CN101535039A - Electronic device and method of making - Google Patents
Electronic device and method of making Download PDFInfo
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- CN101535039A CN101535039A CN200780041769.6A CN200780041769A CN101535039A CN 101535039 A CN101535039 A CN 101535039A CN 200780041769 A CN200780041769 A CN 200780041769A CN 101535039 A CN101535039 A CN 101535039A
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
- Electroluminescent Light Sources (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Disclosed is an electronic device comprising a glass, glass ceramic, or ceramic sheet having a thickness less than about 0.4 mm and wherein a minimum strength of the inorganic substrate is greater than about 500 MPa. Also disclosed is a method of making an electronic device including drawing a viscous inorganic material to form an inorganic ribbon having opposing as-formed edges along a length of the ribbon, separating the ribbon to form a substrate sheet of inorganic material comprising two as-formed edges and forming a device element on the inorganic substrate.
Description
The application requires the U.S. Provisional Application S/N.60/849 that submitted on October 4th, 2006,298 priority according to 35U.S.C. § 119 (e).
Background of invention
Invention field
The present invention relates to the manufacturing of electronic device, and relate in particular to the electronic device of the flexible sheets formation of using one or more inorganic material.
Description of related art
The display device of using plasma, liquid crystal or Organic Light Emitting Diode display element (only lifting several examples) is being defeated the cathode ray tube (CRT) display rapidly in the commodity Great War, thereby is applied in the myriad applications from the cellular phone to the TV.Yet the introducing of extremely thin, light or flexible display only is in its initial stage.This mainly is to be caused by the huge structural requirement to these display devices: they must bear deflection repeatedly or bending or other stress and device or its substrate that is provided with this device are not damaged; Because using intentionally of thin, the light or flexible display in the portable device, they are born rough operation by expection and (again) can not have damage to device or substrate, and they must bear can be less than 2cm and in some cases less than impact or the bending radius of 1cm.
Being expected at a kind of material that uses in thin, light or flexible display or the electronic device is glass.Glass is normally chemically stable, transparent, can form airtight stopping or sealant, can stand common electronic device and make temperature, and can form extremely thin thin slice.Surpass 10m
2Thickness less than 1mm and even manufactured and general less than the glass plate of 0.7mm, and glass plate expection reaches very soon at least about 100m
2Size.In typical display fabrication process, a plurality of displays use one or more big glass plates or substrate to form.Display is divided into each display unit by scribing and sliver or other cutting method then usually.Thereby glass plate is adopted effectively by producing demonstration as much as possible or electronic unit greatly.
Glass-cutting (and cutting glass plate) in the case forms defective (for example, crack) usually in the edge of glass plate.These defectives can play the crack starting point, and thereby reduce the intensity of glass plate, especially made defective be subjected in the tensile stress by deflection at glass.Usually, typical display device can not be subjected to remarkable deflection, thereby the existence of these defectives is not the significant concern point: the edge that common cutting method produces sufficient intensity is with the device technology condition that withstands standard and the final use of current application.
Shown in Fig. 1 is to illustrate according to standardization four-point bending test (for example, Weibull (Weibull) curve map of the failure probability of 75 micron thickness glass plates in four-point bending ASTM).Sample in this case is the long x75 micron thickness of the wide x30mm of 5mm.Sample is with the four-point bending device to test that places the edge, so tensile stress is applied on the positive face thickness of whole 75um.By the glass plates of curve 10 and 12 expressions by laser cutting, and by the glass plate of curve 14 expression by scribing mechanically and by flex apart so that this glass plate breaking.As described, neither one demonstrates the high probability that bears the stress that surpasses about 300MPa in the sample of being represented by curve.The not shown high probability that bears above the stress of 100MPa of sample of machinery scribing (the most extensive method of separation of glasses).Though be used for the needs that thickness has solved current device fabrication greater than the standard cutting method of the glass substrate of 0.4mm or used final use, for be used in emerging technology and the application such as flexible display thickness less than the substrate of 0.4mm need be higher edge strength.
According to the essence of their flexibilities, flexible display or flexible electronic device produce remarkable stress in display or one or more electric substrate in the time of can or using during manufacturing process.Thereby, may be present in defective in the glass and can stand to be enough to stress that glass is split, thereby cause glassbreak.Because relating to glass-cutting, common display manufacturing in glass, produces a plurality of defectives, so this indication is based on the pitiful destiny of the flexible display of glass substrate along the cut edge to form each display and known cutting.
