CN100541757C

CN100541757C - Devices for preventing chip ejectors from colliding

Info

Publication number: CN100541757C
Application number: CNB2006101609031A
Authority: CN
Inventors: 李旻炯; 崔汉铉
Original assignee: Top Engineering Co Ltd
Current assignee: Jin Dongxian
Priority date: 2006-04-10
Filing date: 2006-12-01
Publication date: 2009-09-16
Anticipated expiration: 2026-12-01
Also published as: KR100696986B1; JP2007281418A; JP5000996B2; TW200739753A; CN101034680A; TWI320210B

Abstract

An apparatus for preventing collision of a chip ejector in a wafer stage, comprising: a wafer stage in which a wafer having a chip thereon can be mounted; a stage drive assembly for driving the wafer stage; an ejector positioned in the wafer stage, for supporting the chips arranged on the wafer ring frame when the chips are picked up; and a stop unit provided in the wafer stage for stopping the driving of the stage driving assembly when contacting the ejector. A collision between the wafer stage and the ejector is prevented when the wafer stage moves to a position out of a predetermined range due to occurrence of a software error or a data input error. Therefore, each component including the wafer stage and the ejector is prevented from being damaged, thus enhancing the reliability of the apparatus.

Description

Be used to prevent the equipment of chip ejector

Technical field

The present invention relates to a kind of equipment that is used to prevent chip ejector, more particularly, the present invention relates to a kind of like this equipment that is used to prevent chip ejector, described equipment can be because software error or data entry error prevent that chip displacer and wafer ring framework platform from colliding when causing wafer ring framework platform to move to position beyond the preset range.

Background technology

Liquid crystal display (LCD) device is equipped with a plurality of drive circuits at its LCD panel place.Drive circuit is carried out function as driver chip with being connected to a plurality of conductor terminals of driver chip.

With reference to Fig. 1 the method for making drive circuit is described below.

At first, driver chip 3 is bonded in respectively on the metal pattern (metal pattern) 2 of band T by bonder, band T has the metal pattern 2 that is arranged on the dielectric film 1.Metal pattern 2 constitutes aforementioned a plurality of conductor terminals.

As shown in Figure 2, cutting (singulation) (for example carrying out by cutting from wafer) driver chip 3 afterwards is arranged on the diaphragm that is installed among the ring-type wafer ring framework W.The wafer ring framework W that is furnished with driver chip 3 on it is supplied to wafer ring framework feeding unit 50.

Fig. 3 is the front view that schematically shows the chip adhesive device of the conventional art that can advantageously be suitable for according to the present invention.

As shown in Figure 3, having a plurality of band T that are arranged in the metal pattern on the dielectric film and are wound on the spool 10 is unfolded from spool 10.Afterwards, band loader 20 is feed shelf T continuously, and band T moves to binding head 40 along tape guiding piece 30.The wafer ring framework W that is furnished with driver chip 3 on it is supplied to wafer ring framework feeding unit 50.Afterwards, thus the chip delivery unit 60 that is placed in wafer ring framework feeding unit 50 sidepieces picks up the driver chip 3 that is arranged on the wafer ring framework W makes them move to binding head 40.

Then, thus the driver chip 3 that binding head 40 picks up by chip delivery unit 60 supply is adhered to them on the metal pattern that is arranged on the band T.Here, by heating and pressure operation driver chip is adhered on the metal pattern.Lower tool 70 (or adhesive platform) is positioned in the downside of band T, thus supporting driver chip and binding head 40.

When repeating above-mentioned processing procedure, the driver chip that is arranged on the wafer ring framework is bonded to respectively on the metal pattern that is arranged on the band T.Bonding band T thereon is wound on the other spool 11 with driver chip.

