CN101466225B - Radiating device and hot pipe thereof - Google Patents
Radiating device and hot pipe thereof Download PDFInfo
- Publication number
- CN101466225B CN101466225B CN200710125271XA CN200710125271A CN101466225B CN 101466225 B CN101466225 B CN 101466225B CN 200710125271X A CN200710125271X A CN 200710125271XA CN 200710125271 A CN200710125271 A CN 200710125271A CN 101466225 B CN101466225 B CN 101466225B
- Authority
- CN
- China
- Prior art keywords
- heat
- section
- heat release
- endotherm
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 23
- 238000002791 soaking Methods 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000012080 ambient air Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical class C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Disclosed is a heat-dissipating device, which comprises a heat dissipater and a heat pipe connected with the heat dissipater; wherein, the heat pipe includes a heat-absorbing section, two heat-dissipating sections, and two connecting sections respectively connecting the heat-absorbing section and the corresponding heat-dissipating sections; the two opposite ends of the heat-absorbing respectively extend upward to form the two connecting sections; and the two heat-dissipating sections both have the arc shape and form a circular arc shape together to be connected with the heat dissipater. The two heat-dissipating sections are formed in a semi-circle shape by the free ends of the corresponding connecting sections along the same clock direction. The heat-dissipating device can increase the heat-dissipating ratio thereof without increasing the number of the heat pipes, so as to reduce the cost thereof.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly relates to a kind of heat abstractor with heat pipe.
Background technology
Along with the fast development of electronic industry, the high speed of electronic component, high frequency and integrated its caloric value that makes increase severely, and therefore heat radiation has become the problem that dealer institute emphasis is considered.
In the heat radiation field, industry normally adopts a kind of heat abstractor that heat-generating electronic elements is dispelled the heat, and this heat abstractor comprises a substrate, is located at some radiating fins and some U type heat pipes on this substrate.This substrate contacts with heat-generating electronic elements; Which is provided with some accepting grooves; On this radiating fin also correspondence be provided with some perforation; Each U type heat pipe comprises an endotherm section and extends upward the heat release section of two linearities that form respectively by the two ends of this endotherm section, and said endotherm section is contained in the accepting groove of this substrate, and said heat release section is arranged in the perforation of radiating fin.Above-mentioned heat abstractor in use, this pedestal absorbs the heat that heat-generating electronic elements produces, and is sent to radiating fin through heat pipe, finally is dispersed in the middle of the ambient air.
Yet in order to improve radiating efficiency, the heat that in time heat-generating electronic elements is produced distributes, and often need increase the quantity of heat pipe, has so also just caused the increase of the cost of heat abstractor, therefore need improve.
Summary of the invention
In view of this, being necessary to provide a kind of need not increase heat pipe quantity and have the heat abstractor than high cooling efficiency.
A kind of heat abstractor; Comprise a radiator and with the hot linked heat pipe of this radiator; Two linkage sections that this heat pipe comprises an endotherm section, two heat release section and connects this endotherm section and corresponding heat release section respectively; These two linkage sections are extended upward respectively by two opposite ends of endotherm section and form; This two equal cambers of heat release section and surround a circular arc jointly and combine with this radiator, these two heat release section form semicircular arc along identical clockwise respectively by the free end of the linkage section of correspondence.
A kind of heat pipe; Two linkage sections that comprise an endotherm section, two heat release section and connect this endotherm section and corresponding heat release section respectively; These two linkage sections are extended upward respectively by two opposite ends of endotherm section and form; This two equal cambers of heat release section and surround a circular arc jointly and combine with this radiator, these two heat release section form semicircular arc along identical clockwise respectively by the free end of the linkage section of correspondence.
Compared with prior art; Two heat release section of the heat pipe in the above-mentioned heat abstractor and the thermo-contact of radiating fin group, and these two heat release section are curved, with regard to its radiating efficiency; This heat pipe is equivalent to two traditional U type heat pipes; Therefore, the quantity that above-mentioned heat abstractor need not increase heat pipe can increase its radiating efficiency, reduces its cost.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of the heat abstractor in the present invention's one preferred embodiment.