Trial reduces defective at the edge of glass plate and has comprised laser cutting, grinding, polishing etc., and all these attempts removing or being minimized in glass plate being cut into the defective that is produced in the time of should size being arranged.Yet, many flexible electronic device is used in these methods is unsatisfactory, because technology can not be removed little defective to expection stress required size, but perhaps this technology is difficult to be applied to thin like this glass plate (thickness is less than about 0.4mm) in manufacturing process or yardstick.Can use the acid etching of glass edge, but acid etching also can the deterioration display or is placed electronic device on the substrate.
Brief summary of the invention
In an embodiment of the present invention, disclose a kind of method of making display or electronic device, it comprises: the inorganic material band is provided, and its length along band has relative formation state (as-formed) edge; On being with, this forms electronic component; And separation inorganic material band has the inorganic material plate at relative formation state edge and electronic component placed on it with formation.
In another embodiment, a kind of electronic device has been described, this electronic device comprises the inorganic material plate and is arranged on the electroluminescent of one deck at least, semiconductor or conductor material on this glass plate, and this inorganic material plate comprises less than the thickness of about 0.4mm and two form the state edges at least.
In another embodiment, a kind of electronic device that comprises substrate is disclosed, this substrate comprises the glass plate that forms by down draw process and is arranged on electroactive material on this glass plate that this glass plate has the formation state edge less than the thickness of about 0.4mm and at least two relativenesses.
Be appreciated that above general description and following detailed description all only are exemplary descriptions of the present invention, and both aim to provide the general survey or the framework of the essence and the characteristic that are used to understand the present invention for required protection.
Included accompanying drawing is used to provide to further understanding of the present invention, and is incorporated in this specification and constitutes its part.Accompanying drawing is not inevitable bi-directional scaling, and the size of various elements can be for clarity sake and distortion.Accompanying drawing illustrates one or more embodiment of the present invention, and describes one with this and be used from explanation principle of the present invention and operation.
The accompanying drawing summary
Fig. 1 is the curve map of bursting stress probability that separates the glass sample of (cutting) by mechanical scribing with laser cutting.
Usually how Fig. 2 illustrates the front view of a part that cuts out the downdraw sheet manufacturing process of each glass plate from drawing glassribbons.
Fig. 3 is illustrated in each device separates the center display manufacturing that is arranged in the display element on glass plate or the substrate before from motherboard vertical view.
Usually how Fig. 4 illustrates the front view of a part that cuts out the downdraw sheet manufacturing process of each glass plate from drawing glassribbons according to an embodiment of the invention.
Fig. 5 is according to the display of embodiments of the invention formation or the stereogram of electronic device.
Fig. 6 is the stereogram according to the beam mode of the display of embodiments of the invention manufacturing or electronic device.
Fig. 7 is the stereogram according to another beam mode of the display of embodiments of the invention manufacturing or electronic device.
Fig. 8 illustrates the sectional view how ridge forms at the edge of glass tape according to an embodiment of the invention.
Fig. 9 be bend to " U " shape glass plate sectional view, and it illustrates tensile stress, neutral stress and areas of compressive stress.
Figure 10 be according to an embodiment of the invention display or electronic device sectional view, it illustrates the ridge in the neutral surface at as drawn condition (as-drawn) edge.
Figure 11 is the curve map of the minimum bending radius of a plurality of samples when destroying of two kinds of dissimilar glass plates, and it illustrates the outstanding performance of the sample with as drawn condition edge.
Describe in detail
The conventional down draw process (downdraw process) that is used to form glass plate can be that for example discharge orifice draws (slot draw) technology, overflow process, melting process or drawing process (redraw process) again.In the discharge orifice drawing process, drawn in the discharge orifice of fused raw material from the bottom of the converter that comprises melted material.The size of gained glass plate is partly determined by the temperature/viscosity and the draw rate of the size of discharge orifice and shape, fused raw material.
In single-sided overflow technology, fused raw material flows on the top edge of long converter or pipe.The glass plate of finishing comprises a side that has contacted with converter, and opposite side original relatively (pristine), during overflow not yet with the converter side contacts.
In the variant of overflow process, fused raw material flows on the both sides of converter or pipe, and the inclined side of this converter or pipe is assembled along the bottom of converter.Two independent streams regroup along the convergence line between the both sides and are cooled to the single plate of glass tape with formation.Therefore this band can be cut into littler plate.
