CN100541845C - Light emitting device and lighting device - Google Patents

Abstract

An object of the present invention is to provide a light-emitting device capable of achieving higher power and higher output device characteristics than conventional devices, a manufacturing method thereof, and a highly reliable lighting device with improved heat dissipation. The light-emitting device of the present invention is characterized in that it includes a ceramic member 1, a light-emitting element 2, a translucent member 4, and a metal member 5, and the ceramic member 1 and the translucent member 4 are bonded to each other with an adhesive. The metal member 5, the adhesive is a hot-melt material 6 that is configured to exhibit flexibility in a cured bonded state, and the ceramic member 1 has pores h at least on the surface portion of the power supply bonding area, and the hot-melt material 6 is immersed in the pores h.

Description

Light emitting device and lighting device

technical field

The present invention relates to a light-emitting device such as a light-emitting diode or a laser diode, and a method for manufacturing the same, for example, to a light-emitting device configured as a light-emitting diode provided with a high-power, high-output light-emitting element and having excellent heat dissipation, and a method for manufacturing the same , and also relates to a lighting device constructed using the light emitting device.

Background technique

Representative examples of the light emitting device include electronic devices such as light emitting diodes and laser diodes. Among them, in light emitting diodes (hereinafter also referred to as LEDs), light is emitted from the light emitting elements by providing a light emitting element and supplying predetermined power to the light emitting element. At this time, the light emitting element generates heat along with the light emission, thereby increasing the temperature of the LED.

In recent years, with the practical use of blue LEDs and white LEDs, more and more LEDs are used in the display of indicator lights of electrical products or liquid crystal backlights of mobile phones. Furthermore, with the high luminous efficiency And the improvement of brightness is expected to be widely used in indoor lighting, automotive lighting, signal lighting, etc. In the case of using it for lighting in this way, higher output LEDs are required in the future, and at this time, higher power is supplied to the light-emitting element, and the temperature of the LEDs increases accordingly.

In light-emitting devices such as such high-power, high-output LEDs, a packaging ceramic member made of ceramics is sometimes used as a packaging member that can withstand the above-mentioned temperature rise.

In a light-emitting device including such a ceramic member for packaging, for example, a metal member for heat dissipation made of metal is provided on the ceramic member for packaging in order to suppress the temperature of semiconductor elements such as light-emitting elements below a predetermined guaranteed operating temperature. Heat conduction quickly moves heat from the semiconductor element from the ceramic member to the metal member, and at the same time disperses it with the metal member, thereby efficiently dissipating heat from the surface of the metal member to the heat dissipation portion.

In a light emitting device including such a metal member for heat dissipation and a ceramic member for packaging, the metal member and the ceramic member are usually bonded to each other with an adhesive. Conventionally, such soldering has been performed by using generally used solder materials such as silver (Ag), gold (Au), copper (Cu), Zn (zinc), and Cd (cadmium) as such adhesives. Bonding of metal components to ceramic components.

However, in the above-mentioned light-emitting device including the metal member for heat dissipation and the ceramic member for packaging, and the metal member and the ceramic member are bonded to each other by welding, if there is a difference in the linear expansion coefficients of the metal member and the ceramic member, then correspondingly Stress accompanying temperature rise occurs in metal members and ceramic members, and warping, breakage (cracks) of ceramic members, and the like are likely to occur. In order to avoid this problem, conventionally, materials having similar coefficients of linear expansion have been used as ceramic materials and metal materials for bonding ceramic members and metal members.

Aluminum nitride (AlN), aluminum oxide (Al ₂ O ₃ ), etc. are generally used as the above-mentioned ceramic material, and copper-tungsten composite material (CuW), copper-molybdenum composite material (CuMo, CuMoCu) etc. The coefficients of linear expansion of the respective materials are shown below.

Ceramic material AlN 4.5×10 ^-6

Al ₂ O ₃ 6.7×10 ^-6

Metal material CuW 6.5×10 ^-6 (W-10: 89W, 11Cu)

CuMo 7.0×10 ^-6 (CM-15: 85Mo, 15Cu)

CuMoCu 8.9×10 ^-6 (CMC111)

In addition, the above-mentioned CuMoCu (CMC111) is a material obtained by sandwiching a Mo plate between two Cu plates and press-bonding, and the three-layer ratio is set to be Cu:Mo:Cu=1:1:1.

However, the thermal conductivity of metal materials such as CuW, CuMo, and CuMoCu mentioned above is relatively poor compared to the thermal conductivity of metal materials with relatively good thermal conductivity (typically Cu (393W/mk)), that is, CuW (180W/mk), CuMo (160W/mk), CuMoCu (232W/mk). Therefore, in light-emitting devices such as LEDs with high power and high output compared with conventional devices used for lighting, it is desirable to use a metal material with relatively good thermal conductivity such as Cu as a metal member for heat dissipation. However, the linear expansion coefficient of metallic materials such as Cu (the coefficient of linear expansion is 17.0×10 ^-6 ) is relatively different from that of ceramic materials, and the above-mentioned problems are likely to occur due to the accompanying metal components and ceramic components. Problems such as warping due to stress caused by temperature rise, and breakage (cracks) of ceramic components.

On the other hand, high-power, high-output LEDs have the following requirements. That is, in LEDs, it is generally difficult to utilize the light emitted from the side of the light emitting element, and accordingly it is difficult to efficiently emit light. For example, when a ceramic member is used as the packaging member, the light emitted from the side of the light emitting element is reflected by the ceramic member and emitted to the outside, so the light cannot be used efficiently accordingly. In addition, for example, in the case of using LEDs for lighting, etc., if the light from the light emitting element is condensed by a lens or the like, the light will be unevenly concentrated due to the reflected light reflected by the ceramic member from the side of the light emitting element. . In the past, a plurality of LEDs were installed as a plurality of light sources to reduce the influence of the uneven concentration of light. However, LEDs that have higher power and higher output than conventional devices can be used as a single light source. Therefore, in LEDs having higher power and higher output than conventional devices, it is particularly required to efficiently utilize light emitted from the side of the light emitting element with less unevenness in light concentration.

In addition, in the illuminating device using the above-mentioned conventional light-emitting devices such as LEDs, electrical connection and fixation to the light-emitting devices are performed by methods such as soldering or clamping of lead frames. Therefore, since the soldered part or the lead frame of the lighting device using the light emitting device dissipates heat from the light emitting device to the external wiring board, there is a limit in the amount of heat transfer, and sufficient heat dissipation cannot be ensured. Therefore, a large current cannot be injected into the lighting device, and a high-brightness lighting device cannot be produced.

In addition, once an existing light-emitting device is incorporated into a part of the lighting device by soldering or clamping with an external wiring board, it is difficult to remove only the part of the light-emitting device for repair.

Furthermore, the light-emitting device of the existing lighting device, which is formed by soldering or clamping a part of the conductive pattern provided on the main surface of the light-emitting device and an external wiring substrate, is susceptible to vibration caused by mechanical vibration from the outside. adverse effects. That is, if clamping is performed, changes in optical characteristics due to rotation of the light emitting device in the lighting device are likely to occur, and if soldering is performed, poor electrical connection between the light emitting device and an external circuit board is likely to occur.

Contents of the invention

The present invention was made to solve the above problems, and its first object is to provide the following light-emitting device and its manufacturing method. The light-emitting device of the present invention includes a metal member for heat dissipation made of metal and a ceramic member for packaging made of ceramics. The above-mentioned metal member and the above-mentioned ceramic member are bonded to each other with an adhesive, and the warpage caused by the stress accompanying the temperature rise of the above-mentioned metal member and the above-mentioned ceramic member, and the damage (crack) of the above-mentioned ceramic member can be suppressed. The occurrence of problems caused by the difference in the linear expansion coefficient of the metal member and the above-mentioned ceramic member when the temperature changes, therefore, a metal material with a relatively good thermal conductivity can be used as the material of the above-mentioned metal member, and a higher temperature than the existing device can be realized. Power, high output device characteristics.

In addition, a second object of the present invention is to provide a light-emitting device that includes a metal member for heat dissipation made of metal and a ceramic member for packaging made of ceramics, wherein the metal members are bonded to each other with an adhesive. When the above-mentioned ceramic member is configured as a light-emitting diode provided with a light-emitting element, for example, light emitted from the side of the light-emitting element can be efficiently used with less unevenness in light concentration.

Furthermore, a third object of the present invention is to provide an illuminating device with improved heat dissipation and high reliability, which can replace existing light bulbs, fluorescent lamps, and the like.

The inventors of the present invention have found the following when they have repeatedly studied intensively in order to achieve the above-mentioned first object. That is, in a light-emitting device in which a metal member for heat dissipation made of metal and a ceramic member for packaging made of ceramics are bonded to each other with an adhesive, the metal member and the above-mentioned metal member are bonded together by welding using a solder material as the adhesive. In the case of adhesion of ceramic members, the welding material has poor buffering properties of the stress accompanying the temperature rise of the metal member and the ceramic member, thus easily causing warping, breakage (crack) of the ceramic member, etc. due to the above-mentioned Problems caused by temperature changes due to differences in linear expansion coefficients between metal members and the above-mentioned ceramic members. Therefore, if the above-mentioned metal member and the above-mentioned ceramic member are bonded using a hot-melt material configured to exhibit flexibility in a cured and bonded state as the above-mentioned adhesive, the hot-melt material will relax the accompanying pressure between the above-mentioned metal member and the above-mentioned ceramic member. The stress caused by the temperature rise of the ceramic member can suppress the occurrence of problems caused by temperature changes such as warpage and breakage (cracks) of the ceramic member due to the difference in linear expansion coefficient between the metal member and the ceramic member.

In addition, the present inventors obtained the following findings during the course of the above-mentioned studies. That is, among ceramic materials, some have pores from the viewpoint of brittleness, workability, and the like. If the pores are used to impregnate the above-mentioned hot-melt material into the pores on the surface of the above-mentioned ceramic member, and the hot-melt material is incorporated into the pores, the adhesive force between the ceramic member and the hot-melt material is improved, thereby Even if the thickness of the above-mentioned hot-melt material in the bonded state is relatively thin, the adhesiveness can be maintained well, and the thermal conductivity of the above-mentioned hot-melt material is correspondingly improved.

The present invention is based on such knowledge, and in order to achieve the above-mentioned first object, the following light-emitting device and a method for manufacturing the light-emitting device are provided.

(1) Light emitting devices

A light-emitting device comprising a metal member for heat dissipation made of metal and a ceramic member for packaging made of ceramics, wherein the metal member and the ceramic member are bonded to each other with an adhesive, wherein the adhesive is A hot-melt material that exhibits flexibility in a solidified and bonded state while heating and melting at a melting temperature higher than a predetermined temperature, the above-mentioned ceramic member has pores at least in a surface portion of a predetermined bonding region, and simultaneously The aforementioned hot-melt material is impregnated in the pores.

