CN101280891B - Light source module - Google Patents
Light source module Download PDFInfo
- Publication number
- CN101280891B CN101280891B CN2007100921181A CN200710092118A CN101280891B CN 101280891 B CN101280891 B CN 101280891B CN 2007100921181 A CN2007100921181 A CN 2007100921181A CN 200710092118 A CN200710092118 A CN 200710092118A CN 101280891 B CN101280891 B CN 101280891B
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- Prior art keywords
- source module
- light source
- circuit board
- light
- heat dissipation
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Abstract
A light source module comprises a circuit board, a light emitting element and a heat dissipation plate. The circuit board is provided with a through hole, and the light-emitting element is arranged on the first side of the circuit board, wherein the position of the light-emitting element corresponds to the through hole. The heat dissipation plate is arranged on the second side of the circuit board and provided with a protruding part corresponding to the through hole and the light-emitting element, wherein the protruding part extends into the through hole towards the direction of the circuit board and is contacted with the light-emitting element.
Description
Technical field
The present invention relates to a kind of light source module, particularly a kind of light source module with high cooling efficiency.
Background technology
Along with the progress of semiconductor and electronics technology, traditional cathode ray tube (CRT) display flat-panel screens little by volume gradually and low radiation replaces.Generally speaking, traditional flat-panel screens mostly utilizes fluorescent tube as backlight (backlight), yet fluorescent tube often has the problem that volume is excessive and service life is short.
For effective utilization and the life-span that promotes light source module, also have at present and utilize volume is less and weight is lighter light emitting diode backlight as flat-panel screens, yet because the too high meeting of temperature has a strong impact on the brightness and the service life of light emitting diode, thus the heat radiation of the light source module beginning become an important problem.
Summary of the invention
The invention provides a kind of light source module, comprise circuit board, light-emitting component and first heat sink.The aforementioned circuit plate has perforation, and above-mentioned light-emitting component is arranged at first side of circuit board, and wherein the position of light-emitting component is corresponding to aforementioned perforation.Aforementioned first heat sink is arranged at second side of circuit board and has first protuberance, corresponding to aforementioned perforation and light-emitting component, wherein first protuberance stretches in the perforation and contacts with light-emitting component towards the circuit board direction, is a depression at the dorsal part of this first protuberance of first heat sink.For example, aforementioned first heat sink can be the aluminium sheet with high thermal conductivity coefficient, and aforementioned light-emitting component can be light emitting diode, and the aforementioned circuit plate can be epoxy resin base material (FR-4) printed circuit board (PCB).
In one embodiment, the aforementioned lights source module also comprises second heat sink, and above-mentioned second heat sink has second protuberance, protrudes and connects first heat sink towards the circuit board direction.In particular, first protuberance can be departed from the position of aforementioned second protuberance, makes to form the gap between first, second heat sink, to promote its heat dissipation.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly and conjunction with figs. elaborate.
Description of drawings
Fig. 1 is an expression light source module schematic diagram of the present invention;
Fig. 2 is the schematic diagram of indication circuit plate; And
Fig. 3 is the schematic diagram of another embodiment among expression the present invention.
Description of reference numerals
10 circuit boards, 11 first sides
13 perforation of 12 second sides
20 light-emitting components, 30 first heat sinks
31 first protuberances, 40 second heat sinks
41 second protuberances, 50,60 heat sinks
The specific embodiment
At first see also Fig. 1, light source module in the present embodiment is applicable to electronic installation, for example can be used as the backlight of flat-panel screens inside, it mainly comprises circuit board 10, a plurality of light-emitting component 20 and first heat sink 30, aforementioned circuit plate 10 for example is the FR-4 printed circuit board (PCB), aforementioned light-emitting component 20 for example is a light emitting diode, and 30 of aforementioned heat sinks can utilize the thermal conductivity material high than circuit board 10 made, for example can adopt aluminium sheet as heat sink 30.
As shown in Figure 1, light-emitting component 20 is positioned at first side 11 of circuit board 10, and and circuit board 10 electrically connects, 30 of first heat sinks are arranged at second side 12 of circuit board 10, wherein second side 12 is in contrast to first side 11, the heat energy that can promptly light-emitting component 20 be produced by first heat sink 30 sheds towards the below, and is too high and cause damaging to avoid circuit board 10 or light-emitting component 20 temperature.About the connected mode of the aforementioned circuit plate 10 and first heat sink 30 for example can adopt screw or machinery chimeric, perhaps also can the insulating heat-conductive pad (not shown) with viscosity be set between the circuit board 10 and first heat sink 30, use making both firmly bonding.
