CN101431869A - Shell body jointing structure of electronic device - Google Patents

Abstract

The invention is a shell joint structure of electronic device, at least including: the first shell is provided with a joint part, and the joint part is sequentially provided with a first convex part, a first groove and a second convex part from the outer side surface to the inner side surface; and a second shell having a joint part, wherein the joint part is provided with a first convex part and a first concave groove in sequence from the outer side surface to the inner side direction. The first groove and the second protrusion of the joint of the first shell are opposite to the first protrusion and the first groove of the joint of the second shell, and the inner side surface of the first protrusion of the joint of the first shell is adjacent to the outer side surface of the joint of the second shell, so that the first shell and the second shell are jointed with each other. The design and the joint mode of the shell joint structure can not only increase the electric creepage distance and the electric characteristic of the electronic device, but also strengthen the strength of the shell joint structure.

Description

Housing joint structure of electronic device

technical field

The invention relates to a shell joint structure, in particular to a shell joint structure of an electronic device.

Background technique

In daily life, people often use various electronic devices, such as power adapters, transformers, power supplies, and power connectors. Since these electronic devices need to properly isolate and protect the electronic components and circuits on their internal circuit carriers, they all use casings to cover these electronic components and circuits to avoid direct contact with the outside world. Since the design and joining method of the shell joint structure will affect the appearance, structural strength and electrical characteristics of the electronic device, how to design a proper shell joint structure of the electronic device has become a very important research and development topic.

Please refer to FIG. 1 , which is a schematic diagram showing the junction structure of a casing of a conventional electronic device. As shown in FIG. 1 , the casing joint structure of a traditional electronic device mainly includes an upper casing 1 and a lower casing 2, wherein both the upper casing 1 and the lower casing 2 are box structures, and the upper casing 1 has a joint portion. 11. The lower case 2 has a corresponding joint portion 21 , and the joint portion 11 of the upper case 1 and the joint portion 21 of the lower case 2 are engaged with each other to complete the combination of the upper case 1 and the lower case 2 .

Please refer to FIG. 2 , which is an enlarged structural view of the joint portion of the upper and lower housings in the structure shown in FIG. 1 . As shown in FIG. 2 , a first convex portion 112 , a first groove 113 and a second convex portion 114 are sequentially formed on the joint portion 11 of the upper housing 1 from the outer surface 110 to the inner surface 111 . In addition, the joint portion 21 of the lower case 2 forms a first concave portion 212, a first convex portion 213, and a second concave portion 214 sequentially from the outer surface 210 to the inner surface 211, and are respectively connected to the first convex portion of the joint portion 11. 112 . The first groove 113 is opposite to the second protrusion 114 . In addition, there is a rib 215 on the first protrusion 213 of the joint part 21, and the width of the first protrusion 213 of the joint part 21 is slightly smaller than the width of the first groove 113 of the joint part 11, so that when the upper casing When 1 is engaged with the lower case 2, the first convex portion 213 of the engaging portion 21 can be accommodated in the first groove 113 of the engaging portion 11.

Please refer to FIGS. 3( a ) to 3 ( b ), which are schematic diagrams showing the joining manner of the structure shown in FIG. 2 . As shown in Figure 3 (a), when the housing is to be joined, firstly, the first protrusion 112, the first groove 113 and the second protrusion 114 of the joint portion 11 of the upper housing 1 are respectively connected to the lower housing. The first concave part 212, the first convex part 213 and the second concave part 214 of the joint part 21 of 2 are opposite, and then use the ultrasonic welding technology to directly produce super high The frequency of the sound wave vibration causes the upper and lower shells 1 and 2 to rub against each other violently, and the rib 215 on the first convex portion 213 of the joint part 21 melts into the inner wall of the first groove 113 of the joint part 11 in an instant , as shown in FIG. 3( b ), thereby achieving the purpose of joining the upper and lower housings 1 and 2 .