As shown in Fig. 4,5 and 6, wafer ring framework feeding unit 50 comprises: a pair of X-axis linear electric machine (LM) guide rail 51 that is installed in underframe 80 places; Be connected in first base plate 52 of X-axis LM guide rail 51 movably; The first driver element M1 that base plate 52 linearities of winning are moved back and forth; Be connected in a pair of Y-axis LM guide rail 53 of first base plate 52 in mode perpendicular to X-axis LM guide rail 51; Be connected in second base plate 54 of Y-axis LM guide rail 53 movably; Be used to the second driver element M2 that makes that second base plate, 54 linearities move back and forth; Be connected in the platform guide 55 of second base plate 54; Be arranged in the wafer station 56 in the platform guide 55 rotationally, the wafer ring framework W that is used for being furnished with driver chip on it remains in wafer station 56; Be installed in the rotating drive unit M3 at second base plate, 54 places, be used to make wafer station 56 to rotate; Be arranged in the wafer expanded ring 57 that can vertically move in the wafer station 56, be used for making that by the diaphragm that promotes wafer ring framework W inside being installed on the cut crystal that is loaded with on the wafer ring framework W of wafer station 56 expands; Be used to make the ring driver element M4 that wafer expanded ring 57 vertically moves; And be fixedly connected to underframe 80 so that be positioned in the displacer E of wafer expanded ring 57 inside, be used for the chip that carries from following supporting wafers ring framework W, so that chip delivery unit 60 can pick up the driver chip that is arranged on the wafer ring framework W.Displacer E comprise have certain altitude and arrange the dome 58 that can vertically move and be used to the driver elements 59 that make that dome 58 vertically moves.

The operation of wafer feeding unit will be described below.

At first, by wafer ring framework delivery unit (not shown) wafer ring framework W is installed in the wafer station 56.Then, the wafer station 56 that makes wafer ring framework W be installed on wherein by the first driver element M1 and the second driver element M2 moves along X-axis LM guide rail 51 and Y-axis LM guide rail 53, thereby sets the precalculated position.Thereby rotating drive unit M3 makes wafer station 56 rotate wafer ring framework W is turned to the precalculated position.

Ring driver element M4 makes wafer expanded ring 57 move up.Then, as shown in Figure 7, push away on the wafer expanded ring 57 and be installed in the inner diaphragm of wafer ring framework W (wafer ring framework W is installed in the wafer station 56), so that the diced chip that is loaded with on the diaphragm on wafer ring framework W expansion (that is spread apart) thus widen spacing between the driver chip that is arranged on the wafer ring framework W.

Then, chip delivery unit 60 picks up the driver chip that is arranged on the wafer ring framework W.Here, thereby the lower surface that is positioned at the diaphragm on the dome 58 contact wafer ring framework W of the displacer in the wafer station 56 supports chip adhered thereto, therefore driver chip can be separated with diaphragm in the wafer ring framework W.

Thereby chip delivery unit 60 pickup actuator chips send it to binding head 40.In order to make chip delivery unit 60 pick up ensuing driver chip, make wafer ring framework W move.The position of the dome 58 of displacer E is fixed.

Yet the wafer feeding unit of correlation technique has following problem, describes described problem with reference to Fig. 8.When software error or data entry error took place, the wafer expanded ring 57 of wafer station 56 may bump against with the dome 58 of displacer.Therefore, the parts that comprise the dome 58 of wafer station 56 and displacer may damage.

Summary of the invention

Therefore, the purpose of this invention is to provide a kind of equipment that is used to prevent chip ejector, described equipment can be because software error or data entry error prevent chip displacer and wafer station when causing wafer station to move to position beyond the preset range collides.

In order to realize these and other advantage and according to purpose of the present invention (as comprising in the literary composition and broadly describing), the equipment that provides a kind of displacer that is used for preventing wafer station to bump, in this wafer station, the wafer ring framework that has chip on it can be installed, and the platform driven unit is used to drive wafer station, and the displacer that is placed in the wafer station is used for the described chip of support arrangement on wafer when chip is picked, in a single day described equipment comprises the stop element that is placed in the wafer station, is used for stopping when contacting displacer the operation of platform driven unit.

Aforementioned and other purpose, feature and advantage of the present invention can become apparent from the detailed description of the present invention that provides below in conjunction with accompanying drawing.