(2) Manufacturing method of light-emitting device

A method of manufacturing a light emitting device comprising a metal member for heat dissipation made of metal and a ceramic member for packaging made of ceramics, wherein the metal member and the ceramic member are bonded to each other with an adhesive, characterized in that: It includes the step of dissolving in water or a water-soluble organic solvent and dissolving a resin material that exhibits flexibility in a cured and bonded state while being heated and melted at a melting temperature higher than a predetermined temperature in the water or the water-soluble organic solvent. The process of making a hot-melt material in a non-toxic organic solvent as the adhesive agent; using a ceramic member having pores at least on the surface of the predetermined bonding area as the ceramic member, and the above-mentioned adhesive on the ceramic member Coating the hot-melt material produced in the above-mentioned adhesive preparation process on the surface portion of the bonding area, and impregnating the hot-melt material in the pores in the surface portion of the bonding area of the ceramic member under a predetermined vacuum state The adhesive coating and dipping step in the above-mentioned adhesive agent coating and dipping step; and between the above-mentioned ceramic member coated and impregnated with the above-mentioned hot-melt material in the above-mentioned adhesive agent coating and dipping step and the above-mentioned metal member by welding at a bonding temperature above the melting temperature A ceramic-metal bonding process in which the hot-melt material is used to bond the ceramic member and the metal member to each other.

According to the light-emitting device of the present invention, since the adhesive for bonding the above-mentioned metal member and the above-mentioned ceramic member is a hot-melt material that exhibits flexibility in a cured and bonded state, the hot-melt material can alleviate the above-mentioned problems. The stress of the temperature rise of the metal member and the above-mentioned ceramic member can be suppressed, thereby suppressing the temperature change caused by the difference in the linear expansion coefficient of the above-mentioned metal member and the above-mentioned ceramic member, such as warping and breakage (cracks) of the above-mentioned ceramic member. Therefore, a metal material (typically copper (Cu)) with relatively good thermal conductivity can be used as the material of the above-mentioned metal member, and a device with high power and high output can be realized compared with the existing device characteristics. characteristic. In addition, since the above-mentioned hot-melt material is impregnated into the pores in the surface portion of the above-mentioned bonding region of the above-mentioned ceramic member, the above-mentioned hot-melt material can be bonded into the above-mentioned pores, thereby, the thermal bonding of the ceramic member can be improved. Adhesion of molten materials. Therefore, even if the thickness of the hot-melt material in the bonded state is relatively thin, good adhesiveness can be maintained, and the thermal conductivity of the hot-melt material can be improved accordingly.

In the method of manufacturing a light-emitting device according to the present invention, the hot-melt material prepared as the adhesive is applied to the surface portion of the bonding region of the ceramic member, and is heated in the predetermined vacuum state. impregnated into pores in the surface portion of the above-mentioned bonding region of the above-mentioned ceramic member. Since the hot-melt material is a hot-melt material in which the above-mentioned resin material is dissolved in the above-mentioned water or the above-mentioned water-soluble organic solvent, it has low viscosity at room temperature (for example, 25° C.) and can be uniformly impregnated in the pores. The pressure of the vacuum atmosphere in the vacuum state is, for example, about 1 kPa or less. Thereafter, the above-mentioned hot-melt material is activated by heating and melting between the above-mentioned ceramic member and the above-mentioned metal member coated with and impregnated with the above-mentioned hot-melt material at a bonding temperature equal to or higher than the above-mentioned melting temperature, thereby bonding the above-mentioned ceramics to each other. Components and the aforementioned metal components. In this way, by vacuum-impregnating the above-mentioned hot-melt material into the pores in the surface portion of the above-mentioned bonding region of the above-mentioned ceramic member, the hot-melt material and the pores can be well bonded. In this way, the above-mentioned light-emitting device related to the present invention can be manufactured.

In this way, since the above-mentioned light-emitting device according to the present invention is manufactured according to the method for manufacturing a light-emitting device according to the present invention, it is possible to suppress warping of the above-mentioned metal member and the stress caused by the temperature rise of the above-mentioned ceramic member, and the above-mentioned ceramic member. The occurrence of problems such as breakage (cracks) due to the temperature change caused by the difference in the linear expansion coefficient between the above-mentioned metal member and the above-mentioned ceramic member, therefore, a metal material with relatively good thermal conductivity can be used as the material of the above-mentioned metal member. Compared with existing devices, the device characteristics are high power and high output. In addition, since the above-mentioned hot-melt material is impregnated in the pores in the surface portion of the above-mentioned bonding region of the above-mentioned ceramic member, the above-mentioned hot-melt material can be combined. Into the above-mentioned pores, thereby, the adhesive force between the ceramic member and the hot-melt material can be improved. Therefore, even if the thickness of the hot-melt material in the bonded state is relatively thin, good adhesiveness can be maintained, and a light-emitting device in which the thermal conductivity of the hot-melt material can be improved correspondingly can be provided.

As the material of the metal member, a metal material having relatively good thermal conductivity includes, for example, gold (Au) and silver (Ag) in addition to the above-mentioned Cu (copper). In particular, Cu is good in thermal conductivity, is relatively inexpensive, and can be suitably used because it has good workability compared to composite materials such as CuW, CuMo, and CuMoCu.

The material of the ceramic member is not limited thereto, but examples thereof include aluminum nitride (AlN), aluminum oxide (Al ₂ O ₃ ), and the like. The above-mentioned ceramic member may also be composed of a plurality of ceramic members. At this time, the ceramic members can be bonded to each other with the above hot-melt material. As the above-mentioned ceramic member, from the viewpoint of brittleness, workability, etc., a material in which a ceramic material including pores in the surface portion is integrally formed can be exemplified. As the porosity of the pores in the ceramic member, about 5% to 20% can be exemplified. If the pores are less than about 5%, it becomes difficult to impregnate the pores with the hot-melt material, and if the pores are more than about 20%, the thermal conductivity tends to decrease. The diameter of the pores in the ceramic member is not limited thereto, but about 0.01 mm to 0.15 mm can be exemplified. Furthermore, in the above-mentioned adhesive coating and dipping step of the manufacturing method of the light-emitting device of the present invention, since the above-mentioned resin material is dissolved in the above-mentioned water or the above-mentioned water-soluble organic solvent, it can also be uniformly dipped in, for example, about 0.01 mm ~0.15mm fine pores.

The porosity mentioned here is calculated from the following calculation formula as the open porosity stipulated in JIS R1634 (Measurement method of density and open porosity of fine ceramics, calculation method of open porosity of ceramics) The value is based on a calculation method like Archimedes' method:

Pb=((W3-W1)/(W3-W2))×100

Pb: open porosity (%)

[Here, W1: dry mass (g) (after drying with a thermostat at 110±5°C, leave to cool in a desiccator and measure the mass)

W2: Mass in water (g) (measured in the original state where the water-immersed sample is suspended in water with a wire and corrected for the mass of the jig)

W3: water immersion mass (g) (a water immersion sample was taken out of water, water droplets on the surface were removed with wet gauze, and the mass was measured).

In addition, the pore diameter of the pores is a value calculated by the mercury intrusion method in which mercury is injected into the fine pores, and the volume of the pores is calculated from the intrusion pressure and the volume of the mercury injected. Specifically, the mercury pore size is used. The pore diameter of the pores is calculated using a meter (for example, Auto Aperture Model 9200 manufactured by Shimadzu Corporation, etc.).

In the method of manufacturing a light-emitting device related to the present invention, as the above-mentioned resin material that exhibits flexibility in a cured and bonded state while heating and melting at a melting temperature higher than the above-mentioned predetermined temperature, although not limited thereto, However, thermoplastic elastomers and resin compositions comprising ethylene/vinyl acetate and acrylic acid or methacrylic acid copolymers may be mentioned, for example. In the light-emitting device related to the present invention, as the above-mentioned hot-melt material that is configured to exhibit flexibility in a cured and bonded state while being heated and melted at a melting temperature higher than the above-mentioned predetermined temperature, an elastic modulus of about For the hot-melt material of 0.2×10 ⁸ Pa to 13.0×10 ⁸ Pa, from the point of view of material selection contributing to the elastic coefficient as described later, it can be exemplified that about 0.25×10 Pa is more desirable. ⁸ Pa to 5.0×10 ⁸ Pa hot-melt material, the most ideal is about 1.9×10 ⁸ Pa to 3.3×10 ⁸ Pa hot-melt material. Such hot-melt materials are compatible with existing welding materials such as

Elastic coefficient Pa

Ag 827.7×10 ⁸

Au 780.6×10 ⁸

Cu 1274.9×10 ⁸

Zn 760.0×10 ⁸

Cd 489.4×10 ⁸

In comparison, it is obvious that it is good in softness.

The above-mentioned thermoplastic elastomer is, for example, a material having a molecular structure in which long molecular chains are complexly entangled, such as natural rubber and synthetic rubber, and has a stress relieving agent accompanying the temperature rise of the above-mentioned metal member and the above-mentioned ceramic member. role. As said thermoplastic elastomer, a styrene elastomer, an olefin elastomer, a polyester elastomer, a vinyl chloride elastomer, a polyamide elastomer, etc. are illustrated. Among them, if styrene and olefin thermoplastic elastomers are used, since the coefficient of elasticity of the hot-melt material can be roughly included in the above-mentioned "0.25×10 ⁸ Pa to 5.0×10 ⁸ Pa as a more ideal range", is more ideal.

The above-mentioned copolymer of ethylene/vinyl acetate and acrylic acid or methacrylic acid has an effect of improving the bonding strength between the above-mentioned metal member and the above-mentioned ceramic member.

The aforementioned resin material may also contain polyethylene. As the polyethylene, low-density polyethylene and high-density polyethylene can be used, which have the effect of improving the wettability of the above-mentioned hot-melt material. From the viewpoint of the wettability of the above-mentioned hot-melt material, it is desirable that the above-mentioned resin material contains polyethylene in this manner.

In the above resin composition comprising a thermoplastic elastomer, a copolymer of ethylene/vinyl acetate and acrylic acid or methacrylic acid and polyethylene, at least a thermoplastic elastomer, a copolymer of ethylene/vinyl acetate and acrylic acid or methacrylic acid In this case, as the ratio of each component, for example,

Thermoplastic elastomer: about 20% to 80% by weight

Ethylene/vinyl acetate

Copolymer with acrylic acid or methacrylic acid: about 10% by weight to 60% by weight

Polyethylene: about 0% by weight to 40% by weight

Wherein, the elastic coefficient of the above-mentioned hot-melt material in the cured and bonded state can be adjusted by appropriately formulating at least the composition ratio of the thermoplastic elastomer. For example, if the thermoplastic elastomer is decreased, the modulus of elasticity increases, and if the thermoplastic elastomer is increased, the modulus of elasticity decreases.

In addition, among the aforementioned resin materials, thermosetting resins having good heat resistance, for example, thermosetting resins such as polyimide resins, BT resins, and polysiloxanes, can be appropriately formulated. As a compounding ratio of this thermosetting resin, about 0.01 weight% - 10 weight% is mentioned, for example. Impregnation of such a thermosetting resin into pores in the surface portion of the above-mentioned bonding region of the above-mentioned ceramic member has, for example, an effect of maintaining the bonding strength between the above-mentioned metal member and the above-mentioned ceramic member even at about the above-mentioned predetermined temperature. .

When the above-mentioned resin material is dissolved in the above-mentioned water-soluble organic solvent, the water-soluble organic solvent is not limited thereto, but examples thereof include a mixed solvent of dimethyl ethyl ketone and dimethylformamide, etc. .

