CN100585880C - Functional element installation module and manufacturing method thereof - Google Patents

Abstract

There are provided a small-size optical function element module and its manufacturing method not requiring an expensive special member. On a substrate (2), a predetermined wiring pattern is formed and an optical function element (3) is mounted. A protrusion (7) is formed around the optical function element (3) to stem liquid sealing resin (8) on the substrate (2). The liquid sealing resin (8) is dropped into the portion between the optical function element (3) and the protrusion (7) so as to fill the portion between the optical function element (3) and the protrusion (7) with the sealing resin (8). A package constituent member (9) having a light transmission hole (9a) corresponding to the optical function unit of the optical function element (3) is brought into abutment with the protrusion (7) with the light transmission unit (9a) opposing to the optical function unit (30) of the optical function element (3). Thus, the package constituent member (9) is brought into contact with the sealing resin (8). Furthermore, the sealing resin (8) is hardened so that the package constituent member is fixed to the substrate (2). Lastly, the protrusion (7) is cut off.

Description

Functional element installation module and manufacturing method thereof

technical field

The present invention relates to a functional element mounting module such as a light receiving element or a light emitting element, and particularly relates to a technology of a light functional element mounting module in which a light functional element is mounted on a substrate using a sealing resin.

Background technique

Conventionally, as such an optical functional element mounting module, for example, a package having a hollow structure is known.

As shown in FIG. 10 , a package 101 of a conventional optical functional element mounting module 100 is configured by mounting a translucent member 104 on a substrate 102 via a frame-shaped spacer 103 . Furthermore, the optical functional element 105 is arranged in the package 101 so that the optical functional part 106 is opposed to the translucent member 104, and the optical signal 107 is transmitted and received.

However, in the case of such a prior art, there is a problem that, for example, in order to transmit blue-violet laser light having a short wavelength of 405 nm, it is necessary to use glass with a special coating as the translucent member 104. , and thus become very expensive.

In addition, in order to cope with other wavelengths at the same time (for example, for CD: 780nm, for DVD: 650nm), it is necessary to apply more expensive coating.

In addition, in the case of the prior art, there is a problem that the frame-shaped spacer 103 is required to hold the light-transmitting member 104 , and thus there is a limit to miniaturization.

Contents of the invention

The present invention has been made to solve such conventional problems, and an object of the present invention is to provide a functional element mounting module capable of miniaturization without requiring expensive special components, and a method of manufacturing the same.

The present invention made in order to achieve the above object is: a functional element mounting module, which has: a substrate on which a predetermined wiring pattern is formed; a predetermined functional element mounted on the above substrate; and a functional part with the above functional element In the package component corresponding to the hole portion, the functional component is sealed with a sealing resin in a state where the functional part of the functional element is exposed, and the package component is fixed to the substrate through the sealing resin.

In the present invention, in the above invention, the functional element is electrically connected to the wiring pattern on the substrate by wire bonding.

In the present invention, in the above invention, a protective covering member covering the hole of the package component may be provided on the package component.

In the present invention, in the above invention, an exhaust port communicating with the functional portion exposure space may be provided between the sealing member and the protective cover member.

In the present invention, in the above invention, the protective cover member may be a protective film that can be peeled off from the package member.

In the present invention, in the above-mentioned invention, the above-mentioned functional element may be made into an optical functional element.

In the present invention, in the above invention, a blocking portion for blocking the sealing resin may be provided in the vicinity of the functional portion of the functional element.

In the present invention, in the above invention, the blocking portion is provided in a peripheral area of the functional portion of the functional element.

In the present invention, in the above invention, the stopper portion may be formed in a substantially annular shape.

In the present invention, in the above-mentioned invention, the blocking portion may be formed as a dike protruding from the functional element.

In the present invention, in the above-mentioned invention, the barrier portion may be a groove portion formed through a protective film provided on the functional element.

The present invention is a method of manufacturing a functional component mounting module, which has the following steps: on a substrate on which a predetermined wiring pattern is formed and a predetermined functional component is mounted, a dike for blocking liquid sealing resin is provided near the functional component portion; dripping liquid sealing resin between the above-mentioned functional element and the above-mentioned embankment to fill the space between the above-mentioned functional element and the above-mentioned embankment; The structural member is in contact with the embankment in a state where the hole portion is opposed to the functional portion of the functional element, whereby the sealing structural member is brought into contact with the liquid sealing resin; the liquid sealing resin is cured to obtain Fixing the above-mentioned packaging structure components on the above-mentioned substrate; and removing the above-mentioned dike part.