Description of drawings

Accompanying drawing shows embodiment of the present invention and is used from explanation principle of the present invention with described description one, wherein the accompanying drawing that is comprised is used to provide for further understanding of the present invention, and described accompanying drawing is included in this specification and constitutes the part of specification.

In the accompanying drawing:

Fig. 1 shows the plane graph of the band that is bonded with driver chip on it;

Fig. 2 shows the plane graph that driver chip is arranged wafer ring framework thereon;

Fig. 3 is the front view that schematically shows the chip adhesive device of the conventional art applicatory according to the present invention;

Fig. 4 shows the perspective view according to the wafer feeding unit of the chip adhesive device of conventional art;

Fig. 5 shows the plane graph according to the wafer feeding unit of the chip adhesive device of conventional art;

Fig. 6 shows the front view according to the wafer feeding unit of the chip adhesive device of conventional art;

Fig. 7 shows the section front view according to the mode of operation of the wafer feeding unit of the chip adhesive device of conventional art;

Fig. 8 shows the plane graph according to the collision status between the displacer of the wafer feeding unit of the wafer station of conventional art and chip adhesive device;

Fig. 9 shows the plane graph of the wafer feeding unit of chip adhesive device, and this chip adhesive device has the equipment of collision that is used to prevent its chip displacer according to first embodiment of the invention;

Figure 10 shows the plane graph of equipment of collision that is used to prevent the chip displacer according to first embodiment of the invention;

Figure 11 shows the perspective view of equipment of collision that is used to prevent the chip displacer according to first embodiment of the invention;

Figure 12 shows the plane graph of stop element of equipment of collision that is used to prevent the chip displacer according to second embodiment of the invention; And

Figure 13 and 14 shows the plane graph of mode of operation of equipment of collision that is used to prevent the chip displacer according to second embodiment of the invention.

Embodiment

To be elaborated the example shown in the drawings below to the preferred embodiment of the invention.

Hereinafter, the equipment that is used to prevent the collision of chip displacer according to of the present invention is described with reference to the accompanying drawings.

Fig. 9 shows the plane graph of the wafer feeding unit of chip adhesive device, and described chip adhesive device has the equipment of collision that is used to prevent its chip displacer according to first embodiment of the invention.

The equipment that is used to prevent the collision of chip displacer comprises: wafer station 200, wafer ring framework W can be installed in this wafer station, and have driver chip on the wafer ring framework; The platform driven unit is used to drive wafer station 200; Displacer 300 is placed in the wafer station 200, be used for driver chip on being arranged in wafer ring framework W when picked from the described chip of following support; And stop element 400, be arranged in the wafer station, be used for when contacting, stopping the driving of platform driven unit with displacer 300.

The platform driven unit not only makes wafer station 200 move along X-direction and Y direction, but also makes wafer station 200 rotate.The platform driven unit comprises: X-axis linear electric machine (LM) guide rail 510 that is installed in underframe 80 places of chip adhesive device; Be connected in first base plate 520 of X-axis LM guide rail 510 movably; Be used to make the first driver element M5 that base plate 520 linearities move back and forth that wins; Be connected in the Y-axis LM guide rail 530 of first base plate 520 in mode perpendicular to X-axis LM guide rail 510; Be connected in second base plate 540 of Y-axis LM guide rail 530 movably; And be used to the second driver element M6 that makes that second base plate, 540 linearities move back and forth.

Platform guide 550 is connected in second base plate 540, and wafer station 200 is installed in rotation on the platform guide 550.Rotating drive unit M7 is installed on second base plate 540, is used to make wafer station 200 to rotate.

Wafer expanded ring 600 with certain altitude and cylinder form is installed in the wafer station 200 so that it can vertically move.Internal voids with cylindrical volume is provided in wafer station 200, and wafer expanded ring 600 is placed in the internal voids of wafer station 200.The ring driver element M8 that is used to make wafer expanded ring 600 vertically move is located at second base plate 540.

Displacer 300 is fixedly connected to underframe 80 so that be disposed in the inside of wafer expanded ring 600, that is, be disposed in the internal voids of wafer station 200.

