CN101374388B - Method for preparing fine line flexible circuit board with high peeling strength - Google Patents
Method for preparing fine line flexible circuit board with high peeling strength Download PDFInfo
- Publication number
- CN101374388B CN101374388B CN2008100270927A CN200810027092A CN101374388B CN 101374388 B CN101374388 B CN 101374388B CN 2008100270927 A CN2008100270927 A CN 2008100270927A CN 200810027092 A CN200810027092 A CN 200810027092A CN 101374388 B CN101374388 B CN 101374388B
- Authority
- CN
- China
- Prior art keywords
- layer
- matrix
- circuit board
- thin copper
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000011159 matrix material Substances 0.000 claims abstract description 27
- 238000004544 sputter deposition Methods 0.000 claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 239000004809 Teflon Substances 0.000 claims abstract description 7
- 229920006362 Teflon® Polymers 0.000 claims abstract description 7
- 239000010935 stainless steel Substances 0.000 claims abstract description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 4
- 229920006267 polyester film Polymers 0.000 claims abstract description 4
- 229920001721 polyimide Polymers 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 238000007747 plating Methods 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 57
- 238000012545 processing Methods 0.000 abstract description 11
- 239000011888 foil Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 abstract 1
- 229920006397 acrylic thermoplastic Polymers 0.000 abstract 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 abstract 1
- 229920002379 silicone rubber Polymers 0.000 abstract 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 14
- 239000005030 aluminium foil Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910000939 field's metal Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a method for producing a fine line flexible circuit board with high racking strength, including the following steps: selecting a metal foil as the carrier, vacuum sputtering alayer of sputtering metal level, which can improve the racking strength of the thin copper and the carrier, on one side of the metal foil, then coiling the planting thin copper layer on the sputtering metal level; selecting a film matrix which is coated with B stage modified epoxy or B stage acrylics or polyester film of TPI resin or polyimide film or liquid crystal polymer film on one side or ondouble sides; placing the thin copper layer with metal foil, release paper layer, silicon rubber layer, Teflon layer, stainless steel layer on surface of one side or double sides of the matrix in sequence from inside out; and then pressing the thin copper layer with metal foil carrier on surface of one side of the matrix or on surfaces of the double sides of the matrix separately. Comparing withthe prior art, the equality of the racking strength is effectively ensured at last, and the processing control is simple, the affinity between the matrix and the thin copper layer is good, the rackingstrength is high, the yield rate is high, and the cost for processing is low; the method is suitable for processing circuit boards with small-bore, and has high reliability; the electroplated layer is uniform and is suitable for producing a large amount of fine line products; the method can be used for producing flexible circuit boards with broad width, the utility ratio of the material is high and the efficiency is high.
Description
Technical field
The present invention relates to a kind of manufacture method of fine line flexible circuit board of high-peeling strength.
Background technology
Under the driving of the miniaturization of electronic product, liquid crystal display electron product high speed development, obtained on the application market of flexible electric circuit board enlarging fast.Flexibility coat copper plate is as its main raw material, and current technology and the market of being in is all in the situation that increases fast.In the LCD drive IC, it plays the effect of carrying IC chip, circuit communication, insulation support.Have high fine circuit, it is high that the lead-in wire positional precision is installed is its main feature.Produce the circuit board of high fine circuit, thin copper foil (thickness is less than 9 micron copper foils) flexibility coat copper plate is a critical material.
Name is called ultrathin copper foil and the tellite of being with carrier, the applying date is 2006.12.14, publication number is the patent of invention of CN1984526A, it is by foils, peel ply and ultrathin copper foil constitute, adopt electric plating method between foils and ultrathin copper foil, to form certain thickness peel ply, because foils has certain roughness, the electrodeposited coating that forms homogeneous on foils is very difficult, when electroplating, ultrathin copper foil can produce a large amount of pin holes, can significantly reduce pin hole though at first impact copper facing, but can not can't guarantee consistent peel strength from avoiding the appearance of this defective in essence.Peel ply is by the metal A that keeps fissility with the plating metal B easy to implement of ultrathin copper foil is constituted in addition, and the metal A that wherein constitutes peel ply better is selected from Mo, Ta, V, Mn, W, Cr, and metal B better is Fe, Co, Ni, Cr.Peel ply can electroplate liquid be formed or form different ratio of componentss by changing the plating condition by changing, and the purpose of this method is to need high-peeling strength on the one hand, and defectives such as peel strength is even, does not bubble, layering; The ultrathin copper foil of the band carrier of at high temperature peeling off easily on the other hand, so control is very complicated on its technology, its cost is also higher.