Advantageously, come comfortable the convergence to form the surperficial site polymerization that goes up the raw material of two feed streams that flow and be in contact with it at glass plate, and the initial surface of each stream becomes the outer surface of glass plate, thereby the glass plate of superior quality and definition is provided, makes this so-called " fusion " technology become the ideal source of demonstration glass.
For the purpose simplified and unrestricted, below describe about drawing process again providing, and can understand the present invention and can be applicable to form thickness other method less than the glass plate of 0.4mm.
In the drawing process again of routine, the previous glass (that is, preform) that forms was heated on the softening point of glass repeatedly, and by longitudinally (on the length direction) and/or laterally (on the width) stretch to form glass tape.The thickness of band and the width of band especially depend on preform shape, be applied to on pulling force and the viscosity of glass.Preform can be the pre-formation glass plate of for example making by any other technology of any one or the glass preforming blank that can produce suitable size and shape such as floating process or cigarette ash fixed (soot consolidation) technology in the above-mentioned technology.Usually, glass tape is vertically drawn downwards, and glass reduces-be with to become thinner and narrower on thickness and width during this period.The edge of band can use suitable roller guiding or stretch, but also can be non-touch, and only with the tractive force or the pulling force that are derived from the glass plate bottom.As drawn condition or the edge that forms state usually since the surface tension of static adhesive edge be rounded, but can adopt other shape such as wedge shape or right angle according to technology type and technological parameter.For example, in the discharge orifice drawing process, the shape of discharge orifice and the viscosity of glass can change with the edge that produces common wedge shape or the edge at right angle more.
Glass intensity is by the existence indication of defective in the glass.If tensile stress is applied to the glass with a defective, then this stress becomes concentrated at fault location.Defective for example is microscopic crack, and stress concentrates on the tip in crack in this case.If stress surpasses a certain magnitude, genetic defects-crack-can grow then.If apply enough stress, then in fact crack growth can be instantaneous, and cause the catastrophic collapse of glass: it has broken.
Similar with the intensity based on the chain of weak link strength, glass intensity can be characterized by the maximum and the therefore intensity of the most weak defective.For example, if the tensile stress of 10kpsi (70MPa) is applied to glass fibre and this fiber keeps firm, then this fiber is said to be and has the intensity of 10kpsi at least.That is, all defect that may exist on the glass fibre can cause the defective of its destruction to be lacked than 10kpsi.Similarly, " size " of defective often represented by the required tensile stress that minimizes of momentary breakdown that regulation causes coming from that defective in the glass.Thereby, the glass fibre that has been applied in stress and does not have fracture to 10kpsi be said to and do not have on the intensity " greater than " defective of 10kpsi.Though represent that with the stress of unit of force the physics size has any to choose words inappropriately, characterizing defect size with stress is common in the strength of glass field.This is may directly be measured hardly and indirect " intensity " of defective is used as alternative simple fact and causes by depth of defect.
As being appreciated that ground by previous discussion, glass intensity is the result of the history of glass.That is, the new pristine glass that forms is intrinsic firm extraordinarily.The glass plate of formation state can surpass 700MPa usually near the intensity of the new glass fibre that forms.Yet, subsequent operation or be exposed to environmental factor and can produce defective or enlarge existing defective, thereby weaken glass.For this reason, the new optical fiber that draws is for example used the coating such as polymer coating to apply at once, with the surface of cover glass and avoid or minimize at least the deterioration of intensity.As used in this manner, term " as drawn condition " or " formation state " will refer to after the edge forms (that is, under glass has been cooled to its strain point and enter the load that applies make after the elastic stage that glass flexibly is out of shape) hereinafter as yet not by scribing, cutting, the glass edge that weares and teares or carry out other processing.Any edge treated (shapings, cutting etc.) of carrying out on strain point the time in glass plate or band temperature during handling is regarded as " formation state ", except local edge heating and can be such as use CO
2Outside the remelting of carrying out during laser instrument processing edge.Should be understood that this handle to get rid of contacts with the routine of glass, such as during transportation contact glass, be exposed to air, moisture etc.
In the situation of down draw process, when the edge of glass descends by thermograde and when viscosity or viscosity-elastomeric material are transformed into elastomeric material, they are regarded as the formation state.In the glass plate manufacturing process of routine, the edge that forms state promptly usually after drawing process, is removed after glass cools is under strain point temperature.