Fig. 2 is the cutaway view of heat abstractor shown in Figure 1.
Fig. 3 is the three-dimensional exploded view of heat abstractor shown in Figure 1.
Fig. 4 is the stereogram of another angle of heat pipe in the heat abstractor shown in Figure 1.
Embodiment
With reference to the accompanying drawings, be described further in conjunction with embodiment.
Three-dimensional assembly diagram for heat abstractor in the present invention's one preferred embodiment shown in Figure 1, this heat abstractor comprise a radiator 10, are used for and a soaking plate 20 of a heat-generating electronic elements (figure does not show) thermo-contact and the heat pipe 30 that heat is passed to radiator 10 by soaking plate 20.
Please with reference to Fig. 2 and Fig. 3, it is bowl-shape that the profile of this radiator 10 roughly is, and it comprises a substrate 11 and is positioned at the radiating fin group 12 on this substrate 11.
This substrate 11 is circular plate type, and it is processed by Heat Conduction Material, like aluminium or copper etc.This substrate 11 has a bottom surface 112, and this bottom surface 112 is provided with the accepting groove 114 of a semicircle, to be used to accommodate this heat pipe 30.
This radiating fin group 12 comprises some radiating fins 121, and these radiating fins 121 are arranged on the substrate 11 radially, and one-body molded with this substrate 11, and certainly, these radiating fins 121 also can be opened with substrate and form and be attached on the substrate 11 in 11 minutes.Each radiating fin 121 comprises the last fin section 124 that is positioned at the following fin section 122 of bottom and extends upward formation from the top of this time fin section 122.The radial width of the following fin section 122 of this radiating fin 121 increases to the top from its bottom gradually, so that the outer peripheral face of this radiating fin group 12 forms taper, in the present embodiment, the bottom of this radiating fin group 12 roughly is truncated cone.The top of this radiating fin group 12 is roughly cylindrical, and the last fin section 124 of each radiating fin 121 radially protrudes in down fin section 122, to increase the area of dissipation of radiating fin group 12 as far as possible.The bottom of the last fin section 124 of these radiating fins 121 promptly is provided with an annular groove 125 near the position of following fin section 122, to be used to accommodate this heat pipe 30.The centre of this radiating fin group 12 is provided with the centre bore 126 that a longitudinal section is a T shape; To make things convenient for the manufacturing of this radiating fin group 12; The external diameter on the top of this centre bore 126 is contained in this centre bore 126 thereby form a step 127, one radiator fans (figure does not show) in the inboard of each radiating fin 121 greater than the external diameter of its bottom; And place on this step 127, this radiator fan is used for producing the air quantity that blows to this radiating fin group 12.
This soaking plate 20 also is circular plate type, and it is processed by Heat Conduction Material, like aluminium or copper etc.This soaking plate 20 comprises a bottom surface 21 and an end face 22; This bottom surface 21 contacts with this heat-generating electronic elements; And from this heat-generating electronic elements absorption heat; This end face 22 is provided with a semicircle accepting groove 224, with corresponding to the accepting groove 114 on the substrate 11 of this radiator 10, and surrounds with this accepting groove 114 and to form a circular accepting groove.
Please with reference to Fig. 4; This heat pipe 30 roughly is the direction plate-like; Two linkage sections 35,36 that this heat pipe 30 comprises an endotherm section 31, two heat release section 33,34 and connects this endotherm section 31 and corresponding heat release section 33,34 respectively, these two linkage sections 35,36 are extended to form respectively by two opposite ends of endotherm section 31 obliquely.In the present embodiment, these two linkage sections 35,36 are coplane not, and therebetween forms an acute angle, forms an obtuse angle between each linkage section 35,36 and this endotherm section 31.These two heat release section 33,34 extend to form semicircular arc along the counter clockwise direction of circumference respectively by the free end of the linkage section 35,36 of correspondence; Certainly, these two heat release section also can extend to form semicircular arc along the clockwise direction of circumference respectively by the free end of the linkage section of correspondence.These two heat release section 33,34 are located in the same horizontal plane, and the endotherm section 31 of this heat pipe 30 is parallel to this plane, two heat release section 33,34 places.