In the present invention, in the above-mentioned invention, the above-mentioned jetty portion may be provided in the surrounding area of the above-mentioned functional element.

In the present invention, in the above-mentioned invention, the above-mentioned jetty portion may be formed in a substantially annular shape.

In the present invention, in the above-mentioned invention, the above-mentioned functional element may be made into an optical functional element.

In the present invention, in the above invention, a functional element having a blocking portion for blocking the sealing resin in the vicinity of the functional portion may be used as the functional element.

In the above invention, the present invention may include a step of providing a protective cover member covering the hole of the package component on the package component.

In the case of the functional element mounting module of the present invention, it is possible to provide a functional element mounting module in which since the functional part of the functional element is in an exposed state, it can be reliably mounted without attenuation without using expensive glass to which a special coating is applied. It inputs and outputs short-wavelength light such as blue-violet laser light, and is also excellent in heat dissipation.

In addition, according to the present invention, since a frame-shaped spacer is not required, a very small functional component mounting module can be provided.

On the other hand, when the protective cover member covering the hole of the package component is provided on the package component, it is possible to prevent foreign matter from adhering to the functional portion of the functional element.

At this time, if an exhaust port communicating with the space for exposing the functional part is provided between the package structural member and the covering member for protection, the gas (air) that expands in the space for exposing the functional part during reflow will Escape through the exhaust port, so it can improve the resistance to fusion welding. In addition, by providing the exhaust port, dew condensation in the space for exposing the functional part can also be prevented.

In addition, if a protective film that can be peeled off from the above-mentioned package structural member is used as the protective cover member, the optical signal can be input without attenuation when, for example, an optical functional element is used, by peeling off the protective film during use. output.

On the other hand, according to the method of the present invention, the above-mentioned functional component mounting module can be manufactured with an extremely simple process.

In particular, in the method of the present invention, if the dike is provided in the peripheral region of the functional element, or the dike is formed into a substantially ring shape, the liquid sealing resin can be reliably blocked around the functional element, and the functional element can be reliably sealed. The part other than the functional part of the component.

On the other hand, in the present invention, if the blocking portion is provided near the functional portion of the functional element, the sealing resin can be reliably blocked near the functional portion, thereby improving product quality and yield.

At this time, if a blocking portion is provided around the functional portion of the functional element, or the embankment portion is formed into a substantially annular shape, the liquid sealing resin can be reliably blocked around the functional portion, and the area other than the functional portion can be reliably sealed. part.

In addition, if the blocking portion is formed as a dike portion protruding from the functional element, it can be applied to a module whose functional portion does not want to be shielded from light by the blocking material, such as a light receiving element.

Furthermore, when the blocking portion is a groove portion formed by a protective film provided on the functional element, the functional portion can be protected by the protective film to prevent adhesion of foreign matter.

According to the present invention, short-wavelength light such as blue-violet laser light can be reliably input and output without attenuation without using expensive glass with a special coating.

In addition, according to the present invention, it is possible to provide a very compact functional component mounting module which is excellent in heat dissipation.

Description of drawings

1( a ) to ( d ) are cross-sectional views showing an embodiment of a method of manufacturing an optical functional element mounting module according to the present invention.

Fig. 2 is a cross-sectional structural view showing an embodiment of the optical functional element mounting module of the present invention.

3( a ) to ( d ) are sectional structural views showing main parts of another embodiment of the present invention.

4( a ) to ( d ) are cross-sectional structural diagrams showing main parts of still another embodiment of the present invention.

5( a ) to ( d ) are cross-sectional structural views showing a manufacturing method of still another embodiment of the functional element mounting module of the present invention.

Fig. 6(a) is a sectional structural view of the functional element installation module, and Fig. 6 (b) is a top view showing the appearance structure of the functional element installation module before sealing.

7( a ) is a sectional structural view showing still another embodiment of the functional component mounting module of the present invention, and FIG. 7( b ) is a plan view showing the appearance structure of the functional component mounting module before sealing.