In the method of manufacturing a light-emitting device according to the present invention, the thickness of the hot-melt material coated on the ceramic member is, for example, approximately 20 μm to 200 μm. In the light-emitting device according to the present invention, the thickness of the above-mentioned hot-melt material in a cured and adhered state can be, for example, about 0.01 mm to 0.10 mm. If the thickness is smaller than approximately 0.01 mm, the adhesiveness of the hot-melt material is likely to decrease, and if it is greater than approximately 0.10 mm, the thermal conductivity of the hot-melt material is likely to decrease. In addition, the method of manufacturing a light-emitting device according to the present invention may further include an adhesive drying step of applying and drying the ceramic member impregnated with the hot-melt material using the adhesive coating and dipping step.

The light-emitting device according to the present invention may also be configured as a light-emitting diode in which a light-emitting element is provided on the metal member or the ceramic member. In addition, the method of manufacturing a light-emitting device according to the present invention may further include a step of disposing a light-emitting element on the metal member or the ceramic member to manufacture a light-emitting device configured as a light-emitting diode. A light-emitting device configured as a light-emitting diode in this way, for example, uses a metal material with relatively good thermal conductivity such as Cu as the material of the above-mentioned metal member, and can be used as a high-power, high-power device compared with existing devices. The output light-emitting diode can realize higher brightness light-emitting characteristics.

In addition, the light-emitting device related to the present invention (for example, a light-emitting device configured as a light-emitting diode) may further include a light-transmitting member (for example, an optical member made of glass, more specifically, a glass lens). The hot-melt material bonds the above-mentioned ceramic member and the above-mentioned translucent member (for example, the above-mentioned optical member) to each other. In this case, the hot-melt material includes a first hot-melt material bonded to the metal member and the ceramic member, and a second hot-melt material bonded to the translucent member (for example, the optical member) and the ceramic member. For example, considering the case of bonding the above-mentioned light-transmitting member (for example, the above-mentioned optical member) and the above-mentioned ceramic member after bonding the above-mentioned metal member and the above-mentioned ceramic member and setting a semiconductor element (for example, a light-emitting element), it is preferable to combine the above-mentioned The relationship between the melting temperature a of the first hot-melt material and the melting temperature b of the second hot-melt material is a>b. By doing so, even if the above-mentioned translucent member (for example, the above-mentioned optical member) and the above-mentioned ceramic member are bonded by the above-mentioned second hot-melt material after the above-mentioned metal member and the above-mentioned ceramic member are bonded by the above-mentioned first hot-melt material, When the above-mentioned translucent member (for example, the above-mentioned optical member) and the above-mentioned ceramic member are bonded by the above-mentioned second hot-melt material, the above-mentioned first heat that has bonded the above-mentioned metal member and the above-mentioned ceramic member can also be prevented. melting of molten material.

In the method for manufacturing a light-emitting device related to the present invention, the light-emitting device (for example, a light-emitting device configured as a light-emitting diode) may further include a light-transmitting member (for example, an optical member made of glass, more specifically, glass lens) may further include the above-mentioned melting temperature between the above-mentioned ceramic member coated and impregnated with the above-mentioned hot-melt material in the above-mentioned adhesive agent coating and dipping step and the above-mentioned light-transmitting member (for example, the above-mentioned optical member). A ceramic-translucent member bonding step of bonding the ceramic member and the translucent member (for example, the optical member) to each other by fusing the hot-melt material at a bonding temperature.

At this time, for example, after bonding the metal member and the ceramic member and installing a semiconductor element (for example, a light-emitting element), the case where the light-transmitting member (for example, the optical member) and the ceramic member are bonded together is considered. In the adhesive preparation process, dissolve in water or a water-soluble organic solvent and heat and melt at the first and second melting temperatures a and b (a>b) higher than the above-mentioned predetermined temperature while curing and bonding The first and second resin materials showing flexibility in the state are dissolved in the above-mentioned water or the above-mentioned water-soluble organic solvent to make the first and second hot-melt materials respectively as the above-mentioned adhesive agent, and the above-mentioned adhesive agent is coated and impregnated In the process, a ceramic member whose surface portion of the bonding region includes the surface portions of the first and second bonding regions is used as the ceramic member, and the surface portions of the first and second bonding regions of the ceramic member are respectively Coating the above-mentioned first and second hot-melt materials prepared in the above-mentioned adhesive agent preparation step, and simultaneously impregnating the first and second hot-melt materials in the first and second hot-melt materials of the above-mentioned ceramic member respectively under a predetermined vacuum state. 2 In the pores in the surface portion of the bonded region, in the above-mentioned ceramic-metal bonding step, the above-mentioned ceramic member impregnated with the above-mentioned first hot-melt material and the above-mentioned metal member are coated in the above-mentioned adhesive agent coating and dipping step The first hot-melt material is welded at a first bonding temperature above the first melting temperature a to bond the ceramic member and the metal member to each other, and in the ceramic-translucent member bonding step, After the above-mentioned ceramic member and the above-mentioned metal member are bonded by the above-mentioned ceramic-metal bonding process, the above-mentioned ceramic member impregnated with the above-mentioned second hot-melt material and the above-mentioned light-transmitting member are coated in the above-mentioned adhesive coating and dipping process. (For example, the above-mentioned optical members) are fused with the second hot-melt material at a second bonding temperature above the above-mentioned second melting temperature b but below the above-mentioned first melting temperature a to bond the above-mentioned ceramic member and the above-mentioned transparent material to each other. An optical member (for example, the above-mentioned optical member). By doing so, even if the above-mentioned light-transmitting member (for example, the above-mentioned optical member) and the above-mentioned The ceramic member can also prevent the above-mentioned second metal member and the ceramic member from being bonded together when the above-mentioned translucent member (for example, the above-mentioned optical member) and the above-mentioned ceramic member are bonded by the above-mentioned second hot-melt material. 1 Melting of hot melt materials.

As the above-mentioned predetermined temperature, it is desirable that the semiconductor element provided in the light-emitting device (for example, when the light-emitting device is constituted as a light-emitting diode, the light-emitting element) be lower than the guaranteed operation temperature, for example, about 100°C to 150°C. In this case, the above-mentioned melting temperature may be set to be higher than about 100°C to 150°C. Moreover, as the said bonding temperature more than the said melting temperature, about 180 degreeC - 300 degreeC can be illustrated, for example. If the above-mentioned bonding temperature exceeds about 300° C., there is a possibility that the properties of the resin constituting the above-mentioned hot-melt material will be deteriorated. In addition, in the bonding using conventional soldering materials, bonding is generally carried out in a heated state of about 500°C to 800°C. In this regard, since the present invention can be bonded at a sufficiently lower temperature (for example, 180°C to 300°C) than the conventional temperature of about 500°C to 800°C, the production efficiency of light emitting devices can be improved, and accordingly Manufacturing costs are kept low.

In the method of manufacturing a light-emitting device according to the present invention, in the above-mentioned ceramic-metal bonding step, the above-mentioned thermal fusion may be performed between the above-mentioned ceramic member and the above-mentioned metal member at the above-mentioned bonding temperature and under a predetermined pressure. Materials are welded to bond the above-mentioned ceramic member and the above-mentioned metal member to each other. In the case where the surface portion of the above-mentioned bonding region of the above-mentioned ceramic member includes the surface portion of the first bonding region, in the above-mentioned ceramic-metal bonding step, The ceramic member and the metal member are bonded to each other by fusing the first hot-melt material at the first bonding temperature and a predetermined pressure between the ceramic member and the metal member.

In addition, in the ceramic-translucent member bonding step, the heat may be applied between the ceramic member and the translucent member (for example, the optical member) at the bonding temperature and under a predetermined pressure. The melting material is fused to bond the above-mentioned ceramic member and the above-mentioned light-transmitting member (for example, the above-mentioned optical member) to each other. In the ceramic-light-transmitting member bonding step, after the above-mentioned ceramic member and the above-mentioned metal member are bonded in the above-mentioned ceramic-metal bonding step, the above-mentioned second adhesive is applied and impregnated in the above-mentioned adhesive coating and dipping step. The ceramic member of the hot-melt material and the above-mentioned light-transmitting member (for example, the optical member) are welded at the second bonding temperature and under a predetermined pressure by the second hot-melt material to bond the ceramics to each other. A member and the above-mentioned translucent member (for example, the above-mentioned optical member).

The predetermined pressure is not limited thereto, but about 9.8×10 ⁴ Pa to 294.2×10 ⁴ Pa (1 kg/cm ² to 30 kg/cm ² ) can be exemplified.

Here, if you look at the situation where a generally used two-component type or thermosetting adhesive is used as an adhesive to impregnate the pores of the ceramic material in a vacuum manner, the hardening of the adhesive begins during the vacuum impregnation. , so the vacuum impregnation must be carried out in the state where the adhesive is applied to the ceramic material through the adhesive. In the state where the adhesive is applied to the ceramic material in this way, air from the pores of the ceramic material The unevenness of the adhesive layer at the time of detachment, etc., cannot perform vacuum impregnation well, and it is likely to cause a decrease in adhesiveness.

In this regard, in the method of manufacturing a light-emitting device according to the present invention, after the above-mentioned hot-melt material is impregnated in the above-mentioned ceramic member in a vacuum system, when the above-mentioned adhesive agent drying step is included, the above-mentioned ceramic After vacuum impregnating and drying the member, in the case where the above-mentioned metal member (and further the above-mentioned light-transmitting member (for example, the above-mentioned optical member)) is provided, the light-transmitting member (for example, the above-mentioned optical member) is provided, and by heating To the above-mentioned bonding temperature, when the above-mentioned ceramic member and the above-mentioned metal member (and further the above-mentioned light-transmitting member (for example, the above-mentioned optical member)) are provided, it can be carried out with the light-transmitting member (for example, the optical member). bonding.

In the light-emitting device according to the present invention, for example, when it is configured as a light-emitting diode provided with a light-emitting element, in order to achieve the second object above, it is preferable that the light-emitting element is provided from the metal member or the ceramic member 0.5mm to 2mm protrude from the top of the edge of the By doing so, the light emitted from the side of the light-emitting element can be easily emitted to the outside, and accordingly, the light can be efficiently used. In addition, for example, when the above-mentioned light-emitting diode is used for lighting or the like, even if the light from the above-mentioned light-emitting element is condensed by a lens or the like, the reflected light reflected by the above-mentioned ceramic member from the side of the above-mentioned light-emitting element can be sufficiently suppressed. , and accordingly the occurrence of uneven light concentration can be reduced. Therefore, it is possible to effectively use the light emitted from the side of the light emitting element efficiently and with little unevenness in light concentration.

The above-mentioned light-emitting element may be provided on the above-mentioned metal member or the above-mentioned ceramic member via an element arrangement member for arranging the light-emitting element. This component arrangement member is typically referred to as a submount. A submount including a small circuit formed with a circuit pattern can be exemplified. The sub-fixer can be made of ceramic materials with relatively high thermal conductivity, such as aluminum nitride (AlN), aluminum oxide (Al ₂ O ₃ ), and the like. In the case where the submount is made of a ceramic material, the submount can be configured as a part of the ceramic member.

