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CN101280891B - Light source module - Google Patents

Light source module Download PDF

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Publication number
CN101280891B
CN101280891B CN2007100921181A CN200710092118A CN101280891B CN 101280891 B CN101280891 B CN 101280891B CN 2007100921181 A CN2007100921181 A CN 2007100921181A CN 200710092118 A CN200710092118 A CN 200710092118A CN 101280891 B CN101280891 B CN 101280891B
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China
Prior art keywords
source module
light source
circuit board
light
heat dissipation
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CN2007100921181A
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CN101280891A (en
Inventor
黄添富
游晶莹
胡国昌
昝世蓉
花士豪
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Industrial Technology Research Institute ITRI
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Industrial Technology Research Institute ITRI
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Abstract

A light source module comprises a circuit board, a light emitting element and a heat dissipation plate. The circuit board is provided with a through hole, and the light-emitting element is arranged on the first side of the circuit board, wherein the position of the light-emitting element corresponds to the through hole. The heat dissipation plate is arranged on the second side of the circuit board and provided with a protruding part corresponding to the through hole and the light-emitting element, wherein the protruding part extends into the through hole towards the direction of the circuit board and is contacted with the light-emitting element.

Description

Light source module
Technical field
The present invention relates to a kind of light source module, particularly a kind of light source module with high cooling efficiency.
Background technology
Along with the progress of semiconductor and electronics technology, traditional cathode ray tube (CRT) display flat-panel screens little by volume gradually and low radiation replaces.Generally speaking, traditional flat-panel screens mostly utilizes fluorescent tube as backlight (backlight), yet fluorescent tube often has the problem that volume is excessive and service life is short.
For effective utilization and the life-span that promotes light source module, also have at present and utilize volume is less and weight is lighter light emitting diode backlight as flat-panel screens, yet because the too high meeting of temperature has a strong impact on the brightness and the service life of light emitting diode, thus the heat radiation of the light source module beginning become an important problem.
Summary of the invention
The invention provides a kind of light source module, comprise circuit board, light-emitting component and first heat sink.The aforementioned circuit plate has perforation, and above-mentioned light-emitting component is arranged at first side of circuit board, and wherein the position of light-emitting component is corresponding to aforementioned perforation.Aforementioned first heat sink is arranged at second side of circuit board and has first protuberance, corresponding to aforementioned perforation and light-emitting component, wherein first protuberance stretches in the perforation and contacts with light-emitting component towards the circuit board direction, is a depression at the dorsal part of this first protuberance of first heat sink.For example, aforementioned first heat sink can be the aluminium sheet with high thermal conductivity coefficient, and aforementioned light-emitting component can be light emitting diode, and the aforementioned circuit plate can be epoxy resin base material (FR-4) printed circuit board (PCB).
In one embodiment, the aforementioned lights source module also comprises second heat sink, and above-mentioned second heat sink has second protuberance, protrudes and connects first heat sink towards the circuit board direction.In particular, first protuberance can be departed from the position of aforementioned second protuberance, makes to form the gap between first, second heat sink, to promote its heat dissipation.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly and conjunction with figs. elaborate.
Description of drawings
Fig. 1 is an expression light source module schematic diagram of the present invention;
Fig. 2 is the schematic diagram of indication circuit plate; And
Fig. 3 is the schematic diagram of another embodiment among expression the present invention.
Description of reference numerals
10 circuit boards, 11 first sides
13 perforation of 12 second sides
20 light-emitting components, 30 first heat sinks
31 first protuberances, 40 second heat sinks
41 second protuberances, 50,60 heat sinks
The specific embodiment
