CN100453323C - Ink jet printing head and its manufacturing process - Google Patents

Abstract

The present invention relates to an inkjet print head and its manufacturing process. The inkjet print head manufacturing process provides a wafer, and the wafer has a plurality of actuators. A patterned photoresist layer is formed on the wafer, wherein the patterned photoresist layer has a plurality of chambers and a plurality of flow channels respectively connected to the chambers, and the chambers are located above the actuators. A negative photoresist layer is formed on the patterned photoresist layer, wherein the negative photoresist layer covers the chambers and the flow channels. An exposure process is performed on the negative photoresist layer, and then a development process is performed on the negative photoresist layer to form a patterned negative photoresist layer, wherein the patterned negative photoresist layer has a plurality of nozzles, and the nozzles are respectively connected to the chambers, and the aperture of each nozzle gradually increases from the upper surface of the patterned negative photoresist layer to the lower surface of the patterned negative photoresist layer.

Description

Inkjet print head and its manufacturing process

technical field

The invention relates to a printing device, in particular to an inkjet printing head and its manufacturing process.

Background technique

In recent years, driven by the development of high-tech industries, all electronics-related industries have advanced by leaps and bounds. As far as printers are concerned, in just a few years, printing technology has progressed from early needle-type printing and monochrome laser printing to current color inkjet printing and color laser printing, and even thermal transfer. Printing technology such as printing. As far as inkjet printers are concerned, the printing technologies currently used in inkjet printers on the market mainly include thermal bubble or piezoelectric inkjet technology, which is used to spray ink To the recording medium, such as paper, etc., thus forming characters or patterns on the surface of the recording medium. Among them, the thermal bubble printing technology uses a heater to instantly vaporize the ink, thereby generating high-pressure air bubbles to push the ink, and then ejecting the ink through a nozzle to form ink droplets.

FIG. 1A to FIG. 1D are schematic diagrams illustrating a manufacturing method of a liquid injection device in US Pat. No. 6,739,519. Please refer to FIG. 1A , a conventional manufacturing method of a liquid injection device includes the following steps. First, a substrate (not shown) is provided, and a thinfilm stack 116 is formed on the substrate. A primer layer 205 is formed on the stacked film 116, wherein the material of the primer layer 205 is SU-8. Then, a patterning process is performed on the coating layer 205 to form the coating layer 205 shown in FIG. 1A . Next, a nozzle layer material 207a is coated on the coating layer 205 . A first exposure process (as shown in FIG. 1B ) and a second exposure process (as shown in FIG. 1C ) are sequentially performed on the nozzle material layer 207 a to form the nozzle layer 207 . Finally, a development process is performed on the structure formed by the above process to remove the unexposed nozzle material layer 207 a and form the cavity 202 and the nozzle 105 in the nozzle layer 207 (as shown in FIG. 1D ).

Since the cavity 202 and the nozzle 105 must be formed by two exposure processes for the nozzle material layer 207a, the control of the process parameters of the two exposure processes is particularly important. In other words, the manufacturing process of this conventional liquid injection device manufacturing method is relatively difficult.

Contents of the invention

The purpose of the present invention is to provide a new inkjet printing head manufacturing process. The technical problem to be solved is to make the manufacturing process simpler and more suitable for practical use.

Another object of the present invention is to provide an inkjet printing head with a new structure. The technical problem to be solved is to make it have tapered nozzles of photoresist material to improve printing quality, so that it is more suitable for practical use.

Other purposes and advantages of the present invention can be further understood from the technical features disclosed in the present invention.

