CN101207998A - Heat conducting plate structure and auxiliary tool for dismounting heat conducting plate - Google Patents

Abstract

The invention discloses a heat conducting plate structure and an assistant tool for removing the heat conducting plate, wherein the assistant tool is fixedly arranged on a circuit board and is contacted with a chip for heat exchange, the heat conducting plate structure comprises a heat conducting plate body and at least one buffer piece, the heat conducting plate body is provided with a plurality of fixing points which can be fixedly arranged on the circuit board, the fixing points are positioned outside the contact area of the heat conducting plate body and the chip, the buffer piece is arranged outside the contact area of the heat conducting plate body and the chip, and the height of the buffer piece is equal to the distance between the heat conducting plate body and the circuit board, so that when the heat conducting plate is removed, the buffer piece can reduce the acting force of the heat.

Description

Heat conduction plate structure and auxiliary equipment for dismantling heat conduction plate

technical field

The invention relates to a structure of a heat conducting plate, in particular to a structure of a heat conducting plate that can provide a balanced buffer force.

Background technique

Electronic components such as central processing unit chips and power integrated circuits in computer equipment will generate heat when performing calculations, and the operating temperature will also increase accordingly. Since the operating temperature has a great impact on whether the computer equipment crashes, in order to reduce heat generation To maintain the working temperature of electronic components and maintain effective operation, various heat dissipation devices are designed through heat dissipation design, such as pressing the heat dissipation module on the central processing unit chip on the circuit board and locking it to the circuit board so that the heat dissipation module can In close contact with the central processing unit chip to achieve the purpose of heat dissipation.

Referring to FIG. 1 and FIG. 2 , generally speaking, there are usually a plurality of corresponding screw holes between the circuit board 10 a and the heat dissipation module 30 a. The assembler can use the locking member 50a to tightly lock the heat dissipation module 30a on the circuit board 10a. Based on wiring, electrical or mechanical considerations, the circuit board 10a provides at least three screw holes, wherein the connection of the three screw holes forms a triangular configuration area, and the central processing unit chip 20a is located in the configuration area.

However, when the user wants to remove the heat dissipation module 30a from the circuit board 10a, one of the locking elements 50a must be loosened first. At this time, the other two locking elements are still locked and have internal stress during locking. Therefore, the loose end of the heat dissipation module 30a (as shown in FIG. 2 ) will be tilted, and the central processing unit chip 20a will be pressed against the unloose locking element 50a. In more detail, when the user loosens the first locking part 50a, one end of the heat dissipation module 30a is no longer subjected to the stress of the locking part 50a and becomes warped, but the remaining two ends of the heat dissipation module 30a are still subject to the locking part. 50a is fixed on the circuit board 10a due to the stress of 50a, and the outer part of the contact area between the cooling module 30a and the central processing unit chip 20a will press against the central processing unit chip 20a, and even cause the central processing unit chip 20a to be crushed.

Another example is U.S. Patent Publication No. US2004/0188079 (hereinafter referred to as the 079 case) which proposes a cooling module applied to notebook computer chips, as shown in Figure 2 of the 079 case, wherein a plurality of elastic materials The formed gasket is arranged under the base platform relative to the plurality of fixing holes. When assembling the heat dissipation module, the base platform is fixed above the surface of the chip by using multiple fixing holes, and the contact surface is attached to the surface of the chip. Provide a balanced cushioning force. Although the 079 case has gaskets outside the contact area between the base platform and the chip to protect the chip from being crushed by the base platform during the assembly process, since each gasket is located on the line of the two fixing holes, it is not Set between the base platform and the fixing hole and the chip, when the assembler removes the screw locked on one end of the base platform to loosen the base platform, the loose end of the base platform will no longer be subjected to the stress of the locking piece And it is tilted, and the other end of the screw that has not been removed is still fixed on the circuit board by the stress of the screw, which will make the base platform between the fixing hole and the chip be directly pressed against the central processing unit chip, and the central processing unit There are still cases where the unit chip is crushed.

Looking at the conventional technology disclosed above, although the base platform is provided with a spacer, the spacer is not arranged between the fixing hole and the chip in the base platform, which makes the base platform directly press against the central processing unit at this part. The unit chip does not adequately protect the chip and is still not the best design for the thermal pad.

Contents of the invention

The technical problem to be solved by the present invention is to provide a heat dissipation module that can reliably protect chips.