8( a ), ( b ) are sectional structural views showing still another embodiment of the functional element mounting module of the present invention.

Fig. 9 is a cross-sectional structural view showing still another embodiment of the functional element mounting module of the present invention.

Fig. 10 is a cross-sectional structure diagram of a conventional optical functional element installation module.

Symbol Description

1... Optical functional element mounting module; 2... Substrate; 3... Optical functional element (functional element); 4... Wiring pattern; 6... External connection terminal; 7... Embankment; 8... Sealing resin; ...the hole for light transmission (hole); 30...the light function part (function part)

Detailed ways

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

Fig. 1 (a) - (d) are the sectional structure diagrams showing the embodiment of the manufacturing method of the optical functional element mounting module as the example of the functional element mounting module of the present invention, Fig. 2 shows the structure of the optical functional element mounting module A cross-sectional structure diagram of an embodiment.

As shown in FIG. 1(a), in this embodiment, first, on the substrate 2 on which a predetermined wiring pattern 4 is formed, an optical function having an optical function part (functional part) 30, such as a light receiving element or a light emitting element, is mounted. Element (functional element)3.

In this embodiment, the connecting portion of the wiring pattern 4 on the substrate 2 and the connecting portion of the optical functional element 3 are electrically connected with gold wires 5 , and are drawn out from the external connection terminal 6 on the back side of the substrate 2 .

Then, the dike portion 7 for blocking the liquid sealing resin 8 is provided in the surrounding area of the optical functional element on the substrate 2 (for example, the edge portion of the substrate 2 ).

On the other hand, although the shape of the embankment 7 is not particularly limited, it is preferably formed in a ring shape (for example, a rectangle) from the viewpoint of reliably blocking the sealing resin 8 .

In addition, it is preferable to conditionally set the height of the embankment portion 7 so that its upper end portion becomes higher than the position of the upper end portion of the gold wire 5 when the package structural member 9 described later is pressed.

Next, as shown in FIG. 1( b ), a liquid sealing resin 8 is dripped between the optical functional element 3 and the embankment 7 to fill the space between the optical functional element 3 and the embankment 7 .

At this time, it is preferable that the sealing resin 8 does not reach the optical functional part 30 of the optical functional element 3 and that the top of the sealing resin 8 is substantially equal to the upper end of the embankment 7 .

In addition, in the case of the present invention, although the type of sealing resin 8 is not particularly limited, it is preferable to use an epoxy resin from the viewpoint of ensuring sealing quality.

Furthermore, as shown in FIG. 1( c ), the package structural member 9 is placed in contact with the embankment 7 , and the entirety is pressed toward the substrate 2 with a predetermined pressure.

This packaging structural member 9 is a plate-shaped member made of, for example, a printed wiring board, a plastic plate, etc., and for example, a hole portion (hole portion) for light transmission corresponding to the optical function portion 30 of the optical function element 3 is provided in its central part. 9a, the light transmission hole 9a is placed directly above the optical function part 30 and pressed.

Then, through this step, the sealing resin 8 is filled such that the surface (lower surface) of the package component 9 on the substrate 2 side is in contact with the sealing resin 8 and covers the portion other than the optical functional part 30 of the optical functional element 3 .

That is, although the sealing resin 8 filled between the optical functional element 3 and the embankment 7 spreads toward the light transmission hole 9a along the lower surface of the encapsulating structural member 9 by capillary phenomenon, the lower surface of the encapsulating structural member 9 In the minute gap (gap) between the optical functional element 3 , the edge portion of the light transmission hole 9 a is blocked by the surface tension of the sealing resin 8 , and is stopped so as not to enter the optical functional portion 30 .

In the case of the present invention, although the size of the light transmission peripheral hole 9a of the encapsulation structural member 9 is not particularly limited, if the inflow of the sealing resin 8 to the space 10 for light transmission is considered, it is preferable that the light of the optical functional element 3 The size of the light transmission hole 9a is set around the functional part 30 such that the distance from the optical functional part 30 is 100 to 800 μm, preferably 500 to 700 μm.