In the present embodiment, aforementioned circuit plate 10 is provided with a plurality of perforation 13, and above-mentioned perforation 13 runs through circuit board 10 and connects first, second side 11,12, and its position then corresponds respectively to each light-emitting component 20.In addition, be formed with a plurality of first protuberances 31 on aforementioned first heat sink 30, its position corresponds respectively to each perforation 13 and light-emitting component 20.In particular, aforementioned first protuberance 31 protrudes towards circuit board 10 directions, and stretch in the corresponding perforation 13 and then and contact with light-emitting component 20, the heat energy that produced of light-emitting component 20 can directly see through first heat sink 30 and promptly transmits towards the below thus, and then can significantly promote radiating effect.Wherein, be connected effectively in order to ensure between first protuberance 31 and the light-emitting component 20, also can between the light-emitting component 20 and first protuberance 31 insulating heat-conductive pad (not shown) be set, the heat energy that makes light-emitting component 20 be produced can promptly be passed to first heat sink 30.In particular, aforementioned light-emitting component 20 and bore a hole and 13 for example can adopt matrix-style and arrange (as shown in Figure 2), yet also visual needed light field design are with light-emitting component 20 and bore a hole and 13 take other specific modes to arrange.
In addition, the aforementioned lights source module also can be provided with a plurality of heat sinks to promote its heat dissipation.Then see also Fig. 3, light source module has in another embodiment more been set up second heat sink 40 except being provided with first heat sink 30.As previously mentioned, first heat sink 30 is arranged at second side 12 of circuit board 10, and wherein first protuberance 31 on first heat sink 30 passes the perforation 13 of circuit board 10 and then contacts with light-emitting component 20.On the other hand, aforementioned second heat sink 40 is connected in first heat sink, 30 surface below and has a plurality of second protuberances 41, wherein second protuberance 41 protrudes and butt first heat sink 30 towards circuit board 10 directions, first protuberance 31 is then departed from its position, can make thus to form the gap between first, second heat sink 30,40, to increase area of dissipation and to promote heat dissipation.In like manner, also can set up several heat sinks (heat sink 50,60 as shown in Figure 3) if necessary in first, second heat sink 30,40 belows to strengthen the heat dissipation of its light source module.
In sum, the invention provides a kind of light source module,, and utilize protuberance on the heat sink to pass aforementioned perforation and contact with light-emitting component wherein by on circuit board, forming perforation, can promote the heat dissipation of light source module, use and avoid circuit board or light-emitting component Yin Gaowen and cause damaging.
Though the present invention discloses as above with aforesaid preferred embodiment; right its is not in order to limit the present invention; those skilled in the art without departing from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100921181A CN101280891B (en) | 2007-04-02 | 2007-04-02 | Light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100921181A CN101280891B (en) | 2007-04-02 | 2007-04-02 | Light source module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101280891A CN101280891A (en) | 2008-10-08 |
| CN101280891B true CN101280891B (en) | 2010-10-06 |
Family
ID=40013490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100921181A Active CN101280891B (en) | 2007-04-02 | 2007-04-02 | Light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101280891B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102155725A (en) * | 2010-02-11 | 2011-08-17 | 亿光电子工业股份有限公司 | Heat dissipation device and lighting fixture including the heat dissipation device |
| CN102889561A (en) * | 2012-09-12 | 2013-01-23 | 广东宏泰照明科技有限公司 | A high-power LED thermoelectric separation structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2741193Y (en) * | 2004-04-08 | 2005-11-16 | 吴裕朝 | Light-emitting diode device, light-emitting diode cooling system and lighting device including same |
| TW200620720A (en) * | 2006-03-01 | 2006-06-16 | Mutual Tek Ind Co Ltd | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
-
2007
- 2007-04-02 CN CN2007100921181A patent/CN101280891B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2741193Y (en) * | 2004-04-08 | 2005-11-16 | 吴裕朝 | Light-emitting diode device, light-emitting diode cooling system and lighting device including same |
| TW200620720A (en) * | 2006-03-01 | 2006-06-16 | Mutual Tek Ind Co Ltd | Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| JP 2005-5437 A,全文. |
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| Publication number | Publication date |
|---|---|
| CN101280891A (en) | 2008-10-08 |
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