In order to achieve the above object, the present invention discloses a heat conduction plate structure, which is fixed on a circuit board and contacts a heat source for heat exchange. The heat conduction plate structure includes a heat conduction plate body and at least one buffer member, wherein the heat conduction plate body has A plurality of fixed points are used to be fixed on the circuit board and contact the heat source, and each fixed point is located outside the contact area between the heat conduction plate body and the heat source. The buffer is arranged outside the contact area between the heat conduction plate and the heat source, and the height of the buffer is substantially equal to the distance between the heat conduction plate body and the circuit board.

The present invention further discloses an auxiliary tool for removing the heat conduction plate. The heat conduction plate is fixed on a circuit board and contacts a heat source interposed therebetween for heat exchange. The auxiliary tool includes a handle for the user to hold and two supports. arm with multiple bumpers. Wherein, each support arm extends from the operation part and passes through between the fixed position of the heat conduction plate and the heat source, and each buffer member is arranged on the support arm and is interposed between the support arm and the circuit board. The height of the buffer member is substantially equal to that of the support arm. Distance between arm and circuit board.

According to the structure of the heat conduction plate disclosed in the present invention and the auxiliary device for removing the heat conduction plate, when the user removes the first locking part on the heat conduction plate, the heat conduction plate is loosened and tilted up, and the other ends are still subject to the stress of the lock part However, since the buffer is set between the fixed point of the heat conduction plate and the heat source, the rest of the heat conduction plate will press against the buffer instead of the chip, so the buffer can Absorb the compressive force of the heat conduction plate to protect the chip from damage. In addition, the heat conduction plate can also be removed with an auxiliary tool equipped with a buffer, which can also absorb the force of the heat conduction plate pressing on the chip. In addition to being convenient for the user to operate, it can also reduce the chance of the chip being damaged when the heat conduction plate is removed. .

The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of claims and the drawings , any person skilled in the art can easily understand the related objects and advantages of the present invention.

Description of drawings

FIG. 1 is a schematic diagram of a rear view of a heat dissipation module assembled on a circuit board in the prior art;

FIG. 2 is a schematic side view of a disassembled heat dissipation module in the prior art;

Fig. 3 is an exploded view of the heat conducting plate structure assembled on the circuit board according to the embodiment of the present invention;

FIG. 4A is a combination diagram of the heat conduction plate structure assembled on the circuit board according to the embodiment of the present invention;

Fig. 4B is a schematic side view of the disassembled and assembled heat dissipation module according to the embodiment of the present invention;

FIG. 4C is a schematic back view of the square heat conducting plate body and the buffer member assembled on the circuit board according to the embodiment of the present invention;

5 is a schematic side view of another heat conducting plate structure assembled on a circuit board according to an embodiment of the present invention;

Fig. 6 is a three-dimensional appearance view of the auxiliary device for removing the heat conducting plate according to the embodiment of the present invention;

Fig. 7 is a schematic diagram of the back view of the assembly of the auxiliary device for removing the heat conduction plate between the circuit board and the heat conduction plate according to the embodiment of the present invention;

Fig. 8A is a schematic side view of the assembly of the auxiliary device for disassembling and assembling the heat conduction plate between the circuit board and the heat conduction plate according to the embodiment of the present invention;

Fig. 8B is a schematic back view of the aid for disassembling and assembling the heat conducting plate according to the embodiment of the present invention applied to a square heat conducting plate and each support arm is located outside the fixed position;

FIG. 9 is a schematic rear view of another auxiliary device for removing the heat conducting plate assembled between the circuit board and the heat conducting plate according to the embodiment of the present invention.

Among them, reference signs:

current technology

10a: Circuit board 20a: Central processing unit chip

30a: cooling module 50a: lock accessory

this invention

10: Circuit board 11: Fixing hole

20: Central processing unit chip 30: Heat conduction plate body

30': heat conduction plate 31: perforation

40, 40’, 73: buffer parts 50: lock accessories

60: Insulation block 70: Accessory

71: Handle 712: Guide groove

72: Support arm 722: Slider

74: Hollow part 75: Ring wall

76: positioning slot

Detailed ways

In order to have a further understanding of the purpose, structure, features, and functions of the present invention, the following detailed descriptions are provided in conjunction with the embodiments.

According to the structure of the heat conduction plate disclosed in the present invention and the auxiliary device for removing the heat conduction plate, the heat conduction plate is in contact with the heat source, wherein the heat source can be a central processing unit chip (Central Processing Unit, CPU), a North Bridge chip (North Bridge Chip) and a south bridge chip. Bridge chips (South Bridge Chip), etc., but not limited to central processing unit chips, North Bridge chips and South Bridge chips, such as integrated circuit chips that can generate heat can also apply the technology disclosed in the present invention, in the following the present invention In the detailed description, the central processing unit chip will be used as an application embodiment of the present invention.

