CN101291575A - A cooling device and server - Google Patents
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Abstract
本发明实施例公开了一种散热装置,该散热装置包括供风装置和温控装置,在供风装置的供风口设置有一导叶,所述温控装置用于接收感应的发热物件的温度,并根据所述感应的温度信号调节所述导叶发生偏转,使所述导叶将所述供风装置提供的风流引导至温度较大的发热物件。本发明还公开了一种包括该散热装置的服务器。通过本发明实施例提供的散热装置,可以有效合理利用所述供风装置提供的风流,不必提升供风装置中风扇的转速,从而延长风扇的使用寿命,也解决了服务器的供风不均而带来的系统风流浪费。
The embodiment of the present invention discloses a heat dissipation device, the heat dissipation device includes an air supply device and a temperature control device, a guide vane is arranged at the air supply port of the air supply device, and the temperature control device is used to receive the temperature of the induced heating object, And adjust the deflection of the guide vane according to the sensed temperature signal, so that the guide vane guides the air flow provided by the air supply device to the heat-generating object with relatively high temperature. The invention also discloses a server including the cooling device. Through the heat dissipation device provided by the embodiment of the present invention, the air flow provided by the air supply device can be effectively and rationally used without increasing the speed of the fan in the air supply device, thereby prolonging the service life of the fan and solving the problem of uneven air supply of the server The system airflow waste brought about.
Description
技术领域technical field
本发明涉及散热技术领域,尤其涉及一种散热装置及服务器。The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device and a server.
背景技术Background technique
服务器是指网络系统中服务各计算机的核心计算机,可提供网络使用者需要的磁盘与打印服务等功能,同时也可供各客户端彼此分享网络环境内的各项资源。服务器之基本机架和一般的个人计算机大致相同,是由中央处理器(CPU)、存储器(Memory)及输入/输出(I/O)设备等部件所组成,并由总线(Bus)在内部将其连接起来,透过北桥芯片连接中央处理器和内存,而透过南桥芯片连接输入/输出设备等。服务器按机箱结构来说大约经历了三个演变过程:从早期的塔式机箱到强调集中性能的机架式,再到高密度计算方式之刀片服务器。The server refers to the core computer that serves each computer in the network system. It can provide functions such as disk and printing services required by network users, and also allows various clients to share various resources in the network environment with each other. The basic rack of the server is roughly the same as that of a general personal computer. It is composed of a central processing unit (CPU), a memory (Memory) and an input/output (I/O) device, and is internally connected by a bus (Bus). It is connected, through the north bridge chip to connect the central processing unit and memory, and through the south bridge chip to connect input/output devices and so on. According to the structure of the chassis, the server has gone through three evolutionary processes: from the early tower chassis to the rack type emphasizing centralized performance, and then to the blade server of high-density computing.
刀片服务器主要由两个部分组成:刀片服务器主板和刀片服务器机架。刀片服务器的优点是易于安装、管理以及节省空间。例如,一个刀片服务器机架高13U,每个机架可装置38片刀片服务器主板,包括16条刀片服务器主板插槽、16条数据系统插槽及6条转换器/管理系统插槽。每个刀片服务器主板所需的电源、网络连接、存储服务都通过背板提供,故可以节省大量空间。每一块刀片服务器主板实际上就是一块系统主板,而且每个刀片服务器都是一个独立的计算机系统,有自己的中央处理器、存储器、硬盘以及主板上的其它电子器件,机架里的各个刀片服务器共用电源供应、冷却系统以及一些电缆等。The blade server is mainly composed of two parts: the blade server motherboard and the blade server rack. The advantages of blade servers are ease of installation, management, and space savings. For example, a blade server rack is 13U high, and each rack can be equipped with 38 blade server motherboards, including 16 blade server motherboard slots, 16 data system slots, and 6 converter/management system slots. The power supply, network connection, and storage services required by each blade server motherboard are provided through the backplane, so a lot of space can be saved. Each blade server motherboard is actually a system motherboard, and each blade server is an independent computer system with its own central processing unit, memory, hard disk and other electronic devices on the motherboard. Shared power supply, cooling system, some cables etc.