Shown in Fig. 2 is the glass tape 16 that gets off from the source (not shown).Glass tape 16 can draw by the bottom that power F is applied to band.Alternatively, can be used to drawn glass at throwing roller to 18 with the reverse rotation at each edge of 16.The source can be again drawing process, single-sided overflow down draw process, two-sided fusion downdraw technology or wherein viscous melt be drawn into any other technology of glass tape.Form in the operation at the glass plate of routine, cut out glass plate 20 along defiber 21 and 22 from being with 16.The marginal portion 24 and 26 of as drawn condition is removed after drawing process usually, thereby forms separation edge 28 and 30.Glass plate 20 can use in after a while display or electronic device manufacturing process then.
Large-scale production realizes by form device as much as possible on substrate in the electronic device manufacturing process usually.Thereby, as shown in Figure 3, there is electronic device component 32 as much as possible (for example, display element 32) on glass plate 20, to form.Device element 32 can be that for example one or more layers is electroactive or non-active material or the electroluminescent material such as Organic Light Emitting Diode (OLED) material.The device element can be one or more pixels, electroluminescent material of for example bigger display device etc.The glass plate 20 that comprises a plurality of electronic device components 32 is then such as further cutting to produce each electronic device along defiber 34.For example, glass plate 20 can comprise many group device elements 32.Glass plate 20 is separated then or divide again, can be attached to such as computer display, television set, cellular phone etc. more in each display unit of complex assemblies so that every group of device element 32 comprises.Below describe and relate generally to these display devices.Yet, will be appreciated that following discloses are applicable to other electronic device.As used in this manner, electronic device is intended to indicate the device and the assembly of broad categories, includes but not limited to: display device, photovoltaic device, RF identification (RFID) device, silicon semiconductor device, organic semiconductor device and other conventional electrical device.On the other hand, electronic device component is intended to indicate any one single component or the assembly group in above device or the assembly.
From the above description should be apparent easily, each electronic device that obtains from above technology comprises separation edge in each side of display.Usually, display device is being rectangle in shape, and thereby four separation edge of generation after the display that above technology obtains is included in drawing process.That is, the overall circumference of display device is made up of separation edge, and comprises the defective that changes size and tensile strength similarly.In the situation of the flexible electronic device that can be required to tolerate big bending stress, the probability of the inefficacy that is caused by breaking of device is increased because of the existence of separation edge, no matter since crooked be which direction separation edge all will be bent or be subjected to stress.The high strength that utilization of the present invention obtains from the formation state edge of band and the plate that cuts out from band.
As used in this manner, general terms " glass " is used to refer to baseplate material, but baseplate material means the frangible inorganic material that comprises wide variety, and it comprises glass, glass ceramics and the pottery that can form from viscous state.For example, glass ceramic baseplate can have the edge at the high-intensity formation state that stands to produce before the crystallization step when viscous state draws.Equally, substrate can be by it at least one have the one or more inorganic layers that form the state edge and form.Substrate can comprise additionally that protection polymer or other layer and at least one have the inorganic layer at formation state edge.
In some embodiments of the invention, the formation state edge of glass is by withdrawing roll (pulling roll) contact, and withdrawing roll pulls down glass but temperature on strain point of glass makes the glass edge distortion that is in contact with it.Really, in certain embodiments, roller can lessly be used for tension belt but be used to give belt edge one shape, for example wedge shape more or from panel edges the length along band extend, preferably down to the glass web at the center (neutral surface of band) of edge thickness.Other method of shaping as drawn condition glass edge also is possible, such as using laser instrument, gas-pressurized or other method.
According to an embodiment, do not adopt withdrawing roll, and the as drawn condition edge of the band that draws is not removed.Depicted in figure 4 be can as about Fig. 1 the band that forms with describing, except the edge of as drawn condition is not removed.Glass tape 38 can be for example rolled-up or storage for after use.In any case glass tape 38 comprises long size L (length L) and with the length vertical width W parallel with 42 with the edge 40 of as drawn condition usually.Length L can change with special process.
The size of the width W with 38 is designed to make electronic device component 32 to form on the width of band.Thereby electronic device component can form on glass tape 38 in the similar mode of the mode that forms on the film bar with image sequence ground wherein, so that only need to separate to form for example each electronic device of display device along a yardstick with 38.One or more electronic device components generally include one deck electroluminescent at least, semiconductor or conductor material.For example, the device element can be a luminous organic material.Before or after forming one or more displays or electronic device component 32 on the glass tape 38, each display or electronic device substrate 44 cut from band along defiber 46.For example, each device substrate 44 can separate from glass tape 38 with 42 mode by keeping formation state edge 40 before making device element 32.Equally, at first on substrate 44, make device element 32, and it still to be attached to all the other glass tapes 38 also be possible.First method is applicable to the batch processing of device, and second method be applicable to device continuously or roller-handle to-roller (roll-to-roll).In both of these case, the formation state edge 40 and 42 of device substrate 44 is retained.