Please refer again to Fig. 1 to Fig. 3; The first half of the endotherm section 31 of this heat pipe 30 is contained in the accepting groove 114 of this substrate 11; The heat release section 33,34 of heat pipe 30 surrounds a circular arc jointly and is contained in the annular groove 125 of this radiating fin group 12, and the linkage section 35,36 of heat pipe 30 is close on the outer surface of following fin section 122 of radiating fin group 12.The end face 22 of this soaking plate 20 closely contacts with the bottom surface 112 of substrate 11, and the latter half of the endotherm section 31 of this heat pipe is contained in the accepting groove 224 on the end face 22 of this soaking plate 20.
In use; Soaking plate 20 absorbs the heat of the heat-generating electronic elements generation that is in contact with it; A part of heat on this soaking plate 20 is absorbed by the endotherm section 31 of heat pipe 30; And reaching the heat release section 33,34 of heat pipe 30, the heat release section 33,34 by heat pipe 30 reaches on the radiating fin group 12 of radiator 10 then, and is distributed in the ambient air; Other a part of heat on this soaking plate 20 then directly reaches on the radiating fin group 12 via the substrate 11 of radiator 10, and finally is distributed in the ambient air.
In the above-mentioned heat abstractor, the heat release section 33,34 of two coplanes of this heat pipe 30 and 12 thermo-contacts of radiating fin group, and these two heat release section 33,34 are curved; With regard to its radiating efficiency; This heat pipe 30 is equivalent to two traditional U type heat pipes, therefore, and with respect to traditional heat abstractor; The quantity that heat abstractor of the present invention need not increase heat pipe can increase its radiating efficiency, the also corresponding reduction of its cost.
Claims (10)
1. heat abstractor; Comprise a radiator and with the hot linked heat pipe of this radiator; It is characterized in that: two linkage sections that this heat pipe comprises an endotherm section, two heat release section and connects this endotherm section and corresponding heat release section respectively; These two linkage sections are extended upward respectively by two opposite ends of endotherm section and form; This two equal cambers of heat release section and surround a circular arc jointly and combine with this radiator, these two heat release section form semicircular arc along identical clockwise respectively by the free end of the linkage section of correspondence.
2. heat abstractor as claimed in claim 1 is characterized in that: these two heat release section coplanes, and this endotherm section is parallel to the plane at these two heat release section places.
3. heat abstractor as claimed in claim 1; It is characterized in that: this radiator comprises a radiating fin group; This radiating fin group comprises some radiating fins; Each radiating fin comprises the last fin section that is positioned at the following fin section of bottom and extends upward formation from the top of this time fin section, and bottom of fin section is provided with a groove on this, and the heat release section of this heat pipe is contained in this groove.
4. heat abstractor as claimed in claim 3 is characterized in that: the radial width of this time fin section increases to the top from its bottom gradually, and fin section radially protrudes in this time fin section on this.
5. heat abstractor as claimed in claim 3 is characterized in that: the centre of this radiating fin group is provided with a centre bore.
6. heat abstractor as claimed in claim 3 is characterized in that: this radiator also comprises a substrate, this substrate and this radiating fin group hot link, and this substrate is provided with accepting groove, and the endotherm section of this heat pipe is contained in this accepting groove.
7. heat abstractor as claimed in claim 6 is characterized in that: the radiating fin of this radiating fin group is shaped on this substrate.
8. heat abstractor as claimed in claim 6; It is characterized in that: also comprise a soaking plate; This soaking plate is connected with a heat-generating electronic elements and this substrate heat respectively; This soaking plate be provided with substrate on the corresponding accepting groove of accepting groove, the endotherm section of this heat pipe is contained in the accepting groove of this soaking plate and substrate jointly.