However, in the traditional shell joint structure, when the upper and lower shells 1, 2 are joined, the electrical creepage distance formed between the joints 11, 21 is relatively not long enough, so there may be electrical leakage. The situation occurs, which indirectly affects the electrical characteristics of the electronic device. In addition, the joint strength between the upper case 1 and the lower case 2 is not good, so that the ability of the electronic device to withstand external impact is low. To solve this problem, it is usually necessary to increase the joint portion 11 of the upper case 1 and the lower case 2 at the same time. The thickness of the joint part 21 is, for example, about 3 mm or more, so the material cost will increase. In addition, in order to increase the electrical creepage distance in the traditional housing joint structure, the length of the second convex part 114 of the joint part 11 of the upper housing 1 cannot be reduced, so that when the external force is perpendicular to the outer surface of the joint part 11, 21 When impacted in the direction of the second convex portion 114, it is easy to break due to its fragile structure, and even destroy the joint structure of the shells, resulting in the separation of the upper shell 1 and the lower shell 2 .

Therefore, how to avoid the lack of the above-mentioned known technology, and develop a shell joint structure of electronic devices that can increase the electrical creepage distance and strengthen the joint strength of the shells after the shells are assembled is an urgent problem to be solved at present.

Contents of the invention

The main purpose of the present invention is to provide a housing joint structure of an electronic device, which can increase the electrical creepage distance and improve the joint strength of the housing after the housings are combined, thereby increasing the structural strength and electrical characteristics of the electronic device.

In order to achieve the above object, the present invention provides a shell joint structure of an electronic device, which at least includes: a first shell having a joint portion, and the joint portion has a first convex portion, a first the groove and the second protrusion; and the second casing, which has a joint portion, and the joint portion has a first protrusion and a first groove in sequence from the outer surface to the inner side. Wherein, the first groove and the second protrusion of the joint part of the first housing are relative to the first protrusion and the first groove of the joint part of the second housing, and the first protrusion of the joint part of the first housing The inner side surface of the convex part abuts the outer side surface of the engaging part of the second case, thereby engaging the first case and the second case with each other.

In order to achieve the above purpose, the present invention further provides a shell joint structure of an electronic device, which at least includes: a first shell having a joint portion, and the joint portion has a first convex portion, a second A groove and a second protrusion, wherein the first protrusion defines an opening on the first housing; and the second housing has a joint, and the joint has first protrusions in sequence from the outer side to the inner side part with the first groove. Wherein, the first groove and the second protrusion of the joint portion of the first housing are relative to the first protrusion and the first groove of the joint portion of the second housing, and the second housing is embedded in the first housing. The opening of the body, thereby engaging the first housing and the second housing with each other.

The beneficial effect of the present invention is that, through the shell joint structure design and joint method of the present invention, not only the electrical creepage distance and the electrical characteristics of the electronic device can be increased, but also the strength of the shell joint structure can be strengthened.

Description of drawings

FIG. 1 is a schematic diagram of a casing joint structure of a conventional electronic device.

FIG. 2 is an enlarged structural view of the joint portion of the upper and lower housings in the structure shown in FIG. 1 .

3( a ) to 3 ( b ) are schematic diagrams showing the bonding method of the structure shown in FIG. 2 .

FIG. 4 is a schematic diagram of the joint structure of the housing of the electronic device according to the preferred embodiment of the present invention.

FIG. 5 is a schematic diagram of housing assembly of the structure shown in FIG. 4 .

FIG. 6 is an enlarged structural view of the joint portion of the first housing and the second housing in the structure shown in FIG. 4 .

FIG. 7 is an enlarged structural view of the joint portion of the first housing and the second housing according to another preferred embodiment of the present invention.

8( a ) to 8 ( b ) are schematic diagrams showing the bonding method of the structure shown in FIG. 6 .

Wherein, the reference signs are explained as follows:

1: Upper shell 11: Joint

110: Outer side 111: Inner side

112: The first convex part 113: The first groove

114: Second convex part 2: Lower shell

21: joint part 210: outer surface

211: inner surface 212: first recess

213: The first convex part 214: The second concave part

215: convex rib 3: first shell

31: Joint 32: Opening

4: Second housing 41: Joint

42: Outer surface 43: Support components

310: Outer side 311: Inner side

312: The first convex part 313: The first groove

314: Second convex part 315: Inner side

316: convex rib 317: side

312a: end 313a: inner wall

314a: End 410: Outer side

411: The first convex part 412: The first groove

413: Platform 414: Convex Rib

415: side 412a: inner wall

H1, H2, h: height D, d1, d2, d3: width

Detailed ways

Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the description in the following paragraphs. It should be understood that the invention is capable of various changes in different forms without departing from the scope of the invention, and that the description and illustrations are illustrative in nature and not limiting of the invention.