When the light-emitting element is provided on the metal member or the ceramic member through the element arrangement member alone, thermal conductivity decreases, and heat dissipation of heat from the light-emitting element tends to decrease. Therefore, it is preferable to increase the mutual contact area of the element arrangement member and the metal member or the ceramic member. On the other hand, in the element placement member, it is preferable that the light emitted from the side of the placed light emitting element to the side of the element placement member is not blocked by the element placement member. Taking these circumstances into consideration, it is preferable to form the element arrangement member into a truncated cone shape with tapered ends toward the side where the light emitting elements are arranged. As the shape of the element arrangement member at this time, a trapezoidal cubic shape in a side view (viewed from the side) or a shape in which slopes are formed in steps in such a trapezoidal cubic shape can be exemplified. In addition, the inclination angle of the above-mentioned element arrangement member is preferably about 10° to 30°, for example. The angle of inclination referred to here refers to an angle formed by a surface extending perpendicularly to the top surface along each side of the top surface of the element arrangement member and the slope.

In addition, in the element arrangement member, it is preferable that the surface on which the light emitting elements are arranged be as close as possible to the size of the light emitting elements so that the light from the side of the arranged light emitting elements is not blocked by the element arrangement member. For example, the element arrangement member has a surface that is 0.1 mm to 0.5 mm wider in the peripheral direction from the edge of the light emitting element when the light emitting element is arranged, and the light emitting element is arranged on this surface. By doing so, light from the side of the light-emitting element (for example, light emitted from the side of the light-emitting element within a range of about 5° to the side of the element arrangement member) can be utilized.

As described above, the light-emitting device is configured in such a manner that, while the element arrangement member is formed in a truncated cone shape with a tapered end portion toward the side where the light-emitting element is arranged, the element arrangement member has In the case of an element, a surface with a width of 0.1 mm to 0.5 mm in the peripheral direction from the edge of the light-emitting element and the above-mentioned light-emitting element are arranged on this surface can suppress the decline in the emission efficiency of light from the side of the above-mentioned light-emitting element, In addition, the heat dissipation performance for dissipating heat from the light emitting element can be improved.

Examples of the above-mentioned light-emitting element include a cube-shaped light-emitting element having a square or rectangular light-emitting surface with an area of about 1 mm ² to 9 mm ² . As the size of the above-mentioned light-emitting element, specifically, if the length of one pair of sides is defined as c' and the length of the other pair of sides is defined as d', although not limited thereto, it can be exemplified when c'=1 mm, d'=1mm-9mm, when c'=2mm, d'=1mm-4mm, when c'=3mm, d'=1mm-3mm, etc.

However, the heat radiation from the light-emitting element and the element arrangement member to the outside through the metal member or the ceramic member exhibits saturation with respect to the size of the surface of the metal member or the ceramic member on which the light-emitting element is installed. . In other words, even if the surface area of the above-mentioned metal member or the above-mentioned ceramic member is greatly increased, it is difficult to improve the heat dissipation only by increasing the package size. Therefore, it is desirable to specify the necessary minimum package size.

For example, when the light-emitting device related to the present invention is configured as a high-power, high-output light-emitting diode that uses a metal material with relatively high thermal conductivity such as Cu as the material of the above-mentioned metal member as described above and In the case of using a cube-shaped light-emitting element having a square or rectangular light-emitting surface with an area of about 1 mm ² to 9 mm ² as the above-mentioned light-emitting element, the above-mentioned metal member or the above-mentioned ceramic member has an area of 81 mm ² to 144 mm ² and A case where the light emitting element is provided on a square or rectangular surface including the shape of the light emitting surface of the light emitting element. According to the light emitting device constructed in this way, while maintaining the heat dissipation performance of dissipating heat from the light emitting element and the element placement member to the outside through the metal member or the ceramic member, the minimum required packaging can be realized. size. As the size of the above-mentioned metal member or the above-mentioned ceramic member, specifically, if the length of one pair of sides is defined as c, and the length of the other pair of sides is defined as d, then although it is not limited thereto, it can be exemplified in the range of c=9 mm to When 12mm, d = 9mm ~ 12mm and so on.

In addition, in order to achieve the third object above, the lighting device related to the present invention includes the above-mentioned light-emitting device of the present invention or the light-emitting device manufactured by the manufacturing method of the present invention and at least a pair of positive and negative terminals for supplying power to the light-emitting device, and is characterized in that The terminal has a first terminal for supporting the light emitting device from the side and/or a second terminal for supporting the light emitting device from one main surface side, and at least one of the first terminal and the second terminal sandwiches the light emitting device.

According to this configuration, since the terminals contact the main surface and/or side end surfaces of the light emitting device, the light emitting device can be firmly supported, so that the light emitting device can be supplied with power and the rotation of the light emitting device can be prevented. Furthermore, since the contact area between the light-emitting device and the terminal is increased compared with conventional ones, the heat dissipation of the lighting device can be passed. In addition, the main surface or the side surface of the light-emitting device is clamped by the spring piece, and the elasticity of the spring piece is properly adjusted, so that the light-emitting device can be easily attached and detached. Thus, partial repair of the light emitting device in the lighting device can be easily performed.

In addition, the above-mentioned light emitting device is supported by the heat transfer unit from the other main surface side. According to this structure, since the heat dissipation of the light-emitting device is further improved, a high-brightness lighting device can be produced.

In addition, the light-emitting observation surface side of the above-mentioned light-emitting device is opposite to the reflective surface. With such a configuration, a lighting device capable of irradiating light from the light emitting device in a desired direction can be produced.

In addition, the reflective surface is made of a metal material. According to such a configuration, the reflectance on the reflective surface can be further increased.

In addition, the reflective surface dissipates heat transferred by the heat transfer unit. According to such a configuration, the heat radiation performance of the lighting device can be further improved.

The new features of the present invention are nothing more than the content specifically described in the scope of the attached technical solutions, but regarding both the structure and the content, read the following detailed description together with other purposes or features together with the accompanying drawings. The description of the present invention can better understand and evaluate the present invention.

Description of drawings

FIG. 1 is a schematic exploded side view of a light emitting diode as an example of a light emitting device according to the present invention.

Fig. 2 is a schematic exploded perspective view of the light emitting diode shown in Fig. 1 .

Fig. 3 is a schematic cross-sectional view of the light emitting diode shown in Figs. 1 and 2 .

FIG. 4(A) is a diagram for explaining an inclination angle of a submount, and FIG. 4(B) is a diagram for describing a light emitting element used in Example 2. FIG.

5 is a graph showing the characteristics of the inclination angle of the submount versus the temperature rise value and the contact area of the Cu member and the submount.

FIG. 6 is a graph showing package area-temperature characteristics.

Fig. 7 is a schematic perspective view of the light emitting device 100 used in the lighting device according to Embodiment 1 of the present invention.

Fig. 8 is a schematic perspective view of the terminals 20a, 20b of the lighting device according to this embodiment.

Fig. 9 is a schematic oblique view showing a state where the light emitting device 100 is mounted on the terminals 20a, 20b of the lighting device related to this embodiment.

FIG. 10 is a schematic perspective view of the lighting device 40 according to Embodiment 2 of the present invention viewed from the front.

FIG. 11 is a schematic perspective view of the lighting device 40 according to this embodiment seen from the back side.

Fig. 12 is a schematic perspective view of a lighting device 60 according to Embodiment 3 of the present invention.

FIG. 13 is a schematic perspective view of an illuminating device 70 according to another embodiment 3 of the present invention.

Fig. 14 is a schematic oblique view of a light emitting device 100A used in a lighting device according to each embodiment of the present invention.

FIG. 15 is a schematic oblique view of a lighting device 80 using the light emitting device 100A shown in FIG. 14 .

Part or all of the drawings are drawn based on schematic representations for illustration purposes, and are not necessarily limited to faithfully depicting actual relative sizes or positions of elements shown therein.

Detailed ways

Hereinafter, embodiments related to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic exploded side view of a light emitting diode 10 as an example of a light emitting device according to the present invention, and FIG. 2 is a schematic exploded perspective view of the light emitting diode 10 shown in FIG. 1 . In addition, FIG. 3 is a schematic cross-sectional view of the light emitting diode 10 shown in FIGS. 1 and 2 .

A light emitting diode (hereinafter, also referred to as LED) 10 includes, as shown in FIGS.

The ceramic member 1 is composed of first and second plate-like members 1a and 1b each made of ceramics (AlN, _{Al2O3 ,} etc. in this example) and a submount (an example of an element arrangement member) 1c that are stacked on top of each other. constitute. The first plate-shaped member 1a is a square or rectangular plate with a predetermined size (in this example, one side (e= in FIG. 2) is about 9 mm to 12 mm, and the other side (f= in FIG. 2) is about 9 mm to 12 mm). shaped member, has a rectangular first opening 1a' larger than the size of the bottom surface 1c" of the sub-fixer 1c, and the size of the two opposite sides of the second plate-shaped member 1b corresponds to that of the first plate-shaped member 1a The size of the two sides is the same, and the size of the remaining two sides is smaller than the size of the corresponding two sides of the first plate-shaped member 1a, and has a second larger than the size of the first opening 1a' of the first plate-shaped member 1a. Opening 1b'. In this example, the materials of the first and second plate-shaped members 1a and 1b are the same.

In this example, the submount 1c is a submount called a submount for mounting the light-emitting element 2, and a small circuit such as a circuit pattern is formed, and a ceramic material with relatively high thermal conductivity such as AlN and _Al2O3 is used _. to form. The sub-fixture 1c is formed into a truncated cone shape whose end becomes thinner as it goes toward the installation side of the light-emitting element 2, specifically, it is trapezoidal in side view (viewed from the side) as shown in FIGS. 1 to 3 . Cubic shape of , or in such a trapezoidal cuboid shape, the slope portion is formed in a stepped shape. In this example, the ceramic material of the submount 1c and the above-mentioned first and second plate-shaped members 1a and 1b are all porous materials in which the pores h are formed in the ceramic material including the surface part, and the porosity of the pores h is and pore size are about 5% to 20% and 0.01mm to 0.15mm in this example, respectively. In order to maximize the thermal conductivity within this range, it is desirable to have a porosity of 5%.

In addition, as shown in FIG. 3 , in this example, the submount 1 c has a width (distance i= in the figure) of about 0.1 mm to a width of about 0.1 mm from the edge of the light emitting surface 2 a in the peripheral direction when the light emitting element 2 is mounted. The light-emitting element 2 is mounted on the surface 1c' of 0.5 mm so that the light L2 from the side of the mounted light-emitting element 2 is not blocked by the sub-mount 1c. Further, a submount 1c is provided on the metal member 5 to pass through the first opening 1a' of the first plate member 1a.

In this example, the light emitting element 2 is a square or rectangular shape having an area (length c'×d' in FIG. 2 ) of about 1 mm ² to 9 mm ² (for example, when c'=2 mm, d'=1 mm to 4 mm). The cube-shaped light-emitting element of the light-emitting surface 2a, as shown in FIG. The light-emitting element 2 is separately provided so as to protrude (distance g= in the figure) by about 0.5 mm to 2 mm from the top). By supplying predetermined electric power to the light emitting element 2 , the lights L1 and L2 are respectively emitted from the light emitting surface 2 a and the light emitting side surface 2 b of the light emitting element 2 . At this time, the light emitting element 2 generates heat along with the light emission, thereby increasing the temperature of the LED 10 .

