CN101080120B - Light emitting device and method for manufacturing the same - Google Patents

Abstract

A light emitting device and a method of manufacturing the same, wherein the method of manufacturing includes: first, at least one circuit board is provided. The circuit board is provided with a plurality of light-emitting packaging parts, a first pending power input end and a second pending power input end. The light emitting packages are electrically connected with the first and second pending power input terminals. The first and second pending power input ends each have at least two first pads. The two first bonding pads of the first to-be-determined power input end and the second to-be-determined power input end are mutually and electrically isolated. Then, the first to-be-determined power input terminal is selected as a power input area for inputting an external power signal. Then, the two first pads of the second pending power input terminal are electrically connected. The invention utilizes the design of the first and second undetermined power input ends of the circuit board to ensure that the light-emitting device with the circuit board has flexibility when being applied. In addition, the number of the circuit boards arranged on the connecting plates is not limited to an even number, so that the manufacturing cost of the light-emitting device is saved.

Description

Light emitting device and manufacturing method thereof

technical field

The present invention relates to a light emitting device and a manufacturing method thereof, and particularly relates to a light emitting device with a light source arranged on a circuit board and a manufacturing method thereof.

Background technique

Generally speaking, if a backlight module uses a light emitting diode (LED) element as a light source, the LED element is welded on a single circuit board to form a lighting bar. The light strip cooperates with other optical components and is arranged in the backlight module. The backlight module is divided into an edge type backlight module and a direct type backlight module according to the light emitting surface of the light source.

Taking the edge-lit backlight module as an example, in order to facilitate the assembly and operation of the backlight module, the power lines for inputting external power are arranged on the same side of the backlight module. In this way, the single circuit board that is soldered to the LED components needs to have two forms. Although the design of the continuous layout can be used to complete different forms of circuit board monomers on the same continuous layout. However, the number of single circuit boards provided on the serial plate is limited to an even number, which will increase the manufacturing cost.

In addition, if the LED element includes chips of three colors of red, green and blue, the arrangement of the chips of the three colors in the same LED element is the same. Please refer to FIG. 1 , which depicts a schematic diagram of a direct-type backlight module. The direct type backlight module 100 includes a plurality of circuit board units 110 . Each single circuit board 110 has a plurality of LED elements 111 of the same type. The LED element 111 is used as a light source of the direct type backlight module 100 .

Since the LED elements 111 are of the same form, the arrangement of the chips of each color of the LED element 111 is the same, which are the red chip 112 , the green chip 113 and the blue chip 114 in sequence. However, as shown in FIG. 1 , this arrangement tends to cause a certain color to be too concentrated in a certain direction.

In this way, when the direct-lit backlight module 100 is used, it will produce multiple color bands with concentrated colors, which will affect the display effect. Although this situation can be avoided by designing different forms of circuit board monomers. However, different printed circuit boards on the same serial board are also limited to the above-mentioned situation that the number of printed circuit boards must be an even number.

Contents of the invention

In view of the deficiency of the above-mentioned prior art, the present invention is proposed.

The present invention relates to a light emitting device and its manufacturing method, which utilizes the design of two undetermined power input ends of a circuit board, so that the light emitting device with the circuit board has flexibility in application.

According to a first aspect of the present invention, a method for manufacturing a light emitting device is proposed, the method includes: firstly, in step a, at least one circuit board is provided. The circuit board is provided with a plurality of light emitting packages (210), a first pending power input terminal (231) and a second pending power input terminal (232). These light-emitting packages are electrically connected to the first and second undetermined power input terminals. Each of the first and second undetermined power input terminals has at least two first pads. The first pads (231a, 231b) of the first pending power input are electrically isolated from each other, and the first pads (232a, 232b) of the second pending power input are electrically isolated from each other. Then in step b, select the first undetermined power input end as the power input area for inputting the external power signal. Then in step c, electrically connect the two first pads of the second undetermined power input end.

The above-mentioned manufacturing method, wherein after the step c, the manufacturing method further includes providing a connector electrically connected to the first pad (232a, 232b) of the power input area for inputting the external power signal.

The above-mentioned manufacturing method, wherein after the step c, the manufacturing method further includes arranging at least one bonding wire electrically connected to the first pad of the power input area for inputting the external power signal.

The manufacturing method above, wherein the electrical connection in step c is to electrically connect the first pad of the second undetermined power input terminal by using at least one piece of solder or at least one resistor, wherein the resistor has a resistance value of 0 ohms.

