CN100541392C - Temperature detection system and method - Google Patents
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Abstract
Description
技术领域 technical field
本发明涉及一种温度侦测系统及方法,更详而言之,涉及依据对待测对象所侦测到的工作电流而相对取得该待测对象所消耗的功率,并以该消耗功率作为该待测对象的工作温度,以在侦测到该工作温度高于一预定值时驱使散热单元对该待测对象进行散热的一种温度侦测系统及方法。The present invention relates to a temperature detection system and method. More specifically, it involves relatively obtaining the power consumed by the object to be measured according to the detected operating current of the object to be measured, and using the power consumption as the target A temperature detection system and method for measuring the working temperature of an object to drive a cooling unit to dissipate heat from the object to be measured when the operating temperature is detected to be higher than a predetermined value.
背景技术 Background technique
随着科技的发展,使各类电子设备的效能相对提升,诸如测量该电子设备的系统工作所产生的工作温度,现行多采用温度感测晶片(IC)实现对系统产生温度的测量,然,此类测温方式,必须将该温度感测晶片临近设置于需进行温度测量的对象,例如中央处理器或硬盘,受限于温度感测晶片及其设置方式,因此现行测温方式并不能针对电子设备中的所有电子零件温度作测量。With the development of science and technology, the performance of various electronic devices has been relatively improved. For example, to measure the operating temperature generated by the system operation of the electronic device, a temperature sensing chip (IC) is currently used to measure the temperature generated by the system. However, In this kind of temperature measurement method, the temperature sensing chip must be placed close to the object to be measured, such as a central processing unit or a hard disk, which is limited by the temperature sensing chip and its setting method, so the current temperature measurement method cannot target The temperature of all electronic parts in electronic equipment is measured.
另者,此类测温方式中所采用的温度感测晶片本身具有固定的传输线规格,以便通过该传输线对待测对象进行温度测量,故待测对象则须具备有与该传输线相对应的连接线,然而,一般而言,待测对象并不具备有与该温度感测晶片的传输线对应的连接线,因此,此类测温方式亦受限于与该温度感测晶片的传输线对应的连接线。In addition, the temperature sensing chip used in this type of temperature measurement method itself has a fixed transmission line specification, in order to measure the temperature of the object to be measured through the transmission line, so the object to be measured must have a connection line corresponding to the transmission line However, generally speaking, the object to be measured does not have a connection line corresponding to the transmission line of the temperature sensing chip, so this type of temperature measurement method is also limited to the connection line corresponding to the transmission line of the temperature sensing chip .
因此,如何设计一种温度侦测系统,以克服温度感测晶片设置位置需受限于待测对象所在位置以及温度侦测处理上电子设备需对应具备可支援该温度感测晶片的传输线的问题,实为目前亟待解决的问题。Therefore, how to design a temperature detection system to overcome the problem that the setting position of the temperature sensing chip is limited by the position of the object to be measured and the electronic equipment on the temperature detection processing needs to have a transmission line that can support the temperature sensing chip , is an urgent problem to be solved at present.
发明内容 Contents of the invention
鉴于上述现有技术的问题,本发明的一目的在于提供一种温度侦测系统及方法,用以解决温度感测晶片设置位置受限于待测对象所在位置以及温度侦测处理上电子设备需对应具备可支援该温度感测晶片的传输线的问题。In view of the above-mentioned problems in the prior art, an object of the present invention is to provide a temperature detection system and method, which is used to solve the problem that the position of the temperature sensing chip is limited by the position of the object to be measured and the electronic equipment required for temperature detection processing. Corresponding to the problem of having a transmission line that can support the temperature sensing chip.
本发明的另一目的在于提供一种温度侦测系统及方法,用以侦测该温度侦测对象所消耗的功率,并依据散热单元的散热效率与该电子设备的消耗功率的关系以控制该散热单元所能提供的散热机制,藉以作为电子设备在整体系统上的节能控制。Another object of the present invention is to provide a temperature detection system and method for detecting the power consumed by the temperature detection object, and controlling the power consumption of the electronic device according to the relationship between the heat dissipation efficiency of the heat dissipation unit and the power consumption of the electronic device. The heat dissipation mechanism provided by the heat dissipation unit is used as an energy-saving control of the electronic equipment in the overall system.
本发明的再一目的在于提供一种温度侦测系统及方法,用以侦测电子设备在整体系统上的功率消耗及热量测量。Another object of the present invention is to provide a temperature detection system and method for detecting the power consumption and heat measurement of the electronic equipment in the overall system.