At present there has been the method for human magnetron sputtering to make printed substrate, be called a kind of magnetron sputtering process of making printed circuit board, the applying date utilized as name and be 2003.9.19, publication number patent of invention for CN1527656A, disclosing a kind of method is that the technology that forms line layer is electroplated in sputter then in the boring of insulation single layer of substrate material.Directly form conductive layer (plantation layer) at matrix surface, electroplate then and finish, this technology for matrix require high, especially for flexibility coat copper plate, the KAPTON EN that has only at present DuPont to produce in the world can really meet the demands, and peel strength is lower, and overall cost is high especially, and has limited the market application of this technology.
Summary of the invention
Purpose of the present invention is intended to overcome above-mentioned the deficiencies in the prior art, provide that affinity is good between a kind of matrix and the thin copper layer, peel strength is higher, high yield, processing cost are lower, be fit to the processing of circuit board small-bore, have the manufacture method of the fine line flexible circuit board of high reliability and the simple high-peeling strength of technology controlling and process.
Manufacture method according to the fine line flexible circuit board of a kind of high-peeling strength provided by the invention may further comprise the steps:
1), the formation of the thin copper of band carrier metal paper tinsel: choose metal forming as carrier, the thickness of metal forming is 8 μ m to 50 μ m, width is 100mm to 1000mm, can improve the splash-proofing sputtering metal layer of thin copper and described carrier peel strength at side surface vacuum sputtering one deck of metal forming, the thickness of this splash-proofing sputtering metal layer is 100 dust to 300 dusts, web-like is electroplated thin copper layer on this splash-proofing sputtering metal layer then, and the thickness of this thin copper layer is 2 μ m to 35 μ m.
2), the making of the copper-clad plate of band carrier metal paper tinsel: choose the polyester film of single face or the two-sided B of scribbling rank modified epoxy or B rank acrylic resin or TPI resin or the film matrix of polyimide film or liquid crystalline polymer film; Place thin copper layer, off-style paper layer, silastic-layer, Teflon layer, the stainless steel layer of band metal forming from the inside to the outside successively at matrix one side surface or both sides; Carry out pressing then, will the band metal forming thin copper layer be pressed together on a side surface of matrix or be pressed together on the matrix both side surface respectively, the temperature of pressing be 150 the degree to 330 the degree, the time is 0.3 hour to 3 hours, pressure is 1.5Mpa to 4Mpa; Off-style paper layer on the matrix, silastic-layer, Teflon layer, stainless steel layer are peeled off described matrix.
3), the copper-clad plate of band carrier metal paper tinsel is drilled through via according to the designing requirement of circuit board, boring is finished after etching and is fallen outer field metal forming.
4), hole metallization.
5), the designing requirement according to circuit board adds thick copper layer with the copper-clad plate electric plating of whole board.
6), the making of circuitous pattern:
7), lamination.
8), surface treatment.
The present invention also comprises following additional technical feature:
Described metal forming is made by aluminum or aluminum alloy or nickel or nickel alloy material.
Described metal forming is made by aluminum or aluminum alloy or nickel or nickel alloy material.
Described splash-proofing sputtering metal layer is copper or manganese or iron or tungsten or nickel or chromium or nichrome.
The thickness of described metal forming is 8 μ m or 12 μ m or 20 μ m or 35 μ m or 50 μ m; width is 100mm or 250mm or 500mm or 750mm or 1000mm; the thickness of described splash-proofing sputtering metal layer is 100 dusts or 150 dusts or 300 dusts, and the thickness of described thin copper layer is 2 μ m or 25 μ m or 35 μ m.