At first see also Fig. 1, light source module in the present embodiment is applicable to electronic installation, for example can be used as the backlight of flat-panel screens inside, it mainly comprises circuit board 10, a plurality of light-emitting component 20 and first heat sink 30, aforementioned circuit plate 10 for example is the FR-4 printed circuit board (PCB), aforementioned light-emitting component 20 for example is a light emitting diode, and 30 of aforementioned heat sinks can utilize the thermal conductivity material high than circuit board 10 made, for example can adopt aluminium sheet as heat sink 30.
As shown in Figure 1, light-emitting component 20 is positioned at first side 11 of circuit board 10, and and circuit board 10 electrically connects, 30 of first heat sinks are arranged at second side 12 of circuit board 10, wherein second side 12 is in contrast to first side 11, the heat energy that can promptly light-emitting component 20 be produced by first heat sink 30 sheds towards the below, and is too high and cause damaging to avoid circuit board 10 or light-emitting component 20 temperature.About the connected mode of the aforementioned circuit plate 10 and first heat sink 30 for example can adopt screw or machinery chimeric, perhaps also can the insulating heat-conductive pad (not shown) with viscosity be set between the circuit board 10 and first heat sink 30, use making both firmly bonding.
In the present embodiment, aforementioned circuit plate 10 is provided with a plurality of perforation 13, and above-mentioned perforation 13 runs through circuit board 10 and connects first, second side 11,12, and its position then corresponds respectively to each light-emitting component 20.In addition, be formed with a plurality of first protuberances 31 on aforementioned first heat sink 30, its position corresponds respectively to each perforation 13 and light-emitting component 20.In particular, aforementioned first protuberance 31 protrudes towards circuit board 10 directions, and stretch in the corresponding perforation 13 and then and contact with light-emitting component 20, the heat energy that produced of light-emitting component 20 can directly see through first heat sink 30 and promptly transmits towards the below thus, and then can significantly promote radiating effect.Wherein, be connected effectively in order to ensure between first protuberance 31 and the light-emitting component 20, also can between the light-emitting component 20 and first protuberance 31 insulating heat-conductive pad (not shown) be set, the heat energy that makes light-emitting component 20 be produced can promptly be passed to first heat sink 30.In particular, aforementioned light-emitting component 20 and bore a hole and 13 for example can adopt matrix-style and arrange (as shown in Figure 2), yet also visual needed light field design are with light-emitting component 20 and bore a hole and 13 take other specific modes to arrange.
In addition, the aforementioned lights source module also can be provided with a plurality of heat sinks to promote its heat dissipation.Then see also Fig. 3, light source module has in another embodiment more been set up second heat sink 40 except being provided with first heat sink 30.As previously mentioned, first heat sink 30 is arranged at second side 12 of circuit board 10, and wherein first protuberance 31 on first heat sink 30 passes the perforation 13 of circuit board 10 and then contacts with light-emitting component 20.On the other hand, aforementioned second heat sink 40 is connected in first heat sink, 30 surface below and has a plurality of second protuberances 41, wherein second protuberance 41 protrudes and butt first heat sink 30 towards circuit board 10 directions, first protuberance 31 is then departed from its position, can make thus to form the gap between first, second heat sink 30,40, to increase area of dissipation and to promote heat dissipation.In like manner, also can set up several heat sinks (heat sink 50,60 as shown in Figure 3) if necessary in first, second heat sink 30,40 belows to strengthen the heat dissipation of its light source module.
In sum, the invention provides a kind of light source module,, and utilize protuberance on the heat sink to pass aforementioned perforation and contact with light-emitting component wherein by on circuit board, forming perforation, can promote the heat dissipation of light source module, use and avoid circuit board or light-emitting component Yin Gaowen and cause damaging.
Though the present invention discloses as above with aforesaid preferred embodiment; right its is not in order to limit the present invention; those skilled in the art without departing from the spirit and scope of the present invention, when can doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the accompanying Claim person of defining.

Claims (10)

