram of the overall structural framework of the device of the present invention;
图3是激光聚焦镜旋切法打孔示意图;Fig. 3 is a schematic diagram of punching holes by laser focusing mirror rotary cutting method;
图4是激光回转法打孔示意图;Fig. 4 is a schematic diagram of laser rotary drilling;
图5是本发明激光聚焦镜部件结构图;Fig. 5 is a structural diagram of laser focusing mirror components of the present invention;
图6是本发明激光聚焦镜部件结构分解图;Fig. 6 is an exploded view of the structure of the laser focusing mirror part of the present invention;
图7是本发明激光聚焦镜部件A-A剖视图。Fig. 7 is a sectional view of laser focusing mirror part A-A of the present invention.
1、激光器 2、光学导光系统 3、CCD摄像机 4、聚焦镜部件 5、光电探测器 6、计算机 7、数字示波器 8、工件 9、工作台 10、透镜1 11、Y轴45度全反镜镜架 12、X轴45度全反镜 13、Y轴45度全反镜 14、上导轨架15、X轴丝杠同步轮 16、中间导轨架 17、Y轴导轨 18、Y轴轴承 19、Y轴丝杠同步轮 20、X轴电机同步轮 21、Y轴滑块 22、Y轴移动架 23、Y轴丝杠 24、聚焦镜头 25、X轴移动架 26、X轴丝杠 27、Y轴激光导光管 28、Y轴电机同步轮 29、X轴轴承 30、X轴滑块 31、X轴导轨 32、X轴丝杠螺母 33、Y轴丝杠螺母 34、透镜2 35、保护镜片1.
具体实施方式 Detailed ways
下面结合附图和实施方法、实施例,对本发明作进一步详细说明。The present invention will be described in further detail below in conjunction with the accompanying drawings, implementation methods and examples.
在图1所示的实施方法中,采用本方法适合打的孔径D3大小为0.5mm~2mm,第一步完成的小孔(孔径D1),第二步完成的孔(孔径D2),最终得到加工要求的孔(孔径D3),具体步骤为:In the implementation method shown in Figure 1, the hole diameter D3 suitable for punching by this method is 0.5mm to 2mm, the small hole (aperture D1 ) completed in the first step, and the hole (aperture D2 ) completed in the second step , and finally obtain the hole (aperture D 3 ) required for processing, the specific steps are:
首先,根据工件对需要打孔的位置采用CCD定位,调整好聚焦镜的位置。根据工件需要打孔的孔径以及深度与能量的关系式(I),调整激光器的各个输入参数,控制输出功率,输出能量为E1(利用近阈值附近的小能量激光脉冲光束质量高的特点,输出小能量激光脉冲只要将孔打穿即可)的激光脉冲。根据不同的材料采用压缩气体、氮气、氩气或者氧气作为辅助气体,在气体保护下输出高峰值功率(106W/CM2~109W/CM2)的调制激光脉冲1~3个激光脉冲将工件穿透,得到孔径50~300μ,的小孔D1。First of all, according to the position of the workpiece that needs to be drilled, the position of the focusing lens is adjusted by using CCD positioning. According to the relational expression (I) of the aperture and depth and energy that workpiece needs to punch, adjust each input parameter of laser, control output power, output energy is E Output small energy laser pulse as long as the hole is punched) laser pulse. According to different materials, compressed gas, nitrogen, argon or oxygen are used as auxiliary gas, and 1 to 3 laser pulses are output with high peak power (10 6 W/CM 2 ~10 9 W/CM 2 ) modulated laser pulses under gas protection The pulse penetrates the workpiece to obtain a small hole D 1 with a diameter of 50-300μ.
然后重新调整激光器的频率、脉宽、输入功率,使输出激光能量为5E1~10E1的自由运转激光脉冲,聚焦镜头以及工件的位置保持不变,在辅助气体的保护下,进行打孔,得到孔径为D2(大小为
因为第一步中所打小孔的存在可以更好的防止激光打孔过程中激光与金属蒸汽作用产生等离子体屏蔽,减小了能量的损失,而且减小了孔壁的金属沉积以及微裂纹,但所打孔的质量仍较差,孔的形状也不规则。Because the existence of small holes in the first step can better prevent plasma shielding caused by the interaction between laser and metal vapor during the laser drilling process, reducing energy loss, and reducing metal deposition and microcracks on the hole wall , but the quality of the punched holes is still poor, and the shape of the holes is irregular.