The above-mentioned manufacturing method, wherein the step a includes disposing an internal circuit on the circuit board, the internal circuit is electrically connected to the first and second undetermined power input terminals, and the internal circuit has a plurality of second pads, The second pad is electrically connected to the light emitting package.

According to the above-mentioned manufacturing method, wherein each of the light-emitting packages has at least one light-emitting chip, and the circuit board has a long-side direction and a short-side direction, the first pad in step a of the manufacturing method is: A plurality of first pads are arranged on the first and second undetermined power input ends along the short side direction, wherein the number of first pads of the first and second undetermined power input ends is respectively the number of the light-emitting chip type double.

In the above-mentioned manufacturing method, wherein the light-emitting package includes light-emitting chips of three colors, step a of the manufacturing method further includes: arranging the light-emitting package on the circuit board along the direction of the long side, so that each The light-emitting chips of the three colors in a light-emitting package are arranged in a predetermined order along the direction of the short side.

The above-mentioned manufacturing method, wherein the light-emitting device includes a plurality of circuit boards, each of which has a long-side direction and a short-side direction, and the manufacturing method includes: arranging the circuits in parallel along the short-side direction board; wherein, the light-emitting device is used to provide a direct-type backlight source.

According to a second aspect of the present invention, a light emitting device is provided. The light emitting device is arranged in the display device. The light emitting device includes a plurality of light emitting packages and at least one circuit board. These light emitting packages are arranged on the circuit board. The circuit board includes a first pending power input terminal and a second pending power input terminal. The first and second undetermined power input terminals are respectively located at two ends of the circuit board. The first and second undetermined power input terminals are connected in series with the light emitting packages. Each of the first and second undetermined power input terminals has at least two first pads. The first undetermined power input end is a power input area, and the two first pads of the second undetermined power input end are electrically connected to each other.

The above-mentioned light emitting device, wherein the light emitting device further includes: a connector disposed on the power input area and electrically connected to the first pad of the power input area.

The above-mentioned light emitting device, wherein the light emitting device further includes: at least one bonding wire disposed on the power input area and electrically connected to the first pad of the power input area.

The light-emitting device above, wherein the first pads of the second undetermined power input end are electrically connected to each other through at least one piece of solder or at least one resistor, and are electrically connected to the first pads of the second undetermined power input end, wherein the resistor's The resistance value is 0 ohms.

The above-mentioned light-emitting device, wherein the circuit board further includes: an internal circuit, connecting the light-emitting package in series to the first and second undetermined power input terminals; and a plurality of second pads, disposed on the internal circuit wherein, the second pad is electrically connected to the light emitting package.

The above-mentioned light emitting device, wherein the light emitting device includes a plurality of said circuit boards, each of which has a long side direction and a short side direction, and said circuit boards are arranged in parallel along the short side direction, wherein the light emitting The device is used to provide a direct-type backlight source.

The above-mentioned light-emitting device, wherein the circuit board has a long-side direction and a short-side direction, each of the light-emitting packages has at least one light-emitting chip, and each of the first and second undetermined power input terminals has a plurality of first Welding pads, the first welding pads are arranged along the short side direction, and the number of first welding pads of the first and second undetermined power input ends is respectively twice the type of the light emitting chip.

The above-mentioned light-emitting device, wherein the light-emitting packages are arranged along the long-side direction and each has light-emitting chips of three colors, and the light-emitting chips of three colors are arranged in a predetermined order along the short-side direction.

The above light emitting device, wherein the light emitting chip is a light emitting diode chip.

The invention makes use of the design of the first and second undetermined power input ends of the circuit board, so that the light emitting device with the circuit board has flexibility in application. In addition, the number of circuit boards disposed on the continuous plate may not be limited to an even number, so as to save the manufacturing cost of the light emitting device.

In order to make the above content of the present invention more comprehensible, preferred embodiments are specifically cited below, together with the accompanying drawings, and described in detail as follows.

Description of drawings

FIG. 1 shows a schematic diagram of a direct type backlight module.

FIG. 2 shows a flowchart of a method for manufacturing a light emitting device according to the invention.

3A to 3C are schematic flow charts showing the manufacturing method of the light emitting device of FIG. 2 .

Fig. 4 shows a flowchart of a method of manufacturing a light emitting device according to a second embodiment of the present invention.

Fig. 5 shows a schematic diagram of a light emitting device according to a second embodiment of the present invention.

