CN101452918A - Carrier plate module with embedded phase-locked loop, integrated system and manufacturing method thereof - Google Patents

Abstract

The invention relates to a carrier plate module with an embedded phase-locked loop, which is suitable for carrying functional units to form an integrated system. The carrier module comprises a substrate, a multi-layer board structure, an embedded circuit unit and an external circuit unit. The embedded circuit unit is integrated in the multi-layer board structure, the multi-layer board structure is formed in the substrate, the external circuit unit is arranged on the upper surface of the substrate and electrically coupled with the embedded circuit unit to form a phase-locked loop together with the embedded circuit unit, and the phase-locked loop is matched with the functional unit to work together.

Description

Carrier module with embedded phase-locked loop, integrated system, and manufacturing method thereof

technical field

The present invention relates to an integrated system, especially an integrated system using a carrier board module with an embedded phase-locked loop (Embedded phase-locked loop) inside, and a related manufacturing method.

Background technique

The reference oscillator signal is the basis of digital logic operation. Although the frequency stability of the output signal of the crystal oscillator is better than that of the LC oscillator, its frequency is not easy to change, and the oscillation circuit made by using a phase-locked loop (Phase-locked loop) has both a wide range of oscillation frequency and stable frequency. High precision and other excellent performance, so it is adopted by many electronic systems.

Please refer to FIG. 1 , which is a schematic diagram of a typical PLL system structure, showing the basic structure of the PLL 10 to briefly describe its operating principle. As shown in FIG. 1 , the phase locked loop 10 mainly includes a reference frequency oscillator 101 , a phase frequency comparator 103 , a voltage controlled oscillator 105 and a loop filter 107 . The reference frequency oscillator 101 outputs an oscillating signal with a frequency fr, and the voltage-controlled oscillator 105 outputs an oscillating signal with a frequency fo. The phase-frequency comparator 103 compares fr and fo, thereby outputting the error signal PD as positive and negative pulses to represent the relationship between fr and fo. The loop filter 107 then converts the error signal PD into a DC voltage signal Vr, and outputs the output frequency fo to control the voltage-controlled oscillator 105. Through this feedback structure, fo and fr can be controlled to be consistent, so that the voltage-controlled oscillator 105 The output frequency is stabilized synchronously with the reference frequency oscillator 101 .

By using the frequency divider to change the parameters of the phase-locked loop feedback path, various output frequencies can be obtained, which can be used as a clock generator for computer systems. In the communication system, the frequency synthesizer installed at the front end of various wired and wireless transceiver devices also uses the phase-locked loop to generate accurate local oscillator frequency signals to achieve the function of up-converting and down-converting radio frequency signals. In addition, many control systems (such as optical drive control systems) also use phase-locked loop technology to achieve precise control. Therefore, the phase-locked loop has gradually become an essential unit of many electronic systems.

Due to the continuous improvement of the manufacturing process, combined with semiconductor process technology, chip packaging technology and printed circuit board manufacturing technology, the electronic system can be integrated into a miniaturized module product, which becomes one of the components of the back-end product and is directly arranged on the circuit board. , so as to achieve the effect of reducing the complexity of back-end product design. In order to meet the trend of multi-functional integration and miniaturization of electronic products, module products are also facing the demand for continuous integration and miniaturization. Taking RF modules as an example, integrating multiple communication systems, or integrating communication systems and application systems in a single module is the current main development direction. However, in this way, the circuit inside the module will increase relatively.

In view of the fact that the parts and circuits of the phase-locked loop often occupy a certain construction area, the remaining available area is limited, which will cause difficulties in integrating functional units, and thus propose the present invention to improve this defect.

Contents of the invention

Therefore, the object of the present invention is to overcome the deficiencies and defects of the prior art, and propose a carrier module with an embedded phase-locked loop (Phase-locked loop), an integrated system for its application, and a related manufacturing method. By integrating and embedding the phase-locked loop in the carrier module, the surface components and circuits of the integrated system can be reduced, thereby reducing the construction area, increasing the construction density, and shortening the signal transmission path, thereby improving the carrier module and related integration. system performance and reliability.

To achieve the above purpose, the present invention provides a carrier module with an embedded phase-locked loop, the carrier module includes a substrate, a multi-layer board structure, an embedded circuit unit and an external circuit unit. The multi-layer board structure is formed in the substrate, the embedded circuit unit is integrated inside the multi-layer board structure, the external circuit unit is arranged on the upper surface of the substrate, and is electrically coupled to the embedded circuit unit to form a phase-locked circuit together. circuit.