Based on one or part or all of the above objectives or other objectives, the present invention provides an inkjet printing head manufacturing process, which includes the following steps. First, a wafer is provided, and the wafer has a plurality of actuating elements. Then, a patterned photoresist layer (patterned photoresist layer) is formed on the wafer, wherein the patterned photoresist layer has a plurality of chambers (chambers) and a plurality of flow channels (channels) respectively connected to these chambers, and these A chamber is located above these actuating elements. A negative photoresist layer (negative photoresist layer) is formed on the patterned photoresist layer, wherein the negative photoresist layer covers the chambers and the flow channels, the negative photoresist layer has an upper surface and a lower surface, and the lower surface faces the chamber . Carry out a first exposure process (exposing process) for the negative photoresist layer, then carry out a development process (development process) for the negative photoresist layer, to form a patterned negative photoresist layer, wherein the patterned negative photoresist layer has multiple and these nozzles communicate with the chambers respectively, and the aperture of each nozzle gradually increases from the upper surface of the patterned negative photoresist layer to the lower surface of the patterned negative photoresist layer. Next, a dicing process is performed on the wafer.

According to an embodiment of the present invention, light-absorbing particles, light-absorbing dyes or other light-absorbing substances may be doped in the patterned negative photoresist layer. In addition, the material of the patterned negative photoresist layer can be, for example, SU-8.

According to an embodiment of the present invention, the material of the patterned photoresist layer may be a positive photoresist or a negative photoresist, wherein the negative photoresist may be SU-8.

According to an embodiment of the present invention, the step of forming a negative photoresist layer on the patterned photoresist layer may include providing a first substrate; then, forming a negative photoresist layer on the first substrate. Pressing the negative photoresist layer and the first substrate onto the patterned photoresist layer, wherein the negative photoresist layer is located between the first substrate and the patterned photoresist layer. Next, the first substrate and the negative photoresist layer are separated.

According to an embodiment of the present invention, the step of separating the first substrate and the negative photoresist layer may be performed after the first exposure process and before the development process.

According to an embodiment of the present invention, the step of separating the first substrate and the negative photoresist layer may be between after pressing the negative photoresist layer and the first substrate onto the patterned photoresist layer and before the first exposure process.

According to an embodiment of the present invention, the step of forming a patterned photoresist layer on a wafer may include providing a second substrate; then, forming a first photoresist layer on the second substrate; combining the first photoresist layer with the second The substrate is pressed onto the wafer, wherein the first photoresist layer is located between the second substrate and the wafer. Next, the second substrate and the first photoresist layer are separated. The first photoresist layer is patterned to form a patterned photoresist layer.

According to an embodiment of the present invention, after the first exposure process, the inkjet printing head process can further form a second photoresist layer on the negative photoresist layer. Then, a second exposure process is performed on the second photoresist layer. Next, a development process is performed on the negative photoresist layer and the second photoresist layer. After the developing process, nozzles are formed in the patterned negative photoresist layer, and a plurality of protruding rings are respectively formed on the edges of the nozzles.

According to the embodiment of the present invention, the material of these protruding rings can be a positive photoresist or a negative photoresist, wherein the negative photoresist can be, for example, SU-8.

According to the embodiment of the present invention, the actuating element may be, for example, an electric heating element or a piezoelectric element, but the actuating element that can be used in the present invention is not limited to these two types.

Based on the above and other objectives, the present invention provides an inkjet print head, which includes a chip, a patterned photoresist layer and a patterned negative photoresist layer, wherein the chip has stacked thin films and a plurality of actuating elements. In addition, the patterned photoresist layer is disposed on the wafer, wherein the patterned negative photoresist layer has an upper surface and a lower surface, and the lower surface faces the cavity, and the patterned photoresist layer has a plurality of cavities connected to the cavities respectively. chambers located above the actuating elements. In addition, the patterned negative photoresist layer is disposed on the patterned photoresist layer, wherein the patterned negative photoresist layer has a plurality of nozzles, and these nozzles communicate with the chambers respectively, and the aperture of each nozzle is determined by the patterned negative photoresist The upper surface of the layer gradually increases towards the lower surface of the patterned negative photoresist layer.

According to an embodiment of the present invention, light-absorbing particles, light-absorbing dyes or other light-absorbing substances may be doped in the patterned negative photoresist layer. In addition, the thickness of the patterned negative photoresist layer may be between 20 microns and 50 microns. In addition, the material of the patterned negative photoresist layer may be, for example, SU-8.

