CN100453269C - Substrate holder and fixing member thereof - Google Patents

Abstract

The invention discloses a grinding device, a substrate support and a fixing component thereof. The substrate support is applied to a grinding device and comprises a fixed disc and a fixed member formed by a grinding pad and a stopping piece. The polishing pad is disposed on the surface of the fixed plate and has a plurality of openings, and the positions of the openings correspond to the size of the substrate. The stopping pieces are arranged on the surface of the fixed disc through the openings on the grinding pads, and the stopping pieces protrude out of the grinding pads, so that a containing area is formed between the stopping pieces to arrange the substrate. According to the invention, when the wire needs to be changed in the manufacturing process, the substrates with different sizes can be ground by only changing the arrangement position of the stopping piece, thereby effectively reducing the time and the cost of the manufacturing process.

Description

Substrate support and its fixing member

technical field

The invention relates to a grinding device, in particular to a substrate support of the grinding device and its fixing components.

Background technique

Flat panel displays, such as organic light emitting displays (OLED) and liquid crystal displays (LCD), have been widely used in computer and communication fields.

Glass substrate is one of the key materials of flat-panel displays, and it is mainly used in thin-film transistors and color filters on flat-panel displays. Since the glass substrate used in the flat panel display needs to have a high degree of smoothness, after the glass material is formed into a glass substrate through a molding manufacturing process, most of them need to go through subsequent processing steps such as polishing and grinding. In addition, the pixels on the color filter (color filter; CF) are formed by photoresists with dyes, such as including red, green and blue; however, due to factors such as manufacturing process parameters and machine equipment, photoresist The etchant will form an uneven structure and affect the image quality of the display panel. Therefore, in the manufacturing process, the photoresist of the color filter generally needs to be polished to flatten the photoresist.

The traditional grinding method is to use an outer frame to confine the glass substrate in the frame for grinding. Please refer to Fig. 1A and Fig. 1B, the substrate support of traditional grinding equipment is that positioning frame body 130 is attached on the surface of fixed disk 110, and polishing pad (back pad) 120 is positioned at positioning frame body 130, and the positioning frame body 130 The size corresponds to the size of the glass substrate 140 to be ground, so that the glass substrate 140 is limited in the positioning frame 130 , and then the manufacturing process of the glass substrate 140 is performed.

Another conventional substrate holder adds a resisting member 150 on the outside of the polishing pad 120 and the positioning frame 130 to limit the movement of the positioning frame 130 , as shown in FIG. 2 .

In the prior art, it is necessary to use a positioning frame to confine the glass substrate in the frame for grinding; however, during actual grinding, the positioning frame is likely to cause the glass substrate to collide and cause fragments. In addition, the positioning frame is adhesive-backed, which may easily cause water seepage when the area is large and the attachment is not good. Moreover, when the size of the glass substrate to be ground changes, it is necessary to completely replace the substrate support or the positioning frame on it, and the replacement operation is time-consuming and labor-intensive.

Contents of the invention

In view of the above problems, the present invention provides a grinding device and its substrate support and fixing components, thereby solving the problems disclosed in the prior art that are easily broken due to collision and difficult to change wires.

The substrate holder disclosed by the present invention is applied to a grinding device to absorb the substrate to be polished, and the substrate holder includes a fixed plate and a fixing member.

The fixing member includes a polishing pad and a stopper.

The polishing pad is arranged on the surface of the fixed disk, and has a plurality of openings, and the positions of the openings correspond to the size of the substrate.

The stoppers pass through the holes on the polishing pad and are arranged on the surface of the fixed disk, and these stoppers protrude from the polishing pad, so as to form an accommodating area between the stoppers for setting the substrate.

Wherein, the polishing pad can be an adsorption type polishing pad, and can be made of materials with high friction coefficient.

Specifically, according to a technical solution of the present invention, a fixing member is provided for absorbing a substrate, comprising: a polishing pad having a plurality of first openings, wherein the positions of the first openings correspond to the positions of the substrate size; and a plurality of stoppers, which are respectively arranged in the plurality of first openings in a one-to-one correspondence, wherein the stoppers protrude from the polishing pad, and a housing is formed between the stoppers area to set up the substrate.