Displacer 300 comprises the main body 310 that has definite shape and be fixed in underframe 80, be installed in main body 310 sentences and is convenient to vertically dome 320 movably and is used to the driver elements 330 that make that dome 320 vertically moves.Dome 320 has certain altitude, and vertically is provided with.

As shown in Figure 10, stop element 400 comprises: many it is installed on the wafer station 200 in the mode that has certain intervals therebetween to first and

second terminals

410 and 420, and be electrically connected such as suitable devices such as microcomputer (not shown); And the corresponding a plurality of switch member 430 that are projected into (displacer 300 is arranged in described internal voids) in the internal voids of wafer station 200, be used in case the first terminal 410 and second terminal 420 are interconnected when contacting displacer 300.When the first terminal 410 and second terminal 420 interconnect,, microcomputer stops driver element thereby detecting this contact under switch member 430 and situation that displacer E contacts.

The more preferred embodiment of stop element 400 will be described below.A plurality of the first terminals 410, second terminal 420 and switch member 430 are disposed in the internal voids place of wafer station 200 along the inner circumferential surface of wafer station 200 in the mode that has certain intervals therebetween.

Preferably, switch member 430 is the leaf springs with certain-length and curved shape.The sweep of each switch member 430 is arranged to be projected in the internal voids in the wafer station 200.

One end of each switch member 430 all is fixedly connected to a corresponding the first terminal 410, and its other end is oriented to have certain interval with the grounded part 421 of corresponding each second terminal 420.When the dome 320 of displacer 300 was pressed on the switch member 430, the other end of switch member 430 was connected with second terminal 420.

As shown in Figure 11, switch member 430 is preferably outstanding from the inner circumferential surface of the wafer expanded ring 600 of the internal voids that is placed in wafer station 200.More specifically, a plurality of groove (through slot) 610 with certain size are formed in the wall of the wafer expanded ring 600 that along the circumferential direction extends in the mode that has certain intervals therebetween.In addition, corresponding with a plurality of groove 610, a plurality of installation portions are arranged on the inwall place of the internal voids of wafer station 200.Each the first terminal 410 and second terminal 420 are installed in the installation portion place of wafer station 200.One end of each switch member 430 all is connected in corresponding the first terminal 410, and its other end is arranged in second terminal, 420 places, so that the sweep of switch member 430 can be inwardly outstanding from the inner circumferential surface of wafer expanded ring 600.Switch member 430 is given prominence to so that its sweep can be placed in the inside of wafer expanded ring 600 from the inner circumferential surface of wafer expanded ring 600.Groove 610 in the wafer expanded ring 600 need have enough big size, moves with the vertical of wafer expanded ring 600 that allows wherein to have switch member 430.

When the other end of switch member 430 was connected with second terminal 420, switch member 430 interconnected the first terminal 410 and second terminal 420.Therefore, switch member 430 starts the signal transmission for microcomputer, and this signal has been passed on the dome 320 of displacer 300 and the contact condition between the switch member 430.According to this signal, microcomputer stops the platform driven unit.

Below with reference to Figure 12 description stop element according to another embodiment of the invention.As shown in Figure 12, stop element comprises: have the sensor main body 710 of certain interval with the external peripheral surface of displacer dome 320, be used to allow displacer dome 320 to be inserted in wherein; Elastic supporting member for supporting optical member 720 flexibly supports sensor main body 710; A plurality of first and

second terminals

730 and 740 are installed in the inner circumferential surface place of sensor main body 710 in the mode that has certain intervals therebetween, and are electrically connected with the device (such as microcomputer) that is fit to; And a plurality of switch member 750 that are located at sensor main body 710 places, be used for when putting on sensor main body 710 owing to external force and make the dome 320 of switch member 750 contact displacers 300, the first terminal 730 and second terminal 740 being interconnected.

Sensor main body 710 forms the cylinder form with certain thickness and height, and is positioned in the wafer expanded ring 600.