最后,输出能量为E1的调制激光脉冲,利用伺服电机控制聚焦镜部件的X轴45度全反射镜12和Y轴45度全反射镜13作二维运动,聚焦镜头实现旋转,设置两个电机旋转的速度大小,改变聚焦镜头旋转范围,实现聚焦镜头运动旋转部件对D2孔的旋切,修复孔壁的再铸层和微裂纹,并获得所要求的孔径D3。Finally, the output energy is the modulated laser pulse of E1 , and the X-axis 45-degree
实施方法一:Implementation method one:
若在0.7mm厚镀锌钢板上打孔径为1mm的小孔,首先,根据工件需要打孔位置采用CCD定位,调整好聚焦镜头的位置。调整激光器的各个输入参数,控制输出功率,输出能量为0.3J的激光脉冲。在氧气保护下输出高峰值功率1.0×109W/cm2的调制激光脉冲1个脉冲就将工件穿透,得到孔径为80μm的小孔D1。然后重新调整激光器的频率、脉宽、输入功率,使输出激光能量为2J的自由运转激光脉冲,聚焦镜头及工件的位置保持不变,在辅助气体的保护下,进行打孔,得到孔径为0.7mm的孔D2。最后,输出能量0.3J的调制激光脉冲,利用电机控制聚焦镜旋转运动系统的X、Y轴45度全反镜1和2作二维运动带动聚焦镜头旋转,X、Y轴45度全反镜1和2都为Nd:YAG全反镜,通过设置电机的旋转的速度大小,改变聚焦镜头旋转范围,实现聚焦镜头运动旋转部件对D2孔的旋切,修复孔壁的再铸层和微裂纹,并获得所要求的孔径1mm的孔。If a small hole with a diameter of 1mm is drilled on a 0.7mm thick galvanized steel plate, firstly, use the CCD to position the hole according to the workpiece needs, and adjust the position of the focusing lens. Adjust the input parameters of the laser, control the output power, and output laser pulses with an energy of 0.3J. Under the protection of oxygen, a modulated laser pulse with a high peak power of 1.0×10 9 W/cm 2 is output to penetrate the workpiece with one pulse, and a small hole D 1 with a diameter of 80 μm is obtained. Then readjust the frequency, pulse width, and input power of the laser, so that the output laser energy is a free-running laser pulse of 2J, and the positions of the focusing lens and the workpiece remain unchanged. Under the protection of the auxiliary gas, the hole is drilled to obtain an aperture of 0.7 mm hole D 2 . Finally, output the modulated laser pulse with an energy of 0.3J, use the motor to control the X, Y axis 45-degree
实施例二:Embodiment two:
若在1.5mm厚的低碳钢上打孔径为2mm的小孔,首先,根据工件需要打孔位置采用CCD定位,调整好聚焦镜头的位置。调整激光器的各个输入参数,控制输出功率,输出能量为2J的激光脉冲。在氩气保护下输出高峰值功率3×109W/cm2的调制激光脉冲1个脉冲就将工件穿透,得到孔径为100μm的小孔D1。然后重新调整激光器的频率、脉宽、输入功率,使输出激光能量为16J的自由运转激光脉冲,聚焦镜头及工件的位置保持不变,在辅助气体的保护下,进行打孔,得到孔径为1.4mm的孔D2。最后,输出能量1J的调制激光脉冲,利用伺服电机控制聚焦镜头旋转运动系统的X、Y轴45度全反镜1、2作二维运动带动聚焦镜头旋转,通过设置电机的旋转的速度大小,改变聚焦镜头旋转范围,实现聚焦镜头运动旋转部件对D2孔的旋切,修复孔壁的再铸层和微裂纹,并获得所要求的孔径2mm的孔。If a small hole with a diameter of 2mm is drilled on a low carbon steel with a thickness of 1.5mm, first of all, according to the position of the workpiece to be drilled, use the CCD to position and adjust the position of the focusing lens. Adjust the input parameters of the laser, control the output power, and output laser pulses with an energy of 2J. Under the protection of argon gas, output a modulated laser pulse with a high peak power of 3×10 9 W/cm 2 to penetrate the workpiece with one pulse, and obtain a small hole D1 with a diameter of 100 μm. Then readjust the frequency, pulse width, and input power of the laser, so that the output laser energy is a free-running laser pulse of 16J, and the position of the focusing lens and the workpiece remains unchanged. Under the protection of the auxiliary gas, the hole is drilled to obtain an aperture of 1.4 mm hole D 2 . Finally, output the modulated laser pulse with an energy of 1J, and use the servo motor to control the X, Y axis 45-degree
在图2所示的实施例中,整个所述装置包括相互联接的激光器1及其光学导光部件2、CCD摄像机3、光电探测器5、计算机6、数字示波器7和激光聚焦镜部件4。激光聚焦镜部件4的正上方是CCD摄像机3,激光聚焦镜部件和光学导光部件相连接,光电探测器5在激光聚焦镜部件上部外的一侧。In the embodiment shown in FIG. 2 , the entire device includes an
在图3所示的激光聚焦镜旋切法中,d为旋切的起始端,e为旋切的末端,f为旋切的路径。打孔方法的第三步采用了这种旋切方法,利用了这种方法对前两步中所打的孔进行修复。In the laser focusing mirror rotary cutting method shown in Figure 3, d is the starting end of rotary cutting, e is the end of rotary cutting, and f is the path of rotary cutting. The third step of the drilling method uses this rotary cutting method, which is used to repair the holes punched in the first two steps.