According to another aspect of the present invention, there is provided a substrate support for absorbing a substrate, including: a fixed plate; a polishing pad, which is arranged on the surface of the fixed plate, and has a plurality of first openings, wherein the The position of the first opening corresponds to the size of the substrate; and a plurality of stoppers, which respectively pass through the plurality of first openings in one-to-one correspondence and are arranged on the surface of the fixed plate, wherein the stoppers protruding from the grinding pad to form a receiving area between the stoppers for setting the substrate.

The beneficial technical effects of the present invention are: once the line needs to be changed in the manufacturing process, substrates of different sizes can be ground only by changing the setting position of the stopper, which effectively reduces the time and cost of the manufacturing process.

Regarding the characteristics and examples of the present invention, the preferred embodiments are described in detail below in conjunction with the accompanying drawings.

Description of drawings

1A is a cross-sectional view of a substrate holder of a conventional grinding device;

FIG. 1B is a three-dimensional exploded view of a substrate support of a conventional grinding device;

2 is a cross-sectional view of a substrate holder of another conventional grinding device;

3A is an exploded perspective view of a first embodiment of a substrate holder according to the present invention;

3B is a top view of a second embodiment of a substrate holder according to the present invention;

4 is a top view of a third embodiment of a substrate holder according to the present invention; and

5 is a top view of a fourth embodiment of a substrate holder according to the present invention.

Wherein, the reference signs are explained as follows:

110 Fixing plate 120 Grinding pad 130 Positioning frame

140 glass substrate 150 resisting components 210 fixing plate

220 grinding pad 222 opening 230 stop piece 240 substrate

Detailed ways

Specific embodiments are given below to describe the content of the present invention in detail, and the accompanying drawings are used as auxiliary descriptions. For the reference signs mentioned in the description, please refer to the reference signs in the drawings.

Referring to FIG. 3A, it is an exploded perspective view of a first embodiment of a substrate holder according to the present invention. This substrate holder can be applied to a grinding device for grinding a substrate 240 (such as a glass substrate, a wafer, etc.) in the grinding device. , the substrate 240 to be polished is sucked.

The substrate support includes: a fixed plate 210 and a fixed component. And the fixing component includes a grinding pad 220 and a stopper 230 .

Here, one surface of the polishing pad 220 is attached to the surface of the fixed plate 210 , and a plurality of openings 222 are disposed on the polishing pad 220 corresponding to the size of the substrate 240 . The stoppers 230 respectively pass through the holes 222 and are disposed on the surface of the fixed plate 210 , and the stoppers 230 protrude from the polishing pad 220 to form an accommodating area between the stoppers 230 . When polishing the substrate 240 , the substrate 240 to be polished can be placed in the accommodation area (ie, the substrate 240 to be polished is limited between the stoppers 230 ), so that it is adsorbed on the other surface of the polishing pad 220 .

For example, referring to FIG. 3B , when a rectangular substrate 240 is to be ground, the polishing pad 220 may have holes (not shown) that are substantially arranged around the rectangle, and the stoppers 230 pass through the holes on the polishing pad 220 respectively. Holes are arranged on the fixed disk (not shown in the figure), because the stoppers 230 are higher than the polishing pad 220, so an accommodating area corresponding to the size of the substrate 240 to be ground can be formed between the stoppers 230, and The substrate 240 to be polished can be disposed on the accommodating area, so that the position of the substrate 240 to be polished can be limited by the stopper 230 .

The grinding pad can be an adsorption type grinding pad, and it can be made of a material with a high coefficient of friction. In a preferred embodiment, the friction coefficient of the grinding pad is greater than 1.3; The moisture on the polishing pad can be removed first, such as by scraping with a scraper or blowing with air.

Here, the stopper 230 can be designed as a rectangular cylinder (as shown in FIG. 3B ), and also can be designed as an L-shaped cylinder (as shown in FIG. 4 ). When the stoppers 230 are rectangular cylinders, one or more stoppers 230 may be provided around the substrate 240 to be polished. And when the stopper 230 is an L-shaped cylinder, two stoppers 230 can be used to be respectively arranged on the opposite corners of the substrate 240 to be ground, so as to achieve the effect of controlling the position of the substrate 240 to be ground; Each of the four legs of the substrate 240 is provided with a stopper 230 to control the position of the substrate 240 to be polished.