Also, from the same viewpoint, it is preferable to set the gap between the upper surface of the optical functional element 3 and the lower surface of the encapsulating component 9 to be 100 to 600 μm.

Furthermore, when a thermosetting resin is used as the sealing resin 8 , the sealing resin 8 is cured by heating at a predetermined temperature in this state, and the package component 9 is fixed to the substrate 2 .

Thereafter, as shown in FIG. 1( d ), by cutting along the scribe line 12 near the inner side of the jetty 7 , as shown in FIG. 2 , the optical functional element mounting module 1 as the target object is obtained.

As described above, in the optical functional element mounting module 1 of the present embodiment, since the optical functional part 30 of the optical functional element 3 is in an exposed state, it is possible to provide an optical functional element without using expensive glass with a special coating. An optical functional element mounting module 1 that reliably inputs and outputs short-wavelength light 11 such as blue-violet laser light without attenuation and is excellent in heat dissipation.

In addition, according to this embodiment, since a frame-shaped spacer is unnecessary, it is possible to provide a very small optical functional element mounting module 1 .

On the other hand, according to the method of this embodiment, the above-mentioned optical functional element mounting module 1 can be manufactured with extremely simple steps.

In particular, in this embodiment, since the ring-shaped embankment 7 is formed around the optical functional element 3, the liquid sealing resin 8 can be reliably blocked around the optical functional element 3, and the optical functional element 3 can be reliably sealed. The parts other than the optical functional part 30.

3( a ) to ( d ) are cross-sectional structural diagrams showing main parts of another embodiment of the present invention. Hereinafter, parts corresponding to the above-mentioned embodiment are assigned the same reference numerals and detailed description thereof will be omitted.

In the present embodiment, first, as in the above-mentioned embodiment, a functional element 3A having a predetermined functional portion 30A is mounted on the substrate 2 on which a predetermined wiring pattern 4 is formed, and between the functional element 3A and the embankment portion 7 A liquid sealing resin 8 is dripped to fill the space between the functional element 3A and the above-mentioned embankment 7 .

Then, as shown in FIG. 3( a ), the package component 9 is placed in contact with the embankment 7 , and the entirety is pressed toward the substrate 2 with a predetermined pressure.

Furthermore, as shown in FIG. 3( b ), for example, a plate-shaped protective covering member 13 is bonded to the package structural member 9 with an adhesive, so as to cover the functional portion exposure hole 9A. Thus, the functional portion exposure space 10A is formed above the functional portion 30A of the functional element 3A.

In the case of the present invention, for example, a glass substrate or a resin substrate can be used as the protective cover member 13 . When the functional element 3A is an optical functional element such as a light-emitting element or a light-receiving element, for example, a light-transmitting glass substrate can be used.

On the other hand, in the present embodiment, a groove portion is formed in a portion of the protective cover member 13 that faces the encapsulation member 9 , thereby providing and functioning between the encapsulation member 9 and the protective cover member 13 . Exhaust ports 14 communicated with the space 10A are exposed.

Then, as shown in FIG.3(c), (d), similarly to the above-mentioned embodiment, it cuts along the scribe line 12 near the inside of the embankment part 7, and obtains the target functional element mounting module 1A. In addition, in this embodiment, after bonding the protective covering member 13, the pressing of the above-mentioned sealing member 9 may be performed.

As described above, according to this embodiment, in addition to the same effect as the above-mentioned embodiment, since the protective cover member 13 covering the function portion exposure hole 9A is provided on the package component 9, it is also possible to prevent foreign matter from adhering to the function portion. On the functional part 30A of the component 3A.

In addition, in the present embodiment, since the exhaust port 14 communicating with the functional portion exposure space 10A is provided between the package structure member 9 and the protective cover member 13, the functional portion exposure space 10A will be closed during welding. The expanded gas (air) escapes through the exhaust port 14, so that the welding resistance can be improved. In addition, by providing the exhaust port 14, dew condensation in the functional part exposure space 10A can also be prevented.

The other configurations and effects are the same as those of the above-mentioned embodiment, so detailed description thereof will be omitted.

4( a ) to ( d ) are cross-sectional structural diagrams showing main parts of still another embodiment of the present invention. Hereinafter, parts corresponding to the above-mentioned embodiment are given the same reference numerals and detailed description thereof will be omitted.