Step 2) temperature of pressing is 150 degree or 180 degree or 330 degree in, and the time is 0.3 hour or 2 hours or 3 hours, and pressure is 1.5Mpa or 2Mpa or 3Mpa or 4Mpa.
Electroplating current is 0.5ASD to 4ASD in the step 5), and electroplating time is 15 minutes to 120 minutes.
The present invention compares with present technology, has following advantage: the present invention adopts the mode of sputter to form sputtering layer, and sputtering layer thickness can not change because of the roughness of carrier metal paper tinsel, and finally guarantees the homogeneity of peel strength.Sputtering layer is made of a kind of metal in addition, the present invention does not need to consider simultaneously to peel off easily under high-peeling strength and the high temperature these two features, consider actual track plate manufacture craft demand, just consider high-peeling strength, the more effective quality of stability that improved just erodes the carrier metal paper tinsel after the boring of circuit board processing technology, play the effect of improving drilling quality, be very easy to control on its technology, cost is lower.Moreover affinity is good, peel strength is higher between film matrix of the present invention and the thin copper layer, high yield, and its processing cost is lower in addition; Be fit to the processing of circuit board small-bore on the technology, have high reliability; Even, the suitable fine rule in enormous quantities road product of producing of electrodeposited coating; Can produce big wide cut flexible electric circuit board, stock utilization height, efficient height.
Description of drawings
Below in conjunction with accompanying drawing, describe the present invention in detail:
Fig. 1 is the structural representation of the thin copper of band carrier metal paper tinsel among the present invention;
Fig. 2 is the structural representation when making the copper-clad plate of being with the carrier metal paper tinsel among the present invention;
Fig. 3 is the structural representation of the copper-clad plate of band carrier metal paper tinsel of the present invention.
Embodiment
Embodiment one
A kind of manufacture method of fine line flexible circuit board of high-peeling strength may further comprise the steps:
1); the formation of the thin copper (referring to Fig. 1) of band aluminium foil: choose aluminium foil (1) as carrier; the thickness of aluminium foil is 8 μ m to 50 μ m; preferred 8 μ m or 12 μ m or 20 μ m or 35 μ m or 50 μ m; width is 100mm to 1000mm; preferred 100mm or 250mm or 500mm or 750mm or 1000mm; can improve the sputter copper layer (2) of thin copper and described carrier peel strength at side surface vacuum sputtering one deck of aluminium foil; the thickness of this sputter copper layer is 100 dust to 300 dusts; preferred 100 dusts or 150 dusts or 300 dusts; web-like is electroplated thin copper layer (3) on this sputter copper layer then; the thickness of this thin copper layer is 2 μ m to 35 μ m, preferred 2 μ m or 5 μ m or 9 μ m or 12 μ m.
2), the making (referring to Fig. 2, Fig. 3) of the copper-clad plate of band aluminium foil: choose the polyester film of single face or the two-sided B of scribbling rank modified epoxy or B rank acrylic resin or TPI resin or the film matrix (4) of polyimide film or liquid crystalline polymer film; Place the thin copper layer of being with aluminium foil from the inside to the outside successively at matrix one side surface or both side surface (present embodiment is a both side surface), off-style paper layer (5), silastic-layer (6), Teflon layer (7), stainless steel layer (8), carry out pressing then, the thin copper layer of band carrier metal paper tinsel is pressed together on the both side surface of matrix respectively, the temperature of pressing is that 150 degree are to 330 degree, preferred 150 degree of the temperature of pressing or 180 degree or 330 degree, time is 0.3 hour to 3 hours, time is preferably 0.3 hour or 2 hours or 3 hours, pressure is 1.5Mpa to 4Mpa, preferred 1.5Mpa of pressure or 2Mpa or 3Mpa or 4Mpa; Off-style paper layer on the matrix, silastic-layer, Teflon layer, stainless steel layer are peeled off described matrix.
