CN101364461A - Open-hole constant-resistance chip resistor and manufacturing method thereof - Google Patents

Abstract

The invention discloses an open-hole resistance-fixed chip resistor and a manufacturing method thereof, wherein a base material and a metal sheet with a central open hole are oppositely combined through a combination layer, and a protection layer is covered on the local surface of the metal sheet, so that the part of the surface of the metal sheet, which is not covered by the protection layer, is divided into two electrode areas, thereby eliminating unnecessary current conduction impedance in the prior art and effectively and stably reducing the Temperature Coefficient of Resistance (TCR), and the combination design of the base material and the metal sheet can eliminate the high cost defect of the prior art using a semiconductor process, thereby achieving the effects of easy manufacture, improving the process yield and reducing the cost.

Description

Open hole fixed resistance chip resistor and its manufacturing method

technical field

The invention relates to a resistor, in particular to an aperture fixed-resistance chip resistor and a manufacturing method thereof.

Background technique

In response to the development trend of portability and miniaturization of various electronic devices, chip resistors, which are often used in circuits to measure the potential difference between both ends, are also becoming more and more miniaturized. In order to reduce measurement errors To increase the detected current value, it usually needs to have low resistance and high power characteristics with a resistance value of 0.02Ω to 10Ω and a rated allowable power of more than 0.1W, and must meet the requirements of reducing the temperature coefficient of resistance (TCR). Currently, printing is usually used Under the existing process technology of or coating technology, there are practical difficulties that are difficult to mass-produce cheaply.

China Taiwan Announcement No. 350071 patent case discloses a chip resistor, which is printed on a ceramic substrate using screen printing technology (the material is a resistor glue mixed with glass and conductive particles), and then dried, high-temperature sintered and other processes. After molding, laser trimming is used to melt part of the area to form grooves to adjust its resistance value, and finally the electrode is made by electroplating process. However, since the resistive film is formed by printing, it is difficult to control the uniformity of its thickness, and the resistance value of the resistive film varies greatly due to the diffusion variation of high temperature sintering. Especially, when the aforementioned chip resistor is applied in a high-frequency environment, due to the high porosity and loose structure of the resistive film, the high-frequency signal loss is relatively large, so it cannot be applied to high-frequency products.

Another method using coating technology is to use physical vapor deposition (PVD) such as sputtering (Sputter Deposition) or evaporation (Evaporation) on a ceramic substrate, or chemical vapor deposition (CVD), etc. Semiconductor processes create resistive films. Since chip resistors are manufactured using semiconductor manufacturing processes, the investment in equipment is extremely expensive. Coupled with the limitation of semiconductor manufacturing process yields, the manufacturing cost is too expensive and greatly reduces product competitiveness. At the same time, since the patterning operation for the resistive film in the aforementioned semiconductor manufacturing process is formed by lithography technology, and the subsequent processing needs to be removed after the photoresist film is removed, however, incomplete or excessive removal often occurs when removing the photoresist film. In the case of exposure, the resistive film is exposed and easily polluted or oxidized, which affects its electrical characteristics and relatively reduces the process yield.

In order to overcome the aforementioned problems, the Taiwan Patent No. I237898 discloses a manufacturing method. First, two main electrodes respectively located at both ends of the insulating substrate are formed on the upper surface of an insulating substrate, and then a resistive film is formed on the aforementioned insulating substrate by thin film deposition. On the upper surface of the insulating substrate in the step, a first protection layer is formed on the resistance film in the previous step by printing, the first protection layer at least shields at least part of the resistance film between the main electrodes and makes the resistance film between the main electrodes Part of the resistance film on the main electrode adjacent to the end side is exposed, and the first protection layer part between the main electrodes extends without interruption, and the first protection layer is used as a mask to remove the resistance of the exposed part. film, and finally form two-end surface electrodes on the two ends of the insulating substrate in the previous steps and respectively shield the corresponding main electrodes.