在图4所示的激光回转法打孔中,即工件绕以偏离激光聚焦斑点中心距离D/2的轴回转。工件在二维运动工作台上,聚焦头不动,工件随平台旋转激光在工件上打出一个孔径为D的孔。但采用回转法切孔时需要的激光能量较大,所切孔的质量较差。其中10为透镜1。In the drilling by the laser rotary method shown in Fig. 4, the workpiece rotates around an axis deviating from the center of the laser focus spot by a distance D/2. The workpiece is on the two-dimensional motion table, the focusing head does not move, the workpiece rotates with the platform, and the laser punches a hole with an aperture D on the workpiece. However, when the rotary method is used to cut holes, the laser energy required is relatively large, and the quality of the cut holes is poor. 10 of them is
在图5所示实施例中,聚焦镜部件4从上到下主要是X轴45度全反镜12和位于X轴45度全反镜左侧的Y轴45度全反镜13、上导轨架14、X轴移动架25、中间导轨架16、Y轴移动架22、聚焦镜头24。In the embodiment shown in Fig. 5, the focusing
参见图6所示的激光聚焦镜部件结构分解图和图7所示的A-A剖视图。Refer to the exploded view of the structure of the laser focusing mirror components shown in FIG. 6 and the A-A sectional view shown in FIG. 7 .
上导轨架14、X轴移动架25、中间导轨架16、Y轴移动架22均是中空结构,X轴45度全反镜下部的固定座穿过上导轨架14,固定在X轴移动架25上,Y轴45度全反镜13下部的Y轴激光导光管穿过上导轨架14、X轴移动架25、中间导轨架16,和Y轴移动架22固定,Y轴激光导光管正下方固定聚焦镜头24。上导轨架固定在所述的激光聚焦镜部件的机架上,X轴移动架与中间导轨架固定在一起。The
X轴45度全反镜12通过螺钉固定在X轴移动架25上方,随X轴移动架25一起运动。Y轴45度全反镜13通过螺钉与中空的圆柱形导光管27连接,激光导光管与Y轴移动架22连接为一体,随Y轴移动架一起运动。X轴45度全反镜的镜头和Y轴45度全反镜的镜头正对,且Y轴45度全反镜位于X轴45全反镜的左侧,激光束从平行于工作台的方向最终变为垂直于工作台的方向射出,穿过两者之间的激光束平行于Y轴轴向。The X-axis 45-degree
X轴移动架25与上导轨架14联接,两者之间可沿X轴向相对滑动,Y轴移动架22与中间导轨架16联接,两者之间可沿Y轴向相对滑动,X轴轴向和Y轴轴向相互垂直。上导轨架和X轴移动架之间通过四块均布的X轴滑块30接触,中间导轨架和Y轴移动架之间通过四块均布的Y轴滑块21接触。The
X轴导轨31安装在上导轨架的底部两侧;X轴电机同步轮20和X轴丝杠同步轮15分别固定在上导轨架下部的左右两侧,X轴电机也固定在上导轨架的下部,X轴丝杠26一端固定于X轴丝杠同步轮15的轴心里,X轴电机同步轮与X轴丝杠同步轮通过同步带连接。The
X轴移动架为空腔结构,在腔体的外部前后两侧X轴移动架的下部与中间导轨架16连接在一起,X轴丝杠26的另一端旋入X轴丝杠螺母32里。滑块30固定在X轴移动架上方,且处于导轨31的正下方。X轴丝杠螺母32与X轴移动架的左侧固定在一起,将X轴丝杠26的旋转运动变为自身的X轴方向的运动,带动X轴移动架运动,从而带动X轴滑块30在导轨上运动。The X-axis mobile frame is a cavity structure, and the bottom of the X-axis mobile frame is connected with the
Y轴电机固定在中间导轨架16的外部,Y轴丝杠23的一端固定于Y轴丝杠同步轮19的轴心里,Y轴丝杠23的另一端旋入Y轴丝杠螺母33里。在Y轴移动架下部底板内设有螺纹,来连接聚焦镜头24。The Y-axis motor is fixed on the outside of the
Y轴丝杠螺母33与Y轴移动架的后侧固定在一起,将Y轴丝杠23的旋转运动转化为自身的Y轴方向的直线运动,带动Y轴移动架运动。The Y-axis