According to an embodiment of the present invention, the thickness of the patterned photoresist layer may be between 15 microns and 40 microns. In addition, the material of the patterned photoresist layer can be a positive photoresist or a negative photoresist, wherein the negative photoresist can be, for example, SU-8.

According to an embodiment of the present invention, the included angle between the inner wall of each nozzle and the lower surface of the patterned negative photoresist layer may be between about 60 degrees and about 85 degrees.

According to an embodiment of the present invention, the angle between the inner wall of each chamber and the surface of the wafer is about 90 degrees.

According to an embodiment of the present invention, the inkjet printhead may further include a plurality of protruding rings respectively disposed on the edges of the nozzles. In addition, the thickness of each protruding ring may be between 5 microns and 20 microns. In addition, the material of these protruding rings is a positive photoresist or a negative photoresist, wherein the negative photoresist can be, for example, SU-8.

According to the embodiment of the present invention, the actuating element may be an electric heating element or a piezoelectric element, but the actuating element used in the present invention is not limited to these two types.

Based on the above, the present invention first manufactures the negative photoresist dry film, so as to form the tapered nozzles, and the tapered nozzles can improve the printing quality.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. From the above, it can be seen that the present invention relates to an inkjet print head and its manufacturing process. The inkjet printhead process provides a wafer with a plurality of actuating elements. A patterned photoresist layer is formed on the wafer, wherein the patterned photoresist layer has a plurality of cavities and a plurality of flow channels respectively connected to the cavities, and the cavities are located above the actuating elements. A negative photoresist layer is formed on the patterned photoresist layer, wherein the negative photoresist layer covers the cavities and the flow channels. An exposure process is performed on the negative photoresist layer, and then a development process is performed on the negative photoresist layer to form a patterned negative photoresist layer, wherein the patterned negative photoresist layer has a plurality of nozzles, and these nozzles are respectively connected to the cavities The chamber is connected, and the aperture of each nozzle is determined by the patterned negative photoresist

1. The present invention is manufactured in batches of wafers, so the manufacturing cost of a unit inkjet print head is relatively low.

2. The shape of the nozzle of the present invention is conical, so the ejected ink can be more concentrated to improve the satellite droplet phenomenon.

3. Since the inkjet printhead of the present invention has a protruding ring and a cone-shaped nozzle, the influence of ink accumulation or ink mixing on inkjet can be alleviated, and the printing quality can be improved.

4. Compared with the conventional technology, the manufacturing process of the present invention is relatively simple.

In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments will be described in detail below together with the accompanying drawings. It should be noted that the descriptions of various embodiments of the present invention refer to the accompanying drawings, which are used to illustrate specific embodiments in which the present invention can be implemented. Therefore, the directional terms mentioned in the present invention, such as "upper", "lower", "left", "right", etc., are only referring to the directions of the attached drawings. The inkjet printheads disclosed in the present invention can be arranged arbitrarily, so the directional terms used are for illustration rather than limitation of the present invention.

Description of drawings

FIG. 1A to FIG. 1D are schematic diagrams illustrating a manufacturing method of the liquid injection device of US Pat. No. 6,739,519.

FIG. 2 is a schematic cross-sectional view of an inkjet printhead according to a first embodiment of the present invention.

3A to 3D are schematic cross-sectional views illustrating the inkjet print head manufacturing process according to the first embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view of an inkjet printhead according to a second embodiment of the present invention.

5A to 5B are schematic cross-sectional views illustrating the inkjet print head manufacturing process according to the second embodiment of the present invention.

105: nozzle 116: stacked film

202: Chamber 205: Primer coating

207: Nozzle layer 207a: Nozzle material layer

300, 500: inkjet print head 310: wafer

310a: Wafer 312: Actuation element

320: Patterned photoresist layer 322: Chamber

324: Runner 330: Patterned negative photoresist layer

330a: Negative photoresist layer 332: Nozzle

410: base plate 510: protruding ring

510a: photoresist layer

Detailed ways

In order to further explain the technical means and effects that the present invention adopts to achieve the predetermined invention purpose, the following in conjunction with the accompanying drawings and preferred embodiments, the specific implementation, structure and method of the inkjet print head and its manufacturing process proposed according to the present invention , steps, features and effects thereof are described in detail below.