3), the copper-clad plate of band aluminium foil is drilled through via according to the designing requirement of circuit board, boring is finished after etching and is fallen outer field aluminium foil.
4), hole metallization, this step can adopt different forms according to prior art, no longer describes in detail here.
5), according to the designing requirement of circuit board the copper-clad plate electric plating of whole board is added thick copper layer, electroplating current is 0.5ASD to 4ASD, is preferably 0.5ASD or 2ASD or 4ASD; Electroplating time is 15 minutes to 120 minutes, is preferably 25 minutes.
6), the making of circuitous pattern: make the circuit egative film according to designing requirement, select the dry film of suitable thickness, adopt high-resolution egative film or adopt LDI (laser direct imaging) exposure sources to carry out image transfer.Select suitable etching solution for use, adjust its parameter such as electrode potential, temperature, concentration, pressure be to the scope of setting, and carries out etch process.
7), lamination: with ready-made double sided board flexible substrate and corresponding coverlay lamination, pressing under HTHP.Select perhaps that the photonasty coverlay is vacuum abutted, exposure, develop, the back curing process finishes the protection to circuit.
8), surface treatment, this step can adopt different forms according to prior art, no longer describes in detail here.
Embodiment two
Be step 1) with above-mentioned enforcement difference, choose alloy foil or nickel foil or nickel alloy foil as carrier, the back operation is with embodiment one.
Embodiment three
Be step 1) with embodiment one difference, described splash-proofing sputtering metal layer (2) is manganese or iron or tungsten or nickel or chromium or nichrome, and the back operation is with embodiment one.
The present invention adopts the mode of sputter to form sputtering layer, and sputtering layer thickness can not change because of the roughness of carrier metal paper tinsel, and finally guarantees the homogeneity of peel strength.Sputtering layer is made of a kind of metal in addition, the present invention does not need to consider simultaneously to peel off easily under high-peeling strength and the high temperature these two features, consider actual track plate manufacture craft demand, just consider high-peeling strength, the more effective quality of stability that improved just erodes the carrier metal paper tinsel after the boring of circuit board processing technology, play the effect of improving drilling quality, be very easy to control on its technology, cost is lower.Moreover affinity is good, peel strength is higher between matrix of the present invention and the thin copper layer, high yield, and its processing cost is lower in addition; Be fit to the processing of circuit board small-bore, have high reliability; Even, the suitable fine rule in enormous quantities road product of producing of electrodeposited coating; Can produce big wide cut flexible electric circuit board, stock utilization height, efficient height.
The foregoing description is only for the usefulness that the present invention is described; and be not be to the invention restriction; the those of ordinary skill in relevant technologies field; under the situation that does not break away from the spirit and scope of the present invention; can also make various variations and modification; therefore all technical schemes that are equal to also should belong to category of the present invention, and scope of patent protection of the present invention should be limited by each claim.
Claims (6)
1. the manufacture method of the fine line flexible circuit board of a high-peeling strength is characterized in that may further comprise the steps:
1), the formation of the thin copper of band carrier metal paper tinsel: choose metal forming (1) as carrier, the thickness of metal forming is 8 μ m to 50 μ m, width is 100mm to 1000mm, can improve the splash-proofing sputtering metal layer (2) of thin copper and described carrier peel strength at side surface vacuum sputtering one deck of metal forming, the thickness of this splash-proofing sputtering metal layer is 100 dust to 300 dusts, web-like is electroplated thin copper layer (3) on this splash-proofing sputtering metal layer then, and the thickness of this thin copper layer is 2 μ m to 35 μ m;
2), the making of the copper-clad plate of band carrier metal paper tinsel: choose the polyester film of single face or the two-sided B of scribbling rank modified epoxy or B rank acrylic resin or TPI resin or the film matrix (4) of polyimide film or liquid crystalline polymer film; Place thin copper layer, off-style paper layer (5), silastic-layer (6), Teflon layer (7), the stainless steel layer (8) of being with the carrier metal paper tinsel from the inside to the outside successively at matrix one side surface or both sides; Carry out pressing then, thin copper layer that will band carrier metal paper tinsel is pressed together on a side surface of matrix or is pressed together on the matrix both side surface respectively, the temperature of pressing be 150 degree to 330 degree, the time is 0.3 hour to 3 hours, pressure is 1.5Mpa to 4Mpa; Off-style paper layer on the matrix, silastic-layer, Teflon layer, stainless steel layer are peeled off described matrix;
3), the copper-clad plate of band carrier metal paper tinsel is drilled through via according to the designing requirement of circuit board, boring is finished after etching and is fallen outer field carrier metal paper tinsel;
4), hole metallization;
5), the designing requirement according to circuit board adds thick copper layer with the copper-clad plate electric plating of whole board;
6), the making of circuitous pattern;
7), lamination;
8), surface treatment.
2. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1 is characterized in that described carrier metal paper tinsel (1) made by aluminum or aluminum alloy or nickel or nickel alloy material.
3. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1 is characterized in that described splash-proofing sputtering metal layer (2) is copper or manganese or iron or tungsten or nickel or chromium or nichrome.
4. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1; the thickness that it is characterized in that described carrier metal paper tinsel is 8 μ m or 12 μ m or 20 μ m or 35 μ m or 50 μ m; width is 100mm or 250mm or 500mm or 750mm or 1000mm; the thickness of described splash-proofing sputtering metal layer is 100 dusts or 150 dusts or 300 dusts, and the thickness of described thin copper layer is 2 μ m or 5 μ m or 9 μ m or 12 μ m or 35 μ m.
5. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1, it is characterized in that step 2) in the temperature of pressing be 150 degree or 180 degree or 330 degree, time is 0.3 hour or 2 hours or 3 hours, and pressure is 1.5Mpa or 2Mpa or 3Mpa or 4Mpa.
6. the manufacture method of the fine line flexible circuit board of high-peeling strength according to claim 1 is characterized in that electroplating current is 0.5ASD to 4ASD in the step 5), and electroplating time is 15 minutes to 120 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100270927A CN101374388B (en) | 2008-03-28 | 2008-03-28 | Method for preparing fine line flexible circuit board with high peeling strength |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100270927A CN101374388B (en) | 2008-03-28 | 2008-03-28 | Method for preparing fine line flexible circuit board with high peeling strength |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101374388A CN101374388A (en) | 2009-02-25 |
| CN101374388B true CN101374388B (en) | 2010-06-02 |
Family
ID=40448229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100270927A Active CN101374388B (en) | 2008-03-28 | 2008-03-28 | Method for preparing fine line flexible circuit board with high peeling strength |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101374388B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107227457A (en) * | 2016-03-24 | 2017-10-03 | 琦芯科技股份有限公司 | Copper foil with carrier and sputtering type inorganic composite film and preparation method thereof |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036509B (en) * | 2009-09-25 | 2013-03-27 | 北大方正集团有限公司 | Method for electroplating blind hole and through hole of circuit board |
| CN101699939B (en) * | 2009-11-05 | 2011-04-06 | 深南电路有限公司 | Method for rolling PCB |
| CN102233699B (en) * | 2010-04-29 | 2013-10-16 | 南亚塑胶工业股份有限公司 | Ultra-thin copper foil with ultra-low ridge line copper foil as carrier and manufacturing method thereof |
| CN102281721B (en) * | 2011-05-20 | 2013-01-09 | 深圳市崇达电路技术股份有限公司 | Manufacture method of printed circuit board with surface-pressure covering film |
| CN103135335A (en) * | 2011-11-29 | 2013-06-05 | 北大方正集团有限公司 | Negative plate manufacture method and device for printed circuit board |
| KR101517553B1 (en) * | 2013-10-14 | 2015-05-04 | 한국생산기술연구원 | Method for forming metal patterns of printedcircuit board |
| CN103974549A (en) * | 2014-05-26 | 2014-08-06 | 深圳市智武科技有限公司 | Manufacturing method for circuit board line |
| CN104476847B (en) * | 2014-12-02 | 2017-05-17 | 广州方邦电子股份有限公司 | Flexible copper-clad plate having high peel strength and manufacture method thereof |
| JP6236120B2 (en) * | 2015-06-24 | 2017-11-22 | Ｊｘ金属株式会社 | Copper foil with carrier, laminate, laminate production method, printed wiring board production method, and electronic device production method |