Referring to FIG. 3, and referring to FIG. 4A and FIG. 4B together, the heat conduction plate structure of the embodiment of the present invention is fixed on the circuit board 10 and contacts the central processing unit chip 20 for heat exchange. The heat conduction plate structure includes a heat conduction plate The main body 30 and at least one buffer element 40 . The shape of the heat conduction plate body 30 is triangular here, and may also be other geometric shapes such as equisquare, regular polygon, etc., and is not limited to triangle. The heat conduction plate body 30 has a plurality of fixed points, each fixed point is located outside the contact area between the heat conduction plate body 30 and the central processing unit chip 20, and each fixed point is a perforation 31 that penetrates the heat conduction plate body 30 for supplying A plurality of locking parts 50 are passed through, and the locking parts 50 are, for example, screws, nuts and the like. And the circuit board 10 is provided with a plurality of fixing holes 11 corresponding to the perforations 31 of the heat conducting plate body 30. Correspondingly, a plurality of locking parts 50 are passed through so that the heat conducting plate body 30 is fixed on the circuit board 10 .

The buffer member 40 is arranged outside the contact area between the heat conduction plate body 30 and the central processing unit chip 20 . In addition, there is at least one buffer member 40 . When the heat conduction plate body 30 is to be disassembled from the circuit board 10 , it can be disassembled from the side opposite to the buffer member 40 to achieve a buffering effect. Here, the number of buffer members 40 is two, and when the heat conduction plate body 30 is to be disassembled from the circuit board 10 , one side of the heat conduction plate body 30 can be arbitrarily selected for disassembly. In addition, the buffer member 40 is an elastic element whose thickness is substantially equal to the distance between the heat conduction plate body 30 and the circuit board 10, and can be used to fill between the heat conduction plate body 30 and the circuit board 10, so that the two ends of the buffer member 40 are in contact with each other. To the heat conduction plate body 30 and the circuit board 10 . The buffer member 40 is, for example, a non-conductive elastic element such as bakelite or rubber spring, so that when the heat conduction plate body 30 is fixed on the circuit board 10 , the buffer member 40 normally has a force to push the heat conduction plate body 30 away.

Continue referring to Fig. 3, Fig. 4A and Fig. 4B, when assembling, make each through hole 31 correspond to each fixing hole 11, and each locking part 50 can pass through each through hole 31 and each fixing hole 11 together, to fix heat conduction The plate body 30 is on the circuit board 10, and each buffer member 40 is located between the heat conduction plate body 30 and the circuit board 10, and the heat conduction plate body 30 is attached to the top of the central processing unit chip 20, so the heat conduction plate body 30 can transfer the central processing unit The heat generated by the unit chip 20 is conducted to the heat transfer element, and the heat transfer element transfers the heat to the heat dissipation area for removal. When desiring to disassemble the heat conduction plate body 30 from the circuit board 10, the user can use a tool to dismantle the first lock attachment 50 to loosen the heat conduction plate body 30, the loose end of the heat conduction plate body 30 will no longer be locked by the lock attachment. 50 is tilted due to the stress of the lock part 50, and the other end of the lock part 50 that has not been removed is still fixed to the circuit board 10 by the stress of the lock part 50. The cushioning piece 40 makes the non-loose end of the heat conducting plate body 30 press against the cushioning piece 40, so that the cushioning piece 40 can absorb the pressing force of the heat conducting plate body 30 (as shown in FIG. 4B ).

Referring to FIG. 4C , the position of the buffer member 40 is not limited to the foregoing. For example, when the shape of the heat conduction plate body 30 is square, the buffer member 40 can also be located outside the perforation 31 of the heat conduction plate body 30, and then follow the above steps to disassemble the heat conduction plate body 30, the buffer member 40 can also absorb the heat conduction plate body 30 pressure.

Referring to FIG. 5 , it is a schematic side view of another heat conducting plate structure assembled on a circuit board according to an embodiment of the present invention. Its structure is roughly the same as the above, the difference is the structural composition of the buffer member 40'. The aforementioned buffer member 40 is a non-conductive elastic element, but here, the buffer member 40' is a conductive elastic element, such as a metal spring, and an insulating block 60 is provided between the buffer member 40' and the circuit board. 10, to prevent the buffer 40' from directly contacting the circuit board 10, causing a short circuit of the circuit board 10. In addition, the thickness of the insulating block 60 plus the thickness of the buffer member 40' is substantially equal to the distance between the heat conducting plate body 30 and the circuit board 10.