为达上述所有目的及其它目的,本发明提供一种温度侦测系统及方法。本发明的温度侦测系统系用以对一电子设备中的待测对象进行工作温度的侦测,且在侦测到工作温度高于一预定值时驱使该电子设备中的散热单元对该待测对象进行散热,该温度侦测系统包括:侦测模块,系用以侦测该待测对象的工作电流;转换模块,系用以将该侦测模块所侦测到的工作电流转换为数字信号并予以输出;以及控制模块,系用以于接收到该转换模块所输出的数字信号时,依据该数字信号进行运算来取得该待测对象的消耗功率,而以该消耗功率作为该待测对象的工作温度,并以该消耗功率所对应的工作温度驱使该散热单元对该待测对象进行散热。To achieve all the above objects and other objects, the present invention provides a temperature detection system and method. The temperature detection system of the present invention is used to detect the operating temperature of the object to be measured in an electronic device, and when it detects that the operating temperature is higher than a predetermined value, it drives the heat dissipation unit in the electronic device to the object to be tested The temperature detection system includes: a detection module, which is used to detect the operating current of the object to be measured; a conversion module, which is used to convert the operating current detected by the detection module into digital signal and output it; and the control module is used for receiving the digital signal output by the conversion module, performing calculations based on the digital signal to obtain the power consumption of the object to be measured, and using the power consumption as the power consumption of the object to be measured The operating temperature of the object, and the cooling unit is driven to dissipate heat from the object under test at the operating temperature corresponding to the power consumption.
于本发明中,通过该待测对象的消耗功率决定该待测对象所产生的热量,由此使该控制模块依据散热单元的散热效率与待测对象的消耗功率的关系以控制该散热单元的散热效能,例如,该散热单元为风扇,当该待测对象所产生的热量过高时,该控制模块驱使风扇以全速进行运转,以降低该待测对象所产生的热量,且由于该电子设备内的待测对象会因应电子设备的系统运行状况而相对停止运行,故待测对象在停止运行时并不会消耗任何功率,而因禁示风扇运转或使该风扇维持在低速运转状态,故可有效控制风扇在转速变化时所产生的噪音。因此,本发明的温度侦测系统即依据功率消耗所造成的温度影响而作为散热机制的参考。In the present invention, the heat generated by the object to be measured is determined by the power consumption of the object to be measured, so that the control module controls the heat dissipation of the heat dissipation unit according to the relationship between the heat dissipation efficiency of the heat dissipation unit and the power consumption of the object to be measured. Heat dissipation performance, for example, the cooling unit is a fan, when the heat generated by the object to be measured is too high, the control module drives the fan to run at full speed to reduce the heat generated by the object to be measured, and because the electronic device The object under test will stop running relatively according to the system operating status of the electronic equipment, so the object under test will not consume any power when it stops running, and the fan is prohibited from running or the fan is maintained at a low speed. It can effectively control the noise generated by the fan when the speed changes. Therefore, the temperature detection system of the present invention is based on the temperature impact caused by power consumption as a reference for the heat dissipation mechanism.
通过本发明的温度侦测系统执行本发明的散热温度侦测方法系用以对一电子设备中的待测对象进行工作温度的侦测,且在侦测到工作温度高于一预定值时驱使该电子设备中的散热单元对该待测对象进行散热,该温度侦测方法系包括以下步骤:侦测该待测对象的工作电流;将所侦测到的工作电流转换为可供该电子设备读取的数字信号;以及依据该数字信号进行运算来取得该待测对象的消耗功率,而以该消耗功率作为该待测对象的工作温度,并以该消耗功率所对应的工作温度驱使该散热单元对该待测对象执行散热。Executing the heat dissipation temperature detection method of the present invention through the temperature detection system of the present invention is used to detect the operating temperature of the object to be tested in an electronic device, and when the detected operating temperature is higher than a predetermined value, it is driven The heat dissipation unit in the electronic equipment dissipates heat from the object to be measured, and the temperature detection method includes the following steps: detecting the operating current of the object to be measured; converting the detected operating current into The read digital signal; and performing calculations based on the digital signal to obtain the power consumption of the object to be measured, and use the power consumption as the working temperature of the object to be measured, and drive the heat dissipation at the working temperature corresponding to the power consumption The unit performs heat dissipation on the object under test.
