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CN101257780B - 电子设备导风装置 - Google Patents

电子设备导风装置 Download PDF

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Publication number
CN101257780B
CN101257780B CN2007102002340A CN200710200234A CN101257780B CN 101257780 B CN101257780 B CN 101257780B CN 2007102002340 A CN2007102002340 A CN 2007102002340A CN 200710200234 A CN200710200234 A CN 200710200234A CN 101257780 B CN101257780 B CN 101257780B
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Prior art keywords
air
air guide
electronic equipment
chassis
plate body
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Expired - Fee Related
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CN2007102002340A
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CN101257780A (zh
Inventor
孙正衡
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN2007102002340A priority Critical patent/CN101257780B/zh
Priority to US11/953,861 priority patent/US7609517B2/en
Publication of CN101257780A publication Critical patent/CN101257780A/zh
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Publication of CN101257780B publication Critical patent/CN101257780B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种电子设备导风装置，包括至少一导风板，该导风板组设于一机箱的具通风孔的侧壁的导风板，该导风板包括一板体，该板体设有若干导风通道，每一导风通道是由若干导风壁包围形成，每一导风通道的两端形成一进风孔及一对应该机箱的通风孔的出风孔，每一导风壁沿平行该板体方向的横截面的面积自其进风口至对应的出风口的方向是渐增的。所述电子设备导风装置可有效减小风阻，使风流流畅地流过该机箱的通风孔，从而提高了散热效率。

Description

电子设备导风装置
技术领域
本发明涉及一种电子设备导风装置。
背景技术
随着电子元件高频高速的发展，电子元件所产生的热也越来越多，致使电子设备内部不断升温，严重影响了中央处理器及其他电子元件运行稳定性。所以，电子设备的机箱的侧壁上对应设有通风孔及在机箱内会配置系统风扇，以促进机箱内外的空气对流以进行散热。机箱侧壁的通风孔尺寸及开孔密度越大，散热效果越好。然而，受限于防电磁辐射、安全及制造工艺等因素的考虑，通风孔的尺寸及开孔密度不可能无限制的提高，因此通风孔与通风孔之间存在一定间隔，会对流过这些通风孔的气流产生一定的风阻，从而造成一定程度的风损及风流迟滞，不利于良好散热。
发明内容
鉴于以上内容，有必要提供一种使风流流畅流过机箱的通风孔的电子设备导风装置。
一种电子设备导风装置，包括至少一导风板，该导风板是组设于一机箱的具通风孔的侧壁，该导风板包括一板体，该板体设有若干导风通道，每一导风通道是由若干导风壁包围形成，每一导风通道的两端分别设一进风孔及一对应该机箱的通风孔的出风孔，每一导风壁沿平行该板体方向的横截面的面积自其进风口至对应的出风口的方向是渐增的。
所述电子设备导风装置的每一导风壁沿平行该板体方向的横截面的面积是渐增的，即每一进风孔的尺寸大于对应的出风孔的尺寸，使这些进风孔紧密排列可缩减相邻两进风孔之间的间隔，以有效减小风阻，使风流流畅地流过该机箱的通风孔，提高了散热效率。
附图说明
图1是本发明电子设备导风装置的较佳实施方式与一机箱的立体分解图。
图2是图1的组合图。
图3及图4是本发明电子设备导风装置的较佳实施方式的立体图。
图5是图3沿V-V面的剖视图。
图6是本发明电子设备导风装置的第二较佳实施方式的剖视图。
图7是本发明电子设备导风装置的第三较佳实施方式与部分机箱的立体分解图。
具体实施方式
请参照图1及图2，本发明电子设备导风装置的较佳实施方式包括两导风板10及11。该导风板10组设于一机箱20的具通风孔的侧壁22内侧面以将该机箱20内的热空气引导至该机箱20外。该导风板11组设于该机箱20的具通风孔的侧壁24外侧面而引导外界冷空气进入该机箱20内。在本实施方式中，仅以组设于该机箱20的侧壁22内侧面的导风板10为代表进行介绍。
请参照图3至图5，该导风板10包括一板体12，该板体12设有若干导风通道14，每一导风通道14是由若干导风壁16包围形成，相邻的两导风通道14之间共用同一导风壁。每一导风通道14的两端形成一进风孔142及一出风孔144。该出风孔144是对应该侧壁22的通风孔设置的。该进风孔142的尺寸大于该出风孔144的尺寸，使得这些进风孔142紧密排列，可缩减相邻两进风孔142之间的间隔，以减小风阻。每一导风通道14的尺寸自其进风孔142至对应的出风孔144逐渐递减。每一导风壁16沿垂直该板体12方向的截面是一对称的几何图形(如图5所示的等腰三角形)。请参阅图6，该电子设备导风装置的第二较佳实施方式的导风板10a的导风壁16a沿垂直其板体(未标号)方向的截面是一对称的圆弧形(大致为一1/2椭圆)。导风板10、10a的导风壁16、16a沿平行其板体方向的横截面的面积自其进风孔至对应的出风孔的方向是渐增的。
该导风板10于设有出风孔144的一侧设有可粘贴于该侧壁22内侧面的粘贴物18。
请参阅图7，该电子设备导风装置的第三较佳实施方式是藉由若干常用的固定件36(如螺钉等)组设于该机箱20的设有通风孔的侧壁。该电子设备导风装置包括一设有若干导风通道32的导风板30，该导风板30于周缘处设有若干固定片34，每一固定片34设一固定孔342，该机箱20的设有通风孔的侧壁相应设有若干固定孔。藉由固定件36穿设于该机箱20的固定孔及该导风板30的固定孔342而将该导风体30组设于该机箱20。

Claims (5)

1.一种电子设备导风装置，包括至少一导风板，该导风板是组设于一机箱的具通风孔的侧壁，该导风板包括一板体，该板体设有若干导风通道，每一导风通道是由若干导风壁包围形成，每一导风通道的两端分别设一进风孔及一对应该机箱的通风孔的出风孔，其特征在于：每一导风壁沿平行该板体方向的横截面的面积自其进风口至对应的出风口的方向是渐增的，相邻的两导风通道之间共用其中一导风壁。
2.如权利要求1所述的电子设备导风装置，其特征在于：每一导风壁沿垂直该板体方向的截面是呈对称的几何图形。
3.如权利要求2所述的电子设备导风装置，其特征在于：该对称的几何图形为一等腰三角形或一对称的圆弧形。
4.如权利要求1所述的电子设备导风装置，其特征在于：该板体于设有出风孔的一侧设有粘贴物，以将该板体粘附于该机箱的侧壁。
5.如权利要求1所述的电子设备导风装置，其特征在于：该板体于周缘处设有若干设有固定孔的固定片，该机箱的侧壁对应设有固定孔，若干固定件穿设于这些固定片及该侧壁的固定孔而将该板体组设于该机箱。
CN2007102002340A 2007-02-27 2007-02-27 电子设备导风装置 Expired - Fee Related CN101257780B (zh)

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CN2007102002340A CN101257780B (zh) 2007-02-27 2007-02-27 电子设备导风装置
US11/953,861 US7609517B2 (en) 2007-02-27 2007-12-11 Air guiding plate

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CN109185953A (zh) * 2018-08-21 2019-01-11 平湖伟峰科技有限责任公司 导风装置及包含该导风装置的电暖器
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US20080204996A1 (en) 2008-08-28
CN101257780A (zh) 2008-09-03
US7609517B2 (en) 2009-10-27

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