Wherein, the reference signs are explained as follows:

100: direct type backlight module 110: single circuit board

111: LED component 112: Red chip

113: Green chip 114: Blue chip

200, 200': Lighting device

210, 210': light emitting package

211, 211R, 211G, 211B: Light-emitting chips

230, 230a, 230b, 230c, 230d: circuit boards

231, 231': the first power input terminal to be determined

232, 232': the second power input terminal to be determined

231a, 231b, 232a, 232b: first pads

233, 233’: Power input area

235': internal wiring

237': The second pad

240': Connector

242': Solder

D1, D1': Long side direction

D2, D2': short side direction

Detailed ways

first embodiment

Please refer to FIG. 2 and FIG. 3A to FIG. 3C at the same time. FIG. 2 shows a flow chart of the manufacturing method of the light emitting device according to the present invention, and FIGS. 3A to 3C show a schematic flow chart of the manufacturing method of the light emitting device in FIG. 2 .

First, as shown in FIG. 2 and FIG. 3A , in step 301 , a circuit board 230 is provided. The circuit board 230 is provided with a plurality of light emitting packages 210 , a first pending power input terminal 231 and a second pending power input terminal 232 . The first pending power input terminal 231 and the second pending power input terminal 232 are located at two ends of the circuit board 230 respectively. The light emitting packages 210 are electrically connected to the first pending power input terminal 231 and the second pending power input terminal 232 . The first pending power input terminal 231 has two first pads 231a and 231b, and the second pending power input terminal 232 has two first pads 232a and 232b. The first pad 231a and the first pad 231b are electrically isolated from each other, and the first pad 232a and the first pad 232b are electrically isolated from each other.

Next, as shown in FIG. 2 and FIG. 3B , in step 303 , the first undetermined power input terminal 231 is selected as the power input region 233 for inputting an external power signal. In this embodiment, the first undetermined power input end 231 is selected as the power input area 233 . However, step 303 may also select the second undetermined power input end 232 as the power input area 233 , depending on the needs of the user.

Then, as shown in FIG. 2 and FIG. 3C , in step 305 , the two first pads 232 a and 232 b of the second undetermined power input terminal 232 are electrically connected. In this embodiment, since the first undetermined power input terminal 231 is selected as the power input area 233 in step 303 , the two first pads 232 a and 232 b of the second undetermined power input terminal 232 are electrically connected in step 305 . Through the above steps, the light emitting device 200 of this embodiment can be formed. As for the external power signal, it is input to each light emitting package 210 through the first pads 231 a and 231 b of the power input area 233 .

In this embodiment, the light-emitting device and its manufacturing method utilize the design of the first and second undetermined power input terminals on both sides of the circuit board, so that the user can select one of the first and second undetermined power input terminals as the input according to the requirement. Power input area for external power supply signals. The first pads of the other one of the first and second undetermined power input ends are electrically connected to each other to form a loop on the circuit board. In this way, the application of the light emitting device is more flexible.

In this embodiment, as shown in FIG. 3C , each of the plurality of light emitting packages 210 has a kind of light emitting chip 211 . The light emitting chip 211 is, for example, a light emitting diode (light emitting diode, LED) chip. The circuit board 230 has a long side direction D1 and a short side direction D2. In this embodiment, the first pads of the first and second undetermined power input terminals are arranged along the short side direction. That is to say, as shown in FIG. 3C, the first pads 231a and 231b of the first undetermined power input end 231 are arranged along the short side direction D2, and the first pads 232a and 232b of the second undetermined power input end 232 are also arranged. Arranged along the short side direction D2.

In addition, in this embodiment, the numbers of the first bonding pads of the first and second undetermined power input terminals are respectively twice of the types of the light-emitting chips. Since the light emitting package 210 has only one kind of light emitting chip 211 , the first pending power input terminal 231 has two first pads 231 a and 231 b. In addition, the second pending power input terminal 232 also has two first pads 232a and 232b.

second embodiment

Please refer to FIG. 4 , which shows a flowchart of a method for manufacturing a light emitting device according to a second embodiment of the present invention. Compared with the flowchart in FIG. 2 , the flowchart in FIG. 4 further includes step 401 , step 403 and step 409 . Step 405 and step 407 in FIG. 4 are the same as steps 301 to 305 in FIG. 2 respectively, so these steps will not be described repeatedly.