However, the aforementioned technology still uses semiconductor process technology, and the problems of high cost and poor yield still exist. Moreover, it is necessary to add two additional coating processes for protective layers, which increases the process cost. In addition, the resistive film is indirectly electrically connected to the end electrode through the main electrode, which will cause the temperature coefficient of resistance (TCR) of the resistive film and the main electrode to be combined with each other to increase, resulting in the resistance of the fabricated chip resistor The temperature coefficient cannot be reduced to the required value, and even affects its heat dissipation efficiency.

Therefore, the above-mentioned existing technology has defects such as low process yield, high equipment and process costs, and the inability to reduce the temperature coefficient of resistance to the required value. Therefore, how to propose a chip resistor and its manufacturing method that can effectively solve the above defects It is actually a problem to be solved urgently in the technology of this field.

Contents of the invention

In view of the disadvantages of the background technology described above, an object of the present invention is to provide an aperture fixed resistance chip resistor whose temperature coefficient of resistance can be stably reduced to a required value and a manufacturing method thereof.

Another object of the present invention is to provide an aperture fixed resistance chip resistor which is easy to manufacture and can improve the process yield and its manufacturing method.

Another object of the present invention is to provide a cost-reduced aperture fixed resistance chip resistor and a manufacturing method thereof.

In order to achieve the above object and other objects, the present invention provides an aperture fixed resistance chip resistor, comprising: a base material; a metal sheet having a central opening to define its resistance value; a bonding layer relatively combining the base material and the metal sheet a sheet; and a protective layer covering a part of the surface of the metal sheet, so that the part of the surface of the metal sheet not covered by the protective layer is divided into two electrode regions.

In the aforementioned open-hole fixed-resistance chip resistors, the basic requirement for the base material used is to have insulation properties, and there is no specific limitation, for example, a ceramic substrate can be used. The basic characteristic requirement of the metal sheet is to predefine its resistance value. In one embodiment, the metal sheet is an alloy metal sheet of copper, manganese, and tin; in another embodiment, the metal sheet is copper, manganese, and tin. Alloy metal sheets of manganese and nickel. The central opening of the metal sheet is based on the principle that the area can be calculated and converted into a resistance value, and there is no specific limitation. For example, its shape can be selected from circles, squares, rhombuses, trapezoids, and equiangular polygons. one of them. In addition, the resistance value of the metal sheet is defined by the area of the central opening, and the resistance value is proportional to the area of the central opening. For example, when the central opening is circular, the larger the aperture, the greater the resistance value. relatively larger.

The bonding layer can be a whole layer of solder bumps, or one of at least two solder bumps spaced apart from each other. The basic principle of the protection layer is to provide protection for the area other than the second electrode area of the metal sheet. In one embodiment, the protection layer covers the surface of the middle area of the metal sheet, so that the surface of the metal sheet corresponds to the two sides of the middle area. The terminal area is divided into two electrode areas; in another embodiment, electrodes can also be formed on the surface of the two electrode areas of the metal sheet, for welding to a circuit board that needs to measure the potential difference, for example, preferably, the The electrodes are formed on the surface of the electrode region by barrel plating.

In order to achieve the same purpose, the present invention also provides a method for manufacturing an aperture fixed resistance chip resistor, comprising: providing a base material and a metal sheet, wherein the metal sheet has a central opening to define its resistance value; Combining the base material and the metal sheet; and covering a protective layer on a partial surface of the metal sheet, so that the part of the metal sheet surface not covered by the protective layer is divided into two electrode regions.

In the above method, the central opening of the metal sheet can be made by one of the methods selected from stamping and cutting, wherein the stamping method can be punching, and the cutting method can be drilling and milling. One of the hole jobs.

The bonding layer can be at least two solder bumps spaced apart from each other, and there is no specific limitation on its shape or size. In one embodiment, the welding material is pre-coated on the surface of the base material, and after bonding the metal sheet, it is reduced by heat fusion to form the solder bump that joins the base material and the metal sheet; in another embodiment Among them, the welding material is pre-coated on the surface of the metal sheet, and after bonding the base material, it is reduced by hot melting to form the solder block that joins the base material and the metal sheet. The soldering material is based on the principle that it is close to the temperature coefficient of resistance of the base material and the metal sheet, and has better thermal conductivity. There is no specific limitation, for example, silver paste can be used.