In order to achieve the above purpose, the present invention further provides a manufacturing method, which is suitable for manufacturing the carrier module with an embedded phase-locked loop. The steps of the manufacturing method include: firstly, providing the substrate; secondly, integrating the embedded circuit unit A multi-layer board structure is formed in the substrate; finally, an external circuit unit is arranged on the upper surface of the substrate, so that the external circuit unit is electrically coupled to the embedded circuit unit.

In order to achieve the above purpose, the present invention further provides an integrated system, which has the above-mentioned carrier module with an embedded phase-locked loop and at least one functional unit, the functional unit is mounted on the upper surface of the substrate, and is electrically coupled connected to the phase-locked loop.

In order to achieve the above purpose, the present invention further provides a method for manufacturing an integrated system, the steps of which include: first, providing the carrier module with an embedded phase-locked loop; and carrying at least one functional unit on the substrate On the surface, the functional unit is electrically coupled to the phase-locked loop.

The above overview, the following detailed description and accompanying drawings are all for further explaining the ways, means and effects of the present invention to achieve the intended purpose. Other purposes and advantages of the present invention will be described in the subsequent description and accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of a system architecture of a typical phase-locked loop;

2 is a schematic diagram of the system architecture of the integrated system of the present invention;

3 is a schematic diagram of the component architecture of the phase-locked loop of the present invention;

FIG. 4 is a structural schematic diagram of a carrier board module and an integrated system with an embedded phase-locked loop of the present invention;

5 is a schematic structural view of a first embodiment of a carrier module with an embedded phase-locked loop and an integrated system of the present invention;

6 is a schematic structural view of a second embodiment of a carrier module with an embedded phase-locked loop and an integrated system of the present invention;

7 is a flow chart of the steps of the manufacturing method of the carrier module with an embedded phase-locked loop of the present invention;

FIG. 8 is a flow chart of the steps of the manufacturing method of the integrated system of the present invention.

Explanation of symbols in the figure

10, 200, 300, 400 Phase-locked loop

101, 201 Reference frequency oscillator

103 Phase Frequency Comparator

105 Voltage Controlled Oscillator

107 Loop filter

20, 30, 40 Integrated systems

203 main circuit chip

205 Peripheral passive component unit

21, 31, 41 Substrate

33, 43 Multilayer board structure

25, 35, 45 Carrier module

220, 320, 420 External circuit unit

225, 325, 425 Embedded circuit unit

250 Functional units

PD, Vr Signal

fr, fo frequency

S100～S202 Each step process

Detailed ways

The invention embeds the phase-locked loop inside the carrier board module, so as to achieve the effect of improving the surface mounting area of the integrated system. Please refer to FIG. 2 , which is a schematic diagram of the system architecture of the integrated system of the present invention. As shown in FIG. 2 , the integrated system 20 includes a phase-locked loop 200 and a functional unit 250 . The functional unit 250 is electrically coupled to the phase-locked loop 200 to work together with it.

The integrated system 20 described above is a modular system product manufactured by semiconductor molding, packaging process technology and printed circuit board manufacturing technology, and the functional unit 250 generally refers to an electronic system that needs to cooperate with the phase-locked loop 200 . In a specific embodiment, the functional unit 250 is a logic operation system (for example: a computer system), and the phase-locked loop 200 is used as a clock source (Clock source) of this system, and can generate at least one working clock signal to output to Functional unit 250 .

In another specific embodiment, the functional unit 250 is a communication front-end radio frequency signal processing system, and the phase-locked loop 200 is used as a frequency synthesizer (Frequency synthesizer) of this system to generate at least one local oscillating signal and output it to the functional unit 250. Mixer, which supports radio frequency signal processing; or the functional unit 250 outputs the radio frequency signal to the phase-locked loop 200, and uses the phase-locked loop 200 to perform frequency modulation processing such as up and down frequency on the radio frequency signal, and then transmits the adjusted radio frequency signal Return to functional unit 250.

In yet another embodiment, the functional unit 250 is a synchronous optical communication system, which utilizes the phase-locked loop 200 to perform clock recovery processing (Clock data recovery) on the data signal.

In addition to the above examples, the functional unit 250 can also be any control system, using the phase-locked loop 200 to achieve precise control, or to generate a working clock signal. The application circuit structure of the phase-locked loop 200 in the above example is in the prior art, so it will not be repeated here.

Furthermore, the integrated system 20 may include one or more phase-locked loops and functional units. In the figure, a single phase-locked loop 200 and a functional unit 250 are used as an illustration, but it is not intended to limit the scope of the present invention.