【The first embodiment】

FIG. 2 is a schematic cross-sectional view of an inkjet printhead according to a first embodiment of the present invention. Please refer to FIG. 2, the inkjet printing head 300 of the present embodiment includes a chip 310a, a patterned photoresist layer 320 and a patterned negative photoresist layer 330, wherein the chip 310a has a stacked film (not shown) and a plurality of Actuating element 312 . In this embodiment, these actuating elements 312 are, for example, electric heating elements (heaters) formed by resistive materials, so the inkjet printhead 300 of this embodiment may be a thermal bubble inkjet printhead, but The actuating element usable with the present invention is not limited thereto.

The patterned photoresist layer 320 is disposed on the wafer 310a, wherein the patterned photoresist layer 320 has a plurality of cavities 322 and a plurality of flow channels 324 respectively connected to the cavities 322, and the cavities 322 are located at the actuating elements 312 above. The angle A between the inner wall of each chamber 322 and the surface of the wafer 310a is about 90 degrees. In addition, the thickness of the patterned photoresist layer 320 may be between 15 micrometers and 40 micrometers, but the thickness of the patterned photoresist layer 320 of the present invention is not limited to the above range. In addition, the material of the patterned photoresist layer 320 can be a positive photoresist or a negative photoresist, wherein the negative photoresist can be, for example, SU-8.

The patterned negative photoresist layer 330 is disposed on the patterned photoresist layer 320, wherein the patterned negative photoresist layer 330 has a plurality of nozzles 332 (only one is marked in FIG. 2 ), and these nozzles 332 communicate with the chambers 322 respectively , and the apertures of the nozzles 332 gradually increase from the upper surface of the patterned negative photoresist layer 330 to the lower surface of the patterned negative photoresist layer 330 , as shown in FIG. 2 . It is worth mentioning that the patterned negative photoresist layer 330 may be doped with light-absorbing particles, light-absorbing dyes or other light-absorbing substances (in the present invention, light-absorbing particles or other light-absorbing substances may be collectively referred to as light-absorbing particles ), so as to form these nozzles 332.

The angle B between the inner wall of each nozzle 332 and the lower surface of the patterned negative photoresist layer 320 may be between about 60 degrees and 85 degrees. Since the nozzles 332 are conical in shape, the ejected ink can be concentrated to improve the satellite droplet phenomenon. In addition, the thickness of the patterned negative photoresist layer 330 can be between 20 microns and 50 microns (but the thickness of the patterned negative photoresist layer 330 of the present invention is not limited to this range), and the patterned negative photoresist layer 330 The material may be SU-8, such as the SU-8 series negative photoresist produced by MicroChem. In other words, the materials of the patterned negative photoresist layer 330 and the patterned photoresist layer 320 can be the same or different.

It is worth noting that the patterned negative photoresist layer 330 and the patterned photoresist layer 320 of this embodiment are not limited to be used on thermal inkjet print heads. The orifice plate formed by the patterned negative photoresist layer 330 and the patterned photoresist layer 320 can also be applied to, for example, a piezoelectric inkjet print head, and these actuating elements 312 are piezoelectric elements at this time. The manufacturing method of the inkjet printhead 300 of this embodiment will be described in detail later.

3A to 3D are schematic cross-sectional views illustrating the inkjet print head manufacturing process according to the first embodiment of the present invention. Please refer to FIG. 3A first. The inkjet printhead manufacturing process of this embodiment includes the following steps: First, a wafer 310 is provided, and the wafer has a plurality of actuating elements 312 . Then, a patterned photoresist layer 320 is formed on the wafer 310, wherein the patterned photoresist layer 320 has a plurality of cavities 322 and a plurality of flow channels 324 respectively connected to these cavities 322, and these cavities 322 are located above these actuating elements 312 . For example, to form the patterned photoresist layer 320, a first photoresist material layer (not shown) can be formed on the wafer 310 by, for example, spin coating, and then an exposure process and A developing process to form a patterned photoresist layer 320 .