Please refer to FIG. 4 , which is a schematic diagram of the casing joint structure of the electronic device according to a preferred embodiment of the present invention. As shown in FIG. 4 , the casing joint structure of the electronic device of the present invention can be applied to electronic devices such as but not limited to power adapters, transformers, power supplies, and power connectors, and the casing of the electronic device of the present invention The joint structure is mainly composed of the joint between the first shell 3 and the second shell 4, wherein the first shell 3 has a joint portion 31, and the second shell 4 has a joint portion 41, through the joint of the first shell 3 The joint portion 31 and the joint portion 41 of the second housing 4 are engaged with each other, so that the first housing 3 and the second housing 4 can be combined. In some embodiments, the first housing 3 is preferably in a box structure, and the second housing 4 is preferably in a cover or a plate, wherein the outline of the opening 32 of the first housing 3 is consistent with that of the second housing 4. The outer peripheral contours of the two shells 4 match, and the opening 32 of the first shell 3 can be embedded by the second shell 4, thus after the second shell 4 is embedded in the opening 32 of the first shell 3 The housing assembly can be completed, and the assembled structure is shown in FIG. 5 . In some embodiments, after the second housing 4 is embedded in the opening 32 of the first housing 3 , the outer surface 42 of the second housing 4 can be substantially in contact with the end of the joint portion 31 of the first housing 3 . flush. In some other embodiments, a plurality of supporting components 43 may be disposed on the outer surface 42 of the second housing 4 , and the plurality of supporting components 43 may support the electronic device when the electronic device is placed on a plane.

Please refer to FIG. 6 , which is an enlarged structural view of the joint portion of the first casing and the second casing in the structure shown in FIG. 4 . As shown in FIG. 6 , the joint portion 31 of the first housing 3 includes a first convex portion 312 , a first groove 313 and a second convex portion 314 in sequence from the outer surface 310 to the inner surface 311 , wherein the first concave The groove 313 is defined by the first protrusion 312 and the second protrusion 314 , and there is a height difference h between the end 312 a of the first protrusion 312 and the end 314 a of the second protrusion 314 . In addition, the joint portion 41 of the second housing 4 forms a first protrusion 411 , a first groove 412 and a platform 413 sequentially from the outer surface 410 to the inner direction, wherein the first groove 412 is composed of the first protrusion 411 and the platform 413 . Platform 413 is defined and formed.

In this embodiment, the inner surface 315 of the first convex portion 312 of the first housing 3 is opposite to the outer surface 410 of the joint portion 41 of the second housing 4 , and the first groove 313 of the first housing 3 is aligned with the second housing 4 . The two protrusions 314 are respectively opposite to the first protrusion 411 and the first groove 412 of the second housing 4 , and the side 317 of the second protrusion 314 of the first housing 3 is opposite to the side 415 of the platform 413 . In addition, the width of the first protrusion 411 of the second housing 4 is substantially smaller than the width of the first groove 313 of the first housing 3, and the width of the second protrusion 314 of the first housing 3 is substantially slightly smaller than the width of the first groove 313 of the first housing 3. It is smaller than the width of the first groove 412 of the second housing 4 . In addition, the sum of the width d1 of the first protrusion 312 , the width d2 of the first groove 313 , and the width d3 of the second protrusion 314 of the first housing 3 at the joint portion 31 is substantially the same as that of the first housing 3 at the joint portion 31 . The shell thickness D of the non-joint area of the side is equal, so the outer surface 310 of the joint 31 of the first shell 3 is flat and flush with the non-joint area of the side of the first shell 3 . The first convex portion 312 of the first housing 3 defines an opening 32 on the first housing 3. Since the second housing 4 can be tightly fitted into the opening 32 of the first housing 3, the joint portion 31 The inner surface 315 of the first extension part 312 of the first extension part 312 can be directly adjacent to the outer surface 410 of the joint part 41 of the second housing 4, and the second housing 4 is embedded behind the opening 32 of the first housing 3, because the first The depth H1 of the inner surface 315 of the first convex portion 312 of the casing 3 is substantially equal to the height H2 of the outer surface 410 of the joint portion 41 of the second casing 4, so that the end portion 312a of the first convex portion 312 is aligned with the second casing. The outer surface 42 of the body 4 lies substantially on the same level.