Next, please refer to FIG. 3 , which is a schematic diagram of the component structure of the phase-locked loop 200 of the present invention. The main circuit of the phase-locked loop 200 can be integrated into an integrated circuit chip for ease of application. Therefore, as shown in FIG. and a peripheral passive device unit 205 , the reference frequency oscillator 201 and the peripheral passive device unit 205 are coupled to the main circuit chip 203 to achieve circuit functions together.

In view of the fact that the existing technology mounts the module circuit on the surface of the carrier module, which limits the usable area of the module surface and leads to the difficulty of functional integration, so the present invention uses the component embedding technology to embed the phase-locked loop 200 into the carrier. inside the board module. Please refer to FIG. 3 and FIG. 4 at the same time. FIG. 4 is a schematic structural diagram of the carrier board assembly and integrated system with an embedded phase-locked loop of the present invention. The reference frequency oscillator 201 , the main circuit chip 203 and the peripheral passive components 205 of the PLL 200 are divided into an embedded circuit unit 225 and an external circuit unit 220 according to component types and circuit relationships.

In FIG. 4 , the carrier board module 25 with an embedded PLL includes a substrate 21 , a multi-layer board structure (not shown), an embedded circuit unit 225 and an external circuit unit 220 . The multi-layer board structure is formed in the substrate 21, the embedded circuit unit 225 is integrated in the multi-layer board structure by semiconductor process technology or printed circuit board build-up technology, the external circuit unit 220 is arranged on the upper surface of the substrate 21, and Electrically coupled to the embedded circuit unit 225 to form the phase-locked loop 20 together. The functional unit 250 is also mounted on the upper surface of the substrate 21 and electrically coupled to the phase-locked loop 20 .

Please refer to FIG. 5 and FIG. 6 , which are structural schematic diagrams of two embodiments of the carrier module with embedded phase-locked loop and the integrated system of the present invention.

In the integrated system 30 of FIG. 5 , the embedded circuit unit 325 is mainly a passive component, while the reference frequency oscillator 201 , the main circuit chip 203 and some components not suitable for embedding are distributed in the external circuit unit 320 .

There are roughly two methods for integrating the multilayer board structure 33 and the embedded circuit unit 325 in the substrate 31:

The first method is to use silicon chip materials through semiconductor process technology, according to circuit characteristics, use specific dielectric coefficient and resistance substrate materials, and organic glass fiber substrates to stack and integrate passive components to form embedded capacitors, resistors and transmission lines. And then form the multi-layer plate structure 33;

The second method is to use the printed circuit board build-up technology to form the multi-layer board structure 33 by using metal wires or thin-layer metal resistor film components on the dielectric material.

After the multi-layer board structure 33 in the substrate 31 is formed, the wiring and pads on its surface can be formed subsequently for carrying the components of the external circuit unit 320 and the functional unit 250 . The components of the external circuit unit 320 and the functional unit 250 can be adhered to the surface of the substrate 31 by SMT process at the same time; or all or part of the components of the external circuit unit 320 can be adhered to the substrate 31 to form a sub-module.

In the integrated system 40 of FIG. 6 , the embedded circuit unit 425 also includes the main circuit chip 203 in addition to passive components. The multi-layer board structure 43 can be formed by using a printed circuit board build-up structure, integrating metal wires and thin-layer metal resistance film elements on the dielectric material, and burying the main circuit chip 203 therein during the process. In this embodiment, the main circuit chip 203 should preferably be a thinner chip. After the multi-layer board structure 43 in the substrate 41 is formed, its surface circuits and pads are formed to mount the external circuit unit 420 and the functional unit 250 to complete the integrated system 40 .

Embedded component lines will shorten the transmission distance, thereby optimizing the electrical performance and reliability of the module; and using this process, the heat conduction column can be used to connect to the bottom layer of the substrate 31, 41 to help the main circuit chip 203 dissipate heat. In addition, it should be mentioned that the embedded circuit units 325 and 425 integrated in the above-mentioned multi-layer board structures 33 and 43 can be pre-configured with passive components and transmission line structures through circuit simulation software, referring to the dielectric parameters of substrate materials and other characteristics, so that Optimized electrical characteristics.