1.一种光源模块,包括:1. A light source module, comprising: 电路板,具有第一侧、第二侧以及穿孔,其中该第二侧相反于该第一侧,该穿孔贯穿该电路板并且连接该第一、第二侧;a circuit board having a first side, a second side and a through hole, wherein the second side is opposite to the first side, the through hole passes through the circuit board and connects the first and second sides; 发光元件,设置于该第一侧并且电性连接该电路板,其中该发光元件的位置对应于该穿孔;以及a light emitting element disposed on the first side and electrically connected to the circuit board, wherein the position of the light emitting element corresponds to the through hole; and 第一散热板,设置于该第二侧并具有第一凸出部,对应于该穿孔以及该发光元件,其中该第一凸出部伸入该穿孔内并与该发光元件接触,在第一散热板的该第一凸出部的背侧为一凹陷。The first heat dissipation plate is arranged on the second side and has a first protruding portion corresponding to the through hole and the light emitting element, wherein the first protruding portion protrudes into the through hole and contacts the light emitting element. The back side of the first protrusion of the heat dissipation plate is a depression. 2.如权利要求1所述的光源模块,其中该第一散热板采用导热性较该电路板高的材质所制成。2. The light source module according to claim 1, wherein the first heat dissipation plate is made of a material with higher thermal conductivity than the circuit board. 3.如权利要求1所述的光源模块,其中该发光元件为发光二极管。3. The light source module as claimed in claim 1, wherein the light emitting element is a light emitting diode. 4.如权利要求1所述的光源模块,其中该电路板包括环氧树脂基材印刷电路板。4. The light source module as claimed in claim 1, wherein the circuit board comprises an epoxy-based printed circuit board. 5.如权利要求1所述的光源模块,其中该光源模块还包括多个发光元件,该电路板还包括多个穿孔,且该第一散热板还包括多个第一凸出部,该多个发光元件的位置分别对应于该多个穿孔,且该多个第一凸出部分别伸入该多个穿孔内。5. The light source module according to claim 1, wherein the light source module further comprises a plurality of light emitting elements, the circuit board further comprises a plurality of through holes, and the first heat dissipation plate further comprises a plurality of first protrusions, the plurality of The positions of the light emitting elements respectively correspond to the plurality of through holes, and the plurality of first protruding parts protrude into the plurality of through holes respectively. 6.如权利要求5所述的光源模块,其中该多个发光元件与该多个穿孔呈矩阵方式排列。6. The light source module as claimed in claim 5, wherein the plurality of light emitting elements and the plurality of through holes are arranged in a matrix. 7.如权利要求1所述的光源模块,其中该光源模块还包括第二散热板,该第二散热板连接该第一散热板。7. The light source module according to claim 1, wherein the light source module further comprises a second heat dissipation plate connected to the first heat dissipation plate. 8.如权利要求7所述的光源模块,其中该第二散热板具有第二凸出部,该第二凸出部朝该电路板方向凸出并且连接该第一散热板。8. The light source module according to claim 7, wherein the second heat dissipation plate has a second protruding portion protruding toward the circuit board and connected to the first heat dissipation plate. 9.如权利要求8所述的光源模块,其中该第二凸出部的位置偏离该第一凸出部。9. The light source module as claimed in claim 8, wherein the position of the second protruding portion deviates from the first protruding portion. 10.如权利要求9所述的光源模块,其中该第一、第二散热板之间具有间隙。10. The light source module as claimed in claim 9, wherein there is a gap between the first and second cooling plates.
CN2007100921181A 2007-04-02 2007-04-02 Light source module Active CN101280891B (en)

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Application Number Priority Date Filing Date Title
CN2007100921181A CN101280891B (en) 2007-04-02 2007-04-02 Light source module

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Application Number Priority Date Filing Date Title
CN2007100921181A CN101280891B (en) 2007-04-02 2007-04-02 Light source module

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CN101280891B true CN101280891B (en) 2010-10-06

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102155725A (en) * 2010-02-11 2011-08-17 亿光电子工业股份有限公司 Heat dissipation device and lighting fixture including the heat dissipation device
CN102889561A (en) * 2012-09-12 2013-01-23 广东宏泰照明科技有限公司 A high-power LED thermoelectric separation structure

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2741193Y (en) * 2004-04-08 2005-11-16 吴裕朝 Light-emitting diode device, light-emitting diode cooling system and lighting device including same
TW200620720A (en) * 2006-03-01 2006-06-16 Mutual Tek Ind Co Ltd Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2741193Y (en) * 2004-04-08 2005-11-16 吴裕朝 Light-emitting diode device, light-emitting diode cooling system and lighting device including same
TW200620720A (en) * 2006-03-01 2006-06-16 Mutual Tek Ind Co Ltd Circuit board of back light module of LED capable of increasing heat dissipating efficiency and the manufacturing method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 2005-5437 A,全文.

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