The light-transmitting member 4, as shown in FIGS. 1 to 3 , in this example is a hollow hemispherical dome-shaped glass lens, and when the light-transmitting member 4 is made spherical, the approximate central portion When a light source is arranged, the light from the light source can be emitted substantially radially through the translucent member 4 . This translucent member 4 has an adhesive part 4a on the peripheral end part. In this adhesive portion 4a, the height from the edge portion top A of the main surface facing the adhesive surface of the second hot-melt material 6b is preferably higher than that of the submount 1c that becomes the mounting surface of the light emitting element 2. The height of the top is low. That is, as shown in FIG. 3, it is preferable to set the distance h. As a result, the light L2 from the light-emitting side surface 2b is emitted from the dome-shaped glass lens portion of the translucent member 4 without being shielded by the adhesive portion 4a of the translucent member 4 and the second hot-melt material 6b. Therefore, the light L2 emitted from the side of the light emitting element 2 can be effectively used. In addition, it is preferable to bond the translucent member 4 with the second hot-melt material 6b in an atmosphere of an inert gas such as nitrogen. Thereby, an inert gas is enclosed in the hollow part of the translucent member 4, and moisture does not mix in the hollow part like when bonding in air. Therefore, since the adverse effect of moisture on the light-emitting element 2 or the conductive member (for example, silver paste) as an adhesive of the light-emitting element 2 is eliminated, a highly reliable light-emitting device can be produced. In addition, as long as the material of the light-transmitting member has light-transmitting properties, it is not particularly limited. In addition to glass lenses, inorganic materials having good light resistance such as silicone gel or polysilazane resins, epoxy resins, etc. can be used. Light-transmitting resins excellent in weather resistance, such as urea resins, fluororesins, and mixed resins containing at least one or more of these resins. In addition, all members such as a viscosity extender, a light diffusing agent, a pigment, and a fluorescent substance may be added to the light-transmitting member according to the intended use. For example, examples of light diffusing agents include barium titanate, titanium oxide, aluminum oxide, silicon oxide, silicon dioxide, heavy calcium carbonate, light calcium carbonate, and mixtures containing at least one or more of these. In addition, the shape of the light-transmitting member 4 is not limited thereto, and may be, for example, a meniscus lens shape, a substantially elliptical shape viewed from the light-emitting observation surface side, or a combination of a plurality of these shapes.

In this example, the metal member 5 is made of Cu, which is a metal material with relatively good thermal conductivity, and has ^{an area} (c×d in FIG. ) and includes a square or rectangular surface 5a such as the shape of the light emitting surface 2a of the light emitting element 2, on which the light emitting element 2 is provided via the submount 1c. In addition, in this example, the size of the metal member 5 is the same as the size of the first plate-shaped member 1 a of the ceramic member 1 .

The hot-melt material 6 is configured to exhibit flexibility in a solidified and bonded state while being heated and melted at a melting temperature higher than a predetermined temperature (in this example, about 100° C. to 150° C.), including a bonded metal. The first hot-melt material 6a of the surface 5a of the member 5 and one surface of the ceramic member 1 (in other words, one surface of the first plate-shaped member 1a and the bottom surface 1c" of the sub-fixer 1c) and the transparent member 4 are bonded. The bonding portion 4a and the second hot-melt material 6b on the other surface of the ceramic member 1 (in other words, the surface of the second plate-shaped member 1b), the melting temperature a of the first hot-melt material 6a and the temperature of the second hot-melt material 6b The relationship of melting temperature b is a>b. In addition, in this example, the modulus of elasticity of the hot-melt material 6 is 0.2×10 ⁸ Pa～13.0×10 ⁸ Pa, and the thickness is about 0.01mm～0.10mm. If the thickness ratio When it is smaller than about 0.01 mm, the adhesiveness of the hot-melt material 6 tends to decrease, and when it is larger than about 0.10 mm, the thermal conductivity of the hot-melt material 6 tends to decrease.

And, the first hot-melt material 6a is impregnated in the pores h in the surface portion of the adhesive region on one surface of the ceramic member 1, and the second hot-melt material 6b is impregnated in the adhesive region on the other surface of the ceramic member 1. The pores h in the surface portion of the . Further, on the other surface of the first plate-shaped member 1a, a positive-side power feeding portion 7 and a negative-side power feeding portion 8 connected to external electrodes are formed. In addition, the first plate-shaped member 1a and the second plate-shaped member 1b are bonded to each other with the first hot-melt material 6a, and the first hot-melt material 6a can also be impregnated in the first and second plate-shaped members 1a, 1b. In the pores h of the surface portion of the bonding area.

According to the LED 10 that has been described above, since the adhesive for bonding the metal member 5 and the ceramic member 1 is a hot-melt material 6 that exhibits flexibility in a cured and bonded state, the hot-melt material 6 can relax the pressure. The stress accompanying the temperature rise of the metal member 5 and the ceramic member 1 can thereby suppress temperature changes caused by the difference in the linear expansion coefficients of the metal member 5 and the ceramic member 1, such as warpage and breakage (cracks) of the ceramic member 1 Therefore, as a metal material, a metal material (in this example, Cu) with relatively good thermal conductivity can be used, and as a light-emitting diode with high power and high output compared with existing devices, it can be used Achieve higher brightness emission characteristics. In addition, since the hot-melt material 6 is impregnated into the pores h in the surface portion of the bonding region of the ceramic member 1, the hot-melt material 6 can be firmly bonded to the pores h, thereby improving the thermal stability of the ceramic member 1. Adhesion of molten material 6. Therefore, even if the thickness of the hot-melt material 6 in the cured and bonded state is relatively thin, good adhesiveness can be maintained, and the thermal conductivity of the hot-melt material 6 can be improved accordingly.

In addition, since the relationship between the melting temperature a of the first hot-melt material 6a and the melting temperature b of the second hot-melt material 6b is a>b, even when the first hot-melt material 6a is used to bond the metal member 5 and the ceramic member 1 and after the light-emitting element 2 is installed, the light-transmitting member 4 and the ceramic member 1 are bonded by the second hot-melt material 6b. When the light-transmitting member 4 and the ceramic member 1 are bonded by the second hot-melt material 6b Therefore, melting of the first hot-melt material 6a bonding the metal member 5 and the ceramic member 1 can also be prevented.

In addition, in the LED 10, since the light-emitting element 2 is provided separately from the top A of the edge portion of the ceramic member 1 by a protruding distance g=approximately 0.5mm to 2mm, the light emitted from the light-emitting side surface 2b of the light-emitting element 2 The light L2 is easily emitted to the outside as it is, and the light can be efficiently used accordingly. In addition, for example, when the LED 10 is used for lighting or the like, even if the light L1 and L2 from the light-emitting element 2 are collected by the light-transmitting member 4 or the like, it is possible to sufficiently suppress the light from the light-emitting side 2b of the light-emitting element 2 from being The reflected light reflected by the ceramic member 1 can accordingly reduce the occurrence of uneven light concentration. Therefore, the light L2 emitted from the side 2b of the light-emitting element 2 can be effectively used efficiently and with little unevenness in light concentration.

Furthermore, according to the LED 10, since the sub-fixture 1c is formed into a truncated cone shape whose end portion becomes thinner as it goes toward the installation side of the light-emitting element 2, it has an edge from the edge of the light-emitting surface 2a when the light-emitting element 2 is installed. The surface 1c' widened by i=about 0.1mm to 0.5mm in the peripheral direction, on which the light-emitting element 2 is mounted, can be used, for example, to emit light from the side 2b of the light-emitting element 2 within a range of about 5°. Light L2 on the sub-fixture 1c side. Therefore, it is possible to improve the heat dissipation performance for dissipating heat from the light emitting element 2 while suppressing a decrease in the light emission efficiency from the side 2 b of the light emitting element 2 .

Furthermore, in the LED 10, since the light-emitting element 2 is a cube-shaped light-emitting element having a square or rectangular light-emitting surface with an area of approximately 1 mm ² to 9 mm ² , the metal member 5 made of Cu has an area of 81 mm ² to 144 mm ² The surface of the square or rectangular surface 5a including the shape of the light emitting surface 2a of the light emitting element 2, on which the light emitting element 2 is arranged, can maintain the heat from the light emitting element 2 and the sub-mount 1c through the metal The heat dissipation of the component 5 or the ceramic component 1 to the outside can realize the necessary minimum package size.

Next, the manufacturing example of LED10 shown in FIGS. 1-3 is demonstrated.

When manufacturing the LED 10, first, dissolve it in water or a water-soluble organic solvent (for example, a mixed solvent of dimethyl ethyl ketone and dimethyl formamide) and heat it at a predetermined temperature (here, 150° C.) A resin material that exhibits predetermined flexibility in a cured adhesive state while heating and melting at a high melting temperature is dissolved in the above water or the above water-soluble organic solvent to prepare the hot-melt material 6 as the above-mentioned adhesive. To further explain, consider the case where the metal member 5 and the ceramic member 1 are bonded together and the light-transmitting member 4 and the ceramic member 1 are bonded after the light-emitting element 2 is installed. Here, a thermoplastic elastomer, ethylene/vinyl acetate Dissolve ethylene/acrylic acid copolymer and polyethylene in the above water or the above water-soluble organic solvent, add polyimide as a thermosetting resin, and stir and mix uniformly, so that the first A first hot-melt material 6a in which a first resin composition exhibiting flexibility in a cured and bonded state while heating and melting at a melting temperature a (= 250°C) is dissolved in the water or the water-soluble organic solvent. Furthermore, thermoplastic elastomer, ethylene/vinyl acetate copolymer, ethylene/acrylic acid copolymer, and polyethylene are dissolved in the above-mentioned water or the above-mentioned water-soluble organic solvent, and polyimide as a thermosetting resin is added thereto. , Stir and mix evenly, so that it will be solidified while heating and melting at the second melting temperature b (=180°C) (a>b) which is higher than 150°C and lower than the first melting temperature a (=250°C). The second hot-melt material 6b in which the second resin composition exhibiting flexibility in the bonded state is dissolved in the water or the water-soluble organic solvent.

The ratio of each component of the above-mentioned 1st resin composition is here,

Thermoplastic elastomer : about 24.9% by weight (limited viscosity: 1.2dl/g)

Ethylene/vinyl acetate copolymer: about 24.9% by weight

Ethylene/acrylic acid copolymer : about 24.9% by weight

Polyethylene : about 24.9% by weight

Polyimide : About 0.3% by weight

The ratio of each component of the above-mentioned 2nd resin composition is here,

Thermoplastic elastomer : about 24.9% by weight (limited viscosity: 0.6dl/g)

Ethylene/vinyl acetate copolymer: about 24.9% by weight

Ethylene/acrylic acid copolymer: about 24.9% by weight

Polyethylene: about 24.9% by weight

Polyimide : About 0.3% by weight

In this example, as the thermoplastic elastomer, a styrene-based thermoplastic elastomer was used, and more specifically, the thermoplastic elastomer was "styrene-isoprene-styrene block copolymer", As the first resin composition, a resin composition with an intrinsic viscosity (η) of 1.2 dl/g was used, and a resin composition with an intrinsic viscosity (η) of 0.6 dl/g was used as the second resin composition. Here, the "different melting temperature" between the first resin composition and the second resin composition is determined by the intrinsic viscosity (η) of the thermoplastic elastomer. In other words, the relationship of "small-large intrinsic viscosity (η)" realizes "low-high melting temperature". Thus, in this example, "low-high melting temperature" was realized by changing the intrinsic viscosity (η) in the first resin composition and the second resin composition (in thermoplastic elastomers of the same kind of material) , becomes a structure in which the intrinsic viscosity (η) is changed, but it can also be realized by changing the type of thermoplastic elastomer material in the first resin composition and the second resin composition. That is, in the first resin composition and the second resin composition, even if thermoplastic elastomers of different materials are used, or (in thermoplastic elastomers of the same type of material) different intrinsic viscosities (η) are used Thermoplastic elastomers can achieve "low-high melting temperature". In addition, the above-mentioned "intrinsic viscosity (η)" is a value determined by JIS K7367-3. According to this JIS K7367-3, it is the "viscosity of a certain organic solvent at 135°C", which can be determined using an Ubbelohde viscometer. Find out.