X轴电机同步轮20和Y轴电机同步轮28分别与X轴、Y轴电机相连,X、Y电机采用高速大扭矩精密电机。在Y轴电机驱动下,Y轴丝杠23带动Y轴移动架22运动,滑块21在导轨17上运动,从而带动Y轴45度全反镜13和聚焦镜24同步运动,实现Y轴方向的一维运动。The X-axis motor synchronous wheel 20 and the Y-axis motor synchronous wheel 28 are connected to the X-axis and Y-axis motors respectively, and the X and Y motors adopt high-speed high-torque precision motors. Driven by the Y-axis motor, the Y-
X、Y轴45度全反镜都为Nd:YAG全反镜,激光直线传播到X轴45度全反镜,然后反射到Y轴45度全反镜,再经过Y轴45度全反镜反射后通过导光管27传输到聚焦镜24输出激光进行加工。X轴45度全反镜12和Y轴45度全反镜13的镜头始终正对。Both X and Y axis 45 degree full reflection mirrors are Nd:YAG full reflection mirrors, the laser travels to the X axis 45 degree full reflection mirror in a straight line, then reflects to the Y axis 45 degree full reflection mirror, and then passes through the Y axis 45 degree full reflection mirror After reflection, it is transmitted to the focusing mirror 24 through the
当只有X轴电机同步轮运转时,除上导轨架以及与上导轨架固定在一起的X轴电机同步轮和X轴丝杠同步轮保持不动,其它部分随X轴移动架一起运动,即Y轴运动部分与X轴运动部分同步运动,X轴45度全反镜12和Y轴45度全反镜13同方向运动,保证光始终通过两个镜子的中心,同时确保在运动的过程中光始终从聚焦镜的中心出射,从而实现X轴方向的一维运动。When only the X-axis motor synchronous wheel is running, except for the upper rail frame and the X-axis motor synchronous wheel and X-axis screw synchronous wheel fixed together with the upper rail frame, the other parts move together with the X-axis mobile frame, that is The Y-axis moving part moves synchronously with the X-axis moving part, and the X-axis 45-degree full-
当Y轴电机和X轴电机同时运行时,在X轴丝杠和Y轴丝杠的带动下,X轴移动架和Y轴移动架同时运动,X轴45度全反镜12和Y轴45度全反镜13同时运动,Y轴45度全反镜在保证和X轴45度全反镜同方向运动的同时,在Y轴丝杠螺母的带动下向Y轴方向运动,实现聚焦镜的二维运动,保证了圆孔的切割。When the Y-axis motor and the X-axis motor run at the same time, driven by the X-axis screw and the Y-axis screw, the X-axis moving frame and the Y-axis moving frame move at the same time, and the X-axis 45-degree
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| CN101804514A (en) * | 2010-03-25 | 2010-08-18 | 西北工业大学 | Laser accurate drilling method and device of fiber composite aircraft panel |
| CN101804514B (en) * | 2010-03-25 | 2012-10-10 | 西北工业大学 | Laser accurate drilling method and device of fiber composite aircraft panel |
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| CN1785577A (en) | 2006-06-14 |
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