| JP6236119B2 (en) * | 2015-06-24 | 2017-11-22 | Ｊｘ金属株式会社 | Copper foil with carrier, laminate, laminate production method, printed wiring board production method, and electronic device production method |
| JP6339636B2 (en) * | 2015-08-06 | 2018-06-06 | Ｊｘ金属株式会社 | Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method |
| JP6200042B2 (en) * | 2015-08-06 | 2017-09-20 | Ｊｘ金属株式会社 | Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method |
| CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
| CN106585046B (en) * | 2016-11-28 | 2019-08-23 | 珠海亚泰电子科技有限公司 | Manufacturing process of ultramicro thin copper-clad plate and five-axis laminating machine matched with same |
| CN106784026A (en) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | A kind of solar cell wiring board and preparation method thereof |
| CN109097750A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097751A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097749A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097772A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN109097748A (en) * | 2017-12-15 | 2018-12-28 | 深圳科诺桥科技股份有限公司 | The preparation method of flexibility coat copper plate |
| CN108718485B (en) * | 2018-06-07 | 2021-02-02 | 珠海元盛电子科技股份有限公司 | Semi-additive technology for manufacturing fine-wire thick-copper double-sided FPC |
| CN110798969A (en) * | 2018-12-10 | 2020-02-14 | 广州方邦电子股份有限公司 | Take rubber coating metal forming and circuit board of carrier |
| CN110785016A (en) * | 2018-12-10 | 2020-02-11 | 广州方邦电子股份有限公司 | Glue-coated metal foil and circuit board |
| CN110418507B (en) * | 2019-08-19 | 2020-11-06 | 台山市精诚达电路有限公司 | Manufacturing process of high-frequency high-speed flexible circuit board |
| CN110978576B (en) | 2019-12-20 | 2021-09-10 | 江门市德众泰工程塑胶科技有限公司 | Preparation method of liquid crystal polymer film |
| CN114449758A (en) * | 2020-10-30 | 2022-05-06 | 昆山东威科技股份有限公司 | Preparation method and production system of sheet metal-clad conductive layer board |
| CN113386416B (en) * | 2021-07-08 | 2022-12-16 | 江西柔顺科技有限公司 | Heat-conducting double-sided copper-clad plate and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1281020A (en) * | 2000-07-19 | 2001-01-24 | 湖北省化学研究所 | Reaction-type flame-retarding adhesive for flexible PCB and its preparing process |
| CN1527656A (en) * | 2003-09-19 | 2004-09-08 | 波 曹 | Magnetically controlled sputtering process of making printed circuit board |
| CN1984526A (en) * | 2005-12-15 | 2007-06-20 | 古河电路铜箔株式会社 | Ultrathin copper foil with carrier and printed circuit board |
-
2008
- 2008-03-28 CN CN2008100270927A patent/CN101374388B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1281020A (en) * | 2000-07-19 | 2001-01-24 | 湖北省化学研究所 | Reaction-type flame-retarding adhesive for flexible PCB and its preparing process |
| CN1527656A (en) * | 2003-09-19 | 2004-09-08 | 波 曹 | Magnetically controlled sputtering process of making printed circuit board |
| CN1984526A (en) * | 2005-12-15 | 2007-06-20 | 古河电路铜箔株式会社 | Ultrathin copper foil with carrier and printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107227457A (en) * | 2016-03-24 | 2017-10-03 | 琦芯科技股份有限公司 | Copper foil with carrier and sputtering type inorganic composite film and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101374388A (en) | 2009-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101374388B (en) | Method for preparing fine line flexible circuit board with high peeling strength | |
| CN1657279B (en) | Treated copper foil and circuit board | |
| CN1770953B (en) | Surface treated copper foil and circuit board | |
| JP4087369B2 (en) | Ultra-thin copper foil with carrier and printed wiring board | |
| US4190474A (en) | Method of making a printed circuit board having mutually etchable copper and nickel layers | |