Next, the hot-melt material 6 is applied on the surface portion of the bonding area of the ceramic member 1, and at the same time, the hot-melt material 6 is impregnated into the pores in the surface portion of the above-mentioned bonding area of the ceramic member 1 under a prescribed vacuum state. h. If it is further described, a vacuum chamber (not shown) is prepared, and in this vacuum chamber, the surface portion of the first bonding area between one surface of the first plate-shaped member 1a and the bottom surface 1c" of the submount 1c" is coated with the first adhesive layer. 1 hot-melt material 6a, and at the same time apply the second hot-melt material 6b on the surface portion of the second adhesive region on the surface of the second plate-shaped member 1b, decompress the inside of the vacuum chamber, and make it into a vacuum of 1kPa or less. The atmosphere becomes a prescribed vacuum state. Then, the first and second hot-melt materials 6a, 6b are respectively impregnated in the above-mentioned first and second adhesives of the ceramic member 1 (1a, 1b, 1c) in the above-mentioned prescribed vacuum state. In the pores h in the surface portion of the contact area. Thereafter, the ceramic member 1 coated with the hot-melt material 6 (6a, 6b) is dried.

Between one surface of the first plate-shaped member 1a that is coated with the first hot-melt material 6a and dried, and the bottom surface 1c" of the sub-fixer 1c and the metal member 5, the first melt The first hot-melt material 6a is welded at the first bonding temperature (here, 250°C) above the temperature a (=250°C) and under the above-mentioned predetermined pressure to bond the ceramic member 1 and the metal member 5 to each other, Furthermore, after the ceramic member 1 and the metal member 5 are bonded, the surface of the second plate-shaped member 1b which is coated with the second hot-melt material 6b and dried and the second hot-melt material 6b is dried, and the light-transmitting member 4 Between the above-mentioned second melting temperature b (= 180°C) and the second bonding temperature (here 180°C) that is above the above-mentioned first melting temperature a (= 250°C) and at the above-mentioned predetermined pressure Make this the 2nd hot-melt material 6b welding, mutually bonding ceramic member 1 and translucent member 4.At this moment, the thickness of the 1st and the 2nd hot-melt material 6a, 6b coated on ceramic member 1 is determined as 20 μm to 200 μm, the above specified pressure is set at 9.8×10 ⁴ Pa to 294.2×10 ⁴ Pa.

As described above, in this production example, the hot-melt material 6 prepared as an adhesive is applied to the surface portion of the above-mentioned bonding region of the ceramic member 1, and is heated in the above-mentioned predetermined vacuum state. Immersed in pores h in the surface portion of the above-mentioned bonding region of the ceramic member 1 . Since the hot-melt material 6 is obtained by dissolving the resin composition in the water or the water-soluble organic solvent, it has low viscosity at room temperature (eg, 25° C.) and can be uniformly impregnated in the pores h. Thereafter, the hot-melt material 6 is activated by heating and melting between the ceramic member 1 and the metal member 5 coated and impregnated with the hot-melt material 6 at a bonding temperature above the melting temperature, thereby bonding the ceramic members to each other. 1 with metal components5. Thus, by vacuum-impregnating the hot-melt material 6 into the air hole h in the surface portion of the above-mentioned bonding region of the ceramic member 1, the hot-melt material 6 and the air hole h can be bonded well. In this way, the LED 10 shown in FIGS. 1 to 3 can be manufactured.

According to the above-mentioned manufacturing example, since the LED 10 shown in FIGS. ) etc. due to the temperature change caused by the difference in the coefficient of linear expansion of the metal member 5 and the ceramic member 1, therefore, as the material of the metal member 5, a metal material with relatively good thermal conductivity can be used (in this example , is copper (Cu)), as a high-power, high-output light-emitting diode compared with existing devices, it can achieve higher luminance light-emitting characteristics. In addition, since the hot-melt material 6 is impregnated into the air holes h in the surface portion of the bonding region of the ceramic member 1, the hot-melt material 6 can be firmly bonded to the air holes h, thereby improving the thermal stability of the ceramic member 1. Adhesion of molten material 6. Therefore, even if the thickness of the hot-melt material 6 in the cured and bonded state is relatively thin, good adhesiveness can be maintained, and the light-emitting device 10 in which the thermal conductivity of the hot-melt material 6 can be improved accordingly can be provided.

In addition, in the above-mentioned production example, since the first hot-melt material 6a is welded at the first bonding temperature (here, 250° C.) above the above-mentioned first melting temperature a to bond the ceramic member 1 and the metal to each other. The member 5, after bonding the ceramic member 1 and the metal member 5, is at the above-mentioned second bonding temperature (180°C in this case) that is above the above-mentioned second melting temperature b but not below the above-mentioned first melting temperature a (a > b). °C) to fuse the second hot-melt material 6b to bond the ceramic member 1 and the translucent member 4 to each other, so even if the metal member 5 and the ceramic member 1 are bonded, the translucent member 4 and the ceramic member 1 are bonded together. When the light-transmitting member 4 and the ceramic member 1 are adhered by the second hot-melt material 6b, melting of the first hot-melt material 6a bonded to the metal member 5 and the ceramic member 1 can be prevented.

Furthermore, in the above-mentioned production example, since it is possible to bond at a temperature (here, 180° C. or 250° C.) sufficiently lower than the conventional temperature of about 500° C. to 800° C., the light emitting device 10 can be improved. Production efficiency, and accordingly the manufacturing cost can be kept low.

Furthermore, in the case of vacuum-impregnating a ceramic material using a generally used two-component type or thermosetting adhesive as an adhesive, since the hardening of the adhesive starts during vacuum impregnation, the Vacuum impregnation must be carried out in the state where the adhesive is applied to the ceramic material through the adhesive. In the state where the adhesive is applied to the ceramic material in this way, when air escapes from the pores of the ceramic material The unevenness of the adhesive layer, etc., can not be vacuum impregnated well, and it is easy to cause a decrease in adhesiveness. However, in the above-mentioned manufacturing example, for the hot-melt material 6, after vacuum impregnating the ceramic member 1 and After drying, the metal member 5 and the translucent member 4 are provided, and by heating to the above bonding temperature, the ceramic member 1 and the metal member 5 or the translucent member 4 can be bonded.

(Example 1)

Next, since the LED 10 shown in FIGS. 1 to 3 is used, regarding the sub-mount 1c in this LED 10, the temperature rise of the LED 10 and the contact area of the bottom surface 1c" of the sub-mount 1c with the surface 5a of the Cu member 5 were studied. For the relation of inclination angle, so explain below.Have again, the inclination angle of sub-fixer 1c, as shown in Fig. 4 (A), is along each limit of the top surface 1c ' of sub-fixer 1c with respect to this top The angle (θ in the figure) formed by the plane R extending perpendicularly to the plane 1c' and the inclined plane S.

Here, the material of the ceramic member 1 is AlN, the dimension e×f is 9mm×12mm, the dimension c′×d′ of the light emitting element 2 is 1mm×2mm, the height r′ is set at 100 μm, and the top surface 1c of the sub-mount 1c is ′ is i=0.2 mm wider in the peripheral direction from the edge of the light emitting element 2, and the thickness of the hot melt material 6a bonding the submount 1c and the Cu member 5 is set to 15 μm. Furthermore, the dimension c×d of the Cu member 5 is 9mm×12mm, the height r is set at 2mm, and the inclination angle θ of the submount 1c is changed. At this time, 2.5 W was injected into the light emitting element 2 .

FIG. 5 shows the characteristics of the inclination angle θ of the submount 1c, the temperature rise value, and the contact area between the Cu member 5 and the submount 1c. As shown in FIG. 5, as the inclination angle θ becomes larger, although the heat dissipation becomes better, the contact area between the bottom surface 1c" of the submount 1c and the surface 5a of the Cu member 5 increases. However, from the perspective of cost etc. From a viewpoint, the above-mentioned contact area of the submount 1c (in other words, the size of the submount 1c) is preferably small. Considering the heat dissipation and contact area, the inclination angle θ is preferably about 10° to 30°.

(Example 2)

Next, since the temperature difference between the light-emitting element 2 of the LED 10 and the Cu member 5 [(temperature Tj of the light-emitting element 2)-(temperature Tcu-plate of the Cu member 5) of the LED 10 is studied using the LED 10 shown in FIGS. Since the relationship of the dimension cxd (in other words, package area) of the Cu member 5 in LED10 is demonstrated below. Here, except for the inclination angle θ of the light emitting element 2 and the submount 1c, and the dimensions of the Cu member 5 and the ceramic member 1, it is the same as that of the first embodiment. As shown in FIG. 4(B), the light-emitting element 2 is defined as a light-emitting chip (Dice) with a size c”×d”=1mm×1mm and a height r’ of 100 μm, which are arranged vertically and horizontally x 4. The inclination angle θ of the sub-mount 1c is set to 20°, and as the packaging area, the dimensions c×d of the Cu component 5 and the dimension e×f of the ceramic component 1 are changed to 5mm×5mm=25mm ² , 7mm×7mm=49mm ² , 9mm×9mm=81mm ² , 12mm×12mm=144mm ² , 15mm×15mm=225mm ² . At this time, 10W was injected into the light emitting element 2 .

The package area-temperature characteristic is shown in FIG. 6 . As shown in Fig. 6, as the package area c×d increases, although the heat dissipation becomes better, even if the package area c×d is larger than approximately 9 mm square = 81 mm ² to 12 mm square = 144 mm ² , the heat dissipation is not good. Big changes. Therefore, it can be seen that the package area c×d is preferably about 81 mm ² to 144 mm ² .

As described above, according to the present invention, it is possible to suppress occurrence of problems caused by temperature changes due to differences in the linear expansion coefficients of the metal member and the ceramic member, such as warpage and breakage (cracks) of the ceramic member. , As the material of the above-mentioned metal member, a metal material with relatively good thermal conductivity can be used, and a light-emitting device and a manufacturing method thereof capable of realizing device characteristics of high power and high output compared with conventional devices can be provided.

Furthermore, the present invention can provide a light-emitting device that can efficiently utilize light emitted from the side of the light-emitting element with less unevenness in light concentration, for example, when it is configured as a light-emitting diode provided with a light-emitting element.

Next, an embodiment of the lighting device related to the present invention will be described.

"Implementation of Lighting Device 1"

Fig. 7 is a perspective view showing the appearance of the light emitting device 100 used in the lighting device according to Embodiment 1 of the present invention. The light emitting device 100 is manufactured by using the above-mentioned method of manufacturing a light emitting device related to the present invention. In addition, the positive side power supply part 7 and the negative side power supply part 8 of the light emitting device 100 of this embodiment are provided not only on the surface side of the first plate-shaped member 1a, but also on the corresponding side surfaces, respectively.