Please also refer to FIG. 5 , which shows a schematic diagram of a light emitting device according to a second embodiment of the present invention. In FIG. 5 , in order to make the drawing more concise, the same elements are only labeled representatively. The difference between this embodiment and the first embodiment is that the light emitting device 200' has a plurality of circuit boards 230a, 230b, 230c and 230d, and the light emitting package 210' of each circuit board 230a, 230b, 230c and 230d has three different types. The color light-emitting chips are, for example, a red light-emitting chip 211R, a green light-emitting chip 211G, and a blue light-emitting chip 211B.

As shown in FIG. 4 and FIG. 5, in step 401, an internal circuit 235' is arranged on each circuit board 230a, 230b, 230c and 230d, and along the short side direction of each circuit board 230a, 230b, 230c and 230d D2' disposes a plurality of first pads on each of the first undetermined power input end 231' and the second undetermined power input end 232'. The internal wiring 235' has a plurality of second pads 237'. The second pad 237' is electrically connected to the light emitting package 210'. In this embodiment, the number of the first pads of each of the first and second undetermined power input terminals is twice the type of the light emitting chip. There are three types of light-emitting chips in this embodiment, so the number of the first bonding pads of each of the first and second undetermined power input ends is six.

Next, in step 403, the light-emitting packages 210' are arranged on the circuit boards 230a, 230b, 230c, and 230d along the longitudinal direction D1' of each circuit board 230a, 230b, 230c, and 230d, so that each light-emitting package The light emitting chips 211R, 211G and 211B of three colors in 210' are arranged in a predetermined order along the short side direction D2'. Step 405 and Step 407 follow in sequence after Step 403 . As mentioned above, since step 405 and step 407 are the same as step 301 to step 305 in FIG. 2 , the description of this part will not be repeated.

In this embodiment, in step 405, the first undetermined power input terminal 231' of the circuit boards 230a and 230d is selected as the power input area 233', and the second undetermined power input terminal 232' of the circuit boards 230b and 230c is selected as the power input area 233'. Input field 233'. Therefore, in step 407, the first pads of the second undetermined power input terminals 232' of the circuit boards 230a and 230d are electrically connected respectively, and the first pads of the first undetermined power input terminals 231' of the circuit boards 230b and 230c are respectively electrically connected. pad. In this way, through the design of the first and second undetermined power input terminals of each circuit board, the arrangement of the circuit boards can be determined according to the needs of users.

In this embodiment, step 407 uses at least one solder 242' to electrically connect the first pads of the second undetermined power input terminals 232' of the circuit boards 230a and 230d, and the first undetermined power input terminals 231 of the circuit boards 230b and 230c 'The first pad. However, a resistor with a resistance value of 0 ohms can also be used to electrically connect the first pad of the first undetermined power input end 231' or the second undetermined power input end 232', depending on the needs of users.

Then, in step 409, the connector 240' is set to be electrically connected to the first pad of the power input area 233' for inputting an external power signal. However, in this embodiment, at least one bonding wire (not shown) may be provided in step 409 to electrically connect the first pad of the power input area 233' for inputting an external power signal.

In this way, the light emitting device 200' can be used to provide a direct-lit backlight source.

In this embodiment, although in step 405, the first undetermined power input terminals 231' of the circuit boards 230a and 230d are selected as the power input area 233', and the second undetermined power input terminals 232' of the circuit boards 230b and 230c are selected as the power input area 233'. The power input area 233', however, the selection of the power input area is not limited. In this way, not only the flexibility of circuit board application can be increased, but the light emitting device 200' can also use the design of the first and second undetermined power input terminals to alternately arrange the circuit boards, so as to reduce the situation that a certain color is too concentrated in a certain direction.

The light-emitting device and its manufacturing method disclosed in the above-mentioned embodiments of the present invention utilize the design of the first and second undetermined power input ends of the circuit board, so that the light-emitting device with the circuit board has flexibility in application. In addition, the number of circuit boards disposed on the continuous plate may not be limited to an even number, so as to save the manufacturing cost of the light emitting device.

In summary, although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Various changes and modifications may be made by those skilled in the art to which the present invention belongs without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined by the appended claims.