Elastic supporting member for supporting optical member 720 is carried out function as the elastomer with certain-length, and supports sensor main body 710 by connecting sensor main body 710 and displacer main body 310.

A pair of first and

second terminals

730 and 740 are to be arranged in the sensor main body 710 first and

second terminals

730 and 740 modes with certain interval with another.Preferably, on sensor main body 710, provide four pairs first and

second terminals

730 and 740.

Switch member 750 is carried out as the leaf spring with curved shape.One end of each leaf spring is fixed in corresponding the first terminal 730, and the grounded part of its other end and corresponding second terminal 740 certain interval of being separated by, so that leaf spring can be outstanding from the inner circumferential surface of sensor main body 710.A switch member 750 is arranged in every pair first and

second terminal

730 and 740 places.Preferably, under the situation that does not contact displacer dome 320, four switch member 750 are set in the mode that has certain intervals therebetween.When push switch spare 750, its other end is connected with second terminal 740.

When the other end of switch member 750 was connected with second terminal 740, switch member 750 interconnected the first terminal 730 and second terminal 740.Thereby switch member 750 is informed the dome 320 of displacer 300 and the signal of the contact condition between the switch member 750 to the microcomputer transmission.According to this signal, microcomputer stops the platform driven unit.

Below the equipment that is used to prevent chip ejector in accordance with another embodiment of the present invention will be described.

Displacer is arranged in the wafer expanded ring that is arranged in wafer station, and a plurality of switch member of a plurality of rubber-like are arranged on the inner circumferential surface of wafer expanded ring.When because wafer station moves when making that displacer contacts with transducer, stop the driving of wafer station.

Hereinafter, will the operation that be used to prevent the equipment of chip ejector according to of the present invention be described.

At first, by wafer handling unit (not shown) wafer ring framework W is installed in the wafer station 200.Then, make the wafer station 200 that wafer ring framework W wherein is installed move and rotate, thereby be placed on the precalculated position along X-direction and Y direction.

M8 makes wafer expanded ring 600 move up by the ring driver element.Then, wafer expanded ring 600 promotes to be installed in the diaphragm of the wafer ring framework W inside in the wafer station 200, so that expansion sticks to the cut crystal on the diaphragm on the wafer ring framework W, thereby widen interval between the driver chip on the diaphragm that is arranged among the wafer ring framework W.

Afterwards, chip delivery unit 60 (shown in Fig. 2) picks up the driver chip that is arranged on the wafer ring framework W.Here, the lower surface of dome 320 contact wafer ring framework W diaphragms of displacer that is arranged in wafer station 200 is with supporting chip, so driver chip can be separated with the diaphragm among the wafer ring framework W.

Chip delivery unit 60 pickup actuator chips are to send it to binding head 40 (shown in Fig. 2).In order to make chip delivery unit 60 pick up ensuing driver chip, mobile wafer ring framework W.

When because the appearance of software error or data entry error when having caused wafer station 200 to move to position beyond the preset range, prevents the collision between the dome 320 of wafer station 200 and displacer 300 by the operation that is located at the stop element 400 in the wafer station 200.Describe aforesaid operations in detail with reference to Figure 13 below.When the switch member 430 in the wafer expanded ring 600 that is located at wafer station 200 contacted with the dome 320 of displacer 300, it became straight.Therefore, an end of switch member 430 is connected with the grounded part 421 of second terminal 420, and signal is transferred to microcomputer.According to this signal,, microcomputer stops wafer station 200 thereby stopping the platform driven unit.Therefore, prevent collision between wafer station 200 and the displacer dome 320.

Can prevent collision between wafer station 200 and the displacer 300 by the current moving direction of wafer station 200 being changed into another direction.Therefore even when the dome contact-making switch spare 430 of displacer 300, also can prevent displacer 300 damages because the switch member 430 of stop element is carried out as leaf spring.

With reference to Figure 14 another embodiment of stop element is described below.When wafer expanded ring 600 when contacting with sensor main body 710 near the dome 320 of displacer 300, sensor main body 710 is promoted by elastic supporting member for supporting optical member 720 with supported state.Therefore, thus from the outstanding switch member 750 of sensor main body 710 inner circumferential surfaces contact with displacer dome 320 become straight.