The manufacturing method of the above-mentioned carrier module with embedded PLL and integrated system is proposed below. Please refer to FIG. 7 , which is a flow chart of the steps of the manufacturing method of the carrier module with embedded PLL of the present invention. Please refer to FIG. 4 for related structures. As shown in Figure 7, this manufacturing method comprises the following steps:

First, a substrate 21 is provided (step S100);

Next, integrate the embedded circuit unit 225 to form a multilayer board structure within the substrate 21 (step S102) and

Finally, the external circuit unit 220 is disposed on the upper surface of the substrate 21, and the external circuit unit 220 is electrically coupled to the embedded circuit unit 225 to jointly form a phase-locked loop 200 (step S104).

The multi-layer board structure can be formed by semiconductor process technology or printed circuit board build-up technology.

Next, please refer to FIG. 8 , which is a flowchart of steps of the manufacturing method of the integrated system of the present invention. Please also refer to FIG. 4 for related structures. As shown in Figure 8, the manufacturing method comprises the following steps:

First, provide a carrier board module 25 with an embedded PLL 200 (step S200); and

Next, mount the functional unit 250 on the upper surface of the substrate 21 of the carrier module 25 , so that the functional unit 250 is electrically coupled to the phase-locked loop 200 (step S202 ).

Through the above examples, the carrier module with embedded phase-locked loop and the integrated system and the related manufacturing method of the present invention integrate the phase-locked loop into the substrate of the carrier module to reduce the occupation of the phase-locked loop The area is smaller, so that the configuration of functional circuits is more plentiful; the phase-locked loop is embedded in the substrate and the signal transmission path can be shortened, thereby improving the performance and reliability of the carrier board module and the entire integrated system. It can be seen that the technology of embedding the phase-locked loop inside the substrate of the carrier module in the present invention will simplify the structure of the carrier module, reduce related manufacturing costs, increase the available space for other circuits, and reduce the integration of the carrier module. The difficulty of the multi-function unit and the better electrical characteristics of the carrier board module are beneficial to both the manufacturing end and the back-end application.

The above is only a detailed description and drawings of specific embodiments of the present invention, and is not intended to limit the present invention. All scopes of the present invention should be based on the scope of the claims. Within the field, easily conceivable changes or modifications can be covered within the scope of the claims of the present invention.

Claims (10)

1. the carrier plate module of a tool built-in phase lock loop is characterized in that, described carrier plate module comprises:

One substrate;

One multi-layer sheet structure is formed within this substrate;

Bury circuit unit in one, be integrated in this multi-layer sheet inside configuration; And

One external circuit unit is arranged at the upper surface of this substrate, and is electrically coupled to and buries circuit unit in this, with this in bury the common phase-locked loop of forming of circuit unit.

2. carrier plate module as claimed in claim 1 is characterized in that, described multi-layer sheet structure increases layer technology via manufacture of semiconductor technology or printed circuit board (PCB) and forms.

3. carrier plate module as claimed in claim 2 is characterized in that, buries circuit unit in described and comprises a main circuit chip, increases a layer technology via printed circuit board (PCB) and is integrated in the multi-layer sheet inside configuration.

4. an integrated module is characterized in that, has carrier plate module and at least one functional unit of tool built-in phase lock loop as claimed in claim 1, and this functional unit is equipped on the upper surface of this substrate, and is electrically coupled to this phase-locked loop.

5. integrated module as claimed in claim 4 is characterized in that, described phase-locked loop produces at least one work time pulse signal and exports this functional unit to.

6. integrated module as claimed in claim 4 is characterized in that, described phase-locked loop produces at least one local concussion signal and exports this functional unit to.

7. integrated module as claimed in claim 4 is characterized in that, described functional unit is exported a radio-frequency (RF) signal to this phase-locked loop, and this phase-locked loop will be somebody's turn to do through the radio-frequency (RF) signal of adjusting again and pass this functional unit back after being adjusted according to this radio-frequency (RF) signal working frequency.

8. integrated module as claimed in claim 4, it is characterized in that, described functional unit is exported a document signal to this phase-locked loop, and back this functional unit is passed this treated document signal after doing clock pulse answer processing according to this document signal again in this phase-locked loop.

9. a manufacture method is characterized in that, is applicable to the carrier plate module of making tool built-in phase lock loop as claimed in claim 1, and this manufacture method comprises the following steps:

This substrate is provided;

Bury circuit unit in integration is somebody's turn to do and form this multi-layer sheet structure within this substrate; And

This external circuit unit is set in the upper surface of this substrate, this external circuit unit is electrically coupled to buries circuit unit in this.

10. the manufacture method of an integrated module is characterized in that, comprises the following steps:

The carrier plate module of tool built-in phase lock loop as claimed in claim 1 is provided; And

Carry the upper surface of at least one functional unit, make this functional unit be electrically coupled to this phase-locked loop in this substrate.

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