Referring to FIG. 3B , a substrate 410 is provided. The material of the substrate 410 can be, for example, polyester (PET) material, PP, PVC, PI or other transparent or opaque materials. Next, a negative photoresist layer 330a is formed on the substrate 410, wherein the method for forming the negative photoresist layer 330a can be roll coating (roll coating), extrusion coating (extrusion slot, slot die), doctor blade coating (comma coating) or spin coating (spin), tension coating (web tension), capillary coating (capillary), fine carving type coating (micro gravure) and other coating methods known to those skilled in the art . The thickness of the negative photoresist layer 330a can vary according to design requirements. After the negative photoresist layer 330a is coated on the substrate 410, a soft-bake process is performed on the negative photoresist layer 330a, and the temperature of the soft-bake process may be between 60 degrees Celsius and 90 degrees Celsius. The baking time will be different due to the thickness of the negative photoresist film and the heating method. It can be between 5 minutes and 60 minutes, but the baking time and temperature used in the present invention are not limited to the above numerical range.

Referring to FIG. 3C , the negative photoresist layer 330 a and the substrate 410 are pressed onto the patterned photoresist layer 320 , wherein the negative photoresist layer 330 a is located between the substrate 410 and the patterned photoresist layer 320 . The temperature for pressing the negative photoresist layer 330a and the substrate 410 onto the patterned photoresist layer 320 can be between 20 degrees Celsius and 80 degrees Celsius, but in the present invention, the negative photoresist layer 330a and the substrate 410 are bonded to the patterned photoresist layer 320. The temperature on the photoresist layer 320 is not limited to the above range.

It should be noted that the method for forming the negative photoresist layer 330 a can also be used in the process of forming the patterned photoresist layer 320 . In other words, roll coating (roll coating), extrusion coating (extrusion slot, slot die), doctor blade coating (comma coating) or spin coating (spin), tension coating (web tension), capillary coating can be used A photoresist layer is formed on the substrate 410 by capillary, micro gravure, or any other coating method known to those skilled in the art. Next, the photoresist layer and the substrate 410 are pressed onto the wafer 310 , wherein the photoresist layer is located between the substrate 410 and the wafer 310 . Next, the substrate 410 and the photoresist layer are separated, and then the photoresist layer is patterned to form the patterned photoresist layer 320 , wherein the method of patterning the photoresist layer includes an exposure process and a development process.

Referring to FIG. 3D , sequential exposure and development processes are performed on the negative photoresist layer 330 a to form a patterned negative photoresist layer 330 . Since light-absorbing particles, light-absorbing dyes, or other light-absorbing substances are doped in the negative photoresist layer 330a (in the present invention, light-absorbing particles or other light-absorbing substances can be collectively referred to as light-absorbing particles), the exposure process and the development process Afterwards, a tapered nozzle 332 can be formed in the patterned negative photoresist layer 330 . It should be noted that the step of separating the substrate 410 from the negative photoresist layer 330a may be performed after the exposure process for the negative photoresist layer 330a and before the development process. Alternatively, the step of separating the substrate 410 and the negative photoresist layer 330a may be performed after the negative photoresist layer 330a and the substrate 410 are bonded onto the patterned photoresist layer 320 and before the exposure process for the negative photoresist layer 330a. Then, a hard baking process and a dicing process are sequentially performed on the wafer 310 to form the inkjet print head 300 shown in FIG. 2 .