In some embodiments, the first convex portion 411 of the second housing 4 also has a rib 414, so that when the first housing 3 and the second housing 4 are joined by ultrasonic welding technology, the second The rib 414 on the first protrusion 411 of the housing 4 can be melted into or implanted into the inner wall 313a of the first groove 313 of the first housing 3, so that the first housing 3 and the second housing 4 are joined together . Certainly, in some embodiments, as shown in FIG. When using ultrasonic welding technology to join, the rib 316 on the second convex portion 314 of the first shell 3 is melted or implanted into the inner wall 412a of the first groove 412 of the second shell 4, so that the first shell 3 and the second housing 4 engage with each other.

Please refer to FIGS. 8( a ) to 8 ( b ), which show schematic diagrams of the bonding method of the structure shown in FIG. 6 . As shown in Figure 8(a), when the shells are to be joined, firstly the first groove 313 and the second convex portion 314 of the first shell 3 are respectively connected to the first convex portion 411 and the second convex portion 411 of the second shell 4. The first groove 412 is opposite. Then, the second casing 4 is embedded in the opening 32 of the first casing 3, and the first protrusion 411 of the second casing 4 is accommodated in the first groove 313 of the first casing 3, so that The second protrusion 314 of the first housing 3 is accommodated in the first groove 412 of the second housing 4 , so that the inner surface 315 of the first protrusion 312 of the first housing 3 is in contact with the inner surface of the second housing 4 . The outer side 410 of the joint 41 abuts, and the side 317 of the second protrusion 314 of the joint 31 abuts the side 415 of the platform 413 . Afterwards, using, for example, ultrasonic welding technology, the horn (Horn) of the ultrasonic plastic welding machine directly generates ultra-high-frequency sonic vibrations on the shell, causing the first shell 3 and the second shell 4 to produce severe friction with each other. Then, in an instant, the rib 414 on the first convex portion 411 of the second housing 4 is melted into or implanted into the inner wall 313a of the first groove 313 of the first housing 3, as shown in FIG. 8( b ), Thus, the first housing 3 and the second housing 4 can be engaged with each other through the joint portions 31 and 41 to achieve the purpose of combination. Of course, the bonding method of the present invention is not limited to the ultrasonic welding technology mentioned in the above embodiments. For example, when the convex rib 414 on the first convex portion 411 of the second housing 4 is omitted, the concave-convex contours between the first housing 3 and the joint portions 31, 41 of the second housing 4 can also be tightly fitted and engaged. , or in the way of adhesive adhesion, or in the way of locking the first shell 3 and the second shell 4 with screws, or in the buckle structure formed by the edge of the first shell 3 and the second shell 4 way to achieve the purpose of combination.

It can be understood from the structure shown in FIG. 6 that since the electrical creepage distance formed between the joint parts 31 and 41 after the first shell 3 and the second shell 4 are joined, the inner surface of the first convex part 312 of the joint part 31 can be used. 315 cooperates with the outer side 410 of the joint part 41 and utilizes the side 317 of the second convex part 314 of the joint part 31 to cooperate with the side 415 of the platform 413 of the joint part 41 to increase, so that the insulation distance is relatively sufficient, so that the electronic device can be increased. Electrical insulating properties. In addition, the inner surface 315 of the first convex portion 312 of the joint portion 31 of the first housing 3 is adjacent to the outer surface 410 of the joint portion 41 of the second housing 4, and the second housing 4 can be embedded. The opening 32 of the first shell 3, so when the external force strikes from the direction perpendicular to the outer surface 310 of the joint portion 31 of the first shell 3, the second shell 4 can assist the joint portion 31 of the first shell 3 The first protruding portion 312 provides a force to resist, thereby increasing the impact resistance of the casing. In addition, the height of the second convex portion 314 of the joint portion 31 can be lowered relatively and can be accommodated in the first groove 412 by being sandwiched by the first convex portion 411 of the second housing 4 and the platform 413, so that the first housing The second protrusion 314 of the body 3 is relatively difficult to break, which can further strengthen the strength of the joint structure of the housing.