In the present embodiment, first, as in the above-mentioned embodiment, a functional element 3A having a predetermined functional portion 30A is mounted on the substrate 2 on which a predetermined wiring pattern 4 is formed, and a gap between the functional element 3A and the embankment portion 7 is formed. Liquid sealing resin 8 is dripped between the functional elements 3A and the above-mentioned embankment portion 7 to fill the sealing resin 8 .

Then, as shown in FIG. 4( a ), the package component 9 is placed in contact with the embankment 7 , and the entirety is pressed toward the substrate 2 with a predetermined pressure.

Furthermore, as shown in FIG. 4( b ), a protective film 15 made of, for example, a resin material is bonded to the package component 9 with an adhesive, so as to cover the functional portion exposure hole 9A. Thus, the functional portion exposure space 10A is formed above the functional portion 30A of the functional element 3A.

At this time, the adhesive used for bonding the protective film 15 may be an adhesive having a weak adhesive force and capable of peeling the protective film 15 from the package structural member 9 .

Thereafter, as shown in FIG. 4( d ), similarly to the above-mentioned embodiment, cutting is performed along the scribe line 12 near the inner side of the jetty 7 to obtain the target functional element mounting module 1B.

As described above, according to this embodiment, in addition to the same effect as the above-mentioned embodiment, since the protective film 15 covering the functional portion exposure hole 9A is provided on the package component 9, it is also possible to prevent foreign matter from adhering to the functional element 3A. on the functional part 30A.

Moreover, in this embodiment, since the protective film 15 that can be peeled off from the package structural member 9 is used, by peeling off the protective film 15 (refer to FIG. Input and output optical signals without attenuation under certain conditions.

5( a ) to ( d ) are cross-sectional structural views showing a manufacturing method of still another embodiment of the functional element mounting module of the present invention.

In addition, FIG. 6( a ) is a sectional structural view of the functional component mounting module, and FIG. 6( b ) is a plan view showing the appearance structure of the functional component mounting module before sealing.

Hereinafter, parts corresponding to the above-mentioned embodiment are assigned the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 5(a) and FIG. 6(a), (b), in this embodiment, as a predetermined functional element 3A, a blocking portion 31 for blocking the sealing resin 8 is provided near the functional portion 30A. functional elements.

In the case of the present invention, although the fabrication method of the barrier portion 31 is not particularly limited, it is preferable to use a material for forming a protective film (passivation film) such as polyamide imine) by a known photolithography method.

In addition, in the case of the present invention, although the size and shape of the blocking portion 31 are not particularly limited, if the inflow of the sealing resin 8 to the functional portion exposure space 10A is considered, it is preferable to expose the functional portion with the sealing structural member 9. It is formed so as to correspond to the shape of the hole portion 9A, for example, it is formed in a rectangular ring shape having substantially the same size as the function portion exposing hole portion 9A.

Specifically, it is preferable to set the size of the barrier portion 31 around the functional portion 30A of the functional element 3A such that the distance from the functional portion 30A is 100 to 800 μm, preferably 500 to 700 μm.

In addition, from the same point of view, it is preferable to set the width of the barrier portion 31 to 50 to 300 μm, the height to 1 to 50 μm, and the gap between the upper portion of the barrier portion 31 and the lower surface of the package structural member 9 to be 100 μm. ~500μm.

In this embodiment, as shown in Fig. 5 (a) and (b), similarly to the above-mentioned embodiment, the above-mentioned functional element 3A is mounted on the substrate 2 on which the predetermined wiring pattern 4 is formed, and the functional element 3A and the A liquid sealing resin 8 is dripped between the bank portions 7 to fill the space between the functional element 3A and the above-mentioned bank portion 7 with the sealing resin 8 .

Then, as shown in FIG. 5( c ), the package component 9 is placed in contact with the embankment 7 , and the entirety is pressed toward the substrate 2 with a predetermined pressure.

As a result, the sealing resin 8 spreads along the lower surface of the package structural member 9 toward the functional portion exposure hole 9A by capillary phenomenon, and the step between the edge portion of the functional portion exposure hole 9A and the stopper portion 31 on the functional element 3A The part is blocked by the surface tension, forms a stop state, and does not intrude into the functional part 30A.