FIG. 8 shows a schematic oblique view of the terminals 20a, 20b related to this embodiment. Terminals 20a and 20b are at least a pair of positive and negative terminals made of conductive material for contacting positive side power supply part 7 and negative side power supply part 8 of light emitting device 100 respectively to supply power to light emitting device 100 . Furthermore, the terminals 20a and 20b have at least first terminals 21a and 21b as spring pieces sandwiching the light emitting device 100 from the side and second terminals 22a and 22b supporting the light emitting device 100 from one main surface side. In more detail, the first terminals 21a, 21b and the second terminals 22a, 22b branch at the bases 25a, 25b of the terminals 20a, 20b, starting from the respective bases 25a, 25b in the direction of the mounted light emitting device 100, respectively. extend. With such a structure, it is possible to securely fix the light emitting device 100 while supplying power to the light emitting device 100 . Furthermore, the terminal in this embodiment has a terminal for mounting the light emitting device 100 on one end, and terminals 23a, 23b connected to external electrodes on the other end.

The terminals 23a and 23b of this embodiment are provided in a shape with a wider width in the direction perpendicular to the main surface of the light emitting device 100 as shown in FIG. The shape has a wider width in a direction horizontal to the main surface of the light emitting device 100 . In addition, the terminals 20a, 20b have shapes 24a, 24b in which the light emitting device 100 can be positioned in the mounting direction at a part of the terminal, for example, a portion near the bases 25a, 25b as shown in FIG. 8 .

Fig. 9 is a perspective view schematically showing a lighting device 30 in which a light emitting device 100 is mounted on terminals 20a and 20b related to the present embodiment. In FIG. 9 , the first terminals 21 a and 21 b as spring pieces have elasticity relative to the direction of clamping the light emitting device 100 , and firmly clamp the light emitting device 100 from the side. In addition, the light emitting device 100 is placed on the plate-shaped heat transfer unit 31 to dissipate heat from the back side of the light emitting device 100 . Here, it is preferable to bend the heat transfer unit 31 at the rear surface of the lighting device 30 so that heat can be dissipated in the direction of a heat dissipation means such as a reflection unit. By doing so, the heat dissipation of the lighting device can be improved.

"Implementation of Lighting Device 2"

FIG. 10 is a perspective view schematically showing the state of the lighting device 40 according to the second embodiment seen from the front direction, and FIG. 11 is a perspective view showing the state of the lighting device 40 seen from the rear direction. In the lighting device 40 related to this embodiment, a part of the terminal and the light emitting device 100 are covered with the package body 41 of molded resin or the like. The lighting device 40 shown in FIGS. 10 and 11 is also used as a lighting device combined with a reflection unit. In addition, as shown in FIG. 11 , part of the heat transfer unit 31 is exposed on the back surface of the lighting device 40 , and can dissipate heat on the reflective surface of the reflective unit by connecting to the externally provided reflective unit.

In addition, the molding material of the package body 41 used in this embodiment is not particularly limited, and conventionally known materials such as liquid crystal polymers, polyphthalamide resins, polybutylene terephthalate (PBT) and the like can be used. All thermoplastic resins. In addition, in order to efficiently reflect light from the light-emitting device, a white pigment such as titanium oxide or the like may be mixed with the package molding member.

"Implementation of Lighting Device 3"

FIG. 12 is a perspective view schematically showing a lighting device 60 according to the third embodiment. The lighting device 60 in this embodiment is the same as that of the above-mentioned Embodiments 1 and 2 except for the structure of the terminals 60a and 60b. The terminals 60a and 60b related to this embodiment support the light emitting device 100 only from the side of the light emitting device 100 for power supply.

As shown in FIG. 12, the lighting device 60 related to this embodiment has a pair of positive and negative terminals 60a, 60b, and the light-emitting device 100 is sandwiched from the side by these two terminals. The terminals 60a, 60b are shaped as follows: from the bases 65a, 65b, the spring pieces 61a, 61b and the stoppers 64a, 64b respectively extend along the side surface of the light emitting device 100 and the side adjacent to the side surface, and further have a contact with the stopper portion. 64a, 64b are continuous terminal portions 63a, 63b that can be connected to external electrode terminals. The extending direction of the terminal portions 63 a , 63 b connectable to external electrode terminals is substantially perpendicular to the side surface of the light emitting device 100 . Here, a part of the terminals 60a, 60b is formed as spring pieces 61a, 61b having elasticity in a direction sandwiching the light emitting device 100, and the light emitting device 100 is inserted between the terminals 60a, 60b. In addition, a positive terminal (for example, 60a) is in contact with the positive side power supply part 7 provided on one side of the light emitting device 100, and a negative terminal (for example, 60b) is in contact with the negative side power supply part 7 provided on the other side of the light emitting device 100. The power supply part 8 contacts. In addition, each of 60a, 60b has a wider shape in a direction parallel to the side surface in order to obtain a larger contact area with the side surface of the light emitting device 100 . In addition, each of 60a, 60b has a terminal portion 63a, 63b that can be connected to an external electrode, and the width of the terminal portion in the direction perpendicular to the main surface of the light emitting device 100 is wider, as in the first and second embodiments described above. .

(terminal)

The terminal (20a, 20b or 60a, 60b) related to each of the above-mentioned embodiments is in contact with the power supply part provided on the side surface side and the main surface side of the light emitting device, so as to supply power to the lighting device while firmly supporting the light emitting device. A component made of a conductive material of a light-emitting device. Furthermore, a pair of positive and negative terminals are provided, and the positive terminal and the negative terminal respectively have a first terminal as a spring piece for making it elastic so as to clamp the light emitting device from the side direction and a support for the light emitting device from one main surface side. second terminal. Alternatively, the positive terminal and the negative terminal are respectively first terminals having spring pieces made elastic so as to clamp and support the light emitting device from a side direction. By supporting the light emitting device from the main surface direction and/or the side direction in this way, the light emitting device can be firmly fixed, and rotation due to vibration from the outside can be prevented. Here, not only the first terminal but also the second terminal are made elastic, and the light emitting device can be sandwiched from the main surface direction of the light emitting device by using the second terminal and the heat transfer unit on which the light emitting device is placed. . With such a structure, the light-emitting device can be fixed more firmly, and rotation due to vibration from the outside can be prevented.

In addition, the terminal in this embodiment has a terminal for mounting a light-emitting device at one end and a terminal for connecting to an external electrode at the other end. Compared with one terminal, the shape of the terminal connected to the external electrode may be changed so as to correspond to the shape of the external electrode. In addition, a part of the terminal has a shape that enables positioning in the direction in which the light emitting device is mounted. For example, the positive and negative pairs of terminals respectively have stoppers 24a, 24b, 64a, 64b along the sides of the light emitting device, so as to fix and support the light emitting device so as not to move in the mounting direction. Such a shape is formed, for example, by punching and bending a flat metal plate.

For the terminals, various materials can be selected in consideration of electrical conductivity and elasticity, and they can be formed in various sizes. As a material for such a terminal, in addition to using copper alone, a material obtained by plating silver, palladium, or silver, gold, or the like on the surface of a copper or phosphor bronze plate can be suitably used. When the metal plating is performed in this way, it is preferable because the reflectance of light emitted from the light emitting device 100 is improved and the light extraction efficiency of the lighting device is improved.

(heat transfer unit)

The heat transfer unit 31 in each of the above-mentioned embodiments is a member that places the light emitting device and transfers heat generated from the light emitting device from the back side of the light emitting device toward the heat dissipation direction. For example, the heat transfer unit may be made of a metal plate such as copper or aluminum or a heat pipe. In particular, in each of the above-mentioned embodiments, the heat pipe that can be used as the heat transfer unit is, for example, a metal tube made of a metal material such as copper or aluminum in which water, chlorofluorocarbons, substituted chlorofluorocarbons, fluorides, etc. are sealed. The material of the working fluid for heat transfer, etc., is a heat transfer member that achieves extremely high thermal conductivity by repeating the following operations: the working fluid is heated in the heat-intake part (high-temperature part) and becomes steam, and passes through it. The steam moves to the heat dissipation part (low temperature side) and is liquefied to dissipate heat, and the liquefied working fluid returns to the heat inlet part by capillary action.

In each of the above-mentioned embodiments, the shape of the heat transfer unit can be made into various shapes and sizes in consideration of the direction to be radiated and the effect of radiating heat. For example, as shown in FIG. 9 , the flat heat transfer unit 31 extends from a position facing the back surface of the light emitting device 100 toward the terminal portions 23a, 23b that can be connected to the external electrode terminals, and in the middle toward The heat dissipation direction is bent at right angles. In addition, like the lighting device 70 shown in FIG. 13 , it may be bent 180 degrees at a position facing the back surface of the light emitting device 100 .

(reflection unit)

In the lighting device in each of the above-mentioned embodiments, for the reflective unit having a surface that can be used as a reflective surface, the reflective surface is provided opposite to the light-emitting observation surface of the light-emitting device, and the light emitted from the light-emitting device is illuminated by the reflective surface. The light is reflected in the desired direction. The reflective surface of the reflective unit is processed into a concave shape. For example, metal plating such as silver plating is preferably performed on the reflective surface or surface made of aluminum. By performing silver plating, the reflectance of light can be improved. In addition, it has a function of dissipating heat emitted from the light emitting device through the heat transfer unit from the back of the lighting device to the outside of the lighting device.

Various materials can be selected for the reflector, and various sizes can be formed in consideration of heat dissipation, reflectivity on the reflective surface, and size or output of the light emitting device. That is, the higher the output of the light emitting device, the larger the reflection unit can be. Connecting the end portion of the heat transfer unit to the reflection unit is desirable because the heat emitted from the light emitting device is efficiently dissipated to the outside, so that the thermal conductivity is good. The specific thermal conductivity of such a reflection unit is preferably 0.01cal/(s)(cm ² )(°C/cm) or more, more preferably 0.5cal/(s)(cm ² )(°C/cm )above.

As the material of the reflector, besides aluminum alone, metal plating or solder plating of silver, palladium, silver, gold, etc. on the surface of copper, aluminum, or phosphor bronze plate can be suitably used. In the case where silver plating is performed in this manner, it is preferable because the reflectance of light emitted from the light-emitting device is improved and the light extraction efficiency of the lighting device is improved.

As described above, since the lighting device of the present invention is excellent in heat dissipation, it can illuminate with high brightness. In addition, since the performance against mechanical vibration from the outside is also strong, a highly reliable lighting device can be produced.

For this reason, the lighting device according to the present invention is not limited to general lighting, but can also be used as vehicle-mounted lighting such as a car lamp.

As above, the present invention has been described with respect to an appropriate form in some degree of detail, but the currently disclosed content of the appropriate form should be changed in the details of the structure, and can be changed without departing from the scope and spirit of the invention. Realize the combination or sequence change of each element.