Concrete example described herein has related to display device and has related in particular to flexible display device.In addition, the high strength substrate with formation state edge can be used for the display device of some types, such as organic light emission, electroluminescent, liquid crystal and electric moistening device.Yet the thin glass substrate that generally speaking has a high-intensity formation state edge can be used for other electronic device applications outside the field of display.These devices can comprise the single substrate with formation state edge or have a plurality of substrates (top and bottom, base plate and colour filter, base plate and cap or the like) composition at formation state edge.
Equally, though term " flexibility " is commonly used to describe glass substrate, substrate is during final the application or do not need to be bent during device fabrication.Term " flexibility " is used to refer to that substrate is enough thin and have sufficiently high intensity withstands less than about 30cm, less than about 10cm, less than about 5cm, less than about 2cm or less than the bending radius of about 1cm.For example, the final application that is manufactured on the electronic device on the high strength substrate with formation state edge can need the characteristic of thin and lightweight.The mechanical durable substrate of this application need, but therefore bending may not take place in final use or manufacturing process.Alternatively, continuous or semi-continuous manufacturing process can be used to make electronic device, thereby needs substrate experience bending radius potentially.Final in this case application can not need curved substrate, but the effective manufacturing process of cost may need.Final example is the final use that needs substrate experience short-term or term bend radius.Device can be made for flexibility when the batch processing of continuous or single or comply with application.
When cutting out each display or other electronic device from band, following glass plate or substrate have two groups of two opposed edges at rectangle normally in shape: the first pair of cutting or separation edge and second pair be the edge of cutting, as drawn condition not.Glass plate has and preferably is less than or equal to 0.4mm, preferably is less than or equal to the thickness of 100 μ m.Formation state edge can have the tensile strength greater than about 500MPa.On the other hand, the tensile strength of separation edge quite a little less than, in some cases less than about 200MPa, the edge is damaged (for example, by scribing and sliver) during lock out operation.Thereby the intensity of whole plate is by low edge strength infringement, and promptly the intensity at edge is determined the maximum intensity of whole plate.A kind of electronic device 44 of such gained is shown in Figure 5.Electronic device 44 comprise two form state edges 40 with 42 and two by from with 38 separation edge 48,50 of separating acquisition.Electronic device 44 can be display device or any as disclosed in this other device.
Consider Fig. 6, it illustrates and comprises glass plate 52 with separation edge 48,50 and the relative as drawn condition edge 40,42 on the glass plate 52 (from clear viewpoint, display or electronic device component 32 have been omitted) display or the electronic device 44 based on glass substrate. Normal axis 60 and 62 be illustrated as being superimposed upon on the glass plate so that axle 60 with to form state edge 40 vertical with 42 and intersect and spools 62 vertical with 50 with separation edge 48 and crossing.Should it is evident that axle 60 or 62 does not need to divide equally their respective edges, also not need them perpendicular to they self or their respective edges.That is, bending is not inevitably perpendicular to arbitrary edge.Yet, be exemplary in this expression that presents.
If glass plate 52 is to form the mode bending along the top of U-shaped curve of general " U " shape and axle 60, then separation edge 48,50 is crooked and do not experience the tensile stress that the outside applies.On the other hand, forming state edge 40 and 42 is bent.Because edge 40 and 42 is formation state edges and has high strength, plate can not break.Yet, axle 62 the tops if plate 52 opposite curvature become with axle 60 quadratures along the U-shaped curve shown in Fig. 7, separation edge 48,50 stands stress-compression stress and stands tensile stress on surface 66 on surface 64.Crooked if enough tight (having little bending radius) and at the edge 48,50 places have the intensity that is lower than the tensile stress that applies by the defective of separation/cutting technique generation, then plate can break.
Have many for only experiencing the application of these crooked flexible displays or electronic device conception.For example, flexible display or the electronic device roller that launches, roll again for storage then or the form of volume for checking.If it is parallel with the axle of volume that being easy to of device produces the separation edge of defective, then separation edge will experience minimum stress.The stress that produces because of bending is alternatively born by the high-intensity state edge that forms.In addition, device can be bent during installation once and remain on that bending radius continuously at its whole life period.Because well-known glass fatigue phenomenon also needs high-intensity continuous bend edge.Continuous, technology semi-continuous or that make in batches also can require big hot strength or other intensity along forming the state edge.