Referring to Fig. 6, Fig. 7, Fig. 8A and Fig. 8B, the auxiliary device 70 for removing the heat conduction plate of the present invention is applied to remove the heat conduction plate 30' from the circuit board 10. The shape of the heat conduction plate 30' is triangular here, and it can also be other geometric shapes such as equisquare, regular polygon, etc., and is not limited to triangle. The fixed position of the heat conduction plate 30' is provided with a plurality of perforations passing through the heat conduction plate 30', and each perforation is located outside the contact area between the heat conduction plate 30' and the central processing unit chip 20, and is used for a plurality of locking parts 50 to pass through. It is fixed with the circuit board 10 and contacts with the central processing unit chip 20 sandwiched therebetween for heat exchange.

The auxiliary tool 70 includes a handle 71 and two support arms 72 . Wherein, the handle 71 can be held by the user with hands or hand tools, and the two support arms 72 extend from the handle 71 and pass through between the perforated position of the heat conducting plate 30 ′ and the central processing unit chip 20 . Moreover, the handle 71 and each supporting arm 72 jointly form a hollow portion 74 , the hollow portion 74 has a ring wall 75 , and the ring wall 75 is provided with a positioning groove 76 matched with the lock member 50 for nesting with the lock member 50 . The supporting arm 72 is made of elastic-plastic material to serve as a buffer.

However, the auxiliary tool 70 can also include a plurality of buffer pieces 73, each buffer piece 73 is located on each support arm 72, here, the buffer piece 73 and the support arm 72 are two independent components, and the buffer piece 73 is arranged on the support arm 72 The combination is taken as an application example, however, the buffer member 73 can be extended from the support arm 72 and the two are integrated (as shown in FIG. 6 ).

The buffer pieces 72 are interposed between each support arm 72 and the circuit board 10, and the thickness of each buffer piece 73 plus the height of each support arm 72 is substantially equal to the distance between the heat conducting plate 30' and the circuit board 10. In addition, the buffers 73 are elastic elements, so that when the support arms 72 pass between the heat conducting plate 30' and the circuit board 10, each buffer 73 normally has a force to push the support arms 72. The buffer member 73 can be, for example, an elastic element that does not have conductive properties such as bakelite, rubber spring, etc., but can also be an elastic element with conductive properties such as a metal spring, and an insulating block is also provided between the buffer member 73 and the circuit board 10 , to prevent the buffer member 73 from directly contacting the circuit board, causing a short circuit of the circuit board. Here, each buffer member 73 is bakelite as an application example.

Continue referring to FIG. 6, FIG. 7, FIG. 8A and FIG. 8B, when the heat conduction plate 30' is assembled on the circuit board 10, the locking parts 50 are passed through each perforation and the circuit board 10, so as to fix the heat conduction plate 30' on the circuit board 10 , and the heat conduction plate 30' is pasted above the central processing unit chip 20, so that the heat conduction plate 30' can conduct the heat generated by the central processing unit chip 20 to the heat transfer element, and then the heat transfer element transfers the heat to the cooling area for exclude. When desiring to install and disassemble the heat conduction plate 30 ′ from the circuit board 10 , the user can operate the handle 71 of the auxiliary tool 70 to pass the two support arms 72 between the perforation of the heat conduction plate 30 ′ and the central processing unit chip 20 , and each support arm 72 is located between the heat conduction plate 30' and the contact area of the central processing single chip 20 and each perforation of the heat conduction plate 30', and makes the positioning groove 76 engage with the lock part 50, so that the positioning aid 70 is convenient for rear In the disassembly and assembly of the heat conduction plate 30 ′, at the same time, each buffer member 73 is located between each support arm 72 and the circuit board 10 , so that the locking part 50 can be dismantled to release the heat conduction plate 30 ′. When the first locking part 50 is removed, the loose end of the heat conduction plate 30' is lifted because it is no longer subjected to the stress of the locking part 50, while the other end of the unremoved locking part 50 is still subjected to the stress of the locking part 50 However, it is fixed on the circuit board 10 , but the non-loose end of the heat conduction plate 30 ′ will press against the support arms 72 , and the buffers 73 on the support arms 72 can thus absorb the pressing force of the heat conduction plate 30 ′.

Please refer to FIG. 8B , when the supporting arms 72 pass through the heat conducting plate 30' and the CPU chip 20, the positions thereof are not limited to the above. When the shape of the heat conduction plate 30' is square, each support arm 72 can also be located outside each perforation of the heat conduction plate 30', and when the heat conduction plate 30' is disassembled according to the aforementioned steps, the buffer member 73 on each support arm 72 is also the same The pressing force of the heat conduction plate 30' can be absorbed.