【Second Embodiment】

FIG. 4 is a schematic cross-sectional view of an inkjet printhead according to a second embodiment of the present invention. Please refer to FIG. 4 , this embodiment is similar to the above-mentioned embodiments, the difference is that: in this embodiment, the inkjet print head 500 may further include a plurality of protruding rings 510, which are respectively arranged on the edges of these nozzles 332 , to improve the impact of ink accumulation or ink mixing on inkjet. For example, the thickness of each protruding ring 510 may be between 5 microns and 20 microns, but the thickness of the protruding rings used in the present invention is not limited to this range. The material of these protruding rings 510 is a positive photoresist or a negative photoresist, wherein the negative photoresist can be SU-8. In other words, the materials of the patterned photoresist layer 320 , the patterned negative photoresist layer 330 and the protrusion ring 510 may be the same or different. The manufacturing method of the inkjet printhead 500 of this embodiment will be described in detail later.

5A to 5B are schematic cross-sectional views illustrating the inkjet print head manufacturing process according to the second embodiment of the present invention. Please refer to FIG. 3C and FIG. 5A at the same time. After the substrate 410 is removed, a photoresist layer 510a is formed on the exposed negative photoresist layer 330a, wherein the method of forming the photoresist layer 510a can be as described above. Methods. Then, a post exposure baking (PEB) process is performed on the photoresist layer 510a, wherein the baking temperature of the post exposure baking process can be between 50 degrees Celsius and 110 degrees Celsius, and the baking time can be between 1 Minutes to 10 minutes, but the baking time and temperature used in the present invention are not limited to the above numerical range.

Referring to FIG. 5B, an exposure process is performed on the photoresist layer 510a. Then, a development process is performed on the exposed photoresist layer 510 a and the exposed negative photoresist layer 330 a in sequence to form the protruding rings 510 and the patterned negative photoresist layer 330 . When the material of the photoresist layer 510a and the negative photoresist layer 330a are the same, after the exposure process is performed on the photoresist layer 510a, the development process is performed simultaneously on the exposed photoresist layer 510a and the exposed negative photoresist layer 330a. Finally, a hard-baking process and a dicing process are sequentially performed on the wafer 310 to form the inkjet print head 500 shown in FIG. 4 .

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, can use the method and technical content disclosed above to make some changes or modifications to equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention, Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims (32)