Shown in Fig. 8 is another embodiment of the present invention, wherein wedge shape such as by roller to the 68 formation state edges that give glass tape.As shown, the extreme edge of glass tape 70 is much thinner than the remainder of band.For example, the edge can comprise the thin ridge 72 of glass, and it extends from the length that the band mid portion stretches out and be with on the edge between the positive respectively and back side 74,76 of band.
When the glass object such as glass plate 52 is bent, two stressed zones formation-compressional zone C and drawing zone T.As shown in Figure 9, drawing zone forms in the outside of bending, and the compressional zone forms in the inboard of bending.When from outside when moving by side to the inboard, the tensile stress in the tensile stress area reduces gradually, by zero, and becomes compression stress.That is, when moving through the thickness of glass plate, stress is the ground conversion from the tensile force to the compression stress or from the compression stress to the tensile force.Stress mid portion between two surfaces is zero, and can be described as neutral surface N.Glass destroys down at stress (tensile force), and if aforesaid ridge district form along the neutral surface of plate, the defective that then is present in ridge unlikely plays the destruction source, because stress is minimum in this position.
Shown in Figure 10 is the sectional view that comprises according to an embodiment of the invention from the exemplary electronic device 80 (for example, display device) of 70 isolated glass plates 82.Formation state edge illustrates at the right hand and the left-hand side of Figure 10, and separation edge then passes in and out the page.Electronic device component 32 such as electroluminescent device, semiconductor or conductor material (for example, luminous organic material, silicon (Si) or indium tin oxide (ITO) coating) and so on is set on the glass plate 82.Device 80 also can comprise to be provided glass plate 82 sealing and thereby provides one or more barrier layers 84 of enclosed package for electronic component 32.The barrier layer can form on the electronic device component 32 or on (between glass plate 82 and the device element 32) under the device element 32 or the face opposite with device element 32 that be arranged on glass plate 82.Barrier layer 84 can be for example glassy layer, polymeric layer or any other material of seal can be provided.Glass plate 82 is shown as including the edge ridge 72 that is provided with along the neutral surface N of glass plate 82.Ridge 72 can for example form by roller during aforementioned any down draw process as illustrated in fig. 8.As should be from previous example (being Fig. 9) obviously as seen, curved displays 80 (for example, glass plate 82) is so that ridge 72 is on-plane surface, for example as shown in Figure 9 " U " shape bending, ridge experiences less stress owing to being positioned at along the neutral surface of glass plate.Thereby even be damaged, the as drawn condition edge that comprises ridge 72 also can not impel and breaks.
Be the explanation embodiments of the invention, healthy and free from worry (Corning) sign indicating number 1737G glass plate is cut into the appropriate size conduct preform of drawing process again.This preform is drawn again and the gained glass tape is cut into 40mm length when keeping the as drawn condition edge.The long sample of 40mm is bent to two bending strengths of " U " shape with test formation state edge between two mobile parallel-plates.2 crooked tests are the common methods of testing the intensity of the glass article that comprises glass fibre.Sample is fixed between two anchor clamps with " U " shape, and one of anchor clamps or both move together.The size of glass article and the distance between the anchor clamps (for example bending radius of article) can be used to determine the tensile stress that is experienced by these article when destroying.For example referring to the bulletin no.TSB62-13 of Telecommunications Industries Association.Plate moves up to sample destruction (breaking) together with the closed speed of 0.1mm/s.The result of this test is shown in Figure 11.Figure 11 be depicted as that each sample realizes because of becoming in the data point of the minimum bending radius of thickness of sample.1737G sample (86) can be realized the minimum bending radius less than 30mm in many cases, and it is in some cases less than 20mm, and in other cases less than 10mm.Identical test is also in the Corning0211 microplate execution on glass by the laser cutting designed size and be depicted in (88) on Figure 11.Even it is thinner than drawing the 1737G sample again that Figure 11 illustrates 0211 microplate sample, most of 1737G samples also can be realized than the little a lot of bending radius of 0211 microplate sample before destroying.The minimum attainable bending radius of 0211 microplate sample before destroying is 30mm.