For example, in each embodiment of the above-mentioned lighting device (Fig. 9, Fig. 10, Fig. 12 and Fig. 13), the light-emitting device (light-emitting device 100) related to the present invention is used, but it is not limited thereto. A light emitting device 100A shown in FIG. 14 was used. For the light-emitting device 100A shown in FIG. 14 , the light-emitting element is fixed on the main body of the substrate in which the positive and negative conductive patterns (positive electrode 102 and negative electrode 103 ) are insulated and isolated from each other by an insulating spacer 101 . On the surface, the electrodes of the light-emitting element and the conductive pattern are conductively connected. Here, the electrical connection between the light-emitting element and the conductive pattern is performed using, for example, a conductive lead made of Au, but it is also possible to make a pair of positive and negative electrodes provided on the same surface side of the light-emitting element to face the conductive pattern. directly bonded via a conductive member. In addition, conductive patterns are arranged by insulating positive and negative conductive members from each other from the side of the light-emitting observation surface that is one main surface of the substrate to the side surface of the substrate. In addition, the translucent member 104 is a hemispherical member formed of a rigid polysiloxane resin. The "principal surface" mentioned here refers to the direction of the light-emitting viewing surface or the mounting surface of the light-emitting device for the light-emitting device, especially the substrate. The wide way forms one side of the face.

When the light-emitting device 100A is described in more detail, for an insulating substrate on which a conductive pattern is applied by a conductive member, a light-emitting element is mounted directly or via a heat-conductive substrate as a submount. Here, as the conductive member, gold, silver, copper, etc. are used, for example, and formed as a conductive pattern on an insulating substrate by metal plating. As the insulating substrate, a glass epoxy resin substrate is mainly used. In addition, a structure may be adopted in which the substrates of the light emitting device 100A are bonded with an insulating resin so as to insulate a pair of opposing metal flat plates.

In addition, as a light emitting element, an LED chip is used. A plurality of these LED chips can be used in accordance with the output of the light emitting device 100A, and various shapes and arrangements can be made so that desired optical characteristics can be obtained.

The type of the LED chip is not particularly limited, but when a fluorescent substance is used together, it is preferably a semiconductor light emitting element having an active layer that emits a wavelength that can excite the fluorescent substance. As such a semiconductor light-emitting element, various semiconductors such as ZnSe or GaN can be mentioned, but a nitride semiconductor ( _{InxAlyGa1 -XY)} capable of _emitting short-wavelength light that can efficiently excite fluorescent substances can be mentioned suitably. N, 0≤X, 0≤Y, X+Y≤1). The aforementioned nitride semiconductor may contain boron or phosphorus as necessary. Examples of semiconductor structures include homostructures, heterostructures, and double heterostructures having MIS junctions, PIN junctions, or pn junctions. Depending on the material of the semiconductor layer or its mixed crystallinity, various emission wavelengths can be selected. In addition, a single quantum well structure or a multiple quantum well structure formed in a thin film that produces quantum effects in the active layer can also be used.

When a nitride semiconductor is used, a material such as sapphire, spinel, SiC, Si, ZnO, GaN, or the like can be suitably used as the semiconductor substrate. In order to form a nitride semiconductor having good crystallinity with good mass productivity, it is preferable to use a sapphire substrate. A nitride semiconductor can be formed on this sapphire substrate using MOCVD or the like. For example, a buffer layer of GaN, AlN, GaAlN, etc. is formed on a sapphire substrate and a nitride semiconductor having a pn junction is formed thereon. In addition, the substrate may be removed after laminating the semiconductor layer.

As an example of a light-emitting element having a pn junction using a nitride semiconductor, a first contact layer formed of n-type potassium nitride, n-type aluminum nitride, and potassium are stacked in this order on a buffer layer. The double heterostructure of the first cladding layer, the active layer formed of indium nitride and potassium, the second cladding layer of p-type aluminum nitride and potassium, and the second contact layer of p-type potassium nitride, etc. . A nitride semiconductor exhibits n-type conductivity in an undoped state. When forming a desired n-type nitride semiconductor to improve luminous efficiency, etc., it is preferable to introduce Si, Ge, Se, Te, and C as n-type dopants appropriately. On the other hand, in the case of forming a p-type nitride semiconductor, Zn, Mg, Be, Ca, Sr, Ba, etc. are doped as p-type dopants. Since it is difficult to achieve p-type conversion of nitride semiconductors only by doping p-type dopants, it is preferable to lower the resistance by furnace heating or plasma irradiation after introducing p-type dopants. After the electrodes are formed, the semiconductor wafer is diced into chips to form a light emitting element made of a nitride semiconductor. In addition, if an insulating protective film made of SiO ₂ is formed by patterning so that only the bonding portion of each electrode is exposed and covers the entire element, a miniaturized light-emitting device can be formed with high reliability.

When the light-emitting device 100A emits white-like mixed color light, it is more appropriate for the light-emitting element to have a light-emitting wavelength of 400 nm or more and 530 nm or less in consideration of the complementary color relationship with the light-emitting wavelength from the fluorescent material or the performance deterioration of the light-transmitting resin. Ideally, more than 420nm to less than 490nm is more ideal. In order to further improve the excitation and luminous efficiency of the light-emitting element and the fluorescent substance, respectively, it is ideal to have a wavelength of not less than 450 nm and not more than 475 nm. In addition, a light-emitting element whose main emission wavelength is in the ultraviolet region shorter than 400 nm or in the short-wavelength region of visible light can also be used in combination with a member whose performance is relatively less likely to be deteriorated by ultraviolet rays.

The light-emitting device 100A described above can be used in the lighting devices of the above-mentioned embodiments, but the lighting device 80 shown in FIG. 15 can also be used as an embodiment of other lighting devices. The lighting device 80 has a pair of positive and negative terminals that support the substrate of the light emitting device 100A from the main surface side and supply power to the light emitting device 100A. If described in more detail, the substrate of the light-emitting device 100A is clamped from the direction of the main surface by the main surface of the positive and negative pair of two terminals and the mounting surface of the member (such as the heat transfer unit) on which the light-emitting device is placed, especially for the positive and negative one. For each of the terminals, the support portions 82a, 82b respectively extend from the base portions 85a, 85b along the main surface of the substrate of the light emitting device 100A, and furthermore, the stopper portions 84a, 84b respectively extend along the side surfaces of the substrate of the light emitting device 100A. Furthermore, terminal portions 83a, 83b that can be connected to external electrode terminals are formed continuously with the stopper portions 84a, 84b. The extending direction of the terminal portions 83a, 83b connectable to the external electrode terminals is substantially perpendicular to the side surface of the substrate of the light emitting device 100A. Here, the pair of positive and negative terminals is shaped like a spring having elasticity in a direction sandwiching the substrate of the light emitting device 100A, and the translucent member 104 of the light emitting device 100A is inserted between the two terminals for positioning. For example, a pair of positive and negative terminals has spring pieces 81a and 81b formed by bending a part of the respective flat metal plates in the direction of the main surface of the substrate of the light emitting device 100A, and the spring pieces 81a and 81b extend in different directions from each other. Furthermore, the spring piece 81a provided on the positive terminal is in contact with the positive electrode 102 provided on the main surface side of the light emitting device 100A, while the spring piece 81b provided on the negative terminal is in contact with the positive electrode 102 provided on the same main surface side. The negative electrode 103 contacts. In addition, the shapes of the terminals are respectively formed into shapes having a wider width in the direction parallel to the main surface in order to increase the contact area with the substrate of the light emitting device 100A. In addition, similarly to the above-described embodiments of the lighting device, the terminals each have terminal portions 83a, 83b that can be connected to external electrodes, and the terminal portions have a wide width in a direction parallel to the main surface of the substrate of the light emitting device 100A.

In addition, it is preferable to place the light emitting device 100A on the heat transfer unit via a heat conductive substrate. The thermally conductive substrate has a function of transferring heat generated from the light emitting device 100A to the heat transfer unit. The thermally conductive substrate can be formed in various sizes in consideration of heat dissipation, output of the light source, and the like. The light emitting device 100A is in contact with the heat transfer unit via the heat conductive substrate. Therefore, in order to efficiently dissipate the heat emitted from the light emitting device 100A to the heat transfer unit side, it is desirable that the thermal conductivity of the thermally conductive substrate is good. Specifically, the thermal conductivity is preferably not less than 0.01 cal/(s) (cm ² ) (°C/cm), more preferably not less than 0.5 cal/(s) (cm ² ) (°C/cm).

As a material for such a thermally conductive substrate, in addition to using ceramics, copper, aluminum, or phosphor bronze plates alone, metal plating or solder plating on the surface of these metals with silver, palladium, silver, gold, etc. can be suitably used. and other materials.

Claims (14)

1. luminescent device possesses the encapsulation that is made of pottery with ceramic component and the light transmission member with light transmission mutually bonding with this ceramic component, it is characterized in that:

The circumference of this light transmission member and above-mentioned ceramic component are bonding mutually with bonding agent,

Light-emitting component is arranged at heat radiating metal member or above-mentioned ceramic component by the arrangements of components member that disposes this light-emitting component,

The circumference top of above-mentioned light transmission member is lower than the upper surface of said elements layout structure.

2. the luminescent device described in claim 1 is characterized in that:

The light-emitting diode that forms by on above-mentioned ceramic component light-emitting component being set constitutes.

3. the luminescent device described in claim 2 is characterized in that:

The dome-shaped glass lens of the semi-spherical shape that above-mentioned light transmission member is a hollow is constructed such that the light of the light source of comfortable central part configuration to be radial ejaculation.

4. the luminescent device described in claim 2 is characterized in that:

Above-mentioned light-emitting component is arranged to protrude 0.5mm～2mm from the circumference top of above-mentioned ceramic component.

5. the luminescent device described in claim 1 is characterized in that:

The said elements layout structure forms along with the configuration side towards above-mentioned light-emitting component is the thin truncated cone shape in end.

6. the luminescent device described in claim 1 is characterized in that:

The said elements layout structure has following, the above-mentioned light-emitting component of configuration on this face, this face when having disposed above-mentioned light-emitting component from the circumference of this light-emitting component along the wide 0.1mm of going out of peripheral direction～0.5mm.

7. the luminescent device described in claim 2 is characterized in that:

Above-mentioned light-emitting component is cube shaped, and having area is 1mm ²～9mm ²The light-emitting area of square or rectangular.

8. the luminescent device described in claim 7 is characterized in that:

Above-mentioned ceramic component has the face of square or rectangular of the shape of the above-mentioned light-emitting area that comprises above-mentioned light-emitting component, and the area of this face is 81mm ²～144mm ², on this face, be provided with above-mentioned light-emitting component.

9. lighting device, it possesses the luminescent device described in the claim 1 and to the positive and negative at least pair of terminal of this luminescent device power supply, it is characterized in that:

Above-mentioned each terminal clips above-mentioned luminescent device.

10. the lighting device described in claim 9 is characterized in that:

Above-mentioned each terminal has the first terminal that supports above-mentioned luminescent device from the side and supports second terminal of above-mentioned luminescent device from upper face side,

The first terminal of above-mentioned each terminal clips above-mentioned luminescent device.

11. the lighting device described in claim 9 is characterized in that:

Above-mentioned luminescent device side below it utilizes heat transfer unit to support.

12. the lighting device described in claim 9 is characterized in that:

The luminous sightingpiston side and the reflecting surface of above-mentioned luminescent device are opposed.

13. the lighting device described in claim 12 is characterized in that:

Above-mentioned reflecting surface is made of metal material.

14. the lighting device described in claim 12 is characterized in that:

Above-mentioned reflecting surface is to being dispelled the heat by the heat of above-mentioned heat transfer unit transmission.

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