To sum up, the shell joint structure of the electronic device of the present invention is designed through the special contour design of the joint part of the first shell and the second shell on the joint surface and the second shell is embedded in the opening of the first shell. Through the design of the shell joint structure and the joint method of the present invention, not only the electrical creepage distance and the electrical characteristics of the electronic device can be increased, but also the strength of the shell joint structure can be strengthened.

The present invention can be modified by those skilled in the art according to the above ideas, but none of them depart from the scope of protection of the appended claims.

Claims (10)

1. the casing joint structure of an electronic installation comprises at least:

One first housing has a junction surface, and this junction surface has one first protuberance, one first groove and one second protuberance in regular turn from lateral surface to medial surface direction; And

One second housing has a junction surface, and this junction surface has one first protuberance and one first groove from lateral surface to interior side direction;

Wherein, this first groove at this junction surface of this first housing and this second protuberance are respectively with respect to this first protuberance and this first groove at this junction surface of this second housing, and this lateral surface adjacency at the medial surface of this first protuberance at this junction surface of this first housing and this junction surface of this second housing makes this first housing engage each other with this second housing thus.

2. the casing joint structure of electronic installation as claimed in claim 1, wherein also has a fin on this first protuberance at this junction surface of this second housing, with when this first housing engages with this second housing, make this fin implant the inwall of this first groove of this first housing.

3. the casing joint structure of electronic installation as claimed in claim 1, wherein also has a fin on this second protuberance at this junction surface of this first housing, with when this first housing engages with this second housing, make this fin implant the inwall of this first groove of this second housing.

4. the casing joint structure of electronic installation as claimed in claim 1, wherein the width of this first protuberance of this second housing is in fact less than the width of this first groove of this first housing, and the width of this second protuberance of this first housing is in fact less than the width of this first groove of this second housing.

5. the casing joint structure of electronic installation as claimed in claim 1, wherein this first housing engages by ultrasonic waves welding mode with this second housing.

6. the casing joint structure of electronic installation as claimed in claim 1, wherein this first housing is a box body, this second housing be lid and plate body one of them, and this lateral surface at this junction surface of this first housing is essentially the plane.

7. the casing joint structure of electronic installation as claimed in claim 1, wherein this first protuberance of this first housing defines on this first housing and forms an opening, and this second housing is embedded at this opening of this first housing, and

This second housing is after being embedded at this opening of this first housing, and the end of this first protuberance of this first housing and an outer surface of this second housing are positioned in fact on the same level face.

8. case of electronic device connected structure as claimed in claim 1, wherein this junction surface of this second housing also comprises a platform, this platform and the definition of this first protuberance form this first groove, and the side adjacency of this second protuberance of the side of this platform of this second housing and this first housing.

9. the casing joint structure of an electronic installation comprises at least:

One first housing has a junction surface, and this junction surface has one first protuberance, one first groove and one second protuberance in regular turn from lateral surface to medial surface direction, and wherein this first protuberance forms an opening on this first housing; And

One second housing has a junction surface, and this junction surface has one first protuberance and one first groove in regular turn from lateral surface to interior side direction;

Wherein, this first groove at this junction surface of this first housing and this second protuberance are with respect to this first protuberance and this first groove at this junction surface of this second housing, and this second housing is embedded at this opening of this first housing, and this first housing is engaged each other with this second housing.

10. the casing joint structure of electronic installation as claimed in claim 9, wherein this second housing is after being embedded at this opening of this first housing, and the end of this first protuberance of this first housing and an outer surface of this second housing are positioned in fact on the same level face.

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