9. heat pipe; It is characterized in that: two linkage sections that comprise an endotherm section, two heat release section and connect this endotherm section and corresponding heat release section respectively; These two linkage sections are extended upward respectively by two opposite ends of endotherm section and form; This two equal cambers of heat release section and surround a circular arc jointly, these two heat release section extend to form semicircular arc along identical clockwise respectively by the free end of the linkage section of correspondence.
10. heat pipe as claimed in claim 9 is characterized in that: these two heat release section coplanes, and this endotherm section is parallel to the plane at these two heat release section places.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710125271XA CN101466225B (en) | 2007-12-19 | 2007-12-19 | Radiating device and hot pipe thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710125271XA CN101466225B (en) | 2007-12-19 | 2007-12-19 | Radiating device and hot pipe thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101466225A CN101466225A (en) | 2009-06-24 |
| CN101466225B true CN101466225B (en) | 2012-03-14 |
Family
ID=40806506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710125271XA Expired - Fee Related CN101466225B (en) | 2007-12-19 | 2007-12-19 | Radiating device and hot pipe thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101466225B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103234184B (en) * | 2012-09-05 | 2015-07-29 | 重庆三弓科技发展有限公司 | A kind of LED integration module liquid heat radiating device |
| CN112113450A (en) * | 2020-09-16 | 2020-12-22 | 武汉大学 | Oscillation composite capillary core soaking plate structure for aerospace electronic heat dissipation |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2664189Y (en) * | 2003-09-20 | 2004-12-15 | 鸿富锦精密工业（深圳）有限公司 | Heat sink for heat pipe |
| CN101022097A (en) * | 2007-03-13 | 2007-08-22 | 秦彪 | Circulating hot tube type radiator |
| CN200983741Y (en) * | 2006-12-14 | 2007-11-28 | 曜越科技股份有限公司 | Heat pipe cooling fan device |
-
2007
- 2007-12-19 CN CN200710125271XA patent/CN101466225B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2664189Y (en) * | 2003-09-20 | 2004-12-15 | 鸿富锦精密工业（深圳）有限公司 | Heat sink for heat pipe |
| CN200983741Y (en) * | 2006-12-14 | 2007-11-28 | 曜越科技股份有限公司 | Heat pipe cooling fan device |
| CN101022097A (en) * | 2007-03-13 | 2007-08-22 | 秦彪 | Circulating hot tube type radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101466225A (en) | 2009-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7025125B2 (en) | Heat dissipating device with heat pipe | |
| US20090044927A1 (en) | Thermal module and fin unit thereof | |
| US8667685B2 (en) | Heat-dissipating fin capable of increasing heat-dissipating area | |
| US7487825B2 (en) | Heat dissipation device | |
| US20080156460A1 (en) | Thermal module | |
| US20070195500A1 (en) | Heat dissipation apparatus | |
| CN101212891A (en) | Heat sink fan | |
| CN101652052A (en) | Heat sink device | |
| US20100147496A1 (en) | Heat dissipation device with heat pipe | |
| KR100600448B1 (en) | Cooling device for computer parts and manufacturing method thereof | |
| US20100059211A1 (en) | Cooling fan and heat dissipation device having the same | |
| US20090229790A1 (en) | Radiating fin assembly for thermal module | |
| US6992890B2 (en) | Heat sink | |
| US7643294B2 (en) | Heat dissipating apparatus with heat pipe | |
| CN101466225B (en) | Radiating device and hot pipe thereof | |
| US20110048677A1 (en) | Heat-conducting assembly for heat pipes of different diameters and heat sink having the same | |
| US7841388B2 (en) | Radiating fin assembly for thermal module | |
| CN2713632Y (en) | Heat sink | |
| CN101610656B (en) | Heat sink and assembly method thereof | |
| US20060185821A1 (en) | Thermal dissipation device | |
| US20110277965A1 (en) | Fin and heat sink having the same | |
| US20120261096A1 (en) | Radiating fin structureand thermal module using same | |
| US20110290450A1 (en) | Heat Dissipation Module | |
| US20120043057A1 (en) | Heat-dissipating module | |
| CN101765349A (en) | Heat sink device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120314 Termination date: 20131219 |