Since the open-hole fixed-resistance chip resistor and its manufacturing method provided by the present invention use a bonding layer to relatively bond the base material and the metal sheet, the disadvantages of high cost of using semiconductor manufacturing processes in the prior art can be eliminated, and easy to manufacture, The effect of improving process yield and reducing cost; and the part of the surface of the metal sheet that is not covered with the protective layer is directly divided into two electrode areas, which can be used to directly form electrodes that are conducive to welding, and can also directly provide welding applications, thereby eliminating existing Technology unnecessary current conduction impedance, effectively and stably reduces the temperature coefficient of resistance.

Description of drawings

1A to FIG. 1F are schematic flow diagrams showing the first embodiment of the manufacturing method of the open-hole fixed-resistance chip resistor of the present invention;

2A to 2F are schematic flow diagrams showing the second embodiment of the manufacturing method of the open-hole fixed-resistance chip resistor of the present invention; and

FIG. 3 is a schematic diagram showing the heat conduction of the open-hole fixed-resistance chip resistor in use according to the present invention.

Description of component symbols

1 Substrate 2 Metal sheet

21 Central opening 23 Electrode area

3 bonding layer 4 protection layer

5 Electrodes 6 External Devices

61 line contacts

Detailed ways

The implementation of the present invention is described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

1A to FIG. 1G are flowcharts drawn according to the first embodiment of the manufacturing method of the aperture fixed resistance chip resistor of the present invention. As shown in the figure, the manufacturing method of the aperture fixed resistance chip resistor provided by the present invention includes but not limited to the processes described below.

As shown in FIG. 1A and FIG. 1B , firstly, a base material 1 and a metal sheet 2 with a central opening 21 are provided. The substrate 1 mentioned above is an example of a ceramic substrate using alumina as the main material, but it is based on the basic characteristic requirement of having insulation properties, and there is no specific limitation. The metal sheet 2 defines its resistance value with the central opening 21. In this embodiment, the material of the metal sheet 2 includes alloy metal sheets of copper, manganese, and tin, but not limited thereto. In other embodiments Alloy metal sheets including copper, manganese, and nickel may also be used. The central opening 21 is based on the basic principle that the area can be calculated and converted into a resistance value, and there is no specific limitation. For example, its shape can be selected from a circle, a square, a rhombus, a trapezoid, and an equiangular polygon. , to be shaped in advance by stamping or cutting, such as punching, and cutting such as drilling or milling.

As shown in FIG. 1C and FIG. 1D , the substrate 1 and the metal sheet 2 are relatively combined through a bonding layer 3 . The bonding layer 3 can use at least two solder bumps spaced apart from each other, so as to further adjust the resistance value of the metal sheet 2 through the relative positions and widths of the two solder bumps. The formation sequence of the bonding layer 3 is not specifically limited. In this embodiment, the welding material is pre-coated on the surface of the substrate 1, and after the metal sheet 2 is bonded, the substrate is bonded by thermal fusion reduction. 1 and the bonding layer 3 of the metal sheet 2, such as solder bumps, the solder material is silver paste as an example.

Of course, the above-mentioned bonding layer 3 is not limited to using at least two solder bumps spaced apart from each other. For example, any bonding material that can provide a thermal fusion bonding process and has thermal conductivity can be used. For example, a whole layer of silver paste can also be printed on the The surface of the base material 1 is baked, melted and dried to bond and fix the base material 1 and the metal sheet 2. The whole layer of silver paste is equivalent to the aforementioned bonding layer 3, for example, two solder bumps. It is not limited to the two welding blocks shown in this embodiment. In addition, the steps of baking and drying and curing are equivalent to the reflow process, which can be baked in an environment of 250° C., and dried and cured naturally at room temperature. The same is not limited to this, and baking and drying can be achieved The curing methods all conform to the thermal fusion bonding described in the present invention.