Claims (17)

1. A method for manufacturing a light emitting device, comprising: Step a, providing at least one circuit board, wherein: The circuit board is provided with a plurality of light-emitting packages (210), a first pending power input terminal (231) and a second pending power input terminal (232), The light-emitting package is electrically connected to the first and second undetermined power input terminals, each of the first and second undetermined power input terminals has at least two first pads, and the first pad of the first undetermined power input terminal a pad (231a, 231b) is electrically isolated from each other, and the first pads (232a, 232b) of the second undetermined power input end are electrically isolated from each other; Step b, selecting the first undetermined power input terminal as a power input area for inputting external power signals; and Step c, electrically connecting the first pads (232a, 232b) of the second undetermined power input end. 2. The manufacturing method according to claim 1, wherein after the step c, the manufacturing method further comprises: A connector is provided to be electrically connected to the first pad of the power input area for inputting the external power signal. 3. The manufacturing method according to claim 1, wherein after the step c, the manufacturing method further comprises: At least one welding wire is provided to be electrically connected to the first pad of the power input area for inputting the external power supply signal. 4. The manufacturing method as claimed in claim 1, wherein said electrical connection in said step c is to utilize at least one piece of solder or at least one resistor to electrically connect the first pad of the second undetermined power input end, wherein the resistance of the resistor is The value is 0 ohms. 5. The manufacturing method as claimed in claim 1, wherein the step a comprises: An internal circuit is arranged on the circuit board, the internal circuit is electrically connected to the first and second undetermined power input terminals, and the internal circuit is electrically connected in series with the light-emitting package, and the internal circuit has a plurality of second solder joints. pad, and the second solder pad is electrically connected to the light emitting package. 6. The manufacturing method according to claim 1, wherein each of the light-emitting packages has at least one light-emitting chip, and the circuit board has a long-side direction and a short-side direction, wherein: The first pad described in step a of the manufacturing method is: A plurality of first pads are arranged on the first and second undetermined power input terminals along the short side direction, wherein the number of the first pads of the first and second undetermined power input terminals is respectively the type of the light-emitting chip twice as much. 7. The manufacturing method according to claim 6, wherein the light-emitting package comprises light-emitting chips of three colors, step a of the manufacturing method further comprises: The light-emitting packages are arranged on the circuit board along the long-side direction, so that the three-color light-emitting chips in each light-emitting package are arranged in a predetermined order along the short-side direction. 8. The manufacturing method according to claim 1, wherein the light-emitting device comprises a plurality of circuit boards, each of which has a long-side direction and a short-side direction, the manufacturing method comprising: The circuit boards are arranged in parallel along the short side direction; Wherein, the light-emitting device is used to provide a direct-type backlight source. 9. A light emitting device arranged in a display device, the light emitting device comprising: a plurality of light emitting packages each having at least one light emitting chip; and At least one circuit board, the light-emitting package is arranged on the circuit board, and the circuit board includes a first pending power input terminal and a second pending power input terminal, the first and second pending power input terminals are respectively located on the Both ends of the circuit board, the first and second undetermined power input terminals are connected in series with the light-emitting package, each of the first and second undetermined power input terminals has at least two first pads, and the first The undetermined power input end is a power input area, and the first pads of the second undetermined power input end are electrically connected to each other, wherein the numbers of the first pads of the first and second undetermined power input ends are respectively the types of the light-emitting chips twice as much. 10. The light emitting device of claim 9, wherein the light emitting device further comprises: The connector is arranged in the power input area and electrically connected with the first pad of the power input area. 11. The light emitting device of claim 9, wherein the light emitting device further comprises: At least one welding wire is arranged in the power input area and electrically connected with the first pad of the power input area. 12. The light-emitting device according to claim 9, wherein the first pads of the second undetermined power input end are electrically connected to each other through at least one piece of solder or at least one resistor, and are electrically connected to the first pads of the second undetermined power input end , wherein the resistance value of the resistor is 0 ohms. 13. The lighting device of claim 9, wherein the circuit board further comprises: an internal circuit connecting the light-emitting package in series to the first and second undetermined power input terminals; and A plurality of second welding pads are arranged in the internal circuit, and the second welding pads are electrically connected with the light emitting package. 14. The light-emitting device according to claim 9, wherein the light-emitting device comprises a plurality of circuit boards, each of which has a long-side direction and a short-side direction, and the circuit boards are arranged in parallel along the short-side direction Setting, wherein the light-emitting device is used to provide a direct-type backlight source. 15. The light-emitting device according to claim 9, wherein the circuit board has a long side direction and a short side direction, each of the first and second undetermined power input ends has a plurality of first solder pads, and the first solder pads The disks are arranged along the short side direction. 16. The light-emitting device according to claim 15, wherein the light-emitting packages are arranged along the long-side direction and each has light-emitting chips of three colors, and the light-emitting chips of three colors are arranged in a predetermined order along the short-side direction in order. 17. The light emitting device as claimed in claim 15, wherein the light emitting chip is a light emitting diode chip.

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