相比于现有技术,本发明的温度侦测系统及方法可有效排除现有温度感测晶片的设置需考虑待测对象所在位置以及温度侦测处理上电子设备需对应具备可支援该温度感测晶片的传输线的问题,此外,由于依据待测对象实际功率消耗情形来执行散热,故可有效控制噪音的产生,且亦可免除温度感测晶片的设置,因而降低电子设备的电源消耗;另一方面,依据散热单元的散热效率与待测对象的消耗功率的关系以控制该散热单元的散热效能,进而达到对电子设备的节能控制。再者,通过本发明的温度侦测系统更可求得待测对象的消耗功率,并以此作为待测对象本身的功率消耗,或者是可求得电子设备整体系统所有的功率消耗,依据功率消耗所造成的温度影响而作为散热机制的参考,换言之,亦可依据电子设备的整体系统或局部的电子元件所消耗的功率来控制该散热单元所能发挥的散热效能,由此作为电子设备对于散热上的节能控制。Compared with the prior art, the temperature detection system and method of the present invention can effectively eliminate the need to consider the location of the object to be measured in the setting of the existing temperature sensing chip, and the electronic equipment in the temperature detection process needs to be equipped to support the temperature sensor. In addition, since the heat dissipation is performed according to the actual power consumption of the object to be measured, the generation of noise can be effectively controlled, and the setting of the temperature sensing chip can also be exempted, thereby reducing the power consumption of electronic equipment; On the one hand, the heat dissipation performance of the heat dissipation unit is controlled according to the relationship between the heat dissipation efficiency of the heat dissipation unit and the power consumption of the object to be measured, thereby achieving energy-saving control of the electronic equipment. Furthermore, through the temperature detection system of the present invention, the power consumption of the object to be measured can be obtained, and this can be used as the power consumption of the object to be measured itself, or the power consumption of the entire system of the electronic device can be obtained, based on the power consumption The temperature effect caused by consumption can be used as a reference for the heat dissipation mechanism. In other words, the heat dissipation performance of the heat dissipation unit can also be controlled according to the power consumed by the overall system of the electronic device or the local electronic components. Energy-saving control on heat dissipation.
附图说明 Description of drawings
图1所示为本发明的温度侦测系统的基本架构方块示意图;以及FIG. 1 is a schematic block diagram of the basic structure of the temperature detection system of the present invention; and
图2所示为本发明的温度侦测方法的基本流程图。FIG. 2 is a basic flowchart of the temperature detection method of the present invention.
【主要元件符号说明】[Description of main component symbols]
1 温度侦测系统1 Temperature detection system
10 侦测模块10 detection module
11 转换模块11 conversion module
12 控制模块12 control module
2 电子设备2 electronic equipment
20 待测对象20 objects to be tested
21 散热单元21 cooling unit
S201~S203 步骤S201~S203 steps
具体实施方式 Detailed ways
以下通过特定的具体实施例说明本发明的实施方式,所属领域的技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。本发明亦可通过其他不同的具体实施例加以施行或应用,本说明书中的各项细节亦可基于不同的观点与应用,在不背离本发明的精神下进行各种修饰与变更。The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
如图1所示,为本发明的温度侦测系统1的基本架构方块示意图。该温度侦测系统1系应用于电子设备2中,且可直接内设于该电子设备2中,以对该电子设备2中的待测对象20进行温度感测,且于温度感测后驱使该电子设备2中的散热单元21执行与该温度感测结果对应的散热机制,本实施例,该待测对象20例如CPU,而该散热单元21系例如风扇,该散热机制例如包括当温度感测结果为高温,则电子设备2驱使风扇以全速运转,以调降该待测对象20的温度。由于电子设备2内的电子元件会因应系统运行状况相对产生运行或停止运行的状态,因此在电子元件运行时将对应消耗功率,相对的,在电子元件停止运行时并不会消耗任何功率,因此,本发明的温度侦测系统1即依据功率消耗所造成的温度影响而作为散热机制的参考。As shown in FIG. 1 , it is a schematic block diagram of the basic structure of the temperature detection system 1 of the present invention. The temperature detection system 1 is applied in the electronic equipment 2, and can be directly built in the electronic equipment 2, so as to sense the temperature of the