As shown in Figure 1E, then cover a protective layer 4 to the partial surface of the metal sheet 2, so that the part of the surface of the metal sheet 2 that is not covered with the protective layer 4 is divided into two electrode regions 23, so far the step has been regarded as manufacturing Finished products of open-hole fixed-resistance chip resistors. The protective layer 4 is basically required to provide insulation effect. In this embodiment, for example, insulating materials such as epoxy resin are used to cover the surface of the middle section of the metal sheet 2 (including the top surface and the side surface) by coating. ), so that the two ends of the surface of the metal sheet 2 corresponding to the middle region are divided into two electrode regions 23 . In practical applications, the two electrode regions 23 separated by the surface of the metal sheet 2 can be directly welded to an external device, such as directly welded to a predetermined circuit of a circuit board.

As shown in Figure 1F, due to the convenience of welding in subsequent practical applications, electrodes 5 can be formed on the surface of the two electrode regions 23 of the metal sheet 2, respectively, for welding to a circuit board that needs to measure the potential difference, for example, in a In a preferred embodiment, the electrode 5 is formed to the surface of the electrode region 23 by barrel plating, but it is not limited thereto. For example, any method that can directly form the electrode 5 on the surface of the electrode region 23 can be used. The basic conditions are It is no longer connected through any medium between the two, for example, other electroplating methods or thermocompression methods can be used, which are all feasible methods without intermediate media. Since the purpose of forming the electrode 5 is to provide convenience for external welding, the material of the electrode 5 is preferably an alloy material with tin, such as an alloy including copper, nickel, and tin.

What needs to be particularly stated is that in this embodiment, the production process of manufacturing a single-hole fixed-resistance chip resistor is used as an example for illustration, but it is not specified that the technical idea of the present invention is limited to this, and all production for mass production Conventional methods, such as integrating the aforementioned ceramic substrate 1 into a state of multiple matrix arrangements, and integrating the fixed resistance resistors 2 into a state of multiple matrix arrangements, after synchronously completing multiple open-hole fixed resistance chip resistors through subsequent processes, Then the order cutting is completed, and the process steps should be covered by the present invention without departing from the technical idea of the present invention, and the batch production synchronization operation and order cutting operation are commonly used by those skilled in the art and can It can be implemented after understanding, and will not be repeated here in combination with other embodiments.

2A to FIG. 2G are flow charts drawn according to the second embodiment of the manufacturing method of the opening fixed resistance chip resistor of the present invention, wherein the manufacturing method of the opening fixed resistance chip resistor disclosed includes most of the same as the aforementioned first The manufacturing process of the embodiment does not change the structure of any open-hole fixed-resistance chip resistors. In order to make the description clear and easy to understand, all the same components will be represented by the same symbols, and the labels will not be distinguished separately, only for detailed description The commonality and change of the process are the main ones.

As shown in FIGS. 2A and 2B , firstly, a base material 1 and a metal sheet 2 with a central opening 21 are provided. The characteristics and changes of the base material 1 and the metal sheet 2 are the same as those of the first embodiment, and will not be repeated here.

As shown in FIG. 2C and FIG. 2D , the base material 1 and the metal sheet 2 are relatively combined through a bonding layer 3 . The bonding layer 3 can be at least two solder bumps spaced apart from each other, or a whole layer of solder material as mentioned above, and the order of its formation is not specifically limited. In this embodiment, the bonding layer 3, which takes two solder bumps as an example, is The welding material is pre-coated on the surface of the metal sheet 2, and after bonding the base material 1, it is reduced by heat fusion to form a bonding layer 3, such as a solder bump, that joins the base material 1 and the metal sheet 2. The solder material is silver paste as an example. The properties and changes of the bonding layer 3 are the same as those of the first embodiment, and will not be repeated here.