| WO2015076372A1 (en) | Manufacturing method for printed wiring board provided with buried circuit, and printed wiring board obtained by the manufacturing method | |
| EP0996319B1 (en) | Composite material used in making printed wiring boards | |
| JPWO2014196576A1 (en) | Copper foil with carrier, copper clad laminate, printed wiring board, electronic device, resin layer, method for producing copper foil with carrier, and method for producing printed wiring board | |
| CN104125711A (en) | Copper foil for high frequency circuit, copper-clad plate for high frequency circuit, printed wiring plate, copper foil with carrier, electronic equipment and manufacturing method for printed wiring plate | |
| JP2004535515A (en) | Composite foil and method of manufacturing the same | |
| US7172818B2 (en) | Copper foil for chip-on-film use, plasma display panel, or high-frequency printed circuit board | |
| KR102118245B1 (en) | Composite metal foil, copper-clad laminate using the composite metal foil, and manufacturing method of the copper-clad laminate | |
| WO2015033917A1 (en) | Surface-processed copper foil, copper clad laminate obtained using such surface-processed copper foil, and printed wiring board | |
| CN108156753A (en) | Surface treatment copper foil, Copper foil with carrier, laminate, the manufacturing method of printing distributing board and e-machine manufacturing method | |
| CN100359994C (en) | Chip-on-film use copper foil | |
| CN105074058B (en) | Ultra-thin copper foil with carrier, copper clad laminate and coreless substrate | |
| JP2004119961A (en) | Copper foil for chip-on-film, plasma display, or high-frequency printed wiring board | |
| US4311768A (en) | Printed circuit board having mutually etchable copper and nickel layers | |
| CN102233699A (en) | Ultra-thin copper foil using ultra-low ridge copper foil as carrier and manufacturing method thereof | |
| US4260449A (en) | Method of forming a printed circuit | |
| EP0996318B1 (en) | Novel composite foil, process for producing the same and copper-clad laminate | |
| US11665828B2 (en) | Method for manufacturing FCCL capable of controlling flexibility and stiffness of conductive pattern | |
| JP3615973B2 (en) | Novel composite foil and manufacturing method thereof, copper-clad laminate | |
| KR101012919B1 (en) | Flexible metal laminate without adhesive and its manufacturing method | |
| JP2014201778A (en) | Copper foil with carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20090327 Address after: Room C2-204, Chuangxin building, Guangzhou Science City, Guangzhou, Guangdong, Luogang District 510000, China Applicant after: Guangzhou Lijia Electronic Co., Ltd. Address before: Plaza No. 836 Guangzhou Yuexiu District City, Guangdong Province Dongfeng East Road 4 room 1605 post encoding: 510080 Applicant before: Su De |
|
| ASS | Succession or assignment of patent right |
Owner name: GUANGZHOU LIJIA ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SU ZHI Effective date: 20090327 |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGZHOU FANGBANG ELECTRONICS CO., LTD. Free format text: FORMER OWNER: GUANGZHOU LIJIA ELECTRONIC CO., LTD. Effective date: 20141230 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510000 GUANGZHOU, GUANGDONG PROVINCE TO: 510660 GUANGZHOU, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141230 Address after: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee after: Guangzhou Fangbang Electronic Co., Ltd. Address before: 510000 C2-204 room, innovation building, Guangzhou Science City, Guangzhou, Guangdong, Luogang District Patentee before: Guangzhou Lijia Electronic Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee after: GUANGZHOU FANGBANG ELECTRONICS CO., LTD. Address before: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee before: Guangzhou Fangbang Electronic Co., Ltd. |