Furthermore, when a thermosetting resin is used as the sealing resin 8 , the sealing resin 8 is cured by heating at a predetermined temperature in this state, and the package component 9 is fixed to the substrate 2 .

Thereafter, as shown in FIG. 5( d ), cutting is carried out along the scribe line 12 near the inner side of the jetty portion 7 to obtain the target functional element mounting module 1C as shown in FIG. 6( a ).

As described above, according to this embodiment, in addition to the same effect as the above-mentioned embodiment, since the blocking portion 31 is provided in the vicinity of the functional portion 30A of the functional element 3A, the sealing resin 8 can be reliably blocked in the vicinity of the functional portion 30A. , so as to improve product quality and increase yield.

Fig. 7 (a) is the sectional structure diagram showing another embodiment of the functional element mounting module of the present invention, Fig. 7 (b) is the top view showing the appearance structure of the functional element mounting module before sealing, below, with the above-mentioned The corresponding parts in the embodiments are denoted by the same symbols, and detailed description thereof will be omitted.

As shown in FIGS. 7( a ) and ( b ), in the functional component mounting module 1D of the present embodiment, as a predetermined functional component 3A, a groove portion for blocking the sealing resin 8 is provided near the functional portion 30A. (blocking portion) 32 functional elements.

In the case of the present invention, although the manufacturing method of the trench portion 32 is not particularly limited, from the viewpoint of following the existing general semiconductor process, it is preferable to use the region on and around the functional portion 30A of the functional element 3A to Protective films (passivation films) 33 and 34 are formed and manufactured by known photolithography.

In addition, in the case of the present invention, although the size and shape of the groove portion 32 are not particularly limited, if the inflow of the sealing resin 8 into the functional portion exposure space 10A is considered, it is preferable to use the same size as the functional portion of the sealing component 9. The hole 9A for exposure is formed so as to correspond to the shape of the hole 9A for exposure, for example, it is formed in the shape of a rectangular ring having substantially the same size as the hole 9A for exposing a functional part.

Specifically, it is preferable to set the size of the groove portion 32 around the functional portion 30A of the functional element 3A such that the distance from the functional portion 30A is 100 to 800 μm, preferably 500 to 700 μm.

Furthermore, from the same viewpoint, it is preferable to set the width of the groove portion 32 to 50 to 300 μm, the depth to 1 to 50 μm, and the gap between the upper part of the protective film and the lower surface of the package structural member 9 to be 100. ~500μm.

In addition, the functional component mounting module 1D of this embodiment can be manufactured by the same method as the embodiment shown in FIG. 5, for example.

As described above, according to this embodiment, in addition to the same effect as the above-mentioned embodiment, since the groove portion 32 is provided near the functional portion 30A of the functional element 3A, the sealing resin can be reliably blocked near the functional portion 30A. 8, so as to improve product quality and increase yield.

Fig. 8 (a), (b) and Fig. 9 are the cross-sectional structure diagrams showing still another embodiment of the functional element mounting module of the present invention, and hereinafter, the parts corresponding to the above-mentioned embodiment are denoted by the same symbols and their detailed descriptions are omitted. illustrate.

The functional component mounting module 1E shown in FIG. 8( a ) is a module in which the above-mentioned protective cover member 13 is provided on the packaging structure member 9 of the functional component mounting module 1C.

In addition, the functional component mounting module 1F shown in FIG. 8( b ) is a module in which the protective covering member 13 without the exhaust port 14 is provided on the packaging structural member 9 of the functional component mounting module 1C.

In these cases, the protective covering member 13 can be provided in the same manner as in the above-mentioned embodiment.

According to the present embodiment having such a structure, since the protective cover member 13 covering the functional portion exposure hole 9A is provided on the package component 9, foreign matter can be prevented from adhering to the functional portion 30A of the functional element 3A. The other configurations and effects are the same as those of the above-mentioned embodiment, so detailed description thereof will be omitted.

On the other hand, a functional component mounting module 1G shown in FIG. 9 is a module in which the above-mentioned peelable protective film 15 is provided on the package component 9 of the functional component mounting module 1D.

At this time, the protective film 15 can be provided by the same method as in the above-mentioned embodiment.