图1示出了现有的服务器的内部结构示意图,包括了服务器机架10,在服务器机架10中设有风扇11、I/O刀片模块12以及其他刀片模块13,各个模块之间通过总线进行连接通信,现有的服务器都是采用的风冷进行散热,即采用图中所示的散热风扇11或其它的散热器进行散热。随着刀片服务器效能的提高,其发热量也一直增加,而目前的刀片式服务器或机架式服务器大都采用风扇并联与串联混合排列方式进行扇热,当服务器中的个别器件达到预定极限温度时,只能通过提高风扇转速的方式来冷却降温,这会导致风扇的功耗及噪音增加,同时也会影响到风扇的使用寿命。Fig. 1 shows the schematic diagram of the internal structure of the existing server, including a
发明内容Contents of the invention
本发明实施例提供了一种散热装置及服务器,通过在服务器中使用散热装置,提升服务器的散热能力。Embodiments of the present invention provide a heat dissipation device and a server, and the heat dissipation capability of the server is improved by using the heat dissipation device in the server.
本发明实施例提出了一种散热装置,该散热装置包括供风装置和温控装置,在供风装置的供风口设置有一导叶,所述温控装置用于接收感应的发热物件的温度,并根据所述感应的温度信号调节所述导叶发生偏转,使所述导叶将所述供风装置提供的风流引导至温度较大的发热物件。An embodiment of the present invention proposes a heat dissipation device, the heat dissipation device includes an air supply device and a temperature control device, a guide vane is provided at the air supply port of the air supply device, and the temperature control device is used to receive the temperature of the induced heating object, And adjust the deflection of the guide vane according to the sensed temperature signal, so that the guide vane guides the air flow provided by the air supply device to the heat-generating object with relatively high temperature.
本发明实施例提出了一种服务器,包括服务器机架和多个刀片模块,在服务器机架内设置有散热装置,该散热装置包括供风装置和温控装置,在供风装置的供风口设置有一导叶,所述温控装置用于接收感应的发热物件的温度,并根据所述感应的温度信号调节所述导叶发生偏转,使所述导叶将所述供风装置提供的风流引导至温度较大的发热物件。The embodiment of the present invention proposes a server, including a server rack and a plurality of blade modules, a heat dissipation device is arranged in the server rack, the heat dissipation device includes an air supply device and a temperature control device, and the air supply port of the air supply device is arranged There is a guide vane, and the temperature control device is used to receive the temperature of the induced heating object, and adjust the deflection of the guide vane according to the sensed temperature signal, so that the guide vane can guide the airflow provided by the air supply device To heat-generating objects with high temperature.
本发明实施例中通过导叶与供风装置的配合使用,使服务器供风可以更加合理将风分配到温度较大刀片模块,提高系统的供风效率;通过使用所述散热装置,可以减少供风装置中风扇转速的提升,从而延长风扇的使用寿命,并且解决了服务器的供风不均,带来的系统风流浪费的问题。In the embodiment of the present invention, through the combined use of the guide vane and the air supply device, the air supply of the server can be more reasonably distributed to the blade modules with higher temperature, and the air supply efficiency of the system can be improved; by using the heat dissipation device, the air supply can be reduced. The speed of the fan in the wind device is increased, thereby prolonging the service life of the fan, and solving the problem of waste of system air flow caused by uneven air supply to the server.
附图说明Description of drawings
图1是现有的服务器内部结构示意图;FIG. 1 is a schematic diagram of the internal structure of an existing server;
图2是本发明实施例中的服务器内部结构示意图;Fig. 2 is a schematic diagram of the internal structure of the server in the embodiment of the present invention;
图3是本发明实施例中的散热装置的结构示意图。Fig. 3 is a schematic structural diagram of a heat dissipation device in an embodiment of the present invention.
具体实施方式Detailed ways
下面结合附图详细说明本发明的具体实施例。Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
本发明实施例提供了一种散热装置及服务器,通过在服务器中使用导风装置与供风装置配合,提高了服务器的散热效率。Embodiments of the present invention provide a heat dissipation device and a server, and the heat dissipation efficiency of the server is improved by using an air guiding device in the server to cooperate with an air supply device.