In another experiment, Corning Eagle2000F
TMGlass plate is cut should be had size and be drawn into the glass plate with size that about 0.4mm is wide, 40 μ m are thick, 50cm is long again.Draw again sample carry out then tensile strength test with in air with the speed destruction of about 180MPa/s.Middle value record intensity is 1000MPa approximately.
Though described the present invention, be apparent that replacement of the present invention, modification and variant will become apparent after those of ordinary skills be according to above description together with certain exemplary embodiments of the present invention.Therefore, the present invention is intended to all these replacements, modification and variant are included within the spirit and broad range of claims.
Claims (20)
1. method of making electronic device comprises:
The inorganic material band is provided, and described inorganic material band has relative formation state edge along the length of band;
On described being with, form electronic component; And
Separate described band and have the inorganic material plate at relative formation state edge and electronic component placed on it with formation.
2. the method for claim 1 is characterized in that, the minimum tensile strength of described inorganic material plate is greater than about 500MPa.
3. the method for claim 1 is characterized in that, also comprises the formation state edge that uses the described band of polymer-coated.
4. the method for claim 1 is characterized in that, described inorganic material band comprises glass, glass ceramics or pottery.
5. the method for claim 1 is characterized in that, the formation state edge of described inorganic material band comprises the ridge near the neutral surface setting of described plate.
6. the method for claim 1 is characterized in that, described electronic component comprises at least one layer of electroluminescent, semiconductor or conductor material.
7. method as claimed in claim 6 is characterized in that, the described electroluminescent material of one deck at least is an organic material.
8. electronic device comprises:
Inorganic material plate, the thickness of described inorganic material plate are less than about 0.4mm and comprise that at least two form the state edge; And
Place the electroluminescent of one deck at least, semiconductor or conductor material on the described inorganic board.
9. electronic device as claimed in claim 8 is characterized in that, described inorganic material plate comprises glass, glass ceramics or ceramic material.
10. electronic device as claimed in claim 8 is characterized in that the minimum tensile strength of described inorganic material plate is at least about 500MPa.
11. electronic device as claimed in claim 8 is characterized in that, the thickness of described inorganic material plate is less than about 200 μ m.
12. electronic device as claimed in claim 8 is characterized in that, described inorganic material plate polymer-coated.
13. electronic device as claimed in claim 8 is characterized in that, in 2 crooked tests in the minimum bending radius before described inorganic material plate breaks under the closed speed of 0.1mm/s less than 30mm.
14. electronic device as claimed in claim 8 is characterized in that, described electroluminescent, semiconductor or conductor material are organic materials.
15. an electronic device comprises:
Substrate, described substrate comprise the glass plate that forms by down draw process, and the thickness of described glass plate is less than about 0.4mm and formation state edge with at least two relativenesses; And
Place the electroactive material on the described glass plate.
16. electronic device as claimed in claim 15 is characterized in that, described thickness is less than about 0.2mm.
17. electronic device as claimed in claim 15 is characterized in that, described glass plate along the tensile strength at described formation state edge greater than about 500MPa.
18. electronic device as claimed in claim 15 is characterized in that, described electronic device is electro-luminescence display device, liquid crystal display device, electrophoretic display device, EDD or electric wet-type display spare.
19. electronic device as claimed in claim 15 is characterized in that, described electronic device is photovoltaic device, RFID device or illuminating device.