According to this embodiment having such a structure, since the functional part 3A is covered with the protective film 33, even when the protective film 15 is peeled off during use, foreign matter can be prevented from adhering to the functional part 30A of the functional element 3A. The other configurations and effects are the same as those of the above-mentioned embodiment, so detailed description thereof will be omitted.

In addition, this invention is not limited to the said embodiment, Various changes are possible.

For example, in the above-mentioned embodiment, although the embankment is formed in a ring shape, it may be formed in another shape as long as it can reliably block the liquid sealing resin.

In addition, in the present invention, an electron beam (for example, ultraviolet) curable resin may be used as the sealing resin, which is cured by an electron beam. At this time, the encapsulating member 9 is made of a light-transmitting material, and electron beams are irradiated onto the encapsulating resin through the encapsulating member 9 .

Furthermore, the present invention is applicable not only to optical functional element mounting modules, but also to various MEMS (Micro Electro Mechanical System: Micro Electro Mechanical System) parts.

In addition, the present invention can be configured by arbitrarily combining the above-described embodiments.

Claims (17)

1. A functional element installation module, which has: A substrate formed with a prescribed wiring pattern; The specified functional elements mounted on the above-mentioned substrate; and A packaging structural component having a through-hole portion corresponding to the functional portion of the above-mentioned functional element, The through-hole portion of the package structural component is disposed opposite to the functional portion via a space portion immediately above the functional portion of the functional element, The sealing resin filled between the substrate and the encapsulation component is cured in a state where the edge of the through-hole portion of the encapsulation component is blocked while covering the portion other than the exposed functional portion of the functional element. , so that the package structure component is fixed on the substrate. 2. The functional component mounting module according to claim 1, wherein the functional component is electrically connected to the wiring pattern of the substrate by wire bonding. 3. The functional component mounting module according to claim 1, wherein a protective cover member covering the hole of the package component is provided on the package component. 4. The functional component mounting module according to claim 3, wherein an exhaust port communicating with a space for exposing a functional portion is provided between the encapsulation member and the protective cover member. 5. The functional element mounting module according to claim 3, wherein the protective cover member is a protective film that can be peeled off from the package member. 6. The functional component mounting module according to claim 1, wherein the functional component is an optical functional component. 7. The functional component mounting module according to claim 1, wherein a blocking portion for blocking the sealing resin is provided near the functional portion of the functional component. 8. The functional element installation module according to claim 7, wherein the above-mentioned blocking portion is provided in a surrounding area of the functional portion of the functional element. 9. The functional element mounting module according to claim 8, wherein the blocking portion is formed in a substantially ring shape. 10. The functional element mounting module according to claim 7, wherein the blocking portion is a dike formed to protrude from the functional element. 11. The functional element mounting module according to claim 7, wherein the blocking portion is a groove portion formed by a protective film provided on the functional element. 12. A method of manufacturing a functional component installation module, which has the following steps: On a substrate on which a predetermined wiring pattern is formed and a predetermined functional element is mounted, a dike portion for blocking liquid sealing resin is provided near the above-mentioned functional element; dripping a liquid sealing resin between the functional element and the embankment to fill the space between the functional element and the embankment; A packaging structure component having a hole corresponding to the functional part of the functional element is brought into contact with the embankment in a state where the hole is opposed to the functional part of the functional element, thereby making the packaging structure Parts are in contact with the above-mentioned liquid sealing resin; curing the above-mentioned liquid sealing resin, so as to fix the above-mentioned packaging structural components on the above-mentioned substrate; and The above-mentioned jetty portion is removed. 13. The method of manufacturing a functional element mounting module according to claim 12, wherein the embankment is provided in a surrounding area of the functional element. 14. The method of manufacturing a functional element mounting module according to claim 13, wherein the embankment is formed in a substantially annular shape. 15. The method of manufacturing a functional component mounting module according to claim 12, wherein the functional component is an optical functional component. 16. The method of manufacturing a functional component mounting module according to claim 12, wherein a functional component having a blocking portion for blocking the sealing resin near the functional portion is used as the functional component. 17. The method of manufacturing a functional element mounted module according to claim 12, further comprising a step of providing a protective cover member covering the hole of the package component on the package component.

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