1. An inkjet printing head manufacturing process, characterized in that it comprises the following steps: providing a wafer having a plurality of actuation elements; A patterned photoresist layer is formed on the wafer, wherein the patterned photoresist layer has a plurality of cavities and a plurality of flow channels respectively connected to the cavities, and the cavities are located at the actuation elements above; A negative photoresist layer is formed on the patterned photoresist layer, wherein the negative photoresist layer covers the chambers and the flow channels, the negative photoresist layer has an upper surface and a lower surface, and the lower surface faces the chambers; performing a first exposure process on the negative photoresist layer; and A development process is performed on the negative photoresist layer to form a patterned negative photoresist layer, wherein the patterned negative photoresist layer has a plurality of nozzles, and the nozzles are respectively communicated with the chambers, and each nozzle The aperture of the patterned negative photoresist layer gradually increases from the upper surface of the patterned negative photoresist layer to the lower surface of the patterned negative photoresist layer. 2. The inkjet printing head manufacturing process according to claim 1, wherein light-absorbing particles or light-absorbing dyes are doped in the patterned negative photoresist layer. 3. The inkjet printing head manufacturing process according to claim 1, wherein the material of the patterned negative photoresist layer comprises SU-8. 4. The inkjet printing head manufacturing process according to claim 1, wherein the material of the patterned photoresist layer is a negative photoresist. 5. The inkjet printing head manufacturing process according to claim 4, wherein said negative photoresist comprises SU-8. 6. The inkjet printing head manufacturing process according to claim 1, wherein the patterned photoresist layer is made of a positive photoresist. 7. The inkjet printing head manufacturing process according to claim 1, wherein the step of forming the negative photoresist layer comprises: providing a first substrate; forming the negative photoresist layer on the first substrate; pressing the negative photoresist layer and the first substrate onto the patterned photoresist layer, wherein the negative photoresist layer is located between the first substrate and the patterned photoresist layer; and separating the first substrate and the negative photoresist layer. 8. The inkjet printing head manufacturing process according to claim 7, wherein the step of separating the first substrate and the negative photoresist layer is after the first exposure process and before the development process. 9. The inkjet printing head manufacturing process according to claim 7, wherein the step of separating the first substrate and the negative photoresist layer is between pressing the negative photoresist layer and the first substrate to the After patterning the photoresist layer and before the first exposure process. 10. The inkjet printing head manufacturing process according to claim 1, wherein the step of forming the patterned photoresist layer comprises: providing a second substrate; forming a first photoresist layer on the second substrate; press-bonding the first photoresist layer and the second substrate onto the wafer, wherein the first photoresist layer is located between the second substrate and the wafer; separating the second substrate from the first photoresist layer; and Patterning the first photoresist layer to form the patterned photoresist layer. 11. The inkjet printing head manufacturing process according to claim 1, further comprising: after performing the first exposure process: forming a second photoresist layer on the negative photoresist layer; performing a second exposure process on the second photoresist layer; and The developing process is performed on the negative photoresist layer and the second photoresist layer to form a plurality of protruding rings on the edges of the nozzles respectively. 12. The inkjet printing head manufacturing process according to claim 11, wherein the material of the protruding rings is a negative photoresist. 13. The inkjet printing head manufacturing process according to claim 12, wherein said negative photoresist comprises SU-8. 14. The inkjet printing head manufacturing process according to claim 11, wherein the material of the protruding rings is a positive photoresist. 15. The inkjet printing head manufacturing process according to claim 1, wherein the actuating element is an electric heating element or a piezoelectric element. 16. The inkjet printing head manufacturing process according to claim 1, further comprising performing a dicing process on the wafer after the developing process. 17. An inkjet print head, characterized in that it comprises: a wafer having a plurality of actuating elements; A patterned photoresist layer is disposed on the wafer, wherein the patterned photoresist layer has a plurality of cavities and a plurality of flow channels respectively connected to the cavities, and the cavities are located at the actuating above the component; A patterned negative photoresist layer, configured on the patterned photoresist layer, wherein the patterned negative photoresist layer has an upper surface and a lower surface, the lower surface faces the cavities, the patterned negative photoresist layer There are a plurality of nozzles, and the nozzles communicate with the chambers respectively, and the aperture of each nozzle gradually increases from the upper surface of the patterned negative photoresist layer to the lower surface of the patterned negative photoresist layer. 18. The inkjet print head according to claim 17, wherein light-absorbing particles or light-absorbing dyes are doped in the patterned negative photoresist layer. 19. The inkjet print head according to claim 17, wherein the angle between the inner wall of each nozzle and the lower surface of the patterned negative photoresist layer is between about 60 degrees and about 85 degrees. 20. The inkjet print head according to claim 17, wherein the angle between the inner wall of each chamber and the surface of the wafer is about 90 degrees. 21. The inkjet print head according to claim 17, wherein the thickness of the patterned photoresist layer is between 15 microns and 40 microns. 22. The inkjet print head according to claim 17, wherein the thickness of the patterned negative photoresist layer is between 20 microns and 50 microns. 23. The inkjet print head according to claim 17, wherein the material of the patterned negative photoresist layer comprises SU-8. 24. The inkjet print head according to claim 17, wherein the material of the patterned photoresist layer is a negative photoresist. 25. The ink jet printhead of claim 24, wherein said negative photoresist comprises SU-8. 26. The inkjet print head according to claim 17, wherein the patterned photoresist layer is made of a positive photoresist. 27. The inkjet print head according to claim 17, further comprising a plurality of protruding rings respectively disposed on the edges of the nozzles. 28. The inkjet print head according to claim 27, wherein the thickness of each of the protruding rings is between 5 microns and 20 microns. 29. The inkjet print head according to claim 27, wherein the material of the protruding rings is a negative photoresist. 30. The ink jet printhead of claim 29, wherein said negative photoresist comprises SU-8. 31. The inkjet print head according to claim 27, wherein the material of the protruding rings is a positive photoresist. 32. The inkjet print head according to claim 17, wherein said actuating element is an electric heating element or a piezoelectric element.

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