20. electronic device as claimed in claim 15 is characterized in that, described substrate comprises a plurality of layers, and at least one in described a plurality of layers has at least two and form the state edge.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84929806P | 2006-10-04 | 2006-10-04 | |
| US60/849,298 | 2006-10-04 | ||
| US11/888,169 | 2007-07-31 | ||
| US11/888,169 US8017220B2 (en) | 2006-10-04 | 2007-07-31 | Electronic device and method of making |
| PCT/US2007/021158 WO2008045240A2 (en) | 2006-10-04 | 2007-10-02 | Electronic device and method of making |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101535039A true CN101535039A (en) | 2009-09-16 |
| CN101535039B CN101535039B (en) | 2013-10-23 |
Family
ID=41105002
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800434418A Expired - Fee Related CN101542264B (en) | 2006-10-04 | 2007-10-02 | Method and apparatus for proof testing a sheet of brittle material |
| CN200780041769.6A Expired - Fee Related CN101535039B (en) | 2006-10-04 | 2007-10-02 | Electronic device and method of making |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800434418A Expired - Fee Related CN101542264B (en) | 2006-10-04 | 2007-10-02 | Method and apparatus for proof testing a sheet of brittle material |
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| Country | Link |
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| CN (2) | CN101542264B (en) |
| TW (1) | TWI358537B (en) |
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| CN112629999A (en) * | 2020-12-12 | 2021-04-09 | 盐城华昱光电技术有限公司 | Flexible circuit board detection device and detection method |
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| JP5891941B2 (en) * | 2012-05-17 | 2016-03-23 | 旭硝子株式会社 | Durability test method for brittle plate and durability test apparatus for brittle plate |
| JP5891965B2 (en) * | 2012-06-18 | 2016-03-23 | 旭硝子株式会社 | Durability test method for brittle plate and durability test apparatus for brittle plate |
| TWI554756B (en) | 2012-09-06 | 2016-10-21 | 財團法人工業技術研究院 | Tensile stress detecting device and operating method thereof |
| US9643878B2 (en) * | 2012-11-13 | 2017-05-09 | Nippon Electric Glass Co., Ltd. | Sheet glass manufacturing method and manufacturing device |
| TWI480549B (en) | 2012-12-21 | 2015-04-11 | Ind Tech Res Inst | Method for bending stress testing and apparatus thereof |
| KR102090560B1 (en) * | 2013-04-11 | 2020-03-19 | 삼성디스플레이 주식회사 | Apparatus for bending and the method of bending using the same. |
| CN105143848B (en) * | 2013-04-15 | 2018-03-16 | 旭硝子株式会社 | The manufacture method of sheet shaped piece, fragility piece, fragility piece and electronic device with element |
| DE102014110855B4 (en) * | 2014-07-31 | 2017-08-03 | Schott Ag | Method and device for determining the breaking strength of the edges of thin webs of brittle material |
| DE102014110856B4 (en) * | 2014-07-31 | 2016-04-14 | Schott Ag | Method and device for determining the edge strength of disc-shaped elements made of brittle material |
| KR102275867B1 (en) | 2017-09-07 | 2021-07-09 | 주식회사 엘지에너지솔루션 | Apparatus and method of evaluating brittleness of electrodes |
| WO2020036823A1 (en) * | 2018-08-14 | 2020-02-20 | Corning Incorporated | Methods and apparatus for determining a crush strength of an edge |
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| US4317368A (en) * | 1980-07-28 | 1982-03-02 | Mcelroy John W | Acoustic emission warning system for a fiberglass member |
| US4346601A (en) * | 1980-08-18 | 1982-08-31 | The Post Office | Testing glass fibres |
| CN86102352A (en) * | 1986-04-02 | 1987-10-14 | 苏州丝绸工学院 | Producing GFRP ply-board new technology and equipment thereof |
| US4862414A (en) * | 1986-06-11 | 1989-08-29 | Kuehnle Manfred R | Optoelectronic recording tape or strip comprising photoconductive layer on thin, monocrystalline, flexible sapphire base |
| US5824127A (en) * | 1996-07-19 | 1998-10-20 | Corning Incorporated | Arsenic-free glasses |
| EP1048628A1 (en) * | 1999-04-30 | 2000-11-02 | Schott Glas | Polymer coated glassfoil substrate |
| JP2001060708A (en) * | 1999-06-18 | 2001-03-06 | Nippon Sheet Glass Co Ltd | Transparent laminated and glass article using it |
| JP2002341776A (en) * | 2001-05-16 | 2002-11-29 | Nitto Denko Corp | Film filter for preventing glass breakage and plasma display |
| US6975067B2 (en) * | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
| US7208206B2 (en) * | 2003-03-10 | 2007-04-24 | Nitto Denko Corporation | Glass crack prevention laminate and liquid crystal display device |
| US7375795B2 (en) * | 2004-12-22 | 2008-05-20 | Asml Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
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- 2007-10-02 TW TW96137008A patent/TWI358537B/en active
- 2007-10-02 CN CN200780041769.6A patent/CN101535039B/en not_active Expired - Fee Related
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| US12237511B2 (en) | 2020-08-04 | 2025-02-25 | Polyplus Battery Company | Glassy embedded solid-state electrode assemblies, solid-state batteries and methods of making electrode assemblies and solid-state batteries |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW200844423A (en) | 2008-11-16 |
| CN101542264A (en) | 2009-09-23 |
| CN101542264B (en) | 2012-03-14 |
| TWI358537B (en) | 2012-02-21 |
| CN101535039B (en) | 2013-10-23 |
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