These stoppers can be made of plastic materials, preferably wear-resistant and non-deformable materials, such as PC (polycarbonate) or PEEK (polyether ether ketone) and other materials. Moreover, the height of these stoppers can be greater than or equal to the height of the polishing pad plus the height of the substrate, and preferably the height is approximately equal to the height of the polishing pad plus the height of the substrate.

Here, although only a rectangular substrate is used for detailed description, it can also be applied to substrates of various shapes. At this time, it is only necessary to set the openings on the polishing pad in accordance with the shape and size of the substrate, so that when the stopper is arranged in the opening When inside the hole, an accommodating area corresponding to the shape and size of the substrate can be formed.

In addition, referring to FIG. 3A and FIG. 5 , the openings 222 on the polishing pad 220 can be set corresponding to substrates 240 of various sizes; in other words, the polishing pad 220 can be matched with substrates 240 of various sizes. The openings 222 correspond to substrates of various sizes. For example, with reference to FIG. 3A , for convenience of description, the outer opening 222 is called the first opening, and the inner opening 222 is called the second opening; When it is on the surface of the fixed disk 210, the formed accommodating area can then be used for a substrate of one size to be disposed thereon; The formed accommodating area can be used for disposing a substrate of another size thereon. In this way, when changing the line during the manufacturing process, only need to change the setting position of the stopper (that is, set it on the fixed plate through other openings), and then the grinding of substrates of different sizes can be carried out, thereby reducing the time of the manufacturing process and cost.

Although the present invention is disclosed above with the aforementioned preferred embodiments, they are not intended to limit the present invention. Various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the contents defined in the appended claims.

Claims (17)

1. A fixing member for absorbing a substrate, comprising: a polishing pad having a plurality of first openings, wherein the positions of the first openings correspond to the size of the substrate; and A plurality of stoppers are respectively arranged in the plurality of first openings in one-to-one correspondence, wherein the stoppers protrude from the polishing pad, and an accommodating area is formed between the stoppers for setting the substrate. 2. The fixing member as claimed in claim 1, wherein the polishing pad is an adsorption type polishing pad. 3. The fixing member as claimed in claim 1, wherein the polishing pad has a high coefficient of friction. 4. The fixing member of claim 1, wherein the stopper is a rectangular structure. 5. The fixing member as claimed in claim 4, wherein the stoppers are respectively provided corresponding to the circumference of the base plate. 6. The fixing member of claim 1, wherein the stopper is L-shaped. 7. The fixing member according to claim 6, wherein the stoppers are disposed corresponding to diagonal corners of the base plate, respectively. 8. The securing member of claim 1, wherein the detent comprises a plastic material. 9. The fixing member of claim 1, wherein a height of the stopper is approximately equal to a height of the polishing pad plus a height of the substrate. 10. The fixing member as claimed in claim 1, wherein the polishing pad further comprises: A plurality of second openings are provided corresponding to another size of the substrate. 11. A substrate support for absorbing a substrate, comprising: Fixed order; a polishing pad, which is disposed on the surface of the fixed disk, and has a plurality of first openings, wherein the positions of the first openings correspond to the size of the substrate; and A plurality of stoppers, which respectively pass through the plurality of first openings and are arranged on the surface of the fixed disk in one-to-one correspondence, wherein the stoppers protrude from the polishing pad, so as to be between the stoppers An accommodating area is formed to set the substrate. 12. The substrate holder as claimed in claim 11, wherein the polishing pad is an adsorption polishing pad and has a high coefficient of friction. 13. The substrate holder as claimed in claim 11, wherein the stoppers are rectangular structures and are disposed corresponding to the surroundings of the substrate. 14. The substrate holder as claimed in claim 11, wherein the stoppers are L-shaped and arranged corresponding to diagonal corners of the substrate. 15. The substrate support of claim 11, wherein the stop comprises a plastic material. 16. The substrate holder of claim 11, wherein a height of the stopper is approximately equal to a height of the polishing pad plus a height of the substrate. 17. The substrate holder of claim 11, wherein the polishing pad further comprises: A plurality of second openings are provided corresponding to another size of the substrate.

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