According to the foregoing, the relative distance between the two support arms 72 in the auxiliary device 70 is fixed. If it is applied to the central processing unit chip 20 of different specifications and sizes, it is limited by the relative distance between the two support arms 72, so that the auxiliary device 70 is suitable for use. The performance is limited, so the present invention discloses another structure for removing the heat conducting plate.

As shown in FIG. 9 , the general structure of the auxiliary device 70 is the same as above, the difference is that there is a sliding structure between each support arm 72 and the handle 71 , so that each support arm 72 can slide relative to each other to change its relative distance. Wherein, the handle 71 is provided with two guide grooves 712, and each support arm 72 is provided with a slider 722 corresponding to the position of each guide groove 712 as an application example, each slider 722 can extend into and slide in each guide groove 712, In this way, when the two support arms 72 are inserted between the perforated position of the heat conducting plate 30 ′ and the central processing unit chip 20 , the user can adjust the relative distance between the two support arms 72 depending on the size of the central processing unit chip 20 , to increase the range of applicability. In addition, each support arm 72 can also be separately provided with a guide groove, and the handle 71 is provided with two sliders corresponding to the position of each guide groove, and each slider can extend into and slide in each guide groove, so as to achieve the same effect of changing the position of the two support arms. 72 for the purpose of the relative distance, but this is the corresponding concave-convex relationship, which will not be described in detail here.

Certainly, the present invention also can have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these Corresponding changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (10)

1. A heat conduction plate structure, fixed on a circuit board and in contact with a heat source for heat exchange, characterized in that the heat conduction plate structure includes: A heat conduction plate body has a plurality of fixing points for fixing with the circuit board and contacting the heat source, the fixing points are located outside the contact area between the heat conduction plate body and the heat source; and At least one buffer is provided outside the contact area between the heat conducting plate body and the heat source, and the buffer is stuffed between the heat conducting plate body and the circuit board. 2. The structure of the heat conduction plate according to claim 1, wherein each of the fixing points is a perforation through the heat conduction plate body for a plurality of locking accessories to pass through, and fix the heat conduction plate body to the heat conduction plate body circuit board. 3 . The heat conduction plate structure according to claim 1 , wherein the buffer member has a thickness equal to the distance between the heat conduction plate body and the circuit board. 4 . 4. The structure of the heat conduction plate according to claim 1, wherein the buffer member is an elastic element, and when the heat conduction plate body is fixed on the circuit board, the buffer member normally has a function to push the heat conduction plate body force. 5 . The heat conducting plate structure according to claim 4 , further comprising an insulating block between the buffer member and the circuit board. 6. An auxiliary device for removing a heat conduction plate, the heat conduction plate is fixed on a circuit board and contacts a heat source interposed therebetween for heat exchange, it is characterized in that the auxiliary device includes: a handle for operation by the user; and Two support arms, extending from the handle and passing between the heat conducting plate and the heat source, each of the support arms also has at least one buffer member, each of the buffer members is an elastic element, and is arranged on each of the support arms and Between each of the support arms and the circuit board, each of the buffer members normally has a force to push each of the support arms, and each of the buffers. 7 . The auxiliary tool for removing the heat conducting plate according to claim 6 , wherein there is a sliding structure between each of the supporting arms and the handle, so that each of the supporting arms can slide relative to each other to change their relative distance. 8. The auxiliary tool for removing the heat conduction plate according to claim 7, wherein the handle is provided with two guide grooves, each of the support arms is provided with a slider corresponding to the position of each of the guide grooves, and each of the sliders Can extend into and slide in each of the guide grooves. 9. An auxiliary device for removing a heat conduction plate, the heat conduction plate is fixed on a circuit board and contacts a heat source interposed therebetween for heat exchange, it is characterized in that the auxiliary device includes: a handle for operation by the user; two support arms, extending from the handle and passing between the heat conducting plate and the heat source; and A plurality of buffer pieces, each of the buffer pieces is located on each of the support arms and between each of the support arms and the circuit board, and the height of each of the buffer pieces plus the support arm is equal to the distance between the heat conducting plate and the circuit board. 10. The auxiliary tool for removing the heat conduction plate according to claim 9, wherein each of the buffer members is an elastic element, and when each of the support arms is passed between the heat conduction plate and the circuit board, each of the buffer The parts normally have a force that pushes each of the support arms.

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