Then, an end of switch member 750 is connected with the grounded part 741 of second terminal 740, and signal is transferred to microcomputer.According to this signal,, microcomputer stops wafer station 200 thereby stopping the platform driven unit.Therefore, prevent collision between wafer station 200 and the displacer dome 320.In the present invention, on every pair first and

second terminal

730 and 740, provide a switch member 750,, according to which switch member 750 contact so, can detect the moving direction of wafer station 200 with displacer dome 320 if four switch member 750 are provided.

The equipment that is used to prevent ejector according to the present invention not only can be used for the chip adhesive device but also can be used for picking up all types of devices of the driver chip of wafer.

As previously described, when because the appearance of software error or data entry error when causing wafer station to move to position beyond the preset range, has prevented the collision between wafer station and the displacer.Therefore, each parts that has prevented to comprise wafer station and displacer are impaired, therefore strengthened the reliability of equipment.

Owing under the situation that does not deviate from spirit of the present invention or essential characteristic, can embody the present invention in a variety of forms; but it should also be understood that; unless specialize; above-mentioned embodiment is not limited to aforesaid any details; but should think broadly that it is included in spirit defined in the appended claims and the protection range, therefore drop on the claim scope or be equal to that institute in the described scope changes and correction is included in the claims.

Claims

1. An apparatus for preventing collisions of chip ejectors, said apparatus being located in a wafer stage in which a wafer ring frame with chips thereon is mountable on a stage drive assembly for driving said wafer stage, And the ejector disposed in the wafer stage is used to support the chip arranged on the wafer ring frame when the chip is picked up, the apparatus comprising:

A stop unit is provided in the wafer stage for stopping the operation of the stage driving assembly upon contacting the ejector.

2. The apparatus according to claim 1, wherein the stopping unit comprises:

the first terminal and the second terminal are mounted on the wafer stage with a certain distance therebetween, and are electrically connected to the microcomputer; and

A switching member protrudes into the interior space of the wafer stage in which the ejector is located for interconnecting the first terminal and the second terminal when contacting the ejector.

3. The apparatus of claim 2, wherein a plurality of the first and second terminals and switching members are arranged with a certain space therebetween along an inner wall of the inner void of the wafer stage.

4. The device according to claim 2, wherein the switching member is implemented as a leaf spring having a curved shape, one end of which is fixedly connected to the first terminal and the other end thereof is connected to the The ground portion of the second terminal is separated by a certain gap, and the other end of the leaf spring is connected to the second terminal when the leaf spring is pressed.

5. The apparatus of claim 1, wherein the stopper unit protrudes from an inner circumferential surface of a wafer expansion ring located in the wafer stage for expanding the wafer on the ring frame.

6. The apparatus according to claim 1, wherein the stopping unit comprises:

a sensor body having a gap from the outer circumferential surface of the dome of the ejector for allowing the dome of the ejector to be inserted therein;

an elastic support for elastically supporting the sensor body;

a plurality of first and second terminals mounted at an inner circumferential surface of the sensor main body with a certain interval therebetween, and electrically connected to the microcomputer; and

a plurality of switching elements provided on the sensor body for interconnecting the first terminal and the second terminal when the switching elements contact the ejector due to external force applied to the sensor body .

7. The device according to claim 6, wherein each of said switch members is implemented as a leaf spring having a curved shape, one end of said leaf spring is fixedly connected to the corresponding said first terminal, and its The other end is separated from the ground portion of the corresponding second terminal by a certain gap, and the other end of the leaf spring is connected to the second terminal when the leaf spring is pressed.

8. The apparatus according to claim 7, wherein four of the switching member, the first terminal and the second terminal are respectively provided.

9. The apparatus of claim 1, wherein the stopper unit protrudes from the wafer stage and passes through a through-slot formed in a wall of a wafer extension ring, the wafer extension ring being located inside the wafer stage gap and expand the wafer on the wafer ring frame.