请参阅图2,为本发明实施例中的服务器的内部结构示意图,包括服务器机架20,在服务器机架20中设有散热装置、I/O刀片模块22和其他刀片模块23,I/O刀片模块22与其他刀片模块23之间通过总线进行连接通信。Please refer to FIG. 2, which is a schematic diagram of the internal structure of the server in the embodiment of the present invention, including a
所述散热装置包括供风装置21、温控装置、传感器和导叶24,其中:导叶24和供风装置21固定服务器机架20上,传感器位于供风装置21所在的供风口上,即相应的各个刀片模块23的供风通道上,或者位于各个相应的刀片模块23上,用于感应相应刀片模块23的温度,所述导叶24设置在供风装置21的供风口。The heat dissipation device includes an
在所述供风装置21开始供风后,各个传感器感应各自对应的刀片模块23的温度,将感应的温度信号(具体可为感应的刀片模块23的温度值或超出预定阈值的温度差值)传送至所述温控装置。所述温控装置位于服务器中相应电路控制主板上,所述温控装置根据传送的温度信号确定此时温度比较高的刀片模块,然后调节导叶向温度信号较高的刀片模块偏转,风流从而将所述供风装置21提供的风流大部份引导至所述温度较高的刀片模块上。After the
本发明实施例中,所述温控装置包括一档位调节电路,所述档位电路中存储了各个刀片模块23与调节导叶24偏转角度的对应关系,即根据各个刀片模块23的位置预先设定所述导叶24需要偏转的角度,当需要将风流引导至其中一个刀片模块时,只需控制所述导叶24偏转与所述刀片模块对应的偏转角度即可。在所述传感器24感应刀片模块23的温度,并将感应到的温度信号返回给档位调节电路后,所述档位调节电路根据传感器返回的温度情况不同,确定此时温度较高的刀片模块,然后根据各个刀片模块23与调节导叶24偏转角度的对应关系,调节所述导叶24偏转预先设定的偏转角度,以将供风装置提供的风流转移到的所述温度较高的刀片模块23上。In the embodiment of the present invention, the temperature control device includes a gear adjustment circuit, and the gear circuit stores the corresponding relationship between each
本发明实施例中的服务器只使用一个供风装置21进行散热,在实际需求中可以在服务器机架20内设有一个或多个并排的供风装置21,在每个供风装置21的供风口都设有自动调节风向的导叶24,所述散热装置与刀片模块23前后并列在服务器中,通过该装置为系统提供风源,再通过该装置进行导风,将风流通过导叶24引导至相应的刀片模块23中。The server in the embodiment of the present invention only uses one
图3示出了本发明实施例中的散热装置的结构示意图,该散热装置51中设置了多个风扇53和导叶52,图中示出了5个风扇53和导叶52,所述导叶52设于风扇53的供风口。所述散热装置中还包括档位调节电路、传感器54和定位齿轮,该档位调节电路位于服务器中的控制装置中,传感器54位于发热物件附近,本发明实施例以刀片模块中为例进行说明。当某刀片模块的芯片温度超过预定极限的时候,通过预先在刀片模块上设置的传感器54将感应的温度信号(具体可为温度超出预定阈值的大小)反馈到服务器中的温控装置中,所述温控装置包括档位调节电路,所述档位调节电路接收所述温度信号,根据预先设置好的程序,自动调节导叶52的偏转一定方向使风流转向温度超标较高的刀片模块的风道上,使该刀片模块处的温度降低,如果有多个刀片模块的温度过高时,可以将每个刀片模块上所对应的导叶调节,使偏转一定方向使风流转向温度过高的多个刀片模块。Fig. 3 shows a schematic structural view of a heat dissipation device in an embodiment of the present invention, a plurality of
具体的,所述档位电路中存储了各个刀片模块与调节导叶52偏转角度的对应关系,即根据各个刀片模块的位置预先设定所述导叶52需要偏转的角度,当需要将风流引导至其中一个刀片模块时,只需控制所述导叶52偏转与所述刀片模块对应的偏转角度即可。在所述传感器54感应刀片模块的温度,并将感应到的温度信号返回给档位调节电路后,所述档位调节电路根据传感器返回的温度情况不同,确定此时温度较高的刀片模块,然后根据各个刀片模块与调节导叶52偏转角度的对应关系,调节所述导叶52偏转预先设定的偏转角度,以将供风装置提供的风流转移到的所述温度较高的刀片模块上。Specifically, the corresponding relationship between each blade module and the
所述自动调节导叶52的方向可以通过调节定位齿轮或其他方式来实现,所述档位调节电路根据温度变化调节定位齿轮来改变导叶52方向,将风流转移到刀片模块。通过所述方法的实现可以不用提升风扇转速或者牺牲风扇的性能来达到保护器件的目的,从而可以节能降噪、提升风扇使用寿命。在具体实施时,可以根据服务器的空间大小和刀片模块的具体数量设置相应的风扇数量,如果部署的刀片模块相对较少,可以少设置风扇和相应的导叶,使该散热供风性能达到最佳。如果在此过程中所有的刀片模块都达到极限位置,可以通过档位调节电路将导叶52的偏转角度调节到最佳位置或者使风流导向调节达到最佳,从而使刀片模块中所得到的风流最多,使散热效果达到最佳。The automatic adjustment of the direction of the
通过所述导叶24应用于刀片服务器时,当刀片模块较少时,该导叶24可以更好的将供风装置21提供的风流通过风道引导给温度较高的刀片模块。所述导叶24也可以应用于其它服务器中,通过与其它服务器中的供风装置配置,将供风装置提供的风通过服务器其内部的风道引导给相应的元器件中,从而减少元器件的局部受热。When the
综上所述,通过本发明实施例中的散热装置使服务器供风可以更加合理将风分配到所需要的模块中,提高系统的供风效率。通过使用所述散热装置中的导叶,可以有效合理利用所述供风装置提供的风流,不必提升供风装置中的风扇转速,从而延长风扇的使用寿命,并且解决了服务器的供风不均而带来的系统风流浪费。To sum up, through the heat dissipation device in the embodiment of the present invention, the air supply to the server can be more reasonably distributed to required modules, and the air supply efficiency of the system can be improved. By using the guide vanes in the heat dissipation device, the air flow provided by the air supply device can be effectively and rationally used without increasing the fan speed in the air supply device, thereby prolonging the service life of the fan and solving the uneven air supply of the server And the system waste caused by wind.