As shown in FIG. 2E and FIG. 2F, the step of covering the protective layer 4 and the step of forming electrodes 5 on the surface of the two electrode regions 23 according to actual application requirements, and the characteristics and changes of the protective layer 4 and the electrodes 5 are uniform. It is the same as the first embodiment, and will not be repeated here.

In addition, the present invention also provides an open-hole fixed-resistance chip resistor, as shown in FIG. 1E or FIG. 2E , comprising a substrate 1, a metal sheet 2 having a central opening 21, and relatively combining the substrate 1 and the metal sheet 2. The bonding layer 3 and the protective layer 4 covering part of the surface of the metal sheet 2 are used to separate the part of the surface of the metal sheet 2 not covered by the protective layer 4 into two electrode regions 23 . Simultaneously, this metal sheet 2 defines its resistance value with the area of this central opening 21, and this resistance value is directly proportional to the area of this central opening 21, and for example when this central opening 21 is circular, its aperture is more The larger the resistance value is, the larger it is.

The aforementioned material properties and structural changes of the base material 1 , the metal sheet 2 , the bonding layer 3 , and the protective layer 4 are the same as those described in the aforementioned manufacturing method, and will not be repeated here. In addition, the aperture fixed resistance chip resistor provided by the present invention may also include electrodes 5 formed on the surface of the two electrode regions 23 as shown in FIG. 1F or FIG. 2F .

FIG. 3 is a schematic diagram showing the heat conduction of the open-hole fixed-resistance chip resistor provided by the present invention when it is applied to an external device, as shown in the figure. The electrode 5 on the surface of the two electrode area 23 of the open-hole fixed resistance chip resistor can be welded to the corresponding line contact 61 in the circuit of the external device 6 (such as a circuit board). In response to the structural design of the aforementioned open-hole fixed resistance chip resistor, the electrode 5 is directly connected to the metal sheet 2, so when the metal sheet 2 works to generate heat, as shown in the direction of the arrow in the figure, due to the barrier of the protective layer 4, the heat conduction is directed toward the base material 1 with better thermal conductivity, and then the base material 1 The material 1 is conducted to the line contact 61 via the electrodes on both sides of the metal sheet 2 as a better path. Therefore, the heat can be thermally diffused through the substrate 1, and at the same time be directly conducted to the printed circuit of the external device 6 through the circuit contact 61, preventing the heat from directly spreading to the bottom and causing the external device 6, such as a circuit board, to be burned. Thus, And it can effectively suppress the excessive change of the temperature coefficient of resistance caused by the temperature rise of the electrode 5 and the metal sheet 2, so it can be applied to products with extremely low resistance value.

To sum up, the open-hole fixed-resistance chip resistor and its manufacturing method provided by the present invention use a bonding layer to relatively bond the base material and the metal sheet, thus eliminating the high-cost disadvantages of using semiconductor manufacturing processes in the prior art. It achieves the effects of easy manufacturing, improving process yield and reducing cost; and the part of the surface of the metal sheet that is not covered with the protective layer is directly divided into two electrode areas, which can be used to directly form electrodes that are conducive to welding, and can also directly provide welding applications, thereby Unnecessary current conduction resistance in the prior art can be eliminated, and the temperature coefficient of resistance can be effectively and stably reduced. Therefore, the open-hole fixed-resistance chip resistor and its manufacturing method provided by the present invention have overcome various defects in the prior art.

The specific embodiments described above are only used to illustrate the characteristics and effects of the present invention, rather than to limit the scope of the present invention. Without departing from the spirit and technical scope of the present invention, any application of the present invention Equivalent changes and modifications accomplished through the disclosed content should still be covered by the scope of the claims.