本发明的温度侦测系统1系包括:侦测模块10、转换模块11、控制模块12以及存储器120,以下即针对本发明的温度侦测系统1进行详细说明。The temperature detection system 1 of the present invention includes: a
该侦测模块10系用以侦测该待测对象20工作电流,通过该电流的侦测以取得对应的消耗功率,一般而言,该侦测模块10为电流侦测电路。本实施例中,待测对象20的工作电流决定其所消耗的功率,且由所消耗的功率可确定该待测对象20所产生的热量,并由此作为该待测对象的工作温度。The
该转换模块11系用以对该侦测模块10所侦测出的工作电流执行类比数字转换(ADC),以将该工作电流转换为数字信号输出。该控制模块12系用以于接收到该转换模块11所输出的数字信号时,依据该数字信号控制该散热单元21对该待测对象20执行相对的散热机制。其中,该控制模块12与转换模块11间系通过I2C或GPIO等传输线路达到数字信号的传输处理。The
该控制模块12例如该电子设备2的控制中心,举例而言,若该电子设备2为桌上型电脑或笔记型电脑,则该控制模块12则为中央处理器(CPU);若该电子设备2为服务器,则该控制模块12则为基板管理控制器(BMC)。一般而言,该控制模块12与用以储存多笔运行参数的存储器120电性连接,其中该运行参数系指风扇的控制转速及待测对象的阻值,且各风扇的控制转速亦与预设的消耗功率相对应,如此,以在控制模块12接收经该转换模块11转换后所输出的数字信号后,依据产生该数字信号的最初输出源,亦即该数字信号的最初产生源为该待测对象20,来取得该待测对象20的阻值并将该阻值与所接收到的数字信号(即流经该待测对象的电流)进行运算,以取得该待测对象20所消耗的功率,使该控制模块12依据所取得的待测对象20的消耗功率自该存储器12中取得与其对应的风扇控制转速,进而驱使该散热单元21依据取得的风扇控制转速进行散热。The
由上可知,该侦测模块10通过侦测该待测对象20所流经的电流,并由该转换模块11对所测得的电流进行数字转换,以供该控制模块12依据所接收到的数字信号与存储器120所预存的待测对象20的阻值来取得该待测对象20所消耗的功率,再以与该功率对应的风扇转速来驱使该散热单元执行散热,因此,本发明的温度侦测系统1系加入电流侦测电路(即侦测模块)并利用现有电子设备2原有提供的类比数字转换电路(即转换模块)以及控制模块,即可求得待测对象的消耗功率并以此作为待测对象本身的工作温度,或者是可求得电子设备整体系统所有的功效消耗,依据功率消耗所造成的温度影响而作为散热机制的参考。通过本发明的温度侦测系统1即可有效排除现有温度感测晶片的设置需考虑待测对象所在位置以及温度侦测处理上电子设备需对应具备可支援该温度感测晶片的传输线的问题,此外,由于依据待测对象实际功率消耗情形来执行散热,可有效控制噪音的产生,且亦可免除温度感测晶片的设置,因而降低电子设备的电源消耗,另一方面,依据散热单元21的散热效率与待测对象的消耗功率的关系以控制该散热单元21的散热效能,进而达到对电子设备2的节能控制。As can be seen from the above, the
通过本发明的温度侦测系统1执行本发明的温度侦测方法的流程图如图2所示,该方法包括以下实施步骤:在步骤S201中,通过侦测模块10侦测该电子设备2中的待测对象20的工作电流。接着,进至步骤S202。The flow chart of implementing the temperature detection method of the present invention through the temperature detection system 1 of the present invention is shown in Figure 2. The method includes the following implementation steps: In step S201, detect the The operating current of the object under
在步骤S202中,通过转换模块11依据侦测模块10所侦测到的工作电流进行数字转换,以转换为可供电子设备2判读的数字信号。接着,进至步骤S203。In step S202 , digital conversion is performed by the
在步骤S203中,该控制模块12依据所接收到的数字信号,运算出该待测对象20所消耗的功率,使该控制模块12以运算出的功率控制散热单元21来执行对应散热机制。在此须说明的是,由于该控制模块12系与用以储存多笔运行参数的存储器120电性连接,其中该运行参数系指风扇的控制转速及待测对象的阻值,且各风扇的控制转速亦与预设的消耗功率相对应,例如,消耗功率越高则风扇转速越高,故该控制模块12接收经该转换模块11转换后所输出的数字信号(即流经该待测对象的电流)与该待测对象20的阻值进行运算,以取得该待测对象20所消耗的功率,亦即,功率的取得方式包括待测对象的工作电压乘以待测对象的工作电流,或者待测对象的工作电流的平方后再乘以待测对象的阻值,于本实施例系以待测对象的工作电流的平方后再乘以待测对象的阻值以取得该待测对象的消耗功率,使该控制模块12依据所取得的待测对象20的消耗功率再取得与其对应的风扇控制转速,进而驱使该散热单元21依据取得的风扇控制转速进行散热。In step S203, the
相比于现有技术,本发明的温度侦测系统及方法,主要系通过该侦测模块10侦测该待测对象20的工作电流,并将该工作电流转换为数字信号以供电子设备2中的控制模块12判读,再经过消耗功率的运算方式取得该待测对象20的消耗功率,以依据与该消耗功率对应的散热参数来控制该散热单元21的运行。因此,通过本发明的温度侦测系统及方法即可有效排除现有温度感测晶片的设置需考虑待测对象所在位置以及温度侦测处理上电子设备需对应具备可支援该温度感测晶片的传输线的问题;此外,本发明由于依据待测对象实际功率消耗情形来执行散热,故可适时调整风扇运转工作,例如,待测对象所消耗的功率达到高功率时才驱使风扇以全速方式运转,否则,若待测对象停止运行从而未有任何功率消耗,则禁示风扇运转或使该风扇维持在低速运转状态,因此,本发明的温度感测系统及方法亦可有效控制风扇在转速变化时所产生的噪音。Compared with the prior art, the temperature detection system and method of the present invention mainly detects the operating current of the object to be measured 20 through the
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