以上所揭露的仅为本发明实施例中的一种较佳实施例而已,当然不能以此来限定本发明之权利范围,因此依本发明权利要求所作的等同变化,仍属本发明所涵盖的范围。What is disclosed above is only a preferred embodiment of the embodiments of the present invention, and of course it cannot limit the scope of the present invention. Therefore, the equivalent changes made according to the claims of the present invention are still covered by the present invention. scope.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102411417A (en) * | 2010-09-23 | 2012-04-11 | 鸿富锦精密工业(深圳)有限公司 | Counter data centre and radiating system thereof |
| CN102866748A (en) * | 2012-08-22 | 2013-01-09 | 曙光信息产业(北京)有限公司 | High-density computing blade server |
| CN103135721A (en) * | 2011-11-28 | 2013-06-05 | 国际商业机器公司 | Heat sink with orientable fins |
| CN104317372A (en) * | 2014-09-30 | 2015-01-28 | 杭州华为数字技术有限公司 | Method and device for regulating cooling of terminal and terminal |
| CN104597995A (en) * | 2010-09-20 | 2015-05-06 | 亚马逊科技公司 | System with air flow under data storage devices |
| CN106020394A (en) * | 2016-05-16 | 2016-10-12 | 联想(北京)有限公司 | Temperature control method and server |
| CN108916097A (en) * | 2018-06-29 | 2018-11-30 | 深圳市同泰怡信息技术有限公司 | Server fan control method and server |
| CN110319043A (en) * | 2018-03-28 | 2019-10-11 | 阿里巴巴集团控股有限公司 | Cooling system and server |
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- 2008-06-03 CN CNA2008100284949A patent/CN101291575A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104597995A (en) * | 2010-09-20 | 2015-05-06 | 亚马逊科技公司 | System with air flow under data storage devices |
| CN102411417A (en) * | 2010-09-23 | 2012-04-11 | 鸿富锦精密工业(深圳)有限公司 | Counter data centre and radiating system thereof |
| CN102411417B (en) * | 2010-09-23 | 2016-05-11 | 鸿富锦精密工业(深圳)有限公司 | Container data center and cooling system thereof |
| CN103135721A (en) * | 2011-11-28 | 2013-06-05 | 国际商业机器公司 | Heat sink with orientable fins |
| CN102866748A (en) * | 2012-08-22 | 2013-01-09 | 曙光信息产业(北京)有限公司 | High-density computing blade server |
| CN102866748B (en) * | 2012-08-22 | 2017-12-01 | 曙光信息产业(北京)有限公司 | A kind of high density calculates blade server |
| CN104317372A (en) * | 2014-09-30 | 2015-01-28 | 杭州华为数字技术有限公司 | Method and device for regulating cooling of terminal and terminal |
| CN106020394A (en) * | 2016-05-16 | 2016-10-12 | 联想(北京)有限公司 | Temperature control method and server |
| CN110319043A (en) * | 2018-03-28 | 2019-10-11 | 阿里巴巴集团控股有限公司 | Cooling system and server |
| CN108916097A (en) * | 2018-06-29 | 2018-11-30 | 深圳市同泰怡信息技术有限公司 | Server fan control method and server |
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