Claims (23)

1. An aperture fixed-resistance chip resistor, comprising: Substrate; a metal sheet having a central opening defining its electrical resistance; a bonding layer relatively bonding the substrate and the metal sheet; and The protection layer covers a part of the surface of the metal sheet, so that the part of the surface of the metal sheet not covered by the protection layer is divided into two electrode regions. 2. The open hole constant resistance chip resistor according to claim 1, wherein the metal sheet is an alloy metal sheet of copper, manganese, and tin. 3. The open-hole constant-resistance chip resistor according to claim 1, wherein the metal sheet is an alloy metal sheet of copper, manganese, and nickel. 4 . The aperture fixed resistance chip resistor according to claim 1 , wherein the shape of the central aperture is one selected from a circle, a square, a rhombus, a trapezoid, and an equiangular polygon. 5 . The aperture fixed resistance chip resistor according to claim 1 , wherein the resistance value of the metal sheet is defined by the area of the central opening, and the resistance value is proportional to the area of the central opening. 5 . 6 . The open hole fixed resistance chip resistor according to claim 1 , wherein the protective layer covers the surface of the middle region of the metal sheet, so that two ends of the surface of the metal sheet corresponding to the middle region are divided into two electrode regions. 7. The open-hole fixed-resistance chip resistor according to claim 6, further comprising two electrodes respectively formed on the surface of the two-electrode region of the metal sheet. 8. The open-hole fixed-resistance chip resistor according to claim 1, wherein the protective layer is made of epoxy resin. 9. The open hole constant resistance chip resistor according to claim 1, wherein the substrate is a ceramic substrate. 10. The open-hole fixed-resistance chip resistor according to claim 9, wherein the material of the ceramic substrate is alumina. 11. The open-hole fixed-resistance chip resistor according to claim 1, wherein the bonding layer is one of a whole layer of solder bumps and at least two solder bumps spaced apart from each other. 12. A method for making an aperture fixed-resistance chip resistor, comprising: providing a substrate and a metal sheet, wherein the metal sheet has a central opening to define its electrical resistance; relatively bonding the substrate and the metal sheet through a bonding layer; and A protection layer is covered on the partial surface of the metal sheet, so that the part of the metal sheet surface not covered with the protection layer is divided into two electrode regions. 13 . The method for manufacturing an aperture fixed-resistance chip resistor according to claim 12 , wherein the central aperture of the metal sheet is formed by one of methods selected from stamping and cutting. 14 . 14 . The method for manufacturing an aperture fixed resistance chip resistor according to claim 13 , wherein the punching method is a punching operation. 15 . 15 . The manufacturing method of the aperture fixed resistance chip resistor according to claim 13 , wherein the cutting method is one of drilling operation and hole milling operation. 16 . 16 . The method for manufacturing an open-hole fixed-resistance chip resistor according to claim 12 , wherein the bonding layer is one of a whole layer of solder bumps and at least two solder bumps spaced apart from each other. 17. The manufacturing method of the open-hole fixed-resistance chip resistor according to claim 16, wherein the welding material is pre-coated on the surface of the base material, and after bonding the metal sheet, the base material is bonded to the base material through thermal fusion reduction. material and the solder bump of the metal sheet. 18. The manufacturing method of the open-hole fixed-resistance chip resistor according to claim 16, wherein the solder material is pre-coated on the surface of the metal sheet, and after bonding the base material, the base material is bonded to the base material through thermal fusion reduction. material and the solder bump of the metal sheet. 19. The method for manufacturing an open-hole fixed-resistance chip resistor according to claim 17 or 18, wherein the solder material is silver paste. 20. The method for manufacturing an open-hole fixed-resistance chip resistor according to claim 17 or 18, wherein the solder material is baked, melted and dried to bond and fix the base material and the metal sheet. 21. The method for manufacturing an open-hole fixed-resistance chip resistor according to claim 12, wherein the protective layer covers the surface of the middle region of the metal sheet, so that the two ends of the metal sheet surface corresponding to the middle region are divided into two parts. electrode area. 22 . The method for manufacturing an aperture fixed-resistance chip resistor according to claim 12 , further comprising forming electrodes on the surfaces of the two electrode regions of the metal sheet. 23. The method for manufacturing an open-hole fixed-resistance chip resistor according to claim 22, wherein the electrode is formed on the surface of the electrode region by barrel plating.

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